Abstract: A multilayer coil component 1 includes an element 2 having a plurality of stacked insulator layers 6 and a coil 8 disposed in the element 2. The coil 8 has a plurality of coil conductors and a connection conductor interconnecting one of the coil conductors and another of the coil conductors. A plurality of the connection conductors are spaced apart only in a direction intersecting with an extension direction of the coil conductors at a position of the connection by the connection conductor.

Abstract: Structures that include a peaking inductor and a T-coil, and methods associated with forming such structures. A back-end-of-line interconnect structure includes a first metallization level, a second metallization level, and a third metallization level arranged between the first metallization level and the second metallization level. The T-coil includes a first inductor with a first coil arranged in the first metallization level and a second inductor with a second coil arranged in the second metallization level. A peaking inductor includes a coil arranged in the third metallization level. The first coil of the first inductor, the second coil of the second inductor, and the coil of the peaking inductor are stacked in the back-end-of-line interconnect structure with an overlapping arrangement.

Abstract: An electronic structure comprises: a circuit board, wherein a plurality of electronic devices and a transformer are disposed on the circuit board, the transformer comprises a first coil, a second coil, and a magnetic body, wherein a molding body encapsulates at least one portion of the outer surface of the first coil, at least one portion of the outer surface of the second coil, and the plurality of electronic devices for electrically isolating the plurality of electronic devices from the transformer.

Abstract: Embodiments described herein provide circuitry employing one or more inductors having an unconventional turn-ratio. The circuitry includes a primary inductor having a first length located on a first layer of an integrated circuit (IC). The circuitry further includes a secondary inductor having a second length located on a second layer of the IC different from the first layer, whereby the second length is greater than the first length, with a ratio between the first and the second lengths corresponding to a non-integer turn-ratio.

Abstract: An electronic component includes a capacitor body having alternately stacked first and second internal electrodes with dielectric layers therebetween, the capacitor body having first to sixth surfaces and the first internal electrodes and the second internal electrodes being exposed through the third surface and the fourth surface, respectively. First and second external electrodes are disposed respectively on the third and fourth surfaces of the body and respectively connected to the first and second internal electrodes. A shielding layer includes a cap portion disposed on the second surface of the capacitor body and a side wall portion disposed on the third, fourth, fifth, and sixth surfaces of the capacitor body, and an insulating layer is disposed between the capacitor body and the shielding layer. The shielding layer consists of first and second shielding layers offset from each other in a direction connecting the third and fourth surfaces.

Abstract: According to one or more embodiments, a semiconductor integrated circuit device includes a first inductor portion, a second inductor portion, and a third inductor portion. The first inductor portion is in a first region of a first wiring layer. The second inductor portion is disposed in a second region of the first wiring layer. The third inductor portion is on a second wiring layer spaced from the first wiring layer in a first direction. The third inductor portion includes a first end portion electrically connected to a first end of the first inductor portion, a second end portion electrically connected to a first end of the second inductor portion, and a third end portion between the first and second end portions. The first inductor portion, the second inductor portion, and the third inductor portion constitute an inductor element.

Abstract: The present disclosure provides a coil component including an element assembly containing a filler and a resin material, a coil portion composed of a coil conductor embedded in the element assembly, and a pair of outer electrodes electrically coupled to the coil conductor. A relatively thin first conductor layer and a relatively thick second conductor layer are stacked in the coil conductor.

Abstract: A multilayer coil component includes a multilayer body, and first and second outer electrodes. The multilayer body is formed by stacking plural insulating layers in a length direction, and includes a coil incorporated therein. The first and second outer electrodes are electrically connected to the coil. The coil is formed by electrically connecting plural coil conductors. The multilayer body has first and second end surfaces, first and second major surfaces, and first and second lateral surfaces. Each coil conductor has a line portion, and a land portion. As viewed in plan in the stacking direction, the land portion is not located inside the inner periphery of the line portion, and partially overlaps the line portion. As viewed in plan in the stacking direction, the land portion has a diameter of from about 1.05 times to about 1.3 times the line width of the line portion.

Abstract: A filter circuit includes a branch line coupler and a balun circuit having an input terminal connected to the branch line coupler to receive a signal, a first line connected to the input terminal and having a length comparable to a quarter of an electrical length of one wavelength at a frequency of the signal, a second line connected to the input terminal and having a length comparable to the quarter, a third line connected to the second line and having a length comparable to the quarter, and a fourth line connected to the third line and electromagnetically coupled to the first line, the fourth line having a length comparable to the quarter, wherein an end of the first line and an end of the fourth line are both connected to a ground or open-circuited, or are connected to two respective terminating resistors whose resistance values are equal.

Abstract: The present disclosure is related to a power module power structure and an assembling method thereof. The power module structure includes a first printed-circuit-board (PCB) assembly, a second PCB assembly, and a conductive connection component. The first PCB assembly includes a first circuit board, a power switch and a magnetic component. The first circuit board includes a first side, a second side and a through hole. The power switch is disposed on the first circuit board. The magnetic component includes a first magnetic core and a second magnetic core fastened on the first circuit board through the through hole. The second PCB assembly includes a second circuit board having a third side, a fourth side and at least one opening. The second magnetic core is exposed through the opening. The conductive connection component is disposed and electrically connected between the first PCB assembly and the second PCB assembly.

Abstract: To provide a new type of coil component capable of providing a high inductance and excellent in insulation reliability. A coil component according to one embodiment of the present invention is provided with an insulating body, a first external electrode provided on a surface of the insulating body, a second external electrode provided on a surface of the insulating body, and a coil conductor provided between the first external electrode and the second external electrode. In the coil conductor, a conductor pattern having a larger potential difference from the second external electrode is arranged farther from the second external electrode, and a conductor pattern having a larger potential difference from the first external electrode is arranged farther from the first external electrode.

Abstract: A coil component includes a body, a coil portion embedded in the body, first and second external electrodes spaced apart from each other on an external surface of the body and connected to the coil portion, and an identification portion in which a plurality of fine patterns spaced apart from one another are grouped and which is disposed on the external surface of the body. Each of the plurality of fine patterns includes an insulating resin.

Abstract: A bonding structure of a sheet core and a pair of flange parts wherein the pair of flange parts is formed on both ends of a shaft part to constitute a drum core together with the shaft part; the sheet core is bonded, in a manner connecting the pair of flange parts across the shaft part, to the top faces of the flange parts facing away from the bottom faces of the flange parts to be mounted on a circuit board; and a coil-shaped conductor is constituted by sheathed conductive wires wound around the shaft part; wherein the bonding surfaces of each of the flange parts and the sheet core have multiple contact areas where the flange part makes direct contact with the sheet core, as well as adhesive areas between the contact areas where an adhesive is disposed.

Abstract: Embodiments may relate to a microelectronic package or a die thereof which includes a die, logic, or subsystem coupled with a face of the substrate. An inductor may be positioned in the substrate. Electromagnetic interference (EMI) shield elements may be positioned within the substrate and surrounding the inductor. Other embodiments may be described or claimed.

Abstract: A multilayer coil component includes a multilayer body that is formed by stacking a plurality of insulating layers on top of one another and that has a coil built into the inside thereof; and a first outer electrode and a second outer electrode that are electrically connected to the coil. The coil is formed by electrically connecting a plurality of coil conductors, which are stacked together with insulating layers, to one another. A first main surface of the multilayer body is a mounting surface. A stacking direction of the multilayer body and an axial direction of the coil are parallel to the mounting surface. The coil includes a plurality of different coil conductors having different coil diameters, and shortest distances from the first main surface to the coil conductors are identical for all of the plurality of different coil conductors.

Abstract: A coil device has a core including a winding core portion and a flange portion formed on an X-axis-direction end portion of the winding core portion, a coil portion formed by wires being wound around the winding core portion, and terminal electrodes provided on the flange portion. Leadout portions of the wires are respectively connected to the terminal electrodes. A main protuberance having a protuberating shape is formed on an upper surface of the flange portion. The first and second leadout portions of the wires are connected to the first and second terminal electrodes outside the main protuberance in the X-axis direction.

Abstract: A coil component includes a body including a plurality of effective layers stacked in one direction; a coil portion embedded in the body, the coil portion including a plurality of coil patterns respectively disposed in the plurality of effective layers, the coil portion further including a lead-out pattern; and a core penetrating through an interior of the coil portion, wherein the coil portion further includes a resistance reducing portion extending from an outer circumferential surface of each of the coil patterns to an outside of the core in a respective one of the effective layers in a radially outward direction of the coil portion.

Abstract: A semiconductor package substrate includes an integral magnetic-helical inductor that is assembled during assembly of the semiconductor package substrate. The integral magnetic-helical inductor is located within a die footprint within the semiconductor package substrate.

Abstract: A semiconductor device package includes a substrate, a first patterned conductive layer, a second patterned conductive layer, a dielectric layer, a third patterned conductive layer and a connector. The substrate has a top surface. The first patterned conductive layer is on the top surface of the substrate. The second patterned conductive layer contacts the first patterned conductive layer. The second patterned conductive layer includes a first portion, a second portion and a third portion. The second portion is connected between the first portion and the third portion. The dielectric layer is on the top surface of the substrate. The dielectric layer covers the first patterned conductive layer and surrounds the second portion and the third portion of the second patterned conductive layer. The first portion of the second patterned conductive layer is disposed on the dielectric layer.

Abstract: An inductor component that includes an element body; a coil wiring line that is arranged parallel to a first main surface of the element body inside the element body; and a first vertical wiring line and a second vertical wiring line that are buried inside the element body so that end surfaces thereof are exposed from the first main surface of the element body and that are electrically connected to the coil wiring line. In a first cross section that is perpendicular to a direction in which the coil wiring line extends and intersects the first vertical wiring line, a top surface of the coil wiring line contacts a bottom surface of the first vertical wiring line and the top surface of the coil wiring line is substantially shaped like a convex surface.

Abstract: An on-chip transformer circuit is disclosed. The on-chip transformer circuit comprises a primary winding circuit comprising at least one turn of a primary conductive winding arranged as a first N-sided polygon in a first dielectric layer of a substrate; and a secondary winding circuit comprising at least one turn of a secondary conductive winding arranged as a second N-sided polygon in a second, different, dielectric layer of the substrate. In some embodiments, the primary winding circuit and the secondary winding circuit are arranged to overlap one another at predetermined locations along the primary conductive winding and the secondary conductive winding, wherein the predetermined locations comprise a number of locations less than all locations along the primary conductive winding and the secondary conductive winding.

Abstract: A coil component includes a main body portion containing resin, a coil provided in the main body portion, and an outer electrode electrically connected to the coil. A recess extending from a top surface of the main body portion toward a bottom surface thereof is provided in the side surface of the main body portion. The outer electrode is disposed in the recess, and a wall layer is interposed between the outer electrode and the inner surface of the recess.

Abstract: A multilayer coil component includes an element body and a plurality of coil conductors. The element body includes a plurality of metal magnetic particles and resin existing between the plurality of metal magnetic particles. The plurality of coil conductors is disposed in the element body, the plurality of coil conductors being separated from each other in a predetermined direction and electrically connected to each other. The plurality of metal magnetic particles included in the element body includes a plurality of metal magnetic particles having a particle size equal to or greater than one third of a distance between the coil conductors adjacent to each other in the predetermined direction and equal to or less than a half of the distance. Between the coil conductors adjacent to each other in the predetermined direction, the metal magnetic particles having the particle size are distributed along the predetermined direction.

Abstract: Wireless charging devices, methods of manufacture thereof, and methods of charging electronic devices are disclosed. In some embodiments, a wireless charging device includes a controller, a molding material disposed around the controller, and an interconnect structure disposed over the molding material and coupled to the controller. The wireless charging device includes a wireless charging coil coupled to the controller. The wireless charging coil comprises a first portion disposed in the interconnect structure and a second portion disposed in the molding material. The wireless charging coil is adapted to provide an inductance to charge an electronic device.

Abstract: A magnetic material and an inductor capable of attaining both higher magnetic permeability and improved DC superposition characteristics. A composite magnetic material contains metal magnetic particles, in which the metal magnetic particles include first particles having a median diameter D50 of 1.3 ?m or more and 5.0 ?m or less (i.e., from 1.3 ?m to 5.0 ?m), and second particles having a median diameter D50 larger than the first particles. The first and second particles each include a core portion made of a metal magnetic material, and an insulating film provided on a surface of the core portion. The insulating film of the second particles has an average thickness of 40 nm or more and 100 nm or less (i.e., from 40 nm to 100 nm). The insulating film of the first particles has an average thickness smaller than that of the insulating film of the second particles.

Abstract: An electromagnetic component assembly includes a first magnetic core piece, a second magnetic core piece, and an inverted U-shaped conductive winding including a base section and first and second legs extending from base section. One of the first and second magnetic core pieces is configured to receive the base section. The first and second magnetic core pieces are gapped from one another to define a first gap, and one of the first and second magnetic core pieces includes a second gap that, in combination with the first gap, allows the component to be operated at more than one stable open circuit inductance (OCL) corresponding to different current loads.

Abstract: An inductor includes a first metallization layer multi-turn trace. The inductor also includes a second metallization layer multi-turn trace coupled to the first metallization layer multi-turn trace through at least one first via. The inductor further includes a plurality of discrete third metallization layer trace segments coupled to the second metallization layer multi-turn trace through a plurality of second vias.

Abstract: A coil electronic component includes a body having first to fourth surfaces, an insulating substrate disposed in the body, coil portions disposed on opposing surfaces of the insulating substrate, respectively, a first lead-out portion connected to one of the coil portions and exposed from the first and third surfaces, a second lead-out portion connected to another of the coil portions and exposed from the second and third surfaces, and first and second external electrodes covering the first and second lead-out portions, respectively. The insulating substrate includes a support portion supporting the coil portions, a first end portion extending from the support portion and including end surfaces respectively exposed from the first and third surfaces and spaced apart from each other, and a second end portion extending from the support portion and including end surfaces exposed from the second and third surfaces and spaced apart from each other.

Abstract: A coil assembly includes: a connection substrate including a coil pad and an accommodating portion disposed in a position adjacent to the coil pad; and a coil portion including a spiral wiring and an end portion bonded to the coil pad, wherein at least a portion of the coil portion is disposed in the accommodating portion.

Abstract: A multilayer coil component includes a multilayer body formed by stacking a plurality of insulating layers in a length direction and that has a built-in coil, and first and second outer electrodes that are electrically connected to the coil. The coil is formed by a plurality of coil conductors stacked in the length direction being electrically connected to each other. The first and second outer electrodes respectively cover parts of first and second end surfaces and parts of a first main surface. A stacking direction of the multilayer body and an axial direction of the coil are parallel to the first main surface. In a plan view from the stacking direction, a repeating shape of the coil conductors is a non-circular shape, and distances between the first main surface and the parts of the coil conductors that face the first main surface are not constant.

Abstract: A coil device includes a core including a winding core portion and a flange portion provided in an end portion of the winding core portion in an X-axis direction, a coil portion formed by a first wire and a second wire being wound around the winding core portion, and a first terminal electrode formed on one end side of the flange portion in a Y-axis direction, a first lead portion of the first wire being connected to the first terminal electrode, and a second terminal electrode formed on the other end side of the flange portion in the Y-axis direction, a second lead portion of the second wire being connected to the second terminal electrode. The width of the flange portion along X-axis-direction is different between one end and the other end of the flange portion in the Y-axis-direction.

Abstract: An inductor component includes an element assembly having a first surface and a second surface located opposite to the first surface, a first direction-distinguishing layer disposed on the first surface, and a second direction-distinguishing layer disposed on the second surface. The first direction-distinguishing layer has a first cavity passing through in the thickness direction. The second direction-distinguishing layer has a second cavity passing through in the thickness direction. The element assembly has a first exposed portion that is part of the element assembly and that is exposed in the first cavity and has a second exposed portion that is part of the element assembly and that is exposed in the second cavity. The first amount of protrusion of the first exposed portion protruding in the thickness direction is less than the second amount of protrusion of the second exposed portion protruding in the thickness direction.

Abstract: Examples are disclosed that relate to sensing a position of a surface proximate to a resonant LC sensor. One example provides a method on a sensing device comprising one or more resonant LC sensors each configured to output a signal responsive to a position of a surface proximate to the resonant LC sensor. The method comprises, for each LC sensor, generating an oscillating signal on an antenna of the resonant LC sensor and detecting a near-field response of the resonant LC sensor at a selected frequency.

Abstract: A coil component includes a body, a support substrate embedded in the body, a first coil portion and a second coil portion disposed on the support substrate, a first external electrode and a second external electrode disposed on one end surface of the body to be spaced apart from each other, a third external electrode and a fourth external electrode disposed on the other end surface of the body to be spaced apart from each other, a surface insulating layer disposed on one surface of the body connecting the one end surface and the other end surface of the body to each other, and an edge protection layer disposed between the first and second external electrodes and between the third and fourth external electrodes in the one end surface and the other end surface of the body, and having one end portion extending upwardly of the surface insulating layer.

Abstract: A multi-layer ceramic electronic device includes an element body and terminal electrodes. The terminal electrodes include end electrode parts covering ends of the element body in which internal electrode layers are led and upper electrode parts continuing to the end electrode parts and each partially covering an upper surface of the element body in a lamination direction. The terminal electrodes are not substantially formed on a lower surface of the element body located opposite to the upper surface of the element body in the lamination direction.

Abstract: A coupled inductor includes a ladder magnetic core including (a) a first rail and a second rail separated from each other in a first direction and (b) a plurality of rungs separated from each other in a second direction. The second direction is orthogonal to the first direction, and each rung of the plurality of rungs is disposed between the first rail and the second rail in the first direction. The coupled inductor further includes a plurality of windings, where each winding of the plurality of windings is partially wound around a respective one of the plurality of rungs such that each winding of the plurality of windings does not overlap with itself when the coupled inductor is viewed cross-sectionally in a third direction. The third direction is orthogonal to each of the first direction and the second direction.

Abstract: A mobile terminal is provided with a housing, a circuit board included in the housing and having a thickness direction normal to a plane of the circuit board, a battery pack included in the housing, and a non-contact charging module included in the housing. The non-contact charging module includes a charging coil formed of a wound conducting wire; a communication coil arranged adjacent to the charging coil; and a magnetic sheet on which the charging coil and the communication coil are arranged. The magnetic sheet has four edges that collectively define a rectangular profile of the magnetic sheet, and at most three pairs of adjacent edges respectively meet to form at most three corners. At least a portion of the non-contact charging module overlaps with the circuit board as viewed in the thickness direction of the circuit board.

Abstract: An uplink multiple input-multiple output (MIMO) transmitter apparatus includes a transmitter chain that includes a sigma-delta circuit that creates a summed (sigma) signal and a difference (delta) signal from two original signals to be transmitted. These new sigma and delta signals are amplified by power amplifiers to a desired output level before having two signals reconstructed from the amplified sigma and amplified delta signals by a second circuit. These reconstructed signals match the two original signals in content but are at a desired amplified level relative to the two original signals. The reconstructed signals are then transmitted through respective antennas as uplink signals. By employing this uplink MIMO transmitter apparatus, it is possible to use smaller power amplifiers, which may reduce footprint, power consumption, and costs of the uplink MIMO transmitter apparatus.

Abstract: A multilayer coil component includes a multilayer body formed by stacking a plurality of insulating layers on top of one another and that has a coil built thereinto, and a first outer electrode and a second outer electrode that are electrically connected to the coil. The coil is formed by electrically connecting a plurality of coil conductors. A first main surface of the multilayer body is a mounting surface. A stacking direction of the multilayer body is parallel to the mounting surface. The multilayer coil component includes first and second connection conductors. The first and second connection conductors overlap the coil conductors in a plan view from the stacking direction and are located closer to the mounting surface than a center axis of the coil. Distances between adjacent coil conductors are not constant in a side view from a direction perpendicular to the stacking direction.

Abstract: A coil component includes a support substrate, a first coil and a second coil disposed on the support substrate to be spaced apart from each other, and a body including a first core and a second core penetrating through the first coil portion and the second coil portion and spaced apart from each other. The first coil portion has a first winding portion, forming at least one turn about the first core, and a first extension portion extending from one end portion of the first winding portion to surround the first core and the second core. The second coil has a second winding portion, forming at least one turn about the second core, and a second extension portion extending from one end portion of the second winding portion to surround the first core and the second core. A separation distance between a given turn of the first coil portion and an adjacent turn of the second coil portion is different from a separation distance between adjacent turns of the first coil portion.

Abstract: An electronic component includes an element provided with a recess, a mounting conductor disposed in the recess, and an internal conductor disposed inside the element and connected to the mounting conductor. A first region includes a first surface. A second region includes a third surface connecting a second surface and the first surface. The second surface and the third surface overlap with the first surface as viewed in a direction in which the first surface and the second surface face each other. The internal conductor is connected to the second region away from a connection portion between the first surface and the third surface.

Abstract: A coil component includes a mold portion having a first surface and the second surface opposing each other, a winding coil disposed in the second surface of the mold portion, a cover portion disposed on the mold portion and the winding coil, and accommodating grooves on the first surface of the mold portion to be spaced apart from each other, and in which both ends of the winding coil are disposed, the accommodating grooves extend from one side of the mold portion in a width direction, and a minimum distance from the accommodating grooves to the second surface of the mold portion increases or decreased in the width direction.

Abstract: It would be advantageous to reduce weight and size of high voltage power supplies, to increase frequency of pulses of high voltage, and to improve control of magnitude of high voltage. The embodiments of high voltage power supplies described herein can solve these problems. The high voltage power supply can be used with an x-ray tube. The high voltage power supply can comprise an array of planar transformers each defining a stage with an AC input and a DC output. Each stage can comprise a pair of flat, coil windings adjacent one another and including a primary winding electrically-coupled to the AC input and configured to induce a current in a secondary winding. At least two stages can be electrically-coupled together in series with the DC output of one stage electrically-coupled to an input of the other stage such that a voltage is amplified across the stages.

Abstract: A three-dimensional integrated circuit (3DIC) and techniques for fabricating a 3DIC. An example semiconductor device generally includes an integrated circuit (IC) having a first plurality of pads coupled to components of the IC, wherein a first oxide material is disposed between the first plurality of pads, and a second plurality of pads, wherein at least a portion of the first plurality of pads is bonded to at least a portion of the second plurality of pads, and wherein a second oxide material is disposed between the second plurality of pads and is bonded to the first oxide material b. The semiconductor device may also include a substrate disposed above the second plurality of pads, one or more passive devices adjacent to the substrate, and one or more vias formed through the substrate, wherein at least one of the second plurality of pads is coupled to the one or more vias.

Abstract: The present invention is an inductor element having a conductor wound in a coil form, and a core part surrounding the coil and including a magnetic powder and a resin. The core part includes a top board part and a bottom board part respectively covering both ends of the coil, and an outer circumference part positioned at an outer circumference side of the coil, and a resin content of the outer circumference part is larger than a resin content of the top board part and also larger than a resin content of the bottom board part.

Abstract: A multilayer-type on-chip inductor with a conductive structure includes an insulating redistribution layer disposed on an inter-metal dielectric layer, a first spiral trace layer disposed in the insulating redistribution layer, and a second spiral trace layer disposed in the inter-metal dielectric layer and correspondingly formed below the first spiral trace layer. The inter-metal dielectric layer has a separating region to divide the second spiral trace layer into line segments. First slit openings each passes through a corresponding line segment, and extends in an extending direction of a length of the corresponding line segment.

Abstract: Disclosed herein is a coil component that includes a first coil part spirally wound in a plurality of turns, the first coil part including a first turn positioned at an innermost periphery and a second turn positioned on an outer peripheral side relative to the first turn; and a second coil part spirally wound in a plurality of turns, the second coil part including a third turn positioned at an innermost periphery and a fourth turn positioned on an outer peripheral side relative to the third turn. The first turn and the fourth turn are connected to each other, and the second turn and the third turn are connected to each other.

Abstract: One object is to increase the filling factor of magnetic particles and increase the evenness of distribution of the magnetic particles in a magnetic main body of a coil component. A coil component includes: a magnetic main body containing a resin and magnetic particles; and a coil conductor embedded in the magnetic main body. The magnetic particles include large-sized magnetic particles, middle-sized magnetic particles, and small-sized magnetic particles. The proportion of the volume of the large-sized magnetic particles to the total volume of all the magnetic particles is 70 vol % to 85 vol %, the proportion of the volume of the middle-sized magnetic particles to the total volume is 2 vol % to 28 vol %, and the proportion of the volume of the small-sized magnetic particles to the total volume is 2 vol % to 28 vol %. The particle size distribution of the small-sized magnetic particles overlaps that of the middle-sized magnetic particles.

Abstract: A system of modular components each include pin ports that may be connected in different configurations to enact alternative planar designs. Each modular component has asymmetries that are utilized to facilitate alternative wiring. Such asymmetries could include protrusions in the wafer to align edge connections. Alternatively, or in addition, the asymmetries include differences in copper disposition to certain edge connections. Each modular component has a non-conductive coating on each side of the wafer to insulate the underlaying copper layer.

Abstract: A coil component includes an element body including a magnetic portion containing metal particles and a coil conductor embedded in the magnetic portion, and at least a pair of outer electrodes disposed on the element body and electrically connected to the coil conductor. The magnetic portion includes a region A containing metal particles having a relatively small average particle size and a region B containing metal particles having a relatively large average particle size. The region A is present between outer electrodes of the pair of outer electrodes and the coil conductor.