Strip Type Patents (Class 333/238)
  • Patent number: 10811753
    Abstract: A hollow-waveguide-to-planar-waveguide transition circuit includes: a dielectric substrate; strip conductors formed on a first main surface of the dielectric substrate; a ground conductor formed on a second main surface of the dielectric substrate, facing the strip conductors in the thickness direction; a slot formed in the ground conductor; a coupling conductor formed at a position to be electrically coupled with the strip conductors on the first main surface; and branch conductor lines formed on the first main surface. Each of the branch conductor lines includes a base portion branching from the coupling conductor and a tip portion that is electrically open.
    Type: Grant
    Filed: July 5, 2016
    Date of Patent: October 20, 2020
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Hiromasa Nakajima, Akimichi Hirota, Naofumi Yoneda, Takeshi Oshima
  • Patent number: 10790432
    Abstract: Techniques for implementing multiple microwave attenuators on a high thermal conductivity substrate for cryogenic applications to reduce heat and thermal noise during quantum computing are provided. In one embodiment, a device for using in cryogenic environment is provided that comprises a substrate having a thermal conductivity above a defined threshold, a plurality of transmission lines fabricated on the substrate and arranged with a separation gap between the plurality of transmission lines to maintain crosstalk below ?50 decibels, and one or more microwave attenuators embedded on the plurality of transmission lines.
    Type: Grant
    Filed: July 27, 2018
    Date of Patent: September 29, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Salvatore Bernardo Olivadese, James Robert Rozen, Patryk Gumann, Martin O. Sandberg
  • Patent number: 10777867
    Abstract: A transmission line of the disclosure includes: a first line; a second line having characteristic impedance higher than characteristic impedance of the first line; and a third line. The transmission line transmits a symbol that corresponds to a combination of signals in the first line, the second line, and the third line.
    Type: Grant
    Filed: August 6, 2019
    Date of Patent: September 15, 2020
    Assignee: Sony Corporation
    Inventor: Tatsuya Sugioka
  • Patent number: 10756672
    Abstract: A varainductor includes a signal line, a ground plane, and a floating plane over a substrate. The ground plane is disposed on a side of the signal line, and the first floating plane is disposed between the ground plane and the signal line. An array of switches includes at least two switches configured to selectively electrically connect the ground plane to the floating plane.
    Type: Grant
    Filed: April 11, 2018
    Date of Patent: August 25, 2020
    Assignee: TAIWAN SEMINCONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yi-Hsuan Liu, Hsieh-Hung Hsieh, Chewn-Pu Jou, Fu-Lung Hsueh
  • Patent number: 10720690
    Abstract: A transmission line structure includes a first transmission line having a first and a second extending line segments and a first and a second line segments extending along a first direction and a third line segment extending along a second direction, and a second transmission line having a third and a fourth extending line segments, a fourth and a fifth line segments extending along the first direction and a sixth line segment extending along the second direction. The first and the second extending line segment are connected to ends of the first and the second line segment. The third line segment is connected to sides of the first and the second line segment. The third and the fourth extending line segment are connected to ends of the fourth the fifth line segment. The sixth line segment is connected to sides of the fourth and the fifth line segment.
    Type: Grant
    Filed: October 25, 2018
    Date of Patent: July 21, 2020
    Assignee: CHUNG YUAN CHRISTIAN UNIVERSITY
    Inventor: Guang-Hwa Shiue
  • Patent number: 10673114
    Abstract: A signal transmission line includes a laminate, a signal conductor, a hollow portion, and a reinforcing conductor. The laminate includes a flexible laminate including resin layers each of which has flexibility. The signal conductor extends in a signal transmission direction of the laminate and is disposed in an intermediate position in a laminating direction of the resin layers. The hollow portion is in the laminate and defined by an opening provided at a portion of the plurality of resin layers. The reinforcing conductor is in the laminate. The hollow portion is disposed at a position overlapping with the signal conductor, in a plan view of the laminate from a surface perpendicular or substantially perpendicular to the laminating direction. The reinforcing conductor is disposed at a position different from the position of the hollow portion in a plan view.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: June 2, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kanto Iida, Nobuo Ikemoto
  • Patent number: 10615480
    Abstract: A radio frequency transmission arrangement comprises a ground plate having an aperture comprising a slot with an elongate cross-section and substantially parallel sides, and a first and second transmission line. The thickness of the ground plate is greater than a width of the slot. The first transmission line comprises a first elongate conductor on a first side of the ground plate and has an end terminated with a first termination stub. The second transmission line comprises a second elongate conductor on the opposite side of the ground plate and has an end terminated with a second termination stub. The first transmission line is arranged to cross the slot at a point adjacent to the first termination stub, and the second transmission line is arranged to cross the slot at a point adjacent to the second termination stub.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: April 7, 2020
    Assignee: CAMBIUM NETWORKS LIMITED
    Inventors: Peter Strong, Adam Wilkins, Carl Morrell, Paul Clark, Nigel Jonathan Richard King
  • Patent number: 10615481
    Abstract: A millimeter wave semiconductor apparatus includes: a module substrate including the millimeter wave semiconductor chip mounted thereon; and a waveguide tube member constituting a package of the chip and the waveguide tube by including the waveguide tube and supporting the module substrate, the module substrate includes: a base member; a line pattern including a microstrip line portion, a fin line portion, and an interface portion formed on one of surfaces of the base member; a ground pattern formed on the other surface of the base member; and a cavity defined by a hole formed through the base member at a center portion thereof and a surface of the ground pattern on a side where the line pattern is formed as a bottom surface for mounting the chip on the bottom surface thereof, and the microstrip line portion and the chip are wire-bonded at the substantially same level.
    Type: Grant
    Filed: August 18, 2016
    Date of Patent: April 7, 2020
    Assignee: NEC CORPORATION
    Inventor: Toshihide Kuwabara
  • Patent number: 10581147
    Abstract: An antenna is used in a radar, sensor, communication, discovery, electronic warfare and/or networking system. The antenna system includes a disc-shaped conductive substrate, a ring-shaped conductive substrate being positioned generally parallel with respect to the disc-shaped conductive substrate, the ring-shaped conductive substrate having an outer diameter generally coincides with an outer diameter of the disc-shaped conductive substrate. Antenna elements, such as, Balanced Antipodal Vivaldi Antenna (BAVA) elements, are disposed between the disc-shaped conductive substrate and the ring-shaped conductive substrate.
    Type: Grant
    Filed: January 23, 2017
    Date of Patent: March 3, 2020
    Assignee: ROCKWELL COLLINS, INC.
    Inventor: James B. West
  • Patent number: 10561012
    Abstract: Disclosed are apparatus and methods related to ground paths implemented with surface mount devices to facilitate shielding of radio-frequency (RF) modules. In some embodiments, a method for fabricating a radio-frequency module includes providing a packaging substrate, the packaging substrate configured to receive a plurality of components and the packaging substrate including a ground plane. In some embodiments, the method includes mounting a surface mount device on the packaging substrate, and forming or providing a conductive layer over the surface mount device such that the surface mount device electrically connects the conductive layer with the ground plane to thereby provide radio-frequency shielding between first and second regions about the surface mount device.
    Type: Grant
    Filed: October 10, 2017
    Date of Patent: February 11, 2020
    Assignee: Skyworks Solutions, Inc.
    Inventor: Howard E. Chen
  • Patent number: 10522892
    Abstract: This invention provides a high-frequency line adopting a structure to suppress an impedance variation and occurrence of an excessive power loss in high-frequency wiring having intersection with an optical waveguide. A high-frequency line is a microstrip line which has a basic configuration of stacking a ground electrode, a dielectric layer, and a signal electrode in this order on a SI-InP substrate. In addition, as shown in a transverse sectional view, an optical waveguide core made of InP-based semiconductor intersects with the high-frequency line in a crossing manner. A width of the signal electrode is partially increased in a certain region covering the intersection with the optical waveguide along a propagating direction of the high-frequency line. In the microstrip line, the width of the signal electrode is partially increased from w1 to w2, and characteristic impedance is thus reduced as compared to one with the uniform width w1.
    Type: Grant
    Filed: June 24, 2016
    Date of Patent: December 31, 2019
    Assignee: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Nobuhiro Kikuchi, Eiichi Yamada, Yoshihiro Ogiso, Josuke Ozaki
  • Patent number: 10505584
    Abstract: Aspects of the subject disclosure may include, a system for generating electromagnetic signals that resonate in a cavity having a plurality of reflectors resulting in resonating electromagnetic signals and combining the resonating electromagnetic signals to form an electromagnetic wave that traverses a reflector and couples onto a physical transmission medium. A plurality of fins is aligned radially outward from a surface of a physical transmission medium within a cavity between reflector. Other embodiments are disclosed.
    Type: Grant
    Filed: November 14, 2018
    Date of Patent: December 10, 2019
    Assignee: AT&T Intellectual Property I, L.P.
    Inventors: Paul Shala Henry, Robert Bennett, Donald J. Barnickel, Giovanni Vannucci, Farhad Barzegar, Irwin Gerszberg, Thomas M. Willis, III, Bruce E. Stuckman
  • Patent number: 10506705
    Abstract: Provided is a multilayered transmission line plate including a pair of ground layers, a differential wiring disposed between a one-sided ground layer of the pair of ground layers and the other ground layer, an insulating layer (X) disposed between the differential wiring and the one-sided ground layer, and an insulating layer (Y) disposed between the differential wiring and the other ground layer, wherein the insulating layer (X) has a layer containing a resin and not containing a glass cloth; the insulating layer (X) or the insulating layer (Y) has a layer containing a glass cloth and a resin; and the thickness of the insulating layer (X) is equal to or less than the thickness of the insulating layer (Y).
    Type: Grant
    Filed: November 20, 2015
    Date of Patent: December 10, 2019
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Yuusuke Kondou, Etsuo Mizushima, Takao Tanigawa, Yuki Nagai, Tomio Fukuda, Tetsurou Irino
  • Patent number: 10505243
    Abstract: A balun includes an unbalanced port, a first balanced port, a second balanced port, a main line, a subline, a capacitor, and an impedance matching section. The subline is configured to be electromagnetically coupled to the main line. The main line has a first end and a second end opposite to each other. The subline has a first end and a second end opposite to each other. The capacitor is provided between the first end of the main line and the unbalanced port. The impedance matching section is provided between the second end of the subline and the second balanced port. The second end of the main line is connected to a ground. The first end of the subline is connected to the first balanced port.
    Type: Grant
    Filed: October 17, 2017
    Date of Patent: December 10, 2019
    Assignee: TDK CORPORATION
    Inventors: Hiroya Suzuki, Yuta Ashida, Noriaki Ootsuka
  • Patent number: 10490874
    Abstract: A board to board contactless interconnect system includes a first circuit board for launching at st one microwave signal into a cavity of a first waveguide secured thereto. A second waveguide, secured to a second circuit board, is coupleable to the first waveguide to receive the at least one microwave signal in a cavity of the second waveguide and conduct the at least one microwave signal onto a microwave receiver aligned with the cavity on the second circuit board. The waveguides may be separable and may include additional waveguides. Conductive gaskets with apertures for microwave signals to pass through are positioned between the waveguides and between each circuit board and a waveguide to prevent leakage of microwave energy therebetween. Some embodiments may pass signals through a sealed boundary and maintain integrity of the seal. Such embodiments may have a third waveguide interposed between the first and second waveguides.
    Type: Grant
    Filed: March 15, 2017
    Date of Patent: November 26, 2019
    Assignee: TE CONNECTIVITY CORPORATION
    Inventors: Graham Harry Smith, Jr., Stephen T. Morley, Hung Thai Nguyen, Michael Frank Cina
  • Patent number: 10461033
    Abstract: A semiconductor memory package is provided. The package includes a base substrate, and chip connection pads and external connection pads respectively arranged on upper and lower surfaces of the base substrate; and two semiconductor memory chips mounted on the base substrate each having chip pads electrically connected to the chip connection pads. A first electrical path extends from an external connection pad to a first chip pad of one of the chips and a second electrical path extends from the external connection pad to a second chip pad of another chip, the first and second electrical paths have a common line, and the first electrical path has a first branch line and the second electrical path has a second branch line. The base substrate includes an open stub extending from the common line and having an end which is open without being connected to another electrical path.
    Type: Grant
    Filed: July 25, 2018
    Date of Patent: October 29, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jong-Joo Lee, Hee-woo An
  • Patent number: 10440816
    Abstract: In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; a cover layer disposed below the first ground and having openings formed therein such that the first ground is exposed at certain intervals; and a position alignment portion formed across the opening and configured to bisect an area of the opening.
    Type: Grant
    Filed: May 29, 2019
    Date of Patent: October 8, 2019
    Assignee: GigaLane Co., Ltd.
    Inventors: Sang Pil Kim, Byung Hoon Jo, Byung Yeol Kim, Hee seok Jung
  • Patent number: 10424711
    Abstract: Some embodiments are directed to a device including multiple substrates comprising one or more troughs. The substrates are disposed such that the one or more troughs form at least one enclosure. At least one superconducting layer covers at least a portion of the at least one enclosure. Other embodiments are directed to a method for manufacturing a superconducting device. The method includes acts of forming at least one trough in at least a first substrate; covering at least a portion of the first substrate with a superconducting material; covering at least a portion of a second substrate with the superconducting material; and bonding the first substrate and the second substrate to form at least one enclosure comprising the at least one trough and the superconducting material.
    Type: Grant
    Filed: January 17, 2014
    Date of Patent: September 24, 2019
    Assignee: Yale University
    Inventors: Robert J. Schoelkopf, III, Teresa Brecht, Luigi Frunzio, Michel Devoret
  • Patent number: 10356893
    Abstract: A circuit board comprises at least a first wiring layer, a second wiring layer and a via. The first wiring layer is formed with a pair of first ends, a pair of second ends, a coupling portion, a pair of first trace portions and a pair of second trace portions. The coupling portion has a pair of first coupling points, a pair of second coupling points, an inner trace portion, an outer trace portion and a ground conductor portion. The inner trace portion has a length equal to a length of the outer trace portion. The ground conductor portion is arranged between the inner trace portion and the outer trace portion. The second wiring layer is formed with a ground pattern. The ground conductor portion is connected with the ground pattern through the via.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: July 16, 2019
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventor: Kentaro Toda
  • Patent number: 10338169
    Abstract: A transmitter device for a magnetic resonance scanner includes a transmitter that is arranged in spatial proximity of a transmission coil that is connected thereto. The transmitter is embodied as a high-frequency power source that is connected directly to the transmission coil.
    Type: Grant
    Filed: February 26, 2016
    Date of Patent: July 2, 2019
    Assignee: Siemens Aktiengesellschaft
    Inventor: Oliver Heid
  • Patent number: 10333194
    Abstract: An electronic device includes a high-frequency transmission line member and a housing. The high-frequency transmission line member includes a flexible substrate, a signal conductor, and a ground conductor along the signal conductor. The housing is defined by a member separate from the high-frequency transmission line member and located at one principal surface side of the high-frequency transmission line member. The high-frequency transmission line member includes a first portion along the housing to face the housing, and a second portion spaced apart from the housing more than the first portion. The ground conductor is not provided at one principal surface side of the signal conductor in the first portion and is provided at least in the second portion.
    Type: Grant
    Filed: March 21, 2017
    Date of Patent: June 25, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Katsumi Taniguchi, Kuniaki Yosui
  • Patent number: 10305533
    Abstract: In an RFIC provided in a semiconductor device according to an embodiment, a low-noise amplifier (41) for reception and a power amplifier (11) for transmission are connected to a common antenna connection terminal (5). Between the antenna connection terminal (5) and an LNA (41), a circuit (31) is connected to be used for impedance matching, and a semiconductor switch (SW1) is connected in parallel with the circuit (31).
    Type: Grant
    Filed: August 25, 2014
    Date of Patent: May 28, 2019
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Masakazu Mizokami, Takao Kihara
  • Patent number: 10305157
    Abstract: A high-frequency signal transmission line includes an element, a linear signal line provided at the element and including a first end and a second end, and at least one ground conductor provided at the element and extending along the signal line. The element includes stacked insulating layers. The ground conductor is positioned opposite to the signal line with the insulating layer positioned therebetween. The ground conductor is a contiguous conductor. The signal line, the ground conductor, and the element generate a characteristic impedance. The signal line includes a first section and a second section. The first section is an uninterrupted section generating a characteristic impedance greater than or equal to a first characteristic impedance at the first end and including the first end. The second section generates a characteristic impedance less than the first characteristic impedance and is adjacent to the first section. The second section is longer than the first section.
    Type: Grant
    Filed: July 6, 2018
    Date of Patent: May 28, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Takahiro Baba, Kuniaki Yosui
  • Patent number: 10305156
    Abstract: In a transmission line, a first ground conductor pattern and a second ground conductor pattern are connected through a first interlayer connecting conductor, and the first ground conductor pattern and a third ground conductor pattern are connected through a second interlayer connecting conductor. A first signal conductor pattern includes a first bypassing pattern portion that bypasses the first interlayer connecting conductor, and a second signal conductor pattern includes a second bypassing pattern portion that bypasses the second interlayer connecting conductor. Bypassing directions of the first bypassing pattern portion and the second bypassing pattern portion are opposite to each other.
    Type: Grant
    Filed: March 13, 2017
    Date of Patent: May 28, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Takahiro Baba, Yuya Dokai
  • Patent number: 10283464
    Abstract: An electronic device includes a semiconductor device including a semiconductor chip, a first grounded layer formed on a surface of the semiconductor chip, a mold resin arranged on a side of the semiconductor device, an insulating layer arranged over the semiconductor device and the mold resin, a second grounded layer formed between the semiconductor device and the insulating layer, and the resin mold and the insulating layer, a second wiring layer formed over the insulating layer and includes a first area disposed at a part overlapping with the second grounded layer and a second area disposed on a side of an end part of the second grounded layer, a via that couples the first wiring layer and the second area of the second wiring layer, and a grounded conductor formed inside the insulating layer at a position overlapping with the second area of the second wiring layer.
    Type: Grant
    Filed: June 26, 2018
    Date of Patent: May 7, 2019
    Assignee: FUJITSU LIMITED
    Inventor: Daijiro Ishibashi
  • Patent number: 10263312
    Abstract: A method of making a waveguide ribbon that includes a plurality of waveguides comprises joining a first sheet of dielectric material to a first conductive sheet of conductive material, patterning the first sheet of dielectric material to form a plurality of dielectric waveguide cores on the first conductive sheet, and coating the dielectric waveguide cores with substantially the same conductive material as the conductive sheet to form the plurality of waveguides.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: April 16, 2019
    Assignee: Intel Corporation
    Inventors: Sasha N. Oster, Aleksandar Aleksov, Georgios C. Dogiamis, Telesphor Kamgaing, Adel A. Elsherbini, Shawna M. Liff, Johanna M. Swan, Brandon M. Rawlings, Richard J. Dischler
  • Patent number: 10263311
    Abstract: A transmission line according to an embodiment, includes a first conductor layer, a second conductor layer spaced apart from the first conductor layer, a first conductor line including a first region facing the first conductor layer and a second region facing the second conductor layer, the first conductor line being spaced apart from the first conductor layer and the second conductor layer, the first conductor line extending in a first direction, and a second conductor line spaced apart from the first conductor layer, the second conductor layer, and the first conductor line, the second conductor line extending in the first direction, the second conductor line being shorter than the first conductor line in the first direction in length.
    Type: Grant
    Filed: September 1, 2017
    Date of Patent: April 16, 2019
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hiroyuki Kayano, Yuichi Sawahara
  • Patent number: 10256524
    Abstract: An antenna substrate, provided with: a substrate, a ground electrode, a first antenna element, a second antenna element, a first transmission line and a second transmission line. The first antenna element that is arranged at a first distance away from the ground electrode, on the substrate within the first opening area. The second antenna element that is arranged at a second distance away from the ground electrode, on the substrate within the second opening area. The first distance is a shortest distance between the ground electrode and the first antenna element in a direction along a plane along which an electric field among an electromagnetic wave radiated from the first antenna element vibrates. The second distance is a shortest distance between the ground electrode and the second antenna element in a direction along a plane along which an electric field among an electromagnetic wave radiated from the second antenna element vibrates. The first distance is different from the second distance.
    Type: Grant
    Filed: February 16, 2017
    Date of Patent: April 9, 2019
    Assignee: Panasonic Corporation
    Inventors: Tomohiro Murata, Junji Sato
  • Patent number: 10238879
    Abstract: Implantable medical devices including interconnections having strain-relief structure. The interconnections can take the form of flexible circuits. Strain relief gaps and shapes are integrated in the interconnections to relieve forces in each of three dimensions. In some examples, the region of an interconnection which couples with a component of the implantable medical device is separated by a strain relief gap from a connection to a second component and/or a location where the flex bends around a corner.
    Type: Grant
    Filed: March 2, 2016
    Date of Patent: March 26, 2019
    Assignee: CARDIAC PACEMAKERS, INC.
    Inventors: Jean M. Bobgan, Moira B. Sweeney, James E. Blood, Robert A. Jones, John E. Hansen, Keith R. Maile
  • Patent number: 10225928
    Abstract: A flexible board includes a flexible body including a first principal surface and a second principal surface, and a linear conductor provided in the body and closer to the first principal surface than to the second principal surface. The body is bent inwardly with respect to the first principal surface along an inward bending line crossing the linear conductor and also outwardly with respect to the first principal surface along an outward bending line crossing the linear conductor. The inward bend of the body has a larger mean curvature radius than the outward bend of the body.
    Type: Grant
    Filed: May 19, 2016
    Date of Patent: March 5, 2019
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Kuniaki Yosui
  • Patent number: 10211506
    Abstract: A transmission line transition that couples RF energy between a coaxial cable and an air dielectric microstrip is provided. In some embodiments, the transition can combine a thin printed circuit board substrate and an insulating surface to form an effective capacitive coupling transition that can couple RF energy from the center conductor of a coaxial cable to an air microstrip. In some embodiments, the transition can include an insulating system affixed to a metallic surface, and the insulating system can secure an airstrip conductor in close proximity to an inner conductor of a coaxial cable to capacitively couple the airstrip conductor to the inner conductor of the coaxial cable. In some embodiments, the transition can employ a metallic body coated with an insulating surface to capacitively couple RF energy from the center conductor of the coaxial cable to the air microstrip.
    Type: Grant
    Filed: September 14, 2017
    Date of Patent: February 19, 2019
    Assignee: CommScope Technologies LLC
    Inventor: Michael Francis Bonczyk
  • Patent number: 10190402
    Abstract: Techniques for controlling a bottom hole assembly (BHA) include determining a first candidate BHA control signal; generating an input to a BHA control, the input comprising a perturbation signal superimposed on the first candidate BHA control signal; controlling the BHA using the input to the BHA control; determining a change in an objective value as a function of the perturbation signal, based on a received downhole sensor measurement; and generating, based on the change in the objective value, a second candidate BHA control signal.
    Type: Grant
    Filed: March 11, 2014
    Date of Patent: January 29, 2019
    Assignee: Halliburton Energy Services, Inc.
    Inventors: Jason D. Dykstra, Yuzhen Xue
  • Patent number: 10186768
    Abstract: According to the invention there is provided a dipole antenna array including at least one dipole antenna sub-array, wherein the dipole antenna sub-array includes a plurality of co-planar antenna units, each antenna unit including a pair of dipole radiating elements and a balun having an output line for providing output electrical signals to the pair of dipole radiating elements.
    Type: Grant
    Filed: January 22, 2014
    Date of Patent: January 22, 2019
    Assignee: BAE Systems plc
    Inventor: Gareth Michael Lewis
  • Patent number: 10153534
    Abstract: A first signal conductor pattern, a first ground conductor pattern, and a second ground conductor pattern define a first transmission line with a strip line structure. A second signal conductor pattern, a third ground conductor pattern, and a fourth ground conductor pattern define a second transmission line with a strip line structure. A first connecting portion at an end of the first transmission line and a second connecting portion at an end of the second transmission line are stacked together so that the first ground conductor pattern is electrically connected to the third ground conductor pattern, the second ground conductor pattern is electrically connected to the fourth ground conductor pattern, and the first signal conductor pattern is electrically connected to the second signal conductor pattern.
    Type: Grant
    Filed: March 22, 2017
    Date of Patent: December 11, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Shingo Ito, Kuniaki Yosui
  • Patent number: 10153556
    Abstract: A printed millimeter wave dipole antenna and techniques for designing such an antenna are disclosed. In one embodiment, the dipole antenna comprises: a signal wing and at least one ground wing for propagating signals in a millimeter wave band; and an unbalanced feeding structure directly coupled to the signal wing. The unbalanced feeding structure is boarded by a plurality of escorting vias to ensure equipotential grounds.
    Type: Grant
    Filed: January 5, 2017
    Date of Patent: December 11, 2018
    Assignee: QUALCOMM Incorporated
    Inventors: Elimelech Ganchrow, Ofer Markish, Iddo Diukman, Alon Yehezkely
  • Patent number: 10135137
    Abstract: A phased array antenna system including a front-end circuit having a plurality of antenna channels, each including a front antenna element and a rear antenna element, that provides a spatially combined beam. Each antenna channel includes a beam scan phase shifter and a true time delay phase shifter through which the receive signals or the transmit signals propagate. The system further includes a back-end circuit spaced from the front-end circuit and including an antenna receiving the receive signals from the rear elements or transmitting the transmit signals to the rear elements. The back-end circuit further includes an ortho-mode transducer that separates the transmit signal or the receive signal into orthogonally polarized signals, and a pair of couplers and a pair of polarization phase shifters that combine to adjust the polarization of the transmit signal or the receive signal. The spatially combined beam is reconfigurable in beam shape and its location.
    Type: Grant
    Filed: February 20, 2015
    Date of Patent: November 20, 2018
    Assignee: Northrop Grumman Systems Corporation
    Inventors: Sudhakar K. Rao, Arun K. Bhattacharyya
  • Patent number: 10120065
    Abstract: An antenna array is provided for monitoring an object. The antenna array includes an emitting antenna module, a first receiving antenna module, a second receiving antenna module and a third receiving antenna module. The emitting antenna module emits a detecting signal, wherein the detecting signal contacts the object, and is reflected by the object as a return signal. The first receiving antenna module receives the return signal. The second receiving antenna module receives the return signal. The third receiving antenna module receives the return signal, wherein any one of the antenna modules has a phase difference of 90 degrees with the nearest neighboring antenna module.
    Type: Grant
    Filed: November 20, 2015
    Date of Patent: November 6, 2018
    Assignee: WISTRON CORP.
    Inventor: Chen Yu Chou
  • Patent number: 10101630
    Abstract: An optical device may include at least two waveguides with different propagation constants. Each waveguide is associated with a grating antenna with a grating period selected to emit light at the same emission angle despite the different propagation constants. Each waveguide may be part of an optical path that includes phase shifters. Additionally, the waveguides may be formed in a waveguide layer that is separate from a perturbation layer in which the grating antennas as formed.
    Type: Grant
    Filed: April 27, 2017
    Date of Patent: October 16, 2018
    Assignee: ANALOG PHOTONIC LLC
    Inventors: Michael R. Watts, Ehsan Shah Hosseini, Christopher Vincent Poulton, Erman Timurdogan
  • Patent number: 10091870
    Abstract: An apparatus has a permittivity attenuation layer interposed between a substrate and a first conductive trace, wherein the permittivity attenuation layer comprises a resin matrix containing functionalized carbon nanomaterial, such as functionalized single-wall carbon nanotubes (f-SWNTs). In some embodiments, a design structure for designing, manufacturing, or testing the apparatus is tangibly embodied in a machine readable medium. In some embodiments, the apparatus comprises an enhanced laminate core for use in a printed wiring board (PWB) that contains a differential pair having an inner-leg conductive trace and an outer-leg conductive trace. A permittivity attenuation layer is interposed between the inner-leg conductive trace and a laminate core, wherein the loading level of f-SWNTs in the permittivity attenuation layer is selected to attenuate the permittivity of the inner-leg conductive trace to match the permittivity of the outer-leg conductive trace.
    Type: Grant
    Filed: March 31, 2015
    Date of Patent: October 2, 2018
    Assignee: International Business Machines Corporation
    Inventors: Dylan J. Boday, Samuel R. Connor, Joseph Kuczynski
  • Patent number: 10079422
    Abstract: In an example embodiment, an azimuth combiner comprises: a septum layer comprising a plurality of septum dividers; first and second housing layers attached to first and second sides of the septum layer; a linear array of ports on a first end of the combiner; wherein the first and second housing layers each comprise waveguide H-plane T-junctions; wherein the waveguide T-junctions can be configured to perform power dividing/combining; and wherein the septum layer evenly bisects each port of the linear array of ports. A stack of such azimuth combiners can form a two dimensional planar array of ports to which can be added a horn aperture layer, and a grid layer, to form a dual-polarized, dual-BFN, dual-band antenna array.
    Type: Grant
    Filed: September 29, 2015
    Date of Patent: September 18, 2018
    Assignee: VIASAT, INC.
    Inventors: Donald L Runyon, Dominic Q Nguyen, James W Maxwell
  • Patent number: 10076024
    Abstract: This disclosure relates generally to an electronic assembly and method having a first electrical connection point and a second electrical connection point and a differential interconnect coupling the first electrical connection point to the second electrical connection point, the differential interconnect including first and second transmission traces including a interior edges and a exterior edges opposite the interior edges, the second interior edge facing the first interior edge, and stub traces, each stub trace coupled to one of the first and second transmission traces and projecting from one of the first interior edge, the first exterior edge, the second interior edge, and the second exterior edge. A substantially equal number of stub traces project from the first exterior edge and the second exterior edge. At least twice as many stub traces project from the first and second exterior edges as project from the first and second interior edges.
    Type: Grant
    Filed: June 28, 2016
    Date of Patent: September 11, 2018
    Assignee: Intel Corporation
    Inventors: Ruihua Ding, Min Wang, Mo Liu
  • Patent number: 10050327
    Abstract: Impedance optimization is difficult in microwave-band waveguide converters. To solve that problem, this waveguide converter is provided with the following: a waveguide provided so as to introduce microwaves to an antenna that performs input and output in a planar microwave circuit; a terminal waveguide that faces the aforementioned waveguide with the antenna interposed therebetween and connects to said waveguide so as to terminate same; and a conductor plate mounted so as to face the antenna. The conductor plate is electrically connected to at least part of the inside wall of the terminal waveguide.
    Type: Grant
    Filed: February 27, 2015
    Date of Patent: August 14, 2018
    Assignee: NEC Corporation
    Inventor: Naoyuki Orihashi
  • Patent number: 10045434
    Abstract: A printed circuit board (‘PCB’) comprising: an interior socket configured to receive a connector pin of a first electronic component, the connector pin characterized by a pin impedance; a signal trace coupled to the interior socket, the signal trace configured to transmit electrical signals between the first electronic component and other electronic components mounted on the PCB, the signal trace characterized by a trace impedance; and an insulator between the interior socket and a sleeve that surrounds the interior socket, the sleeve physically configured such that an effective pin impedance matches the trace impedance within a predetermined threshold, wherein the effective pin impedance represents the resistance experienced by electrical signals passing through the connector pin when the connector pin is inserted into the interior socket.
    Type: Grant
    Filed: December 15, 2014
    Date of Patent: August 7, 2018
    Assignee: Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
    Inventors: Candice L. Coletrane, Bradley D. Herrman
  • Patent number: 10044086
    Abstract: A high-frequency signal transmission line includes an element, a linear signal line provided at the element and including a first end and a second end, and at least one ground conductor provided at the element and extending along the signal line. The element includes stacked insulating layers. The ground conductor is positioned opposite to the signal line with the insulating layer positioned therebetween. The ground conductor is a contiguous conductor. The signal line, the ground conductor, and the element generate a characteristic impedance. The signal line includes a first section and a second section. The first section is an uninterrupted section generating a characteristic impedance greater than or equal to a first characteristic impedance at the first end and including the first end. The second section generates a characteristic impedance less than the first characteristic impedance and is adjacent to the first section. The second section is longer than the first section.
    Type: Grant
    Filed: February 8, 2016
    Date of Patent: August 7, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Takahiro Baba, Kuniaki Yosui
  • Patent number: 10038231
    Abstract: A signal transmission cable as a signal transmission component includes a laminate including a first thin portion on one of the opposite ends in a first direction and a second thin portion on the other end in the first direction. A portion between the first thin portion and the second thin portion in the laminate is a main line portion. The thickness of the first and second thin portions is thinner than the thickness of the main line portion. The surface on one end in the thickness direction of the laminate defined by the main line portion and the first and second thin portions is a continuous flat surface. A connector for external connection is arranged on the surfaces of the first and second thin portions, on the sides in which each of the thin portions and the main line portion have a difference in level.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: July 31, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Kuniaki Yosui
  • Patent number: 10027009
    Abstract: A high-frequency signal transmission line includes a dielectric body, a signal conductor, and a ground conductor. The dielectric body extends along a high-frequency signal transmission direction. The signal conductor is in the dielectric body and extends along the high-frequency signal transmission direction. The ground conductor is in the dielectric body and is electromagnetically coupled to the signal conductor. The dielectric body includes, along the high-frequency signal transmission direction, a plurality of straight portions and a curved portion connecting the plurality of straight portions. In the curved portion, the signal conductor is located at a position on an inner side of a curve relative to a center position in a width direction of the dielectric body.
    Type: Grant
    Filed: November 21, 2016
    Date of Patent: July 17, 2018
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takahiro Baba, Kuniaki Yosui
  • Patent number: 9983336
    Abstract: A technique relates to a microwave device. A microwave system is configured to output a microwave readout signal, where the microwave system has an input and an output. An output microwave transmission line is connected to the output of the microwave system. A distributed Bragg reflector, integrated into a transmission line geometry, is configured as a low-loss infrared filter that blocks infrared radiation while allowing transmission of the microwave readout signal. The low-loss infrared filter is connected to the output microwave transmission line.
    Type: Grant
    Filed: September 28, 2015
    Date of Patent: May 29, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventor: Baleegh Abdo
  • Patent number: 9979173
    Abstract: A bus bar assembly includes a first main conductor, a second main conductor, and an insulator member provided between the main conductors. The insulator member includes: (i) an insulator component, (ii) a first conductor layer provided on the top surface of the insulator component, and (iii) a second conductor layer provided on the bottom surface of the insulator component, wherein the first conductor layer includes an outer edge around a perimeter thereof, wherein the outer edge is located at least a certain distance from the outer edge around the perimeter of the insulator component, wherein the second conductor layer includes an outer edge around a perimeter thereof, wherein the outer edge is located at least the same certain distance from the outer edge of the insulator component, and wherein the certain distance is sufficient to cause the bus bar assembly to satisfy the creepage requirement of the assembly.
    Type: Grant
    Filed: April 29, 2011
    Date of Patent: May 22, 2018
    Assignee: GE ENERGY POWER CONVERSION TECHNOLOGY LIMITED
    Inventor: Nicholas David Benavides
  • Patent number: 9980370
    Abstract: To provide a printed board that solves the problem of transmission characteristics deterioration, the disclosed printed board includes a substrate, a circular signal pad that is provided on the substrate, a doughnut-shaped ground pad, which sandwiches the substrate that surrounds, in a doughnut shape, the signal pad, and which surrounds the outer circumference of the substrate, and one or more recessed sections that are disposed on the substrate that surrounds, in the doughnut shape, the signal pad.
    Type: Grant
    Filed: September 11, 2014
    Date of Patent: May 22, 2018
    Assignee: NEC CORPORATION
    Inventor: Kazuhiro Kashiwakura
  • Patent number: 9949361
    Abstract: A balun device comprises an input microstrip, a first output microstrip, a second output microstrip, and a junction comprising a conductive termination of the input microstrip, the first output microstrip, and the second output microstrip, whereby an input signal provided to the input microstrip will propagate through the first output microstrip as a first output signal and through the second output microstrip as a second output signal, wherein the phase of the first output signal is identical to the phase of the input signal, and wherein the junction inverts the phase of the second output signal relative to the phase of the input signal and the first output signal.
    Type: Grant
    Filed: May 4, 2016
    Date of Patent: April 17, 2018
    Assignee: Scientific Components Corporation
    Inventor: Aaron Vaisman