Abstract: A coil component includes an insulator part, a coil that is embedded in the insulator part and includes a plurality of coil conductor layers electrically connected together, and outer electrodes that are disposed on surfaces of the insulator part and are electrically connected to the coil. The insulator part includes a magnetic phase containing at least Fe, Ni, Zn, and Cu and a non-magnetic phase containing at least Si and Zn. A portion of the insulator part located between, of the coil conductor layers, adjacent coil conductor layers has a pore area percentage of 0.3% or more and 3.0% or less (i.e., from 0.3% to 3.0%). The portion of the insulator part located between the adjacent coil conductor layers includes crystal grains having an average crystal grain size of 0.2 ?m or more and 0.8 ?m or less (i.e., from 0.2 ?m to 0.8 ?m).

Abstract: Wireless chargers that can properly align and securely hold an electronic device, provide power to more than one electronic device, and fold into a compact shape. One example can provide a wireless charger having an alignment feature to align an electronic device to the wireless charger. The wireless charger can further include an attachment feature to attach the electronic device to the wireless charger such that the electronic device is securely held in place relative to the wireless charger. The wireless charger can include a first leaf having first charging components for charging a first electronic device and a second leaf having second charging components for charging a second electronic device. The first leaf and the second leaf can fold together into a compact shape.

Abstract: A multilayer coil component that includes a multilayer body in which a plurality of insulating layers are stacked in a stacking direction and a coil inside the multilayer body, and outer electrodes that are on surfaces of the multilayer body and are electrically connected to the coil. The insulating layers include a spinel-structure ferrite phase and a ZnFe(BO3)O-type crystalline phase.

Abstract: A balanced-to-unbalanced (balun) transformer includes a primary inductor coupled to an unbalanced terminal and a secondary inductor coupled to a balanced terminal. The primary inductor is configured on a second layer and a third layer of a four-layer symmetrical stack-up. The secondary inductor is configured on a first layer and a fourth layer of the four-layer symmetrical stack-up. The primary inductor includes a first primary winding disposed on the second layer and a second primary winding disposed on the third layer. The secondary inductor includes a first secondary winding disposed on the first layer and a second secondary winding disposed on the fourth layer.

Abstract: A method for producing a magnetic device is provided. The magnetic device produced by the method includes a main body that is integrally formed. The method includes a preparing process, a coil assembling process, a placing process, and a forming process. The preparing process is implemented by producing a bottom seat and a lid. The coil assembling process is implemented by fixing a coiling to the bottom seat for formation of a first semi-finished product. The placing process is implemented by placing the first semi-finished product into a mold and placing the lid onto the first semi-finished product for formation of a second semi-finished product. The forming process is implemented by pressurizing the second semi-finished product, such that the bottom seat and the lid are melted and connected to each other to form the main body. The coil is correspondingly encompassed by the main body.

Abstract: A multilayer-type on-chip inductor with a conductive structure includes an insulating redistribution layer disposed on an inter-metal dielectric (IMD) layer, and first and second winding portions symmetrically arranged in the IMD layer and the insulating redistribution layer with respect to a symmetrical axis. The first and second winding portions each includes at least first and second semi-circular stacking layers arranged from the inside to the outside and in concentricity. The first and second semi-circular stacking layers each has a first trace layer in the insulating redistribution layer and a second trace layer in the IMD layer and correspondingly formed below the first trace layer. A first slit opening passes through the second trace layer and extends in the extending direction of the length of the second trace layer.

Abstract: The disclosure provides at least an apparatus, system and method for providing a flexible planar inductive coil, such as may be embedded in a product. The apparatus, system and method may include at least one conformable substrate, and a matched function ink set, printed onto at least one substantially planar face of the at least one substrate. This printing may form at least one layer of additive conductive traces capable of receiving current flow from at least one source and layered into successive ones of the conductive traces about a center axis within a plane of the at least one conformable substrate.

Abstract: Disclosed herein is a circuit substrate that includes a coil component mounted on the substrate having first and second land patterns and first and second dummy land patterns. The coil component includes a first signal terminal and a first dummy terminal which are provided on the first flange part, a second signal terminal and a second dummy terminal which are provided on the second flange part, and a wire wound around the winding core part and whose one end and other end are connected respectively to the first signal terminal and the second signal terminal. The coil component is mounted on the substrate such that the first and second signal terminals are connected respectively to the first and second land patterns and that the first and second dummy patterns are connected respectively to the first and second dummy land patterns.

Abstract: An inductor device including a first ring-type structure, a second ring-type structure, and a third ring-type structure is disclosed. The second ring-type structure is coupled to the first ring-type structure and formed an 8-shaped loop with the first ring-type structure. The third ring-type structure is coupled to the second ring-type structure. The first ring-type structure and the second ring-type structure are located at an area surrounded by the third ring-type structure.

Abstract: In the multi-layer inductor, all of the plurality of through conductors are not aligned in a straight line, and the distance between the through conductors can be sufficiently kept in the element body having a predetermined dimensional standard. Therefore, the through conductor as a heat source is apart from each other, and the heat of the through conductor can be efficiently radiated to the outside of the element body.

Abstract: A coil structure for near-field wireless power transfer, integrating the traditional inductor and external capacitor structure into one single coil and forming a series resonance. The series resonance is achieved by a terminal connection and layering method. The electric field is canceled via a distributed turn-to-turn interleaving structure. With the integrated capacitor, the costs and space of a resonant capacitor can be saved. With the canceled electric field, the interference with neighboring components, such as touch-screen, can be reduced. Other benefits can include low-profile and fabrication convenience based on RGB technology. This coil can be useful for both consumer electronics and electric vehicle wireless charging.

Abstract: A coil component according to one or more embodiments of the invention includes a base body including a plurality of metal magnetic particles, where each metal magnetic particle contains a metal element, a coil conductor including a buried portion provided in the base body and an exposed portion externally exposed through the base body, where the coil conductor is mainly composed of copper, and an insulating oxide layer covering a surface of the buried portion, where the insulating oxide layer contains copper element and an oxide of the metal element contained in the metal magnetic particles.

Abstract: An inductor component comprising an element body including a first and second magnetic layers that contain a metal magnetic powder and that are laminated along a first direction, a spiral wiring disposed between the first and second magnetic layers, a vertical wiring connected to the spiral wiring and extending in the first direction to penetrate the element body and an external terminal connected to the vertical wiring and exposed on a first principal surface of the element body orthogonal to the first direction. The spiral wiring is disposed on a first plane orthogonal to the first direction and includes a pad part to which the vertical wiring is connected, a spiral part extending from the pad part on the first plane, and a lead-out part extending from the pad part on the first plane and exposed from a side surface of the element body parallel to the first direction.

Abstract: In one embodiment, an apparatus includes a circuit board having a parallel bus with a first trace and a second trace, a first inductive coil coupled to the first trace, and a second inductive coil coupled to the second trace. The first and second inductive coils are arranged to inductively couple with one another to reduce cross talk effects in the parallel bus.

Abstract: A wiring substrate includes a first conductor layer including wirings, an interlayer insulating layer formed on and covering the first conductor layer, a wiring layer formed in the interlayer insulating layer and including wirings, a second conductor layer formed on the interlayer insulating layer and including wirings, and a via conductor formed in the interlayer insulating layer such that the via conductor is penetrating through the interlayer insulating layer and connecting the first and second conductor layers. The interlayer insulating layer includes first and second insulating layers such that the wiring layer is formed on a surface of the first insulating layer, and the wiring layer is formed such that an aspect ratio of the wirings in the wiring layer is in the range of 2.0 to 6.0 and that aspect ratios of the wirings in the first and second conductor layers are in the range of 1.0 to 2.0.

Abstract: A microelectronics package comprises a substrate comprising at least two conductive layers that are separated by a first dielectric. At least one island comprising a magnetic material is embedded within the dielectric between the two conductive layers. An inductor structure extends within a via in the at least one island. The via extends between the two conductive layers. The inductor structure comprises a conductive wall along a sidewall of the via, and wherein the conductive wall surrounds a second dielectric and is electrically coupled to the two conductive layers.

Abstract: An inductor can be formed in a coreless electronic substrate, such that the fabrication process does not result in the magnetic material used in the inductor leaching into plating and/or etching solutions/chemistries, and results in a unique inductor structure. This may be achieved by forming conductive vias with a lithographic process, rather than a standard laser process, in combination with panel planarization to prevent exposure of the magnetic material to the plating and/or etching solutions/chemistries.

Abstract: Disclosed herein is a coil component that includes a substrate, and a planar spiral coil pattern provided on the surface of the substrate. The coil pattern has a circularity higher in its inner shape than in its outer shape.

Abstract: A coil component includes a body, a support substrate disposed in the body, a coil portion including a first lead-out pattern disposed on a first surface of the support substrate, a first dummy pattern portion disposed to be spaced apart from the first lead-out pattern on the first surface of the support substrate, and a first external electrode disposed on the body to be connected to the first lead-out pattern, wherein the first lead-out pattern and the first dummy pattern portion are exposed to a first surface of the body to be spaced apart from each other, and the first surface of the support substrate, supporting the first lead-out pattern and the first dummy pattern portion, is continuously exposed to the first surface of the body.

Abstract: A multilayer inductor includes: an element body formed by stacking a plurality of layers of insulators in a stacking direction; a terminal electrode provided on at least one side surface of the element body; and a linear conductor portion provided in the element body and extending in a first direction, wherein, as viewed from a second direction perpendicular to the first direction, the conductor portion has a first portion in a region overlapping the terminal electrode and a second portion in a region not overlapping the terminal electrode, and wherein a width of the first portion as viewed from the second direction is smaller than a width of the second portion.

Abstract: A method of making a semiconductor device, includes: forming a first molding layer on a substrate; forming a first plurality of vias in the first molding layer; forming a first conductive line over the first molding layer, wherein the first conductive line is laterally disposed over the first molding layer and a first end of the conductive line aligns with and is electrically coupled to a first via of the first plurality of vias; forming a second molding layer above the first molding layer; and forming a second plurality of vias in the second molding layer, wherein a second via of the second plurality of vias aligns with and is electrically coupled to a second end of the conductive line, and wherein the second plurality of vias, the conductive line, and the first plurality of vias are electrically coupled to one another.

Abstract: A coil component and a method for manufacturing the same are provided, and the coil component includes a body portion including a magnetic material, a support member disposed in the body portion, first and second conductor patterns disposed in both sides of the support member, opposing each other, a recess portion formed in a side surface of the support member, a via conductor disposed in the recess portion and connecting the first and second conductor patterns to each other, and a via pad disposed in an end portion of each of the first and second conductor patterns to connect the first and second conductor patterns to the via conductor, and having a line width greater than line widths of the first and second conductor patterns.

Abstract: Systems and methods for a vehicle pedal assembly and an inductive sensor assembly thereof. The inductive sensor assembly includes a rotary inductive sensor target and a printed circuit board (PCB) positioned opposite the rotary inductive sensor target. The inductive sensor assembly includes a first inductive sensor circuit defined on the PCB. The first inductive sensor circuit includes a first coil circuit including a first coil having a first electrical current in a first flow direction and a second electrical coil having a second current in a second flow direction opposite to the first flow direction. The first inductive sensor circuit is configured such that a rotation of the rotary inductive sensor target induces a change in the first electrical current and the second electrical current within the first coil and the second coil.

Abstract: A coil component includes a body, a support substrate disposed in the body, a coil unit disposed on the support substrate to be perpendicular to a first surface of the body and including first and second lead-out portions exposed to first surface of the body and spaced apart from each other, first and second external electrodes disposed to be spaced apart from each other on the first surface of the body and connected to the first and second lead-out portions, respectively, a slit portion formed in a region of one surface of the body between the first and second external electrodes, and a slit insulating layer disposed in the slit portion.

Abstract: A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one connector connecting two of the conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency. The structure is capable of transmitting or receiving electrical energy and/or data at various near and far field magnetic coupling frequencies.

Abstract: An element body includes a metal-particle-dispersed body in which metal particles are dispersed, the metal-particle-dispersed body includes a display region on a surface, and the display region includes a display pattern in which a resin exposed portion where a resin appears on a surface and a metal exposed portion where the metal particles appear on the surface are alternately repeated.

Abstract: A stacked electronic structure, including a substrate, wherein electronic devices are disposed on the substrate, and a molding body encapsulates the electronic devices, wherein a first thermal conductive layer is disposed on a first electronic device, and a second thermal conductive layer is disposed on a second electronic device, wherein a magnetic device comprising a magnetic body is disposed over a top surface of the molding body, wherein at least one third thermal conductive layer is disposed on the magnetic body, and the first thermal conductive layer and the second thermal conductive layer are respectively connected with the at least one third thermal conductive layer for dissipating heat.

Abstract: A multilayer resin substrate includes a stacked body, and a coil including a first coil conductor pattern and a second coil conductor pattern. The second coil conductor pattern includes a wide portion with a line width larger than a line width of the first coil conductor pattern. The wide portion includes overlapping portions that overlap with the first coil conductor pattern, and non-overlapping portions that do not overlap with the first coil conductor pattern, when viewed in a Z-axis direction. Adjacent non-overlapping portions in the Z-axis direction, when viewed in the Z-axis direction, protrude in opposite directions to each other in a radial direction, with respect to the first coil conductor pattern.

Abstract: An electronic component includes a composite body containing resin and magnetic metal particles, a first metal film provided on an outer surface of the composite body, and a second metal film provided on the first metal film. At least one of the magnetic metal particles is exposed at a contact surface of the composite body that is in contact with the first metal film. The first metal film is in contact with an exposed surface of the at least one of the magnetic metal particles exposed from the contact surface. The film thickness of the first metal film on the exposed surface is 2.9 ?m or more.

Abstract: A coil component includes a body; a coil portion disposed in the body and including a lead-out pattern; an external electrode disposed on a first surface of the body; and a plurality of connection vias disposed in the body, connecting the external electrode to the lead-out pattern, and integrated with each other, wherein, in each of the plurality of connection vias, a size of an end surface area of a lower portion adjacent to the external electrode is different from a size of an end surface area of an upper portion adjacent to the lead-out pattern.

Abstract: An improved distributed-output multi-cell-element power converter utilizes a multiplicity of magnetic core elements, switching elements, capacitor elements and terminal connections in a step and repeat pattern. Stepped secondary-winding elements reduce converter output resistance and improve converter efficiency and scalability to support the high current requirements of very large scale integrated (“VLSI”) circuits.

Abstract: A coil electronic component includes a support substrate, a coil portion disposed on at least one surface of the support substrate, a body in which the support substrate and the coil portion are embedded, and first and second external electrodes disposed on a surface of the body and connected to both ends of the coil portion, respectively. A thickness of the body is 0.55 mm or less. The body includes a cover portion disposed on the coil portion. A ratio of a thickness of the coil portion to a thickness of the cover portion is 5:5 to 8:2.

Abstract: The present invention relates to a circuit breaker operating current/fault current measuring device using a single Rogowski coil has an advantage of reducing an installation space and a manufacturing cost by simultaneously measuring an operating current and a fault current with the single Rogowski coil and has an advantage of improving reliability by simultaneously satisfying accuracy required for measurement of the operating current and the fault current. The circuit breaker operating current/fault current measuring device using a single Rogowski coil according to the present invention is configured with a Rogowski coil installed to wrap around a current-carrying conductor, a protection circuit outputting a fault voltage based on a voltage generated from a tap installed on a portion of the Rogowski coil, and a measurement circuit outputting an operating voltage based on a voltage generated in the entire coil of the Rogowski coil.

Abstract: A coil structure includes layered metal plates, wherein each of the metal plates includes a lead wire portion having a partial-loop shape, end portion thick plate portions formed at both ends of the lead wire portion and thicker than the lead wire portion, and an inside thick plate portion formed with a thickness the same as the end portion thick plate portions, the inside thick plate portion being arranged inside a partial loop formed by the lead wire portion and being away from the lead wire portion, and wherein adjacent metal plates are bonded to each other at one of the end portion thick plate portions, the lead wire portions of the respective metal plates are connected in series to form a coil having a partial-loop shape, and the inside thick plate portions of the adjacent metal plates are bonded to each other to form a magnetic core.

Abstract: A multilayer-type on-chip inductor includes a first winding portion arranged in an inter-metal dielectric (IMD) layer, which includes first and second semi-circular stacking layers arranged from inside to outside and in concentricity. A second winding portion includes third and fourth semi-circular stacking layers arranged symmetrically with the first semi-circular stacking layer and the second semi-circular stacking layer, respectively, with respect to a symmetry axis. A conductive branch layer is disposed in an insulating redistribution layer over the IMD layer. The first, second, third, and fourth semi-circular stacking layers each include an uppermost trace layer and a next uppermost trace layer vertically stacked under the uppermost trace layer.

Abstract: The present disclosure provides a manufacturing method of a magnetic element, comprising: forming an insulation layer on an outer side of at least one section of a magnetic column of a magnetic core; forming a metal wiring layer on an outer side of the insulation layer through a metallization process; and dividing at least part of the metal wiring layer into a multi-turn metal winding through a mechanically dividing process.

Abstract: An improved distributed-output multi-cell-element power converter utilizes a multiplicity of magnetic core elements, switching elements, capacitor elements and terminal connections in a step and repeat pattern. Stepped secondary-winding elements reduce converter output resistance and improve converter efficiency and scalability to support the high current requirements of very large scale integrated (“VLSI”) circuits. Some embodiments of the multi-cell converter comprise integrated secondary-side switching devices comprising control circuitry that monitors circuit conditions to determine when the switching device is to be ON and OFF, thereby eliminating the need for secondary-side switch control signals and signal buses, primary-to-secondary interface circuitry and centralized drive circuitry.

Abstract: A three dimensional (3D) inductor is described. The 3D inductor includes a first plurality of micro-through substrate vias (TSVs) within a first area of a substrate. The 3D inductor also includes a first trace on a first surface of the substrate, coupled to a first end of the first plurality of micro-TSVs. The 3D inductor further includes a second trace on a second surface of the substrate, opposite the first surface, coupled to a second end, opposite the first end, of the first plurality of micro-TSVs.

Abstract: A package board that includes an inductor layer having: a first magnetic layer including first magnetic particles and a resin; an inductor wiring that functions as an inductor in the first magnetic layer; and a second magnetic layer on at least one surface of the first magnetic layer, including second magnetic particles that are higher in average flatness than the first magnetic particles and a resin, the second magnetic particles having a shape where the dimension in a direction along the main surface of the second magnetic layer is longer than the dimension in the thickness direction of the second magnetic layer.

Abstract: A coil component includes a body, a support substrate, a coil portion on one surface of the support substrate, and first and second external electrodes disposed on the body and connected to the coil portion. 100 ?m?0.5*b*tan ?, where, on a cross-section perpendicular to the one surface of the support substrate, P1 is a point among points at which an outline of one coil turn and the support substrate intersect, P2 is a point among points at which an outline of an adjacent coil turn and the support substrate intersect, P3 is a point among points of the one coil turn having a maximum line width, ‘a’ is a length of a first virtual segment connecting P1 to P3, ‘b’ is a length of a second virtual segment connecting P1 to P2, and ? is an angle defined by the first and second virtual segments.

Abstract: A coil device includes a core, a coil, a mounting part, and a bottom raising part. The coil is at least partly disposed close to the core. The mounting part is mounted on an installation surface. The bottom raising part is connected with the coil and extends to the mounting part so as to form a gap having a predetermined height between the mounting part and a bottom surface of the core.

Abstract: Disclosed herein is a coil component that includes a a coil area in which first to third coil patterns are disposed and a terminal area positioned outside the coil area. The outer peripheral end of the first coil pattern is connected to the first terminal electrode. The inner peripheral end of the first coil pattern is connected to an inner peripheral end of the second coil pattern. The outer peripheral end of the second coil pattern is connected to an outer peripheral end of the third coil pattern. A via conductor connecting the outer peripheral ends of the second and third coil patterns is disposed at a position overlapping the terminal area.

Abstract: A common-mode choke coil includes a multilayer body, a first coil, a second coil, a first terminal electrode, a second terminal electrode, a third terminal electrode, and a fourth terminal electrode. The multilayer body includes plural non-conductor layers. The first and second coils are incorporated in the multilayer body. The first and second terminal electrodes are connected to the first coil. The third and fourth terminal electrodes are connected to the second coil. The first coil has a path length L1, the second coil has a path length L2, and the sum of the path length L1 and the path length L2 is less than or equal to 3.5 mm. The non-conductor layers each have a relative permittivity of less than or equal to 11.

Abstract: A common mode choke coil includes a core, and first and second coils opposed to each other and wound on the core. The core can have a square shape, or an elongated shape having a long axis and a short axis when viewed in a direction along a central axis of the core. Each of the first and second coils is a single-layer coil. An area of a cross-section of the core taken perpendicular to a circumferential direction of the core is constant in the circumferential direction of the core. The cross-section of the core has a quadrilateral shape.

Abstract: A filter includes a first resonance circuit including a first capacitor and a first inductor connected in parallel between a ground terminal and a first node electrically connected to a first signal terminal not through any capacitor, no inductor being connected in series with the first capacitor between the first node and the ground terminal, a second resonance circuit including a second capacitor and a second inductor connected in parallel between the ground terminal and a second node electrically connected to a second signal terminal not through any capacitor, and a third resonance circuit including a third capacitor and a third inductor connected in parallel between a third node, located in a path through which a high-frequency signal is transmitted between the first and second nodes, and the ground terminal, and a first series inductor connected in series with the third capacitor between the third node and the ground terminal.

Abstract: An electronic device has a primary coil 10; a secondary coil 20 disposed to face the primary coil 10; a coil sealing part 50 sealing the primary coil 10 and the secondary coil 20 and being made of sealing resin; a primary-side electronic element 110 electrically connected to the primary coil 10; and a secondary-side electronic element 210 electrically connected to the secondary coil 20. The primary-side electronic element 110 is provided on a primary-side extension part 60 extending from the primary coil 10 to an outside of the coil sealing part 50, or the secondary-side electronic element 210 is provided on a secondary-side extension part 70 extending from the secondary coil 20 to an outside of the coil sealing part 50.

Abstract: An inductor component includes an element body having magnetism, a resin layer provided inside the element body, and inductor wirings provided inside the element body and having a contact surface that is in contact with the resin layer. A configuration ratio of the inductor wirings is equal to or less than about “0.9”. In a transverse plane of the inductor wirings perpendicular to an extending direction of the inductor wirings, in a case where a largest dimension among dimensions in a height direction perpendicular to the contact surface is defined as a maximum dimension, the configuration ratio is a ratio of the largest dimension to a dimension of the contact surface in the transverse plane.

Abstract: An electronic device may include a memory; a processor; communication circuitry; and an antenna. The antenna may include an insulation sheet; an antenna pattern disposed in the insulation sheet and having a meander form; a first magnetic sheet layer disposed on a first surface of the insulation sheet; and a second magnetic sheet layer disposed on a second surface of the insulation sheet. Each of the first magnetic sheet layer and the second magnetic sheet layer may include a plurality of magnetic sheets disposed at specified intervals each having a first area. The plurality of magnetic sheets of the first magnetic sheet layer may be disposed to correspond to the first areas of the second magnetic sheet layer.

Abstract: A system and method of measuring a magnetic field from a source. A plurality of sensors each include a plurality of sensing elements. A first sensing element is configured to detect an intensity of the magnetic field and a second sensing element is configured to directly measure a gradient of the magnetic field. A positioned is determined, with respect to the source, where a magnitude of the magnetic field in a first direction is greatest. An orientation of the sensors is determined in a three-dimensional pattern by arranging the sensors to emphasize sensing the magnetic field in the first direction. The sensors are oriented and positioned according to the position and orientation determined. The magnetic field is measured, in the first direction, using the sensors.

Abstract: A multilayer coil component includes a body formed by multiple insulating layers stacked in a direction of stacking and having first and second end surfaces opposite each other in a length direction, first and second main surfaces opposite each other in a height direction, perpendicular to the length direction, and first and second lateral surfaces opposite each other in a width direction, perpendicular to the length direction and to the height direction; a coil inside the body and including multiple coil conductors electrically coupled together; and a first outer electrode extending from at least part of the first end surface of the body to part of the first main surface and electrically coupled to the coil. The direction of stacking of the insulating layers and the direction of the coil axis of the coil are parallel with the first main surface, which is the mounting surface, of the body.