Feedthrough Type Patents (Class 333/182)
  • Patent number: 11296450
    Abstract: An electrical connector assembly includes a receptacle connector and a plug connector adapted to be mated with each other. The receptacle connector includes a contact unit forwardly assembled into the receptacle housing and having a plurality of receptacle contacts and a common mode choke electrically connected together. The plug connector includes a resilient latch associated with the plug shell and received within an enlarged area of a circumferential space formed between the receptacle shell and the receptacle housing.
    Type: Grant
    Filed: July 27, 2020
    Date of Patent: April 5, 2022
    Assignees: FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD., FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventor: Terrance F. Little
  • Patent number: 11243097
    Abstract: A rotary encoder includes a rotor, a stator, and a casting compound. The casting compound has a first surface facing the stator. The first surface has a first predetermined shape and is fixed in relation to the stator. The casting compound has a second surface facing away from the stator, the second surface having a second predetermined shape.
    Type: Grant
    Filed: September 27, 2019
    Date of Patent: February 8, 2022
    Assignee: LEINE & LINDE AB
    Inventors: Richard Arnstein, Per Andréason
  • Patent number: 11210446
    Abstract: In some embodiments, an apparatus can include a printed circuit board (PCB) that has layers and includes a first portion and a second portion. The first portion can have a data port and a power port. A first layer is associated with data of the first portion of the PCB, and a second layer is associated with power of the first portion of the PCB. The second portion can have a data port and a power port. A third layer is associated with data of the second portion, and a fourth layer is associated with power of the second portion. The first portion or the second portion can have vias defining an electromagnetic interference (EMI) shield. The apparatus can include a power filter and a data filter that can, respectively, isolate power and data of the first portion from the second portion.
    Type: Grant
    Filed: February 8, 2021
    Date of Patent: December 28, 2021
    Assignee: Management Services Group, Inc.
    Inventors: Thomas Scott Morgan, Martin Mayer, Steve Yates
  • Patent number: 11202375
    Abstract: A device that includes a substrate including a plurality of metal layers, and a plurality of dielectric layers. The device further includes a first passive component including a first terminal, a second terminal, and a first body, mounted to the substrate on one of the plurality of metal layers. The first terminal is coupled to a first ground signal and the second terminal is coupled to a second ground signal such that the first passive component is shorted.
    Type: Grant
    Filed: February 19, 2020
    Date of Patent: December 14, 2021
    Assignee: QUALCOMM Incorporated
    Inventors: Yu-Chun Liu, Peter Mark Davulis
  • Patent number: 11177318
    Abstract: Various embodiments may provide a semiconductor package. The semiconductor package may include a substrate including a via hole. The semiconductor package may also include a chip attached to the substrate. The semiconductor package may further include a prefabricated ferromagnetic pin having a first portion held by the via hole, a second portion extending from a first end of the first portion, and a third portion extending from a second end of the first portion opposite the first end. The semiconductor package may also include a first magnetic shield structure attached to or extended from the second portion of the prefabricated ferromagnetic pin. The semiconductor package may further include a second magnetic shield structure attached to or extended from the third portion of the prefabricated ferromagnetic pin, such that at least a portion of the chip is between the first magnetic shield structure and the second magnetic shield structure.
    Type: Grant
    Filed: January 28, 2019
    Date of Patent: November 16, 2021
    Assignee: Agency for Science, Technology and Research
    Inventors: Teck Guan Lim, Hideaki Fukuzawa, Hang Liu
  • Patent number: 11147978
    Abstract: Implantable medical devices have a feedthrough from the device to the outside world to pass electrical current from electronics inside the implant to the patient or vice versa. A plurality of sensors and/or signal wires must connect to the feedthrough and implant in living tissue. Chemical and physical forces work against the wire connections. Embodiments of the present invention include a biocompatible cap or top, shaped to attach onto a rim of the feedthrough device. One or more wire bundle ports are included on the cap. One or two layers of a sealant (e.g., epoxy) can be injected under the cap. A first layer can rigidly protect the wire bonds, and an elastomeric silicone can cover the epoxy for a flexible protector. Other embodiments include an implant housing with a recess for the feedthrough; a top can protect the recess. One or more sealants can cover the feedthrough.
    Type: Grant
    Filed: October 30, 2019
    Date of Patent: October 19, 2021
    Assignee: WYSS CENTER FOR BIO AND NEURO ENGINEERING
    Inventors: Dana D. Tompkins, Christopher D. Gongora, Achim Kitschmann, Jennifer Losasso-Tompkins, Claude Clément
  • Patent number: 11094454
    Abstract: A noise reduction unit includes a conductor having a winding portion and a ring-shaped core which is made of a magnetic material and is inserted through the winding portion, and a housing which houses the conductor and the ring-shaped core. An inner wall surface of the housing is formed with a recess configured to receive a part of the winding portion located on an outer circumferential surface of the ring-shaped core. The conductor is housed in the housing so that the part of the winding portion is received in the recess.
    Type: Grant
    Filed: June 22, 2018
    Date of Patent: August 17, 2021
    Assignee: YAZAKI CORPORATION
    Inventors: Hayato Iizuka, Kazuma Kayo
  • Patent number: 10955671
    Abstract: Apparatus and method relating generally to electronics are disclosed. In one such an apparatus, a film assembly has an upper surface and a lower surface opposite the upper surface. A dielectric film of the film assembly has a structured profile along the upper surface or the lower surface for having alternating ridges and grooves in a corrugated section in an at rest state of the film assembly. Conductive traces of the film assembly conform to the upper surface or the lower surface in or on the dielectric film in the corrugated section.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: March 23, 2021
    Assignee: Invensas Corporation
    Inventors: Belgacem Haba, Ilyas Mohammed, Gabriel Z. Guevara, Min Tao
  • Patent number: 10931060
    Abstract: A connector includes: a plurality of conductors; a magnetic core; a housing; and an insulator that locates a core assembling portion therein, the core assembling portion being composed of the respective intermediate portions of the plurality of conductors and the magnetic core, the housing chamber is at least partitioned into a first space in which the core assembling portion is housed and a second space in which the first electrical connection portion and the first counterpart conductor side are housed and are physically and electrically connected to each other, and the insulator is a solidified material of a liquid insulating potting agent filled in the vicinity of the core assembling portion in the first space in order to cover the core assembling portion.
    Type: Grant
    Filed: March 17, 2020
    Date of Patent: February 23, 2021
    Assignee: YAZAKI CORPORATION
    Inventors: Hayato Iizuka, Kazuma Kayo
  • Patent number: 10886815
    Abstract: An electrical connector for an electric motor, includes an insulating main body with a front side configured to be coupled with the motor and a rear side configured to be coupled with a corresponding wiring harness, a plurality of electrical terminals fixed by the main body, and at least one current protection element. The at least one current protection element is positioned in the main body.
    Type: Grant
    Filed: September 7, 2017
    Date of Patent: January 5, 2021
    Assignee: JOHNSON ELECTRIC INTERNATIONAL AG
    Inventors: Bruno Grasso, Carlo Canuto
  • Patent number: 10727173
    Abstract: A power module includes an upper substrate comprising a plurality of circuit pattern areas made of a metal and a dielectric area disposed between each of the plurality of circuit pattern areas; a lower substrate including a plurality of circuit pattern areas made of a metal and a dielectric area disposed between each of the plurality of circuit pattern areas; and a semiconductor element having an upper terminal and a lower terminal, the upper terminal and the lower terminal being bonded to a lower surface of the upper substrate and an upper surface of the lower substrate, respectively.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: July 28, 2020
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Jun Hee Park, Hyeon Uk Kim
  • Patent number: 10707628
    Abstract: A noise filter including a conductor and an annular core. The conductor has a wound portion. The annular core is formed of a magnetic material and passes through the wound portion. The annular core is formed of a pair of split cores that are assembled together with joining surfaces on both ends to be joined to each other. At least one of a recess portion and a projection portion that engage with each other is formed on the joining surfaces of the split cores which are joined to each other.
    Type: Grant
    Filed: April 6, 2018
    Date of Patent: July 7, 2020
    Assignee: Yazaki Corporation
    Inventors: Hayato Iizuka, Kazuma Kayo
  • Patent number: 10607777
    Abstract: Disclosed are apparatus and a method for providing an integrated multiterminal multilayer ceramic device that has three or more capacitive elements. Two of such capacitive elements may be in series, with a third in parallel. The integrated device may be packaged as an overmolded three leaded component, or can be mounted as SMD (surface mount device). The integrated device may also be combined with a separate varistor in a stacked arrangement of leaded components.
    Type: Grant
    Filed: February 2, 2018
    Date of Patent: March 31, 2020
    Assignee: AVX Corporation
    Inventors: Michael Kirk, Marianne Berolini
  • Patent number: 10541664
    Abstract: A conductive path with noise filter that enables an effective reduction in a surge noise in a specific frequency band is provided. A conductive path with noise filter includes conductive path main bodies, insulating layers that respectively surround the conductive path main bodies, conductive layers that are respectively provided to correspond to the conductive path main bodies with the insulating layers being sandwiched between the conductive layers and the conductive path main bodies and that respectively form capacitors in combination with the conductive path main bodies, and inductors connected to the conductive layers.
    Type: Grant
    Filed: August 27, 2015
    Date of Patent: January 21, 2020
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Keiji Hirata, Akihiro Hayashi
  • Patent number: 10338024
    Abstract: An electric potential is applied to first and second electrodes on opposite sides of a gap between an electronic component and a heat spreader. At least one of a thermal interface material in the gap, the electronic component and the heat spreader is subjected to a changing physical condition. The capacitance is monitored. Such a method can be practiced using an array of components sharing a common heat spreader. An assembly for testing thermal interfaces includes a printed circuit board, a plurality of electronic components mounted to and operatively associated with the printed circuit board, a heat spreader positioned for absorbing heat generated by the electronic components, a first electrode associated with the heat spreader, a plurality of second electrodes associated, respectively, with the electronic component, and a device for monitoring electrical capacitances. The technique may be employed for monitoring physical changes in electronic devices.
    Type: Grant
    Filed: July 8, 2017
    Date of Patent: July 2, 2019
    Assignee: International Business Machines Corporation
    Inventors: Timothy J. Chainer, Michael A. Gaynes, Edward J. Yarmchuk
  • Patent number: 10285279
    Abstract: A semiconductor device includes a semiconductor module which has an external terminal protruding from one surface thereof; a printed circuit board which is electrically and mechanically connected to the external terminal of the semiconductor module; a heatsink which abuts against the other surface of the semiconductor module opposite to the one surface; and a joint member which serves as an elastic support column having a first head portion and a second head portion. The first head portion is shaped like a truncated cone and disposed at one end of the elastic support column, and the second head portion is disposed at the other end of the elastic support column. The semiconductor module, the printed circuit board and the heat sink are integrated by the first head portions and the second head portions.
    Type: Grant
    Filed: October 13, 2015
    Date of Patent: May 7, 2019
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Yusuke Sekino
  • Patent number: 10263586
    Abstract: A filter arrangement for filtering parasitic induction currents may include an electrically conductive housing part that at least partly surrounds a cavity, an electric ground connection on the housing part for establishing an electric connection to an electric ground, a busbar in the cavity, and at least one electric filter component electrically connected between the busbar and the housing part and mechanically secured to the housing part and to the busbar. A voltage converter may include at least one such filter arrangement.
    Type: Grant
    Filed: June 9, 2015
    Date of Patent: April 16, 2019
    Assignee: CONTI TEMIC MICROELECTRONIC GMBH
    Inventors: Matthias Ridder, Adam Umerski
  • Patent number: 10154616
    Abstract: An electromagnetic interference filter for various electronic devices such as implantable medical devices is provided. A plurality of signal electrodes can be configured in an array, where each signal electrode extends vertically from a top surface to a bottom surface of the filter such that the signal electrodes are flush with the top and bottom surface. Ground or common electrodes can have a parallel arrangement and be interposed between the signal electrodes. The ground electrodes can be grounded internally, externally, or both internally and externally. Dielectric material can be disposed between signal electrodes and ground electrodes to act as an insulator between adjacent electrodes.
    Type: Grant
    Filed: May 6, 2015
    Date of Patent: December 11, 2018
    Assignee: AVX Corporation
    Inventors: Andrew P. Ritter, Richard J. Panlener, Sam Eldawoudy, Kimberly Van Alstine
  • Patent number: 10079585
    Abstract: An LC filter that is able to obtain high insertion loss in a high-frequency band. The LC filter includes: a core including a core portion and a pair of flange portions formed at both sides of the core portion; a winding; and a pair of signal outer electrodes. At least one of the pair of flange portions is composed of a multilayer body in which inner electrodes and dielectric layers are alternately laminated, and includes a ground outer electrode. The inner electrodes include a first inner electrode and a second inner electrode alternately arranged. The first inner electrode is connected to the signal outer electrode, and the second inner electrode is connected to the ground outer electrode.
    Type: Grant
    Filed: March 7, 2017
    Date of Patent: September 18, 2018
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Yang Guan
  • Patent number: 9937354
    Abstract: An encapsulated filtered feedthrough assembly for an implantable medical device including a ferrule, an electrical insulator coupled to the ferrule, a printed circuit board (PCB), a feedthrough conductor extending through the electrical insulator and the PCB, and a capacitor coupled to the PCB. The encapsulated filtered feedthrough assembly can include a mold defining an opening and located with respect to the printed circuit board such that at least a portion of the capacitor is positioned within the opening. A first non-conductive material can underfill the capacitor and a second non-conductive material can be backfilled into the mold to encapsulate the capacitor.
    Type: Grant
    Filed: March 24, 2016
    Date of Patent: April 10, 2018
    Assignee: Cardiac Pacemakers, Inc.
    Inventors: Patrick J. Barry, Randy White, Steven A. Kubow, Scott A. Spadgenske, David A. Chizek, Jerald Sauber
  • Patent number: 9882323
    Abstract: Connector receptacles that are able to withstand insertion and other forces, are reliable, and are easy to manufacture. One example may provide a connector receptacle having one or more movable portions. These movable portions may move relative to an enclosure for an electronic device housing the connector receptacle. When a connector insert is inserted into the receptacle, the movable portions may move to help absorb insertion forces thereby protecting the connector receptacle from damage.
    Type: Grant
    Filed: April 9, 2015
    Date of Patent: January 30, 2018
    Assignee: APPLE INC.
    Inventors: George Tziviskos, Paul J. Hack, Matthew W. Blum
  • Patent number: 9793618
    Abstract: A connector (10) includes a housing (20) with terminal holding portions (20A to 20D) and terminal fittings (60) in the respective terminal holding portions (20A to 20D). Each terminal fitting (60) includes a terminal main body (62A to 62D) having an annular portion (61A to 61 D) arranged substantially along a front-back direction. A wire connecting portion (63A to 63D) is connected to a rear end of the terminal main body (62A to 62D) and is connectable to a wire (W). The terminal holding portion (20A to 20D) includes a holding main body (21A to 21D) configured so that the annular portion (61A to 61D) is to be fit thereto, and a protecting portion (22A to 22D) intersecting with and integrally connected to a rear end of the holding main body (21A to 21D) and arranged to cover the wire connecting portion (63A to 63D) from the front and/or behind.
    Type: Grant
    Filed: January 23, 2015
    Date of Patent: October 17, 2017
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Kosuke Sone, Hiroyoshi Maesoba, Tomohide Maki, Katsushi Miyazaki
  • Patent number: 9722365
    Abstract: The connector includes a circuit board having a number of electronic components, a transmission assembly joined to the circuit board to a side of the electronic components, a first shielding member on the circuit board shielding the transmission assembly, a second shielding member on the circuit board shielding the electronic components, and a cover on and shielding the first and second shielding members. The connector can be produced to meet different needs by using a common first shielding member joined to a second shielding member adapted to a specific requirement such as dimension, shape, etc., thereby reducing the production and stock costs. The transmission assembly and the electronic components are shielded by the first and second shielding members, respectively, which are further shielded by the cover so as to prevent RF signal leakage and to achieve superior transmission quality.
    Type: Grant
    Filed: August 5, 2016
    Date of Patent: August 1, 2017
    Assignee: ALLSMARTLITE TECHNOLOGY CO., LTD.
    Inventors: Xiaoping Wang, Ming-Han Perng, Chien-Hsing Lai
  • Patent number: 9678109
    Abstract: An apparatus and a method are disclosed herein. The apparatus is disclosed that includes a probe head and a circuit board. The probe head includes a metal housing and pins. The pins penetrate through the metal housing. The circuit board is configured to test a semiconductor device and includes a ground pad. The ground pad is electrically coupled between the metal housing and the circuit board.
    Type: Grant
    Filed: January 9, 2014
    Date of Patent: June 13, 2017
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventor: Ming-Cheng Hsu
  • Patent number: 9647316
    Abstract: A transmission line and an electronic component including a resonator using the transmission line are provided. The transmission line is capable of transmitting electromagnetic waves of at least one frequency ranging from 1 GHz to 10 GHz and is composed of a first dielectric with a first relative permittivity and a surrounding dielectric portion composed of a second dielectric with a second relative permittivity, wherein, the first dielectric is represented by a formula of {XBaO.(1?X)SrO}TiO2 (0.25<X?0.55), and the second relative permittivity is smaller than the first relative permittivity.
    Type: Grant
    Filed: July 1, 2015
    Date of Patent: May 9, 2017
    Assignee: TDK CORPORATION
    Inventors: Toshio Sakurai, Kiyoshi Hatanaka, Takashi Fukui, Shigemitsu Tomaki
  • Patent number: 9521744
    Abstract: A filtered feedthrough assembly for an implantable medical device includes a ferrule, an electrical insulator coupled to the ferrule by a connection element, a plurality of feedthrough conductors extending through the electrical insulator, a printed circuit board (PCB), and a plurality of capacitors. The PCB is coupled to the ferrule or the electrical insulator, and includes one or more ground layers and a plurality of vias. The connection element is electrically coupled to the ground layer through the vias. The capacitor has a ground terminal electrically coupled to the ground layer through at least one of the vias, and a conductor terminal electrically coupled to the feedthrough conductor.
    Type: Grant
    Filed: February 20, 2015
    Date of Patent: December 13, 2016
    Assignee: Cardiac Pacemakers, Inc.
    Inventors: Patrick J. Barry, Randy White, Troy A. Giese, James E. Blood, Michael J. Lyden, Robert M. Mohn
  • Patent number: 9510776
    Abstract: A shoe insole sensor includes a body including a plurality of recessed regions formed at respective locations corresponding to vertexes of N-polygon, where N is an even number, a plurality of first protrusions formed in odd recessed regions of the recessed regions, where each of the first protrusions has a first height, and a plurality of second protrusions formed in even recessed regions of the recessed regions, where each of the second protrusions has a second height different from the first height. Here, the body is formed with a nonconductive material, each of the first protrusions is formed with a conductive material, and each of the second protrusions is formed with a conductive material.
    Type: Grant
    Filed: November 15, 2012
    Date of Patent: December 6, 2016
    Inventor: Jin-Wook Lee
  • Patent number: 9502842
    Abstract: A network interface connector includes a plurality of first and second alternating elongate contacts having contact portions situated in a common plane. The first and second contacts have rearward portions situated in respective first and second spaced parallel planes defining a proximity gap between them. A proximity insert having a particular electrical construction suited for a particular application is situated, preferably in a replaceable manner, in the proximity gap to provide the connector with desired transmission properties.
    Type: Grant
    Filed: June 3, 2015
    Date of Patent: November 22, 2016
    Assignee: Bel Fuse (Macao Commercial Offshore) Ltd.
    Inventors: Yakov Belopolsky, David Henry Gutter, Richard D. Marowsky, Mark Ellis
  • Patent number: 9490573
    Abstract: A plug connector suitable for connecting with a socket connector including a first internal screw thread is provided. The plug connector includes an internal casing having an inside space, a set of terminals disposed in said inside space, a sleeve tube and an external casing. The sleeve tube is fixed to said internal casing and includes an external hook. The external casing is movably covered to said internal casing and includes a first external screw thread, an internal hook and a concaved slot caving in the inner surface of the external casing facing to said internal casing. The internal hook forms one of walls of said concaved slot. The external hook is movably disposed in said concaved slot. When said socket connector screws to said plug connector, said external casing is pulled toward said socket connector, and said internal hook of said external casing contact said external hook of said sleeve tube.
    Type: Grant
    Filed: March 6, 2015
    Date of Patent: November 8, 2016
    Assignee: CHANT SINCERE CO., LTD.
    Inventors: Yu Chin Chien, Chun-Hsiang Hsu, Yong-Sheng Lin
  • Patent number: 9478887
    Abstract: A connector insert comprising a plurality of layers of conductive elastomer, and a concomitant method of employing a connector insert, the method comprising the steps of fabricating a plurality of layers of conductive elastomer as an insert and placing the insert into a connector.
    Type: Grant
    Filed: October 31, 2014
    Date of Patent: October 25, 2016
    Assignee: Quell Corporation
    Inventors: Ken Godana, Dusty Erven, Kevin Foreman, Paul Miller
  • Patent number: 9472887
    Abstract: An electrical connector includes a housing stack, signal and ground conductors, and an electrically conductive ground bracket. The housing stack comprises a front housing and a rear housing. The front housing defines a mating end of the housing stack, and the rear housing defines a mounting end of the housing stack. The housing stack defines signal cavities and ground cavities that extend continuously through the front housing and the rear housing. The signal conductors and ground conductors are held in the signal cavities and ground cavities, respectively, of the housing stack. The signal conductors are arranged in signal pairs, and the ground conductors are interleaved between the signal pairs. The ground bracket is held in the housing stack between the front housing and the rear housing. The ground bracket engages and is electrically connected to each of the ground conductors to electrically common the ground conductors along a ground plane.
    Type: Grant
    Filed: April 22, 2015
    Date of Patent: October 18, 2016
    Assignee: Tyco Electronics Corporation
    Inventors: Michael James Horning, Wayne Samuel Davis
  • Patent number: 9461353
    Abstract: There is provided a power combiner configured to combine high-frequency powers such that the high-frequency powers respectively input to a plurality of input terminals are output from one output terminal via transmission circuits respectively connected to the input terminals. The respective input terminals are connected to one ends of resistances in parallel with the respective transmission circuits and the other ends of the resistances are connected to each other, so that the input terminals are connected to each other through the resistances connected to the respective input terminals. Each of the transmission circuits is comprised of a circuit in which a first inductor, a transmission section having a constant characteristic impedance and a second inductor are connected to each other in series.
    Type: Grant
    Filed: March 18, 2014
    Date of Patent: October 4, 2016
    Assignee: DAIHEN CORPORATION
    Inventor: Hirotaka Takei
  • Patent number: 9444201
    Abstract: An electric connector includes an insulation body, a shielding shell, first and second conductive terminals, and an organizer. The insulation body has a base portion and a tongue portion extended horizontally forward from the base portion. The shielding shell encloses the insulation body. Each first or second conductive terminal has a retaining section fixedly located in the insulation body, a contact section extended forward from the retaining section and located on the tongue portion, and a soldering section bent upward from the retaining section and extended outside the base portion. The organizer located on the base portion has an elongate slot and apertures that penetrate the base portion. The elongate slot allows the soldering sections of the first conductive terminals to pass through and anchor therein. Each aperture allows the soldering section of each second conductive terminal to pass through and anchor therein.
    Type: Grant
    Filed: February 26, 2015
    Date of Patent: September 13, 2016
    Assignee: Advanced-Connectek Inc.
    Inventors: Ching-Tien Chen, Shu-Lin Duan, Wei Wan, Fu-Yi Xu, Pei-Hsuan Huang
  • Patent number: 9431738
    Abstract: A connector of a microphone includes a cylindrical connector case 1 having openings at both ends and a projection 10 on an inner face thereof; two substrates 11 and 12 having shapes fittable to the inner face of the cylindrical connector case 1, the substrates 11 and 12 facing each other across the projection 10 in the cylindrical connector case 1; and a connector pin 2 extending through the substrates 11 and 12 in the cylindrical connector case 1, having a contact 21 that is electrically connected to electronic parts 16 mounted on the substrates 11 and 12, and having a caulked portion 23 fixed to one of the substrates 11 and 12 on an opposite side to the contact 21.
    Type: Grant
    Filed: March 27, 2015
    Date of Patent: August 30, 2016
    Assignee: Kabushiki Kaisha Audio-Technica
    Inventor: Hiroshi Akino
  • Patent number: 9391581
    Abstract: Band rejection filters are protected from the adverse effects of external forces such as stresses, strains and vibrations from external loads and winds by utilizing a protective frame and dampers.
    Type: Grant
    Filed: February 28, 2014
    Date of Patent: July 12, 2016
    Assignee: ALCATEL-LUCENT SHANGHAI BELL CO., LTD
    Inventors: Yin-Shing Chong, Yunchi Zhang, Stanley Michnowicz
  • Patent number: 9362687
    Abstract: An electrical connector includes an insulating body having a plurality of receiving slots, multiple terminals respectively received in the receiving slots, and a passive element. Each of the terminals has an elastic arm. The passive element is disposed at one end of at least one of the elastic arms, and floatable up and down along with the elastic arm. One end of the passive element has a first contact electrically connected to the one end of the elastic arm. The other end of the passive element has a second contact protruding from the receiving slot. The second contact and a first electronic element are electrically connected, and the other end of the elastic arm and a second electronic element are electrically connected.
    Type: Grant
    Filed: March 17, 2015
    Date of Patent: June 7, 2016
    Assignee: LOTES CO., LTD.
    Inventor: Ted Ju
  • Patent number: 9331657
    Abstract: A bus bar device with a noise filter includes a magnetic body, a bus bar and first to third capacitors. The bus bar has input and output ends and extends through the magnetic body. The capacitors are disposed on an electrical path between the bus bar and a ground conductor surface. The first capacitor is located at the input end side of the bus bar and the second and third capacitors are located at the output end side. The first capacitor has one end connected to the bus bar and the other end connected to the ground conductor surface in one of two regions divided by the bus bar. Each one of the second and third capacitors has one end connected to the bus bar and the other end connected to the ground conductor surface in the same region as the first capacitor or in the other region.
    Type: Grant
    Filed: September 13, 2013
    Date of Patent: May 3, 2016
    Assignee: KITAGAWA INDUSTRIES CO., LTD.
    Inventor: Yoshinori Ohashi
  • Patent number: 9276546
    Abstract: An assembly and method for providing electromagnetic interference isolation. The assembly includes an enclosure which has a first panel and a second panel. Bus bars extend through the first panel and the second panel. A mounting plate is positioned between the first panel and the second panel. The mounting plate has locating members thereon. A plurality of inductive cores are positioned proximate the locating members, the inductive cores having openings through which the bus bars extend. The inductive cores are precisely positioned in the enclosure to facilitate the electromagnetic interference isolation.
    Type: Grant
    Filed: February 21, 2014
    Date of Patent: March 1, 2016
    Assignee: TYCO ELECTRONICS CORPORATION
    Inventor: Evan Lawrence Craig
  • Patent number: 9226389
    Abstract: A quickly-mounted capacitor consists of a capacitor (1) and a plug piece (10). The quickly-mounted capacitor is characterized in that a fixation mounting rod (22) or a screw (21) is extended from a lower end of a housing of the capacitor (1); the plug piece (10) comprises an insulating sheet (11) arranged in an upper portion, and a lower portion of the insulting sheet (11) is connected to an upper end of a connection part (13); a lower end of the connecting part (13) is connected to a plastic elastic card (12) to form a plastic anchor-shaped elastic card. An upper portion of the plug piece (10) is provided with a capacitor mounting hole (15). The capacitor not only is convenient to plug, but also can effectively play a role in insulation and prevent the accident caused by conducting leak electricity to an electric appliance casing when abnormal electricity leakage occurs in the capacitor.
    Type: Grant
    Filed: September 25, 2012
    Date of Patent: December 29, 2015
    Assignees: SHANGHAI HAOYE CAPACITORS CO., LTD., SHANGAI HAOYE ELECTRIC CO., LTD.
    Inventors: Zikui Zhang, Feng Xu, Hao Pan
  • Patent number: 9083371
    Abstract: A capacitive element includes first electrodes and second electrodes that are alternately arranged in a concentric form. Each of the first electrodes and the second electrodes is formed with closed loop form, in at least one wiring layer provided on or above a substrate.
    Type: Grant
    Filed: October 29, 2013
    Date of Patent: July 14, 2015
    Assignee: SOCIONEXT INC.
    Inventor: Kenta Aruga
  • Patent number: 9019043
    Abstract: An EMC power filter comprising a filter circuit and a conductive housing enclosing the filter circuit, wherein said filter circuit comprises: at least one electric conductor consisting in a rigid busbar for carrying an electric power, at least one ferromagnetic element for modifying the impedance of the electric conductor, at least one capacitor electrically connected between the electric conductor and the conductive housing. The housing has a tubular shape with a square cross section, allowing a rotation of the filter of 90° within the housing.
    Type: Grant
    Filed: November 29, 2012
    Date of Patent: April 28, 2015
    Assignee: Schaffner EMV AG
    Inventors: Fabian Beck, Benedikt Othmar Scheller
  • Patent number: 9019044
    Abstract: An inductive filter for a magnetron power supply lead comprises an electrically insulating tube; a power lead located partially within the electrically insulating tube, and coaxial therewith, for supplying power from a magnetron power supply to a magnetron, a first core of a first magnetic material and a second core of a second magnetic material coaxially located on the electrically insulating tube; an insulating disc of same external diameter as the first core and the second core and coaxially located on the electrically insulating tube between the first core and the second core. The inductive filter is arranged to filter noise of a first frequency band and noise of a second, different, frequency band different from being transmitted along the power lead and to absorb a predetermined transient voltage from being transmitted along the power lead.
    Type: Grant
    Filed: February 9, 2012
    Date of Patent: April 28, 2015
    Assignee: E2V Technologies (UK) Limited
    Inventors: Robert Richardson, Karl Osbourne
  • Patent number: 8988168
    Abstract: An alternating current (AC) power device includes an AC circuit having input nodes, output nodes and a ground node. The AC circuit is configured to receive an input electrical signal at the input nodes and generate an output electrical signal at the output nodes. The AC power device also includes an inductor coupled to the ground node of the AC circuit. The ground node is configured to be coupled to a ground plane at a ground potential. The AC circuit is configured to be coupled to a load at the output nodes. The inductor is configured to be connected in series between the ground node of the AC circuit and the load to attenuate radio frequency components present at the ground node.
    Type: Grant
    Filed: August 26, 2013
    Date of Patent: March 24, 2015
    Assignee: The Quest Group
    Inventor: Garth Judson Powell
  • Patent number: 8825162
    Abstract: One aspect relates to an electrical bushing for use in a housing of an implantable medical device. The electrical bushing includes at least one electrically insulating base body and at least one electrical conducting element. The conducting element is set up to establish, through the base body, at least one electrically conductive connection between an internal space of the housing and an external space. The conducting element is hermetically sealed with respect to the base body. The at least one conducting element includes at least one cermet. The electrical bushing includes an electrical filter structure. The at least one conducting element forms at least one conducting section of an inductor of the filter structure.
    Type: Grant
    Filed: January 30, 2012
    Date of Patent: September 2, 2014
    Assignee: Heraeus Precious Metals GmbH & Co. KG
    Inventor: Andreas Reisinger
  • Publication number: 20140062618
    Abstract: An electromagnetic interference filter for various electronic devices such as implantable medical devices is provided. A plurality of signal electrodes can be configured in an array, where each signal electrode extends vertically from a top surface to a bottom surface of the filter such that the signal electrodes are flush with the top and bottom surface. Ground or common electrodes can have a parallel arrangement and be interposed between the signal electrodes. The ground electrodes can be grounded internally, externally, or both internally and externally. Dielectric material can be disposed between signal electrodes and ground electrodes to act as an insulator between adjacent electrodes.
    Type: Application
    Filed: August 29, 2013
    Publication date: March 6, 2014
    Applicant: AVX Corporation
    Inventors: Andrew P. Ritter, Richard J. Panlener, Sam Eldawoudy, Kimberly Van Alstine
  • Patent number: 8644936
    Abstract: A feedthrough assembly may include a ferrule defining a ferrule opening, a capacitive filter array at least partially disposed within the ferrule opening, and a feedthrough at least partially disposed within the ferrule opening. In some examples, the capacitive filter array includes a filter array ground conductive pathway. In some examples, the feedthrough includes a feedthrough ground conductive via. The feedthrough ground conductive via may be electrically coupled to the filter array ground conductive pathway, and the feedthrough ground conductive via may be electrically coupled to the ferrule.
    Type: Grant
    Filed: January 9, 2012
    Date of Patent: February 4, 2014
    Assignee: Medtronic, Inc.
    Inventors: Rajesh V. Iyer, Simon E. Goldman, Thomas P. Miltich
  • Publication number: 20130321099
    Abstract: An inductive filter for a magnetron power supply lead comprises an electrically insulating tube; a power lead located partially within the electrically insulating tube, and coaxial therewith, for supplying power from a magnetron power supply to a magnetron, a first core of a first magnetic material and a second core of a second magnetic material coaxially located on the electrically insulating tube; an insulating disc of same external diameter as the first core and the second core and coaxially located on the electrically insulating tube between the first core and the second core. The inductive filter is arranged to filter noise of a first frequency band and noise of a second, different, frequency band different from being transmitted along the power lead and to absorb a predetermined transient voltage from being transmitted along the power lead.
    Type: Application
    Filed: February 9, 2012
    Publication date: December 5, 2013
    Applicant: E2V Technologies (UK) Limited
    Inventors: Robert Richardson, Karl Osbourne
  • Patent number: 8588915
    Abstract: An electronic module assembly (EMA) for an implantable medical device is disclosed. The EMA comprises a non-conductive block having a top side, a bottom side, a front side and a back side. A plurality of conductive strips are coupled to the non-conductive block. Each conductive strip possesses a front side and a back side. The back side of each conductive strip extends from the front side across the top side and over to back side of the non-conductive block.
    Type: Grant
    Filed: March 30, 2010
    Date of Patent: November 19, 2013
    Assignee: Medtronic, Inc.
    Inventors: Rajesh V. Iyer, Lea A. Nygren, Stephanie L. McCracken, Mukul Jain, Christine Gale Kronich
  • Publication number: 20130154766
    Abstract: An EMC power filter comprising a filter circuit and a conductive housing (1) enclosing the filter circuit, wherein said filter circuit comprises: at least one electric conductor (3) consisting in a rigid busbar for carrying an electric power; at least one ferromagnetic element (4) for modifying the impedance of the electric conductor (3); at least one capacitor (5) electrically connected between the electric conductor (3) and the conductive housing (1); The housing has a tubular shape with a square cross section, allowing a rotation of the filter of 90° within the housing.
    Type: Application
    Filed: November 29, 2012
    Publication date: June 20, 2013
    Applicant: Schaffner EMV AG
    Inventor: Schaffner EMV AG
  • Publication number: 20130127567
    Abstract: In one example, a filtered feedthrough assembly for a medical device, such as, e.g., an implantable medical device, is described. The filtered feedthrough assembly may comprise a feedthrough comprising at least one feedthrough conductive pathway extending between a first feedthrough side and a second feedthrough side; a capacitive filter array comprising at least one filter array conductive pathway extending between a first filter array side and a second filter array side, and at least one capacitor filter substantially surrounding at least a portion the at least one filter array conductive pathway; and at least one electrically conductive member electrically coupling the at least one filter array conductive pathway to the at least one feedthrough conductive pathway.
    Type: Application
    Filed: August 28, 2012
    Publication date: May 23, 2013
    Applicant: MEDTRONIC, INC.
    Inventors: Rajesh V. Iyer, Thomas P. Miltich, Gordon O. Munns, Simon E. Goldman