Abstract: A semiconductor memory package is provided. The package includes a base substrate, and chip connection pads and external connection pads respectively arranged on upper and lower surfaces of the base substrate; and two semiconductor memory chips mounted on the base substrate each having chip pads electrically connected to the chip connection pads. A first electrical path extends from an external connection pad to a first chip pad of one of the chips and a second electrical path extends from the external connection pad to a second chip pad of another chip, the first and second electrical paths have a common line, and the first electrical path has a first branch line and the second electrical path has a second branch line. The base substrate includes an open stub extending from the common line and having an end which is open without being connected to another electrical path.

Abstract: In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; a cover layer disposed below the first ground and having openings formed therein such that the first ground is exposed at certain intervals; and a position alignment portion formed across the opening and configured to bisect an area of the opening.

Abstract: Some embodiments are directed to a device including multiple substrates comprising one or more troughs. The substrates are disposed such that the one or more troughs form at least one enclosure. At least one superconducting layer covers at least a portion of the at least one enclosure. Other embodiments are directed to a method for manufacturing a superconducting device. The method includes acts of forming at least one trough in at least a first substrate; covering at least a portion of the first substrate with a superconducting material; covering at least a portion of a second substrate with the superconducting material; and bonding the first substrate and the second substrate to form at least one enclosure comprising the at least one trough and the superconducting material.

Abstract: A circuit board comprises at least a first wiring layer, a second wiring layer and a via. The first wiring layer is formed with a pair of first ends, a pair of second ends, a coupling portion, a pair of first trace portions and a pair of second trace portions. The coupling portion has a pair of first coupling points, a pair of second coupling points, an inner trace portion, an outer trace portion and a ground conductor portion. The inner trace portion has a length equal to a length of the outer trace portion. The ground conductor portion is arranged between the inner trace portion and the outer trace portion. The second wiring layer is formed with a ground pattern. The ground conductor portion is connected with the ground pattern through the via.

Abstract: A transmitter device for a magnetic resonance scanner includes a transmitter that is arranged in spatial proximity of a transmission coil that is connected thereto. The transmitter is embodied as a high-frequency power source that is connected directly to the transmission coil.

Abstract: An electronic device includes a high-frequency transmission line member and a housing. The high-frequency transmission line member includes a flexible substrate, a signal conductor, and a ground conductor along the signal conductor. The housing is defined by a member separate from the high-frequency transmission line member and located at one principal surface side of the high-frequency transmission line member. The high-frequency transmission line member includes a first portion along the housing to face the housing, and a second portion spaced apart from the housing more than the first portion. The ground conductor is not provided at one principal surface side of the signal conductor in the first portion and is provided at least in the second portion.

Abstract: In a transmission line, a first ground conductor pattern and a second ground conductor pattern are connected through a first interlayer connecting conductor, and the first ground conductor pattern and a third ground conductor pattern are connected through a second interlayer connecting conductor. A first signal conductor pattern includes a first bypassing pattern portion that bypasses the first interlayer connecting conductor, and a second signal conductor pattern includes a second bypassing pattern portion that bypasses the second interlayer connecting conductor. Bypassing directions of the first bypassing pattern portion and the second bypassing pattern portion are opposite to each other.

Abstract: In an RFIC provided in a semiconductor device according to an embodiment, a low-noise amplifier (41) for reception and a power amplifier (11) for transmission are connected to a common antenna connection terminal (5). Between the antenna connection terminal (5) and an LNA (41), a circuit (31) is connected to be used for impedance matching, and a semiconductor switch (SW1) is connected in parallel with the circuit (31).

Abstract: A high-frequency signal transmission line includes an element, a linear signal line provided at the element and including a first end and a second end, and at least one ground conductor provided at the element and extending along the signal line. The element includes stacked insulating layers. The ground conductor is positioned opposite to the signal line with the insulating layer positioned therebetween. The ground conductor is a contiguous conductor. The signal line, the ground conductor, and the element generate a characteristic impedance. The signal line includes a first section and a second section. The first section is an uninterrupted section generating a characteristic impedance greater than or equal to a first characteristic impedance at the first end and including the first end. The second section generates a characteristic impedance less than the first characteristic impedance and is adjacent to the first section. The second section is longer than the first section.

Abstract: An electronic device includes a semiconductor device including a semiconductor chip, a first grounded layer formed on a surface of the semiconductor chip, a mold resin arranged on a side of the semiconductor device, an insulating layer arranged over the semiconductor device and the mold resin, a second grounded layer formed between the semiconductor device and the insulating layer, and the resin mold and the insulating layer, a second wiring layer formed over the insulating layer and includes a first area disposed at a part overlapping with the second grounded layer and a second area disposed on a side of an end part of the second grounded layer, a via that couples the first wiring layer and the second area of the second wiring layer, and a grounded conductor formed inside the insulating layer at a position overlapping with the second area of the second wiring layer.

Abstract: A method of making a waveguide ribbon that includes a plurality of waveguides comprises joining a first sheet of dielectric material to a first conductive sheet of conductive material, patterning the first sheet of dielectric material to form a plurality of dielectric waveguide cores on the first conductive sheet, and coating the dielectric waveguide cores with substantially the same conductive material as the conductive sheet to form the plurality of waveguides.

Abstract: A transmission line according to an embodiment, includes a first conductor layer, a second conductor layer spaced apart from the first conductor layer, a first conductor line including a first region facing the first conductor layer and a second region facing the second conductor layer, the first conductor line being spaced apart from the first conductor layer and the second conductor layer, the first conductor line extending in a first direction, and a second conductor line spaced apart from the first conductor layer, the second conductor layer, and the first conductor line, the second conductor line extending in the first direction, the second conductor line being shorter than the first conductor line in the first direction in length.

Abstract: An antenna substrate, provided with: a substrate, a ground electrode, a first antenna element, a second antenna element, a first transmission line and a second transmission line. The first antenna element that is arranged at a first distance away from the ground electrode, on the substrate within the first opening area. The second antenna element that is arranged at a second distance away from the ground electrode, on the substrate within the second opening area. The first distance is a shortest distance between the ground electrode and the first antenna element in a direction along a plane along which an electric field among an electromagnetic wave radiated from the first antenna element vibrates. The second distance is a shortest distance between the ground electrode and the second antenna element in a direction along a plane along which an electric field among an electromagnetic wave radiated from the second antenna element vibrates. The first distance is different from the second distance.

Abstract: Implantable medical devices including interconnections having strain-relief structure. The interconnections can take the form of flexible circuits. Strain relief gaps and shapes are integrated in the interconnections to relieve forces in each of three dimensions. In some examples, the region of an interconnection which couples with a component of the implantable medical device is separated by a strain relief gap from a connection to a second component and/or a location where the flex bends around a corner.

Abstract: A flexible board includes a flexible body including a first principal surface and a second principal surface, and a linear conductor provided in the body and closer to the first principal surface than to the second principal surface. The body is bent inwardly with respect to the first principal surface along an inward bending line crossing the linear conductor and also outwardly with respect to the first principal surface along an outward bending line crossing the linear conductor. The inward bend of the body has a larger mean curvature radius than the outward bend of the body.

Abstract: A transmission line transition that couples RF energy between a coaxial cable and an air dielectric microstrip is provided. In some embodiments, the transition can combine a thin printed circuit board substrate and an insulating surface to form an effective capacitive coupling transition that can couple RF energy from the center conductor of a coaxial cable to an air microstrip. In some embodiments, the transition can include an insulating system affixed to a metallic surface, and the insulating system can secure an airstrip conductor in close proximity to an inner conductor of a coaxial cable to capacitively couple the airstrip conductor to the inner conductor of the coaxial cable. In some embodiments, the transition can employ a metallic body coated with an insulating surface to capacitively couple RF energy from the center conductor of the coaxial cable to the air microstrip.

Abstract: Techniques for controlling a bottom hole assembly (BHA) include determining a first candidate BHA control signal; generating an input to a BHA control, the input comprising a perturbation signal superimposed on the first candidate BHA control signal; controlling the BHA using the input to the BHA control; determining a change in an objective value as a function of the perturbation signal, based on a received downhole sensor measurement; and generating, based on the change in the objective value, a second candidate BHA control signal.

Abstract: According to the invention there is provided a dipole antenna array including at least one dipole antenna sub-array, wherein the dipole antenna sub-array includes a plurality of co-planar antenna units, each antenna unit including a pair of dipole radiating elements and a balun having an output line for providing output electrical signals to the pair of dipole radiating elements.

Abstract: A printed millimeter wave dipole antenna and techniques for designing such an antenna are disclosed. In one embodiment, the dipole antenna comprises: a signal wing and at least one ground wing for propagating signals in a millimeter wave band; and an unbalanced feeding structure directly coupled to the signal wing. The unbalanced feeding structure is boarded by a plurality of escorting vias to ensure equipotential grounds.

Abstract: A first signal conductor pattern, a first ground conductor pattern, and a second ground conductor pattern define a first transmission line with a strip line structure. A second signal conductor pattern, a third ground conductor pattern, and a fourth ground conductor pattern define a second transmission line with a strip line structure. A first connecting portion at an end of the first transmission line and a second connecting portion at an end of the second transmission line are stacked together so that the first ground conductor pattern is electrically connected to the third ground conductor pattern, the second ground conductor pattern is electrically connected to the fourth ground conductor pattern, and the first signal conductor pattern is electrically connected to the second signal conductor pattern.

Abstract: A phased array antenna system including a front-end circuit having a plurality of antenna channels, each including a front antenna element and a rear antenna element, that provides a spatially combined beam. Each antenna channel includes a beam scan phase shifter and a true time delay phase shifter through which the receive signals or the transmit signals propagate. The system further includes a back-end circuit spaced from the front-end circuit and including an antenna receiving the receive signals from the rear elements or transmitting the transmit signals to the rear elements. The back-end circuit further includes an ortho-mode transducer that separates the transmit signal or the receive signal into orthogonally polarized signals, and a pair of couplers and a pair of polarization phase shifters that combine to adjust the polarization of the transmit signal or the receive signal. The spatially combined beam is reconfigurable in beam shape and its location.

Abstract: An antenna array is provided for monitoring an object. The antenna array includes an emitting antenna module, a first receiving antenna module, a second receiving antenna module and a third receiving antenna module. The emitting antenna module emits a detecting signal, wherein the detecting signal contacts the object, and is reflected by the object as a return signal. The first receiving antenna module receives the return signal. The second receiving antenna module receives the return signal. The third receiving antenna module receives the return signal, wherein any one of the antenna modules has a phase difference of 90 degrees with the nearest neighboring antenna module.

Abstract: An optical device may include at least two waveguides with different propagation constants. Each waveguide is associated with a grating antenna with a grating period selected to emit light at the same emission angle despite the different propagation constants. Each waveguide may be part of an optical path that includes phase shifters. Additionally, the waveguides may be formed in a waveguide layer that is separate from a perturbation layer in which the grating antennas as formed.

Abstract: An apparatus has a permittivity attenuation layer interposed between a substrate and a first conductive trace, wherein the permittivity attenuation layer comprises a resin matrix containing functionalized carbon nanomaterial, such as functionalized single-wall carbon nanotubes (f-SWNTs). In some embodiments, a design structure for designing, manufacturing, or testing the apparatus is tangibly embodied in a machine readable medium. In some embodiments, the apparatus comprises an enhanced laminate core for use in a printed wiring board (PWB) that contains a differential pair having an inner-leg conductive trace and an outer-leg conductive trace. A permittivity attenuation layer is interposed between the inner-leg conductive trace and a laminate core, wherein the loading level of f-SWNTs in the permittivity attenuation layer is selected to attenuate the permittivity of the inner-leg conductive trace to match the permittivity of the outer-leg conductive trace.

Abstract: In an example embodiment, an azimuth combiner comprises: a septum layer comprising a plurality of septum dividers; first and second housing layers attached to first and second sides of the septum layer; a linear array of ports on a first end of the combiner; wherein the first and second housing layers each comprise waveguide H-plane T-junctions; wherein the waveguide T-junctions can be configured to perform power dividing/combining; and wherein the septum layer evenly bisects each port of the linear array of ports. A stack of such azimuth combiners can form a two dimensional planar array of ports to which can be added a horn aperture layer, and a grid layer, to form a dual-polarized, dual-BFN, dual-band antenna array.

Abstract: This disclosure relates generally to an electronic assembly and method having a first electrical connection point and a second electrical connection point and a differential interconnect coupling the first electrical connection point to the second electrical connection point, the differential interconnect including first and second transmission traces including a interior edges and a exterior edges opposite the interior edges, the second interior edge facing the first interior edge, and stub traces, each stub trace coupled to one of the first and second transmission traces and projecting from one of the first interior edge, the first exterior edge, the second interior edge, and the second exterior edge. A substantially equal number of stub traces project from the first exterior edge and the second exterior edge. At least twice as many stub traces project from the first and second exterior edges as project from the first and second interior edges.

Abstract: Impedance optimization is difficult in microwave-band waveguide converters. To solve that problem, this waveguide converter is provided with the following: a waveguide provided so as to introduce microwaves to an antenna that performs input and output in a planar microwave circuit; a terminal waveguide that faces the aforementioned waveguide with the antenna interposed therebetween and connects to said waveguide so as to terminate same; and a conductor plate mounted so as to face the antenna. The conductor plate is electrically connected to at least part of the inside wall of the terminal waveguide.

Abstract: A printed circuit board (‘PCB’) comprising: an interior socket configured to receive a connector pin of a first electronic component, the connector pin characterized by a pin impedance; a signal trace coupled to the interior socket, the signal trace configured to transmit electrical signals between the first electronic component and other electronic components mounted on the PCB, the signal trace characterized by a trace impedance; and an insulator between the interior socket and a sleeve that surrounds the interior socket, the sleeve physically configured such that an effective pin impedance matches the trace impedance within a predetermined threshold, wherein the effective pin impedance represents the resistance experienced by electrical signals passing through the connector pin when the connector pin is inserted into the interior socket.

Abstract: A high-frequency signal transmission line includes an element, a linear signal line provided at the element and including a first end and a second end, and at least one ground conductor provided at the element and extending along the signal line. The element includes stacked insulating layers. The ground conductor is positioned opposite to the signal line with the insulating layer positioned therebetween. The ground conductor is a contiguous conductor. The signal line, the ground conductor, and the element generate a characteristic impedance. The signal line includes a first section and a second section. The first section is an uninterrupted section generating a characteristic impedance greater than or equal to a first characteristic impedance at the first end and including the first end. The second section generates a characteristic impedance less than the first characteristic impedance and is adjacent to the first section. The second section is longer than the first section.

Abstract: A signal transmission cable as a signal transmission component includes a laminate including a first thin portion on one of the opposite ends in a first direction and a second thin portion on the other end in the first direction. A portion between the first thin portion and the second thin portion in the laminate is a main line portion. The thickness of the first and second thin portions is thinner than the thickness of the main line portion. The surface on one end in the thickness direction of the laminate defined by the main line portion and the first and second thin portions is a continuous flat surface. A connector for external connection is arranged on the surfaces of the first and second thin portions, on the sides in which each of the thin portions and the main line portion have a difference in level.

Abstract: A high-frequency signal transmission line includes a dielectric body, a signal conductor, and a ground conductor. The dielectric body extends along a high-frequency signal transmission direction. The signal conductor is in the dielectric body and extends along the high-frequency signal transmission direction. The ground conductor is in the dielectric body and is electromagnetically coupled to the signal conductor. The dielectric body includes, along the high-frequency signal transmission direction, a plurality of straight portions and a curved portion connecting the plurality of straight portions. In the curved portion, the signal conductor is located at a position on an inner side of a curve relative to a center position in a width direction of the dielectric body.

Abstract: A technique relates to a microwave device. A microwave system is configured to output a microwave readout signal, where the microwave system has an input and an output. An output microwave transmission line is connected to the output of the microwave system. A distributed Bragg reflector, integrated into a transmission line geometry, is configured as a low-loss infrared filter that blocks infrared radiation while allowing transmission of the microwave readout signal. The low-loss infrared filter is connected to the output microwave transmission line.

Abstract: To provide a printed board that solves the problem of transmission characteristics deterioration, the disclosed printed board includes a substrate, a circular signal pad that is provided on the substrate, a doughnut-shaped ground pad, which sandwiches the substrate that surrounds, in a doughnut shape, the signal pad, and which surrounds the outer circumference of the substrate, and one or more recessed sections that are disposed on the substrate that surrounds, in the doughnut shape, the signal pad.

Abstract: A bus bar assembly includes a first main conductor, a second main conductor, and an insulator member provided between the main conductors. The insulator member includes: (i) an insulator component, (ii) a first conductor layer provided on the top surface of the insulator component, and (iii) a second conductor layer provided on the bottom surface of the insulator component, wherein the first conductor layer includes an outer edge around a perimeter thereof, wherein the outer edge is located at least a certain distance from the outer edge around the perimeter of the insulator component, wherein the second conductor layer includes an outer edge around a perimeter thereof, wherein the outer edge is located at least the same certain distance from the outer edge of the insulator component, and wherein the certain distance is sufficient to cause the bus bar assembly to satisfy the creepage requirement of the assembly.

Abstract: A balun device comprises an input microstrip, a first output microstrip, a second output microstrip, and a junction comprising a conductive termination of the input microstrip, the first output microstrip, and the second output microstrip, whereby an input signal provided to the input microstrip will propagate through the first output microstrip as a first output signal and through the second output microstrip as a second output signal, wherein the phase of the first output signal is identical to the phase of the input signal, and wherein the junction inverts the phase of the second output signal relative to the phase of the input signal and the first output signal.

Abstract: A wireless communication device and methods of manufacturing and using the same are disclosed. The wireless communication device includes a substrate with an antenna and/or inductor thereon, a patterned ferrite layer overlapping the antenna and/or inductor, and a capacitor electrically connected to the antenna and/or inductor. The wireless communication device may further include an integrated circuit including a receiver configured to convert a first wireless signal to an electric signal and a transmitter configured to generate a second wireless signal, the antenna being configured to receive the first wireless signal and transmit or broadcast the second wireless signal. The patterned ferrite layer advantageously mitigates the deleterious effect of metal objects in proximity to a reader and/or transponder magnetically coupled to the antenna.

Abstract: A printed circuit board (PCB) is disclosed. The PCB includes a substrate have a top surface and a bottom surface. A first conductive layer is disposed on the top surface of the substrate. The first conductive layer comprises a first signal net and a second signal net. An outermost insulating layer is disposed on the top surface of the substrate to cover the substrate and the first conductive layer. The outmost insulating layer comprises an opening to expose a portion of the second signal net. And, a second conductive layer is disposed on the outermost insulating layer and substantially covering at least a portion of the first signal net. The second conductive layer is filled into the opening to electrically connect to the second signal net which is able to provide one of a ground potential and a power potential.

Abstract: A connector mountable to a syringe barrel has a proximal barrel-engaging portion, a distal luer fitment portion, and a fluid aperture therethrough. The barrel-engaging portion of the connector includes an axial ledge configured to abut the axial distal edge of a glass syringe barrel. The connector facilitates mounting a luer assembly to the barrel. The luer assembly may be a tip cap having a complementary luer fitment for connection to the luer fitment portion of the connector. The luer assembly may be a luer needle assembly having a complementary luer fitment for connection to the luer fitment portion of the connector. The connector and syringe may further include an immobile, compressible needle seal. The needle seal is adjacent to or engageable with the barrel-engaging portion of the connector. The syringe may be configured with a plunger capable of engaging a retractable needle.

Abstract: The present disclosure is directed to a balun circuit adapted to operate at a frequency of between about 5 GHz to about 110 GHz. The balun circuit includes first and second output striplines and an input stripline formed on a first surface of the substrate, and a slotline formed on a second surface of the substrate opposite the first surface. The slotline has first and second ends, the first end overlapping the first output stripline and the second end overlapping the second output stripline, and the input stripline overlapping the slotline midway between the first end and the second end.

Abstract: A high-frequency signal line includes a laminate of a plurality of insulator layers, a signal line provided on a first principal surface of one of the insulator layers, a first ground conductor provided on a second principal surface of the insulator layer provided with the signal line, the first ground conductor including openings that overlap with the signal conductor, and a second ground conductor provided in or on the laminate so as to be opposed to the first ground conductor with the signal conductor positioned therebetween.

Abstract: Some embodiments of the present disclosure describe a multi-layer package with a bi-layered dielectric structure and associated techniques and configurations. In one embodiment, an integrated circuit (IC) package assembly includes a dielectric structure coupled with a metal layer, with the dielectric structure including a first dielectric layer and a second dielectric layer, wherein the first dielectric layer has a thickness less than a thickness of the second dielectric layer and a dielectric loss tangent greater than a dielectric loss tangent of the second layer. Other embodiments may be described and/or claimed.

Abstract: A microwave antenna assembly is printed on a substrate with a first face and an opposing second face. The assembly includes at least one antenna disposed on the front face of the substrate and a balun disposed on the rear face of the substrate. A first microstrip on the front face is coupled to the antenna(s). A second microstrip on the front face is coupled a feed line. A coplanar strip on the rear face is electrically coupled to the second microstrip and electromagnetically coupled to the first microstrip.

Abstract: A printed circuit board (PCB) is disclosed. The PCB includes a substrate have a top surface and a bottom surface. A first conductive layer is disposed on the top surface of the substrate. The first conductive layer comprises a first signal net and a second signal net. An outermost insulating layer is disposed on the top surface of the substrate to cover the substrate and the first conductive layer. The outmost insulating layer comprises an opening to expose a portion of the second signal net. And, a second conductive layer is disposed on the outermost insulating layer and substantially covering at least a portion of the first signal net. The second conductive layer is filled into the opening to electrically connect to the second signal net which is able to provide one of a ground potential and a power potential.

Abstract: A high-frequency signal line includes a dielectric body including a first dielectric layer and one or more other dielectric layers laminated together. A first signal line is provided on a first main surface, which is a main surface located on one side in a direction of lamination, of the first dielectric layer. A second signal line is provided on a second main surface, which is a main surface located on another side in the lamination direction, of the first dielectric layer so as to face the first signal line via the first dielectric layer. The second signal line is electrically connected to the first signal line. A first ground conductor is located on one side in the lamination direction than the first signal line. A second ground conductor is located on another side in the lamination direction than the second signal line.

Abstract: A connector for coupling a coaxial cable (240) to a strip line comprises a first plate (210) to be arranged above a conductor (220) of the strip line to which a center conductor (244) of the coaxial cable (240) is soldered, the first plate (210) including: a first solder portion (212) to which a braid (242) of the coaxial cable (240) is soldered; and an aperture (214) formed adjacent to the first solder portion (212) and configured to prevent heat propagation of a solder point of the first solder portion (212) and the braid (242) of the coaxial cable (240) and to expose a solder point of the conductor (220) of the strip line and the center conductor (244) of the coaxial cable (240), wherein a biggest dimension of the aperture (214) is shaped to be less than 5% of highest frequency wavelength.

Abstract: A technique relates to a microwave device. A microwave system is configured to output a microwave readout signal, where the microwave system has an input and an output. An output microwave transmission line is connected to the output of the microwave system. A distributed Bragg reflector, integrated into a transmission line geometry, is configured as a low-loss infrared filter that blocks infrared radiation while allowing transmission of the microwave readout signal. The low-loss infrared filter is connected to the output microwave transmission line.

Abstract: An electrical connection interface is provided. The electrical connection interface includes a first ground plane layer, a second ground plane layer, a first substrate and a second substrate. The second ground plane layer is positioned to overlap the first ground plane layer. The first substrate includes a first substrate conductive lead with a first interface region connected to and electrically insulated from the first ground plane layer. The second substrate includes a second substrate conductive lead with a second interface region connected to the first substrate conductive lead and the second ground plane layer. The second substrate conductive lead is electrically insulated from the second ground plane layer.

Abstract: The invention relates to a dipole antenna including first and second radiating elements electrically connected via a transition, said first and second elements being associated with a frequency f1 in a frequency band, a feeding point the feeding point and the reference point being respectively connected to a feeding conductor and a ground conductor of a feeding line, and a balun. The balun is formed by a slot arranged in the first radiating element, said slot having a short circuit at a first end and an open circuit at a second end next to the transition. The feeding point and the reference point are arranged on opposite sides of the slot.

Abstract: A time delay filter comprising a substrate comprising a first surface and a second surface opposite the first surface; a first LC resonator coupled to the substrate and comprising a first coupling point, a first capacitive element electrically coupled between the first coupling point and the first conductive region, and a first inductive element coupled between the first coupling point and the first conductive region, and comprising a first and second inductor tap; and a second LC resonator coupled to the substrate and comprising a second coupling point, a second capacitive element electrically coupled between the second coupling point and the first conductive region, and a second inductive element electrically coupled between the second coupling point and the first conductive region wherein the system group delays a signal output at a second coupling point relative to a signal input at the first coupling point.

Abstract: A stacked-waveguide substrate includes: a body configured to include a first dielectric-substrate, a second dielectric-substrate, and a third dielectric-substrate which are stacked in this order; a first conductor-pattern configured to be formed on a bottom surface of the first dielectric-substrate; a second conductor-pattern configured to be formed on a top surface of the third dielectric-substrate in a position corresponding to the first conductor-pattern; a first conductor-film configured to be located at an interface between the first dielectric-substrate and the second dielectric-substrate, and to have a first opening which faces the first conductor-pattern; a second conductor-film configured to be located at an interface between the second dielectric-substrate and the third dielectric-substrate, and to have a second opening which faces the second conductor-pattern; a first wiring line configured to cross the first opening to the first conductor-pattern; and a second wiring line configured to cross the s