Abstract: A memory cell including a set of active regions that overlay a set of gate regions to form a pair of cross-coupled inverters. A first active region extends along a first axis. A first gate region extends transversely to the first active region and overlays the first active region to form a first transistor of the pair of cross-coupled inverters. A second gate region extends transversely to the first active region and overlays the first active region to form a second transistor of the pair of cross-coupled inverters. A second active region extends along a second axis and overlays the first gate region to form a third transistor of the pair of cross-coupled inverters. A fourth active region extending along a third axis and overlays a gate region to form a transistor of a read port.

Abstract: A state detection circuit for detecting whether a state of an input node is floating, grounded, or electrically connected to an external voltage includes: a unidirectional device circuit and a determination circuit. The unidirectional device circuit electrically conducts a test node to a detection node unidirectionally. The detection node is coupled to the input node. The test node, the unidirectional device circuit, the detection node and the input node form a current path. The determination circuit determines a state of the input node according to a voltage level of the detection node. Within a detection stage, the state detection circuit provides a test voltage at the test node. A voltage of the detection node is determined by the input node, the test voltage, and a characteristic of the unidirectional device circuit.

Abstract: A logic cell structure includes a first portion, a second portion and a third portion. The first portion, arranged to be a first layout of a first semiconductor element, is placed in a first cell row of a substrate area extending in a first direction. The second portion, arranged to be a second layout of a second semiconductor element, is placed in a second cell row of the substrate area. The third portion is arranged to be a third layout of an interconnecting path used for coupling the first semiconductor element and the second semiconductor element. The first, second and third portions are bounded by a bounding box with a height in a second direction and a width in the first direction. Respective centers of the first portion and the second portion are arranged in a third direction different from each of the first direction and the second direction.

Abstract: A semiconductor chip is provided. The semiconductor chip includes a SRAM cell, a logic cell, a signal line and a ground line. The SRAM cell includes a storage transmission gate, a read transmission gate and a latch circuit. The latch circuit is serially connected between the storage and read transmission gates, and includes a first inverter, a second inverter and a transmission gate connected to an output of the first inverter, an input of the second inverter and an output of the storage transmission gate. The logic cell disposed aside the SRAM cell is connected with the SRAM cell by first and second active structures. The signal and ground lines extend at opposite sides of the SRAM and logic cells, and are substantially parallel with the first and second active structures. The SRAM and logic cells are disposed between and electrically connected to the signal and ground lines.

Abstract: A three-dimensional integrated circuit includes a first layer including at least one sensing element configured to output at least one temperature-dependent voltage; and a second layer disposed vertically with respect to the first layer and coupled to the first layer by at least one via. The second layer includes: a compare circuit configured to generate at least one intermediate voltage in response to comparing the at least one temperature-dependent voltage to a feedback voltage; a control circuit configured to generate at least one control signal in response to the intermediate voltage; and a switching circuit configured to couple a capacitor coupled to a feedback node to one of a first voltage supply and a second voltage supply in response to the at least one control signal to generate an output signal that is based on a temperature sensed by the sensing element.

Abstract: An integrated circuit structure includes a first well, a second well, a third well, a first set of implants and a second set of implants. The first well includes a first dopant type, a first portion extending in a first direction and having a first width, and a second portion adjacent to the first portion of the first well, extending in the first direction and having a second width. The second well has a second dopant type and is adjacent to the first well. The third well has the second dopant type, and is adjacent to the first well. The first portion of the first well is between the second well and the third well. The first set of implants is in the first portion of the first well, the second well and the third well. The second set of implants is in the second portion of the first well.

Abstract: A switching system can include a main switching device configured to switch a voltage, a gate driver having an output coupled to a drive terminal of the main switching device and configured to deliver a drive signal to the main switching device, and a clamp circuit. The clamp circuit can be coupled to the drive terminal of the main switching device. The clamp circuit can include a logic gate configured to drive a clamp switching device coupled to and configured to clamp a voltage at the drive terminal of the main switching device. A drive signal of the clamp switching device can be substantially complementary to the main switching device drive signal. The logic gate can provide at least a portion of a delay between switching transitions of the main switching device and switching transitions of the clamp switching device.

Abstract: Aspects of the disclosure provide a semiconductor apparatus including a first stack of transistors and a second stack of transistors. The first stack includes a first transistor and a second transistor stacked on the first transistor along a Z direction perpendicular to a substrate plane. The second stack includes a third transistor and a fourth transistor stacked on the third transistor along the Z direction. The semiconductor apparatus includes a first routing track and a second routing track electrically isolated from the first routing track. The first and second routing tracks extend in an X direction parallel to the substrate plane. A first and fourth conductive trace conductively couple a first gate of the first transistor and a fourth gate of the fourth transistor to the first routing track, respectively. A first terminal structure conductively couples four source/drain terminals of the first, second, third and fourth transistors, respectively.

Abstract: A level shifter circuit includes an input terminal, a first output terminal, a second output terminal, an output stage, a first control bias unit, a second control bias unit, and an output stage. The input stage includes a first transistor and a second transistor, and their gates are coupled to the input terminal. The first control bias unit includes a third transistor and a fourth transistor coupled to the first transistor and second transistor respectively and their gates are controlled by a first bias. The output stage includes a fifth transistor and a sixth transistor coupled to the third transistor and fourth transistor respectively and their gates are coupled to the first output terminal and second output terminal. The second control bias unit includes a seventh transistor and an eighth transistor coupled to the fifth transistor and sixth transistor respectively and their gates are controlled by a second bias.

Abstract: A multi-voltage, high voltage I/O buffer in low-voltage technology is disclosed. In one embodiment, the I/O buffer includes a logic circuit configured to generate a signal based on a data signal and a first control signal. A level shifter is coupled between a supply voltage terminal and a ground terminal, and the level shifter is generates first and second output signals in first and second voltage domains, respectively, at first and second nodes, respectively, based on the signal from the logic circuit. A control circuit is coupled between the second node and a third node. The control circuit transmits the second output signal to the third node when the first control signal is asserted, and the control circuit couples the third node to the ground terminal when the first control signal is not asserted.

Abstract: An isolator chip includes a transmitter circuit coupled to provide differential output signals to respective first terminals of a first and a second capacitor and a receiver circuit coupled to receive the differential output signals from respective second terminals of the first and second capacitors. The transmitter circuit includes a voltage-clamping circuit coupled to receive an input signal and to provide a clamped signal, an oscillator coupled to receive the clamped signal and to provide the differential output signals, and a common mode transient immunity (CMTI) circuit that couples respective first terminals of the first and second capacitors to a lower rail responsive to the clamped signal being low.

Abstract: Provided is a semiconductor device in which influence resulting from a cell function change can be reduced. The semiconductor device includes a function cell designed using a basic cell including a first wiring layer provided over a main surface of a semiconductor substrate and having a predetermined pattern and a second wiring layer provided over the first wiring layer and having a predetermined pattern. The function cell corresponds to the basic cell which is modified to have a predetermined function by changing the pattern of the second wiring layer at a design stage. The function cell has a first layout and a second layout which are disposed in juxtaposition in one direction in a plane parallel with the main surface. The function cell is provided with the predetermined function by coupling together wires belonging to the respective second wiring layers of the first layout and the second layout.

Abstract: The present disclosure provides an array substrate, its manufacturing method, and a display apparatus. The array substrate includes a monocrystalline silicon layer and an array circuit layer. The array circuit layer is disposed over the monocrystalline silicon layer. The array circuit layer comprises a scan drive circuit, a data drive circuit, and a plurality of pixel circuits. The scan drive circuit and the data drive circuit are configured to respectively control a plurality of scan lines and a plurality of data lines to in turn drive a plurality of pixels. Each of the plurality of pixel circuits is configured to drive one of the plurality of pixels to emit light under control of at least one of the plurality of scan lines and at least one of the plurality of data lines; and the scan drive circuit, the data drive circuit, and the plurality of pixel circuits comprise a plurality of thin film transistors (TFTs), each having an active region disposed in the monocrystalline silicon layer.

Abstract: A Static Random Access Memory (SRAM) cell includes a write port including a first inverter including a first pull-up transistor and a first pull-down transistor, and a second inverter including a second pull-up transistor and a second pull-down transistor and cross-coupled with the first inverter; and a read port including a read pass-gate transistor and a read pull-down transistor serially connected to each. A first doped concentration of impurities doped in channel regions of the second pull-down transistor and the read pull-down transistor is greater than a second doped concentration of the impurities doped in a channel region of the first pull-down transistor, or the impurities are doped in the channel regions of the second pull-down transistor and the read pull-down transistor and are not doped in the channel region of the first pull-down transistor.

Abstract: A circuit device includes: a transmitting circuit that performs transmission of a signal by current-driving signal lines in a transmission period; a receiving circuit that receives a signal that a transmitting circuit of a communication partner has transmitted by current-driving the signal lines, in a reception period that is different from the transmission period; and terminating resistor circuits that can be connected to the signal lines, and whose resistance value in the transmission period is set to a value that is smaller than a resistance value in the reception period.

Abstract: An integrated circuit (IC) device includes a first input/output (I/O) buffer circuit. The first input/output buffer circuit includes first and second groups of stacked transistors. The first group of stacked transistors transfer signals formatted in accordance with only one signal protocol from the group of signal protocols. The second group of stacked transistors transfers the signals formatted in accordance with more than one signal protocols. In addition, integrated circuit device also includes a second input/output buffer circuit. The second input/output buffer circuit includes third and fourth groups of stacked transistors. The third group of stacked transistors transfers the signals formatted in accordance to the first signal transmission protocol from the group of signal transmission protocols. The fourth group of stacked transistors transfers the signals formatted in accordance to the plurality of signal transmission protocols from the group of signal transmission protocols.

Abstract: A rectifier including an autonomous type synchronous-rectification MOSFET is provided, which prevents chattering and through-current caused by a malfunction when a noise is applied. The rectifier includes: a rectification MOSFET for performing synchronous rectification; a determination circuit configured to input a voltage between a pair of main terminals of the rectification MOSFET, and to determine whether the rectification MOSFET is in on or off state on the basis of the inputted voltage; and a gate drive circuit configured such that a gate of the rectification MOSFET is turned on and off by a comparison signal from the determination circuit, and such that a time required to boost a gate voltage when the rectification MOSFET is turned on is longer than a time required to lower the gate voltage when the rectification MOSFET is turned off.

Abstract: Provided are an amplifier circuit capable of improving phase characteristics, and a voltage regulator including the amplifier circuit. The amplifier circuit is configured to amplify an input voltage and to output the input voltage, and includes a current source, a first transistor having a gate to which the input voltage is applied, and a second transistor having a gate to which a voltage synchronous with the input voltage is applied, and a source connected to a capacitor.

Abstract: To provide a small driver IC, in a pass transistor logic circuit that converts k-bit digital signals into analog signals, transistors supplied with a first-bit signal are arranged in a line in the channel width direction. The channel width of transistors supplied with second to kth-bit signals is made larger than (e.g., preferably larger than two times and smaller than eight times) that of the transistors supplied with the first-bit signal. The transistors are preferably arranged such that transistors of the same conductivity type are located adjacent to each other wherever possible.

Abstract: An electronic circuit comprising is provided with a current sense amplifier. The amplifier comprises a reference current input terminal, a sense current input terminal, and a first output terminal. The electronic circuit includes a reference current source. The reference current source includes two reference n-FET stacks connected in series, and the reference current input terminal is coupled to a ground terminal via the two reference n-FET stacks. The electronic circuit includes a plurality of memory cells each coupled in parallel via a respective sense n-FET stack to the sense current input terminal. The amplifier is configured to generate a first logical value at the first output terminal of the amplifier in response to a sense current of the sense current input terminal being lower than a reference current of the reference current input terminal.

Abstract: A high-linearity CMOS input buffer circuit is provided for neutralizing non-linearity of follower circuits' transconductance and output impedance resulting from input signals' variation. In doing so, the linearity of CMOS input buffer is improved. The buffer circuit includes a CMOS input follower circuit, a linearity improvement circuit of follower transistor, a current source load, and a linearity improvement circuit of load impedance. The buffer circuit is fabricated in standard CMOS process, featuring low cost, simplicity and strong linearity at high frequency. It has wide applications in analog and hybrid analog-digital CMOS ICs requiring high linearity input buffer.

Abstract: At least one configurable circuit cell with a continuous active region includes at least one center subcell, a first-side subcell, and a second-side subcell. Each center subcell includes first and second pMOS transistors and first and second nMOS transistors. The first pMOS transistor has a first-pMOS-transistor gate, source, and drain. The first-pMOS-transistor source is coupled to a first voltage source. The second pMOS transistor has a second-pMOS-transistor gate, source, and drain. The second-pMOS-transistor source is coupled to the first voltage source. The first-pMOS-transistor drain and the second-pMOS-transistor drain are a same drain. The first nMOS transistor has a first-nMOS-transistor gate, source, and drain. The first-nMOS-transistor source is coupled to a second voltage source. The second nMOS transistor has a second-nMOS-transistor gate, source, and drain. The second-nMOS-transistor source is coupled to the second voltage source.

Abstract: Circuitry including a logic circuitry portion and a delay circuitry portion, with the circuitry having the following features: (i) the logic circuitry is designed to receive a set of input signals including a first input signal and a second input signal; and (ii) the delay circuitry portion includes a transistor connected so that the first input signal gates the second input signal. In some embodiments, the first and second input signals are chosen because it is expected that the second input signal will arrive at the circuitry before the first input signal so that the gating of the second signal by the first signal will cause the logic circuitry portion to receive the first and second signals at substantially the same time. Also, circuitry where a first output signal from a logic circuitry portion is gated by a second output signal.

Abstract: Approaches for forming an oxide cap to protect a semiconductor device (e.g., a fin field effect transistor device (FinFET)) are provided. Specifically, approaches are provided for forming an oxide cap over a subset (e.g., SiP regions) of raised source drain (RSD) structures on the set of fins of the FinFET device to mitigate damage during subsequent processing. The oxide spacer is deposited before the removal of a nitride capping layer from the FinFET device (e.g., by a hot phosphorus wash). The oxide cap on top of the RSD structures will be preserved throughout the removal of the nitride capping layer to provide hardmask protection during this process.

Abstract: This disclosure is directed to devices, integrated circuits, systems, and methods for implementing an internal body tie bias circuit in a CMOS logic circuit. In one example, a CMOS logic circuit is formed in an integrated circuit. The CMOS logic circuit includes a PMOS transistor, an NMOS transistor; and a body tie bias circuit formed in the integrated circuit. The body tie bias circuit is coupled between a body tie connection terminal of the PMOS transistor and a body tie connection terminal of the NMOS transistor.

Abstract: At least one analog signal compatible complementary metal oxide semiconductor (CMOS) switch circuit is incorporated with digital logic circuits in an integrated circuit. The integrated circuit may further comprise a digital processor and memory, e.g., microcontroller, microprocessor, digital signal processor (DSP), programmable logic array (PLA), application specific integrated circuit (ASIC), etc., for controlling operation of the at least one analog signal compatible CMOS switch for switching analog signals, e.g., audio, video, serial communications, etc. The at least one analog signal compatible CMOS switch may have first and second states, e.g., single throw “on” or “off”, or double throw common to a or b, controlled by a single digital control signal of either a logic “0” or a logic “1”.

Abstract: A delay circuit in which the delay is independent of variations in the power supply which powers the logic gates of the delay circuit is disclosed. By separating the CMOS transistors that form each logic gate by additional CMOS bias transistors which are biased at a controlled voltage, variations in the gate delay of the inverter transistors due to variations in the power supply voltage for the inverter transistors may be minimized. In one embodiment, the constant bias voltage may be provided by a constant current source comprising a series of amplifiers each having a gain significantly less than one connected to a triple cascode.

Abstract: A logic circuit is provided which can hold a switching state of the logic circuit even when a power supply potential is not supplied, has short start-up time of a logic block after the power is supplied, can operate with low power consumption, and can easily switch between a NAND circuit and a NOR circuit. Switching between a NAND circuit and a NOR circuit is achieved by switching a charge holding state at a node through a transistor including an oxide semiconductor. With the use of an oxide semiconductor material which is a wide bandgap semiconductor for the transistor, the off-state current of the transistor can be sufficiently reduced; thus, the state of charge held at the node can be non-volatile.

Abstract: This disclosure is directed to devices, integrated circuits, systems, and methods for implementing an internal body tie bias circuit in a CMOS logic circuit. In one example, a CMOS logic circuit is formed in an integrated circuit. The CMOS logic circuit includes a PMOS transistor, an NMOS transistor; and a body tie bias circuit formed in the integrated circuit. The body tie bias circuit is coupled between a body tie connection terminal of the PMOS transistor and a body tie connection terminal of the NMOS transistor.

Abstract: A circuit in which a storage function and an arithmetic function are combined is proposed by using a transistor with low off-state current for forming a storage element. When the transistor with low off-state current is used, electric charge can be held, for example, in a node or the like between a source or a drain of the transistor with low off-state current and a gate of another transistor. Thus, the node or the like between one of the source or the drain of the transistor with low off-state current and the gate of the another transistor can be used as a storage element. In addition, leakage current accompanied by the operation of an adder can be reduced considerably. Accordingly, a signal processing circuit consuming less power can be formed.

Abstract: An integrated circuit includes a first plurality of transistors and a second plurality of transistors coupled together to form a standard cell that performs a logic function. Each of the first plurality of transistors is more critical to a speed of operation of the standard cell than any of the transistors of the second plurality of transistors. Each of the first plurality of transistors has a gate length longer than a gate length of any of the transistors of the second plurality of transistors.

Abstract: A CMOS logic circuit includes a resistive element that is connected to a first voltage line at a first end thereof. The CMOS logic circuit includes a first inverter circuit having a first MOS transistor and a second MOS transistor. The CMOS logic circuit includes a second inverter circuit having a third MOS transistor and a fourth MOS transistor. The CMOS logic circuit includes a fifth MOS transistor that is connected in parallel with the resistive element between the first voltage line and the first end of the first MOS transistor and the gate of which is connected to the second end of the third MOS transistor. The CMOS logic circuit includes a sixth MOS transistor that is connected between the first voltage line and the first output terminal.

Abstract: A semiconductor integrated circuit device includes cells A-1, B-1, and C-1 that have the same logic. Cell B-1 has cell width W2 larger than a cell width of cell A-1, but gate length L1 of a MOS transistor is equal to that of cell A-1. Cell C-1 has cell width W2 equal to a cell width of cell B-1, but has a MOS transistor having large gate length L2. A circuit delay of cell C-1 becomes large as compared with that of cells A-1 and B-1, but leak current becomes small. Therefore, by replacing cell A-1 adjacent to a space area with cell B-1, and by replacing cell B-1 in a path having room in timing with cell C-1, for example, leak current can be suppressed without increasing a chip area.

Abstract: A novel logic circuit which retains data even when power supply is stopped is provided. Further, a novel logic circuit with low power consumption is provided. In the logic circuit, a comparator comparing two output nodes, a charge retaining portion, and an output-node-potential determining portion are electrically connected to each other. Thus, the logic circuit can retain data even when power supply is stopped. In addition, the total number of transistors included in the logic circuit can be reduced. Further, a transistor including an oxide semiconductor and a transistor including silicon are stacked, whereby the area of the logic circuit can be reduced.

Abstract: The latch circuit includes a transistor whose channel region is formed with an oxide semiconductor (OS). Data is held in a node that is electrically connected to an output terminal and one of a source and a drain of the transistor and brought into a floating state when the transistor is turned off. Note that the oxide semiconductor has a band gap wider than silicon and an intrinsic carrier density lower than silicon. By using such an oxide semiconductor for the channel region of the transistor, the transistor with an extremely low off-state current (leakage current) can be realized.

Abstract: Digital circuits are disclosed that may include multiple transistors having controllable current paths coupled between first and second logic nodes. One or more of the transistors may have a deeply depleted channel formed below its gate that includes a substantially undoped channel region formed over a relatively highly doped screen layer formed over a doped body region. Resulting reductions in threshold voltage variation may improve digital circuit performance. Logic circuit, static random access memory (SRAM) cell, and passgate embodiments are disclosed.

Abstract: An integrated circuit ECO base cell module is formed with PMOS and NMOS gate electrode structures and power supply lines that are electrically separated from one another up to the second metal (M2) layer in a fixed circuit structure that may be reconfigured with one or more conductor elements formed above the M2 layer to form a predetermined circuit function.

Abstract: An integrated circuit containing CMOS logic gates and a logic-cell-compatible decoupling capacitor adjacent to the logic gates, in which the decoupling capacitor includes p+/n and n+/p capacitors, resistors between 1 and 1000 ohms connecting the capacitors to Vdd and Vss buses, and gate elements which have widths and spacings similar to the adjacent logic gates. A process of forming an integrated circuit containing CMOS logic gates and a logic-cell-compatible decoupling capacitor adjacent to the logic gates, in which the decoupling capacitor includes p+/n and n+/p capacitors, resistors between 1 and 1000 ohms connecting the capacitors to Vdd and Vss buses, and gate elements which have widths and spacings similar to the adjacent logic gates.

Abstract: A multi-operation mode application specific integrated circuit (ASIC) implemented in fully-depleted silicon-on-insulator (FDSOI) includes an ASIC implemented in FDSOI having a plurality of operating modes, plurality of power rails, and a power supply that provides voltages for the first and second rails corresponding to the plurality of operating modes. The power rails include at least one VDD rail, at least one Vss rail, a first rail for biasing a NGP region of PMOS transistor devices in the ASIC, and a second rail for biasing a PGP region of NMOS transistor devices in the ASIC.

Abstract: A circuit base cell is for implementing an engineering change order (ECO) obtained on a semiconductor substrate. The base cell may include a PMOS transistor having a first active region obtained in a first diffusion P+ layer implanted in an N-well provided for on the substrate, and an NMOS transistor having a second active region obtained in a second diffusion N+ layer implanted on the substrate in such a manner as to be electrically insulated from the first diffusion P+ layer. The cell may be characterized in that the active regions and the diffusion layers are aligned therebetween with respect to a reference axis and they are extended symmetrically in the direction orthogonal to the axis. A first and a second width may be associated with the active regions and to the diffusion layers, respectively. The first and second width may be greater than a width of the cell, which is equivalent to a pitch of the standard minimum cell.

Abstract: Various exemplary embodiments relate to improved fabrication of CMOS transistor arrays for integrated circuits. Increased regularity in standard-cells using gate-isolation architecture may permit further reduction in feature size. MOSFETs may be spaced at roughly equal pitch and have increased channel lengths for leakage current reduction. Logic gates may be designed to have nominal channel lengths for speed and increased channel lengths for leakage current reduction. Further leakage current reduction may involve specialized channel lengths for isolation MOSFETs. Thus, the combination of the gate-isolation technique with MOSFETs having lengthened channels that are evenly spaced at substantially the same pitch may produce a flexible library architecture for improved standard-cell designs in advanced CMOS technology nodes.

Abstract: Provided are an inverter, a method of manufacturing the inverter, and a logic circuit including the inverter. The inverter may include a first transistor and a second transistor having different channel layer structures. A channel layer of the first transistor may include a lower layer and an upper layer, and a channel layer of the second transistor may be the same as one of the lower layer and the upper layer. At least one of the lower layer and the upper layer may be an oxide layer. The inverter may be an enhancement/depletion (E/D) mode inverter or a complementary inverter.

Abstract: Provided are a semiconductor device and a method of fabricating the semiconductor device. The semiconductor device may be a complementary device including a p-type oxide TFT and an n-type oxide TFT. The semiconductor device may be a logic device such as an inverter, a NAND device, or a NOR device.

Abstract: A CMOS logic circuit includes a resistive element that is connected to a first voltage line at a first end thereof. The CMOS logic circuit includes a first inverter circuit having a first MOS transistor and a second MOS transistor. The CMOS logic circuit includes a second inverter circuit having a third MOS transistor and a fourth MOS transistor. The CMOS logic circuit includes a fifth MOS transistor that is connected in parallel with the resistive element between the first voltage line and the first end of the first MOS transistor and the gate of which is connected to the second end of the third MOS transistor. The CMOS logic circuit includes a sixth MOS transistor that is connected between the first voltage line and the first output terminal.

Abstract: An object is to apply a transistor using an oxide semiconductor to a logic circuit including an enhancement transistor. The logic circuit includes a depletion transistor 101 and an enhancement transistor 102. The transistors 101 and 102 each include a gate electrode, a gate insulating layer, a first oxide semiconductor layer, a second oxide semiconductor layer, a source electrode, and a drain electrode. The transistor 102 includes a reduction prevention layer provided over a region in the first oxide semiconductor layer between the source electrode and the drain electrode.

Abstract: A three dimensional multilayer circuit includes a via array made up of a set of first vias and a set of second vias and an area distributed CMOS layer configured to selectively address said first vias and said second vias. At least two crossbar arrays overlay the area distributed CMOS layer. These crossbar arrays include a plurality of intersecting crossbar segments and programmable crosspoint devices which are interposed between the intersecting crossbar segments. The vias are connected to the crossbar segments such that each programmable crosspoint devices can be uniquely accessed using a first via and a second via.

Abstract: Disclosed herein is a semiconductor integrated circuit, wherein a desired circuit is formed by combining and laying out a plurality of standard cells and connecting the cells together, of which the cell length, i.e., the gap between a pair of opposed sides, is standardized, the plurality of standard cells forming the desired circuit include complementary in-phase driven standard cells, each of which includes a plurality of complementary transistor pairs that are complementary in conductivity type to each other and have their gate electrodes connected together, and N (?2) pairs of all the complementary transistor pairs are driven in phase, and the size of the standardized cell length of the complementary in-phase driven standard cell is defined as an M-fold cell length which is M (N?M?2) times the basic cell length which is appropriate to the single complementary transistor pair.

Abstract: A semiconductor device includes a first transistor included in a latch circuit, a second transistor that is included in the latch circuit and is formed in a well in which the first transistor is formed, the second transistor having a conduction type identical to that of the first transistor, and a well contact that is provided between the first transistor and the second transistor and connects a power supply to the well.

Abstract: A novel logic circuit which retains data even when power supply is stopped is provided. Further, a novel logic circuit with low power consumption is provided. In the logic circuit, a comparator comparing two output nodes, a charge retaining portion, and an output-node-potential determining portion are electrically connected to each other. Thus, the logic circuit can retain data even when power supply is stopped. In addition, the total number of transistors included in the logic circuit can be reduced. Further, a transistor including an oxide semiconductor and a transistor including silicon are stacked, whereby the area of the logic circuit can be reduced.

Abstract: Disclosed herein is a semiconductor integrated circuit, wherein a desired circuit is formed by combining and laying out a plurality of standard cells and connecting the cells together, of which the cell length, i.e., the gap between a pair of opposed sides, is standardized, the plurality of standard cells forming the desired circuit include complementary in-phase driven standard cells, each of which includes a plurality of complementary transistor pairs that are complementary in conductivity type to each other and have their gate electrodes connected together, and N (?2) pairs of all the complementary transistor pairs are driven in phase, and the size of the standardized cell length of the complementary in-phase driven standard cell is defined as an M-fold cell length which is M (N?M?2) times the basic cell length which is appropriate to the single complementary transistor pair.