Abstract: A coil component includes a body; a coil portion disposed in the body and including a lead-out pattern; an external electrode disposed on a first surface of the body; and a plurality of connection vias disposed in the body, connecting the external electrode to the lead-out pattern, and integrated with each other, wherein, in each of the plurality of connection vias, a size of an end surface area of a lower portion adjacent to the external electrode is different from a size of an end surface area of an upper portion adjacent to the lead-out pattern.

Abstract: A multilayer resin substrate includes a stacked body, and a coil including a first coil conductor pattern and a second coil conductor pattern. The second coil conductor pattern includes a wide portion with a line width larger than a line width of the first coil conductor pattern. The wide portion includes overlapping portions that overlap with the first coil conductor pattern, and non-overlapping portions that do not overlap with the first coil conductor pattern, when viewed in a Z-axis direction. Adjacent non-overlapping portions in the Z-axis direction, when viewed in the Z-axis direction, protrude in opposite directions to each other in a radial direction, with respect to the first coil conductor pattern.

Abstract: An improved distributed-output multi-cell-element power converter utilizes a multiplicity of magnetic core elements, switching elements, capacitor elements and terminal connections in a step and repeat pattern. Stepped secondary-winding elements reduce converter output resistance and improve converter efficiency and scalability to support the high current requirements of very large scale integrated (“VLSI”) circuits.

Abstract: An electronic component includes a composite body containing resin and magnetic metal particles, a first metal film provided on an outer surface of the composite body, and a second metal film provided on the first metal film. At least one of the magnetic metal particles is exposed at a contact surface of the composite body that is in contact with the first metal film. The first metal film is in contact with an exposed surface of the at least one of the magnetic metal particles exposed from the contact surface. The film thickness of the first metal film on the exposed surface is 2.9 ?m or more.

Abstract: A coil electronic component includes a support substrate, a coil portion disposed on at least one surface of the support substrate, a body in which the support substrate and the coil portion are embedded, and first and second external electrodes disposed on a surface of the body and connected to both ends of the coil portion, respectively. A thickness of the body is 0.55 mm or less. The body includes a cover portion disposed on the coil portion. A ratio of a thickness of the coil portion to a thickness of the cover portion is 5:5 to 8:2.

Abstract: A coil structure includes layered metal plates, wherein each of the metal plates includes a lead wire portion having a partial-loop shape, end portion thick plate portions formed at both ends of the lead wire portion and thicker than the lead wire portion, and an inside thick plate portion formed with a thickness the same as the end portion thick plate portions, the inside thick plate portion being arranged inside a partial loop formed by the lead wire portion and being away from the lead wire portion, and wherein adjacent metal plates are bonded to each other at one of the end portion thick plate portions, the lead wire portions of the respective metal plates are connected in series to form a coil having a partial-loop shape, and the inside thick plate portions of the adjacent metal plates are bonded to each other to form a magnetic core.

Abstract: An improved distributed-output multi-cell-element power converter utilizes a multiplicity of magnetic core elements, switching elements, capacitor elements and terminal connections in a step and repeat pattern. Stepped secondary-winding elements reduce converter output resistance and improve converter efficiency and scalability to support the high current requirements of very large scale integrated (“VLSI”) circuits. Some embodiments of the multi-cell converter comprise integrated secondary-side switching devices comprising control circuitry that monitors circuit conditions to determine when the switching device is to be ON and OFF, thereby eliminating the need for secondary-side switch control signals and signal buses, primary-to-secondary interface circuitry and centralized drive circuitry.

Abstract: A multilayer-type on-chip inductor includes a first winding portion arranged in an inter-metal dielectric (IMD) layer, which includes first and second semi-circular stacking layers arranged from inside to outside and in concentricity. A second winding portion includes third and fourth semi-circular stacking layers arranged symmetrically with the first semi-circular stacking layer and the second semi-circular stacking layer, respectively, with respect to a symmetry axis. A conductive branch layer is disposed in an insulating redistribution layer over the IMD layer. The first, second, third, and fourth semi-circular stacking layers each include an uppermost trace layer and a next uppermost trace layer vertically stacked under the uppermost trace layer.

Abstract: The present invention relates to a circuit breaker operating current/fault current measuring device using a single Rogowski coil has an advantage of reducing an installation space and a manufacturing cost by simultaneously measuring an operating current and a fault current with the single Rogowski coil and has an advantage of improving reliability by simultaneously satisfying accuracy required for measurement of the operating current and the fault current. The circuit breaker operating current/fault current measuring device using a single Rogowski coil according to the present invention is configured with a Rogowski coil installed to wrap around a current-carrying conductor, a protection circuit outputting a fault voltage based on a voltage generated from a tap installed on a portion of the Rogowski coil, and a measurement circuit outputting an operating voltage based on a voltage generated in the entire coil of the Rogowski coil.

Abstract: The present disclosure provides a manufacturing method of a magnetic element, comprising: forming an insulation layer on an outer side of at least one section of a magnetic column of a magnetic core; forming a metal wiring layer on an outer side of the insulation layer through a metallization process; and dividing at least part of the metal wiring layer into a multi-turn metal winding through a mechanically dividing process.

Abstract: A three dimensional (3D) inductor is described. The 3D inductor includes a first plurality of micro-through substrate vias (TSVs) within a first area of a substrate. The 3D inductor also includes a first trace on a first surface of the substrate, coupled to a first end of the first plurality of micro-TSVs. The 3D inductor further includes a second trace on a second surface of the substrate, opposite the first surface, coupled to a second end, opposite the first end, of the first plurality of micro-TSVs.

Abstract: A coil device includes a core, a coil, a mounting part, and a bottom raising part. The coil is at least partly disposed close to the core. The mounting part is mounted on an installation surface. The bottom raising part is connected with the coil and extends to the mounting part so as to form a gap having a predetermined height between the mounting part and a bottom surface of the core.

Abstract: A package board that includes an inductor layer having: a first magnetic layer including first magnetic particles and a resin; an inductor wiring that functions as an inductor in the first magnetic layer; and a second magnetic layer on at least one surface of the first magnetic layer, including second magnetic particles that are higher in average flatness than the first magnetic particles and a resin, the second magnetic particles having a shape where the dimension in a direction along the main surface of the second magnetic layer is longer than the dimension in the thickness direction of the second magnetic layer.

Abstract: Disclosed herein is a coil component that includes a a coil area in which first to third coil patterns are disposed and a terminal area positioned outside the coil area. The outer peripheral end of the first coil pattern is connected to the first terminal electrode. The inner peripheral end of the first coil pattern is connected to an inner peripheral end of the second coil pattern. The outer peripheral end of the second coil pattern is connected to an outer peripheral end of the third coil pattern. A via conductor connecting the outer peripheral ends of the second and third coil patterns is disposed at a position overlapping the terminal area.

Abstract: A coil component includes a body, a support substrate, a coil portion on one surface of the support substrate, and first and second external electrodes disposed on the body and connected to the coil portion. 100 ?m?0.5*b*tan ?, where, on a cross-section perpendicular to the one surface of the support substrate, P1 is a point among points at which an outline of one coil turn and the support substrate intersect, P2 is a point among points at which an outline of an adjacent coil turn and the support substrate intersect, P3 is a point among points of the one coil turn having a maximum line width, ‘a’ is a length of a first virtual segment connecting P1 to P3, ‘b’ is a length of a second virtual segment connecting P1 to P2, and ? is an angle defined by the first and second virtual segments.

Abstract: A filter includes a first resonance circuit including a first capacitor and a first inductor connected in parallel between a ground terminal and a first node electrically connected to a first signal terminal not through any capacitor, no inductor being connected in series with the first capacitor between the first node and the ground terminal, a second resonance circuit including a second capacitor and a second inductor connected in parallel between the ground terminal and a second node electrically connected to a second signal terminal not through any capacitor, and a third resonance circuit including a third capacitor and a third inductor connected in parallel between a third node, located in a path through which a high-frequency signal is transmitted between the first and second nodes, and the ground terminal, and a first series inductor connected in series with the third capacitor between the third node and the ground terminal.

Abstract: A multilayer coil component includes a body formed by multiple insulating layers stacked in a direction of stacking and having first and second end surfaces opposite each other in a length direction, first and second main surfaces opposite each other in a height direction, perpendicular to the length direction, and first and second lateral surfaces opposite each other in a width direction, perpendicular to the length direction and to the height direction; a coil inside the body and including multiple coil conductors electrically coupled together; and a first outer electrode extending from at least part of the first end surface of the body to part of the first main surface and electrically coupled to the coil. The direction of stacking of the insulating layers and the direction of the coil axis of the coil are parallel with the first main surface, which is the mounting surface, of the body.

Abstract: A system and method of measuring a magnetic field from a source. A plurality of sensors each include a plurality of sensing elements. A first sensing element is configured to detect an intensity of the magnetic field and a second sensing element is configured to directly measure a gradient of the magnetic field. A positioned is determined, with respect to the source, where a magnitude of the magnetic field in a first direction is greatest. An orientation of the sensors is determined in a three-dimensional pattern by arranging the sensors to emphasize sensing the magnetic field in the first direction. The sensors are oriented and positioned according to the position and orientation determined. The magnetic field is measured, in the first direction, using the sensors.

Abstract: A common-mode choke coil includes a multilayer body, a first coil, a second coil, a first terminal electrode, a second terminal electrode, a third terminal electrode, and a fourth terminal electrode. The multilayer body includes plural non-conductor layers. The first and second coils are incorporated in the multilayer body. The first and second terminal electrodes are connected to the first coil. The third and fourth terminal electrodes are connected to the second coil. The first coil has a path length L1, the second coil has a path length L2, and the sum of the path length L1 and the path length L2 is less than or equal to 3.5 mm. The non-conductor layers each have a relative permittivity of less than or equal to 11.

Abstract: An electronic device has a primary coil 10; a secondary coil 20 disposed to face the primary coil 10; a coil sealing part 50 sealing the primary coil 10 and the secondary coil 20 and being made of sealing resin; a primary-side electronic element 110 electrically connected to the primary coil 10; and a secondary-side electronic element 210 electrically connected to the secondary coil 20. The primary-side electronic element 110 is provided on a primary-side extension part 60 extending from the primary coil 10 to an outside of the coil sealing part 50, or the secondary-side electronic element 210 is provided on a secondary-side extension part 70 extending from the secondary coil 20 to an outside of the coil sealing part 50.

Abstract: An electronic device may include a memory; a processor; communication circuitry; and an antenna. The antenna may include an insulation sheet; an antenna pattern disposed in the insulation sheet and having a meander form; a first magnetic sheet layer disposed on a first surface of the insulation sheet; and a second magnetic sheet layer disposed on a second surface of the insulation sheet. Each of the first magnetic sheet layer and the second magnetic sheet layer may include a plurality of magnetic sheets disposed at specified intervals each having a first area. The plurality of magnetic sheets of the first magnetic sheet layer may be disposed to correspond to the first areas of the second magnetic sheet layer.

Abstract: An inductor component includes an element body having magnetism, a resin layer provided inside the element body, and inductor wirings provided inside the element body and having a contact surface that is in contact with the resin layer. A configuration ratio of the inductor wirings is equal to or less than about “0.9”. In a transverse plane of the inductor wirings perpendicular to an extending direction of the inductor wirings, in a case where a largest dimension among dimensions in a height direction perpendicular to the contact surface is defined as a maximum dimension, the configuration ratio is a ratio of the largest dimension to a dimension of the contact surface in the transverse plane.

Abstract: A common mode choke coil includes a core, and first and second coils opposed to each other and wound on the core. The core can have a square shape, or an elongated shape having a long axis and a short axis when viewed in a direction along a central axis of the core. Each of the first and second coils is a single-layer coil. An area of a cross-section of the core taken perpendicular to a circumferential direction of the core is constant in the circumferential direction of the core. The cross-section of the core has a quadrilateral shape.

Abstract: A magnetic transfer apparatus includes: a magnetomotive force source providing magnetic flux, a first magnetic flux distribution circuit connected to one end of the magnetomotive force source, having a single input terminal and a plurality of output terminals, and distributing the magnetic flux, and a second magnetic flux distribution circuit connected to the other end of the magnetomotive force source, having a single output terminal and a plurality of input terminals, and collecting the distributed magnetic flux. The output terminals of the first magnetic flux distribution circuit are disposed to be adjacent to each other to form a pair with the input terminals of the second magnetic flux distribution circuit.

Abstract: A mounting structure of an electronic component includes a multilayer ceramic capacitor including lands on a board and spaced apart from each other, solder on the lands, and a component main body including external electrodes on both end portions of the component main body in a length direction, each of the pair of external electrodes being connected to a corresponding one of the pair of lands via the solder. When a separation direction of the lands is an X direction and a direction orthogonal or substantially orthogonal to the X direction is a Y direction, when a width dimension of the land along the Y direction is c, a dimension of each of the external electrodes in the X direction is e, and a gap between the land and the external electrode is Gap, 3.4<(c×e)/Gap<258.8 is satisfied.

Abstract: Embodiments of the present application provide a MEMS solenoid transformer, comprising a silicon substrate, a soft magnetic core, a first solenoid and a second solenoid; wherein, the soft magnetic core is wrapped inside the silicon substrate, the silicon substrate is provided with a first spiral channel and a second spiral channel, and two opposite sides of the soft magnetic core respectively pass through a center of the first spiral channel and a center of the second spiral channel; the first solenoid and the second solenoid are respectively disposed in the first spiral channel and the second spiral channel. By disposing the soft magnetic core, the first solenoid and the second solenoid of the transformer inside the silicon substrate completely, the thickness of the silicon substrate is fully utilized, and the obtained transformer has a larger winding cross-sectional area and a higher magnetic flux, increasing the inductance value of the transformer.

Abstract: A multilayer electronic component includes a body including a plurality of dielectric layers and first and second internal electrodes disposed alternately with the dielectric layers in a first direction; a first external electrode including a first connection electrode, disposed on the third surface, and a first band electrode disposed on the first surface to be connected to the first connection electrode; a second external electrode including a second connection electrode, disposed on the fourth surface, and a second band electrode disposed on the first surface to be connected to the second connection electrode; a first insulating layer disposed on the first connection electrode; a second insulating layer disposed on the second connection electrode; a first plating layer disposed on the first band electrode; and a second plating layer disposed on the second band electrode, The first and second band electrodes include a conductive metal and a resin.

Abstract: An inductor component includes an element assembly; a coil inside the element assembly and helically wound along an axis; and first and second outer electrodes in the element assembly and electrically connected to the coil. The element assembly has insulating layers stacked along the axis. The coil has pieces of coil wiring stacked along the axis and via wiring extending along the axis and connecting the pieces of coil wiring adjacent in a direction of the axis. The pieces are each wound along a plane, are electrically connected in series in a helix, and have first and second coil wirings at a respective endmost on one and other sides in a direction parallel to the axis and respectively connected to the first and second outer electrodes. An end surface on the one side has an area smaller than that of an end surface on the other side.

Abstract: An electromagnetic component includes a magnetic core and a dual-winding arrangement inside the magnetic core structure. The dual-winding arrangement includes a first winding fabricated from an elongated conductor having a first thickness and defining a first inverted U-shaped main winding portion including out of plane axial bends, and a second winding fabricated from a conductor having a second thickness and being formed into a second inverted U-shaped main winding portion with perpendicular sections extending co-planar to one another without any out of plane axial bends.

Abstract: An electronic component module that includes a substrate, an inductor element, a single-sided functional component, a sealing resin, and an electromagnetic shield. The inductor element is mounted on the substrate. The single-sided functional component is mounted on a base ground conductor and a base signal conductor that are disposed on a side of the inductor element opposite to the substrate. The sealing resin has an insulating property and covers the inductor element, the base ground conductor, the base signal conductor, and the single-sided functional component. The electromagnetic shield covers the sealing resin, and a ground surface of the single-sided functional component.

Abstract: A coil component includes a core including a winding core portion and a first flange portion, a first wire and a second wire that are wound around the winding core portion in the same direction, and a first terminal electrode that is disposed on the first flange portion and that is connected to a first end portion of the first wire. The shape of an outer edge of the first terminal electrode includes a convex curve.

Abstract: The present disclosure provideds a side-view type semiconductor light emitting device of the disclosure includes a multilayer substrate having a plurality of substrates, a plurality of conductive layers, and a plurality of semiconductor light emitting elements. The multilayer substrate has a main surface on which the semiconductor light emitting elements are mounted, a back surface facing an opposite side of the main surface and having external electrodes formed thereon, and a mounting surface intersecting both the main surface and the back surface. The plurality of conductive layers have conductive exposed portions exposed from the mounting surface.

Abstract: A plurality of external electrodes are disposed on both ends of an element body. Each of the plurality of external electrodes includes a pair of electrode portions disposed on a pair of side surfaces and including a conductive resin layer. For each of the two conductive resin layers located on the same side surface, one conductive resin layer includes an edge opposing another conductive resin layer. The conductive resin layer includes a first region and a second region. The first region included a plurality of metal particles of a first content and a resin. The second region includes a plurality of metal particles of a second content smaller than the first content and a resin. The second region is located closer to the edge of the conductive resin layer than the first region, and includes the edge of the conductive resin layer.

Abstract: In a multilayer coil component, a coil is configured by electrically connecting coil conductors respectively provided in magnetic body layers constituting an element body and metal magnetic particles have a normal particle having an ellipsoidal shape and flat particles having an ellipsoidal shape flatter in a thickness direction than the normal particle. A plurality of the normal particles and at least one of the flat particles disposed such that a surface (reference surface) including a major axis direction orthogonal to the thickness direction and a minor axis direction is along the forming surface of the coil conductor in the magnetic body layer are arranged in the lamination direction of the magnetic body layers between the coil conductors.

Abstract: The disclosed technology generally relates to lithographically defined conductive lines for integrated circuit devices formed by plating, and more particularly to conductive lines shaped to reduce the magnitude of electric field in the electric field distributions around conductive lines of integrated and monolithic transformers and isolators.

Abstract: In a multilayer coil component, a part filled with a resin and a void part not filled with the resin exist between a plurality of metal magnetic particles in an element body, one main surface of the element body is a mounting surface with respect to an external electronic component, and the edge of an external electrode is positioned on the mounting surface. In the element body, a high void region where the porosity caused by the void part is higher than the porosity of the other part in the element body extends from the edge of the external electrode on the mounting surface toward an end surface of the element body.

Abstract: Provided is a semiconductor integrated circuit that improves insulation reliability between a high-voltage circuit and a low-voltage circuit. The semiconductor integrated circuit includes the following: a first circuit controlled by a control signal of low voltage and driven at a higher voltage; a second circuit configured to output the control signal to the first circuit to control the driving of the first circuit; and a plurality of insulation circuits each including an insulating element, the plurality of insulation circuits connecting between the first and the second circuits in series. Each insulation circuit is configured to magnetically or capacitively couple the control signal in the insulating element to transmit it from the second circuit to the first circuit, and is configured to insulate the first circuit from the second circuit in the insulating element to prevent the higher voltage from being applied from the first circuit to the second circuit.

Abstract: Disclosed is a motherboard comprising at least one printed circuit board (PCB), referred to as the motherboard PCB, at least one planar transformer, which is mounted on the motherboard PCB, and a plurality of electronic components, which are also mounted on the motherboard PCB. The planar transformer comprises at least one printed circuit board with windings and a connection interface, a magnetic core arranged on the printed circuit board so as to interact with the windings, and at least one electronic component mounted on the printed circuit board.

Abstract: A current sampling system, the system including a magnetic component, that is an inductor or a transformer that has at least one winding, where the at least one winding has a first part and a second part, where a first terminal of the first part is connected to a first terminal of the second part, and where a second terminal of the first part is separated from a second terminal of the second part, and a current detection circuit, where the second terminal of the second part is connected to the current detection circuit, and where the current detection circuit is configured to sample a current flowing through the second part, and obtain a total current of the winding based on the sampled current flowing through the second part and a preset ratio.

Abstract: A magnetic-component module includes a substrate, a header on the substrate, a core, a winding including a trace on the header, and an overmold material encapsulating the header, the core, and the trace.

Abstract: An inductor component comprising a spiral wiring wound on a plane; first and second magnetic layers located at positions sandwiching the spiral wiring from both sides in a normal direction relative to the plane of the wound spiral wiring; a vertical wiring extending from the spiral wiring in the normal direction to penetrate at least the inside of the first magnetic layer; and an external terminal disposed on at least a surface of the first magnetic layer to cover an end surface of the vertical wiring. The first magnetic layer is larger than the second magnetic layer in terms of the area of the external terminal viewed in the normal direction, and when A is the thickness of the first magnetic layer and B is the thickness of the second magnetic layer, A/((A+B)/2) is from 0.6 to 1.6.

Abstract: Described are microelectronic devices including an embedded microelectronic package for use as an integrated voltage regulator with a microelectronic system. The microelectronic package can include a substrate and a magnetic foil. The substrate can define at least one layer having one or more of electrically conductive elements separated by a dielectric material. The magnetic foil can have ferromagnetic alloy ribbons and can be embedded within the substrate adjacent to the one or more of electrically conductive elements. The magnetic foil can be positioned to interface with and be spaced from the one or more of electrically conductive element.

Abstract: A coil component includes: a core that includes a winding-core portion and a flange portion that is formed on an end surface of the winding-core portion; a wire that is wound around the winding-core portion; and an outer electrode that is formed on a bottom surface of the flange portion, to which an end portion of the wire is connected, and that includes a first metal layer that forms a surface of the outer electrode. At least a part of the end portion of the wire is embedded in the first metal layer.

Abstract: [Object] Provided is a printed circuit board ensuring a degree of freedom in circuit design and unlikely to cause a circuit connection failure. [Solving Means] A middle interlayer circuit 11, an upper surface side interlayer circuit 12, and a lower surface side interlayer circuit 13 are formed from a connection surface-less integral conductor. In addition, a connection surface 33 between the upper surface side interlayer circuit 12 and an upper surface side surface layer circuit 14 and a connection surface 34 between the lower surface side interlayer circuit 13 and a lower surface side surface layer circuit 15 lack a connection surface in a plate thickness direction, and thus a satisfactory connection state is achieved. Accordingly, a first circuit 10 is unlikely to cause a connection failure.

Abstract: A balun including first and second conductive tracks located vertically in line and at a distance from each other and having a same pattern.

Abstract: A coil component includes a body having a first surface and a first end surface and a second end surface each connected to the first surface and opposing each other, a support substrate disposed in the body, a coil unit including a first coil pattern, a first lead pattern and a second lead pattern respectively disposed on a first surface of the support substrate opposing the first surface of the body, first and second slit portions respectively disposed in edge portions between the first end surface and the second end surface of the body and exposing the first and second lead patterns, and first and second external electrodes arranged in the first and second slit portions and connected to the coil unit, wherein a ratio of a line width of any one of the first and second lead patterns to a line width of any one turn of the first coil pattern satisfies 1 to 1.5.

Abstract: An approach for reducing unwanted magnetic coupling with conductive elements by keeping the localized magnetic field in a transformer's or inductors magnetic gap far away from any conductive elements is provided. The approach includes the use of spacers to keep the localized magnetic field in a transformer's or inductor's magnetic gap far away from any conductive elements to reduce unwanted magnetic coupling with those conductive elements. The spacers can be made from materials including ferrite, conductors and non-conducting elements.

Abstract: An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes at a pair of multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surfaces and the board side surfaces. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of the multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. A mark portion is provided on one of the board main surfaces.

Abstract: A transformer is provided, including a core, a primary conductor, a magnetic member, and a secondary conductor. The core includes a central pillar and at least one lateral pillar. An accommodating space is formed between the central pillar and the lateral pillar. The primary conductor, the magnetic member, and the secondary conductor are disposed in the accommodating space. The primary conductor surrounds the central pillar. The magnetic member surrounds the primary conductor, and the secondary conductor surrounds the magnetic member. The magnetic member is disposed between the primary conductor and the secondary conductor, and is flexible.

Abstract: An electronic component that has fewer cracks during production is provided. The electronic component includes an outer electrode on a multilayer body, which includes an inner glass layer, a magnetic material layer on top and bottom surfaces of the inner glass layer, and an outer glass layer on top and bottom surfaces of the magnetic material layer. The insulating layers of the inner glass layer and the outer glass layers contain a dielectric glass material that contains a glass material containing at least K, B, and Si, quartz, and alumina. The glass material content of each insulating layer of the inner glass layer ranges from approximately 60%-65% by weight, the quartz content of each insulating layer of the inner glass layer ranges from approximately 34%-37% by weight, and the alumina content of each insulating layer of the inner glass layer ranges from approximately 0.5%-4% by weight.