Abstract: A power distribution network includes a reference plane placed under a signal line, the reference plane having a discontinuous structure; and a return current path for the signal line, the return current path being formed on the reference plane. The return current path has any one shape among the same shape as the signal line, a proportional shape to the signal line and an expansion shape of the signal line.

Abstract: An electronic device comprising: a wiring substrate having a first power-supply wiring to which a first power-supply potential is applied and a second power-supply wiring to which a second power-supply potential lower than the first power-supply potential is applied; a microcomputer having first and second power-supply terminals in which the first power-supply terminal is connected to the first power-supply wiring and the second power-supply terminal is connected to the second power-supply wiring; and a connector connected to the first and second power-supply wirings, wherein an inductor element for correcting an impedance error of the first and second wirings is connected in series to either one of the first and second power-supply wirings. According to such configuration, unnecessary electromagnetic radiation posed by a common current can be suppressed.

Abstract: An integrated circuit having voltage isolation capabilities includes a plurality of communications channels for transceiving data from the integrated circuit. Each of the communications channel includes capacitive isolation circuitry located in conductive layers of the integrated circuit for providing a high voltage isolation link. The capacitive isolation circuitry distributes a first portion of a high voltage isolation signal across a first group of capacitors on a first link and a second link in the capacitive isolation circuitry and distributes a second portion of the high voltage isolation signal across a second group of capacitors in the first link and the second link in the capacitive isolation circuitry. A differential receiver on each of the plurality of communications channels receives the data on the first link and the second link.

Abstract: A magnetic field method for mitigating passive intermodulation distortion. The method is useful both for mitigating passive intermodulation and for easily locating dominant sources of it, even in shielded components.

Abstract: A communication system of the present invention includes: a communication coupler that transmits a signal; and a signal transmitting apparatus that communicates by propagating, as an electromagnetic field, the signal transmitted from the communication coupler, the communication coupler includes a coupler case disposed on the signal transmitting apparatus, a noise suppressing section is provided on a lower end surface of the coupler case, the lower end surface faces the signal transmitting apparatus, and the noise suppressing section suppresses noise by creating a high impedance.

Abstract: Disclosed is a circuit for reducing EMI noise in a driver IC including at least one or more input ports, and at least one or more output ports, the circuit including a power unit connected to any one of the input ports to output a current to the driver IC, and at least one or more resistors arranged in series between the at least one or more output ports of the driver IC and an output terminal connecting an exterior device operated by the driver IC.

Abstract: An electromagnetic bandgap structure and a printed circuit board including it as well as a method of manufacturing thereof that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. The electromagnetic bandgap structure in accordance with an embodiment of the present invention can include: a first metal layer; a first dielectric layer, stacked on the first metal layer; a metal plate, stacked on the first dielectric layer; a second dielectric layer, stacked on the metal plate and the first dielectric layer; a second metal layer, stacked on the second dielectric layer; and a via, directed from the metal plate to the first metal layer and the second metal layer. The via can be connected to the first metal layer and is not connected the second metal layer.

Abstract: An integrated antenna package includes an interposer, an integrated circuit die, and a cap that forms a cavity within the integrated antenna package. A lossy ERG structure resides at the cap overlying the integrated circuit device. A lossless EBG structure resides at the cap overlying a microstrip feedline. A radar module includes a plurality of receive portions, each receive portion including a parabolic structure having a reflective surface, an absorber structure, a lens, and an antenna.

Abstract: A process for reducing common-mode current in a power-line communication equipment, where a power-line network is used as a communication medium, includes applying a signal transmitted by the power-line communication equipment via a common-mode choke circuit. The common-mode choke circuit includes braided signal cables mounted around a toroidal magnetic core. The signal is applied to the braided signal cables. The common-mode choke circuit is located adjacent to a connector of a power supply cable supplying power from a power outlet to the power-line communication equipment.

Abstract: According to an embodiment of the present invention, an electromagnetic bandgap structure can include: at least three conductive plates; a first stitching via, configured to electrically connect any one of the conductive plates to another conductive plate; and a second stitching via, configured to electrically connect the one conductive plate to yet another conductive plate. In the electromagnetic bandgap structure of the present invention, the first stitching via can electrically connect the one conductive plate to another conductive plate by allowing a part of the first stitching via to be connected through a planar surface above the one conductive plate, and the second stitching via can electrically connect the one conductive plate to yet another conductive plate by allowing a part of the second stitching via to be connected through a planar surface below the one conductive plate.

Abstract: A cable driver (301) for driving a single ended transmission medium such as a coaxial cable (115) comprising a core (120) and a shield (121) comprises a differential driver (104, 377) comprising a first output (151) for putting a first signal to the core (120) of the single ended transmission medium (115), a second output (152) for putting a second signal to the shield (121) of the single ended transmission medium (115) through a termination resistor (118) having an impedance close to the characteristic impedance (Z0) of the single ended transmission medium (115), and a third output (153) for putting a transmit ground supply signal (GNDT), local to the differential driver, to the shield (121) of the single ended transmission medium (115) through a first high frequency low impedance path (112). In use, the current through the third output (153) will be substantially the inverse of the common mode current through the first and second outputs (151, 152).

Abstract: A noise reduction device for ports of DSL filters and a method thereof are revealed. A plurality of signal transmission line sets is arranged at the ports of a DSL filter. A first cross part is formed between the first signal transmission line and the second signal transmission line of the first signal transmission line set. Before the first cross part, the first signal transmission line of the second signal transmission line set is adjacent to the second signal transmission line of the first signal transmission line set while after the first cross part, the first signal transmission line of the second signal transmission line set is adjacent to the first signal transmission line of the first signal transmission line set. Thus the noises induced by interference between two adjacent signal transmission lines cancel each other out. Therefore, no interference noise occurs between two adjacent signal transmission lines.

Abstract: A high frequency package in which the resonance frequency of a metal seal ring is high, a reflection loss and a insertion loss of an input terminal and an output terminal are reduced in working frequency, and which has an excellent RF (radio frequency) characteristic in such as a millimeter wave, and a manufacturing method for the same are provided. The high frequency package has a minimum of an conductor base plate, a ceramic frame, the metal seal ring arranged on the ceramic frame, a solder metal layer arranged on the metal seal ring, a resonance frequency adjustment conductor formed of a conductor having an opening arranged on the solder metal layer, and a ceramic cap arranged on the resonance frequency adjustment conductor. The resonance frequency adjustment conductor is arranged so that an opening may correspond to a high portion of a loop of bonding wire.

Abstract: The present invention uses metallization termination techniques to reduce the electro-magnetic field scattering at the edges of metallized areas. The metallization termination techniques provide a gradual transition from high conductivity areas to high impedance areas. The mobile phone antenna illuminates the PCB allowing currents to flow on the PCB. When the currents reach edges of the PCB they flow through a region of increasingly high impedance without reflecting back or scattering.

Abstract: An electromagnetic bandgap structure and a printed circuit board that solve a mixed signal problem are disclosed. In accordance with embodiments of the present invention, the electromagnetic bandgap structure includes a first metal layer; a first dielectric layer, stacked in the first metal layer; a second metal layer, stacked in the first dielectric layer, and having a holed formed at a position of the second dielectric layer; a second dielectric layer, stacked in the second metal layer; a metal plate, stacked in the second dielectric layer; a first via, penetrating the hole formed in the second metal layer and connecting the first metal layer and the metal plate; a third dielectric layer, stacked in the metal plate and the second dielectric layer; a third metal layer, stacked in the third dielectric layer; and a second via, connecting the second metal layer to the third metal layer.

Abstract: One embodiment of the present invention provides a system that performs differential signaling through parallel ports in a manner that reduces noise caused by coupling between neighboring ports. The system includes parallel ports for transmitting differential signals from a sender to a receiver, wherein the parallel ports are organized in a two-dimensional grid. Each differential signal is transmitted through a first port and a second port that carry complementary positive and negative components of the differential signal. The first and second ports of a differential pair are diagonally adjacent to each other in the two-dimensional grid. Because the first and second ports transition in opposite directions, coupling noise is cancelled on a neighboring port that is horizontally adjacent to the first port and vertically adjacent to the second port.

Abstract: A ladder LPF includes a first capacitor formed of a transistor in which two terminals out of three are diode-connected, and a second capacitor formed by connecting a pn junction capacitor and an insulating capacitor in parallel. In the second capacitor, the pn junction capacitor formed in a semiconductor layer and the insulating capacitor formed in a surface of the semiconductor layer are connected to each other in parallel so as to almost overlap each other. Accordingly, the area in the LPF occupied by the second capacitor can be prevented from increasing even when its capacitance value is increased. Moreover, having the snap-back characteristics, the first capacitor can protect the second capacitor having the insulating capacitor from ESD. As a result, what can be obtained is a compact noise filter having high RFI removal characteristics and accomplishing high resistance to ESD.

Abstract: The present invention is intended to efficiently implement noise countermeasures for a semiconductor circuit board and for a semiconductor circuit. The present invention is constituted by a control substrate, and a semiconductor circuit connected to the control substrate. The semiconductor circuit includes a substrate, an integrated circuit group, and a noise countermeasure, and is separated from the control substrate. The integrated circuit group includes an integrated circuit as a noise source. The substrate has a stacked multilayer structure, and shifts the frequency of a noise generated by the integrated circuit group to the high frequency side. The noise countermeasure is connected between the integrated circuit group and the control substrate. The noise countermeasure is a filter for attenuating the high frequency of a noise.

Abstract: Proposed is an apparatus for silencing electromagnetic noise, characterized by a plurality of centrally symmetrical ring-shaped through-via-hole crystalline units provided between a high voltage plane and a low voltage plane at a regular interval, thereby forming an omnidirectional noise suppression frequency band for reducing noise interference and electromagnetic radiation. In a first embodiment of the ring-shaped through-via-hole crystalline units, the through via holes are perpendicularly coupled between a metal plane and the low voltage plane. In a second embodiment of the ring-shaped through-via-hole crystalline units, the through via holes are perpendicularly coupled between two metal planes. Positioned at a regular interval, the through via holes enable provision of omnidirectional noise suppression frequency band, simplified design of a power plane, and reduction of production costs.

Abstract: Improved performance of a noise separator circuit capable of separating common mode (CM) and differential mode (DM) components of electromagnetic interference (EMI) noise are provided by arrangement of terminating impedances such that the circuit is fully symmetric with respect of a pair of input ports. The noise separator circuit is further improved by perfecting features for canceling effects of parasitic inductances and capacitances, parasitic capacitance and inductance between circuit connections such as printed circuit board traces, minimizing leakage inductance effects of pairs of coupled inductors and mutual inductance effects between pairs of coupled inductors, providing sufficient magnetizing inductance for low frequency response, and preventing saturation of inductors using switched attenuators, providing a plurality of ground planes, choices of terminating resistors and circuit layout.

Abstract: A noise filter for suppressing conducted emission generated in a power conversion apparatus includes a grounding capacitor circuit, an interphase capacitor circuit and an impedance circuit. The impedance circuit is connected to at least one of the grounding capacitor circuit and the interphase capacitor circuit for adjusting attenuation characteristics of the noise filter.

Abstract: A common mode noise suppression circuit applicable to differential signal transmission performs common mode noise suppression with respect to differential signals transmitted by a transmission line. An inductance-capacitance resonant structure is formed based on electromagnetic coupling combining a ground structure to suppress common mode noise of differential mode signals at broadband meanwhile keeping low loss of the differential mode signals at broadband via differential transmission lines. By this, the common mode noise suppression circuit performs broadband suppression with related to the common mode noise within frequency scope of several GHzs without affecting the differential mode signals and improves manufacturing process miniaturization to decrease cost.

Abstract: An electromagnetic bandgap structure is disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a dielectric layer, a plurality of conductive plates, placed on a planar surface which is different from that of the dielectric layer, vias, of which each is connected to each of the conductive plates, respectively, and penetrates through the dielectric layer from one end part that is connected to the conductive plates, and a conductive trace, which connects the other end parts of the vias with each other such that all of the conductive plates are electrically connected.

Abstract: There is provided a noise eliminating wire harness capable of enhancing a noise elimination performance. In the wire harness 31, an intermediate portion of a sheath 34 of a wire 33 is removed to expose a conductor 35, thereby forming a conductor connection portion 36, and a capacitor 39 is directly connected to this conductor connection portion 36. The capacitor 39 is directly connected to the conductor connection portion 36 without using any wire serving as a branch wire. The capacitor 39 is connected to the conductor connection portion 36 in perpendicularly intersecting relation thereto. The capacitor 39 is connected to the wire 33 in such a condition that there is not provided any portion extending side by side with the wire 33.

Abstract: In one example embodiment, a transmitter comprises a first component coupled to receive a signal for transmission and a second component communicatively coupled to the first component to transmit the signal over a transmission medium. The transmitter further comprises a planar transmission line formed on a substrate and disposed between the first and second components to couple the signal from the first component to the second component. The planar transmission line includes a first transmission line element formed on the substrate and configured to suppress radiation of EMI at a predetermined frequency.

Abstract: A circuit includes an input signal line, a high performance resonant element connected to the input signal line, and an output signal line connected to the high performance resonant element. The high performance resonant element is a via.

Abstract: A radio frequency device is disclosed, which includes an isolation substrate, a ground layer, a first signal end, a second signal end, a radio frequency circuit, and an impedance unit. The isolation substrate includes a first plane and a second plane. The ground layer is disposed on the second plane of the isolation substrate for providing grounding. The first signal end is formed on the first plane of the isolation substrate. The second signal end is formed on the first plane of the isolation substrate and coupled to the ground layer. The radio frequency circuit is disposed on the first plane of the isolation substrate and coupled to the first signal end. The impedance unit is disposed on the first plane of the isolation substrate and coupled to the first signal end and the second signal end.

Abstract: An electromagnetic interference (EMI) suppressor having a bandpass filtering function is provided. The EMI suppressor is disposed on a substrate, and includes a signal line, a ground line, an open-circuit line, a first line group, and a second line group. The signal line has an input terminal and an output terminal for feeding in and feeding out electromagnetic wave signals respectively. One terminal of the ground line is connected to the signal line and the other terminal is a ground terminal. One terminal of the open-circuit line is connected to the signal line and the other terminal is an open-circuit terminal. The first line group is formed by a first open-circuit line and a second open-circuit line, and is connected to the signal line. The second line group is formed by a third open-circuit line and a fourth open-circuit line, and is connected to the signal line.

Abstract: A waveguide system comprises a differential waveguide with at least one first and one second signal conductor, which are coupled to one another within the waveguide, and a divider network with front network elements disposed at a front end of the waveguide in the signal-flow direction and with rear network elements disposed at a rear end of the waveguide in the signal-flow direction. The front network elements comprise a first parallel element, which extends in the direction from the first signal conductor to the earth conductor, and a second parallel element, which extends in the direction from the second signal conductor to the earth conductor. Alternatively, the parallel element can also be disposed between the signal conductors.

Abstract: According to one exemplary embodiment, a connector for coupling a communications medium to an electronic device includes a common-mode suppression block coupled to a number of connector pins. The common-mode suppression block is configured to reduce common-mode noise coupling between the communications medium and the connector pins in the connector. The common-mode suppression block is further configured to provide substantially no attenuation to a differential-mode signal. In one embodiment, the communications medium is an Ethernet cable and the connector is an Ethernet plug. In one embodiment, the common-mode suppression block comprises common-mode chokes. In one embodiment, the connector is an RJ45 plug.

Abstract: A pseudo-Marchand balun, compound balun and tunable multi-resonant coaxial balun, and NMR probes employing each such balun, and a fine balance and impedance adjustment module and a multi-layer transmission line for use in such NMR probes.

Abstract: A measuring system minimizes the parasitic affects of lumped circuit elements. The system includes two or more in-situ interfaces configured to conductively link a source to an internal load and an external load. The in-situ interfaces are linked to a shunt conductor. Two or more linear and dynamic elements conductively link the in-situ interfaces in series. The dynamic elements are configured to overwhelm the parasitic self-capacitance of an input circuit coupled to at least one of the in-situ interfaces. A shield enclosing at least one of the linear and dynamic elements has a conductive surface to fields and electromagnetic interference. The shield has attenuation ratios that substantially dampen the parasitic capacitance between the linear and dynamic elements that bridge some of the in-situ interfaces.

Abstract: A voltage indicating coupling for metal conduit systems to indicate the presence or absence of voltage on a wire enclosed by a section of electrical conduit for a grounded AC power distribution system. Through the use of two opposing rectifiers the National Electrical Code requirement that the entire metal conduit system be grounded is met. The voltage indicating coupling comprises a liquid crystal display (LCD), a static suppression resistor, two opposing rectifiers for grounding purposes, a plastic block housing and two clamping screws with corresponding wire terminals. At least one “hot” conductor enclosed by the section of electrical conduit is capacitively coupled to the conduit creating a complete circuit through the liquid crystal display (LCD), the static suppression resistor and the opposing rectifiers. The path around the circuit is completed by a ground connection on the grounded part of the conduit system, and the ground connection at the transformer.

Abstract: An exemplary PCB includes a first reference layer, a first signal layer, a second signal layer, and a third signal layer in that order, a first differential pair is arranged in the first signal layer in edge-coupled structure and references the first reference layer, a distance between the first signal layer and the second signal layer is greater than a distance between the first reference layer and the first signal layer, a second differential pair is arranged in the second signal layer and the third signal layer in broad-coupled structure. The PCB has a high density layout of transmission lines.

Abstract: The present invention relates to an electrically conductive transmission line (100) adapted for use in the magnet bore of a magnetic resonance system, the line comprising at least one inductive coupling element (106) for coupling at least two lead segments (104) of the line, wherein the coupling element (106) further comprises a paramagnetic and/or ferromagnetic material (400).

Abstract: An isolator provides bidirectional data transfer for a plurality of communications channels. First and second dies are located on first and second sides of a voltage isolation barrier and have a first and second plurality of digital data input/output pins associated therewith. First circuitry on the first die and third circuitry on the second die serializes a plurality of parallel digital data inputs from the digital data input/output pins onto one link across the barrier and transmits synchronization clock signals associated with the digital data inputs over a link across the barrier. Second circuitry on the second die and fourth circuitry on the first die de-serializes the digital data inputs from the first link onto the second digital data input/output pins and receives the first synchronization clock signal associated with the digital data inputs on the second link.

Abstract: A substrate includes a power plane and a ground plane that are placed apart from and are substantially parallel to each other, and at least one signal line that is placed between the power plane and the ground plane. The ground plane includes a first conductive layer having a first conductivity. The power plane includes a second conductive layer having the first conductivity, and the power plane or the ground plane includes a third conductive layer having a second conductivity lower than the first conductivity. The third conductive layer faces the at least one signal line across a dielectric substance.

Abstract: Common mode (CM) and differential mode (DM) components of multi-phase conducted electromagnetic interference (EMI) noise emanating from electronic circuits such as power converters/inverters are separated by respective coupled inductors connected to each phase of three or more phases and which are coupled to each other differently for CM and DM noise of the respective phases. The inductors of the DM separation unit are coupled such that a substantially ideal zero impedance is presented to DM noise while a high impedance is presented to CM noise. Conversely, the inductors of the CM separation unit are coupled such that a substantially ideal zero impedance is presented to CM noise while a high impedance is presented to DM noise.

Abstract: A differential transmission line connector with little unwanted radiation noise is provided. A connector connects a differential transmission pattern for multiple transmission of a group of three differential signals and a differential transmission cable. The differential transmission pattern is provided with three signal lines, and the differential transmission cable also is provided with three signal lines. In a plane that is perpendicular to the longitudinal direction of the differential transmission pattern and the differential transmission cable, the signal lines are positioned at the apexes of an equilateral triangle.

Abstract: In an integrated circuit having a number of circuit units on a single semiconductor chip, particularly in a system-on-chip integrated circuit including an integrated transceiver, interference between the circuit units is suppressed using on-chip resonant elements. Each resonant element has at least one on-chip capacitor and at least one on-chip conductive line constituting an inductance. The capacitance-inductance combinations are arranged to be resonant at one or more frequencies at which radio frequency energy is generated by the circuit units. The capacitive part of each series resonant combination is formed as a plurality of capacitor elements forming in an array to minimise self-inductance. Also disclosed is a filtering arrangement in which each circuit unit is individually supplied from the tap of a series resistive-capacitance combination to provide low-pass filtering.

Abstract: An electromagnetic-wave suppression structure in a multilayer PCB or package structure is supplied with a power to be used therein by a power distribution network including a power plane and a ground plane. The multilayer PCB and package includes: an electromagnetic-wave suppression structure including an electromagnetic band-gap; and the electromagnetic-wave suppression structure is formed at a specific portion(s) of the power plane and/or the ground plane to suppress noises.

Abstract: A chip on film (COF) trace routing method for EMI reduction includes: providing a flexible circuit board; mounting a chip that has a first signal pad, a second signal pad and a ground pad on the flexible circuit board; and forming a first signal trace, a second signal trace, a first ground trace and a second ground trace on the flexible circuit board. The first signal trace and the second signal trace are electrically connected to the first signal pad and the second signal pad respectively. The first ground trace and the second ground trace are both electrically connected to the ground pad. The first signal trace and the second signal trace are disposed between the first ground trace and the second ground trace. The first ground trace and the second ground trace are immediately adjacent to the first signal trace and the second signal trace respectively.

Abstract: A technique capable of achieving both improvement of mounting density and noise reduction for a semiconductor device is provided. An LSI mounted on a printed wiring board comprises a grounding BGA ball and a power BGA ball to get power supply from the printed wiring board, and the grounding BGA ball and the power BGA ball are arranged closely to each other. A decoupling capacitor is mounted on the printed wiring board and has a first terminal and a second terminal. The grounding BGA ball and the first terminal are connected by a first metal electrode plate, and the power BGA ball and the second terminal are connected by a second metal electrode plate. The first metal electrode plate and the second metal electrode plate interpose a dielectric film having a thickness equal to or smaller than 1 ?m therebetween.

Abstract: In a configuration with at least one RF component disposed in a signal path and including a ground connection to an external circuit environment, a coupling element is provided which electromagnetically couples to at least part of the ground connection and at the same time decouples a coupling current. By suitably feeding this coupling current back into the signal path of the component, the negative influence of the inductance of the ground connection on the signal path is thus compensated for.

Abstract: In an electromagnetic bandgap structure including a plurality of conductive plates and a stitching via part, in which the plurality of conductive plates are placed on a first planar surface, the stitching via part includes a first via having one end part connected to one of the two conductive plates, a second via having one end part connected to the other of the two conductive plates, a spiral connector forming a spirally-shaped serial link structure on at least one vertical planar surface that is perpendicular to the first planar surface, a first conductive pattern connecting one end part of the spiral connector and the other end part of the first via with each other and a second conductive connecting pattern connecting the other end part of the spiral connector and the other end part of the second via with each other.

Abstract: A signal transmission circuit includes a transmitting circuit for outputting a transmitting signal to a transmission line, a parallel circuit including a capacitor and a first resistance connected between an output terminal of the transmitting circuit and the transmission line, and a series circuit including an inductor and a second resistance connected between an output side of the parallel circuit and a ground.

Abstract: A transmission medium includes: first and second lines #1 and #2, which are separated from each other and arranged substantially in parallel with each other; a third line #3, which is alternately entangled and wound around the first and second lines from one direction thereof so as to form a plurality of entangling portions Po to Pn in a longitudinal direction of the first and second lines, respectively; and a fourth line #4, which forms a plurality of entangling portions Po to Pn where the fourth line is alternately entangled and wound around the first and second lines from one direction thereof and a plurality of intersecting portions C1 to Cn where the fourth line intersects the third line internally of the first and second lines in the longitudinal direction of the first and second lines, respectively, wherein, the respective entangling portions of the third and fourth lines are alternately disposed in the longitudinal direction of the first and second lines, respectively, the winding direction of one of

Abstract: A signal processing arrangement (REC) comprises a filter (PPF) with variable filter elements (FE). A switching circuit (SWCT) switches a filter element (FE1) and, subsequently, another filter element (FE3) from a filter state to an adjustment state and back again to the filter state. A filter element that is in the filter state contributes to a suppression of unwanted signals. A filter element that is in the adjustment state affects a characteristic of a measurement signal (Sm). An adjustment circuit (ADCT) adjusts the filter element that is in the adjustment state so that the characteristic of the measurement signal is substantially equal to a target value (TV).

Abstract: A pair of signal transmission lines includes an aggressor line and a victim line parallel to the aggressor line. A plurality of time delay modules is linked in the aggressor line. A plurality of time delay modules is linked in the victim line. A total delay time of the time delay modules of the victim line is equal to a total delay time of the time delay modules of the aggressor line.

Abstract: One or more embodiments of the invention relate to an integrated circuit including a first power supply domain and at least a second power supply domain. Furthermore, the integrated circuit includes a radio frequency element connected between the first power supply domain and the second power supply domain.