Printed Circuit-type Coil Patents (Class 336/200)
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Patent number: 12040125Abstract: A thin resonant transformer includes a wire bobbin having a spool, an inner winding wound around the spool, a magnetic plate mounted in the wire bobbin, an outer winding wound in the wire bobbin and encompassing the inner winding and the magnetic plate, and two symmetric magnetic cores mounted on the wire bobbin. The wire bobbin has a top provided with a top plate and a bottom provided with a bottom plate. The magnetic plate is arranged between the inner winding and the outer winding. The inner winding, the outer winding, and the two magnetic cores generate a first magnetic circuit. The magnetic plate, the inner winding, and the outer winding generate a second magnetic circuit.Type: GrantFiled: August 13, 2021Date of Patent: July 16, 2024Assignee: YU JING TECHNOLOGY CO., LTD.Inventor: Sen-Tai Yang
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Patent number: 12040671Abstract: A motor coil substrate includes a flexible substrate, and coils formed on the flexible substrate. The flexible substrate is wound N times where N is 2 or larger, the coils are formed in a multiple of 3, the flexible substrate includes a first flexible substrate and a second flexible substrate extending from the first flexible substrate and wound around the first flexible substrate, the flexible substrate has a first end and a second end on an opposite side with respect to the first end such that the first flexible substrate has a first end of the flexible substrate, the second flexible substrate is positioned on an outer side of the first flexible substrate, and the coils are formed such that a coil or coils formed on the first flexible substrate partially overlap with a coil or coils formed on the second flexible substrate.Type: GrantFiled: June 30, 2021Date of Patent: July 16, 2024Assignee: IBIDEN CO., LTD.Inventors: Haruhiko Morita, Hitoshi Miwa, Shinobu Kato, Toshihiko Yokomaku, Hisashi Kato, Takahisa Hirasawa, Tetsuya Muraki, Takayuki Furuno
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Patent number: 12040111Abstract: A multilayer coil component includes an element body containing a plurality of metal magnetic particles and a resin existing between the plurality of metal magnetic particles and a coil disposed in the element body and configured to include a plurality of electrically interconnected coil conductors. At least one of the plurality of coil conductors has a spiral shape and has conductor portions adjacent to each other when viewed from a direction along a coil axis of the coil. The conductor portion includes a straight conductor portion extending in a straight line and a connecting conductor portion connecting the straight conductor portion and constituting a corner portion of the coil conductor. The metal magnetic particles between the connecting conductor portions adjacent to each other are lower in density than the metal magnetic particles between the straight conductor portions adjacent to each other.Type: GrantFiled: September 27, 2021Date of Patent: July 16, 2024Assignee: TDK CORPORATIONInventors: Yusuke Nagai, Takashi Suzuki, Kazuhiro Ebina, Kouichi Kakuda, Kunihiko Kawasaki, Shinichi Kondo, Shinichi Sato, Seiichi Nakagawa, Mitsuharu Koike, Kazuhiro Miura
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Patent number: 12040123Abstract: A coil component includes a body having end surfaces opposing each other and side surfaces connecting the end surfaces and opposing each other, a support substrate disposed within the body and having a first surface and a second surface opposing each other, first and second coil units disposed on the first surface and the second surface of the support substrate, respectively, and each including a plurality of turns, and lead portions connected to the first and second coil units and exposed to a first end surface and a second end surface of the body, respectively. A shortest distance from an outermost turn of the first coil unit to the second end surface of the body is greater than a shortest distance from the outermost turn of the first coil unit to a first side surface of the body.Type: GrantFiled: April 14, 2021Date of Patent: July 16, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dong Hwan Lee, Dong Jin Lee, Chan Yoon, Young Ghyu Ahn
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Patent number: 12040633Abstract: The present invention suppresses leakage magnetic field. A power transfer coil configured to transmit or receive power includes: an inner coil; a first outer coil formed so as to surround the inner coil such that a magnetic flux opposite in phase to a magnetic flux outside the inner coil is generated outside the first outer coil, the first outer coil having one end connected to a first terminal and the other end connected to one end of the inner coil; and a second outer coil formed so as to surround the inner coil such that a magnetic flux opposite in phase to the magnetic flux outside the inner coil is generated outside the second outer coil, the second outer coil having one end connected to a second terminal and the other end connected to the other end of the inner coil.Type: GrantFiled: February 2, 2023Date of Patent: July 16, 2024Assignee: MAXELL, LTD.Inventor: Katsuei Ichikawa
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Patent number: 12040121Abstract: An electrical transformer and method of manufacturing an electrical transformer. The electrical transformer comprises a set of primary windings comprising first and second primary windings connected in parallel and first and second sets of secondary windings. Each of the first and second sets comprises a plurality of secondary windings that are connected in parallel. The secondary windings of the first set are electrically isolated from the secondary windings of the second set. The set of primary windings and the first and second sets of secondary windings are arranged in a stacked structure in which the secondary windings of the first set are interleaved with the secondary windings of the second set, and at least one secondary winding of the first set and/or at least one secondary winding of the second set is arranged between the first and second primary windings.Type: GrantFiled: November 17, 2020Date of Patent: July 16, 2024Assignee: EnerSys Delaware Inc.Inventors: Damien Brelivet, Maxime Roudaut, Patrick Dehem, Paul Antoine Gori, David Letombe
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Patent number: 12040122Abstract: A multilayer coil component includes an element assembly that has a first surface and second surfaces and extending in a direction orthogonal to the first surface, and terminal electrodes that has first electrode parts extending in a direction orthogonal to the first surface along the second surfaces. At least a portion of the first electrode parts of the terminal electrodes is disposed inside the element assembly. The element assembly is present between imaginary lines extending in a direction parallel to the first surface toward the second surfaces from a position farthest from the first surface in a direction orthogonal to the first surface in the first electrode parts positioned inside the element assembly and the first surface.Type: GrantFiled: April 23, 2019Date of Patent: July 16, 2024Assignee: TDK CORPORATIONInventors: Youichi Kazuta, Hajime Kato, Makoto Yoshino, Kazuya Tobita, Yuto Shiga, Noriaki Hamachi
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Patent number: 12033788Abstract: An electronic component includes an element body including two end surfaces opposite to each other and a bottom surface connected between the two end surfaces. A coil is provided in the element body and an external electrode is provided in the element body. In a first cross-section intersecting with the two end surfaces and the bottom surface of the element body, the external electrode has a first portion extending along a first surface that is one of the end surface and the bottom surface of the element body. The coil is disposed such that an outer circumferential edge of the coil faces the first surface of the element body. A shortest distance between the outer circumferential edge of the coil and the first surface of the element body is smaller than a minimum width of the first portion in a direction orthogonal to the first surface.Type: GrantFiled: October 22, 2021Date of Patent: July 9, 2024Assignee: Murata Manufacturing Co., Ltd.Inventors: Yuta Shimoda, Mitsuru Yamauchi
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Patent number: 12027925Abstract: A method of making an electromagnetic coil for use in a high-temperature electromagnetic machine includes pre-coating magnet wire with a high-temperature insulation precursor to produce pre-coated magnet wire, winding, while applying in-situ a glass-ceramic slurry, the pre-coated magnet wire into a predetermined coil shape to produce a wet-wound green coil, and thermally processing the wet-wound green coil to produce a processed coil. In some instances, a second layer of a high-temperature insulation may be applied to the processed coil to produce a further insulated processed coil, and then thermally processing the further insulated processed coil to produce a further processed electromagnetic coil.Type: GrantFiled: August 30, 2022Date of Patent: July 2, 2024Assignee: HONEYWELL INTERNATIONAL INC.Inventors: Mahdi Mohajeri, Eric Passman, Bahram Jadidian, James Piascik, Robert Dietrich, Andre Robinson, Jimmy Wiggins, Tom McHugh, Yongbae Jung
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Patent number: 12027299Abstract: Present disclosure provides a winding assembly and a magnetic element. The winding assembly includes a circuit board with a central hole and a first winding wound around the central hole in the circuit board; the first winding includes N turns of coil on at least two wiring layers; a second end of at least one turn of coil on a first wiring layers is connected to a first end of next turn of coil at corresponding position on a second wiring layer of the circuit board. The magnetic element includes a magnetic core and a winding assembly sleeved on a magnetic leg.Type: GrantFiled: April 9, 2021Date of Patent: July 2, 2024Assignee: Delta Electronics (Shanghai) CO., LTDInventors: Qi Fu, Haibin Song, Daofei Xu, Zengyi Lu, Jinfa Zhang
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Patent number: 12027297Abstract: An inductor element includes a magnetic body core provided with a through-hole, and a coil inserted through the through-hole and wound around the magnetic body core a plurality of times. The coil includes three bonding portions located on one side in a thickness direction of the magnetic body core. The three bonding portions are located on a first virtual plane that partially intersects with the coil.Type: GrantFiled: September 25, 2020Date of Patent: July 2, 2024Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Tomoki Okano, Keisuke Teranishi, Tsutomu Ishige
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Patent number: 12020841Abstract: The electronic component comprises at least a first electronic element arranged inside a first casing of magnetic material and at least a second electronic element arranged inside a second casing of magnetic material. At least a first outer surface of the first casing and at least a second outer surface of the second casing are connected to each other with a non-magnetic layer and with at least one connection support. The connection support is adapted to be tension-resistant and is adapted and arranged such that the connection support substantially completely prevents an increase in a distance between the first outer surface and the second outer surface upon heating the non-magnetic layer.Type: GrantFiled: July 24, 2020Date of Patent: June 25, 2024Assignee: Würth Elektronik eiSos GmbH & Co. KGInventor: Arpankumar Patel
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Patent number: 12020848Abstract: A multilayer coil component includes an insulator portion, a coil embedded in the insulator portion and including a plurality of coil conductor layers electrically connected together, and an outer electrode disposed on a surface of the insulator portion and electrically connected to the coil. At least one of the coil conductor layers includes an extended portion and a winding portion, and is connected to the outer electrode via the extended portion. The area S of an exposed portion of the extended portion exposed from the insulator portion is 0.018 mm2 or more.Type: GrantFiled: December 23, 2020Date of Patent: June 25, 2024Assignee: Murata Manufacturing Co., Ltd.Inventor: Shun Takai
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Patent number: 12020860Abstract: A coil component includes a molded portion having one surface and another surface opposing each other, and a wound coil disposed on the one surface of the molded portion and including an innermost turn, at least one intermediate turn, and an outermost turn disposed outwardly of a central portion of the one surface of the molded portion. A cover portion is disposed to face the one surface of the molded portion and to cover the wound coil, and first and second external electrodes are connected to the wound coil and arranged to be spaced apart from each other on the other surface of the molded portion. A thickness of one region of the cover portion disposed on the innermost turn is thicker than a thickness of another region of the cover portion disposed on the outermost turn.Type: GrantFiled: February 7, 2023Date of Patent: June 25, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Byung Soo Kang, Byeong Cheol Moon, Tae Jun Choi, Ju Hwan Yang
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Patent number: 12020843Abstract: An inductor built-in substrate includes a core substrate having an opening and a first through hole formed therein, a magnetic resin filling the opening of the core substrate and having a second through hole formed therein, a first through-hole conductor including a metal film formed in the first through hole of the core substrate, and a second through-hole conductor including a metal film formed in the second through hole of the magnetic resin. The magnetic resin includes a resin material and magnetic particles such that the metal film of the second through-hole conductor is in contact with the magnetic particles.Type: GrantFiled: November 24, 2020Date of Patent: June 25, 2024Assignee: IBIDEN CO., LTD.Inventors: Satoru Kawai, Yasuki Kimishima
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Patent number: 12020844Abstract: A measurement transformer includes a printed circuit and a magnetic core. The printed circuit includes an insulating layer, a primary through assembly and a secondary through assembly. The primary through assembly includes first primary plated through holes and second primary plated through holes extending through the insulating layer. The primary through assembly forms a portion of a primary winding of the transformer. The primary winding has a single turn. The secondary through assembly includes first secondary plated through holes and second secondary plated through holes extending through the insulating layer. The secondary through assembly forms a portion of a secondary winding of the transformer. The secondary winding includes a plurality of turns connected in series. The magnetic core extends in the thickness of the printed circuit.Type: GrantFiled: June 26, 2019Date of Patent: June 25, 2024Assignee: SAFRAN ELECTRONICS & DEFENSEInventors: Patrice Chetanneau, François Guillot
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Patent number: 12020850Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and a terminal electrode disposed on the element body. The element body has a first side face and a second side face, a first end face and a second end face, and a first main face and a second main face. The terminal electrode includes a first electrode portion and a second electrode portion. The first electrode portion has a first exposed face exposed on the first main face. The second electrode portion has a second exposed face exposed on the first end face. The first exposed face and the second exposed face are adjacent to each other interposing a ridge portion. The first exposed face is separated from an outer edge of the first main face. The second exposed face is separated from an outer edge of the first end face.Type: GrantFiled: March 3, 2021Date of Patent: June 25, 2024Assignee: TDK CORPORATIONInventors: Yuto Shiga, Hajime Kato, Junichiro Urabe, Kazuya Tobita, Youichi Kazuta, Noriaki Hamachi, Toshinori Matsuura, Yuichi Takubo
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Patent number: 12009128Abstract: A common-mode choke coil includes a multilayer body, a first coil, a second coil, a first terminal electrode, a second terminal electrode, a third terminal electrode, and a fourth terminal electrode. The multilayer body includes plural non-conductor layers. The first and second coils are incorporated in the multilayer body. The first and second terminal electrodes are connected to the first coil. The third and fourth terminal electrodes are connected to the second coil. The first coil includes a first coil conductor. The second coil includes a second coil conductor disposed along an interface between non-conductor layers different from an interface between non-conductor layers along which the first coil conductor is disposed. The first and second coil conductors each have a number of turns of less than 2.Type: GrantFiled: February 2, 2021Date of Patent: June 11, 2024Assignee: Murata Manufacturing Co., Ltd.Inventors: Kouhei Matsuura, Atsuo Hirukawa, Hiroshi Ueki
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Patent number: 12009146Abstract: Various examples of magnetic integration of matrix transformers with controllable leakage inductance are described. In one example, a transformer includes a magnetic core comprising a plurality of core legs and a leakage core leg. The leakage core leg is positioned among the plurality of core legs to control a leakage inductance of the transformer. The transformer also includes a planar winding structure. The planar winding structure includes a primary winding and a plurality of secondary windings. The primary winding and the plurality of secondary windings extend in a number of turns around the plurality of core legs, without a turn around the leakage core leg, to further control the leakage inductance of the matrix transformer.Type: GrantFiled: May 1, 2020Date of Patent: June 11, 2024Assignee: Virginia Tech Intellectual Properties, Inc.Inventors: Ahmed Nabih, Qiang Li, Fred C. Lee
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Patent number: 12009296Abstract: Semiconductor device and method of forming the same are disclosed. One of the semiconductor devices includes a semiconductor substrate, a passivation layer and a conductive pattern. The semiconductor substrate includes a conductive pad thereover. The passivation layer over the semiconductor substrate. The conductive pattern is penetrating through the passivation layer and electrically connected to the conductive pad, wherein a sidewall of the conductive pattern has at least one turning point.Type: GrantFiled: August 30, 2021Date of Patent: June 11, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventor: Wei-Kai Shih
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Patent number: 12009148Abstract: An integrated circuit includes a first conductive path over a substrate, a coil structure over the substrate, and a ferromagnetic structure. The first conductive path is configured to carry a first time-varying current and to generate a first time-varying magnetic field based on the first time-varying current. The coil structure is magnetically coupled with the first conductive path, and is configured to generate an induced electrical potential responsive to the first time-varying magnetic field. The ferromagnetic structure includes an open portion. The first conductive path extends through the open portion of the ferromagnetic structure. The first conductive path includes a first conductive line below the ferromagnetic structure, a second conductive line above the ferromagnetic structure, and a first via plug coplanar with the ferromagnetic structure. The first via plug electrically coupling the first conductive line and the second conductive line.Type: GrantFiled: January 19, 2023Date of Patent: June 11, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Alan Roth, Eric Soenen
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Patent number: 12009129Abstract: A stacked spiral inductor, comprising: a substrate, and multiple stacked insulating layers and inductive metal layers formed on the substrate by means of a semiconductor process. Each inductive metal layer comprises a conductive coil in a shape of a spiral and a through hole area used for connecting two adjacent inductive metal layers. The conductive coils of the inductive metal layers have a common coil center. In two adjacent inductive metal layers, the conductive coil of the lower inductive metal layer is retracted toward the coil center with respect to the conductive coil of the upper inductive metal layer.Type: GrantFiled: April 27, 2023Date of Patent: June 11, 2024Assignee: CSMC TECHNOLOGIES FAB2 CO., LTD.Inventor: Congying Dong
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Patent number: 12009142Abstract: A coil component includes a body having first and second end surfaces opposing each other and first and second side surfaces opposing each other in a first direction; a support substrate disposed in the body; and a coil portion including a first coil pattern disposed on the support substrate, and first and second lead-out patterns respectively exposed to the first and second end surfaces of the body. A distance between the first side surface of the body and the first lead-out pattern in the first direction is smaller than a distance between the second side surface of the body and the first lead-out pattern in the first direction, and a distance between the first side surface of the body and the second lead-out pattern in the first direction is smaller than a distance between the second side surface of the body and the second lead-out pattern in the first direction.Type: GrantFiled: March 8, 2021Date of Patent: June 11, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ji Su Jeon, Ji Young Park
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Patent number: 12002614Abstract: An inductor component includes a plurality of stacked layer structures made of component carrier material with electrically conductive plate structures, and a plurality of electrically conductive interconnect structures connecting the electrically conductive plate structures to thereby form an inductance with multiple windings.Type: GrantFiled: November 4, 2020Date of Patent: June 4, 2024Assignee: AT&S Austria Technologie & Systemtechnik AGInventors: Johannes Stahr, Gerald Weidinger, Heinz Moitzi
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Patent number: 11996229Abstract: Disclosed is a series self-resonant coil structure for wireless power transfer that includes a top coil element that is configured in a spiral and planar arrangement and a bottom coil element that is configured in a spiral and planar arrangement that is substantially similar to the arrangement corresponding to the top coil element, wherein the top coil element and the bottom coil element are positioned in a stacked arrangement in relation to each other. The coil structure further includes a dielectric layer element that is planarly positioned in between the top coil element and the bottom coil element, wherein the top coil element, the bottom coil element, and the dielectric layer element are aligned to produce series-resonance in the coil structure.Type: GrantFiled: March 7, 2019Date of Patent: May 28, 2024Assignee: University of Tennessee Research FoundationInventors: Daniel Jes Costinett, Jie Li, Ruiyang Qin
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Patent number: 11990265Abstract: A multilayer coil component includes an element body that includes a plurality of insulating layers laminated together, a coil that is embedded in the element body and that includes a coil conductor layer provided between the insulating layers, and a first outer electrode and a second outer electrode each of which is provided on at least one of outer surfaces of the element body and each of which is electrically connected to the coil. A dissimilar-material layer that is made of a material different from the insulating layers is provided on at least one of the outer surfaces of the element body that extend in a lamination direction in which the plurality of insulating layers are laminated together.Type: GrantFiled: August 21, 2019Date of Patent: May 21, 2024Assignee: Murata Manufacturing Co., Ltd.Inventors: Shimpei Tanabe, Morihiro Hamano
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Patent number: 11990266Abstract: New types of circuit elements for integrated circuits include structures wherein a thickness dimension is much greater than a width dimension and is more closely spaced than the width dimension in order to attain a tight coupling condition. The structure is suitable to form inductors, capacitors, transmission lines and low impedance power distribution networks in integrated circuits. The width dimension is on the same order of magnitude as skin depth. Embodiments include a spiral winding disposed in a silicon substrate formed of a deep, narrow, conductor-covered spiral ridge separated by a narrow spiral trench. Other embodiments include a wide, thin conductor formed in or on a flexible insulative ribbon and wound with turns adjacent one another, or a conductor in or on a flexible insulative sheet folded into layers with windings adjacent one another Further, a method of manufacture includes directional etching of the deep, narrow spiral trench to form a winding in silicon.Type: GrantFiled: November 1, 2022Date of Patent: May 21, 2024Assignee: nanoHenry, Inc.Inventor: Osman Ersed Akcasu
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Patent number: 11990269Abstract: An inductor device includes a first inductor, a second inductor, and at least one switch circuit. The second inductor is arranged to enclose the first inductor, and use a topmost layer metal to resist external interference for the first inductor. The at least one switch circuit is coupled to the second inductor, and is arranged to receive at least one control voltage, wherein the at least one control voltage is arranged to adjust conduction degree of the at least one switch circuit.Type: GrantFiled: November 21, 2021Date of Patent: May 21, 2024Assignee: Realtek Semiconductor Corp.Inventors: Yang Chang, Chia-Yi Lee, Chia-Jun Chang
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Patent number: 11984411Abstract: A semiconductor structure includes a substrate and a medium layer located on a first face of the substrate, the substrate has a plurality of first metal layers therein, the medium layer has a magnetic core therein, an orthographic projection of the magnetic core on the first face has a closed ring pattern, the first metal layer has a first end and a second end opposite to each other, an orthographic projection of the first end on the first face is located within a region surrounded by the closed ring pattern.Type: GrantFiled: November 28, 2021Date of Patent: May 14, 2024Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.Inventor: Tong Wu
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Patent number: 11983603Abstract: A quantum device includes a quantum chip and a holder. The holder includes a pedestal, a recess portion formed in a main surface of the pedestal so as to be opposed to the quantum chip, and a suction tube provided such that in the recess portion, a suction opening is positioned in a bottom surface of the quantum chip.Type: GrantFiled: July 14, 2021Date of Patent: May 14, 2024Assignee: NEC CORPORATIONInventors: Tomohiro Yamaji, Hideyuki Satou, Yoshihito Hashimoto, Aiko Uchiyama
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Patent number: 11984865Abstract: A band pass filter includes filter circuits, first and second intermediate circuits, and a first capacitor. The first intermediate circuit includes an inductor connected between second and third capacitors. The second intermediate circuit includes an inductor connected between third and fourth capacitors. Resonant circuits included in the filter circuit are connected to ground via a common capacitor. Resonant circuits included in the filter circuit are connected to the ground via a common capacitor. The first capacitor is connected between the first and second intermediate circuits.Type: GrantFiled: July 5, 2022Date of Patent: May 14, 2024Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Tetsuo Taniguchi
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Patent number: 11984254Abstract: A magnetic-component module includes a substrate, a core on a first surface of the substrate, a spacer on the core, a winding including wire bonds extending over the core and electrically connecting a first portion of the substrate and a second portion of the substrate, and traces on and/or in the substrate, a lead frame that supports the core and that electrically connects the winding to the substrate, and an overmold material encapsulating the core, the spacer, the wire bonds, and a portion of the lead frame.Type: GrantFiled: July 9, 2020Date of Patent: May 14, 2024Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Lee Francis, William Jarvis, Takayuki Tange
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Patent number: 11978584Abstract: The present disclosure provides a magnetic element and a method for manufacturing same. The method includes: forming a first metal wiring layer on a surface of at least one segment of a magnetic core; forming a first metal protection layer on the first metal wiring layer; removing a portion of the first metal protection layer with a direct writing technique to expose a portion of the first metal wiring layer; and etching the exposed first metal wiring layer in such a manner that the first metal wiring layer forms at least one first pattern to function as a winding, where at least one turn of the first pattern surrounds the magnetic core. The magnetic element and the method for manufacturing the magnetic element provided in the present disclosure can improve space utilization of the magnetic element.Type: GrantFiled: April 17, 2023Date of Patent: May 7, 2024Assignee: DELTA ELECTRONICS (SHANGHAI) CO., LTD.Inventors: Shouyu Hong, Jianping Ying, Jianhong Zeng, Chaofeng Cai, Ganyu Zhou, Pengkai Ji
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Patent number: 11978580Abstract: A first dimension of each of a first connection portion 12 and a second connection portion 14 in the direction in which a pair of side surfaces 2e and 2f face each other is smaller than an inner diameter W2 of a coil 8 in the direction and is larger than a width W1 of each of a plurality of coil conductors in the direction. A second dimension of each of the first connection portion 12 and the second connection portion 14 in the direction in which a pair of main surfaces 2c and 2d face each other is larger than a thickness H1 of each of the plurality of coil conductors in the direction and is smaller than a height H2 of the coil 8 in the direction.Type: GrantFiled: November 26, 2019Date of Patent: May 7, 2024Assignee: TDK CORPORATIONInventors: Kazuya Tobita, Yuto Shiga, Youichi Kazuta, Noriaki Hamachi
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Patent number: 11978581Abstract: A magnetic-component module includes a substrate, a core on a first surface of the substrate, a spacer on the core, a gap between a bottom surface of the core and the first surface of the substrate, a winding including wire bonds extending over the core and electrically connecting a first portion of the substrate and a second portion of the substrate, and traces on and/or in the substrate, and an overmold material encapsulating the core, the spacer, and the wire bonds and filling the gap.Type: GrantFiled: July 9, 2020Date of Patent: May 7, 2024Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Lee Francis, William Jarvis, Takayuki Tange, Shouhei Hirose
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Patent number: 11978596Abstract: A multilayer ceramic capacitor includes a stacked body and external electrodes. The stacked body includes stacked dielectric layers and internal electrodes. The external electrodes are disposed on lateral surfaces of the stacked body and are connected to the internal electrodes. A ratio of min to max is not less than about 36% and not more than about 90%, where A1, A2, A3, and A4 respectively denote the surface areas of first, second, third, and fourth external electrodes that are located on the first or second main surface of the stacked body.Type: GrantFiled: March 24, 2023Date of Patent: May 7, 2024Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Satoshi Muramatsu
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Patent number: 11972889Abstract: A reactor is provided with a coil including a pair of winding portions arranged in parallel, a magnetic core to be arranged inside and outside the winding portions, a case for accommodating an assembly including the coil and the magnetic core, a leaf spring fitting for pressing the assembly toward an inner bottom surface of the case, and a sealing resin portion to be filled into the case. Each of the winding portions is so arranged that an arrangement direction of the winding portions is along a depth direction of the case. The case includes an opening having a rectangular planar shape. The leaf spring fitting is arranged in a state curved toward the inner bottom surface by having both end parts of the leaf spring fitting directly pressed against parts of inner wall surfaces of the case facing each other in a long side direction.Type: GrantFiled: November 8, 2019Date of Patent: April 30, 2024Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Takehito Kobayashi, Kohei Yoshikawa, Seiji Shitama, Kazuhiro Inaba, Naotoshi Furukawa
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Patent number: 11972896Abstract: The present invention is directed to a compact inductor having the required (predetermined) inductance and current rating, further designed to avoid substantial heat generation by avoiding saturation, winding(s) possessing a low DC resistance and copper loss, and minimizing the required volume or profile in order to conserve circuit board real-estate. The compact inductor design of the present invention includes both enclosed core as well as enclosed winding type of inductor designs.Type: GrantFiled: September 18, 2020Date of Patent: April 30, 2024Assignee: VIRGINIA TECH INTELLECTUAL PROPERTIES, INC.Inventors: Khai Doan The Ngo, Han Cui
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Patent number: 11967448Abstract: A planar transformer may include a primary printed circuit board (PCB) having at least a hole in which a first core and a second core are inserted and including a coil pattern, a secondary PCB having at least a hole in which the first core and the second core are inserted and including a coil pattern, and a heat dissipation plate disposed between the primary PCB and the secondary PCB and including at least a hole in which the first core and the second core are inserted.Type: GrantFiled: November 30, 2020Date of Patent: April 23, 2024Assignees: Hyundai Motor Company, Kia Motors CorporationInventor: Dae Woo Lee
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Patent number: 11961922Abstract: A distributed power harvesting system including multiple direct current (DC) power sources with respective DC outputs adapted for interconnection into an interconnected DC power source output. A converter includes input terminals adapted for coupling to the interconnected DC power source output. A circuit loop sets the voltage and current at the input terminals of the converter according to predetermined criteria. A power conversion portion converts the power received at the input terminals to an output power at the output terminals. A power supplier is coupled to the output terminals. The power supplier includes a control part for maintaining the input to the power supplier at a predetermined value. The control part maintains the input voltage and/or input current to the power supplier at a predetermined value.Type: GrantFiled: May 5, 2023Date of Patent: April 16, 2024Assignee: Solaredge Technologies Ltd.Inventors: Guy Sella, Lior Handelsman, Yoav Galin, Amir Fishelov, Meir Adest
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Patent number: 11959942Abstract: A rate of change of current sensor includes two measurement coils, arranged such that the turns of the first and second measurement coils are interleaved. The rate of change of current sensor further comprises two return coils, arranged to progress in an opposite direction to the measurement coils. The coils form loops and progress substantially around a target measurement conductor. This ensures that the two measurement coils both receive the same electrostatic coupling from external conductors which are not the target of the measurement operation. Further, the two measurement coils are arranged such that the first coil and the second coil are, on average, the same distance to the current-carrying conductor of interest.Type: GrantFiled: March 15, 2022Date of Patent: April 16, 2024Assignee: Analog Devices International Unlimited CompanyInventors: Brent William Hoffman, Jonathan Ephraim David Hurwitz
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Patent number: 11961655Abstract: A multilayer coil component includes an insulator portion, a coil in the insulator portion and including coil conductor layers electrically connected together, and an outer electrode on a surface of the insulator portion and electrically connected to the coil. The multilayer coil component has a void at a boundary between one main surface of each coil conductor layer and the insulator portion. At least one of the coil conductor layers includes extended and winding portions, and is connected to the electrode via the extended portion. Viewing the multilayer coil component in plan view in a stacking direction, an end of the void at the extended portion facing the electrode to which the extended portion is connected is closer to the electrode than is an end, facing the electrode, of the void at the coil conductor layer to which the extended portion is adjacent in the stacking direction.Type: GrantFiled: December 23, 2020Date of Patent: April 16, 2024Assignee: Murata Manufacturing Co., Ltd.Inventor: Shun Takai
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Patent number: 11961653Abstract: An electronic component includes an element body including two end surfaces opposite to each other and a bottom surface connected between the two end surfaces. A coil is provided in the element body and an external electrode is provided in the element body. In a first cross-section intersecting with the two end surfaces and the bottom surface of the element body, the external electrode has a first portion extending along a first surface that is one of the end surface and the bottom surface of the element body. The coil is disposed such that an outer circumferential edge of the coil faces the first surface of the element body. A shortest distance between the outer circumferential edge of the coil and the first surface of the element body is smaller than a minimum width of the first portion in a direction orthogonal to the first surface.Type: GrantFiled: February 3, 2021Date of Patent: April 16, 2024Assignee: Murata Manufacturing Co., Ltd.Inventors: Yuta Shimoda, Mitsuru Yamauchi
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Patent number: 11959943Abstract: A magnetic field detection apparatus includes a magnetoresistive effect element and a conductor. The magnetoresistive effect element includes a magnetoresistive effect film extending in a first axis direction and including a first end part, a second end part, and an intermediate part between the first and second end parts. The conductor includes a first part and a second part that each extend in a second axis direction inclined with respect to the first axis direction. The conductor is configured to be supplied with a current and thereby configured to generate an induction magnetic field to be applied to the magnetoresistive effect film in a third axis direction orthogonal to the second axis direction. The first part and the second part respectively overlap the first end part and the second end part in a fourth axis direction orthogonal to both of the second axis direction and the third axis direction.Type: GrantFiled: May 26, 2022Date of Patent: April 16, 2024Assignee: TDK CORPORATIONInventors: Norikazu Ota, Kenzo Makino, Hiraku Hirabayashi
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Patent number: 11955264Abstract: A coil component includes an element and a coil disposed in the element. The element includes a plurality of first magnetic layers and second magnetic layers laminated. The coil includes a plurality of coil conductive layers laminated. Each of the coil conductive layers is disposed between a corresponding one of the first magnetic layers and a corresponding one of the second magnetic layers. A pore area proportion in the second magnetic layers is smaller than a pore area proportion in the first magnetic layers. A void is present between the coil conductive layer and the corresponding one of the second magnetic layers.Type: GrantFiled: July 15, 2020Date of Patent: April 9, 2024Assignee: Murata Manufacturing Co., Ltd.Inventor: Takashi Sakai
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Patent number: 11955269Abstract: A manufacturing method of a coil component includes: providing an assembly including a wound-wire part formed by winding, around a core, a conductive wire coated with a coating; and a lead part pulled out outwardly from the wound-wire; removing a portion of the coating from the conductive wire at a location outwardly extending away from the wound-wire part, wherein an entire coating over an entire circumference of the conductive wire at the portion of the coating is removed; providing a terminal electrode with a connecting part; forming a joining part at an end of the coating-removed lead conductive wire to electrically connect the terminal electrode to the lead part via the joining part by irradiating a laser from the connecting part toward the coating-removed lead conductive wire while restricting an irradiation range of the laser within a range where the coated lead conductive wire is not included.Type: GrantFiled: January 15, 2021Date of Patent: April 9, 2024Assignee: TAIYO YUDEN CO., LTD.Inventors: Takanori Yoshizawa, Kenji Watanabe
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Patent number: 11955276Abstract: A coil component includes an insulator part and a coil part. The insulator part is constituted by an electrical insulation material, and is no more than 600 ?m long and no more than 600 ?m high. The coil part is wound around one axis and placed inside the insulator part. The coil part has an opening part constituted by straight line parts and curved line parts and whose shape as viewed from the one axis direction is an approximate quadrangle, wherein the line length of the curved line parts along the inner periphery of the opening part is 20% or more but no more than 40% of the line length of the inner periphery of the opening part. The coil component can satisfy both a size reduction need and the properties need.Type: GrantFiled: August 2, 2021Date of Patent: April 9, 2024Assignee: TAIYO YUDEN CO., LTD.Inventors: Takayuki Sekiguchi, Tsuyoshi Ogino
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Patent number: 11948729Abstract: A transformer comprising a primary winding and a secondary winding. The primary winding has N2 number turns and having a first terminal and a second terminal. The secondary winding has having N1 fractional portions, which together form a full turn, are in close proximity to the primary winding to establish coupling between the primary winding and the N1 fractional coil portions, the transformer turn ratio from the primary winding to the secondary winding is N2:(N3/N1) where N2 is an integer equal to or greater than 1, N1 is an integer greater than or equal to 2, and N3 is an integer greater than or equal to 1. Also disclosed is a stacked integrated transformer having a primary winding and secondary winding of which one or both have a waterfall structure and a portion of which functions as a ground connected shield between the secondary winding and the primary winding.Type: GrantFiled: September 3, 2019Date of Patent: April 2, 2024Inventor: Sehat Sutardja
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Patent number: 11948735Abstract: To improve the accuracy in the use of inductive components, the invention provides a method for producing a planar coil assembly (32) comprising n planar coil units (10) arranged on top of the other, wherein n is a natural number greater than 1, the method comprising: a) creating an i-th planar coil unit (10) by producing, with the aid of a computer, at least one planar coil (12) made of an electric conductor and having a planar coil thickness diPS on an insulating material layer (14) made of electric insulating material having a layer thickness di,IM, for i equal to 1 to n, and b) arranging the planar coil units (10) in layers, with the interposition of the insulating material layer (14) between the planar coils (12), wherein the thicknesses di,PS and di,IM, are selected such that 0 , 6 ? D PS D IM + D PS ? 0 , 9 , applies.Type: GrantFiled: April 10, 2019Date of Patent: April 2, 2024Assignee: Trafag AGInventors: Anatol Schwersenz, Viktoria Riesling, Sebastian Schwiertz
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Patent number: 11948717Abstract: A coil device includes: a drum core having first and second flange portions and a winding core portion therebetween; a coil wound around the core portion; a plate core connected to first and second flange portions first and second flange surfaces at a first direction side; a first electrode terminal on the first flange portion, one coil end portion electrically connected on the first electrode terminal; and a second electrode terminal on the second flange portion, the other coil end portion electrically connected on the second electrode terminal. The plate core has a first and second projecting portions respectively protruding toward the first and second flange surfaces and having first and second flat surfaces facing the first and second flange surfaces. The drum core and the plate core are connected by abutting and bonding the first and second flange surfaces against the first and second flat surfaces.Type: GrantFiled: August 25, 2020Date of Patent: April 2, 2024Assignee: TDK CORPORATIONInventors: Ryoei Shinohara, Takashi Arasawa, Yoshihiro Kawasaki, Munehito Nishimura