Abstract: A semiconductor device includes: a first electrode provided on a semiconductor multilayer structure; a second electrode provided on a substrate; and a bonding metal layer which bonds the first electrode and the second electrode together. The bonding metal layer includes a gap inside.

Abstract: In some implementations, an apparatus can include a semiconductor region including an electrical device and a back-end region disposed on the semiconductor region. The back-end region can include a first terminal and a second terminal. The apparatus can include an insulator-metal transition (IMT) material electrically coupled between the first terminal and the second terminal.

Abstract: A sensor and an apparatus for non-invasive measurement of an analyte concentration, the apparatus comprising: a first thermal sensor operable to determine a temperature indicative of a temperature at a location on a skin of a subject, an analyte sensor operable to generate a measurement indicative of a concentration of the analyte, a heater; a controller operable to receive a temperature signal from at least the first thermal sensor and to adjust the heater to maintain a thermal equilibrium at said location on the skin; and a processor configured to convert the measurement to a calculated analyte concentration value at a predetermined temperature.

Abstract: Disclosed is a temperature sensor for measuring a temperature of a reference material. The temperature sensor includes a thermocouple, spring, and spring housing. The thermocouple is configured to measure the temperature of the reference material. The spring is operably coupled to the thermocouple and the spring housing is configured to accommodate the spring and thermocouple within the spring housing. Additionally, the spring housing is configured to attach to the reference material and the spring applies a force on the thermocouple in a direction towards the reference material.

Abstract: This connector (1) includes a connector housing (59) and a holder (4) which supports electric wires (17) connected to terminals (39) accommodated in the connector housing. The holder includes a first holder (5) which has a locking portion (9) and a thermistor accommodation portion (13) accommodating a thermistor (11); and a second holder (7) which is provided with a locked portion (15) locked by the locking portion, and with an electric wire accommodation portion (19) that accommodates the electric wires. Through locking of the locked portion by the locking portion, the thermistor and the electric wires overlapped and mounted on the thermistor are nipped between the thermistor accommodation portion and the electric wire accommodation portion by the second holder (7).

Abstract: A chip thermistor is provided with a thermistor element body, a first electrode, a second electrode, and a third electrode. The thermistor element body has a first principal face and a second principal face opposed to each other in a first direction. The first electrode and the second electrode are arranged as separated from each other in a second direction perpendicular to the first direction, on the first principal face of the thermistor element body. The third electrode is arranged so as to lap over the first electrode and the second electrode, when viewed from the first direction, on the second principal face of the thermistor element body.

Abstract: A gas sensor having high detection sensitivity and a low output signal noise includes a laminate of thermistor ceramic, a catalytic electrode, an internal electrode, and external electrodes. When coming into contact with a detection target gas, the catalytic electrode generates heat, and the resistance of a thermistor layer of a sensing portion is decreased. Since the heat generated by the catalytic electrode is directly transferred to the thermistor layer without passing through an insulating layer or the like, high detection sensitivity is obtained. In addition, the structure can be formed in which heat of the sensing portion is insulated by a hollow portion and heat diffusion is prevented, so that the heat capacity of the sensing portion is further decreased.

Abstract: A portable, low profile electric radiant heater has an elongated heating element. A plurality of thermistors are disposed proximate to and along the length of the elongated heating element, spaced at substantially equal intervals. A microcontroller switches a reference resistor in series with a charging capacitor to determine a reference timer value. The microcontroller switches banks of multiple thermistors in series with the charging capacitor to determine associated timer values. The microcontroller calculates thermistor resistance values using the reference timer, reference resistor, and thermistor timer values. A lookup table is employed to determine a temperature value associated with the thermistor resistance value. This serves as the sensed temperature of the associated bank of thermistors. A plurality of tip-over switches are provided. One tip-over switch is disposed between the microcontroller and the heating element.

Abstract: In a method for sorting PTC elements having different resistance-temperature characteristics, a predetermined voltage that allows a current to sufficiently decay is applied to each of PTC elements A and B, and the PTC elements are sorted on the basis of the difference between the times required for the currents passing through the PTC elements B to reach a predetermined value (e.g., 52 mA).

Abstract: A micromechanical device having a micromechanical component and a heating element and a method for controlling and/or regulating the heating element. In this context, the heating element is used to bring the micromechanical component, which preferably has electrical components, and/or a passivator surrounding the micromechanical component to a specifiable temperature.

Abstract: A portable, low profile electric radiant heater has an elongated heating element. A plurality of thermistors are disposed proximate to and along the length of the elongated heating element, spaced at substantially equal intervals. A microcontroller switches a reference resistor in series with a charging capacitor to determine a reference timer value. The microcontroller switches banks of multiple thermistors in series with the charging capacitor to determine associated timer values. The microcontroller calculates thermistor resistance values using the reference timer, reference resistor, and thermistor timer values. A lookup table is employed to determine a temperature value associated with the thermistor resistance value. This serves as the sensed temperature of the associated bank of thermistors. A plurality of tip-over switches are provided. One tip-over switch is disposed between the microcontroller and the heating element.

Abstract: A thermally stabilized device is described. Single or multiple input ports are accommodated and single and multiple power ports are described. The variation of resistance of a resistor subject to varying power dissipations is minimized by injecting complementary power dissipation and thermally linking it to the resistor. In this manner the temperature of a resistor may be maintained constant even though it dissipates varying amounts of power.

Abstract: An electric PCB heating component for a heating electric component is coupleable to an electronic circuit board. The PCB heating component includes a fastening element, a heating element for generating thermal energy, and a heating body. The heating body emits thermal energy via a heat radiating surface. For a low cost PCB heating component, the heating element is a PTC heating element. A plurality of heating projections of the heating element cooperate to form a relatively large heat radiating surface such that thermal energy can be emitted in a substantially directional mode. The heating projections can be convection or radiation elements.

Abstract: An electric heating module includes an electric heater (10), a heat pipe (20) having an evaporating section (22) thermally attached to the electric heater and a condensing section (24), and at least one heat radiator (30, 40) thermally attached to the condensing section. The electric heater includes a pair of electrode plates (12, 14) and a heating element (16) sandwiched between and electrically connecting the electrode plates. An insulation frame (19) encloses the electrode plates therein for electrically insulating the electric heater from the heat radiator. For the non-linear PTC heating element, the electric heater can rapidly heat up to and stay at a desired stable temperature. The heat pipe can transfer heat from the electric heater to the heat radiator rapidly and timely by phase change.

Abstract: There are provided a carrier substrate, a temperature sensing resistor film formed directly on the carrier substrate, first and second conductive patterns formed on the carrier substrate and connected to both ends of the temperature sensing resistor film respectively, and a semiconductor chip mounting region portion formed on the carrier substrate.

Abstract: The operating temperature of a gas sensor capable of sensing a gas or a gas composition at a high temperature, for example 1000° C. is maintained constant over the entire volume of a gas sensor layer or function layer (4) secured to a sensor carrier section of the gas sensor by supplying heat to the gas sensor layer (4) in such a way that varying heat dissipations in the sensor carrier section are compensated. For this purpose, an electrical heater for heating the gas sensor layer (4) has individual heater sections with different heating resistance values which depend on a spacing between any individual heater section and the tip of the sensor carrier section.

Abstract: A temperature sensor having sturdy construction is simple to install and to package, is uncomplicated to manufacture, and suitable for reliably detecting rapid temperature changes. The temperature sensor (1) includes a silicon substrate (2) in which at least one porous area (3) is formed, the degree of porosity and the thickness of the porous area (3) being chosen so that the porous area (3) is thermally isolated from the silicon substrate (2). In addition, the temperature sensor (1) includes temperature measuring elements (6, 7) for detecting the temperature difference between the silicon substrate (2) and the porous area (3). The temperature sensor may also include heating elements for testing the sensor function.

Abstract: The present invention reveals an over-current protection apparatus comprising a first electrode plate, a second electrode plate, a third electrode plate, a conductive element and a high resistance material layer, where the high resistance material layer may contact the first electrode plate to form a conducting path, the conductive element is connected to the first electrode plate and the second electrode, the thermally expanded conductive element can cut off current, the high resistance material layer is connected to the third electrode plate and the second electrode plate, and the thermal expansion coefficient of the high resistance layer is less than that of the conductive element. By virtue of the thermal expansion of the conductive element due to an over-current, the first electrode plate is departed from the third electrode plate so as to enforce the current flows through the high resistance material layer for current reduction.

Abstract: The present invention includes electronic device workpieces, methods of semiconductor processing and methods of sensing temperature of an electronic device workpiece. In one aspect, the invention provides an electronic device workpiece including: a substrate having a surface; a temperature sensing device borne by the substrate; and an electrical interconnect formed upon the surface of the substrate, the electrical interconnect being electrically coupled with the temperature sensing device. In another aspect, a method of sensing temperature of an electronic device workpiece includes: providing an electronic device workpiece; supporting a temperature sensing device using the electronic device workpiece; providing an electrical interconnect upon a surface of the electronic device workpiece; electrically coupling the electrical interconnect with the temperature sensing device; and sensing temperature of the electronic device workpiece using the temperature sensing device.

Abstract: The present invention includes electronic device workpieces, methods of semiconductor processing and methods of sensing temperature of an electronic device workpiece. In one aspect, the invention provides an electronic device workpiece including: a substrate having a surface; a temperature sensing device borne by the substrate; and an electrical interconnect formed upon the surface of the substrate, the electrical interconnect being electrically coupled with the temperature sensing device. In another aspect, a method of sensing temperature of an electronic device workpiece includes: providing an electronic device workpiece; supporting a temperature sensing device using the electronic device workpiece; providing an electrical interconnect upon a surface of the electronic device workpiece; electrically coupling the electrical interconnect with the temperature sensing device; and sensing temperature of the electronic device workpiece using the temperature sensing device.

Abstract: An electrical device which contains a first electrode, a second electrode, a third electrode, a first resistor which is connected in series between the first and second electrodes, and a second resistor which (i) is thermally coupled to the first resistor, (ii) exhibits anomalous resistance/temperature behavior, and (iii) is connected in series between the first and third electrodes.

Abstract: An electrode for a PTC thermistor of the present invention includes a base layer having electrical conductivity and a sintered layer formed on the base layer. The sintered layer is formed by sintering a conductive powder and has electrical conductivity, and has roughness on a surface thereof. Thus, the present invention can provide an electrode for a PTC thermistor that has a large adhesion to the conductive polymer and can be produced easily.

Abstract: Hybrid circuit arrangement having a resistance layer applied at least on one side of a plate-shaped substrate of glass or ceramic and having at least one overload protection arranged on the substrate that is electrically connected to the resistance layer, whereby the protection is formed by a PTC resistor. As a result thereof, the hybrid circuit arrangement is re-employable with the self-restoring fuse even after an overload malfunction.

Abstract: A thermal fluid flow or property sensor having no exposed contact wires or contact pads in the fluid flow path to obstruct measurements, flat fully passivated sensor surfaces and high corrosion resistance is implemented over a honeycombed thermal isolation chamber.

Abstract: A high voltage, current limiting device is connected in series with a high voltage power source and a protected load to interrupt current for an over-current condition [Typically 50 kA]. The current limiting device includes a current sensor/isolator and a switch connected in series. A current limiter, which may include a fuse or polymer current limiting material, is connected in parallel to the current sensor/isolator. The current sensor/isolator includes a pair of electrically insulated supports secured to a plurality of support rods to maintain the insulated supports at a predetermined fixed spacing to support an expulsion fuse. The expulsion fuse link includes a pair of copper conductors of adequate current carrying capability that are attached to ends of a main weak link fuse. A pair of coil springs hold the weak link fuse under tension to repel the conductors apart when the weak link fuse melts open during an over-current condition.

Abstract: Integrated, electrically operable micro-valves are formed to control fluid flow and pressure. These valves convert electrical energy to mechanical energy through an energy conversion device having a sealed cavity with a flexible wall. The sealed cavity contains a fluid that expands and contracts as it is heated or cooled, thus causing the flexible wall to move. Movement of this wall or membrane is used to move a valve element and dynamically control the opening or closing of a valve port over a predetermined range.

Abstract: A genus of integrated valves having an integrated actuator with a thin, flexible membrane formed of silicon driven by pressure of a fluid trapped in a cavity formed by bonding a first and second die. The cavity has a resistor formed therein through which current is driven to cause the pressure to rise and the flexible membrane to flex. Movement of membrane is used to drive a valve element to a position where it unblocks a port to open the valve. This genus includes species such as ultra clean embodiments where a containment barrier keeps ultra clean processing gases confined to a wetted area having materials and bonding agents selected so as to be chemically compatible with the materials and conditions in the wetted area. Low leak species include a compliant material for a valve seat which is deformed by a ridge surrounding a port in the closed position. It is this port which is blocked and unblocked by movement of the valve element to close and open the valve.

Abstract: A resistance temperature detector (RTD) unit includes an RTD assembly that is removably supported in a central chamber of a support assembly. In a preferred arrangement, the RTD assembly and the central chamber are arc shaped to facilitate removal from the support assembly and to maintain contact surface area. By providing a removable RTD assembly, costs are reduced over current RTD assemblies including two monitoring elements, and the RTD elements can be replaced without dismantling the top bar connections.

Abstract: A method is disclosed for the protection of catalytic converters for exhaust gas purification by measuring the temperature with a heat tone sensor suitable particularly for the implementation of the method, wherein a heat tone sensor composed of at least two NTC or PTC resistors and provided with a coating of a catalytically active material on the sensor in the region of at least one of these resistors is arranged ahead of the catalytic converter in the exhaust gas stream or a part thereof, with the catalytically active material initiating the same exothermal reactions as they take place in the catalytic converter employed for the exhaust gas purification. If the resistor is overheated due to an overly intensive exothermal reaction, resulting in a change in resistance, the heat tone sensor detects the drop in the throughput rate of the catalytic converter.

Abstract: An electrical resistance element having a resistance body between two contact terminals. The resistance body has PTC behavior and is composed of a polymer matrix and a filler component embedded in the polymer matrix. The filler component is composed of electrically conducting particles. Although the element is of simple and inexpensive construction, the resistance element is notable for good electrical conductivity in the low-resistance state and for a low response time for the PTC transition from the low-resistance to the high-resistance state. This is achieved as a result of the fact that at least some of the electrically conducting particles are formed as composite bodies having electrically conducting surfaces and/or as hollow or porous bodies composed of electrically conducting material. These particles have a lower specific density and/or lower specific heat capacity than solidly formed particles composed of conductive material.

Abstract: A current-limiting component having an electrical resistance body arranged between two contact terminals. The resistance body contains a first resistance material having PTC behavior. Below a limit temperature, the first resistance material has a low cold resistivity and at least one current-carrying path extending between the two contact terminals. Above the limit temperature, the first resistance material has a high hot resistivity compared with its cold resistivity. The current-limiting component has uniform switching capability and high rated current-carrying capacity despite simple and inexpensive construction. The resistance body additionally contains second resistance material having a resistivity which is between the cold resistivity and the hot resistivity of the first resistance material. The second resistance material is in intimate electrical contact with the first resistance material and forms at least one resistance path connected in parallel with the current-carrying path.

Abstract: Temperature sensors or temperature sensor arrangements made from glass ceramic and bonding film resistors, suitable especially for control and limitation of output in glass ceramic cooking areas, are distinguished in that thin- and/or thick-film resistors are baked on supports of glass ceramic, for example, in the area of the cooking zone of a glass ceramic cooking surface, and one or more glass ceramic resistances are delimited and bonded there, and the film resistors form parallel and/or iterative circuits with the glass ceramic resistances. By suitable selection of the dimensions as well as the surface resistances and temperature coefficients of the bonding film resistors and the type of sensor circuit (parallel and/or iterative circuit), the temperature resistance characteristic of a sensor circuit can be varied within wide limits, e.g., the temperature area of use of a glass ceramic sensor can be considerably expanded toward low temperatures.

Abstract: Circuit protection systems which comprise a PTC resistor and a second resistor, e.g. a thick film resistor, which is thermally and electrically connected to the PTC resistor have a break current I.sub.B and a hold current I.sub.H such that the ratio I.sub.B /I.sub.H is at most 20. Suitable PTC resistors are conductive polymer devices which comprise a PTC element which has been radiation crosslinked under conditions such that the average dose rate is at most 3.0 Mrad/minute or during which no part of the PTC element which is in contact with the electrodes reaches a temperature greater than (T.sub.m -60).degree.C., where T.sub.m is the melting point of the polymeric component of the conductive polymer.

Abstract: A monolithic microwave integrated circuit device provides a microwave transmission line with a resistor coupled thereto and a heating element thermally coupled to the resistor but electrically insulated therefrom by a dielectric layer. Heating the resistor with the heating element causes either a change in resistance of the resistor or the generation of noise by the resistor. Either the resistor or the heating element is constructed using monolithic integrated circuit construction techniques on the same circuit substrate with the transmission line.

Abstract: A PTC-resistor which is a temperature dependent electrical thermistor of semiconductor ferro-electric ceramic which is provided with power leads and serves as a sensor element is directly fused into glass. The power leads are welded to metal coatings formed on the PTC-resistor which are stable at the temperature occurring when the PTC-resistor is fused. The metal coatings are made of aluminum which are formed by aluminum silk screened metallizations which have a thickness of 50 .mu.m or more.

Abstract: A temperature sensing device for moving surfaces such as electrostatographic fusing rollers includes an electrothermal material such as a thermistor printed on a concave shaped, thermally conductive ceramic substrate with a high temperature lubricant between the ceramic substrate and the moving surface.

Abstract: A sensor assembly for boiling water dispenser includes clamping members for mounting a sensor such as a thermister in position to sense the presence and absence of steam.

Abstract: A device for heating a medium with which the device is in thermal contact for use in determining the thermal or flow properties of the medium. The device has a heater for supplying heat to the medium at an interface of the device with the medium and a temperature sensor for sensing the temperature at such interface.

Abstract: A pressure regulator integrated in a sandwich of pyrex and silicon wafers. A first integrated valve comprising a silicon wafer in which there is etched a cavity so as to leave a flexible membrane of silicon is sandwiched between two other wafers which are usually pyrex. One of the pyrex wafers has a resistor pattern etched thereon in a location such that the resistor pattern is enclosed by the walls of the cavity when the pyrex wafer is bonded to the silicon wafer. The other pyrex wafer has a valve seat etched adjacent to the membrane in the silicon wafer. The cavity is filled with a fluid which, when heated, raises the vapor pressure in the cavity so as to cause the membrane to flex and change the spacing between the membrane and the valve seat thereby regulating flow. A second integrated valve has the same structure. One of these valves is coupled to a high pressure source and the other is coupled to a low pressure sink.

Abstract: There is disclosed herein an apparatus for converting control signals of an electrical or optical nature or any other type of signal which may be converted to a change of temperature of a fixed volume of material trapped in a chamber to flexure of a membrane forming one wall of the chamber. Typically, the device is integrated onto a silicon wafer by anisotropically etching a trench into said wafer for enough that a thin wall of silicon remains as the bottom wall of the trench. In some embodiments, polyimide is used as the material for the membrane. The trench is then hermetically sealed in any one of a number of different ways and the material to be trapped is either encapsulated during the sealing process or later placed in the cavity by use of a fill hole. Typically, a resistor pattern is etched on the face of pyrex wafer used as a top for the trench to form the cavity. When current is passed through this resistor, the material in the cavity is heated, its vapor pressure increases and expansion occurs.

Abstract: An integrated sensing device includes a resistance temperature sensor formed in a semiconductor substrate and a resistance heater which is formed on an insulating layer which covers the surface of the semiconductor substrate. The resistance heater has a low temperature coefficient of resistivity and is positioned adjacent the resistance temperature sensor so the current flow through the resistance heater will generate heat which is transferred through the insulating layer to the resistance temperature sensor. The sensing device is applicable to a variety of sensing systems, such as mass flow measurement systems, dew point detection systems, and frost detection systems.

Abstract: A system for electrically heating a hose of the type used to transport one or more fluid components from a remote location to a point of application includes at least one fluid conduit and an electric heating element enclosed within a thermal insulation blanket to form a hose construction having predetermined heat transfer characteristics. A remotely positioned module enclosed in a thermal insulation blanket and containing an electric heater and temperature sensor provides a hose simulator having heat transfer characteristics substantially identical to that of the hose. An electrical power drive circuit connected in parallel to the hose heating element and the module heater is controlled by a temperature control circuit responsive to the temperature sensed within the module by the temperature sensor. The temperature control circuit is further responsive to an ambient temperature sensor physically separated from the hose and module.

Abstract: A fluid level sensor utilizes thick film thermistors in a four-thermistor bridge configuration. The bridge is heated by a heater to sense the presence or absence of fluid at a particular level with respect to the thermistors. Upon energizing the bridge with a power source, the middle leads thereof are monitored for voltage separation and polarity. An indicator circuit indicates when one or more of the thermistors is submerged in the fluid. The heater influences the temperature of the thermistors to a greater or lesser extent depending upon whether or not they are submerged. Detectable changes in voltages across the bridge are accordingly produced.

Abstract: A resistor device comprises a first film of resistive material deposited on a dielectric substrate and having two terminal portions for connection to an electrical circuit, and a second film of resistive material deposited on the substrate in thermally-conductive contact with the first film and electrically isolated therefrom. The material of one of the films has a relatively high temperature coefficient of resistance, so that the resistance of that film can be utilized as an indication of the temperature of the other film.

Abstract: A PTC thermistor device includes three PTC thermistors aligned and disposed in a heat transmission relation to each other such that the center PTC thermistor provides heat to the other PTC thermistors which are so connected as to define a part of path for the demagnetizing current. The two PTC thermistors positioned on the opposite sides of the center PTC thermistor increase their temperature rapidly so that a rapid and effective attenuation of demagnetizing current can be obtained.

Abstract: Battery feed resistors are constituted by thick film resistors on a substrate, electrically in series with switching type positive temperature coefficient (PTC) resistors which are closely thermally coupled to the thick film resistors by being mounted on the substrate behind the thick film resistors or on insulating layers over the thick film resistors. Precise battery feed resistances and matching of pairs of battery feed resistors are achieved by trimming the thick film resistors. The PTC resistors prevent excessively high temperatures being reached in the event that external high voltages are applied to a telephone subscriber line to which the battery feed resistors are connected.

Abstract: An air data sensor device, such as a pitot, total air temperature sensor, etc., includes an elongated probe having a sensor therein for sensing air flow parameters and a strut for positioning the probe in a desired position on an air vehicle. To avoid ice build-up on the device causing erroneous sensing of air flow parameters a substantially constant wattage electric resistive heater is provided in the probe for deicing. A PTC (positive temperature coefficient) resistive heater is disposed in the support at a location thermally isolated from the probe heater but in thermally conductive relationship to the external surface of the support. The PTC heater is connected in series with the probe heater and continuously varies heater power in response to the rate of heat dissipation at the external surface of the sensor device thereby preventing burn-out of the probe heater and erosion of the probe.

Abstract: A short duration timer for use in an electronic circuit such as a diesel engine glow plug control includes a first PTC resistor energized by an electric power source and stabilized in the exponential portion of its resistance-temperature curve. A second PTC resistor in thermal contact with the first is energized at time zero from the electric power source and substantially immediately stabilizes at a temperature higher than that of the first, resulting in heat flow from the second PTC resistor to the first, and therefore an increase in the resistance of the first, at a rate which is substantially independent of variations in ambient temperature and supply voltage of the electric power source. A signal ending the time duration is generated when the resistance of the first PTC resistor has changed by a predetermined percentage.

Abstract: A thermistor using an organophosphazene polymer having aryloxyl and/or alkoxyl group pendants as a thermo-responsive material. The organophosphazene polymer has an excellent responsiveness to temperature change, and can be molded into desired forms. The thermistor having good reliability and good heat and flame resistances can be prepared with good processability and in good yield.

Abstract: A component consisting of two coupled PTC thermistors with the first thermistor having a lower cold resistance than the second thermistor and the first thermistor having a higher resistance at the operating temperature than the second thermistor. According to the invention, the electric connection to the second thermistor is made directly by solely mechanical contacts to the surface of the ceramic thermistor body. This means a considerable simplification during manufacture, as the second thermistor need not be provided with electrode layers.