Using Stripline Patents (Class 333/116)
  • Patent number: 10637123
    Abstract: A directional coupler includes: a main line electrically connected between input and output terminals and including a first line, a second line connecting the first line and the input terminal, and a third line connecting the first line and the output terminal; a sub line electrically connected between coupling and isolation terminals and including a fourth line electromagnetically coupled with the first line, a fifth line electromagnetically coupled with the second line, and a sixth line electromagnetically coupled with the third line, the fifth line connecting the fourth line and the coupling terminal, the sixth line connecting the fourth line and the isolation terminal, and a ground conductor, shortest distances between the ground conductor and the first and fourth lines being less than shortest distances between the second, third, fifth, and sixth lines and the ground conductor.
    Type: Grant
    Filed: July 27, 2018
    Date of Patent: April 28, 2020
    Assignee: TAIYO YUDEN CO., LTD.
    Inventor: Hisahiro Yasuda
  • Patent number: 10547095
    Abstract: A method of manufacturing a broadside-coupled directional coupler including a main line and a sub line which are broadside-coupled to each other is provided. The method includes at least two adjustment processes. A line width of a coupled line part of the sub line on a first surface of a dielectric substrate is adjusted wherein the dielectric substrate having a second surface being opposite to the first surface, and the second surface has a ground plane. A position of a boundary portion where the ground plane and the coupled line are in contact with each other is adjusted.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: January 28, 2020
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Infrastructure Systems & Solutions Corporation
    Inventor: Shunya Otsuki
  • Patent number: 10541459
    Abstract: A power combiner for coupling, splitting, or coupling and splitting high-frequency signals, the power combiner has a first input for a first high-frequency signal, a second input for a second high-frequency signal, an output, an equalizing connection, a first electrical conductor arranged between the first input and the output, wherein the first electrical conductor has a first total surface shaped primarily as a first planar surface electrode, a second electrical conductor arranged between the second input and the equalizing connection, wherein the second electrical conductor has a second total surface shaped primarily as a second planar surface electrode, and wherein the second electrical conductor is capacitively and inductively coupled to the first electrical conductor; and a cooling body, wherein more than 70% of the first total surface of the first electrical conductor is a same distance from the cooling body as the second total surface of the second electrical conductor.
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: January 21, 2020
    Assignee: TRUMPF Huettinger GmbH + Co. KG
    Inventors: Andre Grede, Alexander Alt, Daniel Gruner, Anton Labanc
  • Patent number: 10530032
    Abstract: A 90-degree hybrid circuit includes a dielectric substrate, a first conductor that includes a conductor pattern formed on the dielectric substrate and electrically conducts between a first port and a second port, a second conductor that includes a conductor pattern formed on the dielectric substrate and electrically conducts between a third port and a fourth port, and a coupled line comprising a portion of the first conductor and a portion of the second conductor that face each other on front and back sides of the dielectric substrate. A first coupled line portion as the portion of the first conductor includes a coplanar line with first ground patterns formed to sandwich the first coupled line portion from both sides. A second coupled line portion as the portion of the second conductor includes a coplanar line with second ground patterns formed to sandwich the second coupled line portion from both sides.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: January 7, 2020
    Assignee: HITACHI METALS, LTD.
    Inventors: Tomoyuki Ogawa, Ryoji Matsubara
  • Patent number: 10504655
    Abstract: The composite electronic component includes: the capacitor including a body in which a plurality of dielectric layers and internal electrodes facing each other, with the dielectric layer interposed therebetween, are stacked, and the ESD protection device including first and second lead electrodes disposed on the body of the capacitor, a discharge part disposed between the first and second lead electrodes, and a protection layer disposed on the first and second lead electrodes and the discharge part; an input terminal connected to the internal electrode of the capacitor and the first lead electrode of the ESD protection device; and a ground terminal connected to the internal electrode of the capacitor and the second lead electrode of the ESD protection device. G2/G1<4.0 is satisfied, in which G1 is a distance between the internal electrodes adjacent to each other and G2 is a distance between the first and second lead electrodes.
    Type: Grant
    Filed: July 7, 2017
    Date of Patent: December 10, 2019
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Man Su Byun, Ho Yoon Kim, Dae Heon Jeong, Kyung Hwa Yu, Min Kyoung Cheon, Soo Hwan Son
  • Patent number: 10490876
    Abstract: This disclosure relates to directional couplers and methods of tuning directional couplers formed in a printed circuit board. The directional couplers include a main line for transmitting power and at least one secondary line having a coupling portion arranged parallel and at a distance from the main line in a coupling region. The directional coupler includes one or more additional coupling lines that have a coupling portion that runs parallel to and at a distance from the coupling section of the at least one secondary line. The one or more additional coupling lines have a connection arranged on the outer portion of the printed circuit board for selective grounding or connection to an external connection.
    Type: Grant
    Filed: December 22, 2017
    Date of Patent: November 26, 2019
    Assignee: TRUMPF Huettinger GmbH + Co. KG
    Inventors: Andre Grede, Daniel Gruner, Alexander Alt, Nikolai Schwerg, Christian Wangler
  • Patent number: 10468771
    Abstract: A surface card antenna apparatus comprises a single circuit board having a major side surface. The surface card antenna apparatus further comprises a horizontal polarization antenna portion mounted on the major side surface of the single circuit board. The surface card antenna apparatus also comprises a vertical polarization antenna portion mounted on the major side surface of the single circuit board.
    Type: Grant
    Filed: October 15, 2015
    Date of Patent: November 5, 2019
    Assignee: The Boeing Company
    Inventors: Nicholas B. Mentesana, Matthew G. Rivett
  • Patent number: 10461393
    Abstract: A bidirectional coupler includes: a multilayer substrate; and a first main line, a second main line, and a sub line which are provided in or on the multilayer substrate. The sub line includes a first line portion being a portion electromagnetically coupled with the first main line and an even number of second line portions being portions electromagnetically coupled with the second main line. One half of the second line portions is provided between the first line portion and one end portion of the sub line, and the other half of the second line portions is provided between the first line portion and the other end portion of the sub line.
    Type: Grant
    Filed: May 25, 2018
    Date of Patent: October 29, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Ryangsu Kim, Yasushi Shigeno
  • Patent number: 10461392
    Abstract: A bidirectional coupler includes a multilayer board, a first main line, a second main line, a third main line, and an sub line. The sub line includes a first line portion, an even number of second line portions, and an even number of third line portions. One half of the second line portions is provided between the first line portion and one end of the sub line. The other half of the second line portions is provided between the first line portion and the other end of the sub line. One half of the third line portions is provided between the one half of the second line portions and the one end of the sub line. The other half of the third line portions is provided between the other half of the second line portions and the other end of the sub line.
    Type: Grant
    Filed: May 31, 2018
    Date of Patent: October 29, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Ryangsu Kim, Yasushi Shigeno
  • Patent number: 10396421
    Abstract: Traveling-wave directional filters (DFs) with multiple coupling slots are disclosed. A traveling-wave directional filter may include two terminating conductive strips in a top circuit layer of a substrate, a loop resonator in a bottom layer of a substrate, and a shared ground plane. Coupling slots in the ground plane may couple the conductive strips via the loop resonator.
    Type: Grant
    Filed: August 2, 2017
    Date of Patent: August 27, 2019
    Inventors: Yifei Zhang, Shouyuan Shi, Richard Martin, Dennis Prather
  • Patent number: 10355642
    Abstract: A technique for reducing series resistance of an inductor system, which may increase the quality factor of the inductor system, has been disclosed. An apparatus includes a conductive loop formed from a first conductive layer. The conductive loop comprises a first terminal and a second terminal. The first terminal includes at least one first conductive finger in the first conductive layer. The second terminal includes at least one second conductive finger in the first conductive layer. The at least one second conductive finger is interdigitated with the at least one first conductive finger without directly contacting the at least one first conductive finger. The apparatus may include a serpentine gap in the first conductive layer. The apparatus may include at least one first conductive via coupled to a second conductive layer and coupled the at least one first conductive fingers, respectively.
    Type: Grant
    Filed: May 27, 2015
    Date of Patent: July 16, 2019
    Assignee: Silicon Laboratories Inc.
    Inventor: Aaron J. Caffee
  • Patent number: 10340577
    Abstract: A wide band directional coupler is disclosed. The coupler includes a main transmission line connected between an input port and an output port; and a coupling transmission line having a first length and connected between a coupling port and an isolation port, wherein the coupling transmission line is coupled to the main transmission line through a coupling capacitive connection and a mutual inductive connection, wherein at least a distance between the main transmission line and the coupling transmission line varies along the first length of the coupling transmission line such that any one of a capacitance value of the capacitive connection and an inductance value of the inductive connection is characterized by a relatively low value, wherein a coupling factor of the wide band directional couple remains substantially constant throughout an operating frequency band of the wide band directional coupler.
    Type: Grant
    Filed: February 16, 2017
    Date of Patent: July 2, 2019
    Assignee: Eagantu Ltd.
    Inventors: Michael Dakhiya, Eran Shaked, Oleg Dounaevsky
  • Patent number: 10341024
    Abstract: Embodiments of the disclosure relate to a high-directivity directional coupler, and related methods and systems. The high-directivity directional coupler includes a first microstrip and a second microstrip disposed parallel to the first microstrip. The high-directivity directional coupler inherently generates an even mode current and an odd mode current in the second microstrip. The second microstrip provides a linear forward path for conveying the even mode current and a non-linear return path for conveying the odd mode current. The non-linear return path is longer than the linear forward path to compensate for phase velocity difference between the even mode current and the odd mode current. As a result, the odd mode current and the even mode current in the second microstrip can destructively cancel out each other, thus rendering high-directivity without compromising other performance aspects of the high-directivity directional coupler.
    Type: Grant
    Filed: November 19, 2018
    Date of Patent: July 2, 2019
    Assignee: Corning Optical Communications LLC
    Inventor: Roi Yosy Ziv
  • Patent number: 10317445
    Abstract: An RF electronic impedance tuner uses multiple PIN diodes, Varactors or MOSFETs, mounted in a low loss slab-line, between the bottom surface of the center conductor and ground, are DC controlled individually and spaced appropriately along the slab-line in order to generate maximum Gamma and bandwidth. The electronic tuner is combined with a slide screw tuner, using the same slab-line in various configurations, before, after or sharing the same slab-line section, mounted on top of each-other. Calibration on a VNA allows high Gamma and harmonic tuning.
    Type: Grant
    Filed: October 20, 2016
    Date of Patent: June 11, 2019
    Inventor: Christos Tsironis
  • Patent number: 10309998
    Abstract: A system for remotely measuring antenna input impedance utilizing an automatic antenna tuner in which, for any tuner, the tuner input impedance may be established by the values of the components in the circuit at the time that the SWR is at a minimum, with these values being automatically available in terms of the components that are switched in to achieve low SWR. Once having established the input impedance to the tuner, the complex conjugate of the tuner input impedance yields the antenna input impedance, with antenna input impedance sensed at full power at a position remote from the antenna input.
    Type: Grant
    Filed: July 26, 2016
    Date of Patent: June 4, 2019
    Inventor: Martin F. Jue
  • Patent number: 10290917
    Abstract: An electric transformer device (balun) is formed on a support plate having a first base face and an opposite second base face. The balun includes a first port (40) connectable to an electrical line for a differential signal and a second port connectable to an electrical line for a single-ended signal. A first printed conductive track is associated to the first base face of the support plate for connecting the first port to the second port. A printed conductive path is associated to the second base face of the support plate for connecting the first port to the second port. The printed conductive path is formed of a symmetric second and third printed conductive tracks.
    Type: Grant
    Filed: September 9, 2015
    Date of Patent: May 14, 2019
    Assignee: STMicroelectronics S.r.l.
    Inventor: Roberto Cammarata
  • Patent number: 10276912
    Abstract: The auxiliary ground layer is a part in which the main line and the sub line do not overlap in the lamination direction and is disposed to face a part in which a distance from the first ground layer and a distance from the second ground layer are different in the lamination direction. When a longer distance is set as a first distance a and a shorter distance is set as a second distance b between a distance between the non-overlapping part and the first ground layer and a distance between the non-overlapping part and the second ground layer, and a third distance between the non-overlapping part and the auxiliary ground layer is set as c, the relationship of a>c?b is satisfied.
    Type: Grant
    Filed: October 18, 2017
    Date of Patent: April 30, 2019
    Assignee: TDK CORPORATION
    Inventor: Tetsuzo Goto
  • Patent number: 10243249
    Abstract: An improved multi-stage broadband directional coupler with at least one line junction between two successive coupling sections has a) a change in the line thickness (LD) and/or b) a change in the line width (LB) and/or c) a change in the coupling distance (KA) between the adjacent coupling sections of the two coupling lines. An electrically conductive cover connected to the coupler housing is provided adjacent to the at least one line junction.
    Type: Grant
    Filed: February 26, 2015
    Date of Patent: March 26, 2019
    Assignee: Kathrein SE
    Inventor: Frank Weiss
  • Patent number: 10224085
    Abstract: A memory slot including a pad formed of a stack of regions made of thin layers, including a first region made of a nonmagnetic conducting material; a second region made of a magnetic material exhibiting a magnetization in a direction perpendicular to the principal plane of the pad; a third region made of a nonmagnetic conducting material of different characteristics to those of the first region; the pad resting on a conducting track adapted to cause the flow of a programming current of chosen sense, in which the pad has an asymmetric shape with respect to any plane perpendicular to the plane of the layers and parallel to the central axis of the track, and with respect to its barycenter.
    Type: Grant
    Filed: January 13, 2016
    Date of Patent: March 5, 2019
    Assignees: Centre National de la Recherche Scientifique, Commissariat à l'Énergie Atomique et aux Énergies Alternatives
    Inventors: Gilles Gaudin, Ioan Mihai Miron, Olivier Boulle, Safeer Chenattukuz Hiyil, Jean-Pierre Nozieres
  • Patent number: 10211497
    Abstract: A microstrip transmission line comprising a dielectric substrate including a series of periodic sinusoidal undulation portions defining spaced apart peaks and troughs, where a distance between the peaks and troughs defines a period of the microstrip line, and where each peak defines a maximum height of the substrate and each trough defines a minimum height of the substrate. The transmission line further includes a conductive strip formed to a surface of the substrate so that the conductive strip follows the undulation portions. The conductive strip includes a modulation portion in a width direction of the conductive strip perpendicular to a signal propagation direction along the strip, where the modulation portion includes a minimum width portion provided at each peak and a maximum width portion provided at each trough so that a variation of a ratio between the width of the conductive strip and the height of the substrate is maximized.
    Type: Grant
    Filed: May 22, 2017
    Date of Patent: February 19, 2019
    Assignee: Northrop Grumman Systems Corporation
    Inventors: Jimmy G. Hester, Evan P. Nguyen, Vesna Radisic, Jesse B. Tice, Andrew D. Smith
  • Patent number: 10182116
    Abstract: One example includes a system is comprised of an elongated transmission line and as module. The elongated transmission line includes an arrangement of transmission line couplers distributed along its length at spaced apart locations. The module has an outer surface and is comprised of a transmitter, and a transmitter coupler. The transmitter transmits a radio frequency signal. The transmitter coupler is on the outer surface of the module, electrically connects with the transmitter, and aligns to couple with a respective one of the transmission line couplers to provide a contactless communication link between the transmitter and the elongated transmission line.
    Type: Grant
    Filed: December 15, 2016
    Date of Patent: January 15, 2019
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Swaminathan Sankaran, Baher Haroun, Srinath M. Ramaswamy
  • Patent number: 10181628
    Abstract: Embodiments herein describe a high-speed communication channel in a PCB that includes a dielectric waveguide sandwiched between two ground layers. The dielectric waveguide includes a core and a cladding where the material of the core has a higher dielectric constant than the material of the cladding. Thus, electromagnetic signals propagating in the core are internally reflected at the interface between the core and cladding such that the electromagnetic signals are primary contained in the core.
    Type: Grant
    Filed: October 21, 2016
    Date of Patent: January 15, 2019
    Assignee: International Business Machines Corporation
    Inventors: Daniel M. Dreps, Jose A. Hejase, Joshua C. Myers, Junyan Tang
  • Patent number: 10142025
    Abstract: Embodiments of the disclosure relate to a high-directivity directional coupler, and related methods and systems. The high-directivity directional coupler includes a first microstrip and a second microstrip disposed parallel to the first microstrip. The high-directivity directional coupler inherently generates an even mode current and an odd mode current in the second microstrip. The second microstrip provides a linear forward path for conveying the even mode current and a non-linear return path for conveying the odd mode current. The non-linear return path is longer than the linear forward path to compensate for phase velocity difference between the even mode current and the odd mode current. As a result, the odd mode current and the even mode current in the second microstrip can destructively cancel out each other, thus rendering high-directivity without compromising other performance aspects of the high-directivity directional coupler.
    Type: Grant
    Filed: April 18, 2017
    Date of Patent: November 27, 2018
    Assignee: Corning Optical Communications Wireless Ltd
    Inventor: Roi Yosy Ziv
  • Patent number: 10128558
    Abstract: Directional couplers having a chain configuration and devices incorporating same. In some implementations, a chain coupler assembly can include a plurality of couplers each having a driver arm configured to route a respective RF signal and a coupled arm disposed physically proximate to the driver arm to detect a portion of power of the respective RF signal. Portions of the driver arm and the coupler arm can form an overlapping region. At least one of the driver arm and the coupled arm can have a non-straight arm shape, and the coupled arms of the plurality of couplers can be connected together in series.
    Type: Grant
    Filed: July 27, 2017
    Date of Patent: November 13, 2018
    Assignee: SKYWORKS SOLUTIONS, INC.
    Inventors: Weimin Sun, Xiaofang Mu, Hongxiao Shao
  • Patent number: 10076022
    Abstract: A noise reducing electronic component is used as mounted on a circuit board. The noise reducing electronic component includes: a floating electrode disposed so as to be capacitively coupled to a ground conductor of the circuit board; a radiation element connected to the floating electrode; and a shielding member to shield electromagnetic waves radiated from the radiation element. With this noise reducing electronic component, noise in a printed circuit board and the like can be reduced.
    Type: Grant
    Filed: August 4, 2016
    Date of Patent: September 11, 2018
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yu Ishiwata, Takahiro Azuma
  • Patent number: 10056988
    Abstract: A directional coupler disclosed herein may include a main line provided on a substrate, the main line having a first end connected to an input port and a second end connected to an output port. The coupler may include a coupled line disposed on the substrate, the coupled line having a first end connected to a coupled port and a second end to an isolated port. The main line is electrically isolated from the coupled line. The coupled line includes multiple turns forming a winding, and a portion of the winding overlaps with the main line. The coupled line forms a plurality of windings inductively coupled with the main line. The main line and the coupled line are routed to propagate electric signals on both lines in a same direction, and enhance inductive coupling by mutual inductance.
    Type: Grant
    Filed: June 28, 2016
    Date of Patent: August 21, 2018
    Assignee: Intel IP Corporation
    Inventors: Jianxin Wu, Lei Feng
  • Patent number: 10037931
    Abstract: The disclosure is directed to semiconductor structures and, more particularly, to a three dimensional microstrip branchline coupler and methods of manufacture. The structure includes a plurality of through silicon vias and conductive lines electrically connected to a first end and a second end of respective ones of the plurality of through silicon vias. A first through silicon via of the plurality of through silicon vias forms a first port of a three dimensional (3D) branchline coupler. A second through silicon via of the plurality of through silicon vias forms a second port of the 3D branchline coupler. A third through silicon via of the plurality of through silicon vias forms a third port of the 3D branchline coupler. A fourth through silicon via of the plurality of through silicon vias forms a fourth port of the 3D branchline coupler.
    Type: Grant
    Filed: August 4, 2017
    Date of Patent: July 31, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Barbara S. DeWitt, Essam Mina, B M Farid Rahman, Guoan Wang
  • Patent number: 10005551
    Abstract: A rotary machine includes a rotatable shaft and a retaining ring coupled to, and at least partially extending about, the rotatable shaft. The rotatable shaft defines a longitudinal axis. The rotatable shaft and the retaining ring define an annular cavity. The rotatable shaft and the retaining ring each include a radially outer surface. The rotary machine also includes a monitoring system including a stationary reader-antenna positioned proximate the retaining ring and a radio frequency (RF) coupler. The RF coupler includes at least one flexible antenna band coupled to, and extending over, the radially outer surface of the retaining ring. The flexible antenna band is configured to establish RF coupling with the stationary reader-antenna. A sensor die is coupled to the flexible antenna band. The sensor die extends into the substantially annular cavity and the sensor die is also coupled to the radially outer surface of the rotatable shaft.
    Type: Grant
    Filed: July 6, 2015
    Date of Patent: June 26, 2018
    Assignee: GENERAL ELECTRIC COMPANY
    Inventors: Yongjae Lee, Joseph Alfred Iannotti
  • Patent number: 9888574
    Abstract: Apparatuses and methods including conductive vias of a printed circuit board are described. An example apparatus includes a first layer including a first conductive plate; a component on the first layer, a second layer including a second conductive plate that may be coupled to an external power source; a third layer between the first layer and the second layer, the third layer including a third conductive plate; a first via coupling the first conductive plate to the second conductive plate; and a second via coupled to the first conductive plate. The first conductive plate includes a first portion coupled to the first via and the first conductive plate further includes a second portion coupled to the second via between the first portion and the component. The second via is coupled to either the second conductive plate or the third conductive plate.
    Type: Grant
    Filed: January 5, 2017
    Date of Patent: February 6, 2018
    Assignee: Micron Technology, Inc.
    Inventor: Atsushi Morishima
  • Patent number: 9843085
    Abstract: A directional coupler includes a multilayer body including a plurality of stacked dielectric layers, a main line including a first main line portion and a second main line portion which are connected in series to each other in this order and that is provided in the multilayer body, and a sub-line including a first sub-line portion and a second sub-line portion which are connected in series to each other in this order, the first sub-line portion being electromagnetically coupled to the first main line portion, the second sub-line portion being electromagnetically coupled to the second main line portion, and the sub-line being provided on one side in a stacking direction with respect to the main line in the multilayer body.
    Type: Grant
    Filed: November 30, 2016
    Date of Patent: December 12, 2017
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Keisuke Katabuchi, Tetsuo Taniguchi, Yasushi Yunoki
  • Patent number: 9795043
    Abstract: Radio frequency subscriber drop units include a housing having an input port and an output port and a printed circuit board mounted in an interior of the housing. The printed circuit board includes a dielectric layer, a wiring layer that includes conductive wirings that comprise at least part of a communications path between the input port and the output port that is on a first face of the dielectric layer, and a ground plane layer that includes a conductive ground plane that is on a second face of the dielectric layer.
    Type: Grant
    Filed: September 16, 2014
    Date of Patent: October 17, 2017
    Assignee: CommScope, Inc. of North Carolina
    Inventors: Shi Man Li, Chi-Min Kang, Jui-Huang Chung
  • Patent number: 9786978
    Abstract: The invention presents a LTCC balun filter using two out-of-phase filtering circuits. The LTCC balun filter is comprised of three half-wavelength resonators and grounds which are located on fourteen metal layers. Vias are utilized to connect different metal parts. The first, fourth, seventh, eleventh and fourteenth metal layers are the ground. The three half-wavelength resonators are on the second, third, fifth, sixth, eighth, ninth, tenth, twelfth and thirteenth metal layers. By adjusting the coupling parts of the three half-wavelength resonators, namely the lengths of the seventh, eighth, ninth, tenth and eleventh layers, as well as the distances between them, the coupling strength between the half-wavelength resonators can be tuned. In addition, the quality factor of the circuit can be improved by tuning the port positions. By using the multi-layer LTCC technology, the present invention has the advantage of compact size, novelty, creativity and practicability.
    Type: Grant
    Filed: December 4, 2014
    Date of Patent: October 10, 2017
    Assignee: South China University of Technology
    Inventors: Xiuyin Zhang, Xiaofeng Liu, Jinxu Xu, Xiaolan Zhao
  • Patent number: 9726753
    Abstract: A circuit configuration for radar applications having a printed board and semiconductor modules mounted on it, each of the semiconductor modules including an integrated circuit, a rewiring layer for connecting the integrated circuit to the printed board and at least one antenna element integrated into the semiconductor module and connected to the integrated circuit for transmitting and/or receiving radar signals, the integrated circuit including at least one HF oscillator and a frequency splitter connected to the HF oscillator, the circuit configuration including phase-locked loops for controlling the HF oscillators, each of the phase-locked loops having the frequency splitter and a phase detector for comparing a split-frequency signal of the HF oscillator with a reference signal, and the reference signals may be fed to the phase-locked loops via the printed board.
    Type: Grant
    Filed: March 13, 2012
    Date of Patent: August 8, 2017
    Assignee: ROBERT BOSCH GMBH
    Inventors: Thomas Binzer, Oliver Brueggmann, Christian Waldschmidt, Dirk Steinbuch
  • Patent number: 9716306
    Abstract: A directional coupler including a first transmission line including a terminal part provided with a matched termination, and a front end part being an end portion on a side opposite to a side of the terminal part; a second transmission line electromagnetically coupled with the first transmission line; and a third transmission line electromagnetically coupled with the first transmission line, wherein each of the second and third transmission lines includes a near end and a far end, the near end being positioned on a side closer to the front end part when tracing the first transmission line from the front end part, the far end being positioned on a side farther from the front end part when tracing the first transmission line from the front end part, and wherein the near end is terminated to have an impedance smaller than a characteristic impedance of the second transmission line.
    Type: Grant
    Filed: July 30, 2014
    Date of Patent: July 25, 2017
    Assignee: KEIO UNIVERSITY
    Inventor: Tadahiro Kuroda
  • Patent number: 9692387
    Abstract: A balun includes a dielectric layer having first and second sides, an electrically conductive plate on the second side of the dielectric layer, a first electrically conductive line on the first side and comprising a first end electrically connected to a first terminal and a second end, a second electrically conductive line on the second side and comprising a third end electrically coupled to a second terminal and a fourth end connected to an unbalanced terminal and a micro strip line comprising a fifth end electrically connected to the third end and a sixth end. The first electrically conductive line overlaps the second electrically conductive line. The second and the sixth ends are electrically coupled to the electrically conductive plate. The electrically conductive plate is hollowed in at least a region corresponding to an overlap area of the first electrically conductive line and second electrically conductive line.
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: June 27, 2017
    Assignee: NXP USA, INC.
    Inventors: Jeremie Jean Simon, Laurent Gauthier, Maria Del Carmen Medina Urturi, Lionel Mongin
  • Patent number: 9673776
    Abstract: A wide band directional coupler comprises a first transmission line, a second transmission line and at least one inductor, wherein the first transmission line and the second transmission line are adjacent each other, and the inductor connects to the second transmission. As a RF signal passes through the first transmission line, the second transmission line will couple with the RF signal in the first transmission line to generate a coupling signal. The inductor is connected to the second transmission line to improve the coupling factor and/or the insertion loss of the wide band directional coupler at high frequency band.
    Type: Grant
    Filed: July 21, 2015
    Date of Patent: June 6, 2017
    Assignee: Airoha Technology Corp.
    Inventor: Kuan-Wei Li
  • Patent number: 9647315
    Abstract: A directional coupler includes a multilayer structure formed by stacking a plurality of dielectric layers including first and second dielectric layers; a main line including first and second main line portions that are electrically connected in series to each other; and a sub line electromagnetically coupled with the main line, the sub line including first and second sub line portions that are electrically connected in series to each other. The first main line portion and the first sub line portion are provided on the first dielectric layer. The second main line portion and the second sub line portion are provided on the second dielectric layer. In planar view along a stacking direction, the first main line portion and the second sub line portion overlap one another, and the first sub line portion and the second main line portion overlap one another.
    Type: Grant
    Filed: April 10, 2015
    Date of Patent: May 9, 2017
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Shinya Yamatogi, Nobuyoshi Okuda
  • Patent number: 9608709
    Abstract: System and methods for (i) covering wirelessly a large angular span using combinations of directional antennas, (ii) dynamic synthesis of antenna radiation patterns, and (iii) antenna configuration selection and beamforming.
    Type: Grant
    Filed: January 29, 2014
    Date of Patent: March 28, 2017
    Assignee: GoNet Systems, Ltd.
    Inventors: Roy Kinamon, Gal Zuckerman, Moshe Salhov, Oz Liv
  • Patent number: 9601818
    Abstract: A microwave circuit with which cracks in substrates can be suppressed and which can reduce the size of module including the microwave circuit is provided. The microwave circuit includes a multilayer first substrate, a second substrate that opposes the first substrate, a plurality of first electrically conductive members that electrically connect a first layer of the first substrate and the second substrate to each other, a plurality of second electrically conductive members that electrically connect the first layer of the first substrate and another layer of the first substrate to each other and each of the plurality of second electrically conductive members has a smaller diameter than that of each of the first electrically conductive members, and transmission lines that connect the first electrically conductive members and the second electrically conductive members.
    Type: Grant
    Filed: June 3, 2014
    Date of Patent: March 21, 2017
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Suguru Fujita, Maki Nakamura
  • Patent number: 9576711
    Abstract: There are provided a coil component and a board having the same. The coil component includes: a magnetic body including a substrate having two cores, first and second coil parts disposed on one surface of the substrate and wound in the same direction, and third and fourth coil parts disposed on the other surface of the substrate to be spaced apart from each other; and first to fourth external electrodes disposed on outer surfaces of the magnetic body and connected to the first to fourth coil parts.
    Type: Grant
    Filed: February 18, 2015
    Date of Patent: February 21, 2017
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chan Yoon, Dong Hwan Lee, Young Ghyu Ahn
  • Patent number: 9553349
    Abstract: To achieve favorable directivity in a directional coupler, even with a low magnetic-field coupling coefficient, the directional coupler includes a main line, a secondary line, and impedance conversion sections. The main line is connected between a signal input port and a signal output port. The secondary line is coupled to the main line through coupling capacitance and mutual inductance. The impedance conversion sections are connected between the secondary line and a coupling port or an isolation port, and the impedance viewed from the secondary line differs from the impedance viewed from a port side while both impedances viewed from the secondary line are equal.
    Type: Grant
    Filed: August 28, 2014
    Date of Patent: January 24, 2017
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Kazutaka Mukaiyama
  • Patent number: 9543632
    Abstract: A directional coupler includes a multilayer body including a plurality of stacked dielectric layers, a main line including a first main line portion and a second main line portion which are connected in series to each other in this order and that is provided in the multilayer body, and a sub-line including a first sub-line portion and a second sub-line portion which are connected in series to each other in this order, the first sub-line portion being electromagnetically coupled to the first main line portion, the second sub-line portion being electromagnetically coupled to the second main line portion, and the sub-line being provided on one side in a stacking direction with respect to the main line in the multilayer body.
    Type: Grant
    Filed: August 20, 2014
    Date of Patent: January 10, 2017
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Keisuke Katabuchi, Tetsuo Taniguchi, Yasushi Yunoki
  • Patent number: 9531053
    Abstract: A directional coupler including a main line having an input terminal and an output terminal, and a sub-line having a coupling terminal and an isolation terminal, the main line, the sub-line, the input terminal, the output terminal, the coupling terminal and the isolation terminal being disposed within a laminate, wherein the main line and the sub-line extend in a loop shape in parallel with and spaced apart from each other by a gap such that electromagnetic coupling is generated therebetween and such that the main line is positioned outside the sub-line on a coupling layer, the input terminal, the output terminal, the coupling terminal and the isolation terminal are disposed outside the main line, and the main line is interposed between the output terminal and the sub-line.
    Type: Grant
    Filed: February 22, 2016
    Date of Patent: December 27, 2016
    Assignee: TDK Corporation
    Inventors: Toshiyasu Fujiwara, Chengbin Lin, Takeshi Oohashi, Yukio Mitake
  • Patent number: 9496902
    Abstract: Provided herein are apparatus and methods for reconfigurable directional couplers in an RF transceiver. Reconfigurable directional couplers can be reconfigured and designed to provide high directivity using configurable capacitors to effect a mutual coupling and using lumped components or delay lines to effect a phase shift. Depending on the embodiment, the reconfigurable directional coupler can include capacitors, inductors, and switching components. The coupler can be designed for multi-band operation with an adjustable coupling factor conducive to semiconductor process integration. The coupler can have variable phase shifters to achieve a desired level of directivity in the coupler.
    Type: Grant
    Filed: July 24, 2015
    Date of Patent: November 15, 2016
    Assignee: SKYWORKS SOLUTIONS, INC.
    Inventors: Nuttapong Srirattana, David Scott Whitefield, David Ryan Story
  • Patent number: 9484334
    Abstract: A semiconductor device has a substrate and RF coupler formed over the substrate. The RF coupler has a first conductive trace with a first end coupled to a first terminal of the semiconductor device, and a second conductive trace with a first end coupled to a second terminal of the semiconductor device. The first conductive trace is placed in proximity to a first portion of the second conductive trace. An integrated passive device is formed over the substrate. A second portion of the second conductive trace operates as a circuit component of the integrated passive device. The integrated passive device can be a balun or low-pass filter. The RF coupler also has a first capacitor coupled to the first terminal of the semiconductor device, and second capacitor coupled to a third terminal of the semiconductor device for higher directivity. The second conductive trace is wound to exhibit an inductive property.
    Type: Grant
    Filed: December 17, 2012
    Date of Patent: November 1, 2016
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: Robert C. Frye, Kai Liu
  • Patent number: 9484611
    Abstract: The invention relates two lines each with two terminals. A first line provides a first terminal and a second terminal. A second line provides a first terminal and a second terminal. The lines extend in spatial proximity and are coupled. The two lines transport an electromagnetic signal fed into the line system. Distanced from the first terminal of the second line and distanced from the second terminal of the second line, at least one controllable element is arranged along the second line. The invention further relates to a switch, a controllable diplexer, a controllable frequency filter, a controllable attenuator and a controllable phase shifter.
    Type: Grant
    Filed: April 29, 2014
    Date of Patent: November 1, 2016
    Assignee: ROHDE & SCHWARZ GMBH & CO. KG
    Inventor: Rudolf Forstmaier
  • Patent number: 9431177
    Abstract: In one or more embodiments, circuitry is provided for isolation and communication of signals between circuits operating in different voltage domains using capacitive coupling. The capacitive coupling is provided by one or more capacitive structures having a breakdown voltage that is defined by way of the various components and their spacing. The capacitive structures each include three capacitive plates arranged to have two plates located in an upper layer and one plate located in a lower layer. A communication signal can be transmitted via the capacitive coupling created between the lower plate and each of the upper plates, respectively.
    Type: Grant
    Filed: March 13, 2015
    Date of Patent: August 30, 2016
    Assignee: NXP B.V.
    Inventor: Peter Gerard Steeneken
  • Patent number: 9413053
    Abstract: A galvanically isolated, directional coupler, especially for in- and out-coupling of high-frequency measurement signals of a radar fill-level measuring device, wherein two mutually engaging, oppositely bent, conductive traces are provided, wherein the two oppositely bent, conductive traces are so arranged that that they couple with one another over a region of a quarter wavelength (?/4) of the wavelength associated with the center frequency of the measuring signals and form two groups of laterally coupled, conductive traces, and wherein curved conductive trace portions adjoin each of the two groups of laterally coupled, conductive traces, in each case, over a region, which is less than an eighth wavelength (?/8) of the wavelength associated with the center frequency.
    Type: Grant
    Filed: July 16, 2012
    Date of Patent: August 9, 2016
    Assignee: ENDRESS + HAUSER GMBH + CO. KG
    Inventor: Thomas Blodt
  • Patent number: 9413054
    Abstract: Directional coupler includes a first, second and third transmission lines. Each of the first and second transmission line elements is disposed on a dielectric substrate, and has a first end and a second end. At least a portion of the first and second transmission line elements are adjacent along a path. A third transmission line element is disposed along the path between the first and the second transmission line elements and separated therefrom by a portion of the dielectric substrate. The third transmission line element is electrically connected to a ground plane disposed on a surface of the dielectric substrate opposed from the first and second transmission line elements.
    Type: Grant
    Filed: December 10, 2014
    Date of Patent: August 9, 2016
    Assignee: Harris Corporation
    Inventor: Ronald J. Hash
  • Patent number: 9391354
    Abstract: A directional coupler includes: a main line connecting an input port and an output port; a first subline section and a second subline section each of which is formed of a line configured to be electromagnetically coupled to the main line; and a matching circuit provided between the first subline section and the second subline section. The matching circuit includes a first path connecting the first subline section and the second subline section, and a second path connecting the first path and the ground. The first path includes a first inductor. The second path includes a first capacitor and a second inductor connected in series.
    Type: Grant
    Filed: February 13, 2015
    Date of Patent: July 12, 2016
    Assignee: TDK CORPORATION
    Inventors: Noriaki Ootsuka, Yasunori Sakisaka