Printed Circuit-type Coil Patents (Class 336/200)
  • Patent number: 10712371
    Abstract: A power inductor includes: a body including a magnetic material; an internal coil disposed in the body and including a plurality of coil patterns; and a sensing coil disposed on the body and facing the internal coil.
    Type: Grant
    Filed: October 23, 2017
    Date of Patent: July 14, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Sang Jin Park
  • Patent number: 10714434
    Abstract: An embedded magnetic inductor coil is at least partially exposed in a recess that seats an embedded multi-chip interconnect bridge die on the coil. The embedded multi-chip interconnect bridge die provides a communications bridge between a dominant semiconductive device and a first semiconductive device.
    Type: Grant
    Filed: December 29, 2018
    Date of Patent: July 14, 2020
    Assignee: Intel Corporation
    Inventors: Srinivas V. Pietambaram, Kristof Darmawikarta, Aleksandar Aleksov
  • Patent number: 10715041
    Abstract: An inductor component includes a composite body that includes a plurality of composite layers each including a composite material of an inorganic filler and a resin; and a plurality of spiral wires that each are stacked on the composite layer, the spiral wires each being covered with the other composite layer. The average particle diameter of the inorganic filler is equal to or smaller than 5 ?m, the wire pitch of the spiral wires is equal to or smaller than 10 ?m, and the interlayer pitch between adjacent spiral wires is equal to or smaller than 10 ?m.
    Type: Grant
    Filed: September 28, 2016
    Date of Patent: July 14, 2020
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Akinori Hamada, Yoshimasa Yoshioka, Hayami Kudo, Shinji Yasuda
  • Patent number: 10714254
    Abstract: An electronic component includes a body, a first inductor, and a low expansion portion. The body includes a laminated body including a plurality of insulating layers laminated in a lamination direction. The insulating layers contain a first resin as a material. The first inductor includes a first inductor conductor layer that adjoins one of the insulating layers. The low expansion portion has a coefficient of linear expansion lower than a coefficient of linear expansion of the plurality of insulating layers. The low expansion portion contains a second resin as a material. At least part of the low expansion portion is embedded in the laminated body. The second resin has a coefficient of linear expansion that is lower than a coefficient of linear expansion of the first resin.
    Type: Grant
    Filed: June 2, 2017
    Date of Patent: July 14, 2020
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yoichi Nakatsuji, Kosuke Ishida, Mizuho Katsuta
  • Patent number: 10699839
    Abstract: A thin film-type inductor includes a body having a coil, and a first external electrode and a second external electrode. The first and second external electrodes are each disposed on an external surface of the body. The coil includes a coil body and a via portion. The via portion is directly connected to the first external electrode. The coil body includes a base conductor layer in a lower portion and a plating layer in an upper portion.
    Type: Grant
    Filed: November 20, 2017
    Date of Patent: June 30, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chan Yoon, Won Chul Sim, Dong Hwan Lee, Young Ghyu Ahn
  • Patent number: 10700003
    Abstract: An integrated circuit structure includes a substrate, an integrated inductor, multiple components, multiple metal interconnections, a first shielding structure, and a second shielding structure. The integrated inductor is substantially formed in a first layer of the integrated circuit structure. The metal interconnections are coupled to the integrated inductor and the components. The first shielding structure is formed between the first layer and the substrate and is substantially beneath the integrated inductor. The second shielding structure is formed between the first layer and the substrate, has substantially the same distribution as the metal interconnections, and is substantially beneath the metal interconnections. The first shielding structure and the second shielding structure are equipotential.
    Type: Grant
    Filed: June 20, 2018
    Date of Patent: June 30, 2020
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Kai-Yi Huang, Sheng-Hung Lin
  • Patent number: 10700022
    Abstract: The present disclosure discloses an inductor structure mounted on a PCB board and a voltage regulator module having the same. The inductor structure includes an inductor core and an inductor winding. The PCB board is provided with at least one hollow part, and the inductor structure further comprises a plurality of copper strips used as the inductor windings of the inductor structure. The copper strips are spaced apart in the hollow part so as to form a plurality of through holes, and the leg of the inductor core is correspondingly inserted into the through hole at the corresponding position of the hollow part.
    Type: Grant
    Filed: August 6, 2019
    Date of Patent: June 30, 2020
    Assignee: DELTA ELECTRONICS (SHANGHAI) CO., LTD.
    Inventors: Xiangxing Zheng, Wenhua Li, Quansong Luo, Yuanyuan Dan, Haijun Yang, Shaohua Zhu
  • Patent number: 10692643
    Abstract: A coil, such as, by way of example, an inductance communication coil, that includes a conductor including a first portion extending in a first level and a second portion extending in a second level, wherein the conductor includes a third portion located on a different level than that of the second portion, wherein an electrical path of the conductor is such that the second portion is located between the first portion and the third portion.
    Type: Grant
    Filed: October 26, 2016
    Date of Patent: June 23, 2020
    Assignee: Cochlear Limited
    Inventors: Oliver John Ridler, Patrik Kennes, Kurt Forrester
  • Patent number: 10692639
    Abstract: An inductive component and a method for producing an inductive component are disclosed. In an embodiment, the inductive component includes a first core part having wound first and second wires and a second core part arranged on the first core part. In various embodiments the inductive component has a low mode conversion, a low inductance in differential-mode operation, a high inductance for common-mode signals, a constant characteristic impedance, a low capacitive coupling of the wires, and/or a low leakage inductance.
    Type: Grant
    Filed: February 6, 2015
    Date of Patent: June 23, 2020
    Assignee: EPCOS AG
    Inventors: Felipe Jerez, Stephan Bühlmaier, Anneliese Drespling, Jörn Schliewe, Stefan Schefler, Joachim Nassal
  • Patent number: 10692642
    Abstract: An inductance communication coil, including a conductor having at least one conductive turn, wherein a width of the conductor is wider at a first location relative to that at a second location. The conductor can be made out of metal. In some embodiments, the first location and the second location are on the same turn. In some embodiments, the conductor includes a plurality of turns, wherein the first location is at a first turn and the second location is at a second turn.
    Type: Grant
    Filed: October 26, 2016
    Date of Patent: June 23, 2020
    Assignee: Cochlear Limited
    Inventors: Oliver John Ridler, Patrik Kennes, Kurt Forrester
  • Patent number: 10692963
    Abstract: In an embodiment, a circuit includes: a transformer defining an inductive footprint within a first layer; a grounded shield bounded by the inductive footprint within a second layer separate from the first layer; and a circuit component bounded by the inductive footprint within a third layer separate from the second layer, wherein: the circuit component is coupled with the transformer through the second layer, and the third layer is separated from the first layer by the second layer.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: June 23, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Feng Wei Kuo, Chewn-Pu Jou, Huan-Neng Chen, Lan-Chou Cho, Robert Bogdan Staszewski
  • Patent number: 10693308
    Abstract: Embodiments describe a wireless charging device including: a housing having a charging surface, the housing including first and second walls defining an interior cavity; a transmitter coil arrangement disposed within the interior cavity; a plurality of cowlings for confining the plurality of planar transmitter coils in their respective positions; an interconnection structure positioned within the interior cavity between the transmitter coil arrangement and the second wall, the interconnection structure including a plurality of packaged electrical components mounted onto the interconnection structure; and a plurality of standoffs coupled to the interconnection structure and configured to electrically couple the transmitter coil arrangement to the plurality of packaged electrical components.
    Type: Grant
    Filed: September 8, 2017
    Date of Patent: June 23, 2020
    Assignee: Apple Inc.
    Inventors: Eric S. Jol, Christopher S. Graham, Darshan R. Kasar, Demetrios B. Karanikos
  • Patent number: 10685776
    Abstract: An integrated magnetic inductor is provided with an inductor coil, magnetic film, and a substrate. The magnetic film can be placed between the neighboring inductor coils, and the thickness of the magnetic film is greater than the coil thickness. In addition, the magnetic film includes exchange-coupled magnetic materials. The exchange-coupled magnetic materials provide improved permeability and fFMR at the frequency of interest for the integrated magnetic inductor.
    Type: Grant
    Filed: April 3, 2017
    Date of Patent: June 16, 2020
    Assignee: The Board of Trustees of the University of Alabama
    Inventors: Yang-Ki Hong, Jaejin Lee
  • Patent number: 10685775
    Abstract: A coil component includes a body part including an internal coil including one end and another end; a first external electrode connected to the one end of the internal coil; a second external electrode connected to the another end of the internal coil; and a third external electrode connected to a first point between the one end of the internal coil and the another end of the internal coil.
    Type: Grant
    Filed: June 8, 2018
    Date of Patent: June 16, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Min Ki Jung, Su Bong Jang, Jae Woon Park, Seung Jae Song
  • Patent number: 10679785
    Abstract: Provided is a coil component including a coil portion that has at least one layer of ring-shaped planar coil portion including a coil-wound portion and an insulative resin layer which covers the periphery of the coil-wound portion within the same layer as the coil-wound portion, and an insulative resin layer overlapping the planar coil portion; and a covering portion that covers the coil portion. The insulative resin layer has a superimposing region overlapping a forming region of the planar coil portion and a protrusion region protruding from at least any one of an inner peripheral edge and an outer peripheral edge of the superimposing region, when viewed in the direction of overlapping the planar coil portion.
    Type: Grant
    Filed: April 24, 2017
    Date of Patent: June 9, 2020
    Assignee: TDK CORPORATION
    Inventor: Akifumi Kamijima
  • Patent number: 10672554
    Abstract: An inductor component 1a includes a resin layer 3 and an inductor electrode 6. The inductor electrode 6 includes metal pins 7a to 7d that extend in the resin layer 3 with upper end surfaces thereof exposed from the upper surface 3a of the resin layer 3, and upper wiring plates 8a and 8b that are disposed on the upper surface 3a of the resin layer 3 and that connect upper end surfaces of the short metal pins 7a and 7c and upper end surfaces of the long metal pins 7b and 7d to each other. In this case, the inductor electrode 6 is formed of the metal pins 7a to 7d and wiring plates 8a to 8c that each have a specific electrical resistance lower than that of a conductive paste and plating, and the resistance of the entire inductor electrode 6 can be decreased.
    Type: Grant
    Filed: July 26, 2018
    Date of Patent: June 2, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Norio Sakai, Yoshihito Otsubo, Hideaki Hashi, Takayuki Tange, Munetake Miyashita, Takeshi Wake, Yasuhiro Higashide
  • Patent number: 10663534
    Abstract: An integrated circuit includes a fluxgate magnetometer. The magnetic core of the fluxgate magnetometer is encapsulated with a layer of encapsulant of a nonmagnetic metal or a nonmagnetic alloy. The layer of encapsulate provides stress relaxation between the magnetic core material and the surrounding dielectric. A method for forming an integrated circuit has the magnetic core of a fluxgate magnetometer encapsulated with a layer of a nonmagnetic metal or nonmagnetic alloy to eliminate delamination and to substantially reduce cracking of the dielectric that surrounds the magnetic core.
    Type: Grant
    Filed: December 2, 2014
    Date of Patent: May 26, 2020
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Mona M. Eissa, Dok Won Lee
  • Patent number: 10665380
    Abstract: A device includes a substrate, and a vertical inductor over the substrate. The vertical inductor includes a plurality of parts formed of metal, wherein each of the parts extends in one of a plurality of planes perpendicular to a major surface of the substrate. Metal lines interconnect neighboring ones of the plurality of parts of the vertical inductor.
    Type: Grant
    Filed: April 2, 2019
    Date of Patent: May 26, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsiao-Tsung Yen, Huan-Neng Chen, Yu-Ling Lin, Chin-Wei Kuo, Mei-Show Chen, Ho-Hsiang Chen, Min-Chie Jeng
  • Patent number: 10665376
    Abstract: In a method of manufacturing an embedded magnetic component, a cavity is formed in an insulating substrate. One or more drops of adhesive are applied to the cavity and a magnetic core is inserted in the cavity. The cavity and the magnetic core are then covered with a first insulating layer. Through holes are formed through the first insulating layer and the insulating substrate, and plated up to form conductive vias. Metallic traces are added to exterior surfaces of the first insulating layer and the insulating substrate to form upper and lower winding layers. The metallic traces and the conductive vias form the windings for an embedded magnetic component, such as a transformer or an inductor.
    Type: Grant
    Filed: January 18, 2019
    Date of Patent: May 26, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Jamie Harber
  • Patent number: 10665385
    Abstract: Embodiments are generally directed to an integrated inductor with adjustable coupling. In some embodiments, an integrated inductor includes a first conductor and a second conductor; a first strip of magnetic material film below the first conductor and the second conductor; and a second strip of magnetic material film above the first conductor and the second conductor, wherein at least one of the first strip of magnetic material and the second strip of magnetic material includes a partial slot to partially separate a first section of the strip of magnetic material and a second section of the strip of magnetic material.
    Type: Grant
    Filed: October 1, 2016
    Date of Patent: May 26, 2020
    Assignee: Intel Corporation
    Inventor: Donald S. Gardner
  • Patent number: 10665388
    Abstract: A method of manufacturing a laminated coil component is a method of manufacturing a laminated coil component provided with a laminate obtained by laminating a coil conductor forming a spiral coil and an insulator layer. The method of manufacturing a laminated coil component includes a step of providing a conductor pattern configured to become a coil conductor on a green sheet configured to become an insulator layer, and a step of laminating a plurality of green sheets provided with the conductor pattern. The conductor pattern includes a pair of first side surfaces opposed to each other in an orthogonal direction orthogonal to a laminating direction of the green sheet. At the step of laminating a plurality of green sheets, a depression is formed on at least one of the pair of first side surfaces.
    Type: Grant
    Filed: October 4, 2017
    Date of Patent: May 26, 2020
    Assignee: TDK CORPORATION
    Inventors: Yuya Oshima, Makoto Yoshino, Yoji Tozawa, Junichi Otsuka, Kazuo Iwai, Yohei Tadaki, Shinichi Kondo, Kazuhiro Ebina, Mamoru Kawauchi
  • Patent number: 10644697
    Abstract: A material-discerning sensing device includes an antenna, a capacitive proximity sensor, and a control circuit. The antenna includes multiple conductive loops and is configured to radiate a wireless signal. The antenna defines an interior region devoid of the conductive loops and an exterior region outside the conductive loops. The capacitive proximity sensor includes a conductive pattern provided within the interior region or within a projection of the interior region, as well as a conductive bar. The control circuit is configured to detect a change in a characteristic of an electrical signal from the capacitive sensor. The conductive pattern includes a longitudinal portion, a first plurality of parallel conductors extending away from the longitudinal portion in a first direction and orthogonal to the longitudinal portion, and a second plurality of parallel conductors extending away from the longitudinal portion in a second direction opposite the first direction.
    Type: Grant
    Filed: February 11, 2016
    Date of Patent: May 5, 2020
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventor: Thomas Almholt
  • Patent number: 10643781
    Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.
    Type: Grant
    Filed: May 18, 2017
    Date of Patent: May 5, 2020
    Assignee: TDK CORPORATION
    Inventors: Masashi Shimoyasu, Shinichi Sato, Seiichi Nakagawa, Mamoru Kawauchi, Shigetoshi Kinouchi, Mitsuru Ito, Yuto Shiga
  • Patent number: 10636562
    Abstract: A coil electronic component includes: a plurality of coil layers including, respectively, coil patterns and connection patterns disposed outside the coil patterns and forming a stacking structure; conductive vias connecting the coil patterns formed on different levels to each other; and external electrodes electrically connected to the plurality of coil layers. The coil patterns of at least two of the plurality of coil layers may have the same shape and be electrically connected to each other in parallel.
    Type: Grant
    Filed: July 27, 2017
    Date of Patent: April 28, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ki Seok Kim, Myung Sam Kang, Ye Jeong Kim, Kwang Hee Kwon, Sa Yong Lee
  • Patent number: 10638611
    Abstract: Disclosed herein is a coil component that includes a first planar spiral conductor; a second planar spiral conductor laminated on the first planar spiral conductor and wound in an opposite direction to the first planar spiral conductor; a first external terminal electrically connected to an outer peripheral end of the first planar spiral conductor; a second external terminal electrically connected to an outer peripheral end of the second planar spiral conductor; and a third external terminal electrically connected in common to inner peripheral ends of the first and second planar spiral conductors.
    Type: Grant
    Filed: October 14, 2016
    Date of Patent: April 28, 2020
    Assignee: TDK CORPORATION
    Inventors: Tomonaga Nishikawa, Kouji Kawamura, Tomokazu Ito, Tadashi Watanabe, Mitsuhiko Endo, Fumio Watanabe
  • Patent number: 10629362
    Abstract: A coil component includes a body including a magnetic material, a support member disposed inside the body, and a coil pattern disposed on the support member inside the body. The coil pattern includes a first conductive layer, having a planar spiral shape, and a second conductive layer, having a line width greater than a thickness thereof, while covering the first conductive layer. When viewed from a surface of the body cut in thickness and width directions, a line width of each of outermost and innermost patterns of the first conductive layer is different from a line width of at least one internal pattern disposed between the outermost and innermost patterns.
    Type: Grant
    Filed: October 17, 2017
    Date of Patent: April 21, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jung Hyuk Jung, Sung Hee Kim, Hye Yeon Cha
  • Patent number: 10629350
    Abstract: A flexible inductor includes a coil substrate having a first spiral conductor formed in or on a bottom surface, a first magnetic sheet laminated on a top surface of the coil substrate, and a second magnetic sheet laminated on the bottom surface of the coil substrate. The flexible inductor includes a plurality of outer electrodes including a first outer electrode and a second outer electrode that are disposed in a peripheral portion of the bottom surface of the coil substrate, and cutout portions each formed in an area between the first spiral conductor and each of the outer electrodes so as to penetrate through the coil substrate. The first outer electrode is electrically connected to an outermost end portion of the first spiral conductor. The second outer electrode is electrically connected to an innermost end portion of the first spiral conductor.
    Type: Grant
    Filed: January 9, 2018
    Date of Patent: April 21, 2020
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Masashi Hattori, Koichi Yamaguchi, Hideji Kihara
  • Patent number: 10629365
    Abstract: An inductor array component includes a body including a plurality of coil portions a coil included in the coil portions, external electrodes connected to both end portions of the coil and disposed on an outer surface of the body, a first blocking layer disposed between the coil portions, and a second blocking layer disposed within the first blocking layer.
    Type: Grant
    Filed: April 11, 2017
    Date of Patent: April 21, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Won Chul Sim, Dong Hwan Lee, Sang Jin Park, Chan Yoon
  • Patent number: 10622126
    Abstract: Provided are: a metal magnetic material capable of reliably establishing insulation while realizing high saturation magnetic flux density; and an electronic component using the metal magnetic material and having low loss and good DC superimposition characteristics. The metal magnetic material for forming a component body of the electronic component comprises a metal magnetic alloy powder consisting of iron and silicon or containing iron, silicon and chromium; and an additional element added to the metal magnetic alloy powder, wherein the additional element is more easily oxidizable in the equilibrium state of oxidation-reduction reaction than the elements contained in the metal magnetic alloy powder. The component body (11) is internally formed with a coil pattern consisting of a plurality of coil conductor patterns (12A to 12C).
    Type: Grant
    Filed: April 17, 2015
    Date of Patent: April 14, 2020
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Makoto Yamamoto
  • Patent number: 10605945
    Abstract: Systems and methods for shielding a metal detector head include placement of conductive shielding around the coils of the head to reduce the effects of capacitance variation between the coils and their surroundings.
    Type: Grant
    Filed: July 23, 2018
    Date of Patent: March 31, 2020
    Inventor: Brian A. Whaley
  • Patent number: 10608550
    Abstract: A power conversion apparatus including a circuit board, a transformer, a first circuit, a second circuit, a first main coil, and a second main coil is provided. The transformer, the first circuit, and the second circuit are disposed on the circuit board. The transformer has a first winding and a second winding. The first circuit is coupled to and provides an input voltage to the first winding. The first end of the second winding is configured to provide an output voltage. The second circuit is coupled to the second winding. The first main coil is coupled to the first circuit. The second main coil is printed on the circuit board and coupled between the second circuit and a first reference potential terminal. The first main coil and the second main coil are electrically insulated from each other and magnetically coupled to each other.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: March 31, 2020
    Inventor: Chen-Yi Wei
  • Patent number: 10607769
    Abstract: An electronic component includes a magnetic body, and first and second internal coil parts embedded in the magnetic body spaced apart from each other and including coil conductors disposed on first and second surfaces of a support member. First and second spacer parts are disposed between the first and second internal coil parts in upper and lower portions of the magnetic body, respectively, with an interval therebetween.
    Type: Grant
    Filed: October 5, 2018
    Date of Patent: March 31, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Dong Jin Jeong
  • Patent number: 10600553
    Abstract: An inductor includes a body including a coil part therein. The coil part includes a first coil layer electrically connected to a first via; a second coil layer disposed below the first coil layer and electrically connected to a second via displaced laterally from that of the first via; and a via connection layer disposed between the first coil layer and the second coil layer and electrically connected to the first and second vias.
    Type: Grant
    Filed: March 13, 2017
    Date of Patent: March 24, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chan Yoon, Dong Hwan Lee, Young Ghyu Ahn
  • Patent number: 10593465
    Abstract: A multilayer chip bead includes: a body including a coil portion and cover layers disposed on upper and lower surfaces of the coil portion; first and second external electrodes disposed on external surfaces of the body; and a coil disposed in the coil portion, including coil patterns having a spiral shape and lead patterns, and having both end portions connected to the first and second external electrodes, respectively, through the lead patterns. A width of the lead pattern is smaller than that of the coil pattern.
    Type: Grant
    Filed: September 19, 2017
    Date of Patent: March 17, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Jin Ha, Hyun Ju Jung, Jeong Hwan Im, So Young Jun, Sung Jin Park
  • Patent number: 10586647
    Abstract: An electronic component includes an element assembly that includes a magnetic layer and a non-magnetic layer and a coil that is provided within the element assembly and that is wound in a spiral form. The coil includes a plurality of laminated layers of coil wires. The non-magnetic layer includes an inter-wire non-magnetic layer located between at least one pair of the coil wires that are adjacent in a lamination direction and a radial direction non-magnetic layer located on at least one of an outer side portion and an inner side portion in a radial direction of the coil. The radial direction non-magnetic layer is spaced apart from the inter-wire non-magnetic layer.
    Type: Grant
    Filed: September 19, 2017
    Date of Patent: March 10, 2020
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Yasushi Takeda
  • Patent number: 10586774
    Abstract: A chip part includes a substrate, a first electrode and a second electrode which are formed apart from each other on the substrate and a circuit network which is formed between the first electrode and the second electrode. The circuit network includes a first passive element including a first conductive member embedded in a first trench formed in the substrate and a second passive element including a second conductive member formed on the substrate outside the first trench.
    Type: Grant
    Filed: October 27, 2017
    Date of Patent: March 10, 2020
    Assignee: ROHM CO., LTD.
    Inventors: Takuma Shimoichi, Yasuhiro Kondo
  • Patent number: 10586642
    Abstract: An inductor includes a body including a coil, and a support member and external electrodes disposed on an outer surface of the body. The coil may include first and second coils, wherein the first coil does not coincide with a coil mirror-symmetric to the second coil, based on one surface of the body. This is due to the fact that exposure positions of lead portions of the first and second coils exposed to the outer surface of the body are different from each other.
    Type: Grant
    Filed: August 14, 2017
    Date of Patent: March 10, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Hun Kim, Eo Jin Choi, Young Ku Lyu, Yong Hui Li
  • Patent number: 10578686
    Abstract: An MRI local coil system for use with an MRI scanner to image a breast, the system comprising a plastic housing and an RF coil system. The RF coil system comprises a conductor and electronics. The electronics comprises a capacitor and a blocking circuit. The conductor and the electronics are disposed within the plastic housing and the conductor is integrally formed with the plastic housing.
    Type: Grant
    Filed: February 1, 2013
    Date of Patent: March 3, 2020
    Assignee: Invivo Corporation
    Inventors: John Laviola, Thomas DeYoung, Raymond Ruthenberg
  • Patent number: 10580563
    Abstract: A coil component includes: a coil part; and a body formed around the coil part and containing a magnetic material. The body contains a first magnetic powder particle having a first insulating film formed on a surface thereof, and a second magnetic powder particle having a second insulating film formed on a surface thereof, and an average thickness of the first insulating film is thicker than that of the second insulating film.
    Type: Grant
    Filed: June 15, 2016
    Date of Patent: March 3, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Dong Jin Jeong
  • Patent number: 10573536
    Abstract: The invention provides a semiconductor package and a method for fabricating a base for a semiconductor package. The semiconductor package includes a base. The base has a device-attach surface. A radio-frequency (RF) device is embedded in the base. The RF device is close to the device-attach surface.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: February 25, 2020
    Assignee: MediaTek Inc.
    Inventors: Wen-Sung Hsu, Ta-Jen Yu
  • Patent number: 10575405
    Abstract: A module includes a wiring board, an insulating layer that is laminated on the bottom surface of the wiring board, a ring-shaped coil core that is embedded in the insulating layer, a coil electrode that is wound around the coil core, electronic components that are disposed in an inner region surrounded by the coil core in the insulating layer, and an electronic component that is mounted on or in the top surface of the wiring board. With this configuration, the areas of main surfaces of the wiring board and main surfaces of the insulating layer are not large, whereas if the electronic components were mounted on or in the top surface of the wiring board, the areas of the main surfaces of the wiring board and the main surfaces of the insulating layer would be large, and a reduction in the size of the module can be facilitated.
    Type: Grant
    Filed: August 4, 2017
    Date of Patent: February 25, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Toshiro Adachi
  • Patent number: 10573454
    Abstract: In one aspect there is an apparatus. The apparatus may include an electronic circuit that generates a first magnetic field from a current in the electronic circuit. The apparatus may further include a sensing circuit separated from the electronic circuit by a predetermined distance to sense the first magnetic field. A cage circuit may cancel a portion of the first magnetic field at the sensing circuit. The cage circuit may generate a cage current from the current in the electronic circuit and at least one of a phase shift or an amplitude shift applied to the current in the electronic circuit. The cage current may generate a second magnetic field causing cancellation of the portion of the magnetic field from the electronic circuit at the sensing circuit.
    Type: Grant
    Filed: May 1, 2017
    Date of Patent: February 25, 2020
    Assignee: Nokia Technologies Oy
    Inventor: Ari Vilander
  • Patent number: 10566129
    Abstract: In an embodiment, an electronic component includes: an element body part 10 constituted by an insulative body of rectangular solid shape; an internal conductor 30 provided inside the element body part 10; and external electrodes 50 provided at least on the bottom face 14 (mounting surface) of the element body part 10 and electrically connected to the internal conductor 30; wherein the element body part 10 has: a conductor-containing layer 20 in which a coil conductor 36 (functional part) that will become a part of the internal conductor 30 to demonstrate electrical performance, is provided; and a high-hardness layer 22 which is provided side by side with the conductor-containing layer 20 in a direction parallel with the bottom face 14 (mounting surface) of the element body part 10, and which has a higher hardness compared to the conductor-containing layer 20. The electronic component has improve mechanical strength.
    Type: Grant
    Filed: September 28, 2017
    Date of Patent: February 18, 2020
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Masuo Yatabe, Chitose Kimura, Kozue Imaizumi, Ichiro Yokoyama
  • Patent number: 10566130
    Abstract: A coil component includes an insulating layer having a coil shape, first and second coil conductor layers on opposing surfaces of the insulating layer, each having a coil shape corresponding to that of the insulating layer, and an encapsulant encapsulating the insulating layer and the first and second coil conductor layers.
    Type: Grant
    Filed: August 22, 2019
    Date of Patent: February 18, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Kang Wook Bong, Boum Seock Kim, Jae Hun Kim, Jong Sik Yoon, Byeong Cheol Moon
  • Patent number: 10566896
    Abstract: A power converter assembly is provided and includes high quality factor (Q) shield-to-transistor integrated low-inductance capacitor elements to divert common mode (CM) currents, high Q shield-to-shield integrated low-inductance capacitor elements to compliment line-to-line filter capacitors and high Q baseplate integrated low-inductance capacitor elements to attenuate residual CM currents.
    Type: Grant
    Filed: August 6, 2018
    Date of Patent: February 18, 2020
    Assignee: RAYTHEON COMPANY
    Inventors: Boris S. Jacobson, Steven D. Bernstein, Steven M. Lardizabal, Jason Adams, Jeffrey R. Laroche
  • Patent number: 10553671
    Abstract: Base pads are spaced by a pitch on a support surface. Conducting members, optionally Cu or other metal pillars, extend up from the base pads to top pads. A top pad interconnector connects the top pads in a configuration establishing an inductor current path between the base pads.
    Type: Grant
    Filed: June 10, 2016
    Date of Patent: February 4, 2020
    Assignee: QUALCOMM Incorporated
    Inventors: Chengjie Zuo, Jonghae Kim, Daeik Daniel Kim, Changhan Hobie Yun, Mario Francisco Velez
  • Patent number: 10553349
    Abstract: An inductor having a magnetic body, wherein a recess is formed in the magnetic body; a coil, formed by a conductive wire and disposed in the magnetic body, wherein a first terminal part of the conductive wire is placed on a bottom surface of the recess, wherein a first portion of the first terminal part is embedded inside the recess, wherein a second portion of the first terminal part is exposed from the magnetic body; and an electrode structure is disposed on the magnetic body, wherein a portion of the axial surface of a first end of the conductive wire is encapsulated by the magnetic body without being encapsulated by the electrode structure, and wherein at least one portion of the electrode structure is disposed over the bottom surface of the recess and in contact with the second portion of the first terminal part of the conductive wire for connecting with an external circuit.
    Type: Grant
    Filed: April 11, 2017
    Date of Patent: February 4, 2020
    Assignee: CYNTEC CO., LTD
    Inventors: Chi-Hsun Lee, Hsieh-Shen Hsieh, Sen-Huei Chen
  • Patent number: 10553340
    Abstract: A coil component includes a core member, a coil structure, at least one terminal electrode and a soldering member. The coil structure includes an insulating layer. A first portion of the coil structure is wound around the core member. The terminal electrode is mounted onto the core member. The terminal electrode includes a clamping portion and a supporting portion. The clamping portion includes a bent part for clamping a second portion of the coil structure. The supporting portion includes a protruding part. A conductive wire of a third portion of the coil structure is revealed. A soldering member covers the protruding part to connect the supporting portion to the conductive wire to form electrical connection between the coil structure and the terminal electrode.
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: February 4, 2020
    Assignee: CYNTEC CO., LTD
    Inventors: Min-Lian Kuo, Dao-Chuang Zhang, QiQi Yang, I-Feng Lin, Chi-Hsiang Chuang, Chao-Hung Hsu
  • Patent number: 10553341
    Abstract: An improvement in coil characteristics is achieved by performing accurate positioning of a magnetic core. A coil component 2 includes a wiring substrate 3, a magnetic core 4 that has a ring-like shape and that is disposed on a bottom surface of the wiring board 3, and a coil electrode 5 that is wound around the magnetic core 4, and the coil electrode 5 includes a plurality of inner metallic pins 11a and outer metallic pins 11b that are vertically arranged around the magnetic core 4. First end portions of the plurality of inner and outer metallic pins 11a and 11b are each connected, with solder, to an end surface of a corresponding one of a plurality of via conductors 9a, the end surface being exposed at the bottom surface of the wiring board 3.
    Type: Grant
    Filed: November 15, 2016
    Date of Patent: February 4, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yoshihito Otsubo, Norio Sakai
  • Patent number: 10555424
    Abstract: A structure, a semiconductor device and a manufacturing method thereof are provided. The structure includes a core dielectric layer, a patterned conductive plate, a metallization layer, an upper build-up stack and a lower dielectric layer. The patterned conductive plate has ducts there-through and is entrenched in the core dielectric layer. The metallization layer is disposed within the ducts and further extends over an upper surface and a bottom surface of the core dielectric layer. The upper build-up stack is disposed on the upper surface of the core dielectric layer. The upper build-up stack includes conductive layers electrically connected to the metallization layer. The lower dielectric layer is disposed on the bottom surface of the core dielectric layer and is in direct physical contact with a bottom surface of the patterned conductive plate. A material of the lower dielectric layer is different from a material of the core dielectric layer.
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: February 4, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Jiun-Yi Wu, Chien-Hsun Lee, Chen-Hua Yu, Chung-Shi Liu