Abstract: A transmission line section of a flat cable includes a dielectric element including a signal conductor at an intermediate position of a thickness direction, a first ground conductor, and a second ground conductor. The first ground conductor includes elongated conductors that are spaced apart from each other in a width direction of the dielectric element, and extend in a longitudinal direction, and bridge conductors that connect the elongated conductors at spaced points along the longitudinal direction. A widened portion having a width larger than the width of the elongated conductors is located at the intermediate position between bridge conductors that are adjacent to each other along the longitudinal direction. The widened portion is configured to project in a direction in which the elongated conductors are opposed to each other. An interlayer connection conductor is located in the widened portion.

Abstract: A flat cable includes a dielectric element assembly including a plurality of dielectric layers laminated on each other, a linear signal line provided in the dielectric element assembly, a first ground conductor provided on one side in a direction of lamination relative to the signal line and including a plurality of first openings arranged along the signal line, and a second ground conductor provided on the other side in the direction of lamination relative to the signal line and including a plurality of second openings arranged along the signal line. The first ground conductor is more distant from the signal line in the direction of lamination than is the second ground conductor. The first openings are larger than the second openings.

Abstract: A feed structure for a wearable antenna incorporates a microstrip transmission line designed for mounting on opposite sides of a fabric. The transmission line has a perforated ground plane which reduces capacitance and offers an appropriate impedance, even when the fabric is thin, and allows the use of a relatively robust line conductor having a width of 3 mm or 5 mm or more. The ground plane can be extended to provide the ground plane of a balun and the material of that ground plane can in turn be extended to provide the wearable antenna.

Abstract: A RF connector assembly, suitable for millimeter waves comprises a housing, holding a transmission line and a RF connector. The transmission line has a band conductor held in an outer conductor. The band conductor is supported by a plurality of holding pins. The holding pins are fixed by holes in the outer conductor and penetrate the inner conductor through holes therein. The holding pins are injection molded parts made of plastic. They comprise of two sections which can be connected together by a plug and socket connection. One end of the transmission line has a printed circuit board contact for contacting a strip line, while the other end of the transmission line has a contact for connecting the inner conductor of the RF connector.

Abstract: An antenna is connected to a first end of a high-frequency transmission line, and a connector is connected to a second end of the high-frequency transmission line. A characteristic impedance of a microstrip line is higher than characteristic impedances of first and second strip lines, and a characteristic impedance of a coplanar line is higher than a characteristic impedance of the second strip line. Thus, at a certain frequency, a standing wave develops in which the position of the microstrip line and the position of the coplanar line are maximum voltage points and three-quarter-wavelength resonance is a fundamental wave mode. Thus, the cutoff frequency of the high-frequency transmission line is high, and an insertion loss of a signal is significantly reduced to be low over a wide band.

Abstract: A high-frequency signal transmission line includes a plate-shaped dielectric element assembly, a linear signal line, and a first ground conductor. The linear signal line is provided at the dielectric element assembly and includes a plurality of thick portions and a plurality of thin portions with a smaller width than the thick portions. The first ground conductor is provided at the dielectric element assembly and positioned on one side in a normal direction to the dielectric element assembly relative to the signal line. The first ground conductor includes a plurality of openings overlapping with the signal line and also includes bridge portions provided between the openings so as to cross the thin portions. The bridge portions cross the thin portion obliquely when viewed in a plan view in the normal direction to the dielectric element assembly.

Abstract: A high-frequency signal transmission line includes a plate-shaped dielectric element assembly, a linear signal line, and a first ground conductor. The linear signal line is provided at the dielectric element assembly and includes a plurality of thick portions and a plurality of thin portions with a smaller width than the thick portions. The first ground conductor is provided at the dielectric element assembly and positioned on one side in a normal direction to the dielectric element assembly relative to the signal line. The first ground conductor includes a plurality of openings overlapping with the signal line and also includes bridge portions provided between the openings so as to cross the thin portions. The bridge portions cross the thin portion obliquely when viewed in a plan view in the normal direction to the dielectric element assembly.

Abstract: In one or more embodiments, circuitry is provided for isolation and communication of signals between circuits operating in different voltage domains using capacitive coupling. The capacitive coupling is provided by one or more capacitive structures having a breakdown voltage that is defined by way of the various components and their spacing. The capacitive structures each include three capacitive plates arranged to have two plates located in an upper layer and one plate located in a lower layer. A communication signal can be transmitted via the capacitive coupling created between the lower plate and each of the upper plates, respectively.

Abstract: An easily bendable high-frequency signal transmission line includes a dielectric body including a protection layer and dielectric sheets laminated on each other, a surface and an undersurface. A signal line is a linear conductor disposed in the dielectric body. A ground conductor is disposed in the dielectric body, faces the signal line via the dielectric sheet, and continuously extends along the signal line. A ground conductor is disposed in the dielectric body, faces the ground conductor via the signal line sandwiched therebetween, and includes a plurality of openings arranged along the signal line. The surface of the dielectric body on the side of the ground conductor with respect to the signal line is in contact with a battery pack.

Abstract: A semiconductor transmission line substructure and methods of transmitting RF signals are described. The semiconductor transmission line substructure can include a substrate; a first signal line over the substrate; a first ground line over the substrate; and a second semiconductor substrate over the substrate. The first signal line, the first ground line and the second semiconductor substrate are each vertically spaced apart from one another and can be separated from one another by at least one electrically insulating layer.

Abstract: Disclosed herein, among other things, are methods and apparatuses that provide a manufacturable RF transmission line to go through the bend area of a flexible circuit to be used in a compact design, such as in a compact hearing aid design. One aspect of the present subject matter relates to using multiple inner layers of the flexible circuit to route RF transmission. By not using outer layers, the RF transmission line will be less susceptible to delamination from the polyimide dielectric layer. One aspect of the present subject matter relates to choosing copper transmission line to have dimensions that allow for narrower transmission lines with good RF return loss. The copper transmission line dimensions also allow for manufacturing in a standard process without adding extra cost.

Abstract: A high-frequency circuit is described as having lines crossing each other on a printed circuit board for high-frequency signals, wherein the sections of the lines, lying on both sides of a crossing point as well as a coupler forming the crossing point are situated in a common plane on the printed circuit board and the sections of the lines are connected to four ports of the coupler situated in a quadrangle, which are connected to one another via a plurality of coupling paths in such a way that the components of a signal supplied at a port, which propagate on various coupling paths, interfere destructively at the adjacent ports and constructively at the diagonally opposite port.

Abstract: A high-frequency signal line includes a dielectric body including a first dielectric layer and one or more other dielectric layers laminated together. A first signal line is provided on a first main surface, which is a main surface located on one side in a direction of lamination, of the first dielectric layer. A second signal line is provided on a second main surface, which is a main surface located on another side in the lamination direction, of the first dielectric layer so as to face the first signal line via the first dielectric layer. The second signal line is electrically connected to the first signal line. A first ground conductor is located on one side in the lamination direction than the first signal line. A second ground conductor is located on another side in the lamination direction than the second signal line.

Abstract: A transmission line portion of a flat cable includes first regions and second regions connected alternately. In the first region, the transmission line portion is a flexible tri-plate transmission line including a dielectric element including a signal conductor, a first ground conductor including opening portions, and a second ground conductor which is a solidly filled conductor. In the second region, the transmission line portion is a hard tri-plate transmission line including a wide dielectric element including a meandering conductor, and a first ground conductor and a second ground conductor which are solidly filled conductors. A variation width of the characteristic impedance in the second region is larger than a variation width of the characteristic impedance in the first region.

Abstract: A signal transmission line is disclosed. The signal transmission line includes a dielectric substrate, a signal line formed on a first surface of the dielectric substrate, a first conductive layer formed on a second surface of the dielectric substrate, and a first stub formed on the first surface of the dielectric substrate, the first stub being electrically connected with the signal line. The first stub includes a plurality of straight areas each extending from a different position of the signal line, a conductor part extending in parallel with the signal line, the conductor part being electrically connected with straight areas, a projection part connected with the conductor part, the projection part extending from the conductor part, and an opening provided between the conductor part and the signal line.

Abstract: A multifunction electronics member combining structural and electronics functions includes in one embodiment an elongate longitudinally-extending structural body configured to support a structural load and including a first support base, a stiffening projection, and a first electrical circuit supported by the first support base. The circuit preferably is embedded between the first circuit base and a cover to form an electrically-active, or in some embodiments passive, structural member.

Abstract: A novel and useful fabricated variable transmission line that is tuned digitally is presented. Digital tuning of the variable transmission line enables the compensation of process variation in both the active and passive devices of the RF design. Along with several embodiments of the variable transmission line, the present invention also provides a method of compact modeling of the variable transmission line. The variable transmission line structure and compact modeling enables circuit level simulation using a parametric device that in one embodiment can be included as an integral part of a silicon foundry design kit.

Abstract: A semiconductor device has an RF balun formed over a substrate. The RF balun includes a first conductive trace wound to exhibit inductive properties with a first end coupled to a first terminal of the semiconductor device and second end coupled to a second terminal of the semiconductor device. A first capacitor is coupled between the first and second ends of the first conductive trace. A second conductive trace is wound to exhibit inductive properties with a first end coupled to a third terminal of the semiconductor device and second end coupled to a fourth terminal of the semiconductor device. The first conductive trace is formed completely within the second conductive trace. The first conductive trace and second conductive trace can have an oval, circular, or polygonal shape separated by 50 micrometers. A second capacitor is coupled between the first and second ends of the second conductive trace.

Abstract: Multi-layer in integrated transmission line circuits are provided having improved signal loss characteristics. A multi-layer integrated transmission line circuit, such as a stripline circuit or a microstrip circuit, comprises at least one reference layer; at least one conducting layer having one or more conducting strips, wherein the at least one conducting layer is separated from the at least one reference layer by a substrate; and at least one additional layer positioned between the at least one conducting layer and the at least one reference layer. The multi-layer integrated transmission line circuit may also comprise a dielectric insulating material, such as an organic material or a ceramic material. The additional layers increase a dielectric thickness of the multi-layer integrated transmission line circuit to reduce dielectric losses.

Abstract: An interconnecting structure for electrically connecting a first electronic device with a second electronic device is provided. The first electronic device has two first bond-pads, and the second electronic device has two second bond-pads electrically connected to the two first bond-pads respectively. The interconnecting structure includes a signal transmission structure electrically connected to the two first bond-pads and the two second bond-pads; and a ground device disposed between the first electronic device and the second electronic device so that the first electronic device and the second electronic device have a same ground potential.

Abstract: The instant disclosure describes a radiofrequency propagation line including a conducting strip connected to a conducting plane parallel to the plane of the conducting strip, wherein the conducting plane includes a network of nanowires made of an electrically conductive, non-magnetic material extending orthogonally to the plane of the conducting strip, in the direction of said conducting strip.

Abstract: A high-frequency signal line includes a dielectric laminate body including a first dielectric layer, an adhesive layer and a second dielectric layer laminated in this order from a first side to a second side in a direction of lamination. A linear signal line is fixed on a main surface of the adhesive layer. A main ground conductor is provided on a main surface of the dielectric layer. An auxiliary ground conductor is provided on the second dielectric layer. The adhesive layer bonds the first and second dielectric layers together. A distance in the direction of lamination between the signal line and the main ground conductor is greater than a distance in the direction of lamination between the signal line and the auxiliary ground conductor.

Abstract: A high-frequency signal transmission line includes a flexible body including a plurality of insulating layers. A linear signal line is located in or on the body. A first ground conductor is located opposite to the signal line via at least one of the insulating layers. A second ground conductor extends along the signal line. An interlayer connection portion that connects the first ground conductor and the second ground conductor includes a plurality of interlayer connection conductors individually pierced in some of6 the insulating layers and connected to each other. The plurality of interlayer connection conductors includes two interlayer connection conductors that are pierced in adjacent ones of the insulating layers with respect to a layer-stacking direction and that have central axes located in different positions when viewed from the layer-stacking direction.

Abstract: Method of manufacturing a transmission line including the steps:—forming an element with at least one longitudinal groove on a surface of the element, the longitudinal groove being defined by two opposite wall portions in the element and having a longitudinal opening adjacent to the surface, and—locating a conductor line in the at least one longitudinal groove. The method is distinguished by the steps:—forming the conductor line from a metal strip upon punching the same from a sheet of metal,—attaching the metal strip to at least one holding device, and—mounting the at least one holding device, with the attached metal strip, on the element, so as to locate the metal strip in the longitudinal groove at a distance from the opposite wall portions of the element. The invention also concerns a transmission line manufactured in accordance with the method.

Abstract: A high-frequency signal line includes a dielectric body including flexible dielectric sheets laminated in a direction of lamination and also including a first line portion, a second line portion extending along the first line portion, and a third line portion connecting ends in a specified direction of the first and second line portions. In the dielectric body, a signal line extends through the first, second and third line portions, and a first ground conductor and a second ground conductor face the signal line from both sides in the direction of lamination. One or more interlayer connection conductors are pierced in the dielectric sheets to connect the first ground conductor and the second ground conductor. None of the interlayer connection conductors is provided in a portion of the third line portion that is farther in a direction opposite to the specified direction than the signal line when viewed from the direction of lamination.

Abstract: In a high frequency signal line, a first signal line extends along a first dielectric element assembly, a first reference ground conductor extends along the first signal line, a second signal line is provided in or on the second dielectric element assembly and extends along the second dielectric element assembly, a second reference ground conductor is provided in or on the second dielectric element assembly and extends along the second signal line. A portion of a bottom surface at an end of the first dielectric element assembly and a portion of the top surface at an end of the second dielectric element assembly are joined together such that a joint portion of the first and second dielectric element assemblies includes a corner. The second signal line and the first signal line are electrically coupled together. The first and second reference ground conductors are electrically coupled together.

Abstract: A vertical three dimensional (3D) microstrip line structure for improved tunable characteristic impedance, methods of manufacturing the same and design structures are provided. More specifically, a method is provided that includes forming a first microstrip line structure within a back end of the line (BEOL) stack. The method further includes forming a second microstrip line structure separated from the BEOL stack by a predetermined horizontal distance.

Abstract: On-chip, high performance, slow-wave coplanar waveguide with through-silicon via structures, method of manufacture and design structures for integrated circuits are provided herein. The method includes forming at least one ground plane layer in a substrate and forming a signal layer in the substrate, in a same plane layer as the at least one ground. The method further includes forming at least one metal filled through-silicon via between the at least one ground plane layer and the signal layer.

Abstract: Described herein are an apparatus, system, and method having a compact symmetrical transition structure for RF applications. The apparatus comprises: first and second ground planes each of which having respective truncated edges, the first and second ground planes being parallel to one another and separated by a multi-layer substrate; a strip line positioned between the first and second ground planes; and a symmetrical transition structure, coupled to the strip line and the first and second ground planes near their respective truncated edges, and further coupled to a broadside coupled line (BCL).

Abstract: A high-frequency signal line includes a first base layer having flexibility, a linear signal line provided on the first base layer and including a first line portion having a first width and a second line portion having a second width greater than the first width, and a first reinforcing conductor provided on the first base layer along the first line portion.

Abstract: A laminated flat cable includes a laminate, a signal line for high-frequency signal transmission, a reference ground conductor, and an auxiliary ground conductor. The laminate includes a first base layer with first and second principal surfaces and a second base layer with third and fourth principal surfaces, and the second principal surface is opposed to the third principal surface. The signal line is located on the second principal surface. The reference ground conductor is located on the first principal surface and is opposite to the signal line. The auxiliary ground conductor is located on the third or fourth principal surface and is opposite to the signal line. The auxiliary ground conductor includes a plurality of openings arranged along the signal line.

Abstract: A high radio frequency transmission line having a dielectric substrate with two sides and constructed of a transparent material. An electrically conductive strip extends along at least a portion of one side of the substrate. An electrically conductive film is deposited on one of the sides of the substrate at a position spaced from the conductive strip. This conductive film has a thickness sufficiently small so that the film is substantially transparent.

Abstract: A flexible substrate is disclosed. The flexible substrate includes an insulating substrate having a first surface and a second surface opposite to the first surface, a first connection portion having a first conductor, a first ground pattern, and a second ground pattern on the first surface, the first ground pattern and the second ground pattern being spaced apart from the first conductor and respectively located at either side of the first conductor, a conductor pattern formed on the second surface, the conductor pattern being connected to the first conductor, and a third ground pattern formed on the second surface, the third ground pattern being connected to the first ground pattern, wherein a distance between the conductor pattern and the third ground pattern is smaller than a distance between the first conductor and the first ground pattern.

Abstract: A high-frequency signal line includes a body with a first layer level and a second layer level; a signal line including a first line portion provided at the first layer level, a second line portion provided at the second layer level, and a first interlayer connection connecting the first line portion and the second line portion; a first ground conductor including a first ground portion provided at the first layer level; a second ground conductor including a second ground portion provided at the second layer level; and a second interlayer connection connecting the first ground portion and the second ground portion. A distance between the first interlayer connection and the second interlayer connection is not less than a maximum distance between the first line portion and the first ground portion and is not less than a maximum distance between the second line portion and the second ground portion.

Abstract: A signal line includes a first line portion at a first layer level and a second line portion at a second layer level, which are connected by a first interlayer connection. A first ground portion at the first layer level includes end portions closer to the first line portion than an intermediate portion, and a second ground portion at the second layer level includes end portions closer to the second line portion than an intermediate portion. A second interlayer connection connects one of the end portions of the first ground portion and one of the end portions of the second ground portion. A distance between the first and second interlayer connections is less than a distance between the first line portion and the intermediate portion of the first ground portion and is less than a distance between the second line portion and the intermediate portion of the second ground portion.

Abstract: A dielectric element assembly includes a plurality of dielectric layers stacked on each other in a direction of lamination and extends in an x-axis direction. A signal line is provided in the dielectric element assembly and extends in the x-axis direction. A reference ground conductor is provided on a positive side in a z-axis direction relative to the signal line. An auxiliary ground conductor is provided on a negative side in the z-axis direction relative to the signal line. Via-hole conductors connect the reference ground conductor and the auxiliary ground conductor and are provided in the dielectric element assembly on the negative side relative to the center in a y-axis direction. A portion of the signal line in a section which includes the via-hole conductors is positioned on the positive side in the y-axis direction relative to another portion of the signal line in a section which does not include the via-hole conductors.

Abstract: Systems and methods are provided a circuit interconnect. In one embodiment of the disclosure, the circuit interconnect includes a dielectric layer. A parallel synchronous bus is disposed on the dielectric layer. The parallel synchronous bus includes at least four conductive traces. The conductive traces are non-uniformly spaced from one another along a portion of the bus where the conductive traces are physically aligned in parallel so that crosstalk interference among the conductive traces is equalized across the conductive traces.

Abstract: A microstrip line structure includes a conductive ground plane having a strip opening encircled by the ground plane. The strip opening extends from a top surface to a bottom surface of the ground plane. The microstrip line structure further includes a dielectric strip filling the strip opening; a dielectric layer over and contacting the ground plane; and a signal line over the dielectric layer, wherein the signal line has a portion directly above a portion of the dielectric strip, and wherein the signal line and the dielectric strip are non-parallel.

Abstract: A shield for differential transmission lines formed in a first metal layer may include one or more floating shields, each floating shield comprising an upper-side tile formed in a second metal layer of the integrated circuit adjacent to the first metal layer, a lower-side tile formed in a third metal layer of the integrated circuit adjacent to the first metal layer and non-adjacent to the second metal layer, and at least one via configured to electrically couple the upper-side tile at an end of the length of the upper-side tile to the lower-side tile and at an end of the length of the lower-side tile.

Abstract: This disclosure provides systems, methods and apparatus for a compact 3-D coplanar transmission line (CTL). In one aspect, the CTL has a proximal end and a distal end separated, in a first plane, by a distance D, the first plane being parallel to a layout area of a substrate. The plane is defined by mutually orthogonal axes x and z The CTL provides a conductive path having pathlength L. D is substantially aligned along axis z, L is at least 1.5×D, and the CPW is configured such that at least one third of the pathlength L is disposed along one or more directions having a substantial component orthogonal to the first plane. Less than one third of the pathlength L is disposed in a direction having a substantial component parallel to axis x.

Abstract: A communication sheet (100) according to the present invention that transmits an electromagnetic wave for communication, includes a dielectric layer (120) including a dielectric substrate, a first conductor layer (110) including a mesh sheet-like mesh conductor disposed on one surface of the dielectric substrate; and a second conductor layer (130) including a sheet-like conductor disposed on another surface of the dielectric substrate opposite to the first conductor layer (110). The communication sheet (100) is provided which includes an opening whose width in a direction perpendicular to a traveling direction of the electromagnetic wave for communication traveling through the dielectric layer (120) is not less than 1/20 and not greater than ? of a width in the direction perpendicular to the traveling direction of the dielectric substrate, the opening penetrating from the first conductor layer (110) to the second conductor layer.

Abstract: An embodiment relates to a coplanar waveguide electronic device comprising a substrate whereon is mounted a signal ribbon and at least a ground plane. The signal ribbon comprises a plurality of signal lines of a same level of metallization electrically connected together, and the ground plane is made of an electrically conducting material and comprises a plurality of holes.

Abstract: A circuit converts a single-ended signal to differential signals that are balanced to have the same amplitudes and opposite phases relative to a reference point of the differential signals. The circuit includes a balance tunable balun, a detector, and a controller. The balance tunable balun has a primary winding, a secondary winding, a control input, and a switched resistor-capacitor (RC) network. The primary winding receives the single-ended signal and the secondary winding outputs the differential signals. The control input receives a control signal and the switched RC network controls the reference point of the differential signals responsive to this control signal. The detector detects the output imbalance and the controller generates the control signal to control the switched RC network to effectively adjust the reference point as needed to reduce that output imbalance. The circuit produces well balanced differential signals over a wide range of signal frequencies.

Abstract: Methods and devices for phase shifting an RF signal for a base station antenna are provided. The device includes a transmission line that has a stationary ground plane coupled to the top of a substrate and a signal line on the bottom of the substrate. The signal line has an input port and an output port. The input port receives the RF signal with a certain phase and travels across the bottom of the substrate to the output port. The RF signal has a different phase at the output port because defected ground structures etched on the stationary ground plane shift the phase of the RF signal. In addition, the device includes a movable ground plane that may cover a portion of the defected ground structures, the substrate, and the stationary ground plane such that the moveable ground plane further adjusts the phase of the RF signal.

Abstract: A high-frequency transmission line includes a laminate including dielectric layers, a first signal line provided in the laminate, a second signal line provided in the laminate and positioned on a first side in a direction of lamination relative to the first signal line, so as to cross the first signal line when viewed in a plan view in the direction of lamination, a first ground conductor positioned on a second side in the direction of lamination relative to the first signal line, a second ground conductor positioned on the first side in the direction of lamination relative to the second signal line, and an intermediate ground conductor provided between the first and second signal lines in the direction of lamination, so as to overlap with crossing portions of the first and second lines when viewed in a plan view in the direction of lamination.

Abstract: A high-frequency transmission line includes a laminate including dielectric layers, a first signal line provided on one of the dielectric layers, a second signal line crossing the first signal line when viewed in a plan view in a direction of lamination, the second signal line being positioned on the same dielectric layer as the first signal line except for a crossing portion that crosses with the first signal line, and an intermediate ground conductor provided between the first and second signal lines in the direction of lamination, so as to overlap with crossing portions of the first and second signal lines when viewed in a plan view in the direction of lamination.

Abstract: A high speed flexible interconnect cable for an electronic assembly includes a number of conductive layers and a number of dielectric layers. Conductive signal traces, located on the conductive layers, combine with the dielectric layers to form one or more high speed electrical transmission line structures. The cable can be coupled to electronic components using a variety of connection techniques. The cable can also be terminated with any number of known or standardized connector packages.

Abstract: The printed wiring board has a conductor of signal line 41 and two conductive lines 42 on one face of the first insulating layer 10 covered by a second insulating layer 20, while having a ground layer of the ground 30 potential on the opposite face thereof, when the dielectric tangent A of the second insulating layer (insulating layer A) 20 is larger than the dielectric tangent B of the first insulating layer (insulating layer B) 10, Relational Expression 1: (relative permittivity B)·(width (W41) of signal line(s) 41)/(thickness (T10) of first insulating layer (insulating layer B) 10)>(relative permittivity A)·{(thickness (T41) of signal line(s) 41)/(distance (S1) between signal line(s) 41 and one conductive line 42a)+(thickness (T41) of signal line(s) 41)/(distance (S2) between signal line(s) 41 and other conductive line 42b)+(thickness (T41) of signal lines 41)/(distance (S3) between pair of signal lines (41a and 41b)·2} is satisfied.

Abstract: A flexible circuit board includes: an insulative substrate having a first surface and a second surface opposite to the first surface; a microstrip line having a first signal line formed on the first surface and a first ground pattern formed on the second surface and located in an area opposite to the first signal line; a coplanar line having a second signal line formed on the first surface, and second ground patterns that are formed on the first surface and are spaced apart from both sides of the second signal line; a connection line that is formed on the first surface and connects the first signal line and the second signal line together, the connection line having an opening; and third ground patterns formed on the second surface and arranged in areas located at both sides of an area opposite to the connection line including the opening.

Abstract: A flat cable includes a dielectric element assembly including a plurality of dielectric layers laminated on each other, a linear signal line provided in the dielectric element assembly, a first ground conductor provided on one side in a direction of lamination relative to the signal line and including a plurality of first openings arranged along the signal line, and a second ground conductor provided on the other side in the direction of lamination relative to the signal line and including a plurality of second openings arranged along the signal line. The first ground conductor is more distant from the signal line in the direction of lamination than is the second ground conductor. The first openings are larger than the second openings.