Printed Circuit-type Coil Patents (Class 336/200)
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Patent number: 12205745Abstract: A coil component includes an insulating substrate; a coil portion including a coil pattern, having a planar spiral shape, disposed on the insulating substrate; and a body embedding the insulating substrate and the coil portion, wherein the coil pattern comprises a first conductive layer disposed to contact the insulating substrate, and a second conductive layer disposed on the first conductive layer, wherein a thickness (T1) of the insulating substrate and a thickness (T2) of the first conductive layer satisfy 10?T1/T2?20.Type: GrantFiled: September 17, 2019Date of Patent: January 21, 2025Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Soon Seong Jeong, Jong Min Lee
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Patent number: 12205747Abstract: A coil component includes a body, a support substrate disposed within the body, a coil disposed on at least one surface of the support substrate, and first and second external electrodes disposed to be spaced apart from each other on the body and connected to the coil. The coil unit includes a first conductive layer disposed on the support substrate, a second conductive layer disposed on the first conductive layer and spaced apart from the support substrate, and a third conductive layer disposed on the second conductive layer to cover at least a portion of a side surface of the second conductive layer and spaced apart from the support substrate to expose a side surface of the first conductive layer.Type: GrantFiled: March 29, 2021Date of Patent: January 21, 2025Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kang Wook Bong, Jae Youn Park, Jin Won Lee
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Patent number: 12205748Abstract: An inductor device includes a first trace, a second trace, and a capacitor. The first trace includes a first and a second sub-trace. The first sub-trace includes first wires, and the second sub-trace includes second wires. The second sub-trace is coupled to the first sub-trace at a first node. The first and the second wires are disposed to each other in an interlaced manner, and located at an outer side of the inductor device. The second trace includes a third and a fourth sub-trace. The third sub-trace includes third wires, and the fourth sub-trace includes fourth wires. The fourth sub-trace is coupled to the third sub-trace at a second node. The third and the fourth wires are disposed to each other in an interlaced manner, and located at an outer side of the inductor device. The capacitor is coupled between the first and the second node.Type: GrantFiled: August 23, 2021Date of Patent: January 21, 2025Assignee: REALTEK SEMICONDUCTOR CORPORATIONInventors: Hsiao-Tsung Yen, Hung-Han Chen, Ka-Un Chan
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Patent number: 12205759Abstract: A coil component according to one embodiment of the present invention includes: a first insulator body containing first magnetic metal particles; a second insulator body containing second magnetic metal particles; a first coil conductor provided in the first insulator body and wound around a coil axis for N1 turns such that intervals between adjacent turns are g1; and a second coil conductor provided in the second insulator body and wound around the coil axis for N2 turns such that intervals between adjacent turns are g2. In the embodiment, a first coil surface of the first coil conductor faces a second coil surface of the second coil conductor, and a distance T between the first coil surface and the second coil surface satisfies a relationship T?g1×N1+g2×N2.Type: GrantFiled: December 29, 2021Date of Patent: January 21, 2025Assignee: TAIYO YUDEN CO., LTD.Inventors: Akihisa Matsuda, Daisuke Yamaguchi, Takayuki Arai
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Patent number: 12205755Abstract: An inductor structure includes a first connecting component, a second connecting component, and a center-tap terminal. In the inductor structure, a first port of the first connecting component is coupled to a first wire, and a second port of the first connecting component is coupled to a second wire. The second connecting component disposed above or beneath the first connecting component in an interlaced manner. The center-tap terminal is coupled to one of the first connecting component and the second connecting component. The center-tap terminal is disposed on a layer that is different from the layer where the first connecting component is disposed or the layer where the second connecting component is disposed.Type: GrantFiled: January 27, 2021Date of Patent: January 21, 2025Assignee: REALTEK SEMICONDUCTOR CORPORATIONInventors: Hsiao-Tsung Yen, Ka-Un Chan
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Patent number: 12205760Abstract: This application provides a wireless charging coil, and an electronic device and an antenna that include the wireless charging coil. The wireless charging coil includes a plurality of coil groups that are at a plurality of layers and that are connected in series, and an insulation layer that is disposed between two layers of the plurality of coil groups. The wireless charging coil includes a first area and a second area that is disposed at an outer periphery of the first area. A plurality of coil groups disposed in the second area are arranged at the plurality of layers, and each coil group includes a plurality of coils wound in parallel at one layer.Type: GrantFiled: August 24, 2022Date of Patent: January 21, 2025Assignee: Honor Device Co., Ltd.Inventors: Hua Huang, Jiaxiang Song, Xialing Zhang, Xing Wang
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Patent number: 12205751Abstract: An inductor device includes a first trace, a second trace, and a capacitor. The first trace includes a first sub-trace and a second sub-trace. The first sub-trace and the second sub-trace form a plurality of first wires together at a first side of the inductor device, and form a plurality of second wires together at a second side of the inductor device. The second sub-trace is coupled to one terminal of the first sub-trace at a first node. The third sub-trace and the fourth sub-trace form a plurality of third wires together at the first side of the inductor device, and form a plurality of fourth wires together at the second side of the inductor device. The fourth sub-trace is coupled to one terminal of the third sub-trace at a second node. The capacitor is coupled to the first node and the second node.Type: GrantFiled: May 9, 2022Date of Patent: January 21, 2025Assignee: Realtek Semiconductor CorporationInventor: Hsiao-Tsung Yen
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Patent number: 12200867Abstract: The present application provides a synchronous rectification assembly, a manufacturing method thereof and a power supply. The synchronous rectification assembly comprises a first circuit board, a transformer, an electrical connection piece and a second circuit board; wherein the transformer is electrically connected to the first circuit board, and the second circuit board is provided with a conductive contact for being electrically connected to an external apparatus, and the electrical connection piece is electrically connected to the first circuit board and the second circuit board respectively; the first circuit board is configured to perform synchronous rectification on the output signal of the transformer and then transmit the output signal to the conductive contact of the second circuit board through the electrical connection piece.Type: GrantFiled: November 30, 2022Date of Patent: January 14, 2025Assignee: APLUS POWER TECHNOLOGY (HANGZHOU) CO., LTD.Inventor: Yuetian Wang
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Patent number: 12199358Abstract: Disclosed herein is an antenna module that includes a substrate on which a first coil is provided, a base material on which a second coil and a magnetic sheet overlapping the second coil are provided, and an adhesive layer bonding the substrate and the base material such that the first coil and the magnetic sheet overlap each other.Type: GrantFiled: May 12, 2022Date of Patent: January 14, 2025Assignee: TDK CorporationInventor: Shoma Kajikiya
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Patent number: 12199699Abstract: Various embodiments of inductor coils, antennas, and transmission bases configured for wireless electrical energy transmission are provided. These embodiments are configured to wirelessly transmit or receive electrical energy or data via near field magnetic coupling. The embodiments of inductor coils comprise a figure eight configuration that improve efficiency of wireless transmission efficiency. The embodiments of the transmission base are configured with at least one transmitting antenna and a transmitting electrical circuit positioned within the transmission base. The transmission base is configured so that at least one electronic device can be wirelessly electrically charged or powered by positioning the at least one device in contact with or adjacent to the transmission base.Type: GrantFiled: May 15, 2023Date of Patent: January 14, 2025Assignee: NuCurrent, Inc.Inventors: Jason Luzinski, Oleg Los
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Patent number: 12197663Abstract: A display device includes a display module which includes a first non-folding area, a folding area, and a second non-folding area, and a digitizer which includes a first area overlapping the first non-folding area and a portion of the folding area, a second area overlapping the folding area, and a third area overlapping a portion of the folding area and the second non-folding area, where a plurality of holes is defined in the second area through the digitizer, and the digitizer includes a base layer, a plurality of first coils, a plurality of second coils, first signal lines which are connected to the plurality of first coils, overlap the first area, the second area, and the third area, and do not overlap the plurality of holes, and second signal lines connected to the plurality of second coils and overlapping the third area.Type: GrantFiled: August 17, 2023Date of Patent: January 14, 2025Assignee: SAMSUNG DISPLAY CO., LTD.Inventors: Hirotsugu Kishimoto, Yong-Kwan Kim, Hyunjae Na, Sungguk An, Seokwon Jang, Sung-Ki Jung
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Patent number: 12195107Abstract: A control device that controls a control target including at least a motor in a steering mechanism including an input shaft to which a steering wheel is connected, an output shaft connected to the input shaft via a torsion bar, and the motor connected to the output shaft. The control device includes a reaction force controller to generate an input torque input to the control target based on a torsion bar torque generated in the torsion bar and to control a reaction force transmitted from the steering wheel to the steering person, and an assist controller to generate a correction torque to correct the input torque based on an output of the control target and a nominal model. The assist controller is configured or programmed such that a transfer function of the control target is constrained by a transfer function of the nominal model in a frequency band.Type: GrantFiled: December 21, 2022Date of Patent: January 14, 2025Assignee: NIDEC CORPORATIONInventors: Shuji Endo, Sohei Miyake, Masaya Ishikawa, Daisuke Notsu
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Patent number: 12200857Abstract: The present disclosure provides a package device including a redistribution layer. The redistribution layer includes a first dielectric layer, a conductive layer, and a second dielectric layer, and the conductive layer is disposed between the first dielectric layer and the second dielectric layer, wherein the redistribution layer has a test mark, the test mark includes a conductive pattern formed of the conductive layer, the conductive pattern includes a center portion and a plurality of extension portions, and the plurality of extension portions are respectively connected to the center portion.Type: GrantFiled: September 27, 2023Date of Patent: January 14, 2025Assignee: InnoLux CorporationInventors: Yeong-E Chen, Cheng-En Cheng, Yu-Ting Liu
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Patent number: 12191061Abstract: A multilayer coil component includes a multilayer body that contain a coil. The coil includes coil conductors. A lamination direction of the multilayer body and an axial direction of the coil are parallel to a first main surface. A distance between the coil conductors adjacent to each other in the lamination direction is from 4 ?m to 8 ?m. Each coil conductor includes a line portion and a land portion that is disposed at an end portion of the line portion. The land portions of the coil conductors adjacent to each other in the lamination direction are connected to each other with a via conductor interposed therebetween. A width of the line portion is from 30 ?m to 50 ?m. An inner diameter of each coil conductor is from 50 ?m to 100 ?m.Type: GrantFiled: February 6, 2024Date of Patent: January 7, 2025Assignee: Murata Manufacturing Co., Ltd.Inventor: Atsuo Hirukawa
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Patent number: 12193158Abstract: A printed circuit board module comprises: a first printed circuit board; a second printed circuit board arranged on one surface of the first printed circuit board; a third printed circuit board arranged on the other surface of the first printed circuit board; and a core passing through the first printed circuit board to the third printed circuit board, wherein the second printed circuit board includes a first coil, the third printed circuit board includes a second coil, and the cross-sectional area of the second printed circuit board and the third printed circuit board is less than the cross-sectional area of the first printed circuit board.Type: GrantFiled: December 4, 2020Date of Patent: January 7, 2025Assignee: LG INNOTEK CO., LTD.Inventors: Jeong Heum Park, Soo Hong Kim, Kwang Soon Jung
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Patent number: 12183497Abstract: A high-insulation multilayer planar transformer (1) includes a pair of iron cores (20) and a circuit board integration (10a). The circuit board integration (10a) is stacked between the iron cores (20) and has a through hole (100a). The circuit board integration (10a) includes a first to a third insulating layers (11a, 12a, 14a) and a first to a second coil windings (13a, 15a). The first and third insulating layers (11a, 14a) include at least two insulating plates (111a, 141a) stacked with each other respectively. The second insulating layer (12a) includes at least one insulating plate (121a). The coil winding (13a, 15a) is disposed between the adjacent insulating layers and surrounds the through hole (100a) planarly. Therefore, the reinforced insulation requirement of safety regulations may be achieved.Type: GrantFiled: December 23, 2020Date of Patent: December 31, 2024Assignee: P-DUKE TECHNOLOGY CO., LTD.Inventors: Lien-Hsing Chen, Hsiao-Hua Chi, Chun-Ping Chang, Han-Chiang Chen, Chia-Ti Lai, Yung-Chi Chang
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Patent number: 12183692Abstract: A package substrate for a semiconductor device includes a first substrate core and an inductor embedded in the first substrate core, the inductor including a magnetic core embedded in the first substrate core and a conductive winding surrounding the magnetic core, the conductive winding including one or more first segments defined by metal patterning on the first substrate core and one or more second segments defined by one or more conductive vias extending through the first substrate core. The package substrate may further include a capacitor embedded in the first substrate core and/or in a second substrate core vertically stacked with the first substrate core.Type: GrantFiled: January 4, 2024Date of Patent: December 31, 2024Assignee: SARAS MICRO DEVICES, INC.Inventors: Carlos Riera, Bartlet H. DeProspo, Urmi Ray
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Patent number: 12183693Abstract: An electronic device includes a magnetic assembly with a multilevel lamination or metallization structure having a core layer, dielectric layers and conductive features formed in metal layers on or between the dielectric layers in respective planes of orthogonal first and second directions and stacked along an orthogonal third direction. The conductive features include first and second patterned conductive features forming first and second windings, first and second conductive capacitor plates, and first and second conductive field plates, in which the first conductive capacitor plate is between the first conductive field plate and the core layer along the third direction and the second conductive capacitor plate is between the second conductive field plate and the core layer along the third direction.Type: GrantFiled: August 15, 2023Date of Patent: December 31, 2024Assignee: TEXAS INSTRUMENTS INCORPORATEDInventor: Enis Tuncer
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Patent number: 12176138Abstract: A coil component includes a body having a first surface and including first and second recessed-cutout portions spaced apart from each other on the first surface of the body, a support substrate, a coil unit disposed on the support substrate to be perpendicularly to the first surface of the body, and first and second external electrodes spaced apart from each other on the first surface of the body and connected to first and second lead patterns of the coil unit, respectively. The first and second external electrodes include conductive resin layers filling the first and second recessed-cutout portions to be in contact with the first and second lead patterns, each of the conductive resin layers having a first surface exposed to the first surface of the body, and the first and second external electrodes further include electrode layers disposed on the first surfaces of the conductive resin layers.Type: GrantFiled: March 29, 2021Date of Patent: December 24, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ji Hoon Hwang, Myoung Ki Shin, Jeong Gu Yeo
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Patent number: 12176136Abstract: A transformer device includes a first coil, a second coil, and a third coil. The first coil includes a first ring structure, a second ring structure, a first connecting portion, and a first terminal, in which the first terminal is arranged on the first connecting portion and is located at a central location between the first ring structure and the second ring structure, the first terminal is connected to the first ring structure through the first connecting portion in a first direction, and connected to the second ring structure through the first connecting portion in a second direction, and the first direction is the opposite of the second direction. The second coil is configured to couple the first ring structure. The third coil is configured to couple the second ring structure, in which the second coil and the third coil have the same structure.Type: GrantFiled: May 6, 2021Date of Patent: December 24, 2024Assignee: REALTEK SEMICONDUCTOR CORPORATIONInventors: Hsiao-Tsung Yen, Jian-You Chen, Ka-Un Chan
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Patent number: 12176135Abstract: A coil component includes a base body containing metal magnetic particles and a binder binding together the metal magnetic particles and having a first surface extending along a coil axis and a second surface opposing the first surface, a first external electrode, a second external electrode, and a coil conductor electrically connected to the first and second external electrodes. In one embodiment, the coil conductor has a winding portion, the winding portion has first conductor portions and one or more second conductor portions smaller in number than the first conductor portions. The first and second conductor portions alternate with and are connected to each other. A first dimension of the base body representing a dimension between the first surface and the second surface is greater than a second dimension of the base body representing a dimension of the base body between the third and fourth surface.Type: GrantFiled: November 29, 2023Date of Patent: December 24, 2024Assignee: TAIYO YUDEN CO., LTD.Inventors: Hidenori Aoki, Tomoo Kashiwa
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Patent number: 12176305Abstract: An electronic device is disclosed. The electronic device includes a first electronic component and a power regulating structure configured to provide a first power to the first electronic component. The power regulating structure includes a first component and a second component at least partially overlapped with the first component from a top view.Type: GrantFiled: February 18, 2022Date of Patent: December 24, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Pao-Nan Lee, Chen-Chao Wang, Chang Chi Lee
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Patent number: 12176385Abstract: A semiconductor device may include a compound substrate and a 3-dimensional inductor structure. The compound substrate may include a front surface and a back surface. The 3-dimensional inductor structure may include a front conductive stack, a back conductive layer, and at least one through-hole structure. At least one portion of the front conductive stack may include a first conductive layer disposed on the front surface of the compound substrate, and a second conductive layer disposed on the first conductive layer. The second conductive layer has a thickness ranging between 30 micrometers and 400 micrometers. The back conductive layer is disposed on the back surface of the compound substrate. The at least one through-hole structure penetrates through the compound substrate, and electrically connects the front conductive stack to the back conductive layer.Type: GrantFiled: November 20, 2022Date of Patent: December 24, 2024Assignee: RichWave Technology Corp.Inventors: Chia-Wei Chang, Yan-Han Huang, Chin-Chia Chang
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Patent number: 12176285Abstract: An electronic device includes first leads along a first side, second leads along a second side, first and second dies, and a magnetic assembly with a multilevel lamination structure with first and second windings and a conductive guard trace. The lamination structure includes the first winding in a first level, and the second winding in a different level. The guard trace is between the first patterned conductive feature and the second side of the package structure. A first set of electrical connections couple the first die, the first winding, and one of the first conductive leads in a first circuit, and a second set of electrical connections couple the second die, the second winding, the guard trace and one of the second conductive leads in an isolated second circuit.Type: GrantFiled: January 23, 2020Date of Patent: December 24, 2024Assignee: TEXAS INSTRUMENTS INCORPORATEDInventor: Vijaylaxmi Gumaste Khanolkar
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Patent number: 12177978Abstract: A circuit board includes a glass substrate having a first surface and a second surface facing away from the first surface; a first coil wiring pattern formed on the first surface and a second coil wiring pattern formed on the second surface, the first and second coil wiring patterns constituting part of a coil; a through hole extending through a predetermined portion of the glass substrate from an end of the first coil wiring pattern to an end of the second coil wiring pattern; a through hole inner conductive surface formed on the inner side of the through hole, the first and second coil wiring patterns and the through hole inner conductive surface constituting the coil wound around a direction perpendicular to an axis of the through hole and to a direction in which the first and second coil wiring patterns extend.Type: GrantFiled: June 3, 2021Date of Patent: December 24, 2024Assignee: TOPPAN PRINTING CO., LTD.Inventor: Jun Onohara
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Patent number: 12165798Abstract: A magnetic-component module includes a substrate; a core on a first surface of the substrate; a spacer on the core; a winding including wire bonds extending over the core and electrically connecting a first portion of the substrate and a second portion of the substrate, and traces on and/or in the substrate; and an overmold material encapsulating the core, the spacer, and the wire bonds.Type: GrantFiled: July 9, 2020Date of Patent: December 10, 2024Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Lee Francis, William Jarvis, Takayuki Tange
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Patent number: 12159744Abstract: An inductor includes a magnetic core composed of a magnetic material having variable permeability characteristics based on at least one of design parameters or operational parameters of the inductor that includes one or more air gaps. A coil is wound through the one or more air gaps and is configured to be excited by an electric current.Type: GrantFiled: May 4, 2021Date of Patent: December 3, 2024Assignee: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.Inventors: Masanori Ishigaki, Ercan Mehmet Dede, Danny J. Lohan
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Patent number: 12159736Abstract: An example device includes a mounting structure including a first material having a first coefficient of thermal expansion (CTE). The mounting structure includes a center portion and an outer portion. The device further includes a magnetic core for an electrical component that is coupled to the outer portion of the mounting structure. The magnetic core includes a second material having a second CTE. The magnetic core is split into a plurality of sections separated by spaces extending from the center portion to an outer edge of the outer portion. Each of the plurality of sections is separately coupled to the mounting structure, and each of the plurality of sections is connected to the electrical component.Type: GrantFiled: November 30, 2020Date of Patent: December 3, 2024Assignee: Waymo LLCInventors: Robert Lockwood, Kelvin Kwong
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Patent number: 12159749Abstract: The present disclosure provides a transformer module and a power module, wherein the transformer module comprises: a magnetic core, a first wiring layer, a first insulating layer and a second wiring layer, where the first wiring layer, the first insulating layer and the second wiring layer are sequentially disposed on the magnetic core from outside to inside; a first metal winding, formed in the first wiring layer, where at least part of the first metal winding is wound around the magnetic core in a foil structure; the first insulating layer, at least partially covered by the first metal winding; a second metal winding, formed in the second wiring layer and wound around the magnetic core, where the second metal winding is at least partially covered by the first insulating layer, and at least partially covered by the first metal winding.Type: GrantFiled: October 25, 2023Date of Patent: December 3, 2024Assignee: Delta Electronics (Shanghai) Co., Ltd.Inventors: Chaofeng Cai, Xiaoni Xin, Jianhong Zeng, Shouyu Hong, Rui Wu, Haoyi Ye, Yiqing Ye, Jinping Zhou, Zhiheng Fu, Min Zhou, Yu-Ching Kuo, Tong-Sheng Pan, Wen-Yu Lin
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Patent number: 12154710Abstract: Embodiments disclosed herein include power transformers for microelectronic devices. In an embodiment, a power transformer comprises a magnetic core that is a closed loop with an inner dimension and an outer dimension, and a primary winding around the magnetic core. In an embodiment, the primary winding has a first number of first turns connected in series around the magnetic core. In an embodiment, a secondary winding is around the magnetic core, and the secondary winding has a second number of second turns around the magnetic core. In an embodiment, individual ones of the second turns comprise a plurality of secondary segments connected in parallel.Type: GrantFiled: September 18, 2020Date of Patent: November 26, 2024Assignee: Intel CorporationInventors: Anuj Modi, Huong Do, William J. Lambert, Krishna Bharath, Harish Krishnamurthy
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Patent number: 12154712Abstract: A low profile high current composite transformer is disclosed. Some embodiments of the transformer include a first conductive winding having a first start lead, a first finish lead, a first plurality of winding turns, and a first hollow core; a second conductive winding having a second start lead, a second finish lead, a second plurality of turns, and a second hollow core; and a soft magnetic composite compressed surrounding the first and second windings. The soft magnetic composite with distributed gap provides for a near linear saturation curve.Type: GrantFiled: November 13, 2020Date of Patent: November 26, 2024Assignee: VISHAY DALE ELECTRONICS, LLCInventor: Darek Blow
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Patent number: 12154714Abstract: A multi-terminal chip inductor includes coil conductors in base material layers, an interlayer connection conductor connecting the coil conductors across layers, and external electrodes each connected to portions of a series of coil conductors defined by the coil conductors and the interlayer connection conductor. The external electrodes include a common external electrode. A first of the coil conductors to which the common external electrode and a first external electrode adjacent to the common external electrode in a circuit are connected, includes first coil conductors connected to each other in parallel.Type: GrantFiled: November 4, 2021Date of Patent: November 26, 2024Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Satoshi Shigematsu, Kenichi Ishizuka
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Patent number: 12154708Abstract: An inductor device includes a first coil, a second coil and a toroidal coil. The first coil is partially overlapped with the second coil in a vertical direction. The toroidal coil is disposed outside the first coil and the second coil. The first coil is interlaced with the second coil at a first side and a second side of the inductor device.Type: GrantFiled: April 21, 2021Date of Patent: November 26, 2024Assignee: Realtek Semiconductor CorporationInventors: Hsiao-Tsung Yen, Ka-Un Chan
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Patent number: 12147031Abstract: An optical reflective element includes: a reflective body that rotationally oscillates about a first rotational axis; a first connector body that is coupled to the reflective body, and includes a groove portion provided in a position in which the first rotational axis is located; a first vibration body that is disposed in a direction intersecting the first rotational axis, and is coupled to a proximal end portion of the first connector body; a second vibration body that is disposed on a side opposite the first vibration body; a first driving body that causes the first vibration body to rotate; a second driving body that is coupled to the second vibration body; and a second connector body that connects the first vibration body and the second vibration body in a manner that allows the first vibration body and the second vibration body to vibrate.Type: GrantFiled: February 22, 2021Date of Patent: November 19, 2024Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventor: Takami Ishida
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Patent number: 12148558Abstract: In a wound inductor component, a first flange and a second flange are connected to both ends of a winding core in the central axial line direction, and protrude from the winding core to both sides in a height direction. A cover member covers a portion from the upper end of the first flange to the upper end of the winding core from above. In a sectional view including the central axial line and along the height direction, a first average distance, which is an average distance in the height direction from the upper end of the first flange to the upper end of the cover member, is 25% or more and 45% or less (i.e., 25% to 45%) of a second average distance, which is an average distance in the height direction from the upper end of the winding core to the upper end of the cover member.Type: GrantFiled: September 14, 2021Date of Patent: November 19, 2024Assignee: Murata Manufacturing Co., Ltd.Inventor: Noboru Shiokawa
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Patent number: 12148693Abstract: A transformer includes a silicon substrate, a plurality of metal layers and a plurality of insulating layers laminated on the silicon substrate, a bottom winding of a metal contacting a first metal layer and a second metal layer of the plurality of metal layers, a first insulating layer on the bottom winding, a core on the first insulating layer, a second insulating layer on the core, a top winding of the metal that extends around the core and a portion of the second insulating layer, and a third insulating layer on the top winding. At least one of the top winding and the bottom winding is thicker than each of the plurality of metal layers.Type: GrantFiled: October 7, 2020Date of Patent: November 19, 2024Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Takayuki Tange, Yoshimitsu Ushimi
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Patent number: 12142418Abstract: A wireless charging coil is provided herein. The wireless charging coil comprising a first stamped coil having a first spiral trace, the first spiral trace defining a first space between windings, and a second stamped coil having a second spiral trace, the second spiral trace defining a second space between windings, wherein the first stamped coil and second stamped coil are planar to and interconnected with one another, such that the first stamped coil is positioned within the second space of the second stamped coil, and the second stamped coil is positioned within the first space of the first stamped coil.Type: GrantFiled: May 10, 2021Date of Patent: November 12, 2024Assignee: A.K. Stamping Company, Inc.Inventors: Arthur Kurz, Bernard Duetsch, Joshua Kurz
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Patent number: 12142979Abstract: A printed coil assembly including a flexible dielectric material, a patterned top conductive layer formed on a top surface of the flexible dielectric material, and a patterned bottom conductive layer formed on a bottom surface of the flexible dielectric material. The patterned top conductive layer and the patterned bottom conductive layer form a plurality of printed coils arranged in a plurality of printed coil rollers concentrically arranged in a cylindrical shape. Each of the plurality of printed coils includes a top layer printed coil disposed within the patterned top conductive layer and a bottom layer printed coil disposed within the patterned bottom conductive layer. Coil pitches of the coils within each roller are chosen such that corresponding ones of the plurality of printed coils in adjacent rollers are axially aligned relative to a center of the cylindrical shape.Type: GrantFiled: March 3, 2023Date of Patent: November 12, 2024Assignee: Systems, Machines, Automation Components CorporationInventors: Edward A. Neff, Toan Vu, Vinh Hoang
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Patent number: 12142582Abstract: An organic interposer includes interconnect-level dielectric material layers embedding redistribution interconnect structures, at least one dielectric capping layer overlying a topmost interconnect-level dielectric material layer, a bonding-level dielectric layer overlying the at least one dielectric capping layer, and a dual-layer inductor structure, which may include a lower conductive coil embedded within the topmost interconnect-level dielectric material layer, a conductive via structure vertically extending through the at least one dielectric capping layer, and an upper conductive coil embedded within the bonding-level dielectric layer and comprising copper.Type: GrantFiled: July 28, 2023Date of Patent: November 12, 2024Assignee: Taiwan Semiconductor Manufacturing Company LimitedInventors: Wei-Han Chiang, Chun-Hung Chen, Ching-Ho Cheng, Hsiao Ching-Wen, Hong-Seng Shue, Ming-Da Cheng, Wei Sen Chang
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Patent number: 12142932Abstract: A wireless power transmission resonator using a conducting wire with a vertical rectangular cross-section is disclosed. The wireless power transmission resonator may include a first element including a first element upper part arranged in an upper end of a resonator and a first element lower part arranged in a lower end of the resonator, wherein the first element upper part and the first element lower part each may include a spiral layer having a spiral structure that is wound to face a wide surface of a conducting wire including a vertical rectangular cross-section and a second element arranged in a center of the resonator and between the first element upper part and the first element lower part and including a spiral layer having a spiral structure that is wound to face the wide surface of the conducting wire including the vertical rectangular cross-section.Type: GrantFiled: October 28, 2022Date of Patent: November 12, 2024Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Je Hoon Yun, Sang-Won Kim, Seong-Min Kim, Jung Ick Moon, In Kui Cho, Gwangzeen Ko, Dong Won Jang
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Patent number: 12142949Abstract: A shielding film includes a first film layer. The first film layer includes a first conductive part and a first insulating part, and the first insulating part penetrates the first conductive part in a thickness direction of the first film layer. Under electromagnetic influence of a first electromagnetic field, a first eddy current is formed in the first film layer, and a loop of the first eddy current is located in the first conductive part, so that the first eddy current has relatively high current intensity. Under electromagnetic influence of a second electromagnetic field, a second eddy current is formed in the first film layer, and a loop of the second eddy current passes through the first insulating part, so that current intensity of the second eddy current can be reduced.Type: GrantFiled: September 30, 2021Date of Patent: November 12, 2024Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Yuechao Li, Chao Yang
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Patent number: 12136510Abstract: To provide a coil device capable of preventing a short circuit between turns of the coil part. A coil device 2 includes a core part 4 including a magnetic powder 41 and a resin 42, and a coil part 6 embedded in the core part 4 and having a wound wire 6a with an insulation coating layer 61.Type: GrantFiled: April 14, 2021Date of Patent: November 5, 2024Assignee: TDK CORPORATIONInventors: Satoshi Sugimoto, Kyohei Tonoyama, Miyuki Asai, Takamasa Iwasaki
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Patent number: 12136509Abstract: Embodiments of the present application provides a MEMS solenoid inductor, including: a silicon substrate, a soft magnetic core, and a solenoid; wherein the soft magnetic core is wrapped inside the silicon substrate, the silicon substrate is provided with a spiral channel, the soft magnetic core passes through a center of the spiral channel, and the solenoid is disposed in the spiral channel. By disposing the soft magnetic core and the solenoid of the inductor inside the silicon substrate completely, the thickness of the silicon substrate is fully utilized, and the obtained inductor has a larger winding cross-sectional area and improved magnetic flux, which increases the inductance value of the inductor; at the same time, the silicon substrate plays a protective role on the soft magnetic core and the solenoid, the strength of the inductor is improved, and the good impact resistance is provided.Type: GrantFiled: July 8, 2019Date of Patent: November 5, 2024Assignee: BEIHANG UNIVERSITYInventors: Tiantong Xu, Zhi Tao, Haiwang Li, Jiamian Sun, Hanxiao Wu, Kaiyun Zhu, Yanxin Zhai, Xiaoda Cao, Wenbin Wang, Weidong Fang
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Patent number: 12136523Abstract: A multilayer capacitor and a board having the multilayer capacitor mounted thereon are provided. The multilayer capacitor includes a capacitor body including a dielectric layer and first and second internal electrodes, and first and second external electrodes disposed on both ends of the capacitor body and connected to exposed portions of the first and second internal electrodes, respectively. A/B satisfies 0.0016?A/B<1 in which A is a thickness of the dielectric layer and B is an average length of margins of the capacitor body in a length direction, and A is 1 ?m or less.Type: GrantFiled: October 26, 2022Date of Patent: November 5, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hwi Dae Kim, Ji Hong Jo, Woo Chul Shin, Chan Yoon, Sang Soo Park
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Patent number: 12132463Abstract: Provided are balun circuit structure and balun device, the balun circuit structure comprises unbalanced terminal, first and second balanced terminals, grounded power terminal, first, second, third and fourth inductors. The first terminal of the first inductor is connected to the first terminal of the second inductor, the second terminal of the first inductor is connected to the unbalanced terminal, the second terminal of the second inductor is open-circuited, the first terminal of the third inductor and the first terminal of the fourth inductor are connected to the grounded power terminal, the second terminal of the third inductor is connected to the first balanced terminal, the second terminal of the fourth inductor is connected to the second balanced terminal, the first, second, third and fourth inductors are located in different planes, respectively, the first inductor is coupled to the third inductor, and the second inductor is coupled to the fourth inductor.Type: GrantFiled: February 9, 2021Date of Patent: October 29, 2024Assignee: ANHUI ANUKI TECHNOLOGIES CO., LTD.Inventors: Wei Cheng, Chengjie Zuo, Jun He
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Patent number: 12132015Abstract: Embodiments include inductors and methods to form the inductors. An inductor includes a substrate layer that surrounds a magnetic layer, where the magnetic layer is embedded between the substrate layer. The inductor also includes a dielectric layer that surrounds the substrate and magnetic layers, where the dielectric layer fully embeds the substrate and magnetic layers. The inductor further includes a first conductive layer over the dielectric layer, a second conductive layer below the dielectric layer, and a plurality of plated-through-hole (PTH) vias in the dielectric and substrate layers. The PTH vias vertically extend from the first conductive layer to the second conductive layer, and the magnetic layer in between the PTH vias. The magnetic layer may have a thickness that is substantially equal to a thickness of the substrate layer, where the thickness of the magnetic layer is less than a thickness defined between the first and second conductive layers.Type: GrantFiled: October 28, 2019Date of Patent: October 29, 2024Assignee: Intel CorporationInventors: William J. Lambert, Sri Chaitra Jyotsna Chavali
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Patent number: 12131856Abstract: A coil component includes a core including a winding core portion and a first flange portion that is disposed on a first end portion of the winding core portion in a direction in which the winding core portion extends. A first curved portion is formed at a connection between a bottom surface of the winding core portion and the first flange portion. A ratio of a length of the first curved portion in a height direction to a distance in the height direction between the bottom surface and a first terminal electrode is no less than 20% and no more than 60% (i.e., from 20% to 60%).Type: GrantFiled: December 5, 2023Date of Patent: October 29, 2024Assignee: Murata Manufacturing Co., Ltd.Inventors: Takashi Sukegawa, Yasuhiro Itani, Takanori Suzuki, Yuuki Kitadai, Yoshifumi Maki, Reiichi Matsuba
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Patent number: 12131854Abstract: A common-mode choke coil includes a multilayer body, a first coil, and a second coil. The multilayer body includes plural non-conductor layers. The first and second coils are incorporated in the multilayer body. The first coil has a path length L1, the second coil has a path length L2, and the sum of the path length L1 and the path length L2 is less than or equal to 3.30 mm. The first coil has a first coil conductor, and the second coil has a second coil conductor. The first coil conductor and the second coil conductor have a spacing D between each other of greater than or equal to 6 ?m and less than or equal to 26 ?m (i.e., from 6 ?m to 26 ?m) in the stacking direction of the non-conductor layers.Type: GrantFiled: August 4, 2021Date of Patent: October 29, 2024Assignee: Murata Manufacturing Co., Ltd.Inventors: Kouhei Matsuura, Atsuo Hirukawa, Hiroshi Ueki
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Patent number: 12125626Abstract: An inductor built-in substrate includes a core substrate having openings and first through holes formed therein, a magnetic resin filling the openings and having second through holes formed therein, first through-hole conductors formed in the first through holes of the core substrate and including metal films formed in the first through holes of the core substrate, respectively, and second through-hole conductors formed in the second through holes of the magnetic resin and including metal films formed in the second through holes of the magnetic resin such that the metal films are filling the second through holes of the magnetic resin, respectively.Type: GrantFiled: November 30, 2020Date of Patent: October 22, 2024Assignee: IBIDEN CO., LTD.Inventor: Satoru Kawai
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Patent number: 12119162Abstract: A coil component that can stabilize the position of a coil while relaxing the stress between coil wiring and a magnetic layer includes an element body and a coil in the element body. The element body has magnetic layers laminated in a first direction. The coil has pieces of coil wiring laminated in the first direction. The pieces extend along a plane orthogonal to the first direction. Each of the pieces of coil wiring has two faces on both sides in the first direction and two side faces on both sides in a direction orthogonal to the first direction, in a section orthogonal to an extending direction of each of the pieces. The two faces and one side face among the two side faces form a gap with the magnetic layer, and the other side face among the two side faces is in contact with the magnetic layer.Type: GrantFiled: February 24, 2021Date of Patent: October 15, 2024Assignee: Murata Manufacturing Co., Ltd.Inventor: Masayuki Oishi