Plural Channel Systems Patents (Class 333/1)
  • Patent number: 10849220
    Abstract: A circuit board has an edge connector with signal traces. The signal traces are formed on a dielectric layer of the circuit board. A reference trace is formed within the dielectric layer or on another surface of the dielectric layer. Parameters of the reference trace are adjusted to set an impedance of a single-ended signal trace or a differential impedance of two adjacent signal traces.
    Type: Grant
    Filed: January 23, 2020
    Date of Patent: November 24, 2020
    Assignee: Super Micro Computer, Inc.
    Inventors: Manhtien V. Phan, Mau-Lin Chou, Chih-Hao Lee
  • Patent number: 10827612
    Abstract: A printed circuit board comprises a substrate and a routing structure arranged on the substrate, the substrate has a welding region and a routing region electrical connected with the welding region. The routing structure comprises a plurality of bonding pads connected with corresponding wires and a plurality of conductive traces electrically connected with the bonding pads, the bonding pads is arranged in the welding region, and the conductive traces are disposed in both the welding region and the routing region. The bonding pads are arranged abreast, and in the arrangement direction of the bonding pads, the bonding pads defines at least two grounding pads for connecting with grounding wires and at least a signal pad between the two grounding pads.
    Type: Grant
    Filed: May 9, 2019
    Date of Patent: November 3, 2020
    Assignee: ALLTOP ELECTRONICS (SUZHOU) LTD.
    Inventors: Mindi Ni, Yichang Chen
  • Patent number: 10757802
    Abstract: A differential transmission line and a wiring substrate are provided. The differential transmission line includes a ground layer, a dielectric layer, a first transmission line, and a second transmission line. The ground layer is formed of a metal conductor. The dielectric layer is disposed on the ground layer. The first transmission line and the second transmission line are disposed on the dielectric layer. A metal conductor removal block is distributed in at least a portion of at least one of a first projection area of the ground layer on which to project the first transmission line and a second projection area of the ground layer on which to project the second transmission line. A metal conductor is provided in a region between the first projection area and the second projection area of the ground layer.
    Type: Grant
    Filed: September 14, 2018
    Date of Patent: August 25, 2020
    Assignee: Wistron Corporation
    Inventor: Po-Lung Su
  • Patent number: 10749233
    Abstract: As a layout requirement imposed on an in-phase corporate-feed circuit, there is provided only a layout requirement to equalize the electric length of a transmission line (4) between one of N T-branch units (6) which is m-th when counted from a start point of a path A, and another one of the T-branch units (6) which is (m+1)-th when counted from the start point of the path A, to that of a transmission line (8) between one of N T-branch units (10) which is m-th when counted from an end point of a path B, and another one of the T-branch units (10) which is (m+1)-th when counted from the end point of the path B. Therefore, the in-phase corporate-feed circuit can be formed in a space smaller than that in which its circuit configuration of tournament type is formed, and downsizing of the circuit size can be achieved.
    Type: Grant
    Filed: February 2, 2016
    Date of Patent: August 18, 2020
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Hiroyuki Mizutani, Kenichi Tajima, Morishige Hieda
  • Patent number: 10709012
    Abstract: A high-frequency electronic device including a dielectric substrate, a first patterned metal layer and a second patterned metal layer is provided. The dielectric substrate has a first region and a second region. The first patterned metal layer is disposed on a first side of the dielectric substrate and corresponds to the first region, wherein the first region and the second region have different etching rates with respect to an etching solution. The second patterned metal layer is disposed on the first side or a second side opposite to the first side of the dielectric substrate.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: July 7, 2020
    Assignee: INNOLUX CORPORATION
    Inventors: Yan-Syun Wang, Chi-Che Tsai, Wei-Yen Wu, I-Yin Li
  • Patent number: 10678114
    Abstract: A radio frequency, RF, waveguide array. The array comprises a substrate and an electrical RF transmission line array. The substrate comprises a plurality of waveguides, each waveguide being elongate in a first direction. The electrical RF transmission line array is located on a face of the substrate and comprises a plurality of signal electrodes and at least two ground electrodes. Portions of the ground electrodes which are relatively distal from the signal electrodes have reduced height in the direction transverse to the substrate to reduce the amount of material required to produce them.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: June 9, 2020
    Assignee: Lumentum Technology UK Limited
    Inventors: Flavio Dell'Orto, Marco Villa
  • Patent number: 10652999
    Abstract: Embodiments are generally directed to a mutual inductance suppressor for crosstalk immunity enhancement. An embodiment of a printed circuit board includes a first signal trace and a second signal trace on a first layer, wherein the first signal trace and second signal trace are non-intersecting; a second layer below the first layer, the second layer including a voltage reference plane; and a mutual inductance suppressor in the voltage reference plane, the mutual inductance suppressor including a serpentine portion of the voltage reference plane between the first signal trace and the second signal trace.
    Type: Grant
    Filed: October 1, 2016
    Date of Patent: May 12, 2020
    Assignee: Intel Corporation
    Inventors: Khang Choong Yong, Jackson Chung Peng Kong, Bok Eng Cheah, Stephen H. Hall
  • Patent number: 10595395
    Abstract: A circuit layout structure is provided. In the circuit layout structure, a transmission line group is disposed on a substrate. In its first differential signal transmission line pair, a first negative polarity transmission line is parallel to a first positive polarity transmission line and is configured to transmit a first negative polarity transmission signal of a first differential signal. In a second differential signal transmission line pair, a second positive polarity transmission line is parallel to a single-ended signal transmission line and is configured to transmit a second positive polarity transmission signal of a second differential signal. The second negative polarity transmission line is parallel to the second positive polarity transmission line. The single-ended signal transmission line is disposed between the first differential signal transmission line pair and the second differential signal transmission line pair.
    Type: Grant
    Filed: February 6, 2018
    Date of Patent: March 17, 2020
    Assignee: Asustek Computer Inc.
    Inventors: Hank Lin, Bin-Chyi Tseng, Tsung-Chieh Yen
  • Patent number: 10581135
    Abstract: In accordance with some embodiments, non-reciprocal circulators are provided, the circulators comprising: a 3?X/4-long ring section having a first end and a second end, wherein ? is an operating wavelength of the non-reciprocal circulator; and a N-path filter having a first port, a second port, and N-paths, each of the N-paths being connected to the first port and the second port. In some of these embodiments, the 3?/4-long ring section includes a transmit port, an antenna port, and a receive port. In some of these embodiments, the transmit port is ?/4 away from the antenna port. In some of these embodiments, the antenna port is ?/4 away from the receive port. In some of these embodiments, the receive port is at the first port of the N-path filter.
    Type: Grant
    Filed: December 7, 2016
    Date of Patent: March 3, 2020
    Assignee: The Trustees of Columbia University in the City of New York
    Inventors: Negar Reiskarimian, Harish Krishnaswamy
  • Patent number: 10530030
    Abstract: A semiconductor device includes a first transmission line and a second transmission line. The semiconductor device further includes a high-k dielectric material between the first transmission line and the second transmission line. The semiconductor device further includes a dielectric material directly contacting at least one of the first transmission line or the second transmission line, wherein the dielectric material has a different dielectric constant from the high-k dielectric material.
    Type: Grant
    Filed: September 6, 2017
    Date of Patent: January 7, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jiun Yi Wu, Chien-Hsun Lee, Chewn-Pu Jou, Fu-Lung Hsueh
  • Patent number: 10505249
    Abstract: In accordance with one or more embodiments, a communication system includes a launcher configured to generate first guided electromagnetic waves in response to a first communication signal conveying first data, wherein the first guided electromagnetic waves are guided by a structure within a cable and propagate within the cable without requiring an electrical return path; wherein the cable comprises a plurality of uninsulated conductors that are stranded together, wherein the plurality of uninsulated conductors form a plurality of interstitial areas that are bounded by conductive surfaces of at least three of the plurality of uninsulated conductors, and wherein the structure comprises one of the plurality of interstitial areas.
    Type: Grant
    Filed: November 3, 2017
    Date of Patent: December 10, 2019
    Assignee: AT&T Intellectual Property I, L.P.
    Inventors: Paul Shala Henry, Giovanni Vannucci, Thomas M. Willis, III, Robert Bennett, Irwin Gerszberg, Farhad Barzegar, Donald J. Barnickel, Martin Birk, Shikik Johnson
  • Patent number: 10506693
    Abstract: A substrate, a touch screen and a touch display device to enhance the anti-interference and anti-static ability of the touch screen are disclosed. The substrate comprises a functional area and a peripheral area, wherein a first wiring and a second wiring insulating from each other are arranged in the peripheral area, the first wiring and second wiring are grounded respectively and are connected to a circuit board respectively to form a ground wire conduction loop; and the first wiring and the second wiring have a plurality of cross points. The touch screen comprises said substrate. The substrate provided in the present disclosure can be used in the touch display device.
    Type: Grant
    Filed: February 16, 2017
    Date of Patent: December 10, 2019
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Zhixiang Fang, Dayu Zhang
  • Patent number: 10505250
    Abstract: In accordance with one or more embodiments, a communication system, includes at least one launcher configured to generate first guided electromagnetic waves in response to a first communication signal conveying first data, wherein the first guided electromagnetic waves are guided by a structure within a cable and propagate within the cable via a plurality of guided wave modes without requiring an electrical return path; wherein the cable comprises a plurality of uninsulated conductors that are stranded together, wherein the plurality of uninsulated conductors form a plurality of interstitial areas that are bounded by conductive surfaces of at least three of the plurality of uninsulated conductors, and wherein the structure comprises one of the plurality of interstitial areas.
    Type: Grant
    Filed: November 3, 2017
    Date of Patent: December 10, 2019
    Assignee: AT&T Intellectual Property I, L.P.
    Inventors: Paul Shala Henry, Giovanni Vannucci, Thomas M. Willis, III, Robert Bennett, Irwin Gerszberg, Farhad Barzegar, Donald J. Barnickel, Martin Birk, Shikik Johnson
  • Patent number: 10470296
    Abstract: Provided is a printed circuit board including a first semiconductor device and a second semiconductor device mounted on a printed wiring board, the printed wiring board including a first and a second differential signal wirings each formed of a pair of signal transmission lines. The pair of signal transmission lines forming the first differential signal wiring are wired to have a relative arrangement in which one signal transmission line and another signal transmission line cross with each other at least once in the first differential signal wiring in a wiring direction thereof. The pair of signal transmission lines forming the second differential signal wiring are wired to have a relative arrangement in which one signal transmission line and another signal transmission line cross with each other at least once in the second differential signal wiring in a wiring direction thereof.
    Type: Grant
    Filed: October 22, 2015
    Date of Patent: November 5, 2019
    Assignee: CANON KABUSHIKI KAISHA
    Inventor: Jin Miyasaka
  • Patent number: 10461808
    Abstract: A signal transmission assembly includes a substrate, a first transmission line, and a second transmission line. The first transmission line and the second transmission line are disposed on the substrate and extending along a first direction. The first transmission line comprises at least one first transmission section and at least one second transmission section. The first transmission section is apart from the second transmission line by a first distance. The second transmission section is apart from the second transmission line by a second distance. The first distance is greater than or equal to the second distance. A first edge of the first transmission section and a second edge of the second transmission section are proximal to the second transmission line and parallel to the first direction, and the second transmission line does not contact an edge extension line extending from the second edge along the first direction.
    Type: Grant
    Filed: September 17, 2018
    Date of Patent: October 29, 2019
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Hank Lin, Bin-Chyi Tseng, Tsung-Chieh Yen
  • Patent number: 10426023
    Abstract: The disclosed embodiments relate to the design of a system that implements a coupling balance scheme for differential signals. The system includes a set of 2N signal lines carrying N differential signal pairs, wherein the set of 2N signal lines runs parallel to each other in a planar layout. The set of 2N signal lines is organized into a set of consecutive sequences, wherein each sequence includes a pattern of twists that switch signal positions for each differential pair to cancel coupling effects with respect to other signal lines. Moreover, the positions of differential signal pairs are exchanged between consecutive sequences, so that the set of consecutive sequences includes a sequence for each possible ordering of the N differential signal pairs.
    Type: Grant
    Filed: February 7, 2018
    Date of Patent: September 24, 2019
    Assignee: The Regents of the University of California
    Inventors: Jinbo Li, Qun Gu
  • Patent number: 10381703
    Abstract: Aspects of the subject disclosure may include, for example, a transmission medium for propagating electromagnetic waves. The transmission medium can include a plurality of cores for selectively guiding an electromagnetic wave of a plurality of electromagnetic waves longitudinally along each core, and a shell surrounding at least a portion of each core for reducing exposure of the electromagnetic wave of each core. Other embodiments are disclosed.
    Type: Grant
    Filed: July 13, 2017
    Date of Patent: August 13, 2019
    Assignee: AT&T INTELLECTUAL PROPERTY I, L.P.
    Inventors: Paul Shala Henry, William Scott Taylor, Robert Bennett, Farhad Barzegar, Irwin Gerszberg, Donald J. Barnickel, Thomas M. Willis, III
  • Patent number: 10374726
    Abstract: Apparatus and methods for rack level pre-installed interconnect for enabling cableless server, storage, and networking deployment. Plastic cable waveguides are configured to couple millimeter-wave radio frequency (RF) signals between two or more Extremely High Frequency (EHF) transceiver chips, thus supporting millimeter-wave wireless communication links enabling components in the separate chassis to communicate without requiring wire or optical cables between the chassis. Various configurations are disclosed, including multiple configurations for server chassis, storage chassis and arrays, and network/switch chassis. A plurality of plastic cable waveguide may be coupled to applicable support/mounting members, which in turn are mounted to a rack and/or top-of-rack switches. This enables the plastic cable waveguides to be pre-installed at the rack level, and further enables racks to be installed and replaced without requiring further cabling for the supported communication links.
    Type: Grant
    Filed: January 18, 2018
    Date of Patent: August 6, 2019
    Assignee: Intel Corporation
    Inventors: Matthew J. Adiletta, Aaron Gorius, Myles Wilde, Hugh Wilkinson, Amit Y. Kumar
  • Patent number: 10374278
    Abstract: In accordance with one or more embodiments, a coupling system includes a plurality of dielectric couplers configured to generate, responsive to first electromagnetic waves received via a hollow waveguide, second electromagnetic waves along a surface of a transmission medium, wherein the plurality of dielectric couplers each have an end at differing azimuthal orientations relative to the transmission medium and wherein the second electromagnetic waves propagate along the surface of the transmission medium without requiring an electrical return path. A controller is configured to control a generation of the first electromagnetic waves in accordance with a first set of phases, wherein the second electromagnetic waves generated by the plurality of dielectric couplers combine on the surface of the transmission medium to propagate via a first selected wave mode.
    Type: Grant
    Filed: September 5, 2017
    Date of Patent: August 6, 2019
    Assignee: AT&T Intellectual Property I, L.P.
    Inventors: Paul Shala Henry, Giovanni Vannucci, Thomas M. Willis, III
  • Patent number: 10355790
    Abstract: Aspects of the subject disclosure may include, for example, a waveguide system that includes a transmission device having a coupler positioned with respect to a transmission medium to facilitate transmission or reception of electromagnetic waves that transport communications data. The electromagnetic waves propagate along an outer surface of the transmission medium. A training controller detects an impairment on the transmission medium adverse to the transmission or reception of the electromagnetic waves and adjusts the electromagnetic waves to reduce the effects of the impairment on the transmission medium. Other embodiments are disclosed.
    Type: Grant
    Filed: January 2, 2019
    Date of Patent: July 16, 2019
    Assignee: AT&T Intellectual Property I, L.P.
    Inventors: Farhad Barzegar, Irwin Gerszberg, Robert Bennett, Paul Shala Henry
  • Patent number: 10320046
    Abstract: Aspects of the subject disclosure may include, for example, a transmission medium for propagating electromagnetic waves. The transmission medium can include a core for propagating electromagnetic waves guided by the core without an electrical return path, a rigid material surrounding the core, wherein an inner surface of the rigid material is separated from an outer surface of the core, and a conductive layer disposed on the rigid material. Other embodiments are disclosed.
    Type: Grant
    Filed: August 1, 2017
    Date of Patent: June 11, 2019
    Assignee: AT&T Intellectual Property I, L.P.
    Inventors: Robert Bennett, Paul Shala Henry, Farhad Barzegar, Irwin Gerszberg, Donald J. Barnickel, Thomas M. Willis, III
  • Patent number: 10271422
    Abstract: The present disclosure relates to a PCB and a method in the PCB for reducing common-mode current. The PCB comprises two differential lines and each of the differential lines is on one or more planes of the PCB. The two differential lines carry a differential mode current and the common mode current. The differential mode current and the common mode current may be at least one of a forward current and a backward current. Further, a predefined configuration is formed using each of the two differential lines to generate impedance at the predefined configuration. Here, the predefined configuration is placed close to each other to generate a dielectric capacitance. The flow of the forward current and the backward current in adjacent tracks of each of the two differential lines in the predefined configuration are in opposite direction.
    Type: Grant
    Filed: May 24, 2017
    Date of Patent: April 23, 2019
    Assignee: Hitachi, Ltd.
    Inventors: Rohan Barot, K. Ramachandra Sekhar
  • Patent number: 10201084
    Abstract: A printed circuit board includes vias of first and second differential pairs, and vias of third and fourth differential pairs. The vias of the first and second differential pairs are arranged in a first via pattern based on a first crosstalk signature of a first connector to be coupled to the vias of the first and second differential pairs. The vias of the third and fourth differential pairs are arranged in a second via pattern based on a second crosstalk signature of a second connector to be coupled to the vias of the third and fourth differential pairs.
    Type: Grant
    Filed: August 30, 2016
    Date of Patent: February 5, 2019
    Assignee: Dell Products, LP
    Inventors: V. Mallikarjun Goud, Bhyrav M. Mutnury
  • Patent number: 10177861
    Abstract: Aspects of the subject disclosure may include, for example, a waveguide system that includes a transmission device having a coupler positioned with respect to a transmission medium to facilitate transmission or reception of electromagnetic waves that transport communications data. The electromagnetic waves propagate along an outer surface of the transmission medium. A training controller detects an impairment on the transmission medium adverse to the transmission or reception of the electromagnetic waves and adjusts the electromagnetic waves to reduce the effects of the impairment on the transmission medium. Other embodiments are disclosed.
    Type: Grant
    Filed: August 6, 2018
    Date of Patent: January 8, 2019
    Assignee: AT&T Intellectual Property I, L.P.
    Inventors: Farhad Barzegar, Irwin Gerszberg, Robert Bennett, Paul Shala Henry
  • Patent number: 10172231
    Abstract: Systems, methods, and apparatus for reducing crossover coupling of two or more RF signals are described. In one case, a crossover structure is described where RF signals are routed through coplanar waveguides having a specific characteristic impedance and crossing at a central point of the crossover structure by way of a bridge. A ground shield having a geometry adapted to reduce the crossover coupling while minimally affecting capacitive coupling between the RF signals and the ground shield is introduced in-between a region comprising the central point. Further described is a multi-port rotary RF switch fitted with the crossover structure which allows substantially balanced electrical performance across all the operational states of the rotary RF switch at RF signal frequencies up to 40 GHz and beyond.
    Type: Grant
    Filed: June 8, 2016
    Date of Patent: January 1, 2019
    Assignee: pSemi Corporation
    Inventors: Gregory Louis Horvath, Peter Bacon
  • Patent number: 10164310
    Abstract: A first signal line is closer to a second ground conductor than a second signal line and, hence, crosstalk between the first and second signal lines is unlikely to be generated. By providing first opening portions in the second ground conductor, capacitive coupling between the first and second signal lines is reduced. Hence, in a transmission line including the first signal line, an increase in the capacitance due to the increased width of the first signal line is cancelled out by a decrease in the capacitance due to the increased distance from the first ground conductor and the first opening portions. Further, the width of the high-frequency transmission line need not be large. Further, since the capacitance is reduced by the first and second opening portions, the distances between the first ground conductor and the first and second signal lines are shortened.
    Type: Grant
    Filed: June 26, 2015
    Date of Patent: December 25, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Nobuo Ikemoto, Takahiro Baba, Fumie Matsuda, Wataru Tamura
  • Patent number: 10149377
    Abstract: A stacked, multi-layer transmission line is provided. The stacked transmission line includes at least a pair of conductive traces, each conductive trace having a plurality of conductive stubs electrically coupled thereto. The stubs are disposed in one or more separate spatial layers from the conductive traces.
    Type: Grant
    Filed: June 24, 2016
    Date of Patent: December 4, 2018
    Assignee: Invensas Corporation
    Inventors: Shaowu Huang, Javier A. Delacruz, Belgacem Haba
  • Patent number: 10147992
    Abstract: A via-less crossover for use in broadband microwave/mm-wave circuitry, including: a dielectric substrate; a top layer disposed on one side of the substrate and including a microstrip line with an input and an output, two tapered sections placed around the microstrip line along a co-planar waveguide (CPW) central line, one microstrip portion having an input and which connects to one top layer, rectangular stub disposed adjacent to one of the tapered sections, and another microstrip portion having an output and which connects to another top layer, rectangular stub disposed adjacent to the other of the tapered sections; and a ground layer disposed on an opposite side of the substrate and including a bottom layer CPW central line situated in a central cutout and which connects between a bottom layer, rectangular stub on one side and a bottom layer, rectangular stub on the other side situated in ground cutouts, respectively.
    Type: Grant
    Filed: June 28, 2016
    Date of Patent: December 4, 2018
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: Kongpop U-Yen, Edward J. Wollack, Marc Castro
  • Patent number: 10122122
    Abstract: A connector includes a wafer having first, second, third, and fourth communication channels. The first and second communication channels form a first differential pair, and the third and fourth communication channels form a second differential pair. The wafer includes a plug and a receptacle. The plug includes a first portion of the first, second, third, and fourth communication channels. The receptacle includes a second portion of the first, second, third, and fourth communication channels. A first crisscross is located at a first predetermined location of the first and second communication channels of the first differential pair. The first crisscross changes a first polarity of a first signal to be transmitted on the first differential pair. A second polarity of a second signal to be transmitted on the second differential pair remains the same throughout an entire length of the second differential pair.
    Type: Grant
    Filed: August 30, 2016
    Date of Patent: November 6, 2018
    Assignee: DELL PRODUCTS, LP
    Inventors: Raymond DeWine Heistand, II, Sandor Farkas, Bhyrav M. Mutnury
  • Patent number: 10114067
    Abstract: A structure for signal transmission is disclosed. The structure comprises a first plurality of waveguides tightly disposed together and disposed substantially in parallel with each other, each of said waveguides having a first opening and a second opening, wherein each first opening is operable to align with a patch antenna, and wherein the first plurality of waveguides is disposed adjacent to a socket. The integrated structure further comprises the socket which comprises an opening operable to support an insertion of a device under test (DUT), wherein the DUT is communicatively coupled to a plurality of microstrip transmission lines on a printed circuit board (PCB) underlying the socket for transmitting test signals from the DUT, wherein each of the microstrip transmission lines is electrically coupled to a respective patch antenna. Further, the first plurality of waveguides and the socket are integrated into a single plastic or metal structure.
    Type: Grant
    Filed: February 4, 2016
    Date of Patent: October 30, 2018
    Assignee: ADVANTEST CORPORATION
    Inventors: Daniel Lam, Don Lee, Roger McAleenan, Kosuke Miyao
  • Patent number: 10117325
    Abstract: A circuit structure and a mobile terminal having a circuit structure are disclosed. The circuit structure may include two transmission lines that extend in a first direction to transmit a signal, and a guard pattern provided between the two transmission lines. The guard pattern may include a plurality of slots each having an open end and a closed end in a second direction. The guard pattern arranged between the transmission lines may lower cross talk by adjusting mutual capacitance so as to improve signal quality.
    Type: Grant
    Filed: June 10, 2016
    Date of Patent: October 30, 2018
    Assignee: LG ELECTRONICS INC.
    Inventors: Inmu Kim, Youngmin Cho, Kipyoung Kim
  • Patent number: 10103446
    Abstract: Embodiments of the present invention relate to graphene-based Rotman lenses. In an embodiment, a lens is formed on a surface of a dielectric plate. The lens comprises a composition having individual sheets of graphene. The lens includes a plurality of first transmission lines extending from a first lens contour and a plurality of second transmission lines extending from a second lens contour. The plurality of first transmission lines each terminate at a first port. The plurality of second transmission lines each terminate at a second port. The first contour and the second contour are positioned opposite each other. The first port and/or the second port has a width of ?/2 or less. The individual graphene sheets form a three-dimensional interconnected network within the composition.
    Type: Grant
    Filed: March 7, 2016
    Date of Patent: October 16, 2018
    Inventors: John S Lettow, Sriram Manivanna, Larry Hurzon, Trentice V Bolar
  • Patent number: 10090574
    Abstract: The present invention provides a microstrip isolation structure for reducing crosstalk, comprising a microstrip line and two grounded resistors. The microstrip line comprises a plurality of indentation structures arranged periodically. The two grounded resistors are connected to two ends of the microstrip line, respectively. The plurality of indentation structures are periodically arranged in a subwavelength configuration that a period length of the plurality of indentation structures is far smaller than a wavelength of a transmission signal generated by a crosstalk around the microstrip line, whereby impingement of electromagnetic wave is confined by the plurality of indentation structures.
    Type: Grant
    Filed: January 8, 2016
    Date of Patent: October 2, 2018
    Inventor: Chia-Ho Wu
  • Patent number: 10056669
    Abstract: A transmission line includes a dielectric base body including stacked dielectric layers. A first signal conductor, a second signal conductor, and a ground conductor are included inside the dielectric base body. The first signal conductor includes a first end portion signal conductor and a second end portion signal conductor, which are two end portions in a transmitting direction, and a signal conductor that defines and functions as a main conductor portion. A signal conductor of the second signal conductor and the main conductor portion are provided on different dielectric layers. The signal conductor of the second signal conductor and the signal conductor of the first signal conductor are formed on the same dielectric layer. The ground conductor has an increased width and is located between the signal conductor of the second signal conductor and the main conductor portion in a stacking direction.
    Type: Grant
    Filed: December 6, 2016
    Date of Patent: August 21, 2018
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takahiro Baba, Yuki Wakabayashi
  • Patent number: 10050326
    Abstract: A transmission line includes, in a dielectric body, a first ground conductor, and first and second signal conductors arranged in a width direction of the dielectric body. The first ground conductor includes a first signal conductor ground portion disposed closer to a first side of the dielectric body in a thickness direction than the first signal conductor, a second signal conductor ground portion disposed closer to a second side of the dielectric body in the thickness direction than the second signal conductor, and an intermediate portion that connects the first signal conductor ground portion to the second signal conductor ground portion. The intermediate portion is disposed between a first transmission line including the first signal conductor and the first signal conductor ground portion and a second transmission line including the second signal conductor and the second signal conductor ground portion.
    Type: Grant
    Filed: December 1, 2016
    Date of Patent: August 14, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Takahiro Baba, Kuniaki Yosui, Nobuo Ikemoto, Fumie Matsuda
  • Patent number: 10044085
    Abstract: Stretchable high frequency transmission lines and high-frequency filters comprising the transmission lines are provided. The transmission lines provide low power loss, even at microwave and millimeter wave frequencies. The transmission lines are thin and flexible and can be stretched without a significant degradation of their scattering parameters. As a result, the transmission lines have applications as interconnects in stretchable and flexible integrated circuits (IC) and circuit device components, such as flexible transistors and flexible diodes.
    Type: Grant
    Filed: April 14, 2016
    Date of Patent: August 7, 2018
    Assignee: Wisconsin Alumni Research Foundation
    Inventors: Zhenqiang Ma, Yei Hwan Jung, Juhwan Lee, Shaoqin Gong
  • Patent number: 10033351
    Abstract: A non-linear impedance terminates a transmission line. The non-linear impedance may be implemented with a back-to-back connected inverter pair. The pair acts as a non-linear resistor. A process, voltage, temperature (PVT) tracking circuit may also be provided to improve PVT tracking, with resistance of transistors locked to a calibrated resistor. The replica circuit does not appear in the signal path, and does not add capacitive load.
    Type: Grant
    Filed: March 4, 2015
    Date of Patent: July 24, 2018
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Guansheng Li, Jun Cao
  • Patent number: 9960471
    Abstract: In a transmission line, first and second signal conductors are located inside a dielectric base body. The first and second signal conductors are located between first and second ground conductors in a thickness direction of the dielectric base body. A main conductor portion of the second ground conductor is located between the first and second signal conductors in a width direction of the dielectric base body. First and second auxiliary conductor portions of the second ground conductor respectively extend from the main conductor portion to first-signal-conductor-side and second-signal-conductor-side lateral surfaces of the dielectric base body. A first lateral-surface conductor connects the first auxiliary conductor portion to a plating-connection conductor connected to the first ground conductor. A second lateral-surface conductor connects the second auxiliary conductor portion to a plating-connection conductor connected to the first ground conductor.
    Type: Grant
    Filed: November 28, 2016
    Date of Patent: May 1, 2018
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takahiro Baba, Satoshi Sasaki, Kuniaki Yosui
  • Patent number: 9912029
    Abstract: A waveguide assembly for propagating electromagnetic signals includes first and second dielectric waveguides and a shield. Each of the first and second dielectric waveguides includes a cladding formed of a first dielectric material. The cladding defines a core region therethrough that is filled with a second dielectric material different than the first dielectric material. The shield is disposed between the first dielectric waveguide and the second dielectric waveguide. The shield is electrically conductive. The shield does not surround an entire perimeter of either of the first dielectric waveguide or the second dielectric waveguide.
    Type: Grant
    Filed: January 21, 2016
    Date of Patent: March 6, 2018
    Assignees: TE CONNECTIVITY CORPORATION, TYCO ELECTRONICS (SHANGHAI) CO., LTD.
    Inventors: Chad William Morgan, Liang Huang
  • Patent number: 9907160
    Abstract: A design for printed circuit board with reduced susceptibility to common-mode noise includes a first substrate, a differential pair of signal lines with two differential transmission lines laid on the first substrate, a second substrate, a metal layer located between the first substrate and the second substrate, and a grounding layer The second substrate is located between the second substrate and the grounding layer, and a conductive structure is located in the second substrate and couples the metal layer to the grounding layer. A length of the metal layer is substantially equal to a length of each of the two differential transmission lines.
    Type: Grant
    Filed: May 17, 2016
    Date of Patent: February 27, 2018
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: Chih-Hao Lin
  • Patent number: 9888600
    Abstract: Substrate-free mechanical structural systems comprised of interconnected subsystems of electronic and/or electromechanical components are provided.
    Type: Grant
    Filed: March 14, 2016
    Date of Patent: February 6, 2018
    Assignee: NUVOTRONICS, INC
    Inventors: Ian Hovey, J. Robert Reid, David Sherrer, Will Stacy, Ken Vanhille
  • Patent number: 9887453
    Abstract: A ballistic radome is provided and includes a flattened radome portion disposable in a primary field of view (FOV) of an antenna and a curved radome portion configured to define an extended FOV of the antenna about the primary FOV.
    Type: Grant
    Filed: March 7, 2014
    Date of Patent: February 6, 2018
    Assignee: RAYTHEON COMPANY
    Inventors: James A. Pruett, Kuang-Yuh Wu
  • Patent number: 9864829
    Abstract: According to one embodiment, there is provided a multilayer substrate including a ground layer and a signal layer. The ground layer includes a mesh ground having multiple openings. The signal layer is laid above the ground layer and including multiple signal lines. The multiple openings include first openings and second openings. The first openings overlap a first signal line from among the multiple signal lines when seen through in a direction perpendicular to a surface of the multilayer substrate. The second openings overlap the first signal line when seen through in the direction perpendicular to the surface of the multilayer substrate. The first openings have a first form, and the second openings have a second form different from the first form.
    Type: Grant
    Filed: September 8, 2015
    Date of Patent: January 9, 2018
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Satoru Fukuchi, Yoshihiro Iida
  • Patent number: 9864155
    Abstract: An optical component includes: a first substrate, a second substrate, and a transfer board. A first electrically conductive path is disposed on a top surface of the first substrate. A second electrically conductive path is disposed on a bottom surface of the first substrate. A third electrically conductive path is disposed on a top surface of the second substrate. A microstrip line structure is disposed on the transfer board. The microstrip line structure includes a transfer line disposed on a top surface of the transfer board. The top surface of the second substrate is opposite to the bottom surface of the first substrate, where the second electrically conductive path fits the third electrically conductive path. The transfer board is disposed on the top of the top surface of the second substrate. One end of the transfer line is electrically connected to the first electrically conductive path by a wire bonding.
    Type: Grant
    Filed: September 9, 2015
    Date of Patent: January 9, 2018
    Assignees: Hisense Broadband Multimedia Technologies Co,. Ltd., Hisense USA Corp., Hisense International Co., Ltd.
    Inventors: Hao Wang, Hongwei Mu, YongLiang Huang, Shun Zhang
  • Patent number: 9847564
    Abstract: The present disclosure relates to a slow-wave transmission line for transmitting slow-wave signals with reduced loss. In this regard, the slow-wave transmission line is formed in a multi-layer substrate and includes an undulating signal path. The undulating signal path includes at least two loop structures, wherein each loop structure includes at least two via structures connected by at least one intra-loop trace. The undulating signal path further includes at least one inter-loop trace connecting the at least two loop structures. Additionally, the slow-wave transmission line includes a first ground structure disposed along the undulating signal path. In this manner, a loop inductance is formed by each of the at least two loop structures, while a first distributed capacitance is formed between the undulating signal path and the ground structure.
    Type: Grant
    Filed: October 23, 2015
    Date of Patent: December 19, 2017
    Assignee: Qorvo US, Inc.
    Inventors: Dirk Robert Walter Leipold, George Maxim, Marcus Granger-Jones, Baker Scott
  • Patent number: 9843301
    Abstract: A transformer balun fabricated in silicon and including a series of alternating metal layers and dielectric layers that define first and second outer conductors that are part of a coaxial structure. Each dielectric layer includes a plurality of conductive vias extending through the dielectric layer to provide electrical contact between opposing metal layers, where a top metal layer forms a top wall of each outer conductor and a bottom metal layer forms a bottom wall of each outer conductor and the other metal layers and the dielectric layers define sidewalls of the outer conductors. Inner conductors extends down both of the first and second outer conductors and a first output line is electrically coupled to a sidewall of the first outer conductor and a second output line is electrically coupled to a sidewall of the second outer conductor.
    Type: Grant
    Filed: July 14, 2016
    Date of Patent: December 12, 2017
    Assignee: Northrop Grumman Systems Corporation
    Inventors: Paul L. Rodgers, Dah-Weih Duan
  • Patent number: 9837696
    Abstract: A transmission line structure for transmitting radio signals includes a first transmission line, a first ground region, and a second transmission line. The first transmission line is arranged on a first layer of a circuit board. The first transmission line includes a first signal line and a second signal line. The first ground region is arranged between the first and second signal lines. The first and second signal lines do not contact the first ground region. The second transmission line is arranged on a second layer of the circuit board, and the second layer is different from the first layer. The second transmission line does not contact the first transmission line, and the second transmission line interleaves with the first signal line, the second signal line and the first ground area.
    Type: Grant
    Filed: October 29, 2015
    Date of Patent: December 5, 2017
    Assignee: Wistron Neweb Corp.
    Inventor: Chih-Lin Chang
  • Patent number: 9806392
    Abstract: Apparatuses and methods associated with shield lines, and/or complementary decoupling capacitors and/or electromagnetic absorbing materials are disclosed herein. In embodiments, an apparatus may include a substrate having a ground plane; and a first and a second transmission line disposed on the substrate. Further, the apparatus may include a shield line constituted with electromagnetic absorbing material disposed between the first and second transmission lines and not coupled with the ground plane. In embodiments, the substrate may further include a power plane having a plurality of edges and a plurality of spacing; a plurality of decoupling capacitors disposed on the power or ground plane; and electromagnetic absorbing materials adhered to the plurality of edges and disposed in the plurality of spacing. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: May 19, 2015
    Date of Patent: October 31, 2017
    Assignee: Intel Corporation
    Inventors: Shaowu Huang, Hanqiao Zhang, Kai Xiao, Beom-Taek Lee, John J. Abbott, Gary Charles
  • Patent number: 9807870
    Abstract: A printed wiring board is provided which comprises a first insulating substrate (11) composed of a liquid crystal polymer, a first signal line (131) formed on one main surface (11a) of the first insulating substrate (11), a second insulating substrate (21) composed of a liquid crystal polymer, a second signal line (231) formed on one main surface (21a) of the second insulating substrate (21) and along the extending direction of the first signal line (131), and an adhesion layer (30) composed of a modified polyphenylene ether for adhesion between the one main surface (11a) of the first insulating substrate (11) and the one main surface (21a) of the second insulating substrate (21). When frequencies of signals transmitted by the first signal line and the second signal line are 2.5 GHz or more and 5.0 GHz or less, an offset amount is longer than a circuit width (L1) of the first signal line (131) and 130 ?m or more and 300 ?m or less.
    Type: Grant
    Filed: May 15, 2015
    Date of Patent: October 31, 2017
    Assignee: FUJIKURA LTD.
    Inventor: Naomi Komatsu
  • Patent number: 9801268
    Abstract: A circuit board comprising a circuit board ply, on which are provided a high-frequency component emitting electromagnetic interference waves during operation and at least one other component, especially another high-frequency component, wherein during operation an as low as possible degrading of the other component by interference waves is achieved. There is provided between the high-frequency component and the other component at least one dielectric barrier, which blocks propagation of high-frequency electromagnetic waves between the high-frequency component and the other component.
    Type: Grant
    Filed: June 7, 2013
    Date of Patent: October 24, 2017
    Assignee: Endress + Hauser GmbH + Co. KG
    Inventor: Thomas Blodt