Abstract: A device comprises a package substrate and a ball grid array (BGA). The package substrate encapsulates an integrated circuit (IC) die and comprises a signal launch configured to emit or receive a signal on a surface of the package substrate. The BGA is affixed to the surface and comprises a set of grounded solder balls arranged as a boundary around the signal launch. The device may further comprise a printed circuit board (PCB) substrate having a waveguide interface side opposite a secondary waveguide side and a through-hole cavity that extends from the waveguide interface side to the secondary waveguide side, perpendicular to a plane of the PCB substrate. The BGA couples the package substrate to the waveguide interface side such that the surface of the package substrate faces the through-hole cavity and the signal launch and through-hole cavity are substantially aligned.

Abstract: High speed waveguide-based data communication systems are disclosed. Such systems may include separable electrical connectors, forming signal propagation paths between electronic assemblies with one or more waveguides.

Abstract: A high-frequency testing probe with a probe substrate and at least two probe tips. The probe substrate is a printed circuit board and the probe tips are coupled to and extend away from the printed circuit board. The first and second probe tips are each communicatively coupled to respective first and second probe connectors through respective first and second conducting traces disposed upon respective first and second sides of the printed circuit board. The probe connectors are configured to couple the testing probe to at least one of a high-frequency vector network analyzer and a high-frequency time domain reflectometer. The positions of the first ends of the first and second probe tips are adjustable. The first and second probe tips may be coupled to the first and second conducting traces through respective first and second joints, and may be configured to rotate about the first and second joints.

Abstract: A multilayer board includes a laminated insulating body, signal conductors inside the laminated insulating body and extending in a transmission direction, and ground conductors sandwiching each of the signal conductors in a lamination direction via the insulating base material layers. The multilayer board includes a parallel extending portion in which the signal conductors extend parallel and that includes signal conductors arranged separately from each other in a direction orthogonal to the transmission direction in a planar view in the lamination direction, and a signal conductor overlapping with the signal conductor in a planar view in the lamination direction and arranged separately from the signal conductor in the lamination direction. The parallel extending portion includes first and second regions arranged separately in a direction orthogonal to the transmission direction in a planar view in the lamination direction.

Abstract: Antenna and/or waveguide assemblies for vehicles, such as RADAR sensor antenna assemblies, along with associated signal confinement structures. In some embodiments, the assembly may comprise an antenna block defining one or more waveguides. A conductive layer may be coupled to the antenna block to form, at least in part, a wall of the waveguide. The assembly may comprise one or more periodic structures that may be operably coupled to the waveguide, each of which may comprise a first elongated opening and a first series of repeated slots extending at least substantially transverse to the first elongated opening, wherein each of the first series of repeated slots is spaced apart from an adjacent slot in the first series of repeated slots along the first elongated opening.

Abstract: A display device includes: a display panel; and a first substrate connected to the display panel, wherein the first substrate comprises: a first base substrate; a first wiring layer having a plurality of first signal wirings on the first base substrate; and a first ground wiring layer on the first wiring layer, wherein the first ground wiring layer comprises a mesh pattern area and a non-mesh pattern area, wherein the mesh pattern area comprises a plurality of first mesh patterns and openings surrounded by adjacent first mesh patterns, and the non-mesh pattern area comprises a plurality of second mesh patterns and non-mesh patterns surrounded by adjacent second mesh patterns, wherein the non-mesh patterns are physically connected to the adjacent second mesh patterns.

Abstract: A printed circuit board has a first stacked body having a flexible region and a rigid region, and a second stacked body disposed on the rigid region of the first stacked body. The first stacked body includes a plurality of first insulating layers, a plurality of first bonding layers, and a plurality of first wiring layers. The second stacked body includes a plurality of second insulating layers and a plurality of second wiring layers, and each of the plurality of first bonding layers integrally covers at least a portion of upper and side surfaces of a respective first wiring layer of the plurality of first wiring layers.

Abstract: The invention provides a transmission cable with a main baseline layer and a superimposed line layer. The main baseline layer includes a superimposed part, and a non-superimposed part. The superimposed line layer and the superimposed part form an unbendable part; the non-superimposed part forms a bendable par. The main baseline layer includes a first grounding layer, a first base layer stacked, a signal line layer, and a second base layer. The superimposed line layer includes a third base layer and a second grounding layer. The bendable part is small in thickness, so that the transmission cable provided by the invention has good bending performance, thereby improving the practicability of the transmission cable and prolonging the service life of the transmission cable.

Abstract: An electrical connector assembly comprises a printed circuit board and a data transmission cable. The printed circuit board has a substrate and a routing structure, the substrate has a welding region and a routing region, the routing structure comprises a plurality of bonding pads. The data transmission cable comprises several juxtaposed wires, a plastic layer and a metallic layer formed by a metal material belt, each wire has a conductor, the metallic layer has at least an aluminum foil layer and a bonding layer. The metallic layer is bonded to the outer side of the plastic layer via the bonding layer. The wires are soldered with corresponding bonding pads, the center distance between every two neighboring wires is same as the center distance between every two neighboring bonding pads.

Abstract: A semiconductor device includes a first transmission line and a second transmission line. The semiconductor device further includes a high-k dielectric material between the first transmission line and the second transmission line, wherein the high-k dielectric material surrounds the second transmission line. The semiconductor device further includes a dielectric material directly contacting the high-k dielectric material, wherein the dielectric material has a different dielectric constant from the high-k dielectric material, and the dielectric material is separated from the first transmission line and the second transmission line.

Abstract: Systems, apparatuses, and methods may provide for technology to process graphical data, and to modify a runtime environment in a parallel computing platform for a graphic environment.

Abstract: A printed circuit board (PCB) comprises two or more PCB layers comprising of a dielectric core and conductive cladding on adjoining surfaces; one or more DC lines embedded in one or more layers of the two or more PCB layers; one or more RF signal lines embedded in one or more layers of the two or more PCB layers; wherein the one or more DC lines crosses over/under at least one of the RF signal lines to form at least one crossover, wherein the at least one crossover is no thicker than the PCB layer in which it is situated. The printed circuit board of claim 1, further comprising two or more generally parallel DC lines which converge to form a stack of superposed parallel DC lines where the two or more DC lines cross over the one or more RF signal lines.

Abstract: An electrical connector includes an insulating body accommodating multiple first terminals. The first terminals include first and second differential signal pairs. No ground terminal is provided at one side of the first differential signal pair. Both sides of the second differential signal pair have ground terminals. The impedance of the first differential signal pair is adjusted by having a distance between the first differential signal pair and the first ground terminal less than a distance between the second differential signal pair and the first ground terminal, or by having a width of a portion of the first differential signal pair exposed out of the insulating body greater than a width of a portion of the second differential signal pair exposed out of the insulating body, or by having a distance between terminals of the first differential signal pair less than a distance between terminals of the second differential signal pair.

Abstract: Disclosed is an electronic device. Other various embodiments as understood from the specification are also possible. The electronic device may include a connector electrically connected to an external device and including a first pin and a second pin and a cable including a plurality of lines. The cable may include an antenna line for receiving a broadcast signal among the plurality of lines, and the antenna line may be configured to be allocated to one pin among the first pin or the second pin.

Abstract: A device comprises a package substrate and a ball grid array (BGA). The package substrate encapsulates an integrated circuit (IC) die and comprises a signal launch configured to emit or receive a signal on a surface of the package substrate. The BGA is affixed to the surface and comprises a set of grounded solder balls arranged as a boundary around the signal launch. The device may further comprise a printed circuit board (PCB) substrate having a waveguide interface side opposite a secondary waveguide side and a through-hole cavity that extends from the waveguide interface side to the secondary waveguide side, perpendicular to a plane of the PCB substrate. The BGA couples the package substrate to the waveguide interface side such that the surface of the package substrate faces the through-hole cavity and the signal launch and through-hole cavity are substantially aligned.

Abstract: The present invention provides a feed circuit capable of enhancing a mechanical strength and electrical characteristics thereof. A waveguide is provided on a plate-like member, and has a plurality of branches. A bridging part-extends in a Y direction intersecting an X direction in which the waveguide-guides an electromagnetic wave between sidewalls of the waveguide (14), and includes a plurality of members provided at predetermined intervals in the X direction so that intensity of a reflected wave becomes a predetermined intensity or less.

Abstract: A circuit board has an edge connector with signal traces. The signal traces are formed on a dielectric layer of the circuit board. A reference trace is formed within the dielectric layer or on another surface of the dielectric layer. Parameters of the reference trace are adjusted to set an impedance of a single-ended signal trace or a differential impedance of two adjacent signal traces.

Abstract: A layout routing structure and a layout routing method for improving an SI performance of a signal are provided. Each of two positive and negative differential traces on a PCB includes multiple segments D1, multiple segments D2 and multiple segments D3. In each of the two differential traces, the segment D1 and the segment D2 are staggered and parallel to each other, the segment D2 is routed between any two segments D1, and any two adjacent segments D1 and D2 are connected by the segment D3. In one of the two differential traces, all of the segments D1 are routed on the glass cloth, and all of the segments D2 are routed on the epoxy resin. In the other of the two differential traces, all of the segments D1 are routed on the epoxy resin, and all of the segments D2 are routed on the glass cloth.

Abstract: An RF crossover apparatus provides low transmission and return losses for microwave systems and meets the requirement for the RF signals to leap over each other as in an insulated state. The RF crossover apparatus contains a body produced from ceramic material, at least two RF strips placed inside the body in a way to intersect each other and at least one insulation layer insulating the RF strips placed on the body at least from the external environment. The body produced from ceramic material enables operation on high frequencies and this provides low transmission and return losses. The RE crossover apparatus also contains matching circuits on the tips of the RF strips for the RF strips to be passed to chip devices during use.

Abstract: Methods and systems for providing crosstalk compensation in a jack are disclosed. According to one method, the crosstalk compensation is adapted to compensate for undesired crosstalk generated at a capacitive coupling located at a plug inserted within the jack. The method includes positioning a first capacitive coupling a first time delay away from the capacitive coupling of the plug, the first capacitive coupling having a greater magnitude and an opposite polarity as compared to the capacitive coupling of the plug. The method also includes positioning a second capacitive coupling at a second time delay from the first capacitive coupling, the second time delay corresponding to an average time delay that optimizes near end crosstalk. The second capacitive coupling has generally the same overall magnitude but an opposite polarity as compared to the first capacitive coupling, and includes two capacitive elements spaced at different time delays from the first capacitive coupling.

Abstract: Aspects of the subject disclosure may include, for example, a transmission medium for propagating electromagnetic waves. The transmission medium can include a core for propagating electromagnetic waves guided by the core without an electrical return path, a rigid material surrounding the core, wherein an inner surface of the rigid material is separated from an outer surface of the core, and a conductive layer disposed on the rigid material. Other embodiments are disclosed.

Abstract: A multilayer board includes a laminated insulating body, signal conductors inside the laminated insulating body and extending in a transmission direction, and ground conductors sandwiching each of the signal conductors in a lamination direction via the insulating base material layers. The multilayer board includes a parallel extending portion in which the signal conductors extend parallel and that includes signal conductors arranged separately from each other in a direction orthogonal to the transmission direction in a planar view in the lamination direction, and a signal conductor overlapping with the signal conductor in a planar view in the lamination direction and arranged separately from the signal conductor in the lamination direction. The parallel extending portion includes first and second regions arranged separately in a direction orthogonal to the transmission direction in a planar view in the lamination direction.

Abstract: Provided is a multilayered transmission line plate including one pair of ground layers, a differential wiring layer disposed between one ground layer and the other ground layer of the one pair of ground layers, a first insulating portion disposed between the differential wiring layer and the one ground layer, and a second insulating portion disposed between the differential wiring layer and the other ground layer, wherein the first insulating portion has a resin layer, the first insulating portion or the second insulating portion has a fiber base material layer including a fiber base material, and a thickness of the first insulating portion is equal to or thinner than a thickness of the second insulating portion.

Abstract: A shielded flat cable includes one or more ground wires arranged, the ground wires being parallel to each other, one or more signal wires arranged parallel to the one or more ground wires, an insulating layer covering the one or more ground wires and the one or more signal wires, and a shield layer provided on an outer surface of the insulating layer, wherein a thickness of the insulating layer at a central position of each ground wire in an arrangement direction is smaller than a thickness of the insulating layer at a central position of each signal wire in the arrangement direction, in a cross-section orthogonal to a longitudinal direction of the one or more ground wires, the arrangement direction being a direction in which the one or more ground wires and the one or more signal wires are arranged parallel to each other.

Abstract: According to one embodiment, a display device includes a display panel including a terminal part, a first insulating layer, a first line disposed on a first surface of the first insulating layer, a second line disposed on a second surface of the first insulating layer opposed to the first surface, a first ground line configured to disposed on the first surface, a second ground line configured to disposed on the first surface, a third ground line configured to disposed on the second surface, a fourth ground line configured to disposed on the second surface, and a circuit substrate including a connector part electrically connected to the terminal part.

Abstract: A circuit board has an edge connector with signal traces. The signal traces are formed on a dielectric layer of the circuit board. A reference trace is formed within the dielectric layer or on another surface of the dielectric layer. Parameters of the reference trace are adjusted to set an impedance of a single-ended signal trace or a differential impedance of two adjacent signal traces.

Abstract: A printed circuit board comprises a substrate and a routing structure arranged on the substrate, the substrate has a welding region and a routing region electrical connected with the welding region. The routing structure comprises a plurality of bonding pads connected with corresponding wires and a plurality of conductive traces electrically connected with the bonding pads, the bonding pads is arranged in the welding region, and the conductive traces are disposed in both the welding region and the routing region. The bonding pads are arranged abreast, and in the arrangement direction of the bonding pads, the bonding pads defines at least two grounding pads for connecting with grounding wires and at least a signal pad between the two grounding pads.

Abstract: A differential transmission line and a wiring substrate are provided. The differential transmission line includes a ground layer, a dielectric layer, a first transmission line, and a second transmission line. The ground layer is formed of a metal conductor. The dielectric layer is disposed on the ground layer. The first transmission line and the second transmission line are disposed on the dielectric layer. A metal conductor removal block is distributed in at least a portion of at least one of a first projection area of the ground layer on which to project the first transmission line and a second projection area of the ground layer on which to project the second transmission line. A metal conductor is provided in a region between the first projection area and the second projection area of the ground layer.

Abstract: As a layout requirement imposed on an in-phase corporate-feed circuit, there is provided only a layout requirement to equalize the electric length of a transmission line (4) between one of N T-branch units (6) which is m-th when counted from a start point of a path A, and another one of the T-branch units (6) which is (m+1)-th when counted from the start point of the path A, to that of a transmission line (8) between one of N T-branch units (10) which is m-th when counted from an end point of a path B, and another one of the T-branch units (10) which is (m+1)-th when counted from the end point of the path B. Therefore, the in-phase corporate-feed circuit can be formed in a space smaller than that in which its circuit configuration of tournament type is formed, and downsizing of the circuit size can be achieved.

Abstract: A high-frequency electronic device including a dielectric substrate, a first patterned metal layer and a second patterned metal layer is provided. The dielectric substrate has a first region and a second region. The first patterned metal layer is disposed on a first side of the dielectric substrate and corresponds to the first region, wherein the first region and the second region have different etching rates with respect to an etching solution. The second patterned metal layer is disposed on the first side or a second side opposite to the first side of the dielectric substrate.

Abstract: A radio frequency, RF, waveguide array. The array comprises a substrate and an electrical RF transmission line array. The substrate comprises a plurality of waveguides, each waveguide being elongate in a first direction. The electrical RF transmission line array is located on a face of the substrate and comprises a plurality of signal electrodes and at least two ground electrodes. Portions of the ground electrodes which are relatively distal from the signal electrodes have reduced height in the direction transverse to the substrate to reduce the amount of material required to produce them.

Abstract: Embodiments are generally directed to a mutual inductance suppressor for crosstalk immunity enhancement. An embodiment of a printed circuit board includes a first signal trace and a second signal trace on a first layer, wherein the first signal trace and second signal trace are non-intersecting; a second layer below the first layer, the second layer including a voltage reference plane; and a mutual inductance suppressor in the voltage reference plane, the mutual inductance suppressor including a serpentine portion of the voltage reference plane between the first signal trace and the second signal trace.

Abstract: A circuit layout structure is provided. In the circuit layout structure, a transmission line group is disposed on a substrate. In its first differential signal transmission line pair, a first negative polarity transmission line is parallel to a first positive polarity transmission line and is configured to transmit a first negative polarity transmission signal of a first differential signal. In a second differential signal transmission line pair, a second positive polarity transmission line is parallel to a single-ended signal transmission line and is configured to transmit a second positive polarity transmission signal of a second differential signal. The second negative polarity transmission line is parallel to the second positive polarity transmission line. The single-ended signal transmission line is disposed between the first differential signal transmission line pair and the second differential signal transmission line pair.

Abstract: In accordance with some embodiments, non-reciprocal circulators are provided, the circulators comprising: a 3?X/4-long ring section having a first end and a second end, wherein ? is an operating wavelength of the non-reciprocal circulator; and a N-path filter having a first port, a second port, and N-paths, each of the N-paths being connected to the first port and the second port. In some of these embodiments, the 3?/4-long ring section includes a transmit port, an antenna port, and a receive port. In some of these embodiments, the transmit port is ?/4 away from the antenna port. In some of these embodiments, the antenna port is ?/4 away from the receive port. In some of these embodiments, the receive port is at the first port of the N-path filter.

Abstract: A semiconductor device includes a first transmission line and a second transmission line. The semiconductor device further includes a high-k dielectric material between the first transmission line and the second transmission line. The semiconductor device further includes a dielectric material directly contacting at least one of the first transmission line or the second transmission line, wherein the dielectric material has a different dielectric constant from the high-k dielectric material.

Abstract: In accordance with one or more embodiments, a communication system includes a launcher configured to generate first guided electromagnetic waves in response to a first communication signal conveying first data, wherein the first guided electromagnetic waves are guided by a structure within a cable and propagate within the cable without requiring an electrical return path; wherein the cable comprises a plurality of uninsulated conductors that are stranded together, wherein the plurality of uninsulated conductors form a plurality of interstitial areas that are bounded by conductive surfaces of at least three of the plurality of uninsulated conductors, and wherein the structure comprises one of the plurality of interstitial areas.

Abstract: A substrate, a touch screen and a touch display device to enhance the anti-interference and anti-static ability of the touch screen are disclosed. The substrate comprises a functional area and a peripheral area, wherein a first wiring and a second wiring insulating from each other are arranged in the peripheral area, the first wiring and second wiring are grounded respectively and are connected to a circuit board respectively to form a ground wire conduction loop; and the first wiring and the second wiring have a plurality of cross points. The touch screen comprises said substrate. The substrate provided in the present disclosure can be used in the touch display device.

Abstract: In accordance with one or more embodiments, a communication system, includes at least one launcher configured to generate first guided electromagnetic waves in response to a first communication signal conveying first data, wherein the first guided electromagnetic waves are guided by a structure within a cable and propagate within the cable via a plurality of guided wave modes without requiring an electrical return path; wherein the cable comprises a plurality of uninsulated conductors that are stranded together, wherein the plurality of uninsulated conductors form a plurality of interstitial areas that are bounded by conductive surfaces of at least three of the plurality of uninsulated conductors, and wherein the structure comprises one of the plurality of interstitial areas.

Abstract: Provided is a printed circuit board including a first semiconductor device and a second semiconductor device mounted on a printed wiring board, the printed wiring board including a first and a second differential signal wirings each formed of a pair of signal transmission lines. The pair of signal transmission lines forming the first differential signal wiring are wired to have a relative arrangement in which one signal transmission line and another signal transmission line cross with each other at least once in the first differential signal wiring in a wiring direction thereof. The pair of signal transmission lines forming the second differential signal wiring are wired to have a relative arrangement in which one signal transmission line and another signal transmission line cross with each other at least once in the second differential signal wiring in a wiring direction thereof.

Abstract: A signal transmission assembly includes a substrate, a first transmission line, and a second transmission line. The first transmission line and the second transmission line are disposed on the substrate and extending along a first direction. The first transmission line comprises at least one first transmission section and at least one second transmission section. The first transmission section is apart from the second transmission line by a first distance. The second transmission section is apart from the second transmission line by a second distance. The first distance is greater than or equal to the second distance. A first edge of the first transmission section and a second edge of the second transmission section are proximal to the second transmission line and parallel to the first direction, and the second transmission line does not contact an edge extension line extending from the second edge along the first direction.

Abstract: The disclosed embodiments relate to the design of a system that implements a coupling balance scheme for differential signals. The system includes a set of 2N signal lines carrying N differential signal pairs, wherein the set of 2N signal lines runs parallel to each other in a planar layout. The set of 2N signal lines is organized into a set of consecutive sequences, wherein each sequence includes a pattern of twists that switch signal positions for each differential pair to cancel coupling effects with respect to other signal lines. Moreover, the positions of differential signal pairs are exchanged between consecutive sequences, so that the set of consecutive sequences includes a sequence for each possible ordering of the N differential signal pairs.

Abstract: Aspects of the subject disclosure may include, for example, a transmission medium for propagating electromagnetic waves. The transmission medium can include a plurality of cores for selectively guiding an electromagnetic wave of a plurality of electromagnetic waves longitudinally along each core, and a shell surrounding at least a portion of each core for reducing exposure of the electromagnetic wave of each core. Other embodiments are disclosed.

Abstract: In accordance with one or more embodiments, a coupling system includes a plurality of dielectric couplers configured to generate, responsive to first electromagnetic waves received via a hollow waveguide, second electromagnetic waves along a surface of a transmission medium, wherein the plurality of dielectric couplers each have an end at differing azimuthal orientations relative to the transmission medium and wherein the second electromagnetic waves propagate along the surface of the transmission medium without requiring an electrical return path. A controller is configured to control a generation of the first electromagnetic waves in accordance with a first set of phases, wherein the second electromagnetic waves generated by the plurality of dielectric couplers combine on the surface of the transmission medium to propagate via a first selected wave mode.

Abstract: Apparatus and methods for rack level pre-installed interconnect for enabling cableless server, storage, and networking deployment. Plastic cable waveguides are configured to couple millimeter-wave radio frequency (RF) signals between two or more Extremely High Frequency (EHF) transceiver chips, thus supporting millimeter-wave wireless communication links enabling components in the separate chassis to communicate without requiring wire or optical cables between the chassis. Various configurations are disclosed, including multiple configurations for server chassis, storage chassis and arrays, and network/switch chassis. A plurality of plastic cable waveguide may be coupled to applicable support/mounting members, which in turn are mounted to a rack and/or top-of-rack switches. This enables the plastic cable waveguides to be pre-installed at the rack level, and further enables racks to be installed and replaced without requiring further cabling for the supported communication links.

Abstract: Aspects of the subject disclosure may include, for example, a waveguide system that includes a transmission device having a coupler positioned with respect to a transmission medium to facilitate transmission or reception of electromagnetic waves that transport communications data. The electromagnetic waves propagate along an outer surface of the transmission medium. A training controller detects an impairment on the transmission medium adverse to the transmission or reception of the electromagnetic waves and adjusts the electromagnetic waves to reduce the effects of the impairment on the transmission medium. Other embodiments are disclosed.

Abstract: Aspects of the subject disclosure may include, for example, a transmission medium for propagating electromagnetic waves. The transmission medium can include a core for propagating electromagnetic waves guided by the core without an electrical return path, a rigid material surrounding the core, wherein an inner surface of the rigid material is separated from an outer surface of the core, and a conductive layer disposed on the rigid material. Other embodiments are disclosed.

Abstract: The present disclosure relates to a PCB and a method in the PCB for reducing common-mode current. The PCB comprises two differential lines and each of the differential lines is on one or more planes of the PCB. The two differential lines carry a differential mode current and the common mode current. The differential mode current and the common mode current may be at least one of a forward current and a backward current. Further, a predefined configuration is formed using each of the two differential lines to generate impedance at the predefined configuration. Here, the predefined configuration is placed close to each other to generate a dielectric capacitance. The flow of the forward current and the backward current in adjacent tracks of each of the two differential lines in the predefined configuration are in opposite direction.

Abstract: A printed circuit board includes vias of first and second differential pairs, and vias of third and fourth differential pairs. The vias of the first and second differential pairs are arranged in a first via pattern based on a first crosstalk signature of a first connector to be coupled to the vias of the first and second differential pairs. The vias of the third and fourth differential pairs are arranged in a second via pattern based on a second crosstalk signature of a second connector to be coupled to the vias of the third and fourth differential pairs.

Abstract: Aspects of the subject disclosure may include, for example, a waveguide system that includes a transmission device having a coupler positioned with respect to a transmission medium to facilitate transmission or reception of electromagnetic waves that transport communications data. The electromagnetic waves propagate along an outer surface of the transmission medium. A training controller detects an impairment on the transmission medium adverse to the transmission or reception of the electromagnetic waves and adjusts the electromagnetic waves to reduce the effects of the impairment on the transmission medium. Other embodiments are disclosed.

Abstract: Systems, methods, and apparatus for reducing crossover coupling of two or more RF signals are described. In one case, a crossover structure is described where RF signals are routed through coplanar waveguides having a specific characteristic impedance and crossing at a central point of the crossover structure by way of a bridge. A ground shield having a geometry adapted to reduce the crossover coupling while minimally affecting capacitive coupling between the RF signals and the ground shield is introduced in-between a region comprising the central point. Further described is a multi-port rotary RF switch fitted with the crossover structure which allows substantially balanced electrical performance across all the operational states of the rotary RF switch at RF signal frequencies up to 40 GHz and beyond.