Transmission Line Inductive Or Radiation Interference Reduction Systems Patents (Class 333/12)
  • Patent number: 11309615
    Abstract: A multiple-layer circuit board has a signaling layer plane, an exterior layer plane, and a ground layer plane. A pair of differential signal lines implemented as strip-lines are within the signaling layer, and propagate electromagnetic interference (EMI) along the signaling layer. A dual slot common mode noise filter may be etched within the ground layer and may include a first U-shaped etching pair comprising a first U-shaped etching and a second U-shaped etching opposing the first U-shaped etching within the ground layer plane.
    Type: Grant
    Filed: April 3, 2019
    Date of Patent: April 19, 2022
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: David Kopp, James Stewart, Karl Bois, Elene Chobanyan
  • Patent number: 11277903
    Abstract: Apparatuses and methods are provided for mitigating radio frequency interference and electromagnetic compatibility issues caused by the resonance of metal planes of a circuit board. A method for controlling impedance at an edge of a circuit board includes creating a cut at an edge of a plane of the circuit board. The cut extends from the edge of the plane to a point at a depth into the plane. The method can further include creating a cut pattern in the edge of the plane by repeating the cut along the edge of the plane such that an impedance of the plane at the depth is different, or lower, than an impedance of the plane at the edge of the plane. Other aspects are described.
    Type: Grant
    Filed: March 28, 2019
    Date of Patent: March 15, 2022
    Assignee: Intel Corporation
    Inventors: Stephen Harvey Hall, Khang Choong Yong, Ying Ern Ho, Yun Rou Lim, Wil Choon Song
  • Patent number: 11256057
    Abstract: A lens module includes a printed circuit board; a lens mounted on one side of the printed circuit board, and a shielding cover. The shielding cover comprises a cavity. A part of the printed circuit board and a part of the lens are received in the cavity of the shielding cover. The disclosure also relates to an electronic device using the lens module. The lens module can filter the magnetic interference of the external signal and facilitate heat generated by the lens module dissipate outside.
    Type: Grant
    Filed: November 12, 2019
    Date of Patent: February 22, 2022
    Assignee: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
    Inventor: Chun-Yan Yan
  • Patent number: 11244079
    Abstract: Provided is a method for masking a sensitive signal by injecting noise into planes of a printed circuit board (PCB). The method comprises detecting, by a secondary integrated circuit (IC), a noise signal on a shared plane of a PCB that includes the secondary IC. The noise signal may be analyzed to determine the characteristics of the noise signal. A masking signal may be generated based on the characteristics. The masking signal may then be injected onto the shared plane.
    Type: Grant
    Filed: September 18, 2019
    Date of Patent: February 8, 2022
    Assignee: International Business Machines Corporation
    Inventors: Matteo Cocchini, Silvio Dragone, Stefano Sergio Oggioni, James Busby, William Santiago-Fernandez
  • Patent number: 11239017
    Abstract: A common mode choke coil includes a differential transmission line including first and second signal lines, a main circuit including a first coil provided in the first signal line, and a second coil provided in the second signal line and connected to the first coil by magnetic field coupling, and a parallel resonance circuit including a third coil connected to both the first and second coils by magnetic field coupling, and a first capacitor electrically connected in parallel to the third coil. In the common mode choke coil, a first resonant frequency of the main circuit is equal or substantially equal to a second resonant frequency of the parallel resonance circuit.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: February 1, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Noriyuki Ueki, Noboru Kato
  • Patent number: 11183466
    Abstract: Disclosed are semiconductor packages and methods of fabricating the same. The method inluces forming a semiconductor chip, forming an electromagnetic shield that covers the semiconductor chip, and forming a molding that covers the electromagnetic shield. The electromagnetic shield is electrically connected to a conductor on a side of the semiconductor chip.
    Type: Grant
    Filed: December 11, 2019
    Date of Patent: November 23, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Youngwoo Park
  • Patent number: 11165619
    Abstract: A link adaptation method is disclosed of a network node adapted to operate in concurrent association with one or more orthogonal frequency division multiple access (OFDMA) wireless communication devices using OFDMA signaling, and a non-OFDMA wireless communication device using non-OFDMA signaling. The non-OFDMA signaling has a bandwidth that is smaller than a maximum bandwidth of the OFDMA signaling. The method comprises excluding one or more sub-carriers from the OFDMA signaling to create a frequency gap and determining a center frequency of the non-OFDMA signaling such that the center frequency is within the frequency gap. The method also comprises selecting a modulation and coding scheme to be used for the OFDMA signaling based on a first signal-to-interference value. In the first signal-to-interference value, the non-OFDMA signaling acts as interference to the OFDMA signaling. Corresponding computer program product, arrangement and network node are also disclosed.
    Type: Grant
    Filed: November 9, 2016
    Date of Patent: November 2, 2021
    Assignee: Telefonaktiebolaget LM Ericsson (publ)
    Inventor: Leif Wilhelmsson
  • Patent number: 11165128
    Abstract: A high-frequency device includes a magnetoresistance effect element which includes a first ferromagnetic layer, a second ferromagnetic layer, and a spacer layer positioned between the first and second ferromagnetic layers, a soft magnetic material body which covers at least a part of a periphery of the magnetoresistance effect element from outside in a plan view in a lamination direction of the magnetoresistance effect element, a non-magnetic material body which is positioned between the soft magnetic material body and the first ferromagnetic layer in the plan view in the lamination direction, and a high-frequency line which is connected to or spaced apart from the magnetoresistance effect element. The high-frequency line is configured to input or output a high-frequency current to or from the magnetoresistance effect element, or is configured to apply a high-frequency magnetic field caused by a high-frequency current flowing through the inside to the magnetoresistance effect element.
    Type: Grant
    Filed: July 16, 2020
    Date of Patent: November 2, 2021
    Assignee: TDK CORPORATION
    Inventors: Naomichi Degawa, Shinji Hara, Akimasa Kaizu
  • Patent number: 11152973
    Abstract: In a communication apparatus, an analog circuit executes an analog process to a differential signal in a condition that a potential of a first conductor is a reference. A communication circuit receives, via a connection circuit, a differential signal obtained by the execution of the analog process of the analog process is executed and generates, based on the received differential signal, a signal with a reference corresponding to a potential of a second conductor. An inductor (a connection element) is connected between the first conductor and the second conductor. The connection circuit includes a circuit element other than a capacitor.
    Type: Grant
    Filed: February 14, 2020
    Date of Patent: October 19, 2021
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Makoto Mashita, Takeshi Hagihara, Yuanjun Xian, Nobuyuki Kobayashi, Akihito Iwata, Takehiro Kawauchi, Tatsuya Izumi
  • Patent number: 11128093
    Abstract: An electrical connector includes an insulating housing, a plurality of terminals, an internal circuit board and a metal shield shell. The internal circuit board is provide to the insulating housing, and the internal circuit board is provided with a ground pad, an insertion gap is formed between the ground pad and the insulating housing. The metal shield shell is provided to the insulating housing, and the metal shield shell has a ground tongue, the ground tongue has a contact section, the contact section has a top surface and a bulge formed on an opposite side of the top surface, a distance between the top surface of the contact section of the ground tongue and a bottom surface of the bulge is larger than the insertion gap, the ground tongue inserts into the insertion gap and the contact section of the ground tongue is clamped between the insulating housing and the ground pad to make the bottom surface of the bulge contact the ground pad.
    Type: Grant
    Filed: March 24, 2020
    Date of Patent: September 21, 2021
    Assignee: Molex, LLC
    Inventor: Ya Feng
  • Patent number: 11108602
    Abstract: A system for suppressing radiofrequency noise includes a modem and an energy transfer device. The modem includes a coaxial radiofrequency port that is configured to connect to a first ground. The energy transfer device includes a first portion and a second portion. The first portion is configured to connect to the coaxial radiofrequency port and the first ground. The second portion is configured to connect to a second ground that is isolated from the first ground. The first and second portions are configured to transfer electrical energy therebetween via electromagnetic coupling.
    Type: Grant
    Filed: April 8, 2019
    Date of Patent: August 31, 2021
    Assignee: PPC BROADBAND, INC.
    Inventors: Erdogan Alkan, André Martineau
  • Patent number: 11095203
    Abstract: In a high-frequency line filter for a converter, the converter has three phase connections for receiving a three-phase alternating signal from a three-phase voltage network and is adapted to convert the received three-phase alternating signal into an output signal for a load. The high-frequency line filter includes: a first filter path for establishing a conductive connection between a first phase connection of the three phase connections and a ground connection; a second filter path for establishing a conductive connection between a second phase connection of the three phase connections and the ground connection; and a third filter path for establishing a conductive connection between a third phase connection of the three phase connections and the ground connection. The high-frequency line filter includes a series connection of a pulse-proof capacitor and a parallel connection of at least two Y capacitors, the series connection being provided in each filter path.
    Type: Grant
    Filed: May 14, 2020
    Date of Patent: August 17, 2021
    Assignee: DR. JOHANNES HEIDENHAIN GmbH
    Inventors: Simon Heinrich, Franz Gramsamer
  • Patent number: 11095210
    Abstract: An arrangement (100) of an electrical power tool for reducing a touch current is disclosed. The arrangement comprises a filter (101) configured to reduce electrical interference, a voltage booster (102) configured to rectify and increase an alternating current into a direct current, a motor comprising a motor drive (104) configured to power the electrical power tool, and a choke impedance (103) arranged between the voltage booster and the motor drive such that an input of the choke impedance is connected to the voltage booster and an output of the choke impedance is connected to the motor drive.
    Type: Grant
    Filed: October 23, 2017
    Date of Patent: August 17, 2021
    Assignee: HUSQVARNA AB
    Inventor: Magnus Rosén
  • Patent number: 11083521
    Abstract: A medical microwave delivery system comprises a microwave generator for providing microwave energy, wherein the microwave generator is electrically isolated from an electrical earth of the medical microwave delivery system, a coaxial cable configured to transfer microwave energy from the microwave generator, and a ferrite element configured to at least partially surround at least part of the coaxial cable.
    Type: Grant
    Filed: August 30, 2016
    Date of Patent: August 10, 2021
    Assignee: EMBLATION LIMITED
    Inventors: Eamon Mcerlean, Gary Beale
  • Patent number: 11083119
    Abstract: A charging apparatus (2) for a vehicle (1) has a power section (3) and a control signal interface (4) for connecting control signals (102) to the power section (3). A filter circuit (5), in particular an EMC filter circuit, is arranged between the power section (3) and the control signal interface (4). A vehicle (1) having such a charging apparatus (2) also is provided.
    Type: Grant
    Filed: November 21, 2019
    Date of Patent: August 3, 2021
    Inventor: Daniel Spesser
  • Patent number: 11063569
    Abstract: A noise suppression filter includes a resonator, a ground plane, and a set of differential transmission lines. The set of differential transmission lines includes a first meander line and a second meander line formed in a first circuit layer. The resonator is formed in a second circuit layer and includes a first long arm, a second long arm, and a short arm extended form a same point to form a T-shape. The ground plane is formed in a third circuit layer and is coupled to the first long arm and the second long arm through vias. The first meander line is detoured along the inner sides of the first long arm and the short arm, and the second meander line is detoured along the inner sides of the second long arm and the short arm.
    Type: Grant
    Filed: December 9, 2019
    Date of Patent: July 13, 2021
    Assignees: Inventec (Pudong) Technology Corp., Inventec Corporation
    Inventors: Yen-Hao Chen, Yo-Hao Cheng, Ding-Bing Lin
  • Patent number: 11004594
    Abstract: A surge voltage reduction member includes a tubular magnetic body having a through-hole and at least one coil wire. The coil wire is inserted through the through-hole and has a winding portion which is winded around a portion of the magnetic body. The coil wire is formed by connecting a bent coil element wire and a straight coil element wire. Where the coil wire has two or more bent coil element wires, the winding portion is formed by connecting the through-hole passing portion of one of adjacent bent coil element wires to the outside passing portion of the other of the adjacent bent coil element wires and connecting the outside passing portion of the one of the adjacent bent coil element wires to the straight coil element wire.
    Type: Grant
    Filed: July 6, 2018
    Date of Patent: May 11, 2021
    Assignee: YAZAKI CORPORATION
    Inventors: Yasuhiro Yamaguchi, Hayato Iizuka, Hiroaki Imai, Naoki Fujimoto, Hiroshi Aihara
  • Patent number: 10999924
    Abstract: An apparatus comprising includes a first pair of conductors to carry differential signals, at least one ground conductor neighboring the first pair of conductors, the ground conductor to be connected to a ground plane, and at least one particular conductor to carry sideband signals. The particular conductor is to be connected to a ground plane via a resonance mitigation circuit, and the resonance mitigation circuit comprises a resistor.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: May 4, 2021
    Assignee: Intel Corporation
    Inventors: Timothy D. Wig, Steven K. Krooswyk, Marc Wells
  • Patent number: 10985099
    Abstract: A package substrate of a semiconductor package includes second and third pad bonding portions respectively located at both sides of a first pad bonding portion on a substrate body. First to third via landing portions are spaced apart from the first to third pad bonding portions. First and second connection trace portions are disposed side by side. A first guard trace portion is substantially parallel with the first connection trace portion. The second connection trace portion is connected to the first guard trace portion through a first connection plane portion. The first connection plane portion connects the second connection trace portion to the second via landing portion. The third pad bonding portion is connected to the third via landing portion through a second connection plane portion. A semiconductor chip mounted on the package substrate includes first inner chip pads and first outer chip pads bonded to the package substrate.
    Type: Grant
    Filed: August 14, 2019
    Date of Patent: April 20, 2021
    Assignee: SK hynix Inc.
    Inventors: Jae Hoon Lee, Ju Il Eom
  • Patent number: 10938205
    Abstract: An electronic device according to the present invention includes a power supply unit and a load, the power supply unit including a ground terminal, a rectifier circuit, a circuit section connected to a DC output of the rectifier circuit, the circuit section supplying electric power to the load, a first varistor connected at one end thereof to one input end of the rectifier circuit, a second varistor connected at one end thereof to another input end of the rectifier circuit and connected at another end thereof to another end of the first varistor and an arrester connected at one end thereof to the another end of the second varistor and connected at another end thereof to the ground terminal, wherein an electrostatic capacity of each of the first and second varistors is 40% or more of a sum of earth capacitances of the power supply unit and the load.
    Type: Grant
    Filed: September 21, 2017
    Date of Patent: March 2, 2021
    Assignees: MITSUBISHI ELECTRIC CORPORATION, MITSUBISHI ELECTRIC LIGHTING CORPORATION
    Inventors: Teiji Ohtsu, Mamoru Kamikura, Akira Yamagami, Shinsuke Funayama
  • Patent number: 10933670
    Abstract: The liquid ejecting apparatus includes a liquid ejecting head ejecting liquid in a first-direction and a transport unit transporting a medium in either a second-direction or a third-direction, in which the liquid ejecting head includes a nozzle plate, a case head provided in a fourth-direction with respect to the nozzle plate and having a support surface on the fourth-direction-side thereof, a circuit substrate supported on the support surface, a holder provided in the fourth-direction with respect to the circuit substrate, and a first-screw fixing the case head and the holder, the case head includes a case main body having a first-side-surface on the second-direction-side thereof and a first-fixing-portion provided in the second-direction with respect to the first-side-surface and provided with a first-screw-hole, and the first-fixing-portion includes a first-opening-surface, and a first-inclined-surface provided between the first-side-surface and the first-opening-surface and inclined with respect to a surf
    Type: Grant
    Filed: November 25, 2019
    Date of Patent: March 2, 2021
    Assignee: Seiko Epson Corporation
    Inventor: Haruki Kobayashi
  • Patent number: 10925164
    Abstract: Methods and systems for producing circuitry using stackable passive components are discussed. More specifically, the present disclosure provides designs and fabrication methods for production of stackable devices that may be used as components in circuitry such as filters and impedance matching adaptors. Such components may be used to save space in printed circuit boards. Moreover, stackable passive components may be dual components, which may be improve the electrical performance in certain types of circuits such as matched component filters.
    Type: Grant
    Filed: September 12, 2017
    Date of Patent: February 16, 2021
    Assignee: Apple Inc.
    Inventors: Paul A. Martinez, Curtis C. Mead, Scott D. Morrison, Giancarlo F. De La Cruz, Lin Chen, Albert Wang, Brad W. Simeral
  • Patent number: 10904997
    Abstract: Provided is a printed circuit board realizing selective inhibition of electromagnetic noise and enabling high-density arrangement of differential transmission lines without increasing cost. The printed circuit board includes a pair of strip conductors (first layer), a first resonance conductor plate, a ground conductive layer (together with a second layer) including an opening portion, a second resonance conductor plate (third layer), a third resonance conductor plate (fourth layer), first via holes connecting the first and second resonance conductor plates, a second via hole connecting the second and third resonance conductor plates, and third via holes connecting the third resonance conductor plate and the ground conductive layer, wherein a polygon obtained by sequentially connecting centers of the adjacent third via holes overlaps so as to include the first resonance conductor plate, and center-to-center distance between the adjacent third via holes is 0.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: January 26, 2021
    Assignee: Lumentum Japan, Inc.
    Inventor: Osamu Kagaya
  • Patent number: 10894526
    Abstract: A key unit that locks and unlocks a target by transmitting a signal to a locking and unlocking device, includes: a substrate on which a power supply circuit and a reception circuit that receives a request signal transmitted in a first frequency band from the locking and unlocking device via a reception antenna are mounted; and a housing configured to accommodate the substrate. Among parts associated with the power supply circuit, a part having the highest height from a substrate surface is mounted on a first surface of the substrate. The reception antenna is mounted on a second surface. When the substrate is accommodated in the housing, a distance from a substrate surface of the second surface to an inner surface of the housing is shorter than a distance from the substrate surface of the first surface to the inner surface of the housing.
    Type: Grant
    Filed: September 7, 2018
    Date of Patent: January 19, 2021
    Assignees: Toyota Jidosha Kabushiki Kaisha, Nomura Research Institute, Ltd., Kabushiki Kaisha Tokai Rika Denki Seisakusho
    Inventors: Yasuyuki Tamane, Tsukasa Takahashi, Masaki Oshima
  • Patent number: 10886966
    Abstract: Disclosed herein are a method for eliminating passive intermodulation distortion (PIMD) and an antenna apparatus using the same. According to an embodiment, the antenna apparatus includes a main antenna used for transmission and reception of an RF signal; an auxiliary antenna used for reception of an RF signal; and a passive intermodulation distortion (PIMD) eliminator configured to calculate PIMD contained in a received signal of the main antenna using a received signal of the auxiliary antenna, and to eliminate the calculated PIMD from the received signal of the main antenna.
    Type: Grant
    Filed: May 17, 2019
    Date of Patent: January 5, 2021
    Assignee: KMW INC.
    Inventors: Young Chan Moon, Min Seon Yun, Sung-hwan So
  • Patent number: 10879604
    Abstract: A radio-frequency signal grounding device for an antenna comprises: a substrate layer; a grounding transmission line on a first side of the substrate layer; a metal layer on a second side of the substrate layer, the metal layer including at least one gap such that the metal layer is divided into at least a first sub-region and a second sub-region, where the gap is configured to block at least one of a low frequency signal and a direct current signal; a metal plate; and a dielectric layer that is disposed between the metal plate and the metal layer. The radio-frequency signal grounding device can achieve good radio-frequency signal grounding and low frequency/direct current signal blocking within a limited space via a multi-coupling design.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: December 29, 2020
    Assignee: CommScope Technologies LLC
    Inventors: Xun Zhang, Ligang Wu, Bo Wu, Xiaotuo Wang
  • Patent number: 10856405
    Abstract: A 3D electromagnetic bandgap circuit includes: a dielectric layer having a first surface and an opposing second surface; a spiral element positioned on the first surface; a first surrounding element positioned on the first surface and surrounding the spiral element, but does not touch with the spiral element; a plane element positioned on the second surface and including a notch; a second surrounding element positioned on the second surface and surrounding the plane element, but does not touch with the plane element, wherein the second surrounding element further includes a protruding portion extending toward the notch; a first via passing through the dielectric layer, the spiral element, and the protruding portion; a second via passing through the dielectric layer, the plane element, and the first surrounding element; and a third via passing through the dielectric layer, the plane element, and the first surrounding element.
    Type: Grant
    Filed: May 15, 2019
    Date of Patent: December 1, 2020
    Assignee: REALTEK SEMICONDUCTOR CORP.
    Inventors: Yu-Cong Wang, Ruey-Beei Wu, Shih-Hung Wang, Wen-Shan Wang
  • Patent number: 10847293
    Abstract: The disclosure provides a core, comprising a body formed from a winding of tape shaped material, and a package encasing the body. A single gap is formed in the body and the package. A clamp is connected to the package to flex a flexible section of the package to reduce the gap.
    Type: Grant
    Filed: October 22, 2015
    Date of Patent: November 24, 2020
    Assignee: Cummins Inc.
    Inventors: Nikhil Pandey, Philip E. Becker, Miguel Angel Gonzalez, Jr., Anirban De
  • Patent number: 10833723
    Abstract: The representative embodiments discussed in the present disclosure relate to techniques in which isolation between transmission signals and received signals in a transceiver may be maintained during downlink carrier aggregation. More specifically, in some embodiments, the transceiver may be implemented to include an electrical balance duplexer that isolates a signal component of a signal transmitted via the transceiver from a receiver signal path of the transceiver. The transceiver may also include analog interference cancellation circuitry implemented to isolate a noise component of the signal transmitted via the transceiver from the receiver signal path (e.g., from one or more downlink receiver channels). As such, the transceiver may operate using inter-band, non-contiguous downlink carrier aggregation, intra-band, non-contiguous downlink carrier aggregation, intra-band, contiguous carrier aggregation, and/or the like.
    Type: Grant
    Filed: March 18, 2019
    Date of Patent: November 10, 2020
    Assignee: Apple Inc.
    Inventors: Joonhoi Hur, Rastislav Vazny, Ronald William Dimpflmaier
  • Patent number: 10820410
    Abstract: A high speed circuit and a method for fabricating the same is disclosed. The high speed circuit has a printed circuit board. A pair of first and second differential traces are formed on a first surface of the printed circuit board. The differential traces carry an electrical signal. A partial loop extends through the printed circuit board. The partial loop includes first and second end slots under the first and second differential traces. The partial loop includes a pair of side slots substantially parallel to the differential traces. An anchor member connects the printed circuit board to an island formed by the first and second end slots and side slots. The anchor member forms a gap in one of the end slots or side slots. The length of the side slots and the length of the gap is selected to reduce a target common mode frequency from the electrical signal.
    Type: Grant
    Filed: March 4, 2019
    Date of Patent: October 27, 2020
    Assignee: QUANTA COMPUTER INC.
    Inventor: Cheng-Hsien Lee
  • Patent number: 10809284
    Abstract: Systems and methods are provided for improving the operation of a computer or other electronic device that utilizes root-mean-square (RMS) measurements, e.g., RMS current measurements, by reducing error in the RMS measurement. A series of measurement samples are received at a processor, which executes a noise-decorrelated RMS algorithm including: calculating a current-squared value for each measurement sample by multiplying the measurement sample by a prior measurement sample in the series (rather by simply squaring each measurement sample as in conventional techniques), summing the current-squared values, and calculating an RMS value based on the summed values. The processor may also execute a frequency-dependent magnitude correction filter to correct for frequency-dependent attenuation associated with the noise-decorrelated RMS algorithm.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: October 20, 2020
    Assignee: MICROCHIP TECHNOLOGY INCORPORATED
    Inventor: Daniel Arthur Staver
  • Patent number: 10811790
    Abstract: A noise filter includes a filter circuit including a noise reduction element that reduces a noise component, a conductive first circuit connection member to which a first connection portion of the noise reduction element is electrically connected, and a conductive second circuit connection member to which a second connection portion of the noise reduction element is electrically connected, and an electric connection structure that electrically connects an intermediate connection portion of a core wire of an electric wire to one of the first circuit connection member and the second circuit connection member. The electric connection structure includes a circuit side connection body provided in one of the first circuit connection member and the second circuit connection member and indirectly or directly electrically connected to the intermediate connection portion by an elastic force indirectly or directly exerted on the intermediate connection portion.
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: October 20, 2020
    Assignee: YAZAKI CORPORATION
    Inventors: Kunihiko Yamada, Masashi Tsukamoto, Ryoma Toyoda
  • Patent number: 10790569
    Abstract: Aspects of the subject disclosure may include, receiving, by a waveguide system, a communication signal that conveys data; transmitting, via a coupler of the waveguide system, electromagnetic waves, where the electromagnetic waves propagate along a transmission medium without requiring an electrical return path, and where the electromagnetic waves convey the data; and mitigating, by the waveguide system, interference to the electromagnetic waves associated with residual electromagnetic waves propagating along the transmission medium. Other embodiments are disclosed.
    Type: Grant
    Filed: December 12, 2018
    Date of Patent: September 29, 2020
    Assignee: AT&T Intellectual Property I, L.P.
    Inventors: Robert Bennett, Irwin Gerszberg, Thomas M. Willis, III, Paul Shala Henry, Farhad Barzegar, Donald J. Barnickel, Giovanni Vannucci
  • Patent number: 10788549
    Abstract: An antenna array includes a plurality of linear electromagnetic resonators having longitudinal axes oriented parallel to one another and not aligned, and at least one decoupling device arranged between two the linear electromagnetic resonators, wherein the decoupling device comprises a plurality of open-loop electromagnetic resonators that are matched to a frequency located in the bandwidth of the two the adjacent linear electromagnetic resonators, that are electrically insulated and that are arranged in a plurality of planes that are not parallel to a plane containing the longitudinal axes of the two the linear electromagnetic resonators. Nuclear magnetic resonance imaging apparatus comprising such an antenna array is also provided.
    Type: Grant
    Filed: January 5, 2017
    Date of Patent: September 29, 2020
    Assignees: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES, CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE, UNIVERSITE D'AIX-MARSEILLE
    Inventors: Elodie Georget, Michel Luong, Alexandre Vignaud, Eric Giacomini, Edouard Chazel, Redha Abdeddaim, Stefan Enoch, Gérard Tayeb
  • Patent number: 10784046
    Abstract: A film capacitor includes a capacitor element that includes an element body formed of a winding of or a laminate of metallized films and a P pole electrode and an N pole electrode that are respectively formed on opposite end faces of the element body. The film capacitor also includes a P electrode bus bar and an N electrode bus bar that are respectively connected to the P pole electrode and the N pole electrode, and an electrically conductive covering that covers a peripheral surface of the capacitor element with the covering spaced away from at least one of the P pole electrode or the N pole electrode.
    Type: Grant
    Filed: September 5, 2018
    Date of Patent: September 22, 2020
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hiroki Takeoka, Tsuyoshi Ichinose
  • Patent number: 10763561
    Abstract: There is provided a band-pass filter capable of easily changing a bandwidth of a pass band. A band-pass filter (1B) of the present disclosure includes: a housing (11), a plurality of resonant plates (12) stored in the housing (11), a first coupling conductor (15) connecting two adjacent resonant plates (12) of the plurality of resonant plates (12), and a second coupling conductor (16) arranged at a position affecting a coupling coefficient between the two adjacent resonant plates (12), wherein a distance from the resonant plate (12) to the second coupling conductor (16) is changeable.
    Type: Grant
    Filed: May 2, 2017
    Date of Patent: September 1, 2020
    Assignee: NEC CORPORATION
    Inventor: Takahiro Miyamoto
  • Patent number: 10748839
    Abstract: The present invention provides a leadframe component and a package structure. The leadframe component includes a first leadframe and a second leadframe. The first leadframe includes a first chip-mounting portion for carrying a first chip, a first coil portion, a plurality of first pins and a plurality of first floated pins. The second leadframe includes a second chip-mounting portion for carrying a second chip, a second coil portion, a plurality of second pins and a plurality of second floated pins. The first leadframe is disposed above or under the second leadframe for aligning the first coil portion with the second coil portion.
    Type: Grant
    Filed: November 20, 2019
    Date of Patent: August 18, 2020
    Assignee: LITE-ON SINGAPORE PTE. LTD.
    Inventor: You-Fa Wang
  • Patent number: 10727895
    Abstract: A transceiver circuit having a T-coil circuit, inductive termination, and an equalization circuit is disclosed. The transceiver includes a transmitter having an output coupled to a first node, and a receiver having an input coupled to the first node. A T-coil circuit is coupled between the first node and an input/output (I/O) node. The T-coil circuit includes first and second inductors coupled in series between the first node and the I/O node, the inductors being coupled at a second node. A termination circuit is coupled between the first node and a reference node, the termination circuit including a third inductor. The transceiver circuit also includes an equalization circuit configured to convey an equalization signal to the second node.
    Type: Grant
    Filed: September 27, 2019
    Date of Patent: July 28, 2020
    Assignee: Apple Inc.
    Inventors: Huy M. Nguyen, Cristian Gozzi, Huabo Chen, Xuchen Zhang, Yu Chang
  • Patent number: 10701846
    Abstract: An electromagnetic shield component that includes a tube that is electrically conductive and into which an electrical wire is to be inserted, wherein the tube includes a first half tube that has a shape of a half tube, a second half tube that has a shape of a half tube, and welds where both ends of the first half tube in a circumferential direction and both ends of the second half tube in the circumferential direction are welded to each other, an inner circumferential surface of the first half tube is provided with extensions that extend inward from the inner circumferential surface of the first half tube, in a radial direction of the tube, toward the second half tube, and portions of the extensions that face the welds in the radial direction are provided such that gaps are formed between the portions and the welds.
    Type: Grant
    Filed: June 11, 2018
    Date of Patent: June 30, 2020
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventor: Yuichi Kimoto
  • Patent number: 10699843
    Abstract: A motor vehicle with at least one energizable active current line, which at least sometimes carries an active current for the operation of at least one electrical consumer. At least one attenuation line layout is coupled by way of an inductive coupling to the energizable active current line in such a way that, in a protection area spaced apart from the active current line and the attenuation line layout, a magnetic field generated by the active current and/or a perturbation superimposed on the active current and/or a leakage current produced by the active current is attenuated by current flow induced in the attenuation line layout.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: June 30, 2020
    Assignee: AUDI AG
    Inventors: Thomas Rinkleff, Amir Cenanovic
  • Patent number: 10698041
    Abstract: In one embodiment, an apparatus includes a port for receiving a plug connected to one end of a cable with another plug connected to an opposite end of the cable for use in a Power over Ethernet system delivering power at a level exceeding 100 watts, an online removal button on a face of the port for use in indicating an intent to remove the plug from the port, and an online removal module for detecting activation of the online removal button and reducing power on the cable to at least 90 watts to prevent damage during removal of the cable.
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: June 30, 2020
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Joel Richard Goergen, Chad M. Jones
  • Patent number: 10698040
    Abstract: In one embodiment, an apparatus includes a cable for transmitting power at a level exceeding 100 watts and data from power sourcing equipment to a powered device, and plugs at each end of the cable, each of the plugs comprising at least one resistor. Power capacity of the cable is identified at a port receiving one of the plugs based on the resistors.
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: June 30, 2020
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Joel Richard Goergen, Chad M. Jones
  • Patent number: 10681301
    Abstract: A display device includes a signal processor, a display component, a substrate, and a conductive housing. The signal processor includes an oscillator that outputs oscillation signal, the signal processor processing signal whose frequency is higher than a specific threshold. The display component displays video. The substrate has a ground component, the signal processor being disposed on the substrate. The conductive housing is connected to a first site of the ground component and to a second site that is different from the first site. The first site and the second site are disposed at positions where a first area of the housing that is an odd-numbered multiple of ¼ wavelength of the oscillation signal away from the first site overlaps at least part of a second area of the housing that is a multiple of ¼ wavelength of the oscillation signal away from the second site.
    Type: Grant
    Filed: January 4, 2019
    Date of Patent: June 9, 2020
    Assignee: FUNAI ELECTRIC CO., LTD.
    Inventor: Shinichi Kodama
  • Patent number: 10680674
    Abstract: A cord for suppressing noise from a modem includes a hot wire, a neutral wire, and a signal balancing device. The hot wire is configured to connect to a hot power port of a modem. The neutral wire is configured to connect to a neutral power port of the modem. The signal balancing device is configured to connect to an outer conductor of a coaxial radiofrequency (RF) port of the modem and to the neutral wire or a ground wire. The signal balancing device is configured to balance RF signals transmitted through the coaxial RF port.
    Type: Grant
    Filed: March 12, 2019
    Date of Patent: June 9, 2020
    Assignee: PPC BROADBAND, INC.
    Inventor: Erdogan Alkan
  • Patent number: 10673182
    Abstract: A ground shield includes a plurality of contact members configured to contact the ground contacts of a column of contacts of an electrical connector, so as to electrically common the grounds to each other.
    Type: Grant
    Filed: December 7, 2016
    Date of Patent: June 2, 2020
    Assignee: FCI USA LLC
    Inventor: Jason John Ellison
  • Patent number: 10667386
    Abstract: A circuit board includes a first conductive layer, a second conductive layer, and a first insulating layer disposed between the first conductive layer and the second conductive layer, wherein the first conductive layer includes a signal line, the second conductive layer includes a ground line, and the ground line of the second conductive layer includes a pattern area patterned in a meander shape.
    Type: Grant
    Filed: February 4, 2019
    Date of Patent: May 26, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Han Kim, Seong Hee Choi, Dae Hyun Park
  • Patent number: 10653050
    Abstract: A vehicle electronic module is provided. The vehicle electronic module has a reduced size and improved productivity by replacing a sensor and an offset unit of an electromagnetic interference (EMI) filter module with a printed circuit board (PCB) winding structure. The electronic module includes a sensor that detects EMI noise of a power line and an offset unit that transmits an offset voltage for removing the EMI noise to the power line. A controller is configured to generate the offset voltage that corresponds to the EMI noise detected by the sensor. Then sensor and the offset unit are formed in a stacked structure of the PCB.
    Type: Grant
    Filed: December 4, 2017
    Date of Patent: May 12, 2020
    Assignees: Hyundai Motor Company, Kia Motors Corporation, Industry-Academic Cooperation Foundation Gyeongsang National University
    Inventors: SeungHyun Han, Jongpil Kim, Yongoh Choi, Wongyu Seol, Se-Kyo Chung
  • Patent number: 10602647
    Abstract: An electromagnetic shield component that includes a tube that is electrically conductive and has an internal space through which an electrical wire is to be inserted, wherein the tube includes: a first half-split tube that has a half-split tubular shape and has two first ends in a circumferential direction; a second half-split tube that has a half-split tubular shape and has two second ends in the circumferential direction that are provided so as to face the two first ends of the first half-split tube in the circumferential direction; and a plurality of connectors that contain a crystal refining agent, and are provided between, and are welded to, the two first ends of the first half-split tube in the circumferential direction and the two second ends of the second half-split tube in the circumferential direction.
    Type: Grant
    Filed: January 10, 2018
    Date of Patent: March 24, 2020
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Yuichi Kimoto, Yasushi Itani
  • Patent number: 10547437
    Abstract: The present invention relates to a synchronization signal transmitting device, method thereof and a power electronic apparatus with the device. The synchronization signal transmitting device comprises at least one serial differential signal transmitter for receiving an identical-period pulse signal and outputting a differential signal pair, at least one serial differential signal receiver for receiving the differential signal pair and outputting a single-ended signal, and at least one controller for receiving the single-ended signal. Moreover, the controller is configured for conducting a signal filtering process and/or a signal reconstruction process to the single-ended signal, so as to obtain a synchronization signal. Thus, the present invention shows the advantages of transmission and process purely by hardware without participation of software, without occupation to calculating ability of processors, high time accuracy, and low time delay.
    Type: Grant
    Filed: February 17, 2015
    Date of Patent: January 28, 2020
    Assignee: DELTA ELECTRONICS (SHANGHAI) CO., LTD.
    Inventors: Qielu Pan, Wei Guan, Hongyang Wu
  • Patent number: 10530072
    Abstract: A coaxial radio frequency (RF) isolator is disclosed. The isolator can include an input connector, an output connector, and a conductive body. The isolator can also include an outer shield surrounding a portion of the body. The isolator can further include a coupler within the outer shield and forming a cavity between an inner surface of the body and the coupling member. The coupler can be configured to electrically couple with the outer shield. Additionally, the isolator can include a coaxial circuit surrounding a portion of the coupler within the cavity. Further, the isolator can include a toroid surrounding a portion of the coupler and positioned within the cavity. Moreover, the isolator can include a signal conditioning circuit electrically configured to condition signals communicated between the input connector and the output connector.
    Type: Grant
    Filed: March 24, 2017
    Date of Patent: January 7, 2020
    Assignee: PPC BROADBAND, INC.
    Inventor: Erdogan Alkan