Printed Circuit-type Coil Patents (Class 336/200)
  • Patent number: 11367560
    Abstract: An inductor is laid out on a multi-layer structure, the inductor having a multi-turn coil including a plurality of metal traces laid out on at least two metal layers and a plurality of vias configured to provide inter-layer connection, wherein the multi-turn coil includes a first half configured to conduct a current flow between a first end and a center tap and a second half configured to conduct a current flow between a second end and the center tap; and an additional metal laid out on a metal layer below a lowest metal layer of the multi-turn coil, wherein the additional metal is laid out beneath the first half if the second half has a greater parasitic capacitance, or alternatively beneath the second half if the first half has a greater parasitic capacitance.
    Type: Grant
    Filed: March 30, 2021
    Date of Patent: June 21, 2022
    Assignee: REALTEK SEMICONDUCTOR CORP.
    Inventor: Chia-Liang (Leon) Lin
  • Patent number: 11368092
    Abstract: Embodiments are disclosed of a multiphase converter that includes a main switch circuit, an active clamp circuit, a voltage multiplier cell, and an output capacitor. The main switch circuit includes a primary winding of a first coupled inductor; a primary winding of a second coupled inductor connected in parallel with the primary winding of the first coupled inductor and in parallel with an input voltage; a first switch connected between the primary winding of the first coupled inductor and the input voltage; and a second switch connected between the primary winding of the second coupled inductor and the input voltage. The active clamp circuit includes a third switch, a fourth switch, and a first capacitor. The voltage multiplier cell includes a secondary winding of the first coupled inductor, a secondary winding of the second coupled inductor, a second capacitor, a first diode, the first capacitor, and the third switch.
    Type: Grant
    Filed: July 6, 2020
    Date of Patent: June 21, 2022
    Assignee: BAIDU USA LLC
    Inventors: Huawei Yang, Tianyi Gao
  • Patent number: 11367552
    Abstract: An inductor component comprising a spiral wiring wound on a plane; first and second magnetic layers located at positions sandwiching the spiral wiring from both sides in a normal direction relative to the plane of the wound spiral wiring; a vertical wiring extending from the spiral wiring in the normal direction to penetrate at least the inside of the first magnetic layer; and an external terminal disposed on at least a surface of the first magnetic layer to cover an end surface of the vertical wiring. The first magnetic layer is larger than the second magnetic layer in terms of the area of the external terminal viewed in the normal direction, and when A is the thickness of the first magnetic layer and B is the thickness of the second magnetic layer, A/((A+B)/2) is from 0.6 to 1.6.
    Type: Grant
    Filed: July 19, 2018
    Date of Patent: June 21, 2022
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yoshimasa Yoshioka, Ryuichiro Tominaga, Akinori Hamada
  • Patent number: 11367557
    Abstract: The structure includes a semiconductor chip connected to a substrate via one or more solder balls. The semiconductor chip includes one or more on-chip metal winding. The structure includes a first ferromagnetic core. The first ferromagnetic core is located below the semiconductor chip and above the substrate. The structure includes a second ferromagnetic core. The second ferromagnetic core is located above the semiconductor chip. The first ferromagnetic core and the second ferromagnetic core create a magnetic loop.
    Type: Grant
    Filed: December 16, 2019
    Date of Patent: June 21, 2022
    Assignee: International Business Machines Corporation
    Inventors: Xin Zhang, Todd Edward Takken
  • Patent number: 11367559
    Abstract: The inventors have newly found that, even when a composition of a first element body portion and a composition of a second element body portion are different from each other, a high bonding strength at an interface between the first element body portion and the second element body portion can be obtained when both the first element body portion and the second element body portion contain Zn2SiO4 as a constituent component. That is, when the first element body portion and the second element body portion contain Zn2SiO4, a bonding strength at the interface is improved compared to a case in which the first element body portion and the second element body portion do not contain Zn2SiO4.
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: June 21, 2022
    Assignee: TDK CORPORATION
    Inventors: Takahiro Sato, Hitoshi Kudo, Takashi Suzuki, Kouichi Kakuda, Tatsuro Suzuki, Hiroyuki Tanoue
  • Patent number: 11361896
    Abstract: An ultra-high coupling factor transformer has a plurality of conductive layers, a primary winding inductor, and a secondary winding inductor. The primary winding inductor is defined by a plurality of turns and disposed on a first one of the plurality of conductive layers and extends to a second one of the plurality of conductive layers. The secondary winding inductor is defined by a plurality of turns and disposed on the first one of the plurality of conductive layers and extends to the second one of the plurality of conductive layers. The primary winding is vertically and horizontally cross coupled with the secondary winding inductor, and defines a mutual coupling inductance from surrounding directions.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: June 14, 2022
    Assignee: SKYWORKS SOLUTIONS, INC.
    Inventors: Lisette L. Zhang, Oleksandr Gorbachov
  • Patent number: 11360162
    Abstract: The present invention relates to a device for measuring a magnetic field and, more specifically, for measuring direct and/or alternating currents circulating in a primary conductor. The current sensor 1 according to the invention comprises: •at least two magnetic transducers 2, 3, each comprising at least one elongate coil 5, 6, forming a loop surrounding the primary conductor; •at least one loop closure mechanism allowing two ends of the coils 5, 6 of a transducer 2, 3 to be retained while providing: —a negative mechanical gap between the two ends of the coils 5, 6 closing each loop, along a first elongation axis Y of the coils 5, 6; an offset of each end of a coil 5, 6 of a loop relative to the other end of a coil of the loop, along an offset axis X; —a mechanical inversion of the offsets between the loops.
    Type: Grant
    Filed: June 14, 2018
    Date of Patent: June 14, 2022
    Assignee: NEELOGY
    Inventor: Lionel Cima
  • Patent number: 11361889
    Abstract: Embodiments are directed to a method of forming a laminated magnetic inductor and resulting structures having multiple magnetic layer thicknesses. A first magnetic stack having one or more magnetic layers alternating with one or more insulating layers is formed in a first inner region of the laminated magnetic inductor. A second magnetic stack is formed opposite a major surface of the first magnetic stack in an outer region of the laminated magnetic inductor. A third magnetic stack is formed opposite a major surface of the second magnetic stack in a second inner region of the laminated magnetic inductor. The magnetic layers are formed such that a thickness of a magnetic layer in each of the first and third magnetic stacks is less than a thickness of a magnetic layer in the second magnetic stack.
    Type: Grant
    Filed: January 28, 2020
    Date of Patent: June 14, 2022
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Hariklia Deligianni, Bruce B. Doris, Eugene J. O'Sullivan, Naigang Wang
  • Patent number: 11348719
    Abstract: A multilayer inductor component includes an element body that is an insulator and a coil in which a plurality of coil conductor layers that extend along planes in the element body are electrically connected to each other. Also, each of the coil conductor layers includes metal part and glass part, and the glass part include internal glass portion that is entirely included in the metal part.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: May 31, 2022
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Tomohiro Kido, Masahiro Kubota, Tomonori Sakata, Kenta Kondo, Shimpei Tanabe, Yoshiyuki Oota
  • Patent number: 11342107
    Abstract: A chip electronic component includes a magnetic body including first magnetic metal particles, internal coil portions embedded within the magnetic body, and insulation resistance layers disposed on upper and lower surfaces of the magnetic body and including second magnetic metal particles having an oxide coating.
    Type: Grant
    Filed: June 19, 2018
    Date of Patent: May 24, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Kwang Sun Choi
  • Patent number: 11342108
    Abstract: Techniques regarding one or more NFC antennas that can comprise vertically stacked coils of electrically conductive material are provided. For example, one or more embodiments described herein can comprise an apparatus, which can comprise can a first substrate layer that can comprise a first coil of electrically conductive material that can be wound in a first direction. The apparatus can also comprise a second substrate layer that can comprise a second coil of electrically conductive material that can be wound in a second direction opposite the first direction. The first substrate layer can be stacked onto the second substrate layer. Also, the first coil of electrically conductive material can be operably coupled to the second coil of electrically conductive material through an interconnection via to form an NFC antenna.
    Type: Grant
    Filed: May 11, 2018
    Date of Patent: May 24, 2022
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Bo Wen, Bing Dang, Rajeev Narayanan
  • Patent number: 11336188
    Abstract: Provided is a power conversion circuit for achieving a power conversion device capable of suppressing charging/discharging of a parasitic capacitor caused by high-frequency switching, and of reducing a loss of a semiconductor switching element. The power conversion circuit includes: a circuit board including a plurality of layers including two or more layers, on which circuit patterns are formed; and a plurality of semiconductor switching elements connected to the circuit patterns of the circuit board, and configured to perform switching for power conversion. In the circuit board, a plurality of control ground patterns for different nodes, which are configured to drive the plurality of semiconductor switching elements, are arranged so as not to overlap one another in plan view.
    Type: Grant
    Filed: April 10, 2018
    Date of Patent: May 17, 2022
    Assignee: Mitsubishi Electric Corporation
    Inventor: Kei Hayase
  • Patent number: 11335494
    Abstract: A planar transformer is disclosed. The planar transformer includes a first core, a second core, a third core, and a fourth core, which are sequentially disposed; a primary coil unit having multiple primary substrates through which the first to fourth cores penetrate and on which primary coil patterns are formed such that magnetic flux is generated in a first direction in the first and fourth cores and in a second direction in the second and third cores; and a secondary coil unit having multiple secondary substrates through which the first to fourth cores penetrate and on which secondary coil patterns are formed, the secondary coil patterns formed on a periphery of the first to fourth cores such that current induced by the magnetic flux flowing in the first to fourth cores flows therein, wherein the multiple primary and secondary substrates form a multi-layer structure.
    Type: Grant
    Filed: July 12, 2019
    Date of Patent: May 17, 2022
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: In Yong Yeo, Tae Jong Ha, Dae Woo Lee, Youn Sik Lee
  • Patent number: 11328857
    Abstract: A high-voltage isolation withstand planar transformer and its high-voltage insulation method are provided. An insulating medium is provided between low-voltage windings and high-voltage windings. High-frequency current flows through the windings and generates a high-frequency alternating magnetic field to achieve isolated energy transmission. The low-voltage windings are connected to low-voltage side connection terminals, and the high-voltage windings are connected to high-voltage side connection terminals through a high-voltage winding leading-out foil. An annular hollow part of the low-voltage windings and the high-voltage windings is provided with a magnetic core. A stress grading method is provided to control the distribution of the electric field around the high-voltage winding leading-out foil. A voltage-balancing element group provides a voltage potential with a gradient change between the high-voltage winding leading-out foil and the low-voltage windings.
    Type: Grant
    Filed: September 23, 2021
    Date of Patent: May 10, 2022
    Assignee: INSTITUTE OF ELECTRICAL ENGINEERING, CHINESE ACADEMY OF SCIENCES
    Inventors: Guoen Cao, Yibo Wang, Yong Zhao, Jianhong Guo
  • Patent number: 11330713
    Abstract: A printed wiring board includes an insulating substrate having openings, a first conductor layer formed on a first surface of the insulating substrate, a second conductor layer formed on a second surface of the insulating substrate, magnetic material portions formed in the openings of the insulating substrate and having through holes extending from the first surface to second surface of the insulating substrate, and through-hole conductors formed on side walls of the through holes such that the through-hole conductors connect the first conductor layer and second conductor layer. The magnetic material portions include magnetic particles and resin such that the magnetic particles include particles forming the side walls and that gaps are formed between the particles and the resin, and each of the through-hole conductors includes a chemical copper plating film such that the chemical copper plating film is deposited in the gaps formed between the particles and the resin.
    Type: Grant
    Filed: April 14, 2021
    Date of Patent: May 10, 2022
    Assignee: IBIDEN CO., LTD.
    Inventors: Satoru Kawai, Yasuki Kimishima
  • Patent number: 11322284
    Abstract: A high-frequency transformer includes a primary coil and a secondary coil coupled to each other by magnetic field coupling and sharing a coil winding axis, a first terminal connected to a first end of the primary coil, a second terminal connected to a first end of the secondary coil, and a common terminal connected to a second end of the primary coil and a second end of the secondary coil. The primary and secondary coils are helical coils including loop conductor patterns, and the number of turns of a first loop conductor pattern closest to the second end of the primary coil is larger than an average number of turns of other loop conductor patterns included in the primary coil.
    Type: Grant
    Filed: October 15, 2018
    Date of Patent: May 3, 2022
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Noriyuki Ueki
  • Patent number: 11322290
    Abstract: Techniques are provided for an inductor at a first level interface between a first die and a second die. In an example, the inductor can include a winding and a core disposed inside the winding. The winding can include first conductive traces of a first die, second conductive traces of a second die, and a plurality of connectors configured to connect the first die with the second die. Each connector of the plurality of connecters can be located between a trace of the first conductive traces and a corresponding trace of the second conductive traces.
    Type: Grant
    Filed: June 19, 2018
    Date of Patent: May 3, 2022
    Assignee: Intel Corporation
    Inventors: Cheng Xu, Yikang Deng, Kyu Oh Lee, Ji Yong Park, Srinivas Pietambaram, Ying Wang, Chong Zhang, Rui Zhang, Junnan Zhao
  • Patent number: 11320489
    Abstract: According to the embodiment, a field winding interlayer short-circuit detection apparatus comprises: a field winding resistance calculator to calculate, for a field winding of a rotating electrical machine, a field winding resistance calculated value from a detected value of a field winding current and a detected value of a field winding voltage; a determiner to determine presence or absence of an interlayer short-circuit in the field winding by using a comparison result between the field winding resistance calculated value and the reference resistance value.
    Type: Grant
    Filed: July 27, 2020
    Date of Patent: May 3, 2022
    Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ENERGY SYSTEMS & SOLUTIONS CORPORATION
    Inventors: Toshio Hirano, Yoshihiro Taniyama, Masafumi Fujita, Koji Ando, Yoshinori Torii
  • Patent number: 11322292
    Abstract: A coil component includes a body, a coil conductor embedded in the body, and outer electrodes disposed on the outside of the body. The body includes a first magnetic layer containing a substantially spherical metallic magnetic material and second and third layers containing a substantially flat metallic magnetic material. At least the wound section of the coil conductor is between the second and third magnetic layers in the direction along the axis of the coil conductor. In the direction perpendicular to the axis, the second and third magnetic layers have a width equal to or larger than the outer diameter of the wound section of the coil component. The substantially flat metallic magnetic material is oriented so that the flat plane thereof is perpendicular to the axis of the coil conductor. The first magnetic layer extends between the second and third magnetic layers and the outer electrodes.
    Type: Grant
    Filed: December 7, 2018
    Date of Patent: May 3, 2022
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Mikito Sugiyama, Mitsuru Odahara, Takuya Ishida, Hideaki Ooi, Takao Kawachi
  • Patent number: 11315724
    Abstract: An inductor includes: a body in which a plurality of insulating layers having a plurality of coil patterns each disposed on each of the plurality of insulating layers are stacked; and first and second external electrodes disposed on an exterior surface of the body, wherein the body further includes a through-hole, and at least one portion of an inner surface of the plurality of coil patterns is exposed through the through-hole.
    Type: Grant
    Filed: October 3, 2018
    Date of Patent: April 26, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Yong Sun Park
  • Patent number: 11315719
    Abstract: A manufacturing method of a coil component includes: forming a plating resist on an internal insulating layer; forming a coil pattern and a lead pattern connected to the coil pattern and at least partially having a thickness smaller than that of the coil pattern by plating; removing the plating resist; and stacking a magnetic sheet on the internal insulating layer to form a body.
    Type: Grant
    Filed: December 7, 2018
    Date of Patent: April 26, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jeong Gu Yeo, Jae Hun Kim
  • Patent number: 11310908
    Abstract: A power supply circuit board includes a substrate, a first line that is provided on a first main surface of the substrate and that has a land, a second line that is provided on the first main surface of the substrate and that has a land, an inductor that is connected to the land of the first line and the land of the second line and that is made of a ferrite material, and an open stub that is connected to at least one of the first line and the second line.
    Type: Grant
    Filed: June 15, 2020
    Date of Patent: April 19, 2022
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Masashi Omuro, Yu Ishiwata, Yasuhisa Yamamoto
  • Patent number: 11309120
    Abstract: Present disclosure relates to a transformer structure. The transformer structure includes a first inductor and a second inductor. The first inductor has first turns and second turns. The second inductor has third turns and fourth turns. The first turns of the first inductor and the third turns of the second inductor are mutually disposed in a first area of a first metal layer. The second turns of the first inductor and the fourth turns of the second inductor are mutually disposed in a second area of the first metal layer. The first area is adjacent to the second area.
    Type: Grant
    Filed: October 19, 2018
    Date of Patent: April 19, 2022
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventor: Hsiao-Tsung Yen
  • Patent number: 11309119
    Abstract: An on-chip balun transformer including a primary winding and a secondary winding is provided. The primary winding includes at least one parallel coil and a plurality of first serial semi-turn coils connected to the at least one parallel coil. The secondary winding, magnetically coupled to the primary winding, includes a plurality of second serial semi-turn coils connected to each other. At least one of the second serial semi-turn coils is located within the at least one parallel coil. The primary winding and the secondary winding are coplanar.
    Type: Grant
    Filed: July 13, 2018
    Date of Patent: April 19, 2022
    Assignee: AIROHA TECHNOLOGY CORP.
    Inventors: Kuo-Yu Tseng, Shih-Chieh Chien
  • Patent number: 11309116
    Abstract: An electronic component with a plurality of coil conductor layers laminated such that a coil conductor having a coil pattern on a surface of an insulation layer is formed on each of the plurality of coil conductor layers. The electronic component includes a laminated body in which a bottom face side extended electrode layer, a primary coil conductor layer including a primary coil conductor, a secondary coil conductor layer including a secondary coil conductor, a tertiary coil conductor layer including a tertiary coil conductor, a parallel primary coil conductor layer including a parallel primary coil conductor, and a top face side extended electrode layer are laminated in this order. The electronic component further includes first through sixth external electrodes on a surface of the laminated body, which are connected to the primary, secondary, tertiary and parallel primary coil conductors.
    Type: Grant
    Filed: November 27, 2018
    Date of Patent: April 19, 2022
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Kouhei Matsuura, Morihiro Hamano, Keiichi Tsuduki
  • Patent number: 11309121
    Abstract: An inductor includes a coil configured in an open loop topology with a first multi-finger end and a second multi-finger end, wherein the fingers of the first end are disposed in interdigitating fashion with the fingers of the second end, and laid out on a first metal layer of a multi-layer structure; a plurality of pairs of metal strips laid out on a second metal layer of the multi-layer structure, wherein each of said plurality of pairs of metal strips comprises a first metal strip intersecting the first multi-finger end as seen from a top view and connecting to the first multi-finger end through a first set of vias, and a second metal strip intersecting the second multi-finger end as seen from the top view and connecting to the second multi-finger end through a second set of vias.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: April 19, 2022
    Assignee: REALTEK SEMICONDUCTOR CORP.
    Inventor: Chia-Liang (Leon) Lin
  • Patent number: 11302471
    Abstract: An integrated transformer includes a primary winding and a secondary winding each having a spiral planar arrangement coils. A dielectric portion of dielectric material is interposed between the primary winding and the secondary winding. A field plate winding is electrically coupled with the primary winding. The field plate winding includes at least one field plate coil having a first lateral extension greater than a second lateral extension of a primary outer coil of the primary winding. The field plate coil is superimposed in plan view to the primary outer coil of the primary winding.
    Type: Grant
    Filed: January 16, 2020
    Date of Patent: April 12, 2022
    Assignee: STMicroelectronics S.r.l.
    Inventors: Vincenzo Palumbo, Gabriella Ghidini, Enzo Carollo, Fabrizio Fausto Renzo Toia
  • Patent number: 11295890
    Abstract: A coil component includes a body; a first substrate disposed inside of the body, and a second substrate, disposed below the first substrate; a first coil layer disposed on an upper surface of the first substrate; a second coil layer disposed between the first substrate and the second substrate; a third coil layer disposed on a lower surface of the second substrate; a conductive via passing through the first substrate and connecting the first coil layer and the second coil layer to each other; a connection electrode disposed outside of the body and connecting the second coil layer and the third coil layer to each other; a first external electrode disposed outside of the body and connected to the first coil layer; and a second external electrode disposed outside of the body and connected to the third coil layer.
    Type: Grant
    Filed: August 6, 2019
    Date of Patent: April 5, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dong Jin Lee, Dong Hwan Lee, Young Ghyu Ahn, Chan Yoon, Won Chul Sim
  • Patent number: 11289264
    Abstract: An inductor includes a body in which a plurality of insulating layers on which a plurality of coil patterns are arranged are stacked, and first and second external electrodes disposed on an external surface of the body, wherein the plurality of coil patterns are connected through coil connecting portions and include coil patterns disposed on an outer side and coil patterns disposed on an inner side thereof, a coil pattern disposed on the inner side adjacent to the coil pattern disposed on the outer side includes two coil connecting portions spaced apart from each other and facing each other in a length direction of the body, and a dummy electrode pattern is further disposed in a void portion between two coil connecting portions.
    Type: Grant
    Filed: November 14, 2018
    Date of Patent: March 29, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Jun Lim, Yeong Min Jeong, Kyung Ho Lee, Han Kim, Sang Jong Lee, Su Bong Jang
  • Patent number: 11289258
    Abstract: In a high-frequency transformer element includes a primary coil including first coil conductors and a secondary coil including second coil conductors are disposed in a multilayer body that includes a plurality of insulating layers. A magnetic-field cancellation conductor pattern is disposed in the multilayer body, is adjacent to some conductors of the first coil conductors in a lamination direction of the insulating layers, is arranged along a surface of the insulating layers, and allows a high-frequency current to flow in a direction opposite a high-frequency current flowing in the first coil conductors.
    Type: Grant
    Filed: August 21, 2017
    Date of Patent: March 29, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Akira Ochiai, Kenichi Ishizuka
  • Patent number: 11289266
    Abstract: A multilayer coil component includes a body including laminated ferrite layers, a coil conductor including conductive layers laminated in the body, and a pair of outer electrodes. Each of the outer electrodes is electrically connected to a corresponding one of end portions of the coil conductor. At least one of the conductive layers has a constricted portion at an end portion thereof. Each of the conductive layers includes a first conductive layer and a second conductive layer. The first conductive layer has a thickness different from the second conductive layer.
    Type: Grant
    Filed: January 10, 2019
    Date of Patent: March 29, 2022
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Katsuhisa Imada
  • Patent number: 11289965
    Abstract: A resin multilayer substrate includes a stacked body including resin layers, and a coil including coil conductor patterns provided on two or more resin layers. The coil conductor patterns include a coil conductor pattern including a parallel conductor portion. The parallel conductor portion includes linear conductor patterns connected in parallel that are parallel to each other, and is provided at least at a portion of an outermost peripheral portion of the coil conductor pattern. A total line width of the linear conductor patterns of the parallel conductor portion is larger than a line width of other portions of the coil conductor pattern.
    Type: Grant
    Filed: September 1, 2020
    Date of Patent: March 29, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Shingo Ito
  • Patent number: 11282631
    Abstract: A magnetic core is situated in a cavity routed into an insulating substrate. The cavity and magnetic core are coved with a first insulating layer. Through holes are then formed through the first insulating layer and the insulating substrate, and plated to form conductive vias. Metallic traces are added to the exterior surfaces of the first insulating layer and the insulating substrate to form upper and lower winding layers. The metallic traces and conductive vias define the respective primary and secondary side windings for an embedded transformer. At least a second set of the outer conductive vias, are spaced farther from the cavity than a first set, and have greater via hole diameter than the vias in the first set. This reduces the resistance of the windings for a given substrate size and improves the performance of the device.
    Type: Grant
    Filed: July 3, 2019
    Date of Patent: March 22, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Lee Francis
  • Patent number: 11282629
    Abstract: The multilayer inductor includes a multilayer body including a plurality of insulating layers laminated in a lamination direction, and a plurality of coil groups arranged in the multilayer body along the lamination direction and connected in series. Each of the coil groups includes a plurality of coil patterns respectively provided on the insulating layers and laminated in the lamination direction, and is configured by connecting a plurality of pattern groups in series. Each of the pattern groups is formed by connecting n (n is a positive integer) coil patterns in parallel. The number of parallels n of at least one of the coil groups is different from the number of parallels n of another coil group. The insulating layers include magnetic and non-magnetic insulating layers. At least one of the insulating layers adjacent to one of the coil patterns is the non-magnetic insulating layer.
    Type: Grant
    Filed: June 15, 2018
    Date of Patent: March 22, 2022
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Kouji Yamauchi, Toshihiko Fukushima, Hideo Ajichi
  • Patent number: 11282623
    Abstract: A coil component comprising a first coil conductor layer wound on a plane, a lead-out conductor led out on the same plane as the first coil conductor layer from an outer-circumferential end of the first coil conductor layer, an insulating layer laminated on the first coil conductor layer and the lead-out conductor, and a second coil conductor layer laminated on the insulating layer and wound on a plane. The first coil conductor layer and the second coil conductor layer concentrically overlap with each other when viewed in a lamination direction, and the lead-out conductor has a connecting portion connected to the first coil conductor layer and provided with a coil extension part extending to overlap with the second coil conductor layer when viewed in the lamination direction.
    Type: Grant
    Filed: July 13, 2018
    Date of Patent: March 22, 2022
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Ryo Okura, Yoichi Nakatsuji, Kosuke Ishida
  • Patent number: 11282637
    Abstract: An inductor includes a body including a substrate, a coil portion, including a top coil and a bottom coil disposed on one surface and the other surface of the substrate, respectively, and an encapsulation portion encapsulating the substrate and the coil portion, a first terminal electrode, disposed on a bottom surface of the body and connected to the top coil, and a second terminal electrode disposed on the bottom surface of the body and connected to the bottom coil, a third terminal electrode disposed between the first and second terminal electrodes and disposed on the bottom surface of the body, and a shielding layer disposed to cover the body. The shielding layer is connected to the third terminal electrode.
    Type: Grant
    Filed: March 18, 2019
    Date of Patent: March 22, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Gun Woo Koo, Sung Min Song, Hwan Soo Lee
  • Patent number: 11282632
    Abstract: A power module comprises a first circuit board assembly, a second circuit board assembly and a magnetic assembly. The first circuit board assembly comprises a first printed circuit board and at least one power circuit. The second circuit board assembly comprises a second printed circuit board and at least one output capacitor. The magnetic assembly is located between the first circuit board assembly and the second circuit board assembly and comprises a magnetic core module and at least one first electrical conductor. The magnetic core module comprises at least one hole. The at least one first electrical conductor passes through the corresponding hole of the magnetic core module to define at least one output inductor. Each of the at least one output inductor is electrically connected with the corresponding power circuit and the at least one output capacitor so that the power module forms at least one phase converter.
    Type: Grant
    Filed: October 2, 2019
    Date of Patent: March 22, 2022
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Yahong Xiong, Da Jin, Qinghua Su
  • Patent number: 11282638
    Abstract: Various embodiments of inductor coils, antennas, and transmission bases configured for wireless electrical energy transmission are provided. These embodiments are configured to wirelessly transmit or receive electrical energy or data via near field magnetic coupling. The embodiments of inductor coils comprise a figure eight configuration that improve efficiency of wireless transmission efficiency. The embodiments of the transmission base are configured with at least one transmitting antenna and a transmitting electrical circuit positioned within the transmission base. The transmission base is configured so that at least one electronic device can be wirelessly electrically charged or powered by positioning the at least one device in contact with or adjacent to the transmission base.
    Type: Grant
    Filed: May 25, 2018
    Date of Patent: March 22, 2022
    Assignee: NuCurrent, Inc.
    Inventors: Jason Luzinski, Oleg Los
  • Patent number: 11282630
    Abstract: A common mode choke coil includes a body, a first spiral conductor, a second spiral conductor, a first extension conductor, and a second extension conductor. The thickness of the first extension conductor is equal to or less than (thickness of the first spiral conductor)/(winding number of the first spiral conductor), and the width of the first extension conductor is equal to or more than (width of the first spiral conductor)×(thickness of the first spiral conductor)/(thickness of the first extension conductor). The thickness of the second extension conductor is equal to or less than (thickness of the second spiral conductor)/(winding number of the second spiral conductor), and the width of the second extension conductor is equal to or more than (width of the second spiral conductor)×(thickness of the second spiral conductor)/(thickness of the second extension conductor).
    Type: Grant
    Filed: April 3, 2019
    Date of Patent: March 22, 2022
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Koichi Yamaguchi, Masashi Hattori
  • Patent number: 11270836
    Abstract: An inductor includes a body in which a plurality of insulating layers on which a plurality of coil patterns are respectively disposed are stacked, and first and second external electrodes disposed on an external surface of the body. The plurality of coil patterns are connected to each other by coil connecting portions and opposing ends thereof are connected to the first and second external electrodes through coil lead portions, respectively, to form a coil. The plurality of coil patterns include coil patterns disposed on outermost sides of the body and coil patterns disposed on an inner side thereof. The coil patterns arranged on the inner side are connected in parallel. At least one of gaps between the coil patterns arranged on the inner side is greater than a gap between other remaining coil patterns.
    Type: Grant
    Filed: November 13, 2018
    Date of Patent: March 8, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Soo Park, Hwi Dae Kim, Young Ghyu Ahn
  • Patent number: 11270937
    Abstract: An integrated circuit (IC) package comprises a semiconductor die, a leadframe comprising a plurality of leads coupled to bond pads on the semiconductor die, and an electrically conductive member electrically coupled to the leadframe. A magnetic mold compound encapsulates the electrically conductive member to form an inductor. A non-magnetic mold compound encapsulates the semiconductor die, the leadframe, and the magnetic mold compound.
    Type: Grant
    Filed: December 26, 2018
    Date of Patent: March 8, 2022
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Dongbin Hou, Steven Alfred Kummerl, Roberto Giampiero Massolini, Joyce Marie Mullenix
  • Patent number: 11270986
    Abstract: This disclosure describes techniques to provide a regulator circuit using a component-on-top (CoP) package. The CoP package comprising a system-in-package (SIP) comprising regulator circuitry, the SIP having a top portion and a first side portion; and an inductor on the top portion of the SIP, wherein: the inductor is coupled to the regulator circuitry via the top portion of the SIP; and a first end of the inductor extends beyond the first side portion of the SIP.
    Type: Grant
    Filed: August 20, 2020
    Date of Patent: March 8, 2022
    Assignee: Analog Devices, Inc.
    Inventors: Ahmadreza Odabaee, John David Brazzle, Zafer Kutlu, Zhengyang Liu, George Anthony Serpa
  • Patent number: 11270833
    Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.
    Type: Grant
    Filed: February 13, 2020
    Date of Patent: March 8, 2022
    Assignee: TDK CORPORATION
    Inventors: Masashi Shimoyasu, Shinichi Sato, Seiichi Nakagawa, Mamoru Kawauchi, Shigetoshi Kinouchi, Mitsuru Ito
  • Patent number: 11271490
    Abstract: An improved distributed-output multi-cell-element power converter utilizes a multiplicity of magnetic core elements, switching elements, capacitor elements and terminal connections in a step and repeat pattern. Stepped secondary-winding elements reduce converter output resistance and improve converter efficiency and scalability to support the high current requirements of very large scale integrated (“VLSI”) circuits.
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: March 8, 2022
    Assignee: Vicor Corporation
    Inventor: Patrizio Vinciarelli
  • Patent number: 11264836
    Abstract: A power unit and method of manufacturing a power unit. The power unit may include one or more inductors arranged in an alternating pole configuration. The inductors are attached to a circuit board to form an electrical generator configured to provide electrical energy to a wireless charger. The wireless charger may be detached from the generator.
    Type: Grant
    Filed: May 2, 2018
    Date of Patent: March 1, 2022
    Inventors: Rabia Ahmad Mughal, Zaid Ahmad Mughal
  • Patent number: 11264161
    Abstract: A coil electronic component includes a support substrate, a coil pattern disposed on at least one surface of the support substrate, a lead-out pattern disposed on at least one surface of the support substrate to be connected to the coil pattern, an encapsulant disposed to encapsulate the support substrate, the coil pattern, and at least one portion of the lead-out pattern, and an external electrode disposed on an external surface of the encapsulant to be connected to the lead-out pattern. The lead-out pattern includes a slit disposed on a side of a region facing the external electrode. The slit is exposed in a direction toward the external electrode and in a direction away from the support substrate, on the basis of a thickness direction of the support substrate, and is not connected to the support substrate.
    Type: Grant
    Filed: February 21, 2019
    Date of Patent: March 1, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chan Yoon, Dong Hwan Lee, Dong Jin Lee, Young Ghyu Ahn
  • Patent number: 11257759
    Abstract: According to an aspect, a semiconductor device for integrating multiple transistors includes a wafer substrate including a first region and a second region, where the first region defines at least a portion of at least one first transistor and the second region defines at least a portion of at least one second transistor. The semiconductor device includes an isolation area located between the first region and the second region, at least one conductive pad of the at least one first transistor contacting the first region of the wafer substrate, at least one conductive pad of the at least one second transistor contacting the second region of the wafer substrate, a backplate coupled to the wafer substrate, and an encapsulation material, where the encapsulation material has a portion contacting the backplate, and the encapsulation material includes a portion located within the isolation area.
    Type: Grant
    Filed: October 26, 2020
    Date of Patent: February 22, 2022
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Francis J. Carney, Yusheng Lin, Takashi Noma
  • Patent number: 11257615
    Abstract: Disclosed herein is a coil component that includes a substrate having a first surface and a first spiral coil spirally wound in a plurality of turns formed on the first surface of the substrate. Each of the turns has a first circumference region in which a radial position is substantially fixed and a first shift region in which a radial position is shifted. Each of inner and outer peripheral ends of the first spiral coil is positioned at the first shift region.
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: February 22, 2022
    Assignee: TDK CORPORATION
    Inventors: Shigeru Kaneko, Toshio Tomonari
  • Patent number: 11244784
    Abstract: An inductor includes a body including a substrate, a coil portion, including a top coil and a bottom coil disposed on one surface and the other surface of the substrate, respectively, and an encapsulation portion encapsulating the substrate and the coil portion, a first terminal electrode, disposed on a bottom surface of the body and connected to the top coil, and a second terminal electrode disposed on the bottom surface of the body and connected to the bottom coil, a third terminal electrode disposed between the first and second terminal electrodes and disposed on the bottom surface of the body, and a shielding layer disposed to cover the body. The shielding layer is connected to the third terminal electrode.
    Type: Grant
    Filed: March 18, 2019
    Date of Patent: February 8, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Gun Woo Koo, Sung Min Song, Hwan Soo Lee
  • Patent number: 11239020
    Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.
    Type: Grant
    Filed: February 13, 2020
    Date of Patent: February 1, 2022
    Assignee: TDK CORPORATION
    Inventors: Masashi Shimoyasu, Shinichi Sato, Seiichi Nakagawa, Mamoru Kawauchi, Shigetoshi Kinouchi, Mitsuru Ito