Transmission Line Inductive Or Radiation Interference Reduction Systems Patents (Class 333/12)
  • Patent number: 9000860
    Abstract: A circuit for a low-loss electrical balance duplexer (EBD) with noise cancellation may include an EBD circuit. The EBD circuit may be coupled to one or more output nodes of a transmit (TX) path, an antenna, and a one or more input nodes of a receive (RX) path. The EBD circuit may be configured to isolate the TX path from the RX path, and to provide low-loss signal paths between the one or more output nodes of the TX path and the antenna. A balancing network may be coupled to the EBD circuit and configured to provide an impedance that matches an impedance associated with the antenna. A noise cancellation circuit may be configured to sense a noise signal generated by the balancing network, and to use the sensed noise signal to improve a signal-to-noise ratio (SNR) of the RX path.
    Type: Grant
    Filed: December 18, 2012
    Date of Patent: April 7, 2015
    Assignee: Broadcom Corporation
    Inventors: Mohyee Mikhemar, Hooman Darabi
  • Patent number: 8994477
    Abstract: A noise filtering circuit for suppressing electromagnetic interference (EMI) is provided. The noise filtering circuit filters out high multiplied-frequency noise of a digital signal being transmitted and includes a reference voltage structure formed from conductors, a signal transmitting structure formed from a transmission conductor, a ground layer, and a ground structure electrically connected to the reference voltage structure and the ground layer. The ground structure is configured to form an inductor-capacitor oscillating structure in coordination with the electric-magnetical coupling between the reference voltage structure and the signal transmitting structure as well as the inductance of the ground structure, so that a digital signal is filtered out at a specific frequency and the passband of the digital signal can be transmitted.
    Type: Grant
    Filed: April 10, 2012
    Date of Patent: March 31, 2015
    Assignee: National Taiwan University
    Inventors: Tzong-Lin Wu, Iat-In Ao-Ieong
  • Patent number: 8994470
    Abstract: A circuit substrate has three wiring layers, wherein a signal line is formed in a first wiring layer; a ground plane is formed in a second wiring layer; a resonant line is formed in a third wiring layer. A circumferential slit is formed in the ground plane, wherein an island electrode separated from the ground plane is formed inside the slit. The left end of the resonant line is connected to the island electrode through an interlayer-connecting via, while the right end of the resonant line is connected to the ground plane through an interlayer-connecting via. A transmission line (or a microstrip line) is formed using the signal line and the ground plane, and therefore a complex resonator is formed to embrace the transmission line. This achieves band elimination with regard to a signal component of a resonance frequency among signals propagating through the microstrip line.
    Type: Grant
    Filed: April 25, 2012
    Date of Patent: March 31, 2015
    Assignee: Lenovo Innovations Limited (Hong Kong)
    Inventor: Jun Sakai
  • Publication number: 20150070102
    Abstract: A transmission line includes a signal terminal for inputting a first signal and a second signal, a first wire coupled to the signal terminal for transmitting the first signal, a second wire coupled to the signal terminal for transmitting the second signal, a filtering module coupled to the first and second wires for receiving the first and second signals to filter out noises of the first and second signal, a third wire coupled to the filtering module for transmitting the first signal, and a fourth wire coupled to the filtering module for transmitting the second signal.
    Type: Application
    Filed: February 10, 2014
    Publication date: March 12, 2015
    Applicant: Wistron Corporation
    Inventors: Chih-Sheng Dai, Tien-Kuei Chiang
  • Patent number: 8975978
    Abstract: Provided is an interconnect substrate that includes a laminated body including an electric conductor and an insulator, over which an electronic element (141) is disposed, wherein the laminated body includes a first layer (130) having at least one first conductor (131) separated in an island shape, a first connecting member (142) which is buried in the laminated body in order to electrically connect the electronic element (141) and the first conductor (131), a second layer (110) having a third conductor (111) which is provided opposite to at least a partial region of the first conductor (131), a second conductor (122) which is provided opposite to at least one of the first conductor (131) and the third conductor (111) with a layer of an insulator interposed therebetween, wherein when the laminated body is seen in a plan view, the second conductor (122) is located at a region less than a quarter of a wavelength occurring at a frequency of noise propagated from the electronic element (141) to the first conductor
    Type: Grant
    Filed: May 25, 2011
    Date of Patent: March 10, 2015
    Assignee: NEC Corporation
    Inventors: Masashi Kawakami, Hiroshi Toyao
  • Patent number: 8952266
    Abstract: A structural body includes: a first conductor and a second conductor of which at least portions are opposite to each other; a third conductor, interposed between the first conductor and the second conductor, of which at least a portion is opposite to the first conductor and the second conductor, and has a first opening; an interconnect provided in the inside of the first opening; and a conductor via which is electrically connected to the first conductor and the second conductor and is electrically insulated from the third conductor, wherein the interconnect is opposite to the first conductor and the second conductor, one end thereof being electrically connected to the third conductor at an edge of the first opening and an other end thereof being formed as an open end.
    Type: Grant
    Filed: August 26, 2011
    Date of Patent: February 10, 2015
    Assignee: NEC Corporation
    Inventor: Hiroshi Toyao
  • Patent number: 8952766
    Abstract: An object is to provide a control board, an inverter device, and an integrated-inverter electric compressor that are capable of improving electromagnetic compatibility (EMC property) and improving reliability against input/output of electromagnetic noise, which shows a tendency towards greater complexity and intensity. A control board to which two power systems, that is, a low-voltage power system and a high-voltage power system, are inputs, comprising a low-voltage circuit and a high-voltage circuit, and a low-voltage-side ground region and a high-voltage-side ground region that are formed in correspondence with the circuits, respectively, wherein frame ground regions are provided at a plurality of positions on the control board, and a plurality of communication line patterns connected to the low-voltage circuit are respectively connected to both the low-voltage-side ground region and the frame ground region through capacitance elements with various capacitances.
    Type: Grant
    Filed: December 20, 2010
    Date of Patent: February 10, 2015
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Makoto Hattori, Masahiko Asai
  • Publication number: 20150022278
    Abstract: In an embodiment of the disclosure, an electronic device arranged for eliminating wireless noise interference is provided. The electronic device includes a circuit board and two first metal components. The metal components are arranged on different sides of the circuit board. Each of the first metal components comprises a first terminal and a second terminal opposite to the first terminal The first terminal is coupled to the circuit board and the second terminal is open loop. The length of the first metal component is about one-fourth wavelength of a pre-determined frequency.
    Type: Application
    Filed: April 18, 2014
    Publication date: January 22, 2015
    Applicant: Media Tek Inc.
    Inventors: Hsiao-Ting HUANG, Cheng-Hao KUO
  • Patent number: 8937516
    Abstract: The present invention relates to a device and a method for reducing harmful effects to people of a first alternating electromagnetic field that is characterized by a first frequency. According to the invention, the device comprises extraction means for extracting electric power from the first alternating electromagnetic field and transmission means for transmitting a second alternating electromagnetic field that is characterized by a second frequency. During operation, the transmission means are supplied with the electric power extracted by the extraction means, and the first and the second frequency are different.
    Type: Grant
    Filed: July 14, 2009
    Date of Patent: January 20, 2015
    Assignee: W.W.I.M. Ltd.
    Inventor: Wilhelmus Adrianus Johannes Maris Wagenaar
  • Patent number: 8928425
    Abstract: A circuit for a wireline system is disclosed. In an embodiment, the circuit includes a twisted pair channel. The twisted pair channel delivers a differential signal that includes a converter mode component. The circuit includes at least one transformer coupled to the twisted pair channel and a transceiver coupled to the at least one transformer. The circuit further includes a common mode detection coupled to the transceiver for detecting a common mode component. In an embodiment, the circuit detects the common mode component. Accordingly, with common mode component detection capability, the common mode component of the differential can be analyzed for characterization purposes as well as for potential improvement in the system performance signal.
    Type: Grant
    Filed: October 22, 2009
    Date of Patent: January 6, 2015
    Assignee: Aquantia Corp.
    Inventors: Hossein Sedarat, Paul Langner, Ramin Farjadrad, Ramin Shirani
  • Patent number: 8922299
    Abstract: The present disclosure relates to a circuit for mitigating EMI generated from an input terminal of an IC (Integrated Circuit) including a power input port connected to a first input and an operational mode selection port connected to a second input, the circuit including a first diode connected to the first input, an LC filter unit connectively interposed a cathode terminal of the first diode and the power input port, and a first resistor connectively interposed between the cathode terminal of the first diode and the second input.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: December 30, 2014
    Assignee: LG Innotek Co., Ltd.
    Inventor: Youngwuk Lee
  • Patent number: 8922303
    Abstract: To sufficiently attenuate a common mode signal by passing an ultra-high speed differential signal through an ultra-high speed differential transmission line. A common mode filter comprises: a pair of conductive lines formed on a first dielectric layer to transmit a differential signal; a plurality of first divided floating grounds in a state of being separated from an external ground potential, and facing the conductive lines, with the first dielectric layer interposed between them, and formed by being divided into a plurality of numbers in a length direction of the conductive lines, and forming a distribution constant type differential transmission line for the differential signal, together with the conductive lines; and a first passive two-terminal network connected between the first divided floating grounds located at least at an input side or an output side of the first divided floating grounds, and the external ground potential.
    Type: Grant
    Filed: July 21, 2010
    Date of Patent: December 30, 2014
    Assignee: Elmec Corporation
    Inventor: Masaaki Kameya
  • Patent number: 8917148
    Abstract: A transmission unit with reduced crosstalk signal includes a first conductor group having at least one first conductor surrounded by a first sheath and at least one second conductor surrounded by a second sheath. The first and the second conductor are axially arranged corresponding to one another. The first sheath has a dielectric coefficient higher than that of the second sheath, so that a difference in dielectric property exists between the first and the second conductor to enable reduction of crosstalk occurred during high-speed signal transmission over the transmission unit.
    Type: Grant
    Filed: July 14, 2011
    Date of Patent: December 23, 2014
    Assignee: Yes Way Enterprise Corporation
    Inventors: Da-Yu Liu, Da-Yung Liu, Teng-Lan Liu, Ben-Hwa Jang
  • Patent number: 8895851
    Abstract: A magnetically shielded cable arrangement, comprising at least two AC cables (201-203) comprising a spaced portion extending between two close portions of parallel cables, such spaced portion sequentially including a diverging portion, a widely spaced portion and a converging portion, and an EMF shielding system (1) laid over said at least two AC cables (201-203), said EMF shielding system (1) comprising a conductor (2, 3, 11, 12) having two branches (2, 3) forming a median portion (4, 5) and end portions (7-10), the median portion width being equal to or larger than the AC cables distance in the widely spaced portion and the width at the extremities of the end portions (7-10) being larger than the AC cables distance in the close portions and smaller than the AC cables distance in the widely spaced portion, said conductor (2, 3, 11, 12) comprising an inner electrical path (2a, 3a) and an outer electrical path (2e, 3e) connected together (11, 12) at relevant longitudinal ends.
    Type: Grant
    Filed: April 23, 2010
    Date of Patent: November 25, 2014
    Assignee: Prysmian S.p.A.
    Inventor: Paolo Maioli
  • Publication number: 20140340167
    Abstract: A low pass filter 6 comprises an inductor unit 8 comprising first and second inductors 11 and 12, an input side capacitor unit 7 provided on a signal input side of the inductor unit 8, and an output side capacitor unit 9 provided on a signal output side of the inductor unit 8. The input side capacitor unit 7 comprises a first capacitor 21 provided between the signal lines. Further, the input side capacitor unit 7 comprises a second capacitor 22 wherein one end is connected to a signal input end 11a of the first inductor 11, and the other end is connected to a ground (GND), and a third capacitor 23 wherein one end is connected to a signal input end 12a of the second inductor 12, and the other end is connected to a ground (GND).
    Type: Application
    Filed: September 10, 2012
    Publication date: November 20, 2014
    Applicant: CANON KABUSHIKI KAISHA
    Inventor: Daishiro Sekijima
  • Patent number: 8890559
    Abstract: [Problems] In a connector to which unbalanced-type lines are connected, providing a connector which prevents crosstalk in the connector and an interface apparatus including the connector. [Solutions] Comprising terminals to be connected with connectors, a plurality of boards having a plurality of transmission lines, one ends of the transmission lines being connected with the terminals, a housing for fixing the plurality of boards, and common mode choke coils provided on the boards and connected with balanced-type lines.
    Type: Grant
    Filed: October 13, 2011
    Date of Patent: November 18, 2014
    Assignee: Advantest Corporation
    Inventors: Yuichiro Iwamoto, Takayuki Nakamura
  • Patent number: 8884719
    Abstract: A noise filter includes a first substrate on which a filter input terminal, an input-side capacitor, a common-mode choke coil, and a filter output terminal are mounted and a second substrate on which an output-side capacitor and a ground capacitor are mounted. The first substrate is selected from a plurality of first substrates including a substrate in which a characteristic of at least one of an input-side capacitor and a common-mode choke coil is different, the second substrate is selected from a plurality of second substrates including a substrate in which a characteristic of at least one of an output-side capacitor and a ground capacitor is different, and the second substrate is attached to an end of the first substrate so that the filter output terminal is electrically connected to the output-side capacitor and to be substantially vertical to the first substrate.
    Type: Grant
    Filed: April 18, 2012
    Date of Patent: November 11, 2014
    Assignee: Mitsubishi Electric Corporation
    Inventor: Masahiro Otsubo
  • Publication number: 20140327488
    Abstract: A multi-band whip antenna having a 30 MHz to 2 GHz bandwidth and an L-band dipole has its coverage extended up to 6 GHz by eliminating nulls and reducing VSWR problems that are cured through the utilization of a sleeve over the feedpoint of the L-band antenna. Chokes in the form of sleeves are provided at either end of the L-band dipole to shorten the L-band antenna for preventing reverse polarity currents at the L-band antenna feedpoint, with the antenna further including the use of double shielded meanderlines to provide improved performance between 410-512 MHz and in which a capacitance sleeve is added at the bottom of the L-band antenna to effectively elongate the antenna below the L-band to permit operation below 700 MHz.
    Type: Application
    Filed: July 16, 2014
    Publication date: November 6, 2014
    Inventors: John T. Apostolos, William Mouyos, Judy Feng
  • Patent number: 8866566
    Abstract: To pass an ultra high-speed differential signal and make it difficult to pass a common mode noise. Lumped—constant differential delay line DL is formed by arranging inductors Lo, being passive series elements, and capacitors Co, being passive parallel elements, in a differential four terminal network of a ladder shape composed of the passive series elements and the passive parallel elements arranged in differential lines 1 and 3. The lumped-constant differential delay line DL is composed of capacitors Co including two capacitors Co/2 and Co/2, or Co and Co equivalent to the aforementioned capacitors, having equal values, and connected in series. Inductors L1 to L4 for attenuating a common mode noise are connected between connection points of the capacitors Co/2 and Co/2 or Co and Co connected in series, and a ground potential, so that attenuation poles are formed for attenuating the common mode noise together with the capacitors Co/2 and Co.
    Type: Grant
    Filed: September 17, 2010
    Date of Patent: October 21, 2014
    Assignee: Elmec Corporation
    Inventor: Masaaki Kameya
  • Patent number: 8848385
    Abstract: The present disclosure relates to reducing unwanted RF noise in a printed circuit board (PCB) containing an RF device. An isolation filter is embedded in a PCB containing an RDF device. By placing the isolation filter as close as possible to the RF device in order to dramatically reduce unwanted RF noise due to unavoidable coupling between Vias and planes in the PCB structure.
    Type: Grant
    Filed: September 28, 2011
    Date of Patent: September 30, 2014
    Assignee: R&D Sockets, Inc
    Inventors: Thomas P. Warwick, James V. Russell
  • Patent number: 8847697
    Abstract: A communication system of the present invention includes: a communication coupler that transmits a signal; and a signal transmitting apparatus that communicates by propagating, as an electromagnetic field, the signal transmitted from the communication coupler, the communication coupler includes a coupler case disposed on the signal transmitting apparatus, a noise suppressing section is provided on a lower end surface of the coupler case, the lower end surface faces the signal transmitting apparatus, and the noise suppressing section suppresses noise by creating a high impedance.
    Type: Grant
    Filed: June 25, 2010
    Date of Patent: September 30, 2014
    Assignee: NEC Corporation
    Inventor: Masaharu Imazato
  • Patent number: 8847705
    Abstract: There is provided a common mode filter capable of allowing an ultrahigh speed differential signal to transmit and hardly allowing a common mode noise to transmit, comprising: a lumped-constant differential delay line DL formed by arranging inductors Lo, being passive series elements, and capacitors Co, being passive parallel elements, in a ladder-shaped differential four terminal network composed of the passive series elements and the passive parallel elements arranged in the differential lines 1, 3. In the lumped-constant differential delay line DL, the capacitors Co, being the parallel elements, are formed of two capacitors connected in series equivalent to each other and having same values with each other such as Co/2 and Co/2, or Co and Co.
    Type: Grant
    Filed: October 13, 2010
    Date of Patent: September 30, 2014
    Assignee: Matsue Elmec Corporation
    Inventor: Masaaki Kameya
  • Publication number: 20140253258
    Abstract: An electromagnetic band gap device is provided, comprising: a conductive plane; a non-conductive substrate located over the conductive plane; and an electromagnetic band gap unit cell that includes a first via located in the non-conductive substrate and filled with a conductive material, a second via located in the non-conductive substrate and filled with the conductive material, a first conductive surface located on the non-conductive substrate over the first via, and a second conductive surface located on the non-conductive substrate over the second via, wherein the electromagnetic band gap unit cell is configured to operate as an LC resonant circuit in conjunction with the conductive plane, at least one gap is located in the electromagnetic band gap unit cell, the at least one gap being located in the first via, in the first conductive surface, in the second conductive surface, and in the second via.
    Type: Application
    Filed: March 5, 2013
    Publication date: September 11, 2014
    Applicant: Freescale Semiconductor, Inc.
    Inventor: Walter PARMON
  • Patent number: 8830009
    Abstract: A method including receiving power, from a power line, at a device configured to communicate via the power line. The power from the power line is received at the device via a power cord of the device being connected, via a connector, to a power outlet from which the power of the power line is supplied. The connector is coupled to a first end of the power cord. The device is coupled to a second end of the power cord. The method further includes supplying a signal generated by the device to a choke located on the power cord. The choke is located closer to the first end of the power cord than to the second end of the power cord. The method further includes transmitting the signal from the choke to the power line for communication via the power line.
    Type: Grant
    Filed: February 11, 2013
    Date of Patent: September 9, 2014
    Assignee: Marvell Hispania, S. L. U.
    Inventors: Antonio Poveda Lerma, Miguel Gargolla Parra, Jorge Blasco Claret
  • Publication number: 20140240055
    Abstract: An electronic circuit according to an embodiment includes a power supply line having a first EBG pattern, the first EBG pattern including a plurality of first linear parts and a first slit, each of the first linear parts extending along a direction in which the power supply line extends and surrounded by the first slit except one end of the first linear part.
    Type: Application
    Filed: February 19, 2014
    Publication date: August 28, 2014
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Tadahiro SASAKI, HIROSHI YAMADA
  • Patent number: 8816795
    Abstract: An EMC filter circuit (1) has an essentially rigid busbar (3) for carrying an electric power to which is superposed a noise component in a conductive housing (2), which connected to ground. The filter (1) has two main elements inductors (4) increasing an impedance of the bus bar and capacitors (5) connected between the busbar (3) and the conductive housing (2). The capacitors (5) are inserted and tightly held solderless in position between the conductive housing (2) and the electric conductor (3). One advantage comes from the fact, that flat connection elements are arranged on both sides of the capacitors (5), which allow an easy manufacturing process.
    Type: Grant
    Filed: April 12, 2013
    Date of Patent: August 26, 2014
    Assignee: Schaffner EMV AG
    Inventor: Fabian Beck
  • Patent number: 8786379
    Abstract: A common mode noise filter includes: a common mode filter inserted into a pair of signal lines; and a pair of capacitively coupled coils having one ends connected respectively to the corresponding signal lines and the other ends opened. According to the present invention, common mode noise can be removed by a common mode filter, as well as, differential mode noise in a desired frequency band can be removed by a pair of coils whose other ends are opened.
    Type: Grant
    Filed: May 16, 2011
    Date of Patent: July 22, 2014
    Assignee: TDK Corporation
    Inventors: Takashi Nakagawa, Takeshi Okumura, Toshio Tomonari
  • Patent number: 8780584
    Abstract: An electronic product includes a case; a first board placed inside the case; and a second board having an Electromagnetic Band Gap (EBG) structure inserted therein. The second board is coupled to an inside of the case facing the first board so as to shield a noise radiated from the first board.
    Type: Grant
    Filed: April 3, 2013
    Date of Patent: July 15, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Han Kim, Chang-Sup Ryu
  • Publication number: 20140176252
    Abstract: A differential transmission circuit includes differential signal transmission and reception units connected by a differential signal wiring having an inductor unit composed of magnetically coupled first and second inductors provided on first and second signal lines, an input-side capacitor unit including a first input-side capacitor having one terminal connected to a first inductor signal input terminal and the other terminal grounded and a second input-side capacitor having one terminal connected to a second inductor signal input terminal and the other terminal grounded, and an output-side capacitor unit including a first output-side capacitor having one terminal connected to a first inductor signal output terminal and the other terminal grounded and a second output-side capacitor having one terminal connected to a second inductor signal output terminal and the other terminal grounded.
    Type: Application
    Filed: August 7, 2012
    Publication date: June 26, 2014
    Applicant: CANON KABUSHIKI KAISHA
    Inventor: Yasuhiro Takahashi
  • Publication number: 20140159828
    Abstract: The present invention is directed to an assembly that includes at least one first microstrip network having at least one first transmission line disposed on a first surface of a first dielectric layer. The first dielectric layer includes a first ground plane disposed on a second surface of the dielectric layer. At least one second microstrip network includes at least one second transmission line disposed on a first surface of a second dielectric layer, the second dielectric layer including a second ground plane disposed on a second surface of the second dielectric layer. The at least one second microstrip network is inverted relative to the at least one first microstrip network. At least one integrated support and shielding (ISS) structure is disposed between the at least one second microstrip network and the at least one first microstrip network.
    Type: Application
    Filed: March 14, 2013
    Publication date: June 12, 2014
    Applicant: ANAREN. INC.
    Inventors: Benjamin Shawley, Michael Enders
  • Patent number: 8749100
    Abstract: In some embodiments, a method is disclosed that includes measuring a waveform of a power source side voltage of a circuit breaker; measuring a waveform of a transmission line side voltage of the circuit breaker; calculating a waveform of a voltage between contacts of the circuit breaker that is a difference between the waveform of the power source side voltage and the waveform of the transmission line side voltage; calculating a waveform of an absolute value of the waveform of the voltage between contacts; extracting a waveform of a component in a frequency band which is lower than a frequency of the power source and higher than a frequency of a DC component from the waveform of the absolute value; detecting a cycle of the extracted waveform; and closing the circuit breaker based on the cycle.
    Type: Grant
    Filed: January 31, 2011
    Date of Patent: June 10, 2014
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Tadashi Koshizuka, Minoru Saito, Hiroyuki Maehara, Yoshimasa Sato
  • Publication number: 20140125424
    Abstract: Semiconductor dies and methods are described, such as those including a first capacitive pathway having a first effective series resistance (ESR) and a second capacitive pathway having an adjustable ESR. One such device provides for optimizing the semiconductor die for different operating conditions such as operating frequency. As a result, semiconductor dies can be manufactured in a single configuration for several different operating frequencies, and each die can be tuned to reduce (e.g. minimize) supply noise, such as by varying the ESR or the capacitance of at least one of the pathways.
    Type: Application
    Filed: January 13, 2014
    Publication date: May 8, 2014
    Applicant: Micron Technology, Inc.
    Inventors: Timothy M. Hollis, Steven Bodily
  • Patent number: 8705636
    Abstract: The present invention relates to a method for estimating properties of a transmission line by means of features of a noise spectrum generated by noise entering said transmission line at an intermediate location between the ends of the line. The invention provides possibility to estimate a number of properties, e.g. length of a portion of the transmission line, line attenuation of said line portion and even line termination.
    Type: Grant
    Filed: October 13, 2009
    Date of Patent: April 22, 2014
    Assignee: Telefonaktiebolaget L M Ericsson (Publ)
    Inventors: Antoni Fertner, Miguel Berg, Per Ola Borjesson, Daniel Cederholm, Klas Ericson
  • Patent number: 8704610
    Abstract: A multi-layer cradle comprises a first layer comprising first and second contact pads configured to be electrically coupled to a signal input and a signal output of the electronic component, respectively. The first layer also comprises a first ground plane configured to be electrically coupled to a ground of the electronic component and a first fence positioned about the first ground plane. The first ground plane is positioned at least between the first and second contact pads. A second layer comprising a second ground plane is also included. The cradle further comprises a first dielectric material positioned between the first and second layers, a ground plane via extending through the first dielectric material and electrically coupled to the first and second ground planes, and a plurality of fence vias extending through the first dielectric material and electrically coupled to the first fence and to second ground plane.
    Type: Grant
    Filed: August 1, 2011
    Date of Patent: April 22, 2014
    Assignee: General Electric Company
    Inventors: Victor Taracila, Fraser John Laing Robb, Vijayanand Alagappan, Miguel Angel Navarro, II, Peter Asuzu
  • Patent number: 8698571
    Abstract: In a vehicle network for controlling electronic devices of the type having a network driver with at least one output line connected to the network through a common mode choke. A circuit for improving the immunity of the network includes a resistor and a capacitor connected in series between the signal output line and ground. The series resistor and capacitor protect the network from communication errors.
    Type: Grant
    Filed: March 30, 2011
    Date of Patent: April 15, 2014
    Assignee: Hitachi, Ltd.
    Inventors: Masayoshi Takahashi, Hua Zeng
  • Patent number: 8698579
    Abstract: Common mode (CM) and differential mode (DM) components of multi-phase conducted electromagnetic interference (EMI) noise emanating from electronic circuits such as power converters/inverters are separated by respective coupled inductors connected to each phase of three or more phases and which are coupled to each other differently for CM and DM noise of the respective phases. The inductors of the DM separation unit are coupled such that a substantially ideal zero impedance is presented to DM noise while a high impedance is presented to CM noise. Conversely, the inductors of the CM separation unit are coupled such that a substantially ideal zero impedance is presented to CM noise while a high impedance is presented to DM noise.
    Type: Grant
    Filed: March 25, 2011
    Date of Patent: April 15, 2014
    Assignee: Virginia Tech Intellectual Properties, Inc.
    Inventors: Shuo Wang, Fred C. Lee
  • Publication number: 20140091874
    Abstract: The present disclosure is directed to systems and methods for operating, designing, testing and verifying the performance of wireless communication devices. Specifically, the present systems and methods can passively attenuate unwanted electromagnetic interference (EMI) without degrading signal quality of predetermined frequency using a novel versatile module including a RF absorbing material in a composite medium surrounding the conducting signal lines. Utilizing varying permeability media, the present invention offer a robust platform to eliminate unwanted noise while maintaining a desirable control and power interfaces used for testing of wireless communication systems.
    Type: Application
    Filed: October 1, 2012
    Publication date: April 3, 2014
    Inventors: Ron Cook, James Sozanski
  • Patent number: 8669828
    Abstract: Integrated circuits with decoupling capacitor circuitry are provided. Decoupling capacitor circuitry may include multiple arrays of decoupling capacitors. Each decoupling capacitor array may have a corresponding decoupling capacitor monitoring circuit that is associated with that decoupling capacitor array. Each decoupling capacitor monitoring circuit may include a resistor and switching circuitry. Each decoupling capacitor monitoring circuit may be coupled to a comparator and control circuitry. During testing, the control circuitry may configure each decoupling capacitor array for leakage current testing one at a time. If a decoupling capacitor array is determined to exhibit excessive leakage currents, that decoupling capacitor array will be marked as defective and will be disabled from use. If the decoupling capacitor array is determined to exhibit tolerable leakage currents, that decoupling capacitor array will be enable for use to help reduce power supply noise.
    Type: Grant
    Filed: October 21, 2010
    Date of Patent: March 11, 2014
    Assignee: Altera Corporation
    Inventors: Wilson Wong, Allen Chan, Sergey Shumarayev
  • Publication number: 20140062612
    Abstract: A signal transmission circuit may include a main driving unit configured to drive a first signal transmission line with given driving force in response to a first input signal, and a crosstalk cancellation unit configured to differentiate a signal transferred through a second signal transmission line, which is adjacent to the first signal transmission line, and incorporate a differentiated value into the first signal transmission line.
    Type: Application
    Filed: December 18, 2012
    Publication date: March 6, 2014
    Applicants: Industry-University Cooperation Foundation Hanyang University, SK hynix Inc.
    Inventors: Chun-Seok JEONG, Young-Hoon KIM, Chang-Sik YOO
  • Publication number: 20140062611
    Abstract: The present invention is related to a filtering device with slotted ground structure, comprising a first substrate, a second substrate and a pair of differential signal lines, in which a ground plane having slotted ground structure is provided between the first substrate and the second substrate. Each of the two differential signal lines is symmetric to each other and comprises a first line segment being horizontally provided on the top surface of the first substrate and a second line segment being horizontally provided on the bottom surface of the second substrate, respectively. The first line segment is connected to the second line segment through a vertically disposed conductive via. Thereby, a common-mode noise within a specific frequency band may be suppressed effectively, so as to avoid interference a differential-mode signal transmitted on the differential signal lines, due to the slotted ground structure etched on the ground plane.
    Type: Application
    Filed: December 14, 2012
    Publication date: March 6, 2014
    Applicant: NATIONAL TAIWAN UNIVERSITY
    Inventors: TZONG-LIN WU, TSUI-WEI WENG, CHIH-YING HSIAO
  • Publication number: 20140055208
    Abstract: A resonator is connected to a first plane which is one of a power plane and a ground plane, wherein the power plane and the ground plane are apart from each other in an up-down direction. The resonator comprises a connecting portion and a body portion. The connecting portion is connected to the first plane. The connecting portion extends in the up-down direction beyond a second plane, which is a remaining one of the power plane and the ground plane, while not being in electrical contact with the second plane. The body portion is connected to the connecting portion while not being in contact with the second plane. The body portion is arranged so that the second plane is located between the body portion and the first plane in the up-down direction.
    Type: Application
    Filed: August 21, 2013
    Publication date: February 27, 2014
    Applicants: NATIONAL UNIVERSITY CORPORATION OKAYAMA UNIVERSITY, NEC TOKIN CORPORATION
    Inventors: Koichi KONDO, Naoharu YAMAMOTO, Yoshitaka TOYOTA, Kengo IOKIBE, Farhan Zaheed MAHMOOD
  • Patent number: 8659365
    Abstract: A common mode noise suppression circuit applicable to differential signal transmission performs common mode noise suppression with respect to differential signals transmitted by a transmission line. An inductance-capacitance resonant structure is formed based on electromagnetic coupling combining a ground structure to suppress common mode noise of differential mode signals at broadband meanwhile keeping low loss of the differential mode signals at broadband via differential transmission lines. By this, the common mode noise suppression circuit performs broadband suppression with related to the common mode noise within a frequency scope of several GHz without affecting the differential mode signals and improves manufacturing process miniaturization to decrease cost.
    Type: Grant
    Filed: October 6, 2010
    Date of Patent: February 25, 2014
    Assignee: National Taiwan University
    Inventors: Tzong-Lin Wu, Chung-Hao Tsai, Iat In Ao Ieong
  • Patent number: 8658892
    Abstract: A method to increase the coupling effectiveness of an AC electric field to a ferroelectric substance, thereby improving noise reduction. The method employs an electric field chamber, preferably a hollow conductive tube, to distribute the radiated electric field over a larger effective area without affecting the inductance or transmission qualities of the AC power conductor.
    Type: Grant
    Filed: January 6, 2012
    Date of Patent: February 25, 2014
    Assignee: Gabriel Patent Technologies, LLC
    Inventor: Caelin Gabriel
  • Patent number: 8643446
    Abstract: An electronic system that partially or perhaps even fully mitigates the effects of EMI by having a dedicated antenna circuit for carrying an antenna signal that is not used for signal processing in the functional circuit, but is instead used to emit electromagnetic radiation that at least partially offsets EMI emitted by the operation signal of a functional circuit. An antenna signal generation circuit generates the antenna signal and asserts the antenna signal on the antenna circuit. The ante a signal has the characteristic such that when the antenna signal is applied to the antenna circuit, the resultant emitted electromagnetic radiation at least partially offsets electromagnetic interference emitted by the functional circuit.
    Type: Grant
    Filed: February 3, 2011
    Date of Patent: February 4, 2014
    Assignee: Semiconductor Components Industries, LLC
    Inventors: Harihara Subramanian, Gautam K. Singh
  • Publication number: 20140028412
    Abstract: An EBG (Electromagnetic Band Gap) structure according to an embodiment includes: an electrode that is made of a first conductor; a first insulating layer that is provided on the electrode; a patch unit that is provided in substantially parallel with the electrode on the first insulating layer, the patch unit including a first gap, the patch unit being made of a second conductor; a second insulating layer that is provided on the patch unit; a first via that is provided between the patch unit in the first insulating layer and the electrode and connected to the patch unit and the electrode; and a second via that is provided in the first and second insulating layers, the second via piercing the first gap and being connected to the electrode.
    Type: Application
    Filed: July 26, 2013
    Publication date: January 30, 2014
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Tadahiro Sasaki, Kazuhiko Itaya, Hiroshi Yamada
  • Patent number: 8629733
    Abstract: Semiconductor dies and methods are described, such as those including a first capacitive pathway having a first effective series resistance (ESR) and a second capacitive pathway having an adjustable ESR. One such device provides for optimizing the semiconductor die for different operating conditions such as operating frequency. As a result, semiconductor dies can be manufactured in a single configuration for several different operating frequencies, and each die can be tuned to reduce (e.g. minimize) supply noise, such as by varying the ESR or the capacitance of at least one of the pathways.
    Type: Grant
    Filed: August 20, 2010
    Date of Patent: January 14, 2014
    Assignee: Micron Technology, Inc.
    Inventors: Timothy Hollis, Steven Bodily
  • Patent number: 8629715
    Abstract: An apparatus for propagating local oscillator signals in a circuit, the apparatus comprising two pairs of lines carrying respectively differential in-phase and quadrature signals. The lines are arranged such that in at least one region along their length one of each pair of lines crosses the other of the pair to create a twist. The twist(s) in each respective pair of lines is offset from the twist(s) in the other pair of lines such that the portion of their length over which the in-phase lines magnetically couple to the quadrature lines with a positive coupling coefficient is substantially equal to the portion of their length over which the in-phase lines magnetically couple to the quadrature lines with a negative coupling coefficient.
    Type: Grant
    Filed: August 28, 2012
    Date of Patent: January 14, 2014
    Assignee: Cambridge Silicon Radio Limited
    Inventors: Giuseppe Gramegna, Pasquale Lamanna, Maxime Vignasse
  • Publication number: 20140009246
    Abstract: A network signal enhancement circuit assembly includes a processing circuit installed in a circuit board and having opposing first and second connection ends thereof respectively coupled to a network connector and a voltage-mode network-on-chip. The processing circuit includes coupling modules for coupling network signals, EMI protection modules for removing noises from coupled network signals, and a signal enhancement module including a voltage source and a plurality of pull-up resistors and adapted to compensate for an attenuation of the network signal due to long distance signal transmission, assuring a high level of signal transmission stability.
    Type: Application
    Filed: September 9, 2013
    Publication date: January 9, 2014
    Applicant: AJOHO ENTERPRISE CO., LTD.
    Inventors: Chia-Ping MO, You-Chi LIU
  • Patent number: 8610063
    Abstract: A system for transmitting an electrical signal, notably a frequency-related electrical signal, includes two conducting lines each having a central conductor surrounded by a conducting sheath, the lines being coupled and isolated from one another at each end by a transformer. The central conductor of a line is linked at the input of the system to a coil of a first transformer and at the output of the system to a coil of the second transformer. The invention is applied for example for the transmission of strongly disturbed environment measurement signals.
    Type: Grant
    Filed: June 9, 2009
    Date of Patent: December 17, 2013
    Assignee: Commissariat a l'Energie Atomique et aux Energies Alternatives
    Inventors: Jean-michel Bourbotte, Loïc Barbot, Stéphane Normand, Vladimir Kondrasovs
  • Patent number: 8595924
    Abstract: A hybrid electromagnetic bandgap (EBG) structure for broadband suppression of noise on printed wiring boards includes an array of coplanar patches interconnected into a grid by series inductances, and a corresponding array of shunt LC networks connecting the coplanar patches to a second conductive plane. This combination of series inductances and shunt resonant vias lowers the cutoff frequency for the fundamental stopband. The series inductances and shunt capacitances may be implemented using surface mount component technology, or printed traces. Patches may also be interconnected by coplanar coupled transmission lines. The even and odd mode impedances of the coupled lines may be increased by forming slots in the second conductive plane disposed opposite to the transmission line, lowering the cutoff frequency and increasing the bandwidth of the fundamental stopband.
    Type: Grant
    Filed: October 21, 2009
    Date of Patent: December 3, 2013
    Inventor: William E. McKinzie, III