Abstract: A microwave circuit includes a concentric-circle-like prominence (7) formed on a contact surface which is on the side of a metal body (3) serving as an external conductor of a coaxial line and which connects a conductor strip (1) of an MSL formed on a dielectric substrate (2) to an internal conductor of the coaxial line through a through-hole (9) extending from a ground plane (11) of the MSL through the dielectric substrate (2). The construction involves no mismatched portion and can prevent a loss and deterioration in VSWR in the coaxial-line/MSL conversion section, thereby making it possible to obtain satisfactory characteristics.

Abstract: The improved moistureproof structure for a module circuit is characterized in that a porous film conditioned to have an apparent relative dielectric constant of no more than 2.0 is coated over a stripline a high-frequency circuit, or a high-frequency device formed on a substrate, which porous film may in turn be provided with a resin coating material. The structure insures that the module circuit is moistureproof, thereby protecting it against corrosion to improve its operational reliability without affecting its electrical characteristics.

Abstract: In a microwave multistage amplifier, a shield casing (8) has a partition plate (7) integrally moulded with and disposed in the casing (8); microwave amplifiers (5, 6) are arranged on a dielectric substrate so as to locate the partition plate therebetween; and an upper cover plate (11) is provided which can be screwed to partition plate (7). By virtue of the above-mentioned arrangement, it becomes possible to strictly separate rooms defined in the casing from each other and suppress generation of a surface wave mode of the microwave propagation on the dielectric substrate, thereby assuring an isolation between the amplifiers.

Abstract: A high-frequency bias supply circuit includes a plurality of bias supply lines each of which is connected in parallel with others between a corresponding one of selected points along the main signal line and a common bias supply terminal. Each of the bias supply lines has a length and a distance from an adjacent bias supply line different from those of others, the length and the distance being in a range of a 1/3 to 3/8 wavelength of the center frequency.

Abstract: A first stripline on a first dielectric carrier material having a first dielectric constant is releasably connected to a second stripline on a second dielectric carrier material having a second dielectric constant by means of an elastic connection strip including a plurality of surface contact strips which extend transversely to its longitudinal direction. In order to reduce reflections at the location of connection, the striplines have the same width and the first carrier material is provided with an additional conductive inner layer, which is connected to ground potential, and, depending on the two dielectric constants and on the thickness of the second carrier material, the distance between the first stripline and the additional conductive inner layer is chosen such that the two striplines have characteristic impedances which correspond to one another.

Abstract: A surface-mountable packageless hybrid comprising a ceramic substrate with circuit elements attached to a top surface of the substrate is soldered to a ground pad on a printed circuit board. A high performance transition for microwave frequency signals between the circuit board and the substrate is provided by RF connections comprising three gull wing shaped leads connecting three solder pads on the printed circuit board to three solder pads on the substrate, the solder pads having capacitive matching sections to compensate for lead inductance. The center lead conducts the microwave frequency signal while the outer leads are grounded.

Abstract: In a device for contacting shielded conductors, surrounded by shield and ground planes, a clamping means is disposed to press contact means connected to the conductors against each other as well as shield and ground planes which face each other and surround the contact means. A pad of an electrically conducting, elastic material is arranged between the clamping means and one of the contact means. The pad covers the contact area between the contact means and is in contact with the surrounding ground planes to form an electrically closed enclosure of the contact means.

Abstract: A microstrip transmission line substrate to substrate transition is provi comprising a pair of spaced-apart dielectric substrates having facing inner surfaces and ground planes on the non-facing outer surfaces and a parallelepiped-shaped dielectric waveguide element sandwiched between the substrate inner surfaces. The waveguide element has a pair of rhomboidal-shaped sides and a pair of sloping ends. A first microstrip conductor is disposed on the inner surface of one of the substrates and the upwardly-sloping end of the waveguide element contiguous to that surface. A second microstrip conductor is disposed on the inner surface of the other substrate and the other sloping end of the waveguide element, so that a pair of mutually-inverted microstrip transmission lines is formed. The dielectric constant of the material of the substrates is preferably much less than the dielectric constant of the waveguide element material.

Abstract: A high frequency signal processing apparatus having signal line patterns formed on the upper surface of a dielectric substrate has a bias line pattern that extends from each of the signal line patterns. The bias line pattern has a first portion formed on the upper surface of the dielectric substrate, a second portion formed on the lower surface of the dielectric substrate, and a conductor extending through the dielectric substrate for providing an electrical connection between the first and second portions of the bias line pattern. A trap pattern is formed on the lower surface of the dielectric substrate and is connected to the second portion of the bias line pattern at a position spaced a predetermined distance away from the corresponding one of the signal line patterns. The predetermined distance is substantially equal to an odd number multiplied by T.multidot..lambda./4 where T and .lambda. are the periodicity and wave-length of the high frequency signal to be processed.

Abstract: A flat type dielectric filter comprises a substantially U-shaped strip line formed such that each center frequency of spurious output deviates from each odd number frequency times the center frequency of the dielectric filter. That is, it comprises a first portion so curved to form an open loop and two second portions formed to have a larger width than the first portion, each of the second portions being provided to an end of the first portion such that each extends in the opposite direction to the other. In this filter, input/output electrodes confronting ends of U-shaped strip line can be formed on a different layer from the layer where the resonator is formed in order to reduce its size. Reduction of size can be obtained by vertically folding the U-shaped strip line extending horizontally. Terminals of this filter formed on the side surface have a first layer formed on the side surface and a second layer formed on the first layer.

Abstract: The transition interconnects microstrip transmission lines whose finite-width conductors are formed on the upper surface and whose ground planes are formed on the under surface of a ceramic substrate. A patternable metallizable multilayer thick film dielectric is applied to the under surface of the ceramic substrate. The transition comprises first and second vias which penetrate the ceramic substrate inside and outside a hermetic enclosure. The upper ends of the vias are connected to the finite-width transmission line conductors, and the lower ends of the vias are interconnected by a finite-width conductor formed on the under surface of the substrate. The lower conductor then forms a transmission line of either a microstrip or coplanar nature with a ground plane available on the underside of the assembly. The thick film dielectric facilitates sealing, and attachment of a metal base plate. All steps are performed using thick film processing.

Abstract: The invention relates to a structure for making microwave circuits and components, in which the mechanical and electrical functions are integrated overall but dissociated locally. The invention is particularly suitable for space applications.

Abstract: An improved coplanar transmission structure has a coplanar transmission line formed on one surface of a substrate and a lossy resistive material formed on the opposite surface of the substrate for suppressing spurious electromagnetic modes propagating through the substrate. The lossy resistive material may be nichrome or the like and is patterned on the substrate using thin or thick film processing.

Abstract: Directed millimeter wave radiation from internal elements of a microwave circuit through the housing cover, housing base, and side walls of a hermetically-sealed MMIC integrated subsystem assembly uses a waffle-wall array of conductive posts as a band rejection filter to provide walls which guide the radiated waves through a hermetically sealed window in the housing base for waveguide propagation or to a dielectric side wall or cover to radiate energy therethrough. For a waveguide launch, the launch probe is printed on a TEM mode microstrip transmission line substrate and is located over or on a dielectric window formed at the end of an air filled waveguide. A waveguide-like mode of propagation is launched perpendicular to the microstrip substrate and the energy is transmitted through the dielectric window into the air dielectric waveguide which extends through the housing base.

Abstract: A DC high voltage block comprising coupled lines etched upon a substrate and covered with a bubble-free, polyurethane insulating layer. The polyurethane insulating layer prevents DC voltage breakdown through air. This DC voltage block provides a planar, noncomplex circuit that can effectively provide voltage blockage up to 4500 volts. High voltage DC blocks of this nature have applications in vacuum tubes and IMPATT devices, as well as ferro-electric or electro-optic phase shifters. They are also employed to protect bias tees and electrical devices that employ bias tees.

Abstract: A flexible circuit such as a membrane probe (10) is made by forming a trench (50, 60) in the upper surface (39) of a polyimide substrate (38) with a trench base (52, 62) spaced below the upper surface. The trench has an end wall (54, 64) ramped at an obtuse angle to the substrate upper surface and the trench base. A conductive layer deposited on the upper surface is patterned to form a line trace (44, 46) extending continuously over the substrate upper surface, down the ramped end wall and along the trench base, to contact a ground plane or form a distributed capacitance. An excimer laser is used, at a wavelength of 308 nm., an energy density less than 0.54 J./cm.sup.2 (preferably 0.18 to 0.35 J./cm.sup.2), and a pulse frequency of about 100 Hz., to ablate successive incremental thicknesses (80) of polyimide from the substrate in sweeps of depthwise decreasing length.

Abstract: A cooling structure for a high frequency power transistor is mounted on a circuit board where heat generated by the transistor is conducted from the semiconductor material through the collector conductor. A metal piece, which is larger than the collector conductor and sized to the requirements of heat removal through the collector conductor, contacts the collector conductor or an extension. The metal piece is solidly attached to a conductor strip formed on the circuit board. Heat is dissipated from the exposed surface of the metal piece to the ambient air and by conduction to the circuit board.

Abstract: The present invention relates to a stripline microwave module comprising: at least one first line situated in a first plane; at least one second line; and at least one coupling opening situated in a second plane so as to enable transmission to take place between the two lines. The invention is particularly suitable for space applications.

Abstract: A load for a stripline integrated into a three-plate structure is formed by a resonant cavity filled with absorbent material. The resonant cavity is defined by metallized holes extending through the three plates. The holes are spaced no more than 1/4 wavelength apart and can extend along the length of the stripline to form an opening of the resonant cavity. The structure of the load allows its size to have the same height and width of the stripline.

Abstract: According to this invention, a monolithic integrated circuit device includes a semiconductor element, a metal ground film and a plurality of electrodes of the semiconductor element, first and second microstrip conductors, and a pair of via hole circuits. A semiconductor element is formed in a predetermined region on the first surface of a semi-insulating compound semiconductor substrate. A metal ground film and a plurality of electrodes of the semiconductor element are independently formed on the first surface of the semiconductor substrate. First and second microstrip conductors are formed on the second surface of the semiconductor substrate. A pair of via hole circuits connect the microstrip electrodes to input and output electrodes of the high-power semiconductor element, respectively.

Abstract: A method and apparatus for optimizing the signal transmission speed between a signal source and a signal receiver of a microelectronic circuit is disclosed. The method includes the step of providing a signal transmission path whose length provides a predetermined ratio between its resistance and characteristic impedance which will reproduce the transmitted signal at the receiving end upon the first signal transition. The length of this transmission path may be increased by using a nonhomogeneous line structure in which the characteristic impedance increases in the direction of the signal transmission. In one form of the invention, the signal transmission path is formed by interconnecting a plurality of micro-strip conductors disposed on different planes of a universally programmable silicon circuit board. Under the appropriate circumstances, a signal can travel through such a "semi-lossy" transmission path at approximately the speed of light.

Abstract: A transition circuit includes a conductive pin; a first dielectric member disposed about a first portion of the conductive pin; and a second dielectric member disposed about a second, different portion of the conductive pin and having a first surface disposed adjacent to a first surface of the first dielectric member. A conductive wall is disposed about and contiguous to a second surface of the first dielectric member and a second surface of the second dielectric member. A strip conductor is disposed on a third surface of said second dielectric member and coupled between said conductive pin and said conductive wall.

Abstract: A dielectric filter having a plurality of dielectric coaxial resonators and a multilayer substrate comprising a plurality of dielectrics layers and a plurality of electrically conductive patterns, wherein the dielectric coaxial resonators are positioned against a front surface of the multilayer substrate and are electrically connected in parallel through first capacitors formed by the electrically conductive patterns of the multilayer substrate, a series connection of a second capacitor, a strip line and a third capacitor or a series connection of a second capacitor, an inductance element and a third capacitor formed by the electrically conductive patterns of the multilayer substrate is electrically connected in parallel relative to the first capacitors. The filter is small and can be manufactured in a reduced number of man-hours.

Abstract: The performance of microwave coplanar and other circuit boards is improved by providing local matching elements for adjusting the characteristic impedance of local transmission line segments to better match the input or output impedance of the particular devices to which they couple. This is accomplished by providing a conductive bridge over the active lead of the transmission line, thereby lowering its characteristic impedance. This is very useful for narrow transmission line segments needed to make contact to small active device and/or MMIC's and which otherwise exhibit a substantial impedance mismatch with such small elements.

Abstract: This invention discloses a band-stop filter, which has multiple sections of non-uniform and unbalanced microstrip transmission line. Such a structure can optimize the characteristics and maximize the matching frequency range. The total length of the filter can be reduced to a half of that of a conventional filter, and the insertion loss in the pass-band is reduced to a third of that of a conventional filter. Besides, this invention suggests a structure which does not require the inward etching of the microstrip line. Instead, the microstrip line itself is used directly as the building element of a spur-line filter. Thus, the tolerance in fabrication can be greatly relaxed without effecting the required characteristics.

Abstract: A filter circuit includes a first pair of RF propagation networks disposed to provide a first coupled line section having a first electrical pathlength at a first frequency, means for providing a signal path between an input port of the filter and the first coupled line section and a second pair of RF propagation networks disposed to provide a second coupled line section having a second different electrical pathlength at the first frequency with a first one of the first pair of RF propagation networks coupled to a first one of the second pair of RF propagation network. The filter circuit further includes a third pair of RF propagation networks disposed to provide a third coupled line section having a third different electrical pathlength at the first frequency with a second one of the second pair of RF propagation networks coupled to a first one of the third pair of RF propagation networks and means for providing a signal path between the third coupled line section and an output port of the filter.

Abstract: A microstrip transmission line structure a series of connected microstrip strip sections having different widths disposed on an outside layer of a unitized multilayer circuit structure and forming a microstrip line, respective ground planes for each of the strip sections formed between insulating layers of the untilized multilayer circuit structure and respectively spaced from the associated strip sections to provide a substantially constant impedance along the length of the microstrip line, and a plurality of conductive vias for electrically interconnecting the respective ground planes.

Abstract: The ends of two strip transmission line substrates which meet at an interface are supported by resting on top of a sandwich structure made up of a dielectric, a circular metal choke member and a conductive pedestal. The choke member, the dielectric and the ground planes of the substrates form a low-loss RF ground connection to bridge the gap at the interface. The choke member, the dielectric and the ground planes form a quarter wave open circuited transmission line stub in the form of a circular structure. This structure acts as an RF choke and reflects a short circuit into the region between the ground planes, making a virtual connection between the ground planes and the metal choke member. The strip transmission line substrates and the metallic choke member are not rigidly connected, thus allowing for relative movement between the substrate and choke member due to differences in thermal expansion or contraction.

Abstract: A miniature, electrostatically actuated, variable impedance circuit element which is operably tunable in response to control signals. With integrated circuit, thin film processing a fixed circuit member is fabricated on a substrate and a movable circuit member is fabricated over the substrate and is movable relative to the fixed circuit member in response to electrostatic fields produced at armature tabs when the control signals are selectively applied to rows of control electrodes. Embodiments include a variable capacitor and a variable ring resonator.

Abstract: A MIC package housing that reduces or completely eliminates alumina substrate cracking due to thermal expansion rate differences between the housing and the alumina by using a low-expansion iron-nickel alloy, such as commercially available Carpenter 49, made to ASTM Specification A-753-78 (Alloy 2) and MIL-N-14411B (MR) (Composition 3 and 4). Such a housing places compressive stresses no glass-to-metal seals used in hermetic feedthroughs and the glass is fused and the stresses relieved by a special process of annealing. Manufacturing yields are improved and very large alumina substrates can be used and are attached by hard soldering.

Abstract: A transmission line comprising first and second planar dielectric layers. Each layer has a first surface and a second surface. The first surface of each layer has a plurality of electrical conductors thereon defining a center conductor and at least two other conductors, one on either side of and spaced from the center conductor. The second surface of each layer has an electrically conductive ground plane thereon. The first surface of one layer is opposed to the first surface of the other layer, with the conductors on the first surface of the one layer being in registry with and in physical and electrical contact with the conductors on the first surface of the other layer. A plurality of conductors are provided for making electrical contact with the ground planes and each of the at least two conductors for causing the ground planes and each of the at least two conductors to be at substantially the same electrical potential.

Abstract: There is presented herein an N-way power combiner/divider and which includes a common output/input port, a plurality of N input/output ports together with N load ports. N transmission lines interconnect the common output/input port with the N input/output ports. A second plurality of N transmission lines interconnect the respective input/output ports with respective ones of the N load ports. Also, a third plurality of N transmission lines interconnect each of the load ports with a common point and which is, in turn, connected to ground by a capacitor. A first plurality of transmission lines and a second plurality of transmission lines include a plurality of metal foil traces respectively mounted on first and second insulator boards which are spaced from each other. At least three metal layers are provided which are electrically connected together and which serve as ground planes.

Abstract: A miniature, electrostatically actuated, stub tuner which is operable to dynamically tune a transmission line in response to control signals. With the use of integrated circuit processing the transmission line is fabricated on a substrate and at least one stub tuner is fabricated over the substrate and is movable relative to the transmission line in response to electrostatic fields produced when the control signals are selectively applied to rows of control electrodes.

Abstract: A multiple layer semiconductor circuit module includes a semiconductor substrate including opposed first and second surfaces and side walls; a first circuit disposed on the first surface of the substrate including a plurality of conductors, at least one of the conductors extending on the first surface of the substrate to one of the side walls; a first electrically insulating layer disposed on the first surface of the substrate, covering the first circuit, and including a second surface adjacent to the first surface of the substrate, an opposed first surface, and side walls; a second circuit disposed on the first surface of the first layer including a plurality of conductors, at least one of the conductors extending on the first surface of the first layer to one of the side walls; a second electrically insulating layer disposed on the first surface of the first layer, covering the second circuit, and including a second surface adjacent to the first surface of the first layer, an opposed first surface, and side

Abstract: A composite microstrip circuit with a plurality of discrete microstrip conents made from materials having different dielectric constants mounted thereon. A transitional taper is formed on each discrete microstrip component at the point where a connection is made between other components or devices. The base on which the discrete microstrip components are positioned has a dielectric constant lower than any of the dielectric constants of the discrete components. The transitional taper results in a low cost, low loss interconnection between discrete microstrip components.

Abstract: A microwave circuit high isolation packaging technology involving the fabrication of a single-piece baseplate containing microwave circuits, the fabrication of a single-piece framework, and the assembly of the baseplate structure to the framework structure eliminating any gaps. The baseplate contains the desired microwave circuitry without isolation channels or other impediments to mounting circuit components or making circuit interconnections. The framework comprises all isolation walls, transoms, or other structures capable of isolating individual portions of the microwave circuit when assembled to the baseplate.

Abstract: A signal carrying structure comprising a planar conductive member having a major surface, a dielectric layer having a substantially constant thickness, and a conductive track. A first major surface of the dielectric layer is in contact with the major surface of the planar conductive member, and the conductive track is in contact with a second major surface of the dielectric layer. The conductive track is spaced from the major surface of the planar conductive member by the dielectric layer. The dielectric layer has a plurality of apertures which extend between the first and second major surfaces thereof in the region between the conductive track and the planar conductive member. The proportion of dielectric material in the dielectric layer is less in this region than in the other regions of the dielectric layer. The structure is used for propagating microwave electromagnetic radiation, and is applicable to strip line, triplate and phased array antenna applications.

Abstract: A TVRO receiver for receiving frequency-modulated video signals comprises a tuner including a super-heterodyne circuit having a voltage-controlled oscillator (VCO), means for supplying a cotnrolling input voltage to the VCO, and a mixer for combining incoming 1st intermediate frequency (IF) sigals within a 1st predetermined IF frequency range with the output of the VCO to reduce the frequency of the 1st IF signals to generate 2nd IF signals within a 2nd predetermined IF frequency range, and a filter for selectively rejecting undersired interference signals. The interference filter comprises separate trap means for respectively blocking out interfering signals having selected bottom and top trap frequencies, tuning means for adjusting the bottom and top trap frequencies, means for increasing the quality factor of the trap means, and means for selectively switching the trap means into and out of the receiver based on the presence or absence of signals which interfere with the received signals.

Abstract: An airline transmission structure in a low temperature co-fired ceramic ("LTCC"). A cavity is made within the LTCC structure. Ground planes surround the cavity. Electronic processing circuitry, such as an airline filter, is suspended within the cavity. Transmission lines are provided to connect the electronic circuitry to the electronic signals (typically microwave) which require processing. Full integration of the airline filter with other electronic circuitry in a single LTCC package is also shown.

Abstract: A multidielectric electrical filter is adapted for passing a primary electrical signal at a first frequency while attenuating higher frequency signals, most notably harmonic spurs. The filter comprises an elongated transmission line and one or more radial pads overlying a first surface of a dielectric support opposite a ground plate. The support is formed of a first dielectric material to achieve a desired capacitive coupling between the pad and the ground plate effective to attenuate the higher frequency signals. The support further comprises a region underlying the transmission line and containing a second dielectric material having a dielectric constant distinct from the first material. Preferably, the region includes one or more slots containing air to minimize the capacitive coupling between the transmisison line and the ground plate and thereby reduce insertion loss of the primary signal that would otherwise lessen the power of the signal to the antenna.

Abstract: The system is a fixture used to nondestructively support electrical circuits for testing. It is particularly useful for physically and electrically mounting circuits which are edge accessed. Support, positioning and contact elements are used in conjunction with a base plate grid and adjustably cooperate through a system of T slots and T shaped projections.

Abstract: Stripline shielding structures for stripline conductors implemented in unitized multilayer circuit structures are disclosed. The stripline structures generally include a lower ground plane below the stripline conductor, one or more embedded ground planes above the stripline conductor, and conductive elements laterally spaced from the stripline conductor for electrically connecting the ground planes. Resistive layers may be included above the embedded ground plane(s) for additional shielding.

Abstract: A connector for RF packages which provides both RF and DC signals to the package. The connector comprises a silicone block with an embedded RF jumper which connects an RF conductor on the package to an RF feed line. The block also has numerous conductive strips passing through it. These conductive strips connect DC feed lines to DC input pads on the package. The connector is compressed by means of a cover, deforming the elastomer block. The block serves to envornmentally seal the RF and DC inputs from the environmental effects.

Abstract: A magnetometer is prepared by depositing three thin-film SQUID magnetic field detectors upon a substrate. Two of the detectors incorporate stripline SQUID detectors deposited at right angles to each other, to measure the orthogonal components of a magnetic field that lie in the plane of the substrate. The third detector uses a planar loop SQUID detector that measures the component of the magnetic field that is perpendicular to the substrate. The stripline SQUID detectors have thin-film base and counter electrodes separated by an insulating layer which is at least about 1 micrometer thick, and a pair of Josephson junctions extending between the electrodes through the insulating layer.

Abstract: Microwave and millmeter-wave system components are fabricated by using slotlines extending from the periphery of CPW resonators. This technique permits the degree of electrical coupling between the CPW and and the slotlines to be adjusted for matching, and the CPW resonators and slotlines behave as if they were relatively independent circuit elements, permitting transmission line models to be useful design tools and predicting the behavior of the system components. The system components are fully planar and allow easy integration of active and passive semiconductor devices in series with the CPW, and in shunt across the slotlines in hybrid and monolithic circuit forms. This technique also enables the conductive plane to be split for biasing semiconductor devices coupled to the CPW resonators for microwave and millimeter-wave power generation, tuning, mixing, filtering, frequency multiplication and switching.

Abstract: An impedance matching transformer includes a dielectric having a varying thickness between opposing surfaces. A transmission conductor and a return conductor are formed on the opposing surfaces. The impedance transformation between a first terminal and a second terminal is proportional to the thickness variation of the dielectric.

Abstract: An integrated circuit package having enhanced mounting density is provided. The package includes a microwave integrated circuit and a drive circuit therefor, both accommodated in a casing having a layer structure made of a multi-layer ceramic. Through holes in a multi-layer ceramic are utilized for wiring so that the number of conductive tracks provided on the same plane can be reduced and the mounting density can be enhanced. The integrated circuit and the drive circuit are disposed in the casing vertically with respect to each other to reduce the overall longitudinal dimension of the package and enhance mounting density. High frequency connectors adapted to feed high frequency signals to the integrated circuit, and connector pins adapted to supply external control signals and a power signal to the drive circuit, are connected on the underside surface of the casing.

Abstract: A microstrip switch having a conductive path comprises a grounded waveguide cavity-defining enclosure. A movable switch member having first and second, separated, electrically conductive segments is mounted within a path-interrupting gap for movement between an open position and a closed position. The first conductive segment is always electrically coupled to the cavity enclosure. The second conductive segment comprises a cantilevered, springy member for contact with the conductive path on either side of the gap when the switch is closed. Single-throw and double-throw embodiments are described.

Abstract: A lightweight mechanical structure is provided for supporting an RF partitioning network for a large dimension array antenna. The network consists of two horizontally disposed stripline RF dividing circuits positioned in two enclosed portions of the network. The network is formed within an enclosure which is made up of rigid side frames and electrically conductive ground planes between which the microwave stripline dividing circuit is formed. The ground plates of the stripline circuit are bonded to rigid honeycomb materials so as to provide structural support. The network is assembled by means of suitable structural adhesives. The structure of the partitioning network of the present invention provides for the RF feeding and mechanical support of large dimension array antennae in one assembly.

Abstract: A stripline circuit grounding and shielding system has specially configured ground plane foil sheets that are applied to opposite sides of a module substrate. The sheets extend beyond perimeter edges of the substrate, being folded into overlapping contact and soldered together. Intersecting slits made in the sheets permit tab portions of each sheet to be formed about protruding circuit components of the module. Cover plates on each side of the module have cavities for receiving the protruding component portions, together with the sheet tab portions, which are biased against the components by spring members that are also retained by the cavities. The soldered edges of the sheets provide excellent EMI shielding, while the tab portions provide short, low resistance ground paths for the components, without introducing harmful air gaps, because no soldering is done at the ground planes of the sheets.