Printed Circuit-type Coil Patents (Class 336/200)
  • Patent number: 11031918
    Abstract: An on-chip transformer circuit is disclosed. The on-chip transformer circuit comprises a primary winding circuit comprising at least one turn of a primary conductive winding arranged as a first N-sided polygon in a first dielectric layer of a substrate; and a secondary winding circuit comprising at least one turn of a secondary conductive winding arranged as a second N-sided polygon in a second, different, dielectric layer of the substrate. In some embodiments, the primary winding circuit and the secondary winding circuit are arranged to overlap one another at predetermined locations along the primary conductive winding and the secondary conductive winding, wherein the predetermined locations comprise a number of locations less than all locations along the primary conductive winding and the secondary conductive winding.
    Type: Grant
    Filed: November 1, 2018
    Date of Patent: June 8, 2021
    Assignee: Intel Corporation
    Inventors: Kaushik Dasgupta, Chuanzhao Yu, Chintan Thakkar, Saeid Daneshgar, Hyun Yoon, Xi Li, Anandaroop Chakrabarti, Stefan Shopov
  • Patent number: 11024589
    Abstract: Distributions of on-chip inductors for monolithic voltage regulation are described. On-chip voltage regulation may be provided by integrated voltage regulators (IVRs), such as a buck converter with integrated inductors. On-chip inductors may be placed to ensure optimal voltage regulation for high power density applications. With this technology, integrated circuits may have many independent voltage domains for fine-grained dynamic voltage and frequency scaling that allows for higher overall power efficiency for the system.
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: June 1, 2021
    Assignee: Oracle International Corporation
    Inventors: Michael Henry Soltau Dayringer, Anatoly Yakovlev, Ji Eun Jang, Hesam Fathi Moghadam, David Hopkins
  • Patent number: 11024455
    Abstract: One object of the present invention is to provide a compact coil component with superior characteristics. An electronic component according one embodiment includes an insulator and a coil portion. The insulator is formed of a non-magnetic material. The insulator includes a width direction in a first axial direction, a length direction in a second axial direction, and a height direction in a third axial direction. The coil portion includes a circumference section. The circumference section is wound around the first axial direction. The coil portion is arranged inside the insulator. The first ratio of a height to a length of the insulator is 1.5 times or less of a second ratio of a height between first inner peripheral portions of the circumference section along the third axial direction with respect to a length between second inner peripheral portions of the circumference section along the second axial direction.
    Type: Grant
    Filed: March 22, 2017
    Date of Patent: June 1, 2021
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Takayuki Sekiguchi, Tsuyoshi Ogino
  • Patent number: 11024452
    Abstract: The disclosure provides at least an apparatus, system and method for providing a flexible planar inductive coil, such as may be embedded in a product. The apparatus, system and method may include at least one conformable substrate, and a matched function ink set, printed onto at least one substantially planar face of the at least one substrate. This printing may form at least one layer of additive conductive traces capable of receiving current flow from at least one source and layered into successive ones of the conductive traces about a center axis within a plane of the at least one conformable substrate.
    Type: Grant
    Filed: May 17, 2017
    Date of Patent: June 1, 2021
    Assignee: JABIL INC.
    Inventors: Sai Guruva Avuthu, Mark Edward Sussman, David Donald Logan, Mary Alice Gill, Nabel M. Ghalib, Jorg Richstein, Edward Joseph Collins
  • Patent number: 11017952
    Abstract: A multi-layer ceramic electronic component includes: a ceramic body including first and second main surfaces facing in a first axis direction, first and second end surfaces facing in a second axis direction, and first and second internal electrodes; a first external electrode including a first cover portion covering the first end surface, and a first extended portion extending from the first cover portion to the second main surface; and a second external electrode including a second cover portion covering the second end surface, and a second extended portion extending from the second cover portion to the second main surface, the multi-layer ceramic electronic component satisfying that, when T1 represents a dimension of the ceramic body in the first axis direction and T2 represents a dimension of each extended portion in the first axis direction, T1+T2 is 50 ?m or less, and T2/(T1+T2) is 0.32 or less.
    Type: Grant
    Filed: July 3, 2019
    Date of Patent: May 25, 2021
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Yasutomo Suga, Masataka Watabe, Takeshi Nakajima, Yuji Tomizawa, Toshiya Kuji
  • Patent number: 11017931
    Abstract: A coil component includes a body, a coil part embedded in the body, and an insulating layer covering the body. First and second plating electrodes are disposed between the body and the insulating layer, are connected to the coil part, and are disposed to be spaced apart from each other on one surface of the body. First and second through electrodes penetrate through the insulating layer to thereby be connected to the first and second plating electrodes, respectively.
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: May 25, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Byung Soo Kang, Yong Hui Li, Byeong Cheol Moon, Yoon Mi Cha, Eun Jin Kim
  • Patent number: 11017934
    Abstract: The present invention discloses an electronic module. The electronic module comprises: a substrate, having a top surface and a bottom surface; a plurality of coils on the top surface of the substrate, wherein each coil comprises a corresponding first end and a corresponding second end; and a molding body, disposed on the substrate to encapsulate said coils, wherein said corresponding first end and said corresponding second end of each coil are electrically coupled to a corresponding first electrode and a corresponding second electrode of the electronic module.
    Type: Grant
    Filed: December 8, 2017
    Date of Patent: May 25, 2021
    Assignee: CYNTEC CO., LTD.
    Inventors: Bau-Ru Lu, Chun Hsien Lu, Da-Jung Chen
  • Patent number: 11011301
    Abstract: One object of the present invention is to provide a magnetic coupling coil component having a high coupling coefficient between coils of different lines and facilitating insulation between the coils. A coil component according to one embodiment includes: an insulator body including first insulating layers and second insulating layers stacked together in a lamination direction; first conductive patterns formed on the first insulating layers; and second conductive patterns formed on the second insulating layers. The insulator body includes a first end region, a second end region, and an intermediate region positioned between the first end region and the second end region. The first end region includes the first insulating layers only, the second end region includes the second insulating layers only, and the intermediate region includes the first insulating layers and the second insulating layers arranged alternately in the lamination direction.
    Type: Grant
    Filed: March 27, 2018
    Date of Patent: May 18, 2021
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Natsuko Sato, Takashi Nakajima
  • Patent number: 11004599
    Abstract: A wireless charging coil is provided herein. The wireless charging coil comprising a first stamped coil having a first spiral trace, the first spiral trace defining a first space between windings, and a second stamped coil having a second spiral trace, the second spiral trace defining a second space between windings, wherein the first stamped coil and second stamped coil are planar to and interconnected with one another, such that the first stamped coil is positioned within the second space of the second stamped coil, and the second stamped coil is positioned within the first space of the first stamped coil.
    Type: Grant
    Filed: January 2, 2018
    Date of Patent: May 11, 2021
    Assignee: A.K. STAMPING COMPANY, INC.
    Inventors: Arthur Kurz, Bernard Duetsch, Joshua Kurz
  • Patent number: 10998119
    Abstract: A coil component includes a body part in which a plurality of body sheets are stacked, an internal coil disposed in the body part and including a plurality of internal electrode patterns each disposed on a respective one of the plurality of body sheets, and an external electrode part electrically connected to both ends of the internal coil. A first internal area of a first internal electrode pattern disposed on one of the plurality of body sheets is smaller than a second internal area of a second internal electrode pattern disposed on another of the plurality of body sheets.
    Type: Grant
    Filed: June 5, 2018
    Date of Patent: May 4, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Bong Sup Lim
  • Patent number: 10991654
    Abstract: A pad forms a connection terminal suitable for coupling circuit elements integrated in a chip to circuits outside the chip itself. At least one inductor is provided for use in the reception/transmission of electromagnetic waves or for supplying the chip with power or both. The connection pad and inductor are combined in a structure which reduces overall occupied area. A magnetic containment structure surrounds the structure to contain a magnetic field of the inductor.
    Type: Grant
    Filed: February 9, 2018
    Date of Patent: April 27, 2021
    Assignee: STMicroelectronics S.r.l.
    Inventor: Alberto Pagani
  • Patent number: 10992180
    Abstract: A device for inductively transferring electrical energy and/or data from a primary-sided carrier to at least one positionable secondary-sided recipient includes at least one primary-sided coil arrangement, which inductively interacts with at least one secondary-sided coil arrangement. Meander-shaped windings of a predeterminable winding number of the primary-sided and/or secondary-sided coil arrangement are arranged on at least one flexible carrier by embroidering a high frequency strand, and the meander-shaped windings have straight courses in the region of crossovers of the embroidered high frequency strands.
    Type: Grant
    Filed: March 13, 2020
    Date of Patent: April 27, 2021
    Assignee: Balluff GmbH
    Inventors: Joerg Heinrich, David Maier, Nejila Parspour
  • Patent number: 10989515
    Abstract: An inductive position-measuring device includes a scanning element and a graduation element, rotatable about an axis relative to the scanning element. The scanning element has exciter lead(s), a first receiver track, including receiver line(s), extending according to a first periodic pattern having a first period along a first direction, and a second receiver track, including receiver line(s). The graduation element includes a graduation track, extending in the circumferential direction and including a graduation period. An electromagnetic field generated by the exciter lead(s) with the aid of the graduation track is able to be modulated, so that an angular position is detectable with the aid of the receiver line of the first receiver track, and a position of the graduation element in the first direction relative to the scanning element is detectable with the aid of the receiver line of the second receiver track.
    Type: Grant
    Filed: November 26, 2018
    Date of Patent: April 27, 2021
    Assignee: DR. JOHANNES HEIDENHAIN GmbH
    Inventors: Marc Oliver Tiemann, Alexander Frank, Martin Heumann, Daniel Auer, Oliver Sell
  • Patent number: 10978235
    Abstract: An inductor includes a body including a coil and an encapsulant and an external electrode on an outer surface of the body. The encapsulant includes a first core surrounding the coil and a second core surrounding the first core. The first core includes a magnetic powder having high current characteristics, and the second core includes a magnetic powder having high capacity characteristics.
    Type: Grant
    Filed: August 10, 2018
    Date of Patent: April 13, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jong Suk Jeong, Han Wool Ryu, Seong Jae Lee, Sang Kyun Kwon, Chang Hak Choi
  • Patent number: 10969067
    Abstract: A light emitting device includes a flexible substrate, a plurality of LEDs arranged on the flexible substrate to emit light in a main direction perpendicular to both a longitudinal direction and a transversal direction of the flexible substrate a plurality of folds provided such that the flexible substrate is folded resulting in the main direction in which the light from at least one LED is rotated around the longitudinal axis or the transversal axis of the flexible substrate over a desired angle ?.
    Type: Grant
    Filed: December 21, 2017
    Date of Patent: April 6, 2021
    Assignee: SIGNIFY HOLDING B.V.
    Inventors: Ties Van Bommel, Rifat Ata Mustafa Hikmet
  • Patent number: 10972001
    Abstract: Some embodiments include apparatuses having a switching circuit included in a buck converter; an output node; an inductor including a first portion having a first terminal coupled to the switching circuit, a second portion having a second terminal coupled to the output node, and a third terminal between the first and second portions; and a capacitor coupled to the second terminal, the second terminal to couple to a first additional capacitor, and the third terminal to couple to a second additional capacitor.
    Type: Grant
    Filed: August 13, 2018
    Date of Patent: April 6, 2021
    Assignee: Intel Corporation
    Inventors: Sameer Shekhar, Amit K. Jain, Ravi Sankar Vunnam
  • Patent number: 10957479
    Abstract: A coil component includes a first outer magnetic body, a first outer insulator, a first inner magnetic body, an inner insulator, a second inner magnetic body, a second outer insulator, and a second outer magnetic body stacked sequentially, and a coil in the inner insulator and an internal magnetic body inside the coil. Volumes A, B, C, and D of the first and second outer insulators, the inner insulator, the coil, and the internal magnetic body, respectively, and volume E of the first outer magnetic body, the first inner magnetic body, the second inner magnetic body, and the second outer magnetic body satisfy 0.05?A?0.07, 0.2?B?0.4, 0.01?C?0.08, 0.03?D?0.05, and 0.4?E?0.71, where 0.05B?C?0.2B and A+B+C+D+E=1.
    Type: Grant
    Filed: September 7, 2018
    Date of Patent: March 23, 2021
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Kazunori Annen
  • Patent number: 10957478
    Abstract: An electronic component includes insulator layers having first and second sides respectively extending in first and second directions from a first point, and outer conductor layers extends in the first and second direction from the first point. Each of the outer conductor layers has second and third points. One of the outer conductor layers has a fixing portion inside a region having a third side connecting the second and third points, and fourth and fifth sides respectively extending from the second point in the reverse first direction and from the third point in the reverse second direction.
    Type: Grant
    Filed: October 2, 2019
    Date of Patent: March 23, 2021
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Tomohiro Kido
  • Patent number: 10957477
    Abstract: An inductor includes a body including a support member having a first through-hole, a second through-hole, a first via-hole and a second via-hole, the first and second via-holes being spaced apart from the first and second through-holes, a first coil unit and a second coil unit disposed on one surface of the support member, a third coil unit and a fourth coil unit facing the one surface of the support member, and an encapsulant encapsulating the support member and the first to fourth coil units and including a magnetic material, and a first external electrode to a fourth external electrode respectively connected to the first to fourth coil units on an external surface of the body. The encapsulant includes a first encapsulant and a second encapsulant having magnetic permeability different from each other.
    Type: Grant
    Filed: August 9, 2018
    Date of Patent: March 23, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chan Yoon, Dong Hwan Lee, Young Ghyu Ahn, Won Chul Sim
  • Patent number: 10957475
    Abstract: A hybrid coil component in which a magnetic core generally included in a wire-wound type inductor and a core included in a multilayer type inductor are combined with each other. A winding coil may be wound around a magnetic core manufactured in advance and an encapsulant having a stacked structure of a plurality of magnetic sheets may encapsulate the winding coil wound around the magnetic core. In this case, a magnetic flux generated in the winding coil is arranged to be parallel to long axes of magnetic particles contained in the magnetic core and the encapsulant.
    Type: Grant
    Filed: November 7, 2017
    Date of Patent: March 23, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Soon Kwang Kwon, Young Seuck Yoo, Jung Wook Seo
  • Patent number: 10951067
    Abstract: In the power transmission unit, a first coil pattern includes first inner side patterns, and first outer side patterns provided on the outer side of the first inner side patterns. A second coil pattern includes second inner side patterns, and second outer side patterns provided on the outer side of the second inner side patterns. The first and second coil patterns are configured such that the first inner side patterns and the second outer side pattern are connected, and the first outer side patterns and the second inner side patterns are connected. Then, the first and second coil patterns transfer power to the power transmission coil pattern of a power receiving unit in a contactless manner.
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: March 16, 2021
    Assignee: YAZAKI CORPORATION
    Inventor: Antony Wambugu Ngahu
  • Patent number: 10950380
    Abstract: A coil electronic component includes a magnetic body, wherein the magnetic body includes a substrate, and a coil part including patterned insulating films disposed on the substrate, a first plating layer formed between the patterned insulating films by plating, and a second plating layer disposed on the first plating layer.
    Type: Grant
    Filed: August 14, 2019
    Date of Patent: March 16, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Woon Chul Choi, Ji Hye Oh, Jung Hyuk Jung, Han Wool Ryu
  • Patent number: 10944397
    Abstract: The present embodiments relate generally to data communications, and more particularly to systems including high-speed serializer-deserializer circuits having TCOILs. One or more embodiments are directed to a four-terminal TCOIL structure that consumes the same amount of area on a chip as a traditional three-terminal structure, while providing more bandwidth and less reflection and group delay variation.
    Type: Grant
    Filed: January 31, 2020
    Date of Patent: March 9, 2021
    Assignee: Cadence Design Systems, Inc.
    Inventors: Xiaobin Yuan, Dimitri Loizos, Hiu Ming Lam, Mouna Safi-Harab
  • Patent number: 10943730
    Abstract: A single-ended inductor comprises a first partial coil wound in a first direction; and a second partial coil wound in a second direction and adjoined the first partial coil; wherein, the second direction is opposite to the first direction to reduce the coupling of single-ended inductors and peripheral lines and reduce signal interference.
    Type: Grant
    Filed: March 17, 2017
    Date of Patent: March 9, 2021
    Assignee: Realtek Semiconductor Corp.
    Inventors: Cheng Wei Luo, Hsiao-Tsung Yen, Ta-Hsun Yeh, Yuh-Sheng Jean
  • Patent number: 10937584
    Abstract: A common mode noise filter includes a non-magnetic body and first to third coil conductors provided inside the non-magnetic body. The second coil conductor is provided in a downward direction from the first coil conductor. The third coil conductor is provided in the downward direction from the second coil conductor. The first and third coil conductors deviate in a direction perpendicular to the downward direction with respect to the second coil conductor. At least one of the first and third coil conductors overlaps the second coil conductor viewing from the direction perpendicular to the downward direction. This common mode noise filter allows these coil conductors to be magnetically coupled to each other with a preferable balance, thereby preventing degradation of differential signals.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: March 2, 2021
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takuji Kawashima, Yoshiharu Oomori, Yoichi Nagaso, Atsushi Shinkai
  • Patent number: 10937588
    Abstract: A coil includes a resin substrate, a first coil structure formed on a first surface of the resin substrate, a second coil structure formed on a second surface of the resin substrate on the opposite side with respect to the first surface such that the second coil structure is formed at a position corresponding to the first coil structure, a third coil structure formed on the second surface such that the third coil structure is positioned adjacent to the second coil structure, and a fourth coil structure formed on the first surface such that the fourth coil structure is formed at a position corresponding to the third coil structure. The resin substrate is folded such that the second coil structure and the third coil structure oppose each other.
    Type: Grant
    Filed: June 27, 2018
    Date of Patent: March 2, 2021
    Assignee: IBIDEN CO., LTD.
    Inventors: Haruhiko Morita, Shinobu Kato, Hitoshi Miwa, Hisashi Kato, Toshihiko Yokomaku
  • Patent number: 10937581
    Abstract: A hybrid inductor includes an inductor body having a core part in which a coil part is disposed, and first and second cover parts having the core part interposed therebetween. The core part includes magnetic metal layers, and the first and second cover parts include ferrite layers.
    Type: Grant
    Filed: February 4, 2019
    Date of Patent: March 2, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ho Yoon Kim, Yu Jin Choi, Soo Hwan Son, Min Kyoung Cheon
  • Patent number: 10937583
    Abstract: A laminated electronic component having a coil formed in the laminated body of pluralities of laminated magnetic material layers and conductor patterns by electrically connecting the conductor patterns adjacent to each other via the magnetic material layers. The magnetic material layers contain a metal magnetic material. The coil has a first end portion close to a bottom surface of the laminated body and a second end portion distant from the bottom surface of the laminated body. The first end portion is electrically connected to a first external terminal disposed on the bottom surface of the laminated body. The second end portion is electrically connected to a second external terminal disposed on the bottom surface of the laminated body via an electrode disposed on a side surface of the laminated body. The electrode is covered with an insulator film.
    Type: Grant
    Filed: September 21, 2017
    Date of Patent: March 2, 2021
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yutaka Noguchi, Takeshi Kobayashi, Makoto Yamamoto
  • Patent number: 10937589
    Abstract: In a coil component, in an upper coil portion, a winding end portion constituting an end portion is connected to a lead-out conductor. Accordingly, the lead-out conductor can absorb heat from the winding end portion and can dissipate heat to the outside via a terminal electrode. Moreover, the lead-out conductor is formed to cover a winding adjacent portion. Accordingly, heat can also be absorbed from the winding adjacent portion and can be dissipated to the outside via the terminal electrode. That is, in the coil component described above, since the lead-out conductor absorbs heat not only from the winding end portion but also from the winding adjacent portion, improvement of heat dissipation properties is realized in the coil component.
    Type: Grant
    Filed: March 22, 2018
    Date of Patent: March 2, 2021
    Assignee: TDK CORPORATION
    Inventor: Masanori Suzuki
  • Patent number: 10930421
    Abstract: An inductive sensor includes a core body, a coil wound on the core body, a cavity having a fixed volume within the core body, and an epoxy mixture filling a controlled portion of the fixed volume. The controlled portion of the fixed volume filled with the epoxy mixture controls an inductance of the sensor.
    Type: Grant
    Filed: June 10, 2019
    Date of Patent: February 23, 2021
    Assignee: Simmonds Precision Products, Inc.
    Inventor: Sean Postlewaite
  • Patent number: 10930427
    Abstract: A coil component includes: a body; a coil part including a coil pattern embedded in the body and having at least one turn winding around on one direction; first and second external electrodes disposed on a surface of the body and connected to the coil part; and a shielding via having a permeability higher than that of the body and extending along the one direction in the body.
    Type: Grant
    Filed: October 24, 2018
    Date of Patent: February 23, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hee Soo Yoon, Jae Woon Park, Seung Jae Song, Sang Jong Lee, Min Ki Jung, Seung Hee Hong, Su Bong Jang
  • Patent number: 10923259
    Abstract: A coil component includes a body, a coil disposed inside of the body and forming one coil track when being viewed in a laminated direction, external electrodes disposed on an outer surface of the body. The coil track includes corner portions and linear portions connecting the respective corner portions to each other, and a line width of the corner portion is greater than that of the linear portion.
    Type: Grant
    Filed: April 21, 2017
    Date of Patent: February 16, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Min Ki Jung, Su Bong Jang, Sang Jong Lee
  • Patent number: 10923266
    Abstract: A coil component includes a body including a support member having a through hole and a via hole, first and second coils disposed on first and second sides of the support member opposing each other and having coil patterns, and a magnetic material sealing the support member and the coil, and an external electrode disposed on an exterior surface of the body. The first coil includes at least a portion embedded in the support member, and a second coil is connected to the first coil through a via filling an interior of the via hole. Groove portions, recessed toward a center of the support member according to a shape of the first coil, are filled with a first conductive layer as a lowermost layer of the first coil. The second side of the support member is in contact with a lower surface of the second coil.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: February 16, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Joung Gul Ryu
  • Patent number: 10916449
    Abstract: The invention provides a semiconductor package and a method for fabricating a base for a semiconductor package. The semiconductor package includes a base. The base has a device-attach surface. A radio-frequency (RF) device is embedded in the base. The RF device is close to the device-attach surface.
    Type: Grant
    Filed: January 15, 2020
    Date of Patent: February 9, 2021
    Assignee: MediaTek Inc.
    Inventors: Wen-Sung Hsu, Ta-Jen Yu
  • Patent number: 10916367
    Abstract: A printed circuit board includes at least one of a first coil pattern disposed on a first main surface and a second coil pattern disposed on a second main surface. The first coil pattern includes a first portion arranged between a first core portion and a second core portion. The second coil pattern includes a third portion arranged between the first core portion and the second core portion. A first heat transfer member is mounted on at least one of the first portion and the third portion. Therefore, temperature increase of at least one of the first portion and the third portion can be suppressed.
    Type: Grant
    Filed: January 10, 2017
    Date of Patent: February 9, 2021
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Kazuaki Fukui, Koji Nakajima, Shota Sato, Kenta Fujii
  • Patent number: 10910142
    Abstract: A switching power converter includes a first and second switching device, an air core coupled inductor, and a controller. The air core coupled inductor includes a first winding electrically coupled to the first switching device and a second winding electrically coupled to the second switching device. The first and second windings are magnetically coupled. The controller is operable to cause the first and second switching devices to repeatedly switch between their conductive and non-conductive states at a frequency of at least 100 kilohertz to cause current through the first and second windings to repeatedly cycle, thereby providing power to an output port. The switching power converter may have a topology including, but not limited to, a buck converter topology, a boost converter topology, and a buck-boost converter topology.
    Type: Grant
    Filed: July 9, 2018
    Date of Patent: February 2, 2021
    Assignee: VOLTERRA SEMICONDUCTOR LLC
    Inventor: Alexandr Ikriannikov
  • Patent number: 10912232
    Abstract: In an electronic circuit board of a power conversion device or the like, heat interference between parts mounted on a multi-layer printed circuit board is suppressed in order to place the mounted parts close to each other. The mounted parts include a semiconductor element and a magnetic part formed by a coil pattern, which is made from a copper foil of the printed circuit board, and by a magnetic core. A screw fixing portions is placed in the surroundings of the semiconductor element and the coil pattern. A heat radiation pattern connected to the screw fixing portion is provided between and around the semiconductor element and the coil pattern when viewed from a direction perpendicular to a principal surface of the multi-layer printed circuit board. The screw fixing portion is connected to a cooler in a manner that gives the screw fixing portion heat conductance and electrical conductance.
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: February 2, 2021
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Koji Nakajima, Yuji Shirakata, Kenta Fujii, Shota Sato
  • Patent number: 10902995
    Abstract: A coil component and a method of manufacturing the same are provided. The coil component may include a body part containing a magnetic material, a coil part disposed in the body part, and an electrode part disposed on the body part. The coil part includes a support member, a coil disposed on a surface of the support member and having a terminal exposed to at least one outer surface of the body part, and a conductive via connected to the terminal of the coil and penetrating through at least one end portion of the support member to thereby be exposed to the at least one outer surface of the body part.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: January 26, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jong Sik Yoon, Byeong Cheol Moon
  • Patent number: 10903571
    Abstract: A magnetic field coupling element includes conductor patterns stacked with insulating layers interposed therebetween, and interlayer connection conductors that inter-connect the conductor patterns at predetermined positions. The conductor patterns include first, second, third, and fourth conductor patterns, and the interlayer connection conductors include first and second interlayer connection conductors. The first conductor pattern, the second conductor pattern, and the first interlayer connection conductor define a first coil, and the third conductor pattern, the fourth conductor pattern, and the second interlayer connection conductor define a second coil. The first coil and the second coil are disposed in a region of less than about ? of a stacking height of a multi-layer body including the insulating layers.
    Type: Grant
    Filed: February 7, 2019
    Date of Patent: January 26, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kentaro Mikawa, Kenichi Ishizuka, Takafumi Nasu
  • Patent number: 10896949
    Abstract: Aspects generally relate to adjusting, or lowering, the Q of an inductor. In one embodiment, an integrated circuit includes an inductor and a conductive closed ring inside a periphery of the inductor. In another embodiment, there can be a plurality of closed rings inside the periphery of the inductor. The conductive closed rings are magnetically coupled to the inductor to adjust the Q.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: January 19, 2021
    Assignee: QUALCOMM Incorporated
    Inventors: Haitao Cheng, Chao Song, Ye Lu
  • Patent number: 10892079
    Abstract: A multilayer coil component includes an element body; and a coil that is provided inside the element body and includes a plurality of coil conductors that are stacked in a stacking direction and are electrically connected to each other. Each coil conductor has a contact portion and a non-contact portion. A pair of the contact portions that are adjacent to each other in the stacking direction and contact each other form a contact region. In the coil, all the contact regions are located at different positions from each other when viewed in the stacking direction. The number of turns of the coil is represented by n (positive number). The number of stacked coil conductor layers is given by 2n+1.
    Type: Grant
    Filed: December 4, 2018
    Date of Patent: January 12, 2021
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Yasushi Takeda
  • Patent number: 10886061
    Abstract: A multilayer electronic component manufacturing method includes forming a multilayer body including a plurality of ceramic layers, and forming a groove by removing a part of a bottom surface of the multilayer body. The method further includes segmenting the multilayer body by dividing the multilayer body into a plurality of chip regions, and forming an outer electrode conductor layer on the bottom surface of the multilayer body after formation of the groove and segmentation.
    Type: Grant
    Filed: December 13, 2017
    Date of Patent: January 5, 2021
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Kaoru Tachibana
  • Patent number: 10886060
    Abstract: A multilayer electronic component manufacturing method includes forming a multilayer body including a plurality of ceramic layers, and forming an outer electrode conductor layer on a bottom surface of the multilayer body. The method further includes forming a groove by removing at least a part of the outer electrode conductor layer in a part of the outer electrode conductor layer and a part of the bottom surface of the multilayer body after the outer electrode conductor layer is formed, and segmenting the multilayer body by dividing the multilayer body into a plurality of chip regions.
    Type: Grant
    Filed: December 13, 2017
    Date of Patent: January 5, 2021
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Kaoru Tachibana
  • Patent number: 10886884
    Abstract: Embodiments of the present invention provide an inductively coupled filter and a WiFi module. The inductively coupled filter includes a first circuit, where the first circuit is disposed on a first substrate; and a second circuit, where the second circuit is disposed on a second substrate; and the first substrate and the second substrate are disposed opposite to each other, so that a coil inductor in the first circuit and a coil inductor in the second circuit form a mutual induction structure. In the inductively coupled filter in the embodiments of the present invention, the coil inductors are disposed on two substrates respectively. This can reduce an area occupied by the inductively coupled filter on each package substrate.
    Type: Grant
    Filed: June 6, 2016
    Date of Patent: January 5, 2021
    Assignee: Huawei Technologies Co., Ltd.
    Inventor: Huijuan Wang
  • Patent number: 10886056
    Abstract: An inductor element includes a wire-winding portion and a core portion. In the wire-winding portion, a conductor is wound in a coil shape. The core portion surrounds the wire-winding portion and contains a magnetic powder and a resin. The wire-winding portion includes an inner circumferential surface. A winding-wire inner circumferential neighboring region is a region of the core portion within a distance from the inner circumferential surface toward a winding axis of the wire-winding portion. An inner-core central region is a region of the core portion within a distance from the winding axis center toward an existing region of the wire-winding portion in an outward direction perpendicular to the winding axis center. S??S?1?5.0% is satisfied, where S?(%) and S?1(%) are respectively an area ratio of a magnetic powder in the inner-core central region and the winding-wire inner circumferential neighboring region.
    Type: Grant
    Filed: May 1, 2018
    Date of Patent: January 5, 2021
    Assignee: TDK CORPORATION
    Inventors: Yasuhide Yamashita, Katsushi Yasuhara, Chiomi Sato
  • Patent number: 10886058
    Abstract: An inductor includes a substrate, and a first coil pattern disposed on one surface of the substrate and having a spiral shape comprising a plurality of turns, wherein as the first coil pattern extends inwardly towards a center of the first coil pattern, a pattern width of the first coil pattern decreases while a center-to-center distance between two adjacent turns of the first coil pattern increases.
    Type: Grant
    Filed: July 24, 2019
    Date of Patent: January 5, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hyung Jun Cho, Jong Mo Lim, Hyun Hwan Yoo, Hyun Jin Yoo, Yoo Hwan Kim, Yoo Sam Na
  • Patent number: 10879341
    Abstract: Some features pertain to a device package that includes a die and a package substrate. The die includes a first switch. The package substrate is coupled to the die. The package substrate includes at least one dielectric layer, a primary inductor, and a first secondary inductor coupled to the first switch of the die. The first secondary inductor and the first switch are coupled to a plurality of interconnects configured to provide an electrical path for a reference ground signal. The primary inductor is configurable to have different inductances by opening and closing the first switch coupled to the first secondary inductor. In some implementations, the primary inductor is configurable in real time while the die is operational. In some implementations, the die further includes a second switch, and the package substrate further includes a second secondary inductor coupled to the second switch of the die.
    Type: Grant
    Filed: January 20, 2016
    Date of Patent: December 29, 2020
    Assignee: QUALCOMM Incorporated
    Inventors: Young Kyu Song, Sangjo Choi, Jong-Hoon Lee, Paragkumar Ajaybhai Thadesar
  • Patent number: 10879170
    Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a semiconductor die, a molding compound, a polymer layer, a conductive trace, a conductive via and an inductor. The semiconductor die is laterally surrounded by the molding compound. The polymer layer covers the semiconductor die and the molding compound. The conductive trace, the conductive via and the inductor are embedded in the polymer layer. The conductive via extends from a top surface of the conductive trace to a top surface of the polymer layer. The inductor has a body portion extending horizontally and a protruding portion protruded from the body portion. A total height of the body and protruding portions is substantially equal to a sum of a thickness of the conductive trace and a height of the conductive via. The height of the body portion is greater than the thickness of the conductive trace.
    Type: Grant
    Filed: April 21, 2019
    Date of Patent: December 29, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yung-Ping Chiang, Chung-Shi Liu, Han-Ping Pu, Ming-Kai Liu, Ting-Chu Ko, Chang-Wen Huang, Yu-Sheng Hsieh, Ching-Yu Huang
  • Patent number: 10867735
    Abstract: The present invention is directed to electrical circuits. and more specially, inductor designs that reduce on-chip electromagnetic coupling in certain applications. In a specific embodiment, the present invention provides an inductor that includes coils that are configured to generate magnetic fields of opposite polarities. The electromagnetic fields generated by the inductor coils substantially cancel out with each other, thereby minimizing parasitic inductance of the inductor and reducing interference with operations of other components in an integrated circuit. There are other embodiments as well.
    Type: Grant
    Filed: March 6, 2020
    Date of Patent: December 15, 2020
    Assignee: INPHI CORPORATION
    Inventors: Marco Garampazzi, Matteo Pisati
  • Patent number: 10867743
    Abstract: In an embodiment, a coil component includes: an element body part 10; a coil conductor 36 constituted by first conductors 32 extending along the pair of end faces 16 and orthogonally to a bottom face 14, as well as second conductors 34 extending from one side, to the other side, of the pair of end faces and thereby connecting the multiple first conductors 32; lead conductor parts 38 electrically connected to two ends of the coil conductor, respectively; and a pair of external electrodes 50 electrically connected to the lead conductor parts; wherein at least one end of the coil conductor is electrically connected, via the lead conductor, to the external electrode at a top face 12 of the element body part; and the coil conductor extends from the at least the one end, using a second conductor, along and near the top face.
    Type: Grant
    Filed: September 22, 2017
    Date of Patent: December 15, 2020
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Takayuki Sekiguchi, Ichiro Yokoyama, Masuo Yatabe, Noriyuki Mabuchi, Tomoyuki Oyoshi