Printed Circuit-type Coil Patents (Class 336/200)
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Patent number: 12159744Abstract: An inductor includes a magnetic core composed of a magnetic material having variable permeability characteristics based on at least one of design parameters or operational parameters of the inductor that includes one or more air gaps. A coil is wound through the one or more air gaps and is configured to be excited by an electric current.Type: GrantFiled: May 4, 2021Date of Patent: December 3, 2024Assignee: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.Inventors: Masanori Ishigaki, Ercan Mehmet Dede, Danny J. Lohan
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Patent number: 12159749Abstract: The present disclosure provides a transformer module and a power module, wherein the transformer module comprises: a magnetic core, a first wiring layer, a first insulating layer and a second wiring layer, where the first wiring layer, the first insulating layer and the second wiring layer are sequentially disposed on the magnetic core from outside to inside; a first metal winding, formed in the first wiring layer, where at least part of the first metal winding is wound around the magnetic core in a foil structure; the first insulating layer, at least partially covered by the first metal winding; a second metal winding, formed in the second wiring layer and wound around the magnetic core, where the second metal winding is at least partially covered by the first insulating layer, and at least partially covered by the first metal winding.Type: GrantFiled: October 25, 2023Date of Patent: December 3, 2024Assignee: Delta Electronics (Shanghai) Co., Ltd.Inventors: Chaofeng Cai, Xiaoni Xin, Jianhong Zeng, Shouyu Hong, Rui Wu, Haoyi Ye, Yiqing Ye, Jinping Zhou, Zhiheng Fu, Min Zhou, Yu-Ching Kuo, Tong-Sheng Pan, Wen-Yu Lin
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Patent number: 12159736Abstract: An example device includes a mounting structure including a first material having a first coefficient of thermal expansion (CTE). The mounting structure includes a center portion and an outer portion. The device further includes a magnetic core for an electrical component that is coupled to the outer portion of the mounting structure. The magnetic core includes a second material having a second CTE. The magnetic core is split into a plurality of sections separated by spaces extending from the center portion to an outer edge of the outer portion. Each of the plurality of sections is separately coupled to the mounting structure, and each of the plurality of sections is connected to the electrical component.Type: GrantFiled: November 30, 2020Date of Patent: December 3, 2024Assignee: Waymo LLCInventors: Robert Lockwood, Kelvin Kwong
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Patent number: 12154710Abstract: Embodiments disclosed herein include power transformers for microelectronic devices. In an embodiment, a power transformer comprises a magnetic core that is a closed loop with an inner dimension and an outer dimension, and a primary winding around the magnetic core. In an embodiment, the primary winding has a first number of first turns connected in series around the magnetic core. In an embodiment, a secondary winding is around the magnetic core, and the secondary winding has a second number of second turns around the magnetic core. In an embodiment, individual ones of the second turns comprise a plurality of secondary segments connected in parallel.Type: GrantFiled: September 18, 2020Date of Patent: November 26, 2024Assignee: Intel CorporationInventors: Anuj Modi, Huong Do, William J. Lambert, Krishna Bharath, Harish Krishnamurthy
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Patent number: 12154708Abstract: An inductor device includes a first coil, a second coil and a toroidal coil. The first coil is partially overlapped with the second coil in a vertical direction. The toroidal coil is disposed outside the first coil and the second coil. The first coil is interlaced with the second coil at a first side and a second side of the inductor device.Type: GrantFiled: April 21, 2021Date of Patent: November 26, 2024Assignee: Realtek Semiconductor CorporationInventors: Hsiao-Tsung Yen, Ka-Un Chan
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Patent number: 12154712Abstract: A low profile high current composite transformer is disclosed. Some embodiments of the transformer include a first conductive winding having a first start lead, a first finish lead, a first plurality of winding turns, and a first hollow core; a second conductive winding having a second start lead, a second finish lead, a second plurality of turns, and a second hollow core; and a soft magnetic composite compressed surrounding the first and second windings. The soft magnetic composite with distributed gap provides for a near linear saturation curve.Type: GrantFiled: November 13, 2020Date of Patent: November 26, 2024Assignee: VISHAY DALE ELECTRONICS, LLCInventor: Darek Blow
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Patent number: 12154714Abstract: A multi-terminal chip inductor includes coil conductors in base material layers, an interlayer connection conductor connecting the coil conductors across layers, and external electrodes each connected to portions of a series of coil conductors defined by the coil conductors and the interlayer connection conductor. The external electrodes include a common external electrode. A first of the coil conductors to which the common external electrode and a first external electrode adjacent to the common external electrode in a circuit are connected, includes first coil conductors connected to each other in parallel.Type: GrantFiled: November 4, 2021Date of Patent: November 26, 2024Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Satoshi Shigematsu, Kenichi Ishizuka
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Patent number: 12147031Abstract: An optical reflective element includes: a reflective body that rotationally oscillates about a first rotational axis; a first connector body that is coupled to the reflective body, and includes a groove portion provided in a position in which the first rotational axis is located; a first vibration body that is disposed in a direction intersecting the first rotational axis, and is coupled to a proximal end portion of the first connector body; a second vibration body that is disposed on a side opposite the first vibration body; a first driving body that causes the first vibration body to rotate; a second driving body that is coupled to the second vibration body; and a second connector body that connects the first vibration body and the second vibration body in a manner that allows the first vibration body and the second vibration body to vibrate.Type: GrantFiled: February 22, 2021Date of Patent: November 19, 2024Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventor: Takami Ishida
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Patent number: 12148558Abstract: In a wound inductor component, a first flange and a second flange are connected to both ends of a winding core in the central axial line direction, and protrude from the winding core to both sides in a height direction. A cover member covers a portion from the upper end of the first flange to the upper end of the winding core from above. In a sectional view including the central axial line and along the height direction, a first average distance, which is an average distance in the height direction from the upper end of the first flange to the upper end of the cover member, is 25% or more and 45% or less (i.e., 25% to 45%) of a second average distance, which is an average distance in the height direction from the upper end of the winding core to the upper end of the cover member.Type: GrantFiled: September 14, 2021Date of Patent: November 19, 2024Assignee: Murata Manufacturing Co., Ltd.Inventor: Noboru Shiokawa
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Patent number: 12148693Abstract: A transformer includes a silicon substrate, a plurality of metal layers and a plurality of insulating layers laminated on the silicon substrate, a bottom winding of a metal contacting a first metal layer and a second metal layer of the plurality of metal layers, a first insulating layer on the bottom winding, a core on the first insulating layer, a second insulating layer on the core, a top winding of the metal that extends around the core and a portion of the second insulating layer, and a third insulating layer on the top winding. At least one of the top winding and the bottom winding is thicker than each of the plurality of metal layers.Type: GrantFiled: October 7, 2020Date of Patent: November 19, 2024Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Takayuki Tange, Yoshimitsu Ushimi
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Patent number: 12142932Abstract: A wireless power transmission resonator using a conducting wire with a vertical rectangular cross-section is disclosed. The wireless power transmission resonator may include a first element including a first element upper part arranged in an upper end of a resonator and a first element lower part arranged in a lower end of the resonator, wherein the first element upper part and the first element lower part each may include a spiral layer having a spiral structure that is wound to face a wide surface of a conducting wire including a vertical rectangular cross-section and a second element arranged in a center of the resonator and between the first element upper part and the first element lower part and including a spiral layer having a spiral structure that is wound to face the wide surface of the conducting wire including the vertical rectangular cross-section.Type: GrantFiled: October 28, 2022Date of Patent: November 12, 2024Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Je Hoon Yun, Sang-Won Kim, Seong-Min Kim, Jung Ick Moon, In Kui Cho, Gwangzeen Ko, Dong Won Jang
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Patent number: 12142979Abstract: A printed coil assembly including a flexible dielectric material, a patterned top conductive layer formed on a top surface of the flexible dielectric material, and a patterned bottom conductive layer formed on a bottom surface of the flexible dielectric material. The patterned top conductive layer and the patterned bottom conductive layer form a plurality of printed coils arranged in a plurality of printed coil rollers concentrically arranged in a cylindrical shape. Each of the plurality of printed coils includes a top layer printed coil disposed within the patterned top conductive layer and a bottom layer printed coil disposed within the patterned bottom conductive layer. Coil pitches of the coils within each roller are chosen such that corresponding ones of the plurality of printed coils in adjacent rollers are axially aligned relative to a center of the cylindrical shape.Type: GrantFiled: March 3, 2023Date of Patent: November 12, 2024Assignee: Systems, Machines, Automation Components CorporationInventors: Edward A. Neff, Toan Vu, Vinh Hoang
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Patent number: 12142418Abstract: A wireless charging coil is provided herein. The wireless charging coil comprising a first stamped coil having a first spiral trace, the first spiral trace defining a first space between windings, and a second stamped coil having a second spiral trace, the second spiral trace defining a second space between windings, wherein the first stamped coil and second stamped coil are planar to and interconnected with one another, such that the first stamped coil is positioned within the second space of the second stamped coil, and the second stamped coil is positioned within the first space of the first stamped coil.Type: GrantFiled: May 10, 2021Date of Patent: November 12, 2024Assignee: A.K. Stamping Company, Inc.Inventors: Arthur Kurz, Bernard Duetsch, Joshua Kurz
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Patent number: 12142582Abstract: An organic interposer includes interconnect-level dielectric material layers embedding redistribution interconnect structures, at least one dielectric capping layer overlying a topmost interconnect-level dielectric material layer, a bonding-level dielectric layer overlying the at least one dielectric capping layer, and a dual-layer inductor structure, which may include a lower conductive coil embedded within the topmost interconnect-level dielectric material layer, a conductive via structure vertically extending through the at least one dielectric capping layer, and an upper conductive coil embedded within the bonding-level dielectric layer and comprising copper.Type: GrantFiled: July 28, 2023Date of Patent: November 12, 2024Assignee: Taiwan Semiconductor Manufacturing Company LimitedInventors: Wei-Han Chiang, Chun-Hung Chen, Ching-Ho Cheng, Hsiao Ching-Wen, Hong-Seng Shue, Ming-Da Cheng, Wei Sen Chang
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Patent number: 12142949Abstract: A shielding film includes a first film layer. The first film layer includes a first conductive part and a first insulating part, and the first insulating part penetrates the first conductive part in a thickness direction of the first film layer. Under electromagnetic influence of a first electromagnetic field, a first eddy current is formed in the first film layer, and a loop of the first eddy current is located in the first conductive part, so that the first eddy current has relatively high current intensity. Under electromagnetic influence of a second electromagnetic field, a second eddy current is formed in the first film layer, and a loop of the second eddy current passes through the first insulating part, so that current intensity of the second eddy current can be reduced.Type: GrantFiled: September 30, 2021Date of Patent: November 12, 2024Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Yuechao Li, Chao Yang
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Patent number: 12136510Abstract: To provide a coil device capable of preventing a short circuit between turns of the coil part. A coil device 2 includes a core part 4 including a magnetic powder 41 and a resin 42, and a coil part 6 embedded in the core part 4 and having a wound wire 6a with an insulation coating layer 61.Type: GrantFiled: April 14, 2021Date of Patent: November 5, 2024Assignee: TDK CORPORATIONInventors: Satoshi Sugimoto, Kyohei Tonoyama, Miyuki Asai, Takamasa Iwasaki
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Patent number: 12136523Abstract: A multilayer capacitor and a board having the multilayer capacitor mounted thereon are provided. The multilayer capacitor includes a capacitor body including a dielectric layer and first and second internal electrodes, and first and second external electrodes disposed on both ends of the capacitor body and connected to exposed portions of the first and second internal electrodes, respectively. A/B satisfies 0.0016?A/B<1 in which A is a thickness of the dielectric layer and B is an average length of margins of the capacitor body in a length direction, and A is 1 ?m or less.Type: GrantFiled: October 26, 2022Date of Patent: November 5, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hwi Dae Kim, Ji Hong Jo, Woo Chul Shin, Chan Yoon, Sang Soo Park
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Patent number: 12136509Abstract: Embodiments of the present application provides a MEMS solenoid inductor, including: a silicon substrate, a soft magnetic core, and a solenoid; wherein the soft magnetic core is wrapped inside the silicon substrate, the silicon substrate is provided with a spiral channel, the soft magnetic core passes through a center of the spiral channel, and the solenoid is disposed in the spiral channel. By disposing the soft magnetic core and the solenoid of the inductor inside the silicon substrate completely, the thickness of the silicon substrate is fully utilized, and the obtained inductor has a larger winding cross-sectional area and improved magnetic flux, which increases the inductance value of the inductor; at the same time, the silicon substrate plays a protective role on the soft magnetic core and the solenoid, the strength of the inductor is improved, and the good impact resistance is provided.Type: GrantFiled: July 8, 2019Date of Patent: November 5, 2024Assignee: BEIHANG UNIVERSITYInventors: Tiantong Xu, Zhi Tao, Haiwang Li, Jiamian Sun, Hanxiao Wu, Kaiyun Zhu, Yanxin Zhai, Xiaoda Cao, Wenbin Wang, Weidong Fang
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Patent number: 12132015Abstract: Embodiments include inductors and methods to form the inductors. An inductor includes a substrate layer that surrounds a magnetic layer, where the magnetic layer is embedded between the substrate layer. The inductor also includes a dielectric layer that surrounds the substrate and magnetic layers, where the dielectric layer fully embeds the substrate and magnetic layers. The inductor further includes a first conductive layer over the dielectric layer, a second conductive layer below the dielectric layer, and a plurality of plated-through-hole (PTH) vias in the dielectric and substrate layers. The PTH vias vertically extend from the first conductive layer to the second conductive layer, and the magnetic layer in between the PTH vias. The magnetic layer may have a thickness that is substantially equal to a thickness of the substrate layer, where the thickness of the magnetic layer is less than a thickness defined between the first and second conductive layers.Type: GrantFiled: October 28, 2019Date of Patent: October 29, 2024Assignee: Intel CorporationInventors: William J. Lambert, Sri Chaitra Jyotsna Chavali
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Patent number: 12131854Abstract: A common-mode choke coil includes a multilayer body, a first coil, and a second coil. The multilayer body includes plural non-conductor layers. The first and second coils are incorporated in the multilayer body. The first coil has a path length L1, the second coil has a path length L2, and the sum of the path length L1 and the path length L2 is less than or equal to 3.30 mm. The first coil has a first coil conductor, and the second coil has a second coil conductor. The first coil conductor and the second coil conductor have a spacing D between each other of greater than or equal to 6 ?m and less than or equal to 26 ?m (i.e., from 6 ?m to 26 ?m) in the stacking direction of the non-conductor layers.Type: GrantFiled: August 4, 2021Date of Patent: October 29, 2024Assignee: Murata Manufacturing Co., Ltd.Inventors: Kouhei Matsuura, Atsuo Hirukawa, Hiroshi Ueki
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Patent number: 12132463Abstract: Provided are balun circuit structure and balun device, the balun circuit structure comprises unbalanced terminal, first and second balanced terminals, grounded power terminal, first, second, third and fourth inductors. The first terminal of the first inductor is connected to the first terminal of the second inductor, the second terminal of the first inductor is connected to the unbalanced terminal, the second terminal of the second inductor is open-circuited, the first terminal of the third inductor and the first terminal of the fourth inductor are connected to the grounded power terminal, the second terminal of the third inductor is connected to the first balanced terminal, the second terminal of the fourth inductor is connected to the second balanced terminal, the first, second, third and fourth inductors are located in different planes, respectively, the first inductor is coupled to the third inductor, and the second inductor is coupled to the fourth inductor.Type: GrantFiled: February 9, 2021Date of Patent: October 29, 2024Assignee: ANHUI ANUKI TECHNOLOGIES CO., LTD.Inventors: Wei Cheng, Chengjie Zuo, Jun He
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Patent number: 12131856Abstract: A coil component includes a core including a winding core portion and a first flange portion that is disposed on a first end portion of the winding core portion in a direction in which the winding core portion extends. A first curved portion is formed at a connection between a bottom surface of the winding core portion and the first flange portion. A ratio of a length of the first curved portion in a height direction to a distance in the height direction between the bottom surface and a first terminal electrode is no less than 20% and no more than 60% (i.e., from 20% to 60%).Type: GrantFiled: December 5, 2023Date of Patent: October 29, 2024Assignee: Murata Manufacturing Co., Ltd.Inventors: Takashi Sukegawa, Yasuhiro Itani, Takanori Suzuki, Yuuki Kitadai, Yoshifumi Maki, Reiichi Matsuba
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Patent number: 12125626Abstract: An inductor built-in substrate includes a core substrate having openings and first through holes formed therein, a magnetic resin filling the openings and having second through holes formed therein, first through-hole conductors formed in the first through holes of the core substrate and including metal films formed in the first through holes of the core substrate, respectively, and second through-hole conductors formed in the second through holes of the magnetic resin and including metal films formed in the second through holes of the magnetic resin such that the metal films are filling the second through holes of the magnetic resin, respectively.Type: GrantFiled: November 30, 2020Date of Patent: October 22, 2024Assignee: IBIDEN CO., LTD.Inventor: Satoru Kawai
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Patent number: 12119162Abstract: A coil component that can stabilize the position of a coil while relaxing the stress between coil wiring and a magnetic layer includes an element body and a coil in the element body. The element body has magnetic layers laminated in a first direction. The coil has pieces of coil wiring laminated in the first direction. The pieces extend along a plane orthogonal to the first direction. Each of the pieces of coil wiring has two faces on both sides in the first direction and two side faces on both sides in a direction orthogonal to the first direction, in a section orthogonal to an extending direction of each of the pieces. The two faces and one side face among the two side faces form a gap with the magnetic layer, and the other side face among the two side faces is in contact with the magnetic layer.Type: GrantFiled: February 24, 2021Date of Patent: October 15, 2024Assignee: Murata Manufacturing Co., Ltd.Inventor: Masayuki Oishi
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Patent number: 12119153Abstract: A common-mode choke coil includes a multilayer body, a first coil, a second coil, a first terminal electrode, a second terminal electrode, a third terminal electrode, and a fourth terminal electrode. The multilayer body includes plural non-conductor layers. The first and second coils are incorporated in the multilayer body. The first and second terminal electrodes are connected to the first coil. The third and fourth terminal electrodes are connected to the second coil. The first coil has a path length L1, the second coil has a path length L2, and the sum of the path length L1 and the path length L2 is less than or equal to 3.4 mm. The respective lower-face electrode portions of the terminal electrodes each have an area of less than or equal to 0.034 ?m2.Type: GrantFiled: August 4, 2021Date of Patent: October 15, 2024Assignee: Murata Manufacturing Co., Ltd.Inventors: Kouhei Matsuura, Atsuo Hirukawa, Hiroshi Ueki
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Patent number: 12119165Abstract: A coil component includes: a body; a coil unit disposed in the body; a support substrate unit in contact with the coil unit to support the coil unit, and including first and second support substrates spaced apart from and oppose each other; and first and second external electrodes disposed on a first surface of the body and spaced apart from each other, and respectively connected to the coil unit.Type: GrantFiled: February 19, 2021Date of Patent: October 15, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ye Ji Jung, Jae Hun Kim
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Patent number: 12119163Abstract: An inductor comprises a core and a coil. The coil has a first terminal, a second terminal, a first portion, a second portion, a third portion, a first coupling portion, a second coupling portion, a first extending portion and a second extending portion. Each of the first portion and the second portion is positioned apart from a first edge of the core. Each of the first portion and the second portion is parallel to the first edge. Each of the first portion and the second portion is positioned apart from the third portion in a first horizontal direction. The third portion is positioned apart from a second edge of the core. The third portion is parallel to the second edge. The first extending portion couples the first portion and the third portion with each other. The second extending portion couples the second portion and the third portion with each other.Type: GrantFiled: July 8, 2020Date of Patent: October 15, 2024Assignee: TOKIN CORPORATIONInventor: Toshiaki Oka
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Patent number: 12119164Abstract: A coil component includes a drum-shaped core including a core portion that extends in a length direction of the coil component and a first flange portion provided on a first end portion of the core portion, and first and second terminal electrodes provided on the first flange portion. The first and second terminal electrodes each include a base electrode formed on a surface of the first flange portion and a plating layer that covers the base electrode. The base electrode includes a bottom-surface base electrode portion on a bottom surface, an end-surface base electrode portion on an end surface, and a side-surface base electrode portion on a first side surface. The end-surface base electrode portion has a height greater than that of the first crotch portion. The side-surface base electrode portion has a height less than that of the first crotch portion.Type: GrantFiled: July 16, 2021Date of Patent: October 15, 2024Assignee: Murata Manufacturing Co., Ltd.Inventors: Masayoshi Nakamura, Yuki Kanbe, Akio Miyazaki, Kazuhiko Chiba
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Patent number: 12119160Abstract: A coil component includes an insulating base body and a coil conductor arranged in the base body and having a winding portion extending around a coil axis. The insulating base body includes a magnetic body portion made of a magnetic material and a magnetic gap portion made of a low-permeability material having a lower relative permeability than the magnetic material. The magnetic gap portion is shaped like a ring when seen in a direction along the coil axis and arranged within the winding portion. The magnetic body portion includes a first region positioned within the winding portion, a second region positioned opposite the first region with respect to the magnetic gap portion in the direction along the coil axis, and a third region arranged within a through hole defined by an inner peripheral surface of the magnetic gap portion, where the third region connects together the first and second regions.Type: GrantFiled: March 30, 2021Date of Patent: October 15, 2024Assignee: TAIYO YUDEN CO., LTD.Inventors: Natsuko Sato, Takayuki Arai, Atsuko Kasahara, Tomoo Kashiwa
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Patent number: 12112892Abstract: A multilayer electronic component includes a body including a dielectric layer and a first internal electrode and a second internal electrode and having first to sixth surfaces, a first external electrode including a first connection portion on the third surface, a first band portion on the first surface, and a third band portion on the second surface, a second external electrode including a second connection portion on the fourth surface, a second band portion on the first surface, and a fourth band portion on the second surface, an insulating layer disposed on the second surface and extending onto the first and second connection portions, a first plating layer disposed on the first band portion, and a second plating layer disposed on the second band portion. The insulating layer includes glass, and a region disposed on the second surface in the insulating layer has a convex shape in the first direction.Type: GrantFiled: September 13, 2022Date of Patent: October 8, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hyung Jong Choi, Yoo Jeong Lee, Chung Yeol Lee, Kwang Yeun Won, So Jung An, Kang Ha Lee, Woo Kyung Sung, Myung Jun Park, Jong Ho Lee
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Patent number: 12112879Abstract: A coil component includes a body, a coil portion disposed in the body, and first and second external electrodes disposed on the body to be spaced apart from each other, wherein A/C?2.4 and B/C?1.6 are satisfied, where a length, a width, and a thickness of the coil component are defined as ‘A’, ‘B’, and ‘C’, respectively, and a ratio of a thickness to a width of at least one turn of the coil portion is 1 or less, based on a cross-section of the coil component.Type: GrantFiled: December 9, 2020Date of Patent: October 8, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chan Yoon, Dong Hwan Lee, Dong Jin Lee, Sang Soo Park
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Patent number: 12112873Abstract: Disclosed herein is a coil component that includes first, second, third, and fourth terminal electrodes; a first planar spiral coil formed on a substrate, the first planar spiral coil having an outer peripheral end connected to the first terminal electrode; a second planar spiral coil stacked on the first planar spiral coil through a first insulating layer, the second planar spiral coil having an outer peripheral end connected to the second terminal electrode; and first and second lead-out patterns stacked on the second planar spiral coil through a second insulating layer. The first lead-out pattern connects the third terminal electrode and an inner peripheral end of the first planar spiral coil. The second lead-out pattern connects the fourth terminal electrode and an inner peripheral end of the second planar spiral coil. The second insulating layer is thicker than the first insulating layer.Type: GrantFiled: September 27, 2021Date of Patent: October 8, 2024Assignee: TDK CorporationInventors: Hidenori Tsutsui, Kouji Kawamura, Hiromu Sakamoto, Kengo Osada, Takuro Tsuruta, Takeshi Okumura
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Patent number: 12106895Abstract: The present disclosure provides a transformer module and a power module, wherein the transformer module comprises: a magnetic core, where a first insulating layer and a second wiring layer are sequentially disposed on the magnetic core from inside to outside; a first metal winding, wound around the magnetic core and comprising a first winding segment formed in the first wiring layer and a second winding segment formed in the second wiring layer; and a second metal winding, wound around the magnetic core and comprising a third winding segment formed in the first wiring layer and a fourth winding segment formed in the second wiring; where at least part of the first metal winding and the second metal winding are wound around the magnetic core in a foil structure.Type: GrantFiled: October 24, 2023Date of Patent: October 1, 2024Assignee: Delta Electronics (Shanghai) Co., Ltd.Inventors: Chaofeng Cai, Xiaoni Xin, Jianhong Zeng, Shouyu Hong, Rui Wu, Haoyi Ye, Yiqing Ye, Jinping Zhou, Zhiheng Fu, Min Zhou, Yu-Ching Kuo, Tong-Sheng Pan, Wen-Yu Lin
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Patent number: 12107544Abstract: An apparatus comprising two inductors; wherein the two inductors are layered on top of each other in different layers of metal of a circuit; wherein each inductor of the inductor has a set of turns; wherein the current path of the two inductors is in the same direction.Type: GrantFiled: November 15, 2019Date of Patent: October 1, 2024Assignee: ACACIA COMMUNICATIONS, INC.Inventors: Ian Dedic, Gavin Allen, David Enright, Guojun Ren
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Patent number: 12107043Abstract: A multilayer-type on-chip inductor with a conductive structure includes an insulating redistribution layer disposed on an inter-metal dielectric layer, a first spiral trace layer disposed in the insulating redistribution layer, and a second spiral trace layer disposed in the inter-metal dielectric layer correspondingly formed below the first spiral trace layer, wherein the inter-metal dielectric layer has a separating region to divide the second spiral trace layer into a plurality of line segments, and wherein each of a plurality of first slit openings and each of a plurality of second slit openings pass through a corresponding line segment, and extend in an extending direction of a length of the corresponding line segment.Type: GrantFiled: February 7, 2023Date of Patent: October 1, 2024Assignee: VIA LABS, INC.Inventor: Sheng-Yuan Lee
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Patent number: 12094633Abstract: An electronic component includes a wire winding wound around a central axis. The wire winding having first and second ends, and first and second terminals are connected to or formed by the first and second ends. The terminals provide electrical contacts for connecting the component into a circuit. The component has a wet press molded body made of a mixture of magnetic and non-magnetic material that is heated and pressed about the wire winding. The wet press molded body leaves at least a portion of the terminals exposed for mounting the component to the circuit.Type: GrantFiled: January 8, 2024Date of Patent: September 17, 2024Assignee: Coilcraft, IncorporatedInventors: Andrzej Klesyk, Scott D. Hess, Lawrence B. Lestarge
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Patent number: 12094644Abstract: An electronic structure comprising: a circuit board, wherein electronic devices and a transformer are disposed on the circuit board, wherein the transformer comprises a first coil, a second coil, and a magnetic body comprising a pillar with at least one portion of the pillar being disposed in a through-opening of the circuit board, wherein the first coil is wound around an upper portion of the pillar and the second coil is wound around a lower portion of the pillar for forming the transformer.Type: GrantFiled: April 8, 2023Date of Patent: September 17, 2024Assignee: CYNTEC CO., LTD.Inventors: Da-Jung Chen, Chi-Feng Huang
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Patent number: 12095360Abstract: An EMI filter for an inverter may include a choke including a magnetic inner core, a magnetic outer core, and at least one conductor pair. The at least one conductor pair may include an electrically conductive positive conductor and an electrically conductive negative conductor. The inner core, the outer core, the positive conductor, and the negative conductor may extend along a longitudinal central axis of the choke. The inner core may be arranged in the outer core. The positive conductor and the negative conductor may be arranged between the inner core and the outer core. The positive conductor and the negative conductor may be arranged spaced apart from one another in a circumferential direction extending around the longitudinal central axis. A gap may be formed between the inner core, the outer core, the positive conductor, and the negative conductor, which are adjacent in the circumferential direction.Type: GrantFiled: June 8, 2022Date of Patent: September 17, 2024Assignee: Mahle International GmbHInventors: Ziga Ahec, Gregor Babic, Peter Bozic, Gregor Ergaver
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Patent number: 12094659Abstract: A ceramic electronic component has an element body having a dielectric and internal electrodes, and external electrodes formed on the element body. Each of the external electrodes has an electrical conductive layer connected to the internal electrodes. The electrical conductive layer has an outer side and an inner side. The outer side is farther from the element body than the inner side. The outer side includes more voids than the inner side.Type: GrantFiled: December 13, 2021Date of Patent: September 17, 2024Assignee: TAIYO YUDEN CO., LTD.Inventors: Shin Nishiura, Jun Shibano
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Patent number: 12094629Abstract: A magnetic micro-device and process to manufacture the same is disclosed. The magnetic micro-device has a near-zero conductivity magnetic nanocomposite film layer with a plurality of apertures through which a corresponding plurality of electrical conductors (vias) pass. Due to the near-zero conductivity of the magnetic nanocomposite film layer, the vias are self-insulating. The presence of the magnetic nanocomposite film layer results in greater inductance than that possible with an air core (or core-less) magnetic micro-device. Potential magnetic micro-devices include toroid micro-inductors, solenoid micro-inductors, toroid micro-transformers, and solenoid micro-transformers. Additional potential magnetic micro-devices include generators, motors, electromagnetic switches, and voice coils (for speakers or microphones). The process used to manufacture the magnetic micro-device can be scaled to cost-effectively produce large numbers of the magnetic micro-device.Type: GrantFiled: July 15, 2021Date of Patent: September 17, 2024Assignee: National Technology & Engineering Solutions of Sandia, LLCInventors: Eric Langlois, Michael J. K. Abere, Dale L. Huber, Jamin Ryan Pillars
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Patent number: 12094631Abstract: Provided is a chip inductor and manufacturing method thereof. The chip inductor includes: a pin layer, a plurality of insulating layers and a plurality of metal layers, where the insulating layers and the metal layers are arranged successively and alternately on the pin layer. Multiple patterned metal structures arranged in the plurality of metal layers are respectively electrically connected to form a multilayer plane spiral coil structure. The multilayer plane spiral coil structure has two ends electrically connected with respective pin structures in the pin layer.Type: GrantFiled: February 22, 2019Date of Patent: September 17, 2024Assignee: ANHUI ANUKI TECHNOLOGIES CO., LTD.Inventors: Wei Cheng, Chengjie Zuo, Jun He
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Patent number: 12094642Abstract: A multilayer inductor component includes an element body, an internal conductor, and an external electrode. The internal conductor is disposed in the element body. The external electrode is disposed on a surface of the element body and electrically connected to the internal conductor. The external electrode includes a sintered metal layer and a plating layer. The sintered metal layer is disposed on the surface of the element body. The plating layer covers the sintered metal layer. The sintered metal layer includes a thick portion and thin portions. The thick portion covers the surface of the element body. A plurality of glass particles is dispersed in the thick portion. The thin portions cover glass particles exposed on a surface of the thick portion among the plurality of glass particles and being in contact with the plating layer.Type: GrantFiled: May 25, 2021Date of Patent: September 17, 2024Assignee: TDK CORPORATIONInventors: Masashi Shimoyasu, Daiki Kato, Yoji Tozawa, Takashi Endo, Seiichi Nakagawa, Mitsuru Ito, Kenta Sasaki, Akihiko Oide, Makoto Yoshino, Kazuhiro Ebina
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Patent number: 12091746Abstract: Traveling-wave tube amplifiers for high-frequency signals, including terahertz signals, and methods for making a slow-wave structure for the traveling-wave tube amplifiers are provided. The slow-wave structures include helical conductors that are self-assembled via the release and relaxation of strained films from a sacrificial growth substrate.Type: GrantFiled: October 21, 2021Date of Patent: September 17, 2024Assignees: WISCONSIN ALUMNI RESEARCH FOUNDATION, The Regents of the University of New MexicoInventors: Max G. Lagally, Matthew McLean Dwyer, Francesca Cavallo, Daniel Warren van der Weide, Abhishek Bhat
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Patent number: 12087484Abstract: A multilayer coil component includes an element body including a plurality of metal magnetic particles, and a plurality of coil conductors. The plurality of coil conductors is disposed in the element body. The plurality of coil conductors is separated from each other in a predetermined direction and electrically connected to each other. The plurality of coil conductors includes one pair of side surfaces opposing each other in the predetermined direction. Surface roughness of the one pair of side surfaces is less than 40% of an average particle size of the plurality of metal magnetic particles.Type: GrantFiled: June 6, 2023Date of Patent: September 10, 2024Assignee: TDK CORPORATIONInventors: Shinichi Sato, Takahiro Sato, Yusuke Nagai, Mitsuharu Koike, Kazuhiro Miura, Seiichi Nakagawa, Shinichi Kondo, Takashi Suzuki
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Patent number: 12087491Abstract: An inductance apparatus includes a first winding comprising a first wire section and a second wire section. The first wire section and the second wire section are disposed in a first horizontal plane associated with a center axis, and the first winding is associated with an equivalent current flow path within the first horizontal plane; a second winding extends via the center axis in the first horizontal plane to the first wire section and the second wire section, wherein the equivalent current flow path of the first winding is aligned with a current flow path associated with the second winding.Type: GrantFiled: May 22, 2023Date of Patent: September 10, 2024Assignee: Intel CorporationInventors: Chuanzhao Yu, Qiang Li, David Newman
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Patent number: 12089333Abstract: An electricity meter (17) is described which includes a conductor (19) for transferring energy from a supply (20) to a load (21). The electricity meter (17) also includes a multi-layer printed circuit board (18) mechanically attached to the conductor (19). The multi-layer printed circuit board (18) includes two or more insulating layers (26, 27, 33, 34). The two or more insulating layers (26, 27, 33, 34) include a first insulating layer (26, 27) having an attachment surface (28) facing the conductor (19). The multi-layer printed circuit board (18) also includes a first conductive layer (29) including a first planar sensor coil (30). The first insulating layer (26, 27) is between the first conductive layer (29) and the conductor (19). The multi-layer printed circuit board (18) also includes a second conductive layer (31) including a second planar sensor coil (32).Type: GrantFiled: November 20, 2019Date of Patent: September 10, 2024Assignee: SENTEC LTDInventors: Andrew Nicholas Dames, Dawei Zhi, Joseph Adam
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Patent number: 12087496Abstract: A method for manufacturing a coil component comprises: forming a coil conductor including a winding portion, the winding portion including a plurality of first conductor portions and one or more second conductor portions smaller in number than the first conductor portions, the first and second conductor portions alternate with and connected to each other; forming a molded body by molding composite magnetic material including metal magnetic particles and a binder with the coil conductor being disposed inside the composite magnetic material; and heating the molded body to produce a magnetic base body. The magnetic base body is formed such that a distance between the first conductor portions and a first surface of the magnetic body is greater than a distance between the second conductor portions and a second surface of the magnetic base body opposite to the first surface, by molding, cutting or polishing.Type: GrantFiled: June 26, 2023Date of Patent: September 10, 2024Assignee: TAIYO YUDEN CO., LTD.Inventors: Hidenori Aoki, Tomoo Kashiwa
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Patent number: 12088208Abstract: A semiconductor package includes a VLSI semiconductor die and one or more output circuits connected to supply power to the die mounted to a package substrate. The output circuit(s), which include a transformer and rectification circuitry, provide current multiplication at an essentially fixed conversion ratio, K, in the semiconductor package, receiving AC power at a relatively high voltage and delivering DC power at a relatively low voltage to the die. The output circuits may be connected in series or parallel as needed. A driver circuit may be provided outside the semiconductor package for receiving power from a source and driving the transformer in the output circuit(s), preferably with sinusoidal currents. The driver circuit may drive a plurality of output circuits. The semiconductor package may require far fewer interface connections for supplying power to the die.Type: GrantFiled: June 7, 2023Date of Patent: September 10, 2024Assignee: Vicor CorporationInventor: Patrizio Vinciarelli
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Patent number: 12087502Abstract: An inductor component comprising a spiral wiring wound on a plane; a first magnetic layer and a second magnetic layer located at positions sandwiching the spiral wiring from both sides in a normal direction relative to the plane on which the spiral wiring is wound; a vertical wiring extending from the spiral wiring in the normal direction to pass through the first magnetic layer; and an external terminal disposed on a surface of the first magnetic layer to connect an end surface of the vertical wiring. The first magnetic layer has magnetic permeability lower than that of the second magnetic layer.Type: GrantFiled: April 28, 2023Date of Patent: September 10, 2024Assignee: Murata Manufacturing Co., Ltd.Inventors: Yoshimasa Yoshioka, Keisuke Kunimori, Akinori Hamada
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Patent number: 12087497Abstract: In a coil component, a main body portion is made of a metal magnetic powder-containing resin, and thus a resin component appears on end surfaces of the main body portion. In addition, since external terminal electrodes are made of a conductive resin, a resin component also appears on the surfaces of the external terminal electrodes. Accordingly, insulating coating layers are integrally covered with high adhesion with the end surfaces of the main body portion and the external terminal electrodes by the insulating coating layers coming into contact with the end surfaces of the main body portion so as to straddle the external terminal electrodes.Type: GrantFiled: November 10, 2020Date of Patent: September 10, 2024Assignee: TDK CORPORATIONInventors: Hitoshi Ohkubo, Kenei Onuma, Masazumi Arata, Masataro Saito, Kohei Takahashi