Abstract: A converter for an air conditioner includes a substrate, an inductor that is disposed in one side of the substrate and includes a core and a coil wound around the core, a switching element that is disposed in one side of the substrate and selectively controls a flow of a circuit, and a heat sink for absorbing heat generated from the switching element by contacting the switching element. A lead-in hole is formed in one side of the substrate, and at least a portion of the inductor is disposed in the lead-in hole, thereby quickly discharging the heat generated by the inverter and more efficiently using a space.

Abstract: An FPC cable assembly is provided that includes a first ground layer, a second ground layer, and at least one signal line sandwiched by the first and second ground layers. The FPC cable assembly further includes an electromagnetic shielding structure including a first magnetic layer at least partially covering and electrically grounded to the first ground layer, a second magnetic layer at least partially covering and electrically grounded to the second ground layer, and a plurality of magnetic rings magnetically engaged with and electrically contacting the first magnetic layer and the second magnetic layer so as to surround the first and second ground layers, the at least one signal line, and the first and second magnetic layers, thereby providing electromagnetic shielding of the at least one signal line.

Abstract: A feedthrough for an AIMD includes a ferrule with an insulator hermetically sealing a ferrule opening, both cooperatively separating a body fluid side from a device side. A circuit board disposed adjacent to the insulator device side has a ground plate or ground trace electrically connected to a circuit board ground conductive pathway disposed in a circuit board ground via hole. An anisotropic conductive layer disposed between the circuit board and the insulator device side has an electrically insulative matrix supporting a plurality of electrically conductive particles. The anisotropic conductive layer has a first thickness where at least one first electrically conductive particle is longitudinally aligned and in electrical contact with the ferrule and the circuit board ground conductive pathway electrically connected to the at least one circuit board ground plate or ground trace.

Abstract: A printed circuit board includes a printed board, a first integrated circuit chip, a connector, and a capacitor. The printed board includes a first ground pattern and a second ground pattern directly opposed to the first ground pattern. The second ground pattern is electrically connected with a chassis or connector ground wiring. The capacitor is connected to the first ground pattern and the second ground pattern and disposed on a straight line that defines the shortest distance between the first ground terminal and the second ground pattern.

Abstract: An electronic control device including a circuit substrate having a signal wiring and a ground wiring; at least one connector having a signal conductor and a ground conductor respectively connected to the signal wiring and the ground wiring of the circuit substrate on one end side and extending on the other end side; a housing including an accommodating portion that accommodates the circuit substrate and the at least one connector, in which a radio wave path through which a leakage electromagnetic wave propagates from one end on the circuit substrate side toward the other end on the side opposite to the circuit substrate side of the at least one connector is formed in an internal space at the periphery of the at least one connector; and a leakage electromagnetic wave attenuating structure provided between the housing and the at least one connector; where the leakage electromagnetic wave attenuating structure includes a plurality of conductors that are arrayed along a direction in which the leakage electromagn

Abstract: A shuttered keystone jack assembly is provided in the disclosure. The shutter keystone jack assembly includes a jack housing, a frame, a shutter and an elastic member. The frame is detachably disposed on the jack housing and defining a receiving opening. The shutter is pivotally connected to the frame and selectively covering the receiving opening. The elastic member includes a first end portion and a second end portion, and the first end portion and the second end portion respectively abut against the frame and the shutter.

Abstract: A biocompatible electrical connection includes a substrate; a ferrule having a concentric flange at a first end of the ferrule; a first adhesive; and a second adhesive. The first adhesive adheres a first surface of the concentric flange of the ferrule to a surface of the substrate. The second adhesive fills an annular space between a hole in the substrate and the ferrule. The first adhesive or the second adhesive forms a conductive path on the surface of the substrate between the ferrule and a circuit pattern on the substrate.

Abstract: One example provides a ferrule for an implantable medical device including a frame body having an upper surface and an opposing lower surface, an interior perimeter surface extending between the upper and lower surfaces for attachment to an insulator body, and an exterior perimeter surface extending between the upper and lower surfaces for attachment to a housing. A flange extends from the exterior perimeter surface and has an upper surface facing the upper surface of the frame body, the upper surface of the flange to engage an interior surface of a housing of the implantable medical device to limit a position of the housing along the exterior perimeter surface in a direction toward the bottom surface of the frame body, wherein a distance of the top surface of the flange from the top surface of the frame body is greater than and proportional to a thickness of the housing.

Abstract: Various embodiments of a hermetic assembly and a method of forming such assembly are disclosed. The hermetic assembly includes a dielectric substrate having a first major surface and a second major surface, a patterned layer connected to the first major surface of the dielectric substrate by a laser bond, and a ferrule having a body and a flange extending from the body. The flange is welded to a welding portion of the patterned layer that is disposed between the flange and the first major surface of the dielectric substrate such that the ferrule is hermetically sealed to the dielectric substrate.

Abstract: It is aimed to improve anti-vibration performance. A connector includes a case made of metal and including an opening, and a terminal holding member made of synthetic resin for holding terminal fittings, the terminal holding member being integrated with the case while penetrating through the opening. The opening 18 includes a protruding portion protruding inward toward an outer periphery of the terminal holding member. The terminal holding member includes an inclination restricting portion to be held in contact with at least one of an outer surface and an inner surface of the protruding portion. Since the inclination restricting portion is in contact with the protruding portion, the inclination of the terminal holding member with respect to the case is suppressed even if the terminal holding member is subjected to vibration.

Abstract: An integrated microstrip circulator comprises a dielectric substrate having an aperture, a ferrite disc secured within the aperture in the dielectric substrate, metallization on upper surfaces of the dielectric substrate and the ferrite disc, and surface mount contacts disposed on lower surfaces of the dielectric substrate and the ferrite disc and in electrical communication with the metallization on the upper surfaces of the dielectric substrate and the ferrite disc.

Abstract: Embodiments of the present disclosure provide an antenna assembly for a test system. The antenna assembly includes a feedthrough part, two waveguide inputs, a single waveguide output as well as a multiplexing part that is interconnected between the two waveguide inputs and the single waveguide output. The multiplexing part is integrated within the feedthrough part at least partially. Moreover, embodiments of the present disclosure provide a test system and a method of establishing a test system for testing a device under test.

Abstract: An implantable pulse generator including a header, a can, and a filtered feedthrough assembly. The header including lead connector blocks. The can coupled to the header and including a wall and an electronic substrate housed within the wall. The filtered feedthrough assembly including a flange mounted to the can and having a feedthrough port, a plurality of feedthrough wires extending through the feedthrough port, and an insulator brazed to the feedthrough port of the flange. The filtered feedthrough assembly further including a capacitor having the plurality of feedthrough wires extending there through, an insulating washer positioned between and abutting the insulator and the capacitor at least in the area of the braze joint such that the capacitor and the braze joint are non-conductive, and an electrically conductive material adhered to the capacitor and the flange for grounding of the capacitor.

Abstract: On example provides a ferrule for an implantable medical device including a first frame body having a first perimeter surface to make a brazed connection to a first medical device component, and a second frame body having a first perimeter surface to make a welded connection to a second medical device component. A spacer flange connects a second perimeter surface of the first frame body to a second perimeter surface of the second frame body, a thickness between a top surface and bottom of the spacer flange being less than a thickness between a top surface and a bottom surface of the first frame body such that the spacer flange is to deflect relative to the first frame body in response to forces being applied to the second frame body so as to reduce transmission of weld strain from the second frame body to the first frame body.

Abstract: An implantable medical device, battery and method include memory configured to store program instructions. At least one of circuitry or a processor are configured to execute the program instructions in connection with at least one of monitoring a biological signal or administering a therapy. The device includes a battery comprising a cell stack that includes an anode, a cathode, and one or more separator layers electrically insulating the anode from the cathode. The device includes a case having a feedthrough port and a feedthrough assembly disposed in the feedthrough port. The feedthrough assembly includes a ferrule having a lumen. An inner conductor is disposed within the lumen of the ferrule. The inner conductor is formed from a material having a first composition and a first coefficient of thermal expansion (CTE). An insulating core is disposed within the lumen of the ferrule and separates the inner conductor from the ferrule.

Abstract: A structure for forming inductor windings includes a first portion and a second portion of a clamshell casing. The first portion includes a first set of electrically conductive segments, a first inner carrier, and a first outer carrier. The second portion includes a second set of electrically conductive segments, a second inner carrier, and a second outer carrier. An inductor core is mountable between the first inner carrier and the first outer carrier within the first portion. A control assembly aligns and joins the first portion to the second portion of the clamshell casing such that the first set of electrically conductive segments arranged in the first pattern that correspond to first half-turns of the inductor windings, are attached to the second set of electrically conductive segments arranged in the second pattern that correspond to second half-turns of the inductor windings, to form continuous turns around the inductor core.

Abstract: A signal processing system includes: an interference source; and a band-stop filter. A first terminal of the band-stop filter is electrically connected to the interference source, a second terminal of the band-stop filter is grounded, and the band-stop filter is configured to filter a baseband signal output by the interference source. The interference source includes a first main board; or the interference source includes a target module and a metal frame used for fastening the target module, and the target module is a display module or a camera module.

Abstract: An inductor unit includes a conductive structure, a first magnetic element and an insulating layer. The conductive structure has a bottom conductive layer, a top conductive layer, and a first side conductive layer extending from the bottom conductive layer to the top conductive layer. The first magnetic element is disposed on the bottom conductive layer of the conductive structure. The insulating layer is disposed on the bottom conductive layer of the conductive structure, wherein the insulating layer covers and surrounds the first magnetic element. The circuit structure including the inductor unit and the methods for manufacturing the same are also provided.

Abstract: A connection device includes a housing having a first face provided with a first opening that is closed by a PCB, and a second face provided with a second opening facing at least one electrical connection interface of the PCB. The housing includes at least one well extending from an edge of the second opening to the PCB so as to position a first connector relative to the connection interface, and in that the housing is a one-piece part that includes the well.

Abstract: Implantable medical devices have modular lead bores that are constructed from individual lead bore modules. A given modular lead bore utilizes the number of individual lead bore modules necessary for the particular implantable medical device. Each lead bore module has a lead bore passageway and a feedthrough passageway. An electrical contact is present within the lead bore passageway of each lead bore module and the electrical contact is aligned to the lead bore passageway of a lead bore module. Hermetic feedthrough assemblies are also present within the lead bore passageway of each lead bore module. A feedthrough pin passes through a hermetic feedthrough assembly within a feedthrough passageway of each lead bore module. Each feedthrough pin is electrically coupled to a corresponding electrical contact and the medical device circuitry.

Abstract: A transmitter, a receiver and a transceiver are provided. The transceiver includes a hybrid transceiving circuit and a common-mode voltage control circuit. The hybrid transceiving circuit includes a digital-to-analog converter (DAC) circuit, a line driver coupled to the DAC circuit, a filtering and/or amplifying circuit coupled to the line driver, and an analog-to-digital converter (ADC) circuit coupled to the filtering and/or amplifying circuit. The common-mode voltage control circuit is electrically connected to a node of the hybrid transceiving circuit and is configured to detect a common-mode voltage of the node and to adjust the common-mode voltage of the node.

Abstract: A biocompatible electrical connection includes: a substrate; a ferrule having a concentric flange at a first end of the ferrule; a first adhesive; and a second adhesive. The substrate includes a hole having a diameter that is a specified amount larger than an outside diameter of the ferrule forming an annular space between the hole and the ferrule, the first adhesive adheres a first surface of the concentric flange of the ferrule to a first surface of the substrate, and the second adhesive fills the annular space between the hole and the ferrule.

Abstract: An interface for mitigating electromagnetic interference (EMI) on a printed circuit board (PCB) is disclosed. The PCB can contain circuit components and includes one or more signal planes sandwiched between corresponding ground planes. The PCB has a first and second side and an interface region separating the first and second sides that includes a partition wall projecting outward from the interface region, configured for EMI shielding between the first side and second sides, one or more pairs of input and output pads straddling the interface region on respective first and second sides and configured to accommodate an EMI line filter, and a ground barrier within the printed circuit board under the interface region. A method of mitigating EMI using the interface is also disclosed.

Abstract: An electrical connector assembly includes a receptacle connector and a plug connector adapted to be mated with each other. The receptacle connector includes a contact unit forwardly assembled into the receptacle housing and having a plurality of receptacle contacts and a common mode choke electrically connected together. The plug connector includes a resilient latch associated with the plug shell and received within an enlarged area of a circumferential space formed between the receptacle shell and the receptacle housing.

Abstract: A rotary encoder includes a rotor, a stator, and a casting compound. The casting compound has a first surface facing the stator. The first surface has a first predetermined shape and is fixed in relation to the stator. The casting compound has a second surface facing away from the stator, the second surface having a second predetermined shape.

Abstract: In some embodiments, an apparatus can include a printed circuit board (PCB) that has layers and includes a first portion and a second portion. The first portion can have a data port and a power port. A first layer is associated with data of the first portion of the PCB, and a second layer is associated with power of the first portion of the PCB. The second portion can have a data port and a power port. A third layer is associated with data of the second portion, and a fourth layer is associated with power of the second portion. The first portion or the second portion can have vias defining an electromagnetic interference (EMI) shield. The apparatus can include a power filter and a data filter that can, respectively, isolate power and data of the first portion from the second portion.

Abstract: A device that includes a substrate including a plurality of metal layers, and a plurality of dielectric layers. The device further includes a first passive component including a first terminal, a second terminal, and a first body, mounted to the substrate on one of the plurality of metal layers. The first terminal is coupled to a first ground signal and the second terminal is coupled to a second ground signal such that the first passive component is shorted.

Abstract: Various embodiments may provide a semiconductor package. The semiconductor package may include a substrate including a via hole. The semiconductor package may also include a chip attached to the substrate. The semiconductor package may further include a prefabricated ferromagnetic pin having a first portion held by the via hole, a second portion extending from a first end of the first portion, and a third portion extending from a second end of the first portion opposite the first end. The semiconductor package may also include a first magnetic shield structure attached to or extended from the second portion of the prefabricated ferromagnetic pin. The semiconductor package may further include a second magnetic shield structure attached to or extended from the third portion of the prefabricated ferromagnetic pin, such that at least a portion of the chip is between the first magnetic shield structure and the second magnetic shield structure.

Abstract: Implantable medical devices have a feedthrough from the device to the outside world to pass electrical current from electronics inside the implant to the patient or vice versa. A plurality of sensors and/or signal wires must connect to the feedthrough and implant in living tissue. Chemical and physical forces work against the wire connections. Embodiments of the present invention include a biocompatible cap or top, shaped to attach onto a rim of the feedthrough device. One or more wire bundle ports are included on the cap. One or two layers of a sealant (e.g., epoxy) can be injected under the cap. A first layer can rigidly protect the wire bonds, and an elastomeric silicone can cover the epoxy for a flexible protector. Other embodiments include an implant housing with a recess for the feedthrough; a top can protect the recess. One or more sealants can cover the feedthrough.

Abstract: A noise reduction unit includes a conductor having a winding portion and a ring-shaped core which is made of a magnetic material and is inserted through the winding portion, and a housing which houses the conductor and the ring-shaped core. An inner wall surface of the housing is formed with a recess configured to receive a part of the winding portion located on an outer circumferential surface of the ring-shaped core. The conductor is housed in the housing so that the part of the winding portion is received in the recess.

Abstract: Apparatus and method relating generally to electronics are disclosed. In one such an apparatus, a film assembly has an upper surface and a lower surface opposite the upper surface. A dielectric film of the film assembly has a structured profile along the upper surface or the lower surface for having alternating ridges and grooves in a corrugated section in an at rest state of the film assembly. Conductive traces of the film assembly conform to the upper surface or the lower surface in or on the dielectric film in the corrugated section.

Abstract: A connector includes: a plurality of conductors; a magnetic core; a housing; and an insulator that locates a core assembling portion therein, the core assembling portion being composed of the respective intermediate portions of the plurality of conductors and the magnetic core, the housing chamber is at least partitioned into a first space in which the core assembling portion is housed and a second space in which the first electrical connection portion and the first counterpart conductor side are housed and are physically and electrically connected to each other, and the insulator is a solidified material of a liquid insulating potting agent filled in the vicinity of the core assembling portion in the first space in order to cover the core assembling portion.

Abstract: An electrical connector for an electric motor, includes an insulating main body with a front side configured to be coupled with the motor and a rear side configured to be coupled with a corresponding wiring harness, a plurality of electrical terminals fixed by the main body, and at least one current protection element. The at least one current protection element is positioned in the main body.

Abstract: A power module includes an upper substrate comprising a plurality of circuit pattern areas made of a metal and a dielectric area disposed between each of the plurality of circuit pattern areas; a lower substrate including a plurality of circuit pattern areas made of a metal and a dielectric area disposed between each of the plurality of circuit pattern areas; and a semiconductor element having an upper terminal and a lower terminal, the upper terminal and the lower terminal being bonded to a lower surface of the upper substrate and an upper surface of the lower substrate, respectively.

Abstract: A noise filter including a conductor and an annular core. The conductor has a wound portion. The annular core is formed of a magnetic material and passes through the wound portion. The annular core is formed of a pair of split cores that are assembled together with joining surfaces on both ends to be joined to each other. At least one of a recess portion and a projection portion that engage with each other is formed on the joining surfaces of the split cores which are joined to each other.

Abstract: Disclosed are apparatus and a method for providing an integrated multiterminal multilayer ceramic device that has three or more capacitive elements. Two of such capacitive elements may be in series, with a third in parallel. The integrated device may be packaged as an overmolded three leaded component, or can be mounted as SMD (surface mount device). The integrated device may also be combined with a separate varistor in a stacked arrangement of leaded components.

Abstract: A conductive path with noise filter that enables an effective reduction in a surge noise in a specific frequency band is provided. A conductive path with noise filter includes conductive path main bodies, insulating layers that respectively surround the conductive path main bodies, conductive layers that are respectively provided to correspond to the conductive path main bodies with the insulating layers being sandwiched between the conductive layers and the conductive path main bodies and that respectively form capacitors in combination with the conductive path main bodies, and inductors connected to the conductive layers.

Abstract: An electric potential is applied to first and second electrodes on opposite sides of a gap between an electronic component and a heat spreader. At least one of a thermal interface material in the gap, the electronic component and the heat spreader is subjected to a changing physical condition. The capacitance is monitored. Such a method can be practiced using an array of components sharing a common heat spreader. An assembly for testing thermal interfaces includes a printed circuit board, a plurality of electronic components mounted to and operatively associated with the printed circuit board, a heat spreader positioned for absorbing heat generated by the electronic components, a first electrode associated with the heat spreader, a plurality of second electrodes associated, respectively, with the electronic component, and a device for monitoring electrical capacitances. The technique may be employed for monitoring physical changes in electronic devices.

Abstract: A semiconductor device includes a semiconductor module which has an external terminal protruding from one surface thereof; a printed circuit board which is electrically and mechanically connected to the external terminal of the semiconductor module; a heatsink which abuts against the other surface of the semiconductor module opposite to the one surface; and a joint member which serves as an elastic support column having a first head portion and a second head portion. The first head portion is shaped like a truncated cone and disposed at one end of the elastic support column, and the second head portion is disposed at the other end of the elastic support column. The semiconductor module, the printed circuit board and the heat sink are integrated by the first head portions and the second head portions.

Abstract: A filter arrangement for filtering parasitic induction currents may include an electrically conductive housing part that at least partly surrounds a cavity, an electric ground connection on the housing part for establishing an electric connection to an electric ground, a busbar in the cavity, and at least one electric filter component electrically connected between the busbar and the housing part and mechanically secured to the housing part and to the busbar. A voltage converter may include at least one such filter arrangement.

Abstract: An electromagnetic interference filter for various electronic devices such as implantable medical devices is provided. A plurality of signal electrodes can be configured in an array, where each signal electrode extends vertically from a top surface to a bottom surface of the filter such that the signal electrodes are flush with the top and bottom surface. Ground or common electrodes can have a parallel arrangement and be interposed between the signal electrodes. The ground electrodes can be grounded internally, externally, or both internally and externally. Dielectric material can be disposed between signal electrodes and ground electrodes to act as an insulator between adjacent electrodes.

Abstract: An LC filter that is able to obtain high insertion loss in a high-frequency band. The LC filter includes: a core including a core portion and a pair of flange portions formed at both sides of the core portion; a winding; and a pair of signal outer electrodes. At least one of the pair of flange portions is composed of a multilayer body in which inner electrodes and dielectric layers are alternately laminated, and includes a ground outer electrode. The inner electrodes include a first inner electrode and a second inner electrode alternately arranged. The first inner electrode is connected to the signal outer electrode, and the second inner electrode is connected to the ground outer electrode.

Abstract: An encapsulated filtered feedthrough assembly for an implantable medical device including a ferrule, an electrical insulator coupled to the ferrule, a printed circuit board (PCB), a feedthrough conductor extending through the electrical insulator and the PCB, and a capacitor coupled to the PCB. The encapsulated filtered feedthrough assembly can include a mold defining an opening and located with respect to the printed circuit board such that at least a portion of the capacitor is positioned within the opening. A first non-conductive material can underfill the capacitor and a second non-conductive material can be backfilled into the mold to encapsulate the capacitor.

Abstract: Connector receptacles that are able to withstand insertion and other forces, are reliable, and are easy to manufacture. One example may provide a connector receptacle having one or more movable portions. These movable portions may move relative to an enclosure for an electronic device housing the connector receptacle. When a connector insert is inserted into the receptacle, the movable portions may move to help absorb insertion forces thereby protecting the connector receptacle from damage.

Abstract: A connector (10) includes a housing (20) with terminal holding portions (20A to 20D) and terminal fittings (60) in the respective terminal holding portions (20A to 20D). Each terminal fitting (60) includes a terminal main body (62A to 62D) having an annular portion (61A to 61 D) arranged substantially along a front-back direction. A wire connecting portion (63A to 63D) is connected to a rear end of the terminal main body (62A to 62D) and is connectable to a wire (W). The terminal holding portion (20A to 20D) includes a holding main body (21A to 21D) configured so that the annular portion (61A to 61D) is to be fit thereto, and a protecting portion (22A to 22D) intersecting with and integrally connected to a rear end of the holding main body (21A to 21D) and arranged to cover the wire connecting portion (63A to 63D) from the front and/or behind.

Abstract: The connector includes a circuit board having a number of electronic components, a transmission assembly joined to the circuit board to a side of the electronic components, a first shielding member on the circuit board shielding the transmission assembly, a second shielding member on the circuit board shielding the electronic components, and a cover on and shielding the first and second shielding members. The connector can be produced to meet different needs by using a common first shielding member joined to a second shielding member adapted to a specific requirement such as dimension, shape, etc., thereby reducing the production and stock costs. The transmission assembly and the electronic components are shielded by the first and second shielding members, respectively, which are further shielded by the cover so as to prevent RF signal leakage and to achieve superior transmission quality.

Abstract: An apparatus and a method are disclosed herein. The apparatus is disclosed that includes a probe head and a circuit board. The probe head includes a metal housing and pins. The pins penetrate through the metal housing. The circuit board is configured to test a semiconductor device and includes a ground pad. The ground pad is electrically coupled between the metal housing and the circuit board.

Abstract: A transmission line and an electronic component including a resonator using the transmission line are provided. The transmission line is capable of transmitting electromagnetic waves of at least one frequency ranging from 1 GHz to 10 GHz and is composed of a first dielectric with a first relative permittivity and a surrounding dielectric portion composed of a second dielectric with a second relative permittivity, wherein, the first dielectric is represented by a formula of {XBaO.(1?X)SrO}TiO2 (0.25<X?0.55), and the second relative permittivity is smaller than the first relative permittivity.

Abstract: A filtered feedthrough assembly for an implantable medical device includes a ferrule, an electrical insulator coupled to the ferrule by a connection element, a plurality of feedthrough conductors extending through the electrical insulator, a printed circuit board (PCB), and a plurality of capacitors. The PCB is coupled to the ferrule or the electrical insulator, and includes one or more ground layers and a plurality of vias. The connection element is electrically coupled to the ground layer through the vias. The capacitor has a ground terminal electrically coupled to the ground layer through at least one of the vias, and a conductor terminal electrically coupled to the feedthrough conductor.

Abstract: A shoe insole sensor includes a body including a plurality of recessed regions formed at respective locations corresponding to vertexes of N-polygon, where N is an even number, a plurality of first protrusions formed in odd recessed regions of the recessed regions, where each of the first protrusions has a first height, and a plurality of second protrusions formed in even recessed regions of the recessed regions, where each of the second protrusions has a second height different from the first height. Here, the body is formed with a nonconductive material, each of the first protrusions is formed with a conductive material, and each of the second protrusions is formed with a conductive material.