Abstract: An electromagnetic component includes a magnetic core and a dual-winding arrangement inside the magnetic core structure. The dual-winding arrangement includes a first winding fabricated from an elongated conductor having a first thickness and defining a first inverted U-shaped main winding portion including out of plane axial bends, and a second winding fabricated from a conductor having a second thickness and being formed into a second inverted U-shaped main winding portion with perpendicular sections extending co-planar to one another without any out of plane axial bends.

Abstract: An inductor component includes an element assembly; a coil inside the element assembly and helically wound along an axis; and first and second outer electrodes in the element assembly and electrically connected to the coil. The element assembly has insulating layers stacked along the axis. The coil has pieces of coil wiring stacked along the axis and via wiring extending along the axis and connecting the pieces of coil wiring adjacent in a direction of the axis. The pieces are each wound along a plane, are electrically connected in series in a helix, and have first and second coil wirings at a respective endmost on one and other sides in a direction parallel to the axis and respectively connected to the first and second outer electrodes. An end surface on the one side has an area smaller than that of an end surface on the other side.

Abstract: A coil component includes a core including a winding core portion and a first flange portion, a first wire and a second wire that are wound around the winding core portion in the same direction, and a first terminal electrode that is disposed on the first flange portion and that is connected to a first end portion of the first wire. The shape of an outer edge of the first terminal electrode includes a convex curve.

Abstract: The present disclosure provideds a side-view type semiconductor light emitting device of the disclosure includes a multilayer substrate having a plurality of substrates, a plurality of conductive layers, and a plurality of semiconductor light emitting elements. The multilayer substrate has a main surface on which the semiconductor light emitting elements are mounted, a back surface facing an opposite side of the main surface and having external electrodes formed thereon, and a mounting surface intersecting both the main surface and the back surface. The plurality of conductive layers have conductive exposed portions exposed from the mounting surface.

Abstract: An electronic component module that includes a substrate, an inductor element, a single-sided functional component, a sealing resin, and an electromagnetic shield. The inductor element is mounted on the substrate. The single-sided functional component is mounted on a base ground conductor and a base signal conductor that are disposed on a side of the inductor element opposite to the substrate. The sealing resin has an insulating property and covers the inductor element, the base ground conductor, the base signal conductor, and the single-sided functional component. The electromagnetic shield covers the sealing resin, and a ground surface of the single-sided functional component.

Abstract: A plurality of external electrodes are disposed on both ends of an element body. Each of the plurality of external electrodes includes a pair of electrode portions disposed on a pair of side surfaces and including a conductive resin layer. For each of the two conductive resin layers located on the same side surface, one conductive resin layer includes an edge opposing another conductive resin layer. The conductive resin layer includes a first region and a second region. The first region included a plurality of metal particles of a first content and a resin. The second region includes a plurality of metal particles of a second content smaller than the first content and a resin. The second region is located closer to the edge of the conductive resin layer than the first region, and includes the edge of the conductive resin layer.

Abstract: The disclosed technology generally relates to lithographically defined conductive lines for integrated circuit devices formed by plating, and more particularly to conductive lines shaped to reduce the magnitude of electric field in the electric field distributions around conductive lines of integrated and monolithic transformers and isolators.

Abstract: In a multilayer coil component, a coil is configured by electrically connecting coil conductors respectively provided in magnetic body layers constituting an element body and metal magnetic particles have a normal particle having an ellipsoidal shape and flat particles having an ellipsoidal shape flatter in a thickness direction than the normal particle. A plurality of the normal particles and at least one of the flat particles disposed such that a surface (reference surface) including a major axis direction orthogonal to the thickness direction and a minor axis direction is along the forming surface of the coil conductor in the magnetic body layer are arranged in the lamination direction of the magnetic body layers between the coil conductors.

Abstract: In a multilayer coil component, a part filled with a resin and a void part not filled with the resin exist between a plurality of metal magnetic particles in an element body, one main surface of the element body is a mounting surface with respect to an external electronic component, and the edge of an external electrode is positioned on the mounting surface. In the element body, a high void region where the porosity caused by the void part is higher than the porosity of the other part in the element body extends from the edge of the external electrode on the mounting surface toward an end surface of the element body.

Abstract: Provided is a semiconductor integrated circuit that improves insulation reliability between a high-voltage circuit and a low-voltage circuit. The semiconductor integrated circuit includes the following: a first circuit controlled by a control signal of low voltage and driven at a higher voltage; a second circuit configured to output the control signal to the first circuit to control the driving of the first circuit; and a plurality of insulation circuits each including an insulating element, the plurality of insulation circuits connecting between the first and the second circuits in series. Each insulation circuit is configured to magnetically or capacitively couple the control signal in the insulating element to transmit it from the second circuit to the first circuit, and is configured to insulate the first circuit from the second circuit in the insulating element to prevent the higher voltage from being applied from the first circuit to the second circuit.

Abstract: Disclosed is a motherboard comprising at least one printed circuit board (PCB), referred to as the motherboard PCB, at least one planar transformer, which is mounted on the motherboard PCB, and a plurality of electronic components, which are also mounted on the motherboard PCB. The planar transformer comprises at least one printed circuit board with windings and a connection interface, a magnetic core arranged on the printed circuit board so as to interact with the windings, and at least one electronic component mounted on the printed circuit board.

Abstract: A current sampling system, the system including a magnetic component, that is an inductor or a transformer that has at least one winding, where the at least one winding has a first part and a second part, where a first terminal of the first part is connected to a first terminal of the second part, and where a second terminal of the first part is separated from a second terminal of the second part, and a current detection circuit, where the second terminal of the second part is connected to the current detection circuit, and where the current detection circuit is configured to sample a current flowing through the second part, and obtain a total current of the winding based on the sampled current flowing through the second part and a preset ratio.

Abstract: A magnetic-component module includes a substrate, a header on the substrate, a core, a winding including a trace on the header, and an overmold material encapsulating the header, the core, and the trace.

Abstract: An inductor component comprising a spiral wiring wound on a plane; first and second magnetic layers located at positions sandwiching the spiral wiring from both sides in a normal direction relative to the plane of the wound spiral wiring; a vertical wiring extending from the spiral wiring in the normal direction to penetrate at least the inside of the first magnetic layer; and an external terminal disposed on at least a surface of the first magnetic layer to cover an end surface of the vertical wiring. The first magnetic layer is larger than the second magnetic layer in terms of the area of the external terminal viewed in the normal direction, and when A is the thickness of the first magnetic layer and B is the thickness of the second magnetic layer, A/((A+B)/2) is from 0.6 to 1.6.

Abstract: A coil component includes: a core that includes a winding-core portion and a flange portion that is formed on an end surface of the winding-core portion; a wire that is wound around the winding-core portion; and an outer electrode that is formed on a bottom surface of the flange portion, to which an end portion of the wire is connected, and that includes a first metal layer that forms a surface of the outer electrode. At least a part of the end portion of the wire is embedded in the first metal layer.

Abstract: [Object] Provided is a printed circuit board ensuring a degree of freedom in circuit design and unlikely to cause a circuit connection failure. [Solving Means] A middle interlayer circuit 11, an upper surface side interlayer circuit 12, and a lower surface side interlayer circuit 13 are formed from a connection surface-less integral conductor. In addition, a connection surface 33 between the upper surface side interlayer circuit 12 and an upper surface side surface layer circuit 14 and a connection surface 34 between the lower surface side interlayer circuit 13 and a lower surface side surface layer circuit 15 lack a connection surface in a plate thickness direction, and thus a satisfactory connection state is achieved. Accordingly, a first circuit 10 is unlikely to cause a connection failure.

Abstract: An approach for reducing unwanted magnetic coupling with conductive elements by keeping the localized magnetic field in a transformer's or inductors magnetic gap far away from any conductive elements is provided. The approach includes the use of spacers to keep the localized magnetic field in a transformer's or inductor's magnetic gap far away from any conductive elements to reduce unwanted magnetic coupling with those conductive elements. The spacers can be made from materials including ferrite, conductors and non-conducting elements.

Abstract: A balun including first and second conductive tracks located vertically in line and at a distance from each other and having a same pattern.

Abstract: A coil component includes a body having a first surface and a first end surface and a second end surface each connected to the first surface and opposing each other, a support substrate disposed in the body, a coil unit including a first coil pattern, a first lead pattern and a second lead pattern respectively disposed on a first surface of the support substrate opposing the first surface of the body, first and second slit portions respectively disposed in edge portions between the first end surface and the second end surface of the body and exposing the first and second lead patterns, and first and second external electrodes arranged in the first and second slit portions and connected to the coil unit, wherein a ratio of a line width of any one of the first and second lead patterns to a line width of any one turn of the first coil pattern satisfies 1 to 1.5.

Abstract: Described are microelectronic devices including an embedded microelectronic package for use as an integrated voltage regulator with a microelectronic system. The microelectronic package can include a substrate and a magnetic foil. The substrate can define at least one layer having one or more of electrically conductive elements separated by a dielectric material. The magnetic foil can have ferromagnetic alloy ribbons and can be embedded within the substrate adjacent to the one or more of electrically conductive elements. The magnetic foil can be positioned to interface with and be spaced from the one or more of electrically conductive element.

Abstract: An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes at a pair of multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surfaces and the board side surfaces. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of the multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. A mark portion is provided on one of the board main surfaces.

Abstract: A coil component includes: a body; a support substrate disposed in the body; a coil portion including coil patterns, lead patterns, and extension patterns, while disposed on the support substrate, the lead patterns being exposed to the body, and the extension patterns connecting the coil patterns and the lead patterns; and external electrodes disposed on the body and contacting the lead patterns, wherein the lead pattern has an inner portion adjacent to the extension pattern, an outer portion adjacent to the external electrode, and a middle portion disposed between the inner portion and the outer portion, and a width of the middle portion is larger than a width of the inner portion and smaller than a width of the outer portion.

Abstract: A coil component includes a support substrate having one surface including at least one groove portion; a coil portion disposed to contact the one surface of the support substrate; and a body embedding the support substrate and the coil portion, wherein the coil portion has an anchor portion disposed in the at least one groove portion, and a pattern portion disposed on the anchor portion and spaced apart from the one surface of the support substrate. A line width of the anchor portion is narrower than a line width of the pattern portion.

Abstract: An electronic component that has fewer cracks during production is provided. The electronic component includes an outer electrode on a multilayer body, which includes an inner glass layer, a magnetic material layer on top and bottom surfaces of the inner glass layer, and an outer glass layer on top and bottom surfaces of the magnetic material layer. The insulating layers of the inner glass layer and the outer glass layers contain a dielectric glass material that contains a glass material containing at least K, B, and Si, quartz, and alumina. The glass material content of each insulating layer of the inner glass layer ranges from approximately 60%-65% by weight, the quartz content of each insulating layer of the inner glass layer ranges from approximately 34%-37% by weight, and the alumina content of each insulating layer of the inner glass layer ranges from approximately 0.5%-4% by weight.

Abstract: An electronic component includes a body including a dielectric layer and internal electrodes, and including first to sixth surfaces; a first external electrode including a first connection portion on the third surface and a first band portion on the first surface; a second external electrode including a second connection portion on the fourth surface and a second band portion on the first surface; an insulating layer on the second surface and the first and second connection portions; and a plating layer on the first and second band portions. The plating layer extends onto the first and second connection portions and is in contact with the insulating layer. A thickness of an end of the insulating layer decreases toward the plating layer. An end of the plating layer includes a first region between the insulating layer and the first or second connection portion and a second region covering the insulating layer.

Abstract: A transformer is provided, including a core, a primary conductor, a magnetic member, and a secondary conductor. The core includes a central pillar and at least one lateral pillar. An accommodating space is formed between the central pillar and the lateral pillar. The primary conductor, the magnetic member, and the secondary conductor are disposed in the accommodating space. The primary conductor surrounds the central pillar. The magnetic member surrounds the primary conductor, and the secondary conductor surrounds the magnetic member. The magnetic member is disposed between the primary conductor and the secondary conductor, and is flexible.

Abstract: A multilayer coil component includes an element body, first and second coils, and a pair of external electrodes. The element body includes a plurality of insulator layers laminated in a first direction. The element body has a pair of end surfaces opposing each other in a second direction orthogonal to the first direction. The first coil and the second coil are disposed in the element body and respectively have coil shafts along the second direction. The pair of external electrodes are disposed on the pair of end surfaces and electrically connected to both ends of the first coil and the second coil. The first coil includes a first conductor layer, a second conductor layer, and a first through hole conductor. The coil shaft of the first coil is disposed inside the second coil.

Abstract: An integrated transformer and an electronic device are provided. An integrated transformer includes at least one substrate defining a plurality of annular accommodating grooves. Each annular accommodating groove divides a corresponding substrate into a central part surrounded by the each annular accommodating groove and a peripheral part arranged around the each annular accommodating groove. The central parts and the peripheral parts, magnetic cores received in the annular accommodating grooves and conductive connectors assembled on the at least one substrate, and transmission wire layers on both sides of the at least one substrate cooperatively constitute a plurality of transformers and filters arranged according to preset arrangement manners. At least one of the transformers and at least one of the filters are electrically connected to form a group of electromagnetic assemblies, and any two groups of electromagnetic assemblies are not electrically connected with each other on the at least one substrate.

Abstract: A method for constructing a solenoid inductor of an IC package with active/passive devices includes positioning an inner winding substantially around a magnetic core, positioning an outer winding substantially around the inner winding, and using a layered process to perform positioning the inner and outer windings. The layered process includes processing a first conducting layer as a bottom layer of the outer winding, above processing a first dielectric layer, above processing a second conducting layer as a bottom layer of the inner winding, above processing a second dielectric layer, above processing a magnetic core layer, above processing a third dielectric layer, above processing a third conducting layer as a top layer of the inner winding, above processing a fourth dielectric layer, above processing a fourth conducting layer as a top layer of the outer winding, above processing a fifth dielectric layer, and the inner and outer windings are electrically connected.

Abstract: The present invention provides an inductor device comprising one or more interconnected columns of conductive material embedded in a supporting structure, wherein the one or more columns comprise an input terminal and an output terminal; and wherein each column is surrounded by a first magnetic layer.

Abstract: A coil component includes a body, a support substrate disposed within the body, a coil disposed on at least one surface of the support substrate, and first and second external electrodes disposed to be spaced apart from each other on the body and connected to the coil. The coil unit includes a first conductive layer disposed on the support substrate, a second conductive layer disposed on the first conductive layer and spaced apart from the support substrate, and a third conductive layer disposed on the second conductive layer to cover at least a portion of a side surface of the second conductive layer and spaced apart from the support substrate to expose a side surface of the first conductive layer.

Abstract: A coil component includes an insulating substrate; a coil portion including a coil pattern, having a planar spiral shape, disposed on the insulating substrate; and a body embedding the insulating substrate and the coil portion, wherein the coil pattern comprises a first conductive layer disposed to contact the insulating substrate, and a second conductive layer disposed on the first conductive layer, wherein a thickness (T1) of the insulating substrate and a thickness (T2) of the first conductive layer satisfy 10?T1/T2?20.

Abstract: This application provides a wireless charging coil, and an electronic device and an antenna that include the wireless charging coil. The wireless charging coil includes a plurality of coil groups that are at a plurality of layers and that are connected in series, and an insulation layer that is disposed between two layers of the plurality of coil groups. The wireless charging coil includes a first area and a second area that is disposed at an outer periphery of the first area. A plurality of coil groups disposed in the second area are arranged at the plurality of layers, and each coil group includes a plurality of coils wound in parallel at one layer.

Abstract: An inductor device includes a first trace, a second trace, and a capacitor. The first trace includes a first and a second sub-trace. The first sub-trace includes first wires, and the second sub-trace includes second wires. The second sub-trace is coupled to the first sub-trace at a first node. The first and the second wires are disposed to each other in an interlaced manner, and located at an outer side of the inductor device. The second trace includes a third and a fourth sub-trace. The third sub-trace includes third wires, and the fourth sub-trace includes fourth wires. The fourth sub-trace is coupled to the third sub-trace at a second node. The third and the fourth wires are disposed to each other in an interlaced manner, and located at an outer side of the inductor device. The capacitor is coupled between the first and the second node.

Abstract: An inductor device includes a first trace, a second trace, and a capacitor. The first trace includes a first sub-trace and a second sub-trace. The first sub-trace and the second sub-trace form a plurality of first wires together at a first side of the inductor device, and form a plurality of second wires together at a second side of the inductor device. The second sub-trace is coupled to one terminal of the first sub-trace at a first node. The third sub-trace and the fourth sub-trace form a plurality of third wires together at the first side of the inductor device, and form a plurality of fourth wires together at the second side of the inductor device. The fourth sub-trace is coupled to one terminal of the third sub-trace at a second node. The capacitor is coupled to the first node and the second node.

Abstract: A coil component according to one embodiment of the present invention includes: a first insulator body containing first magnetic metal particles; a second insulator body containing second magnetic metal particles; a first coil conductor provided in the first insulator body and wound around a coil axis for N1 turns such that intervals between adjacent turns are g1; and a second coil conductor provided in the second insulator body and wound around the coil axis for N2 turns such that intervals between adjacent turns are g2. In the embodiment, a first coil surface of the first coil conductor faces a second coil surface of the second coil conductor, and a distance T between the first coil surface and the second coil surface satisfies a relationship T?g1×N1+g2×N2.

Abstract: An inductor structure includes a first connecting component, a second connecting component, and a center-tap terminal. In the inductor structure, a first port of the first connecting component is coupled to a first wire, and a second port of the first connecting component is coupled to a second wire. The second connecting component disposed above or beneath the first connecting component in an interlaced manner. The center-tap terminal is coupled to one of the first connecting component and the second connecting component. The center-tap terminal is disposed on a layer that is different from the layer where the first connecting component is disposed or the layer where the second connecting component is disposed.

Abstract: The present disclosure provides a package device including a redistribution layer. The redistribution layer includes a first dielectric layer, a conductive layer, and a second dielectric layer, and the conductive layer is disposed between the first dielectric layer and the second dielectric layer, wherein the redistribution layer has a test mark, the test mark includes a conductive pattern formed of the conductive layer, the conductive pattern includes a center portion and a plurality of extension portions, and the plurality of extension portions are respectively connected to the center portion.

Abstract: The present application provides a synchronous rectification assembly, a manufacturing method thereof and a power supply. The synchronous rectification assembly comprises a first circuit board, a transformer, an electrical connection piece and a second circuit board; wherein the transformer is electrically connected to the first circuit board, and the second circuit board is provided with a conductive contact for being electrically connected to an external apparatus, and the electrical connection piece is electrically connected to the first circuit board and the second circuit board respectively; the first circuit board is configured to perform synchronous rectification on the output signal of the transformer and then transmit the output signal to the conductive contact of the second circuit board through the electrical connection piece.

Abstract: A control device that controls a control target including at least a motor in a steering mechanism including an input shaft to which a steering wheel is connected, an output shaft connected to the input shaft via a torsion bar, and the motor connected to the output shaft. The control device includes a reaction force controller to generate an input torque input to the control target based on a torsion bar torque generated in the torsion bar and to control a reaction force transmitted from the steering wheel to the steering person, and an assist controller to generate a correction torque to correct the input torque based on an output of the control target and a nominal model. The assist controller is configured or programmed such that a transfer function of the control target is constrained by a transfer function of the nominal model in a frequency band.

Abstract: Various embodiments of inductor coils, antennas, and transmission bases configured for wireless electrical energy transmission are provided. These embodiments are configured to wirelessly transmit or receive electrical energy or data via near field magnetic coupling. The embodiments of inductor coils comprise a figure eight configuration that improve efficiency of wireless transmission efficiency. The embodiments of the transmission base are configured with at least one transmitting antenna and a transmitting electrical circuit positioned within the transmission base. The transmission base is configured so that at least one electronic device can be wirelessly electrically charged or powered by positioning the at least one device in contact with or adjacent to the transmission base.

Abstract: A display device includes a display module which includes a first non-folding area, a folding area, and a second non-folding area, and a digitizer which includes a first area overlapping the first non-folding area and a portion of the folding area, a second area overlapping the folding area, and a third area overlapping a portion of the folding area and the second non-folding area, where a plurality of holes is defined in the second area through the digitizer, and the digitizer includes a base layer, a plurality of first coils, a plurality of second coils, first signal lines which are connected to the plurality of first coils, overlap the first area, the second area, and the third area, and do not overlap the plurality of holes, and second signal lines connected to the plurality of second coils and overlapping the third area.

Abstract: Disclosed herein is an antenna module that includes a substrate on which a first coil is provided, a base material on which a second coil and a magnetic sheet overlapping the second coil are provided, and an adhesive layer bonding the substrate and the base material such that the first coil and the magnetic sheet overlap each other.

Abstract: A printed circuit board module comprises: a first printed circuit board; a second printed circuit board arranged on one surface of the first printed circuit board; a third printed circuit board arranged on the other surface of the first printed circuit board; and a core passing through the first printed circuit board to the third printed circuit board, wherein the second printed circuit board includes a first coil, the third printed circuit board includes a second coil, and the cross-sectional area of the second printed circuit board and the third printed circuit board is less than the cross-sectional area of the first printed circuit board.

Abstract: A multilayer coil component includes a multilayer body that contain a coil. The coil includes coil conductors. A lamination direction of the multilayer body and an axial direction of the coil are parallel to a first main surface. A distance between the coil conductors adjacent to each other in the lamination direction is from 4 ?m to 8 ?m. Each coil conductor includes a line portion and a land portion that is disposed at an end portion of the line portion. The land portions of the coil conductors adjacent to each other in the lamination direction are connected to each other with a via conductor interposed therebetween. A width of the line portion is from 30 ?m to 50 ?m. An inner diameter of each coil conductor is from 50 ?m to 100 ?m.

Abstract: A high-insulation multilayer planar transformer (1) includes a pair of iron cores (20) and a circuit board integration (10a). The circuit board integration (10a) is stacked between the iron cores (20) and has a through hole (100a). The circuit board integration (10a) includes a first to a third insulating layers (11a, 12a, 14a) and a first to a second coil windings (13a, 15a). The first and third insulating layers (11a, 14a) include at least two insulating plates (111a, 141a) stacked with each other respectively. The second insulating layer (12a) includes at least one insulating plate (121a). The coil winding (13a, 15a) is disposed between the adjacent insulating layers and surrounds the through hole (100a) planarly. Therefore, the reinforced insulation requirement of safety regulations may be achieved.

Abstract: A package substrate for a semiconductor device includes a first substrate core and an inductor embedded in the first substrate core, the inductor including a magnetic core embedded in the first substrate core and a conductive winding surrounding the magnetic core, the conductive winding including one or more first segments defined by metal patterning on the first substrate core and one or more second segments defined by one or more conductive vias extending through the first substrate core. The package substrate may further include a capacitor embedded in the first substrate core and/or in a second substrate core vertically stacked with the first substrate core.

Abstract: An electronic device includes a magnetic assembly with a multilevel lamination or metallization structure having a core layer, dielectric layers and conductive features formed in metal layers on or between the dielectric layers in respective planes of orthogonal first and second directions and stacked along an orthogonal third direction. The conductive features include first and second patterned conductive features forming first and second windings, first and second conductive capacitor plates, and first and second conductive field plates, in which the first conductive capacitor plate is between the first conductive field plate and the core layer along the third direction and the second conductive capacitor plate is between the second conductive field plate and the core layer along the third direction.

Abstract: A transformer device includes a first coil, a second coil, and a third coil. The first coil includes a first ring structure, a second ring structure, a first connecting portion, and a first terminal, in which the first terminal is arranged on the first connecting portion and is located at a central location between the first ring structure and the second ring structure, the first terminal is connected to the first ring structure through the first connecting portion in a first direction, and connected to the second ring structure through the first connecting portion in a second direction, and the first direction is the opposite of the second direction. The second coil is configured to couple the first ring structure. The third coil is configured to couple the second ring structure, in which the second coil and the third coil have the same structure.

Abstract: Outer terminal electrodes form exposed surfaces that extend in the form of a substantially L shape while at least part thereof are embedded in a component main-body. A loop conductor layer of the coil conductor has a lower side portion, lateral side portions, oblique side portions, and an upper side portion. The lower side portion has a length shorter than a gap between outer terminal electrodes, and is positioned within a range of the gap.