Feedthrough Type Patents (Class 333/182)
  • Patent number: 11904073
    Abstract: A biocompatible electrical connection includes a substrate; a ferrule having a concentric flange at a first end of the ferrule; a first adhesive; and a second adhesive. The first adhesive adheres a first surface of the concentric flange of the ferrule to a surface of the substrate. The second adhesive fills an annular space between a hole in the substrate and the ferrule. The first adhesive or the second adhesive forms a conductive path on the surface of the substrate between the ferrule and a circuit pattern on the substrate.
    Type: Grant
    Filed: October 27, 2022
    Date of Patent: February 20, 2024
    Assignee: VERILY LIFE SCIENCES LLC
    Inventors: Alexander Loo, Damiano Patron, Matthew Page
  • Patent number: 11894163
    Abstract: One example provides a ferrule for an implantable medical device including a frame body having an upper surface and an opposing lower surface, an interior perimeter surface extending between the upper and lower surfaces for attachment to an insulator body, and an exterior perimeter surface extending between the upper and lower surfaces for attachment to a housing. A flange extends from the exterior perimeter surface and has an upper surface facing the upper surface of the frame body, the upper surface of the flange to engage an interior surface of a housing of the implantable medical device to limit a position of the housing along the exterior perimeter surface in a direction toward the bottom surface of the frame body, wherein a distance of the top surface of the flange from the top surface of the frame body is greater than and proportional to a thickness of the housing.
    Type: Grant
    Filed: February 22, 2021
    Date of Patent: February 6, 2024
    Assignee: Heraeus Medical Components LLC
    Inventor: Harold Holmberg
  • Patent number: 11865639
    Abstract: Various embodiments of a hermetic assembly and a method of forming such assembly are disclosed. The hermetic assembly includes a dielectric substrate having a first major surface and a second major surface, a patterned layer connected to the first major surface of the dielectric substrate by a laser bond, and a ferrule having a body and a flange extending from the body. The flange is welded to a welding portion of the patterned layer that is disposed between the flange and the first major surface of the dielectric substrate such that the ferrule is hermetically sealed to the dielectric substrate.
    Type: Grant
    Filed: December 10, 2020
    Date of Patent: January 9, 2024
    Assignee: Medtronic, Inc.
    Inventors: David A. Ruben, Andreas Fenner, Andrew J. Ries, Robert A. Munoz, Christopher T. Kinsey, Mark E. Henschel
  • Patent number: 11855384
    Abstract: It is aimed to improve anti-vibration performance. A connector includes a case made of metal and including an opening, and a terminal holding member made of synthetic resin for holding terminal fittings, the terminal holding member being integrated with the case while penetrating through the opening. The opening 18 includes a protruding portion protruding inward toward an outer periphery of the terminal holding member. The terminal holding member includes an inclination restricting portion to be held in contact with at least one of an outer surface and an inner surface of the protruding portion. Since the inclination restricting portion is in contact with the protruding portion, the inclination of the terminal holding member with respect to the case is suppressed even if the terminal holding member is subjected to vibration.
    Type: Grant
    Filed: January 8, 2020
    Date of Patent: December 26, 2023
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Yasunori Asano, Motoki Kubota
  • Patent number: 11843152
    Abstract: An integrated microstrip circulator comprises a dielectric substrate having an aperture, a ferrite disc secured within the aperture in the dielectric substrate, metallization on upper surfaces of the dielectric substrate and the ferrite disc, and surface mount contacts disposed on lower surfaces of the dielectric substrate and the ferrite disc and in electrical communication with the metallization on the upper surfaces of the dielectric substrate and the ferrite disc.
    Type: Grant
    Filed: December 2, 2021
    Date of Patent: December 12, 2023
    Assignee: SKYWORKS SOLUTIONS, INC.
    Inventors: Iain Alexander Macfarlane, Scott David Wilson, David Bowie Cruickshank, Michael David Hill
  • Patent number: 11789068
    Abstract: Embodiments of the present disclosure provide an antenna assembly for a test system. The antenna assembly includes a feedthrough part, two waveguide inputs, a single waveguide output as well as a multiplexing part that is interconnected between the two waveguide inputs and the single waveguide output. The multiplexing part is integrated within the feedthrough part at least partially. Moreover, embodiments of the present disclosure provide a test system and a method of establishing a test system for testing a device under test.
    Type: Grant
    Filed: July 1, 2021
    Date of Patent: October 17, 2023
    Assignee: Rohde & Schwarz GmbH & Co. KG
    Inventors: Corbett Rowell, Daniel Markert
  • Patent number: 11764745
    Abstract: An implantable pulse generator including a header, a can, and a filtered feedthrough assembly. The header including lead connector blocks. The can coupled to the header and including a wall and an electronic substrate housed within the wall. The filtered feedthrough assembly including a flange mounted to the can and having a feedthrough port, a plurality of feedthrough wires extending through the feedthrough port, and an insulator brazed to the feedthrough port of the flange. The filtered feedthrough assembly further including a capacitor having the plurality of feedthrough wires extending there through, an insulating washer positioned between and abutting the insulator and the capacitor at least in the area of the braze joint such that the capacitor and the braze joint are non-conductive, and an electrically conductive material adhered to the capacitor and the flange for grounding of the capacitor.
    Type: Grant
    Filed: November 14, 2022
    Date of Patent: September 19, 2023
    Assignee: Pacesetter, Inc.
    Inventors: Kavous Sahabi, Jean-Baptiste Fruhauf
  • Patent number: 11701519
    Abstract: On example provides a ferrule for an implantable medical device including a first frame body having a first perimeter surface to make a brazed connection to a first medical device component, and a second frame body having a first perimeter surface to make a welded connection to a second medical device component. A spacer flange connects a second perimeter surface of the first frame body to a second perimeter surface of the second frame body, a thickness between a top surface and bottom of the spacer flange being less than a thickness between a top surface and a bottom surface of the first frame body such that the spacer flange is to deflect relative to the first frame body in response to forces being applied to the second frame body so as to reduce transmission of weld strain from the second frame body to the first frame body.
    Type: Grant
    Filed: February 22, 2021
    Date of Patent: July 18, 2023
    Assignee: Heraeus Medical Components LLC
    Inventor: Harold Holmberg
  • Patent number: 11701520
    Abstract: An implantable medical device, battery and method include memory configured to store program instructions. At least one of circuitry or a processor are configured to execute the program instructions in connection with at least one of monitoring a biological signal or administering a therapy. The device includes a battery comprising a cell stack that includes an anode, a cathode, and one or more separator layers electrically insulating the anode from the cathode. The device includes a case having a feedthrough port and a feedthrough assembly disposed in the feedthrough port. The feedthrough assembly includes a ferrule having a lumen. An inner conductor is disposed within the lumen of the ferrule. The inner conductor is formed from a material having a first composition and a first coefficient of thermal expansion (CTE). An insulating core is disposed within the lumen of the ferrule and separates the inner conductor from the ferrule.
    Type: Grant
    Filed: May 8, 2020
    Date of Patent: July 18, 2023
    Assignee: Pacesetter, Inc.
    Inventor: Xiaofei Jiang
  • Patent number: 11699548
    Abstract: A structure for forming inductor windings includes a first portion and a second portion of a clamshell casing. The first portion includes a first set of electrically conductive segments, a first inner carrier, and a first outer carrier. The second portion includes a second set of electrically conductive segments, a second inner carrier, and a second outer carrier. An inductor core is mountable between the first inner carrier and the first outer carrier within the first portion. A control assembly aligns and joins the first portion to the second portion of the clamshell casing such that the first set of electrically conductive segments arranged in the first pattern that correspond to first half-turns of the inductor windings, are attached to the second set of electrically conductive segments arranged in the second pattern that correspond to second half-turns of the inductor windings, to form continuous turns around the inductor core.
    Type: Grant
    Filed: July 29, 2022
    Date of Patent: July 11, 2023
    Assignee: Tesla, Inc.
    Inventor: Tobias S. Ricco
  • Patent number: 11652558
    Abstract: A signal processing system includes: an interference source; and a band-stop filter. A first terminal of the band-stop filter is electrically connected to the interference source, a second terminal of the band-stop filter is grounded, and the band-stop filter is configured to filter a baseband signal output by the interference source. The interference source includes a first main board; or the interference source includes a target module and a metal frame used for fastening the target module, and the target module is a display module or a camera module.
    Type: Grant
    Filed: July 22, 2021
    Date of Patent: May 16, 2023
    Assignee: VIVO MOBILE COMMUNICATION CO., LTD.
    Inventor: Guokun Xiao
  • Patent number: 11581123
    Abstract: An inductor unit includes a conductive structure, a first magnetic element and an insulating layer. The conductive structure has a bottom conductive layer, a top conductive layer, and a first side conductive layer extending from the bottom conductive layer to the top conductive layer. The first magnetic element is disposed on the bottom conductive layer of the conductive structure. The insulating layer is disposed on the bottom conductive layer of the conductive structure, wherein the insulating layer covers and surrounds the first magnetic element. The circuit structure including the inductor unit and the methods for manufacturing the same are also provided.
    Type: Grant
    Filed: July 23, 2020
    Date of Patent: February 14, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Syu-Tang Liu, Huang-Hsien Chang, Yunghsun Chen
  • Patent number: 11570925
    Abstract: A connection device includes a housing having a first face provided with a first opening that is closed by a PCB, and a second face provided with a second opening facing at least one electrical connection interface of the PCB. The housing includes at least one well extending from an edge of the second opening to the PCB so as to position a first connector relative to the connection interface, and in that the housing is a one-piece part that includes the well.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: January 31, 2023
    Assignee: SAFRAN ELECTRONICS & DEFENSE
    Inventors: François Guillot, Marvin Doreau, Louis-Théophile Thirion
  • Patent number: 11559695
    Abstract: Implantable medical devices have modular lead bores that are constructed from individual lead bore modules. A given modular lead bore utilizes the number of individual lead bore modules necessary for the particular implantable medical device. Each lead bore module has a lead bore passageway and a feedthrough passageway. An electrical contact is present within the lead bore passageway of each lead bore module and the electrical contact is aligned to the lead bore passageway of a lead bore module. Hermetic feedthrough assemblies are also present within the lead bore passageway of each lead bore module. A feedthrough pin passes through a hermetic feedthrough assembly within a feedthrough passageway of each lead bore module. Each feedthrough pin is electrically coupled to a corresponding electrical contact and the medical device circuitry.
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: January 24, 2023
    Assignee: MEDTRONIC, INC.
    Inventors: Darren A. Janzig, Andrew Thom, Brad Tischendorf, Randy S. Roles, Steven T. Deininger, Nicholas R. Whitehead
  • Patent number: 11546002
    Abstract: A transmitter, a receiver and a transceiver are provided. The transceiver includes a hybrid transceiving circuit and a common-mode voltage control circuit. The hybrid transceiving circuit includes a digital-to-analog converter (DAC) circuit, a line driver coupled to the DAC circuit, a filtering and/or amplifying circuit coupled to the line driver, and an analog-to-digital converter (ADC) circuit coupled to the filtering and/or amplifying circuit. The common-mode voltage control circuit is electrically connected to a node of the hybrid transceiving circuit and is configured to detect a common-mode voltage of the node and to adjust the common-mode voltage of the node.
    Type: Grant
    Filed: April 8, 2020
    Date of Patent: January 3, 2023
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Jian-Ru Lin, Wei-Chou Wang, Tung-Hung Sung, Shih-Hsiung Huang
  • Patent number: 11504453
    Abstract: A biocompatible electrical connection includes: a substrate; a ferrule having a concentric flange at a first end of the ferrule; a first adhesive; and a second adhesive. The substrate includes a hole having a diameter that is a specified amount larger than an outside diameter of the ferrule forming an annular space between the hole and the ferrule, the first adhesive adheres a first surface of the concentric flange of the ferrule to a first surface of the substrate, and the second adhesive fills the annular space between the hole and the ferrule.
    Type: Grant
    Filed: October 17, 2019
    Date of Patent: November 22, 2022
    Assignee: VERILY LIFE SCIENCES LLC
    Inventors: Alexander Loo, Damiano Patron, Matthew Page
  • Patent number: 11477924
    Abstract: An interface for mitigating electromagnetic interference (EMI) on a printed circuit board (PCB) is disclosed. The PCB can contain circuit components and includes one or more signal planes sandwiched between corresponding ground planes. The PCB has a first and second side and an interface region separating the first and second sides that includes a partition wall projecting outward from the interface region, configured for EMI shielding between the first side and second sides, one or more pairs of input and output pads straddling the interface region on respective first and second sides and configured to accommodate an EMI line filter, and a ground barrier within the printed circuit board under the interface region. A method of mitigating EMI using the interface is also disclosed.
    Type: Grant
    Filed: March 9, 2021
    Date of Patent: October 18, 2022
    Assignee: HAMILTON SUNDSTRAND CORPORATION
    Inventors: Constantinos J. Mantis, Edward John Marotta, James A. Gosse
  • Patent number: 11296450
    Abstract: An electrical connector assembly includes a receptacle connector and a plug connector adapted to be mated with each other. The receptacle connector includes a contact unit forwardly assembled into the receptacle housing and having a plurality of receptacle contacts and a common mode choke electrically connected together. The plug connector includes a resilient latch associated with the plug shell and received within an enlarged area of a circumferential space formed between the receptacle shell and the receptacle housing.
    Type: Grant
    Filed: July 27, 2020
    Date of Patent: April 5, 2022
    Assignees: FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD., FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventor: Terrance F. Little
  • Patent number: 11243097
    Abstract: A rotary encoder includes a rotor, a stator, and a casting compound. The casting compound has a first surface facing the stator. The first surface has a first predetermined shape and is fixed in relation to the stator. The casting compound has a second surface facing away from the stator, the second surface having a second predetermined shape.
    Type: Grant
    Filed: September 27, 2019
    Date of Patent: February 8, 2022
    Assignee: LEINE & LINDE AB
    Inventors: Richard Arnstein, Per Andréason
  • Patent number: 11210446
    Abstract: In some embodiments, an apparatus can include a printed circuit board (PCB) that has layers and includes a first portion and a second portion. The first portion can have a data port and a power port. A first layer is associated with data of the first portion of the PCB, and a second layer is associated with power of the first portion of the PCB. The second portion can have a data port and a power port. A third layer is associated with data of the second portion, and a fourth layer is associated with power of the second portion. The first portion or the second portion can have vias defining an electromagnetic interference (EMI) shield. The apparatus can include a power filter and a data filter that can, respectively, isolate power and data of the first portion from the second portion.
    Type: Grant
    Filed: February 8, 2021
    Date of Patent: December 28, 2021
    Assignee: Management Services Group, Inc.
    Inventors: Thomas Scott Morgan, Martin Mayer, Steve Yates
  • Patent number: 11202375
    Abstract: A device that includes a substrate including a plurality of metal layers, and a plurality of dielectric layers. The device further includes a first passive component including a first terminal, a second terminal, and a first body, mounted to the substrate on one of the plurality of metal layers. The first terminal is coupled to a first ground signal and the second terminal is coupled to a second ground signal such that the first passive component is shorted.
    Type: Grant
    Filed: February 19, 2020
    Date of Patent: December 14, 2021
    Assignee: QUALCOMM Incorporated
    Inventors: Yu-Chun Liu, Peter Mark Davulis
  • Patent number: 11177318
    Abstract: Various embodiments may provide a semiconductor package. The semiconductor package may include a substrate including a via hole. The semiconductor package may also include a chip attached to the substrate. The semiconductor package may further include a prefabricated ferromagnetic pin having a first portion held by the via hole, a second portion extending from a first end of the first portion, and a third portion extending from a second end of the first portion opposite the first end. The semiconductor package may also include a first magnetic shield structure attached to or extended from the second portion of the prefabricated ferromagnetic pin. The semiconductor package may further include a second magnetic shield structure attached to or extended from the third portion of the prefabricated ferromagnetic pin, such that at least a portion of the chip is between the first magnetic shield structure and the second magnetic shield structure.
    Type: Grant
    Filed: January 28, 2019
    Date of Patent: November 16, 2021
    Assignee: Agency for Science, Technology and Research
    Inventors: Teck Guan Lim, Hideaki Fukuzawa, Hang Liu
  • Patent number: 11147978
    Abstract: Implantable medical devices have a feedthrough from the device to the outside world to pass electrical current from electronics inside the implant to the patient or vice versa. A plurality of sensors and/or signal wires must connect to the feedthrough and implant in living tissue. Chemical and physical forces work against the wire connections. Embodiments of the present invention include a biocompatible cap or top, shaped to attach onto a rim of the feedthrough device. One or more wire bundle ports are included on the cap. One or two layers of a sealant (e.g., epoxy) can be injected under the cap. A first layer can rigidly protect the wire bonds, and an elastomeric silicone can cover the epoxy for a flexible protector. Other embodiments include an implant housing with a recess for the feedthrough; a top can protect the recess. One or more sealants can cover the feedthrough.
    Type: Grant
    Filed: October 30, 2019
    Date of Patent: October 19, 2021
    Assignee: WYSS CENTER FOR BIO AND NEURO ENGINEERING
    Inventors: Dana D. Tompkins, Christopher D. Gongora, Achim Kitschmann, Jennifer Losasso-Tompkins, Claude Clément
  • Patent number: 11094454
    Abstract: A noise reduction unit includes a conductor having a winding portion and a ring-shaped core which is made of a magnetic material and is inserted through the winding portion, and a housing which houses the conductor and the ring-shaped core. An inner wall surface of the housing is formed with a recess configured to receive a part of the winding portion located on an outer circumferential surface of the ring-shaped core. The conductor is housed in the housing so that the part of the winding portion is received in the recess.
    Type: Grant
    Filed: June 22, 2018
    Date of Patent: August 17, 2021
    Assignee: YAZAKI CORPORATION
    Inventors: Hayato Iizuka, Kazuma Kayo
  • Patent number: 10955671
    Abstract: Apparatus and method relating generally to electronics are disclosed. In one such an apparatus, a film assembly has an upper surface and a lower surface opposite the upper surface. A dielectric film of the film assembly has a structured profile along the upper surface or the lower surface for having alternating ridges and grooves in a corrugated section in an at rest state of the film assembly. Conductive traces of the film assembly conform to the upper surface or the lower surface in or on the dielectric film in the corrugated section.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: March 23, 2021
    Assignee: Invensas Corporation
    Inventors: Belgacem Haba, Ilyas Mohammed, Gabriel Z. Guevara, Min Tao
  • Patent number: 10931060
    Abstract: A connector includes: a plurality of conductors; a magnetic core; a housing; and an insulator that locates a core assembling portion therein, the core assembling portion being composed of the respective intermediate portions of the plurality of conductors and the magnetic core, the housing chamber is at least partitioned into a first space in which the core assembling portion is housed and a second space in which the first electrical connection portion and the first counterpart conductor side are housed and are physically and electrically connected to each other, and the insulator is a solidified material of a liquid insulating potting agent filled in the vicinity of the core assembling portion in the first space in order to cover the core assembling portion.
    Type: Grant
    Filed: March 17, 2020
    Date of Patent: February 23, 2021
    Assignee: YAZAKI CORPORATION
    Inventors: Hayato Iizuka, Kazuma Kayo
  • Patent number: 10886815
    Abstract: An electrical connector for an electric motor, includes an insulating main body with a front side configured to be coupled with the motor and a rear side configured to be coupled with a corresponding wiring harness, a plurality of electrical terminals fixed by the main body, and at least one current protection element. The at least one current protection element is positioned in the main body.
    Type: Grant
    Filed: September 7, 2017
    Date of Patent: January 5, 2021
    Assignee: JOHNSON ELECTRIC INTERNATIONAL AG
    Inventors: Bruno Grasso, Carlo Canuto
  • Patent number: 10727173
    Abstract: A power module includes an upper substrate comprising a plurality of circuit pattern areas made of a metal and a dielectric area disposed between each of the plurality of circuit pattern areas; a lower substrate including a plurality of circuit pattern areas made of a metal and a dielectric area disposed between each of the plurality of circuit pattern areas; and a semiconductor element having an upper terminal and a lower terminal, the upper terminal and the lower terminal being bonded to a lower surface of the upper substrate and an upper surface of the lower substrate, respectively.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: July 28, 2020
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Jun Hee Park, Hyeon Uk Kim
  • Patent number: 10707628
    Abstract: A noise filter including a conductor and an annular core. The conductor has a wound portion. The annular core is formed of a magnetic material and passes through the wound portion. The annular core is formed of a pair of split cores that are assembled together with joining surfaces on both ends to be joined to each other. At least one of a recess portion and a projection portion that engage with each other is formed on the joining surfaces of the split cores which are joined to each other.
    Type: Grant
    Filed: April 6, 2018
    Date of Patent: July 7, 2020
    Assignee: Yazaki Corporation
    Inventors: Hayato Iizuka, Kazuma Kayo
  • Patent number: 10607777
    Abstract: Disclosed are apparatus and a method for providing an integrated multiterminal multilayer ceramic device that has three or more capacitive elements. Two of such capacitive elements may be in series, with a third in parallel. The integrated device may be packaged as an overmolded three leaded component, or can be mounted as SMD (surface mount device). The integrated device may also be combined with a separate varistor in a stacked arrangement of leaded components.
    Type: Grant
    Filed: February 2, 2018
    Date of Patent: March 31, 2020
    Assignee: AVX Corporation
    Inventors: Michael Kirk, Marianne Berolini
  • Patent number: 10541664
    Abstract: A conductive path with noise filter that enables an effective reduction in a surge noise in a specific frequency band is provided. A conductive path with noise filter includes conductive path main bodies, insulating layers that respectively surround the conductive path main bodies, conductive layers that are respectively provided to correspond to the conductive path main bodies with the insulating layers being sandwiched between the conductive layers and the conductive path main bodies and that respectively form capacitors in combination with the conductive path main bodies, and inductors connected to the conductive layers.
    Type: Grant
    Filed: August 27, 2015
    Date of Patent: January 21, 2020
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Keiji Hirata, Akihiro Hayashi
  • Patent number: 10338024
    Abstract: An electric potential is applied to first and second electrodes on opposite sides of a gap between an electronic component and a heat spreader. At least one of a thermal interface material in the gap, the electronic component and the heat spreader is subjected to a changing physical condition. The capacitance is monitored. Such a method can be practiced using an array of components sharing a common heat spreader. An assembly for testing thermal interfaces includes a printed circuit board, a plurality of electronic components mounted to and operatively associated with the printed circuit board, a heat spreader positioned for absorbing heat generated by the electronic components, a first electrode associated with the heat spreader, a plurality of second electrodes associated, respectively, with the electronic component, and a device for monitoring electrical capacitances. The technique may be employed for monitoring physical changes in electronic devices.
    Type: Grant
    Filed: July 8, 2017
    Date of Patent: July 2, 2019
    Assignee: International Business Machines Corporation
    Inventors: Timothy J. Chainer, Michael A. Gaynes, Edward J. Yarmchuk
  • Patent number: 10285279
    Abstract: A semiconductor device includes a semiconductor module which has an external terminal protruding from one surface thereof; a printed circuit board which is electrically and mechanically connected to the external terminal of the semiconductor module; a heatsink which abuts against the other surface of the semiconductor module opposite to the one surface; and a joint member which serves as an elastic support column having a first head portion and a second head portion. The first head portion is shaped like a truncated cone and disposed at one end of the elastic support column, and the second head portion is disposed at the other end of the elastic support column. The semiconductor module, the printed circuit board and the heat sink are integrated by the first head portions and the second head portions.
    Type: Grant
    Filed: October 13, 2015
    Date of Patent: May 7, 2019
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Yusuke Sekino
  • Patent number: 10263586
    Abstract: A filter arrangement for filtering parasitic induction currents may include an electrically conductive housing part that at least partly surrounds a cavity, an electric ground connection on the housing part for establishing an electric connection to an electric ground, a busbar in the cavity, and at least one electric filter component electrically connected between the busbar and the housing part and mechanically secured to the housing part and to the busbar. A voltage converter may include at least one such filter arrangement.
    Type: Grant
    Filed: June 9, 2015
    Date of Patent: April 16, 2019
    Assignee: CONTI TEMIC MICROELECTRONIC GMBH
    Inventors: Matthias Ridder, Adam Umerski
  • Patent number: 10154616
    Abstract: An electromagnetic interference filter for various electronic devices such as implantable medical devices is provided. A plurality of signal electrodes can be configured in an array, where each signal electrode extends vertically from a top surface to a bottom surface of the filter such that the signal electrodes are flush with the top and bottom surface. Ground or common electrodes can have a parallel arrangement and be interposed between the signal electrodes. The ground electrodes can be grounded internally, externally, or both internally and externally. Dielectric material can be disposed between signal electrodes and ground electrodes to act as an insulator between adjacent electrodes.
    Type: Grant
    Filed: May 6, 2015
    Date of Patent: December 11, 2018
    Assignee: AVX Corporation
    Inventors: Andrew P. Ritter, Richard J. Panlener, Sam Eldawoudy, Kimberly Van Alstine
  • Patent number: 10079585
    Abstract: An LC filter that is able to obtain high insertion loss in a high-frequency band. The LC filter includes: a core including a core portion and a pair of flange portions formed at both sides of the core portion; a winding; and a pair of signal outer electrodes. At least one of the pair of flange portions is composed of a multilayer body in which inner electrodes and dielectric layers are alternately laminated, and includes a ground outer electrode. The inner electrodes include a first inner electrode and a second inner electrode alternately arranged. The first inner electrode is connected to the signal outer electrode, and the second inner electrode is connected to the ground outer electrode.
    Type: Grant
    Filed: March 7, 2017
    Date of Patent: September 18, 2018
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Yang Guan
  • Patent number: 9937354
    Abstract: An encapsulated filtered feedthrough assembly for an implantable medical device including a ferrule, an electrical insulator coupled to the ferrule, a printed circuit board (PCB), a feedthrough conductor extending through the electrical insulator and the PCB, and a capacitor coupled to the PCB. The encapsulated filtered feedthrough assembly can include a mold defining an opening and located with respect to the printed circuit board such that at least a portion of the capacitor is positioned within the opening. A first non-conductive material can underfill the capacitor and a second non-conductive material can be backfilled into the mold to encapsulate the capacitor.
    Type: Grant
    Filed: March 24, 2016
    Date of Patent: April 10, 2018
    Assignee: Cardiac Pacemakers, Inc.
    Inventors: Patrick J. Barry, Randy White, Steven A. Kubow, Scott A. Spadgenske, David A. Chizek, Jerald Sauber
  • Patent number: 9882323
    Abstract: Connector receptacles that are able to withstand insertion and other forces, are reliable, and are easy to manufacture. One example may provide a connector receptacle having one or more movable portions. These movable portions may move relative to an enclosure for an electronic device housing the connector receptacle. When a connector insert is inserted into the receptacle, the movable portions may move to help absorb insertion forces thereby protecting the connector receptacle from damage.
    Type: Grant
    Filed: April 9, 2015
    Date of Patent: January 30, 2018
    Assignee: APPLE INC.
    Inventors: George Tziviskos, Paul J. Hack, Matthew W. Blum
  • Patent number: 9793618
    Abstract: A connector (10) includes a housing (20) with terminal holding portions (20A to 20D) and terminal fittings (60) in the respective terminal holding portions (20A to 20D). Each terminal fitting (60) includes a terminal main body (62A to 62D) having an annular portion (61A to 61 D) arranged substantially along a front-back direction. A wire connecting portion (63A to 63D) is connected to a rear end of the terminal main body (62A to 62D) and is connectable to a wire (W). The terminal holding portion (20A to 20D) includes a holding main body (21A to 21D) configured so that the annular portion (61A to 61D) is to be fit thereto, and a protecting portion (22A to 22D) intersecting with and integrally connected to a rear end of the holding main body (21A to 21D) and arranged to cover the wire connecting portion (63A to 63D) from the front and/or behind.
    Type: Grant
    Filed: January 23, 2015
    Date of Patent: October 17, 2017
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Kosuke Sone, Hiroyoshi Maesoba, Tomohide Maki, Katsushi Miyazaki
  • Patent number: 9722365
    Abstract: The connector includes a circuit board having a number of electronic components, a transmission assembly joined to the circuit board to a side of the electronic components, a first shielding member on the circuit board shielding the transmission assembly, a second shielding member on the circuit board shielding the electronic components, and a cover on and shielding the first and second shielding members. The connector can be produced to meet different needs by using a common first shielding member joined to a second shielding member adapted to a specific requirement such as dimension, shape, etc., thereby reducing the production and stock costs. The transmission assembly and the electronic components are shielded by the first and second shielding members, respectively, which are further shielded by the cover so as to prevent RF signal leakage and to achieve superior transmission quality.
    Type: Grant
    Filed: August 5, 2016
    Date of Patent: August 1, 2017
    Assignee: ALLSMARTLITE TECHNOLOGY CO., LTD.
    Inventors: Xiaoping Wang, Ming-Han Perng, Chien-Hsing Lai
  • Patent number: 9678109
    Abstract: An apparatus and a method are disclosed herein. The apparatus is disclosed that includes a probe head and a circuit board. The probe head includes a metal housing and pins. The pins penetrate through the metal housing. The circuit board is configured to test a semiconductor device and includes a ground pad. The ground pad is electrically coupled between the metal housing and the circuit board.
    Type: Grant
    Filed: January 9, 2014
    Date of Patent: June 13, 2017
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventor: Ming-Cheng Hsu
  • Patent number: 9647316
    Abstract: A transmission line and an electronic component including a resonator using the transmission line are provided. The transmission line is capable of transmitting electromagnetic waves of at least one frequency ranging from 1 GHz to 10 GHz and is composed of a first dielectric with a first relative permittivity and a surrounding dielectric portion composed of a second dielectric with a second relative permittivity, wherein, the first dielectric is represented by a formula of {XBaO.(1?X)SrO}TiO2 (0.25<X?0.55), and the second relative permittivity is smaller than the first relative permittivity.
    Type: Grant
    Filed: July 1, 2015
    Date of Patent: May 9, 2017
    Assignee: TDK CORPORATION
    Inventors: Toshio Sakurai, Kiyoshi Hatanaka, Takashi Fukui, Shigemitsu Tomaki
  • Patent number: 9521744
    Abstract: A filtered feedthrough assembly for an implantable medical device includes a ferrule, an electrical insulator coupled to the ferrule by a connection element, a plurality of feedthrough conductors extending through the electrical insulator, a printed circuit board (PCB), and a plurality of capacitors. The PCB is coupled to the ferrule or the electrical insulator, and includes one or more ground layers and a plurality of vias. The connection element is electrically coupled to the ground layer through the vias. The capacitor has a ground terminal electrically coupled to the ground layer through at least one of the vias, and a conductor terminal electrically coupled to the feedthrough conductor.
    Type: Grant
    Filed: February 20, 2015
    Date of Patent: December 13, 2016
    Assignee: Cardiac Pacemakers, Inc.
    Inventors: Patrick J. Barry, Randy White, Troy A. Giese, James E. Blood, Michael J. Lyden, Robert M. Mohn
  • Patent number: 9510776
    Abstract: A shoe insole sensor includes a body including a plurality of recessed regions formed at respective locations corresponding to vertexes of N-polygon, where N is an even number, a plurality of first protrusions formed in odd recessed regions of the recessed regions, where each of the first protrusions has a first height, and a plurality of second protrusions formed in even recessed regions of the recessed regions, where each of the second protrusions has a second height different from the first height. Here, the body is formed with a nonconductive material, each of the first protrusions is formed with a conductive material, and each of the second protrusions is formed with a conductive material.
    Type: Grant
    Filed: November 15, 2012
    Date of Patent: December 6, 2016
    Inventor: Jin-Wook Lee
  • Patent number: 9502842
    Abstract: A network interface connector includes a plurality of first and second alternating elongate contacts having contact portions situated in a common plane. The first and second contacts have rearward portions situated in respective first and second spaced parallel planes defining a proximity gap between them. A proximity insert having a particular electrical construction suited for a particular application is situated, preferably in a replaceable manner, in the proximity gap to provide the connector with desired transmission properties.
    Type: Grant
    Filed: June 3, 2015
    Date of Patent: November 22, 2016
    Assignee: Bel Fuse (Macao Commercial Offshore) Ltd.
    Inventors: Yakov Belopolsky, David Henry Gutter, Richard D. Marowsky, Mark Ellis
  • Patent number: 9490573
    Abstract: A plug connector suitable for connecting with a socket connector including a first internal screw thread is provided. The plug connector includes an internal casing having an inside space, a set of terminals disposed in said inside space, a sleeve tube and an external casing. The sleeve tube is fixed to said internal casing and includes an external hook. The external casing is movably covered to said internal casing and includes a first external screw thread, an internal hook and a concaved slot caving in the inner surface of the external casing facing to said internal casing. The internal hook forms one of walls of said concaved slot. The external hook is movably disposed in said concaved slot. When said socket connector screws to said plug connector, said external casing is pulled toward said socket connector, and said internal hook of said external casing contact said external hook of said sleeve tube.
    Type: Grant
    Filed: March 6, 2015
    Date of Patent: November 8, 2016
    Assignee: CHANT SINCERE CO., LTD.
    Inventors: Yu Chin Chien, Chun-Hsiang Hsu, Yong-Sheng Lin
  • Patent number: 9478887
    Abstract: A connector insert comprising a plurality of layers of conductive elastomer, and a concomitant method of employing a connector insert, the method comprising the steps of fabricating a plurality of layers of conductive elastomer as an insert and placing the insert into a connector.
    Type: Grant
    Filed: October 31, 2014
    Date of Patent: October 25, 2016
    Assignee: Quell Corporation
    Inventors: Ken Godana, Dusty Erven, Kevin Foreman, Paul Miller
  • Patent number: 9472887
    Abstract: An electrical connector includes a housing stack, signal and ground conductors, and an electrically conductive ground bracket. The housing stack comprises a front housing and a rear housing. The front housing defines a mating end of the housing stack, and the rear housing defines a mounting end of the housing stack. The housing stack defines signal cavities and ground cavities that extend continuously through the front housing and the rear housing. The signal conductors and ground conductors are held in the signal cavities and ground cavities, respectively, of the housing stack. The signal conductors are arranged in signal pairs, and the ground conductors are interleaved between the signal pairs. The ground bracket is held in the housing stack between the front housing and the rear housing. The ground bracket engages and is electrically connected to each of the ground conductors to electrically common the ground conductors along a ground plane.
    Type: Grant
    Filed: April 22, 2015
    Date of Patent: October 18, 2016
    Assignee: Tyco Electronics Corporation
    Inventors: Michael James Horning, Wayne Samuel Davis
  • Patent number: 9461353
    Abstract: There is provided a power combiner configured to combine high-frequency powers such that the high-frequency powers respectively input to a plurality of input terminals are output from one output terminal via transmission circuits respectively connected to the input terminals. The respective input terminals are connected to one ends of resistances in parallel with the respective transmission circuits and the other ends of the resistances are connected to each other, so that the input terminals are connected to each other through the resistances connected to the respective input terminals. Each of the transmission circuits is comprised of a circuit in which a first inductor, a transmission section having a constant characteristic impedance and a second inductor are connected to each other in series.
    Type: Grant
    Filed: March 18, 2014
    Date of Patent: October 4, 2016
    Assignee: DAIHEN CORPORATION
    Inventor: Hirotaka Takei
  • Patent number: 9444201
    Abstract: An electric connector includes an insulation body, a shielding shell, first and second conductive terminals, and an organizer. The insulation body has a base portion and a tongue portion extended horizontally forward from the base portion. The shielding shell encloses the insulation body. Each first or second conductive terminal has a retaining section fixedly located in the insulation body, a contact section extended forward from the retaining section and located on the tongue portion, and a soldering section bent upward from the retaining section and extended outside the base portion. The organizer located on the base portion has an elongate slot and apertures that penetrate the base portion. The elongate slot allows the soldering sections of the first conductive terminals to pass through and anchor therein. Each aperture allows the soldering section of each second conductive terminal to pass through and anchor therein.
    Type: Grant
    Filed: February 26, 2015
    Date of Patent: September 13, 2016
    Assignee: Advanced-Connectek Inc.
    Inventors: Ching-Tien Chen, Shu-Lin Duan, Wei Wan, Fu-Yi Xu, Pei-Hsuan Huang