Utilizing Long Line Element Patents (Class 333/134)
  • Patent number: 7719385
    Abstract: Disclosed herein are a method and divider for dividing power between and supplying the parts of the power to respective radiation elements of an array antenna, and an antenna device using the divider. The division method includes the steps of dividing power, applied to a feeding unit, into two parts at a first stage of division, and supplying a first of the two parts to at least one central radiation element, and dividing a second of the two parts and supplying sub-parts of the second part to respective peripheral radiation elements, thereby supplying relatively high power to the central radiation element and relatively low power to the peripheral radiation elements.
    Type: Grant
    Filed: August 7, 2007
    Date of Patent: May 18, 2010
    Assignee: Sunwoo Communication Co., Ltd
    Inventors: Jong-In Choi, Young-Jai Kim, Dae-Sung Kim, Yu-Rin Kim
  • Patent number: 7714680
    Abstract: A ceramic monoblock filter including a direct signal path defined by at least four spaced-apart through-hole resonators in combination with ground bars extending between the through-hole resonators and a separate quadruplet cross-coupling alternate signal path defined by two conductive pads located adjacent the first and fourth ones of the through-hole resonators respectively and a separate external bridge member which interconnects and couples the two pads. The bridge member is preferably made of a material having a lower dielectric constant than the block of the filter. In one embodiment, the filter is a monoblock duplexer filter comprising respective transmit and receive sections each including at least four of the through-hole resonators, the ground bars, the two pads, and the bridge member. In the duplexer embodiment, additional through-hole resonators may define shunt zeros.
    Type: Grant
    Filed: May 15, 2007
    Date of Patent: May 11, 2010
    Assignee: CTS Corporation
    Inventors: Reddy Vangala, Tri Dinh
  • Patent number: 7711389
    Abstract: A high frequency module for transmitting and receiving, for example, communication signals of GSM/DCS/PCS/WCDMA systems through a single antenna, is provided at a relatively small size and low cost. The high frequency module includes a diplexer arranged to separate communication signals from the antenna into GSM communication signals in lower frequency bands and POS/DOS/WODMA communication signals in higher frequency bands, a diode switch circuit that is connected to a input and output terminal of the GSM communication signal of the diplexer and is arranged to switch transmission and reception of the GSM communication signal, and a multipoint GaAsIC switch that is connected to the GSM/DCS/PCS/WCDMA communication signals of the diplexer and is arranged to switch transmission and reception of these signals. The high frequency module switches the four types of communication signals by changing the patterns of controls signals VcG, VC1, and Vc2 that are applied to the diode switch circuit and the GaAsIC switch.
    Type: Grant
    Filed: October 21, 2004
    Date of Patent: May 4, 2010
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Koji Furutani, Shinya Watanabe
  • Patent number: 7710219
    Abstract: A multiplexer circuit may include a first-frequency-quarter-wavelength transmission line extending between a junction between a common terminal and a second-frequency terminal, and a first-frequency low-impedance circuit electrically directly connecting the first transmission line to a circuit ground. In some examples, a second-frequency-quarter-wavelength transmission line may extend between the first transmission line and a third-frequency terminal. A second-frequency low-impedance circuit may electrically directly connect the second transmission line to the circuit ground. The first and second transmission lines and the first and second low-impedance circuits may provide a third-frequency transmission line. A further second-frequency low-impedance circuit may electrically couple the second terminal to the first transmission line. A third-frequency low-impedance circuit may electrically couple the second terminal to the circuit ground.
    Type: Grant
    Filed: February 28, 2008
    Date of Patent: May 4, 2010
    Assignee: Endwave Corporation
    Inventor: Edward B. Stoneham
  • Patent number: 7696845
    Abstract: In a dielectric filter (1) for base station communication equipment, a rectangular solid dielectric block (2) is provided with a plurality of ¼ wavelength resonators (3A1-3A4; 3B1-3B4), which are arranged along side planes (2c,2d) of the dielectric block and extend in parallel to each other and to the side planes (2c,2d). The dielectric block (2) is composed of dielectric ceramics having a relative dielectric constant of 5-20, and a size (H) in a direction orthogonally intersecting with the side planes (2c,2d) of the dielectric block (2) is 10-30 mm.
    Type: Grant
    Filed: June 22, 2006
    Date of Patent: April 13, 2010
    Assignee: UBE Industries, Ltd.
    Inventors: Masataka Fujinaga, Hiroshi Nakamura, Yoshiaki Fujiyama
  • Patent number: 7663455
    Abstract: A high frequency module incorporates a layered substrate, a plurality of elements mounted on a top surface of the layered substrate, and a metallic casing that covers these elements. The plurality of elements mounted on the top surface of the layered substrate include a band-pass filter element. The band-pass filter element includes a plurality of conductor layers for band-pass filter and a plurality of dielectric layers for band-pass filter that implement a function of a band-pass filter, but does not include any conductor layer that functions as an electromagnetic shield. A conductor layer for grounding that the layered substrate includes and the casing are each opposed to the band-pass filter element, and thereby function as an electromagnetic shield for the band-pass filter element.
    Type: Grant
    Filed: April 11, 2007
    Date of Patent: February 16, 2010
    Assignee: TDK Corporation
    Inventors: Tomoyuki Goi, Hideaki Fujioka, Masami Itakura, Hideya Matsubara
  • Patent number: 7656254
    Abstract: A chip device having a ground electrode and a plurality of top-surface electrodes on a plate-like dielectric substrate. Two of the top-surface electrodes are connected to the ground electrode via respective short-circuit side-surface electrodes to form quarter wavelength resonant lines. A third top-surface electrode is provided between the two top-surface electrodes and both ends thereof are opened to form a half wavelength resonant line. The two top-surface electrodes each have a parallel portion arranged near and in parallel to the third top-surface electrode and a flexion that curves from the parallel portion, extends toward the remaining of the two top-surface electrodes, and is jump-coupled to the remaining of the two top-surface electrodes. The short-circuit side-surface electrodes are jump-coupled to each other, like the flexions.
    Type: Grant
    Filed: June 4, 2008
    Date of Patent: February 2, 2010
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yasunori Takei, Motoharu Hiroshima, Hideyuki Kato
  • Patent number: 7636025
    Abstract: A duplexer that includes an input filter (Rx filter), an output filter (Tx filter), and one or more of an isolation line and a delay line is disclosed. The Rx and Tx filters are microwave (MW) resonators and include continuous, internally metallized holes in a ceramic body. The ceramic body includes a metal coating substantially covering the external surfaces of the ceramic body except for an end face and one or more recesses on a bottom side of the ceramic body. An output of the Rx filter on the bottom side of the ceramic body is electrically connected to a balun. The ceramic body has a first height in an area of the Tx filter and a second height in an area of the Rx filter, the second height being less than the first height.
    Type: Grant
    Filed: November 30, 2004
    Date of Patent: December 22, 2009
    Assignee: EPCOS AG
    Inventors: Isabel Gavela, Alenko Lic, Bernhard Reichel
  • Patent number: 7619496
    Abstract: A resonator/filter adapted for direct surface mounting to the surface of a printed circuit board. The resonator/filter comprises a block of dielectric material including at least one resonator through-hole extending therethrough and respective top, bottom and side surfaces defining respective regions of dielectric material covered with conductive material. The top block surface defines at least a first conductive region. A second conductive region on the bottom surface of the block defines an input/output contact which allows the filter to be mounted on the board with the bottom filter surface seated thereon, thus providing a direct ground contact between the board and the resonator through-hole for improved attenuation performance particularly at higher frequencies. A plurality of transmission line embodiments electrically interconnect the first and second conductive regions.
    Type: Grant
    Filed: October 24, 2007
    Date of Patent: November 17, 2009
    Assignee: CTS Corporation
    Inventor: Alexandre Rogozine
  • Patent number: 7609130
    Abstract: In a high-frequency module, mounting lands arranged to mount at least one filter device having at least one set of an unbalanced terminal and two balanced terminals are provided at one side of a substrate top surface, and mounting lands arranged to mount at least one element electrically connected to the filter device are arranged at the opposite side. At least two of a plurality of connection terminals provided on a substrate bottom surface are respectively connected to conductor patterns connected to via-hole conductors penetrating the substrate within a mounting area for mounting the filter device via connection lines and are arranged at a pitch which is less than the pitch of the via-hole conductors.
    Type: Grant
    Filed: June 5, 2008
    Date of Patent: October 27, 2009
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Taturo Nagai
  • Patent number: 7598824
    Abstract: A circuit for combining/splitting first and second RF signals having different wavelengths of x and y, respectively, the circuit comprising: (a) first and second transmission portions coupled at an intersection, the first transmission portion comprising at least two intersecting transmission lines, each having a length which is an odd multiple of about ¼ y, the second transmission portion comprising at least two intersecting transmission lines, each having a length which is an odd multiple of about ¼ x; and (b) first, second and third ports, the first port located at the first transmission portion, the second port located at the intersection of the first and second transmission portions, and the third port being located at the second transmission portion, the first and second ports being electrically coupled, and the second and third ports being electrically coupled.
    Type: Grant
    Filed: November 14, 2006
    Date of Patent: October 6, 2009
    Assignee: M/A-COM Technology Solutions Holdings, Inc.
    Inventor: Clyde Maynord Callewaert
  • Publication number: 20090231059
    Abstract: An antenna feed coupling structure of a duplexer is disclosed to include a base defining a detoured resonance cavity and a T-shaped feed-in cavity perpendicularly intersecting the resonance cavity and a signal input port in connection with the head of the feed-in cavity, a cover closing the base, and adjustment rods mounted in the base and suspending in the resonance cavity and the feed-in cavity. The adjustment rods include two feed-in adjustment rods and two coupling structure adjustment rods suspending in the intersected area between the resonance cavity and the feed-in cavity and respectively kept in horizontal and in vertical relative to the resonance cavity and rotatable inwards and outwards to adjust the feed-in amount and coupling structure amount of the antenna feed coupling structure respectively.
    Type: Application
    Filed: March 12, 2009
    Publication date: September 17, 2009
    Applicant: UNIVERSAL MICROWAVE TECHNOLOGY INC.
    Inventors: JEN-TI PENG, CHIEN-CHIH LEE
  • Patent number: 7583237
    Abstract: A multilayered substrate includes a first layer and at least one second layer laminated on one face of the first layer. A first component is mounted on the other face of the first layer. A second component is comprised of a pattern formed on at least one second layer, and electrically connected to the first component through a via hole.
    Type: Grant
    Filed: January 30, 2007
    Date of Patent: September 1, 2009
    Assignee: Mitsumi Electric Co., Ltd.
    Inventors: Junichi Noro, Makoto Abe
  • Patent number: 7579929
    Abstract: A small-sized, high-performance transmission circuit is provided which avoids degradation in transmission line characteristics caused by coupling, due to a transmission line and a leader electrode to an external electrode which are oppositely facing, of the electromagnetic field induced by the transmission line and the electromagnetic field induced by the leader electrode. In order to attain the aforementioned object, the present invention comprises a first shield layer which is a first ground electrode, a second shield layer which is a second ground electrode, and a spiral-shaped transmission line facing the first shield layer and the second shield layer which is disposed between the first shield layer and the second shield layer. The spiral portion of the transmission line, when viewed from the top face or the bottom face of the transmission line, is disposed on the inside of the first shield layer and the second shield layer.
    Type: Grant
    Filed: February 27, 2006
    Date of Patent: August 25, 2009
    Assignee: Hitachi Media Electronics Co., Ltd.
    Inventors: Osamu Hikino, Masashi Ohki, Hideaki Sunayama
  • Patent number: 7579930
    Abstract: A high-frequency module is integrally formed from at least some circuit components defining a first wireless system using a first frequency band and at least some circuit components defining a second wireless system using a second frequency band. The high-frequency module includes a multilayer substrate including a plurality of stacked dielectric layers, a first terminal group disposed on a first surface of the multilayer substrate, where a plurality of terminals are arranged along a first side of four sides defining the first surface, and a second terminal group disposed on the first surface, where a plurality of terminals are arranged along a second side that is different from the first side. The first terminal group includes a first antenna terminal of the first wireless system whereas the second terminal group includes a second antenna terminal of the second wireless system.
    Type: Grant
    Filed: August 24, 2007
    Date of Patent: August 25, 2009
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Toshihiro Hosokawa, Kazuaki Higashibata, Tsuyoshi Suesada
  • Patent number: 7565116
    Abstract: A high frequency module comprises a layered substrate. Inside the layered substrate, a reception diplexer for processing reception signals and a transmission diplexer for processing transmission signals are provided. The reception diplexer and the transmission diplexer are located in two different regions inside the layered substrate. A conductor portion that is connected to the ground and that electromagnetically separates the reception diplexer and the transmission diplexer from each other is provided between the two regions inside the layered substrate. The conductor portion is formed by using a plurality of through holes.
    Type: Grant
    Filed: November 8, 2005
    Date of Patent: July 21, 2009
    Assignee: TDK Corporation
    Inventors: Yuichiro Okuyama, Hideya Matsubara, Shinya Nakai, Masashi Iwata
  • Patent number: 7561011
    Abstract: A dielectric device includes a dielectric substrate and a resonator unit. The resonator unit includes first and second holes. The first hole opens on a first surface of the dielectric substrate and extends toward a second surface opposite to the first surface. A first internal conductor is provided inside the first hole. The second hole opens on a third surface of the dielectric substrate, extends toward a fourth surface opposite to the third surface, and is connected to the first hole. A second internal conductor is provided inside the second hole with one end connected to an external conductor film on the third surface and the other end connected to the first internal conductor. The first hole has a recess opposed to a junction with the second hole. The first internal conductor in the recess is opposed to the external conductor film on the fourth surface across the dielectric substrate.
    Type: Grant
    Filed: September 20, 2006
    Date of Patent: July 14, 2009
    Assignee: TDK Corporation
    Inventors: Osamu Takubo, Kouji Tashiro, Kazuyoshi Terao, Ryohei Nakano
  • Patent number: 7545235
    Abstract: A unitary resonator assembly for use in dielectric resonator filters and multiplexers. The unitary resonator assembly comprises a plurality of resonators joined by bridges, where the resonators and bridges are all constructed from a single piece of a dielectric material. The unitary resonator assemblies may be used in conjunction with unitary mounting structures that support a unitary resonator assembly in a filter or multiplexer. Also disclosed are 2-pole, 4-pole, and triplet filters implementing a unitary resonator assembly in conjunction with a unitary mounting structure, and a diplexer implementing a unitary resonator assembly in conjunction with a unitary mounting structure.
    Type: Grant
    Filed: December 7, 2006
    Date of Patent: June 9, 2009
    Inventors: Raafat R. Mansour, Rui Zhang
  • Patent number: 7541893
    Abstract: A duplexing filter suitable for use in a mobile communication system. The filter has a core of dielectric material with several through holes that define resonators. The core has metallized surfaces except for a portion of the top and bottom surfaces. At least one metallized resonator pad surrounds through holes on the top and bottom surfaces. A metallized serpentine region extends from the resonator pad on the bottom surface toward a side surface of the core. The metallized serpentine region causes attenuation of a third harmonic frequency.
    Type: Grant
    Filed: April 4, 2006
    Date of Patent: June 2, 2009
    Assignee: CTS Corporation
    Inventor: Tao Ye
  • Patent number: 7541892
    Abstract: According to one exemplary embodiment, a three-way splitter includes a printed element and a resistive network comprising discrete resistors. A first printed branch, second printed branch, and third printed branch distribute a received communication signal to respective outputs having substantially the same phase, frequency, and impedance. Each printed branch includes a number of substantially ninety-degree angles. In one embodiment, the printed branches are quarter wavelength transmission lines in a frequency range of 1.5 GHz. In one embodiment, the three-way splitter consumes less than one square inch of surface area on a printed circuit board, and can be used in a satellite receiving system, for example. In this embodiment, the three-way splitter is utilized for frequencies in the range of approximately 900 MHz to 2.2 GHz.
    Type: Grant
    Filed: March 9, 2007
    Date of Patent: June 2, 2009
    Assignee: Broadcom Corporation
    Inventor: Jose Ignacio Gorostegui
  • Patent number: 7515018
    Abstract: An acoustic resonator is described, the acoustic resonator comprising a stack of a first and a second piezoelectric body, wherein said first and second piezoelectric bodies have substantially the same spatial piezoelectric orientation, an intermediate intermediate electrode being arranged between said first and said second piezoelectric body forming a first terminal of said acoustic resonator, and first and second electrodes, wherein said first electrode is arranged such that said first piezoelectric body is arranged between said first electrode and said intermediate electrode, wherein said second electrode is arranged such that said second piezoelectric body is arranged between said second electrode and said intermediate electrode, and wherein said first and said second electrode are electrically connected to each other forming a second terminal of said acoustic resonator.
    Type: Grant
    Filed: August 31, 2006
    Date of Patent: April 7, 2009
    Inventors: Martin Handtmann, Jyrki Kaitila, Andreas Meckes, Lueder Elbrecht
  • Patent number: 7499678
    Abstract: A compact, inexpensive antenna sharing device meeting requirements in terms of transmitter distortion characteristic and ESD characteristic is provided which separates and combines signals transmitted and received in first to third signal bands and which thereby enables an antenna terminal to be shared as a common terminal. It includes a diplexer realizing an attenuation characteristic for protection against ESD, a compound semiconductor switch with an IIP3 of 66 dBm or more, and an inexpensive PIN diode switch.
    Type: Grant
    Filed: December 19, 2005
    Date of Patent: March 3, 2009
    Assignee: Hitachi Media Electronics Co., Ltd.
    Inventors: Nobuhiko Shibagaki, Mitsutaka Hikita, Kazuyuki Sakiyama, Osamu Hikino
  • Publication number: 20090051463
    Abstract: A circuit for combining/splitting at least two RF signals comprising: (a) at least two or more transmission portions coupled at an intersection, the intersection having a common port for inputting or outputting a combination of the at least two RF signals; (b) each transmission portion extending from the intersection to a port for inputting or outputting a selection of signals from the combination, and comprising at least one set of intersecting transmission lines; (c) each set of intersecting transmission lines rejecting a particular signal of the combination; and (d) each intersecting transmission line of a given set having a length of about an odd multiple of a quarter wavelength of the particular signal which is rejected by the given set.
    Type: Application
    Filed: August 1, 2008
    Publication date: February 26, 2009
    Applicant: M/A-Com, Inc.
    Inventor: Clyde Maynord Callewaert
  • Patent number: 7489215
    Abstract: The invention relates to a high frequency filter of coaxial construction, comprising an outer conductor housing with a housing base and a housing wall, whereby several resonators are embodied in the outer conductor housing, each comprising an inner conductor tube, electrically-coupled to the housing base. At least one part of adjacent resonators are electrically-coupled to each other by means of at least one coupling opening in the outer conductor housing. Said filter is characterized in that one or more recesses are embodied in the housing base, between at least one part of the inner conductor tube of adjacent resonators.
    Type: Grant
    Filed: October 6, 2005
    Date of Patent: February 10, 2009
    Assignee: Kathrein-Werke KG
    Inventors: Franz Rottmoser, Dietmar Sieraczewski, Wilhelm Watzenberger
  • Patent number: 7482898
    Abstract: A dielectric filter with an ultra hetero-axial structure is provided with open end-face electrodes. By increasing the capacitance between each open end-face electrode and an external conductor greater than that generated between the open end-face electrodes adjacent to each other, the inductive coupling between two resonators due to neighboring resonator holes is increased.
    Type: Grant
    Filed: December 21, 2006
    Date of Patent: January 27, 2009
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Masayuki Atokawa, Hitoshi Tada, Takayoshi Yui, Hideyuki Kato
  • Patent number: 7479849
    Abstract: A dielectric resonator device including a circuit substrate with a top surface provided with transmission lines, and a bottom surface provided with a ground electrode; a dielectric substrate with opposite surfaces that are respectively provided with electrodes having circular openings so as to form a TE010-mode resonator; and an insulating layer disposed between the ground electrode of the circuit substrate and the electrodes of the TE010-mode resonator. The TE010-mode resonator is attached to the circuit substrate with an insulative adhesive. Accordingly, a current path remains unchanged even if the circuit substrate and the TE010-mode resonator are partially disengaged from each other, thereby achieving stable characteristics.
    Type: Grant
    Filed: September 27, 2004
    Date of Patent: January 20, 2009
    Assignee: Murata Manufacturing Co., Ltd
    Inventors: Yoshihiro Himi, Hiroshi Nishida, Koichi Sakamoto
  • Publication number: 20090000106
    Abstract: A method for forming a vertical coupling structure for non-adjacent resonators is provided to have a first and a second resonators, a dielectric material layer, a first and a second high-frequency transmission lines and at least one via pole. The first and the second resonators respectively have a first and a second opposite metal surfaces. The dielectric material layer is disposed between the opposite second metal surfaces of the first and the second resonators. The first and the second transmission lines are respectively arranged at sides of the first metal surfaces of the first resonator and the second resonator. The first high-frequency transmission line is vertically connected to the second high-frequency transmission line by the via pole.
    Type: Application
    Filed: January 7, 2008
    Publication date: January 1, 2009
    Applicants: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, NATIONAL TAIWAN UNIVERSITY
    Inventors: Chia-Cheng Chuang, Ruey-Beei Wu, Tze-Min Shen
  • Patent number: 7468643
    Abstract: Disclosed is a bandpass filter comprising a first resonator 1 to a sixth resonator 6 having lengths of basically ¼ wavelength, an input section IN connected to an ungrounded end of the first resonator, and an output section OUT connected to an ungrounded end of the sixth resonator, wherein the second to fifth resonators 2-5 are electromagnetically coupled with each other, the second and the third resonators are respectively coupled to the first resonator via the first and the second capacitances C1,C2, the third and the fourth resonators are respectively coupled to the sixth resonator via the third and the fourth capacitances C3,C4, and the input section IN and output section OUT are coupled to the first resonator and sixth resonator through an input and output capacitances C5, C6, respectively. This bandpass filter can be a small size, low loss filter suitable for UWB (Ultra Wide Band).
    Type: Grant
    Filed: April 28, 2006
    Date of Patent: December 23, 2008
    Assignee: Kyocera Corporation
    Inventors: Hiroshi Ninomiya, Katsurou Nakamata
  • Patent number: 7463865
    Abstract: Method and apparatus are provided for compensation of an RF link between a transmitter and amplifier of a communication system. The apparatus comprises a signal source coupled to the transmitter for providing an RF test signal of a first magnitude to the RF link, a test signal measuring apparatus at the RF input of the amplifier for measuring a second magnitude of the test signal reaching the RF input of the amplifier through the RF link, and an electronically adjustable attenuator serially coupled with the RF link and responsive to differences between the first and second magnitudes so as to provide attenuation in an RF communication signal passing into the amplifier from the RF link such that the sum of RF signal loss in the link and the attenuator has a predetermined value.
    Type: Grant
    Filed: September 28, 2005
    Date of Patent: December 9, 2008
    Assignee: Honeywell International Inc.
    Inventors: David L. Reese, Gregory L. Carlile, Curt A. Gray
  • Patent number: 7459993
    Abstract: A resonator, a band-pass filter, and a duplexer are provided. In the resonator, a first electrode is formed of a nonmagnetic conductive material. A ferromagnetic fixed layer is disposed on the first electrode and has a magnetization direction which is fixed. A nonmagnetic conductive layer is disposed on the ferromagnetic fixed layer. A ferromagnetic free layer is disposed on the nonmagnetic conductive layer and has a magnetization direction which varies depending on an external magnetic field. A second electrode is disposed on the ferromagnetic free layer and comprises a nonmagnetic conductive material. The band-pass filter and the duplexer are configured using the resonator. The band-pass filter and the duplexer can operate in a high-frequency range and be miniaturized. The bandwidth of the band-pass filter and the duplexer can be adjusted and the band-pass filter and the duplexer can be formed in one body with an integrated circuit.
    Type: Grant
    Filed: December 29, 2006
    Date of Patent: December 2, 2008
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kook-hyun Sunwoo, Yong-su Kim
  • Patent number: 7449977
    Abstract: An electrical circuit includes an antenna connection for receiving a signal, a first signal path connected to the antenna connection, a filter arranged in the first signal path, and a first and a second gate circuit connected in series. The first gate circuit is connected to the antenna connection, and the second gate circuit is arranged between the first gate circuit and the filter. The first and second gate circuits each includes an impedance transformer arranged in the first signal path and a shunt circuit connected to ground. The shunt circuit includes a switch element and a capacitor. When the switch element is enabled, the shunt circuit defines a ground path through which at least part of the signal can pass to ground.
    Type: Grant
    Filed: August 24, 2005
    Date of Patent: November 11, 2008
    Assignee: EPCOS AG
    Inventors: Jens Schöning, Peter Hagn
  • Publication number: 20080272855
    Abstract: It is possible to generate an additionally attenuation pole in a laminate type band pass filter without adding an attenuation circuit and improve the attenuation characteristics of the laminate type band pass filter by independently controlling the frequencies of the attenuation poles. A diplexer is realized by using at least such a filter.
    Type: Application
    Filed: April 29, 2008
    Publication date: November 6, 2008
    Inventors: Syouji Ono, Tetsuo Suehiro, Jyunichi Ichikawa, Keiji Takagi, Manabu Sato
  • Patent number: 7436270
    Abstract: A duplexer assembly is provided and includes a circuit board and a duplexer connected to the circuit board by a joint material, wherein the joint material provides a joint thickness of at least about 10 mils.
    Type: Grant
    Filed: December 20, 2005
    Date of Patent: October 14, 2008
    Assignee: Delphi Technologies, Inc.
    Inventors: Joseph M. Ratell, Jr., Michael T. Dolce
  • Patent number: 7429962
    Abstract: A planar multi-layer transreflector for generating collimated coherent energy comprises one or more of insulating layers between two or more metallic layers. The transreflector substantially reflects a cross-polarized component of an incident millimeter-wave signal and substantially transmits the remaining portions of the incident millimeter-wave signal. Each of the metallic layers comprises a plurality of rectangles arranged in a grid pattern radially varying in size within circumferential regions. The reflected cross-polarized component may be substantially orthogonal to the transmitted remaining portions. A substantially collimated and coherent wavefront comprising the remaining portions may be produced in a first direction, and substantially collimated and coherent wavefront comprising the cross-polarized components may be produced in a second direction.
    Type: Grant
    Filed: October 11, 2007
    Date of Patent: September 30, 2008
    Assignee: Raytheon Company
    Inventor: Jonathan Lynch
  • Publication number: 20080231391
    Abstract: A dielectric device includes a dielectric substrate and a resonator unit. The resonator unit includes first and second holes. The first hole opens on a first surface of the dielectric substrate and extends toward a second surface opposite to the first surface. A first internal conductor is provided inside the first hole. The second hole opens on a third surface of the dielectric substrate, extends toward a fourth surface opposite to the third surface, and is connected to the first hole. A second internal conductor is provided inside the second hole with one end connected to an external conductor film on the third surface and the other end connected to the first internal conductor. The first hole has a recess opposed to a junction with the second hole. The first internal conductor in the recess is opposed to the external conductor film on the fourth surface across the dielectric substrate.
    Type: Application
    Filed: September 20, 2006
    Publication date: September 25, 2008
    Applicant: TDK Corporation
    Inventors: Osamu Takubo, Kouji Tashiro, Kazuyoshi Terao, Ryohei Nakano
  • Publication number: 20080204164
    Abstract: For the cost effective implementation of negative-index refraction, an anisotropic hyperbolic planar metamaterial comprising a first set of substantially parallel, unloaded and coplanar transmission lines, said first set being spaced with a periodicity dy a second set of substantially parallel, unloaded and coplanar transmission lines, said second set being spaced with a periodicity dx, further being coplanar and substantially orthogonal with said first set of transmission lines, wherein the periodicities of said first set and second set of transmission lines being governed by the relationship ?x(fr)dx+?y(fr)dy=2?, where: ?x and ?y are the intrinsic propagation constants of electromagnetic waves of frequency fr propagating along the first and second set of transmission lines, respectively.
    Type: Application
    Filed: August 9, 2005
    Publication date: August 28, 2008
    Applicant: ONTARIO CENTRES OF EXCELLENCE INC.
    Inventor: George V. Eleftheriades
  • Patent number: 7400221
    Abstract: In a semi-coaxial cavity resonator in which an inner conductor is fixed to an outer conductor with a screw, an inner cavity where the inner conductor does not engage with the screw is provided to extend from a bearing surface of the inner conductor to a region of an internal thread hole formed inside the inner conductor which does engage with the screw, thereby providing a region where the screw is deformable. Accordingly, deviation in perpendicularity of the screw relative to the bearing surface, deviation in perpendicularity of the internal thread hole of the inner conductor, and the like, may be accommodated by the deformation of the screw, and the bearing surface of the inner conductor is brought into contact with a bottom surface of an outer conductor evenly and reliably, thereby suppressing intermodulation distortion from occurring.
    Type: Grant
    Filed: November 1, 2006
    Date of Patent: July 15, 2008
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Hiroyuki Kubo, Hirokazu Nakae
  • Patent number: 7397330
    Abstract: A filter includes a resonant unit which has a plurality of resonators respectively formed of each microstrip line and connected in cascade with one another, and a coupling unit which has at least one inter-resonator coupling of the resonant unit in an area within a range of ±45° (?-wavelength) in an electrical length from a voltage maximum point at a intermediate of the microstrip line.
    Type: Grant
    Filed: October 31, 2006
    Date of Patent: July 8, 2008
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hiroyuki Kayano, Noritsugu Shiokawa, Mutsuki Yamazaki
  • Patent number: 7397325
    Abstract: A method for configuring a microwave multiplexing network having a first channel filter and a second channel filter and an interconnect in order to improve channel performance. The top ends of the first and second channel filters are coupled to the closer of the top and bottom surfaces of the interconnect according to interconnect spacing values and filter to interconnect values. Interconnect values and filter to interconnect values are determined by selecting interconnect spacing values and filter to interconnect values to ensure that a pole is formed causing an additional real reflection zero to be brought into the passband of the microwave multiplexing network thereby increasing the filter order by one. Then interconnect spacing values and filter to interconnect values as well as the internal filter dimensions are selected to ensure that the return loss of the microwave multiplexing network is less than a predetermined return loss level.
    Type: Grant
    Filed: February 10, 2006
    Date of Patent: July 8, 2008
    Assignee: COM DEV International Ltd.
    Inventors: Ming Yu, Ying Wang
  • Patent number: 7397324
    Abstract: A multilayer chip-type triplexer is provided. It uses four-session matching transmission lines to integrate three band-pass filters at different frequency bands for simplifying triplexer design. A band-pass filter may be composed of a two-stage combline band-pass filter. The transmission zero generated by the two-stage combline band-pass filter is to increase the isolation and performance of the triplexer. The triplexer uses low-loss materials to reduce the insertion loss of the circuit Moreover, a multilayer structure is adopted to minimize the size of the triplexer. The triplexer is applicable to multiband radio-frequency modules, and meets the multimodule requirement for wireless communication products.
    Type: Grant
    Filed: September 15, 2005
    Date of Patent: July 8, 2008
    Assignee: Industrial Technology Research Institute
    Inventors: Ching-Wen Tang, Sheng-Fu You
  • Publication number: 20080157899
    Abstract: An improved high frequency filter displays the following features: the high frequency filter displays transmission behavior with a coupling impedance resonance having at least one blocking point at a frequency, the blocking point at the frequency being adjustable by presetting and/or preselecting a defined capacitive and inductive coupling between two coaxial resonators, one immediately following the other on a signal path.
    Type: Application
    Filed: December 27, 2006
    Publication date: July 3, 2008
    Applicant: Kathrein-Werke KG
    Inventor: Wilhelm Weitzenberger
  • Patent number: 7394334
    Abstract: A substantially circular electrode 3 is arranged on a surface 2A of a dielectric substrate 2 of a TM010-mode resonator 1. A coupling line 5, which extends along a diameter of the substantially circular electrode 3, is arranged on a back surface 2B of the dielectric substrate 2, and back-surface electrodes 7 are arranged with the coupling line 5 interposed therebetween in the width direction. Furthermore, signal lines 11 and ground electrodes 13 are arranged on a surface of an external substrate 10 in positions other than portions facing the coupling line 5 of the TM010-mode resonator 1. The signal lines 11 are connected to the coupling line 5 of the TM010-mode resonator 1 and the ground electrodes 13 is connected to the back-surface electrodes 7.
    Type: Grant
    Filed: June 12, 2007
    Date of Patent: July 1, 2008
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Takeshi Okano
  • Patent number: 7378924
    Abstract: A filter is provided which comprises a single dielectric, and a line conductor and a ground conductor disposed on the dielectric. The line conductor includes first and second line conductor sections having opposed portions defining an open gap therebetween to form a capacitive coupling section. The edge lines of the opposed portions of the first and second conductor sections defining the open gap therebetween are substantially elongated relative to the line width of the corresponding conductor sections. The thus constructed filter is capable of suppressing a variation in the normalized J-inverter value even if dimensional errors relative to the design specifications due to overetching or underetching involved during the manufacture.
    Type: Grant
    Filed: February 1, 2005
    Date of Patent: May 27, 2008
    Assignee: NTT DoCoMo, Inc.
    Inventors: Daisuke Koizumi, Kei Satoh, Shoichi Narahashi
  • Patent number: 7352260
    Abstract: Provided is a microwave and millimeter wave transceiver package technology that can unify the transceiver composed of an amplifier, a filter and a mixer into a low temperature co-fired ceramic (LTCC) module package by using an LTCC method utilizing a multilayer dielectric substrate, thereby achieving miniaturization, a loss reduction and moderate price. The transceiver includes a plurality of cavities arrayed in a multilayer substrate, an amplifier and a mixer mounted in the cavities and a filter provided with a strip line between the amplifier and the mixer.
    Type: Grant
    Filed: June 28, 2005
    Date of Patent: April 1, 2008
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Bong-Su Kim, Kwang-Seon Kim, Ki-Chan Eun, Myung-Sun Song
  • Patent number: 7343137
    Abstract: The invention relates to a circuit comprising an antenna input (1), a signal input (2) and a signal output (3), and a switching unit (4), wherein the antenna input (1) is connected to a first protection device (6) against electrostatic discharges, said first protection device (6) being a band-pass filter in a ?-configuration. The advantage of the first protection device (6) is that it eliminates the need for a band-pass filter in the front end module, when used in a mobile telephone. Furthermore, the band-pass filter has a very good filtering characteristic, enabling ESD-related disturbances to be effectively suppressed. The invention also relates to a switching module and to the use of the same.
    Type: Grant
    Filed: September 27, 2002
    Date of Patent: March 11, 2008
  • Patent number: 7321278
    Abstract: A low profile ceramic filter for connection to an antenna, a transmitter and a receiver. The filter filters an incoming signal from the antenna to the receiver and an outgoing signal from the transmitter to the antenna. The filter has a ceramic core with through-holes that extend between sides of the core. The through-holes form coupled resonators and trap resonators. Two trap resonators are located at ends of the block, and two of the trap resonators are located in a central portion of the block. The coupled resonators are located between the end trap resonators and the trap resonators in the central portion. The trap resonators have a resonant frequency that is outside of the desired passband such that trap zeros or poles are provided.
    Type: Grant
    Filed: April 7, 2004
    Date of Patent: January 22, 2008
    Assignee: CTS Corporation
    Inventor: Reddy Vangala
  • Publication number: 20070279150
    Abstract: A ceramic monoblock filter including a direct signal path defined by at least four spaced-apart through-hole resonators in combination with ground bars extending between the through-hole resonators and a separate quadruplet cross-coupling alternate signal path defined by two conductive pads located adjacent the first and fourth ones of the through-hole resonators respectively and a separate external bridge member which interconnects and couples the two pads. The bridge member is preferably made of a material having a lower dielectric constant than the block of the filter. In one embodiment, the filter is a monoblock duplexer filter comprising respective transmit and receive sections each including at least four of the through-hole resonators, the ground bars, the two pads, and the bridge member. In the duplexer embodiment, additional through-hole resonators may define shunt zeros.
    Type: Application
    Filed: May 15, 2007
    Publication date: December 6, 2007
    Inventors: Reddy Vangala, Tri Dinh
  • Patent number: 7298230
    Abstract: The duplexer includes a transmit filter connected between an antenna terminal and a transmit terminal, and a splitter circuit and a receive filter connected in series between the antenna terminal and the receive terminal. The splitter circuit includes at least one phaseline connected between the antenna terminal and the receive filter and at least one resonator connected in parallel with the phaseline. According to the present invention, the length of the phaseline can be made shorter, so the entire duplexer can be made more compact in size. In addition, an inductors are preferably connected between each ends of the phaseline and the resonator. In this case, the inductance of a wire or via formed within the package can be used.
    Type: Grant
    Filed: February 24, 2004
    Date of Patent: November 20, 2007
    Assignee: TDK Corporation
    Inventor: Kenji Inoue
  • Patent number: 7283017
    Abstract: Planar band pass filter includes several planar resonators (Ri) arrange parallely, such that the input (R1) and output (R5) planar resonators are connected to input (11) and output (12) feed lines, respectively, and the connections between the input (R1) and output (R2) planar resonators and the input (11) and output (12) feed lines are made by means of high impedance lines (14), respectively, such that the direction of propagation of the signal from the input to the output of the filter remains invariable between the feed lines, the high impedance lines (14), the corresponding resonators, and the rest of the filter resonators.
    Type: Grant
    Filed: August 20, 2004
    Date of Patent: October 16, 2007
    Assignee: Thales
    Inventors: Juan Sebastian Galaz Villasante, Ana Isabel Daganzo Eusebio, Manuel Jesus Padilla Cruz, Magdalena Salazar Palma, Sergio Llorente Romano, Alejandro Garcia Lamperez
  • Patent number: RE40465
    Abstract: A ?/2 resonator comprises an inner conductor formed hole having an inner conductor with both open-ends, formed therein, and ?/4 resonators comprise inner conductor formed holes having inner conductors with one short-circuited ends and the other open ends, respectively. The resonators are coupled, whereby a terminal electrode connected to the vicinity of the one open end of one of the ?/4 resonators functions as an unbalanced terminal, and terminal electrodes connected to both open ends of the ?/2 resonator function as balanced terminals.
    Type: Grant
    Filed: January 22, 2003
    Date of Patent: August 26, 2008
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Motoharu Hiroshima, Katsuhito Kuroda, Shohachi Nishijima, Hideyuki Kato, Haruo Matsumoto