Abstract: A method of forming a buried resistor within a cavity for use in electronic packages using two glass impregnated dielectric layers, one with a clearance hole, the second with a resistor core, the clearance hole being placed over the resistor core and the assembly fusion bonded. The space remaining around the resistor core is filled with a soldermask material and the assembly is coated with metal. Thru-holes are drilled, cleaned, and plated and then the metal coating is etched and partially removed. The soldermask is then removed and a layer of gold plating is applied to the exposed metal surfaces. The use of glass impregnated dielectric layers and fusion bonding eliminates the fluorinated ethylene propylene resin (FEP) bleed problem associated with previous buried resistor cavity assemblies.

Abstract: There is provided a method of producing a printed circuit board incorporating a resistance element capable of adjusting resistance after the resistance element has been formed and assuring a high accurate resistance. A method of producing a printed circuit board incorporating a resistance element using carbon paste includes the steps of: forming through holes 5, 6, 25 and 26 or a bottomed hole in a double-sided copper clad laminate; applying noble metal plating into the through hole or the bottomed hole; filling the through hole or the bottomed hole with carbon paste; subjecting the carbon paste with which the thorough hole or the bottomed hole is filled to noble metal plating, conducting treatment and plating to form a conductive layer; forming an opening 18 in the conductive layer on the end of the through hole filled with the carbon paste; and performing trimming through the opening to adjust the resistance of the resistor formed by the carbon paste.

Abstract: A stack of an interconnect-level dielectric material layer and a disposable dielectric material layer is patterned so that at least one recessed region is formed through the disposable dielectric material layer and in an upper portion of the interconnect-level dielectric material layer. A dielectric liner layer and a metallic liner layer is formed in the at least one recessed region. At least one photoresist is applied to fill the at least one recessed region and lithographically patterned to form via cavities and/or line cavities in the interconnect-level dielectric material layer. After removing the at least one photoresist, the at least one recessed region, the via cavities, and/or the line cavities are filled with at least one metallic material, which is subsequently planarized to form at least one planar resistor having a top surface that is coplanar with top surfaces of metal lines or metal vias.

Abstract: A higher precision resistive element suppresses variation of the resistance value due to variation of film thickness. A resistive element includes a first portion having a first film thickness and a first width, and a second portion having the first film thickness and a second width determined by the first width. The sum of the first and second widths is constant. The first portion has an upper surface at a position at which a height from the bottom surface of the resistive element first portion is a first height. The resistive element second portion has an upper surface of the resistive element second portion at a position at which a height from a surface including the bottom surface of the resistive element first portion is the first height. The resistive element first portion and the resistive element second portion are coupled to each other via a coupling portion.

Abstract: A method of forming a buried resistor within a cavity for use in electronic packages using two glass impregnated dielectric layers, one with a clearance hole, the second with a resistor core, the clearance hole being placed over the resistor core and the assembly fusion bonded. The space remaining around the resistor core is filled with a soldermask material and the assembly is coated with metal. Thru-holes are drilled, cleaned, and plated and then the metal coating is etched and partially removed. The soldermask is then removed and a layer of gold plating is applied to the exposed metal surfaces. The use of glass impregnated dielectric layers and fusion bonding eliminates the fluorinated ethylene propylene resin (FEP) bleed problem associated with previous buried resistor cavity assemblies.

Abstract: The resistor device is provided with a resistive plate (11) of metal plate material, which is used as a resistance body; a radiative plate (15) of metal plate material, which is spaced from the resistive plate and intercrossed on the resistive plate; a molded resin body (19), which encloses an intercrossing portion of the resistive plate and the radiative plate; terminal portions of the resistive plate (11a), which comprises so that both ends of the resistive plate extending from the molded resin body are bent along an end face and a bottom face of the molded resin body; and terminal portions of the radiative plate (15a), which comprises so that both ends of the radiative plate extending from the molded resin body are bent along an end face and a bottom face of the molded resin body. Accordingly, the surface-mountable resin-sealed metal plate resistor device is enabled to increase the power capacity drastically and to improve the reliability without changing most of the size.

Abstract: Methods, devices, and systems associated with resistance variable memory device structures are described herein. In one or more embodiments, a method of forming a confined resistance variable memory cell structure includes forming a resistance variable material such that a first unmodified portion of the resistance variable material contacts a bottom electrode and a second unmodified portion of the resistance variable material contacts a top electrode.

Abstract: The present invention provides an array type chip resistor including: a substrate having a plurality of grooves formed on both sides thereof at equal spaces; lower electrodes formed on both sides of a bottom surface of the substrate; upper electrodes formed on both sides of a top surface of the substrate; side electrodes electrically connected to the upper and lower electrodes; a resistive element interposed between lower electrodes of the bottom surface of the substrate; a protection layer covered on the resistive element, the protection layer having both sides which cover a part of the lower electrodes and the resistive element; leveling electrodes being in contact with the lower electrodes exposed to outside of the protection layer; and a plating layer formed on the leveling electrodes.

Abstract: There is provided a method of producing a printed circuit board incorporating a resistance element capable of adjusting resistance after the resistance element has been formed and assuring a high accurate resistance. A method of producing a printed circuit board incorporating a resistance element using carbon paste includes the steps of: forming through holes 5, 6, 25 and 26 or a bottomed hole in a double-sided copper clad laminate; applying noble metal plating into the through hole or the bottomed hole; filling the through hole or the bottomed hole with carbon paste; subjecting the carbon paste with which the thorough hole or the bottomed hole is filled to noble metal plating, conducting treatment and plating to form a conductive layer; forming an opening 18 in the conductive layer on the end of the through hole filled with the carbon paste; and performing trimming through the opening to adjust the resistance of the resistor formed by the carbon paste.

Abstract: A method for making an integrated circuit substrate having embedded passive components provides a reduced cost and compact package for a die and one or more passive components. An insulating layer of the substrate is embossed or laser-ablated to generate apertures for insertion of a paste forming the body of the passive component. A resistive paste is used to form resistors and a dielectric paste is used for forming capacitors. A capacitor plate may be deposited at a bottom of the aperture by using a doped substrate material and activating only the bottom wall of the aperture, enabling plating of the bottom wall without depositing conductive material on the side walls of the aperture. Vias may be formed to the bottom plate by using a disjoint structure and conductive paste technology. Connection to the passive components may be made by conductive paste-filled channels forming conductive patterns on the substrate.

Abstract: It is provided that a reflection plate of semiconductor heat treatment, which is resistant to cracks or deformations by controlling the adsorption of foreign materials and the production of reaction. Said reflection plate 1 for semiconductor heat treatment is composed of a disk-shaped or ring-shaped plate of optically transmissible material and a plate 2 of inorganic material hermetically enclosed in said disk-shaped or ring-shaped plate, in which said plate of inorganic material has at least one side in contact with said plate of optically transmissible material, said at least one side 2a having a surface roughness of Ra 0.1 to 10.0 ?m, said at least one side 2a formed grooves 2c therein.

Abstract: A wrist-wearable detection device 2 for detecting a electrical potential of a pre-set magnitude within a certain proximity to the detection device. Detective circuitry 1 has a detection coil 3 that detects an electrical potential field generated by an electrically active field. The electrical potential is analyzed and compared by control circuit 20 against pre-set levels such as 60 Hz frequency, which in turn activates audible, visual (LED light) and for a vibratory indicator when in the presence of an electrical potential of a pre-set magnitude. The detector 2 is preferably incorporated into a wrist watch with controls (16, 17 and 18) which can be easily worn and thus always available for use.

Abstract: Disclosed is a method of producing a printed circuit board (PCB) with an embedded resistor, in which a resistor with a desired shape and volume is precisely formed using a resistor paste so that resistance values according to a position of the PCB are uniform, thereby a laser trimming process is omitted or minimally utilized. The method has advantages in that a production time of the PCB is shortened and productivity is improved because an operation condition is rapidly set without being greatly affected by the position precision of a printing device. Other advantages of the method are that the resistor paste with a relatively uniform thickness is secured through a screen printing process, thereby easily forming the resistor and improving resistance tolerance.

Abstract: A sensor system has an AlN substrate, a W layer on the substrate, a signal source adapted to apply an electrical actuating signal to the W layer, and a sensor adapted to sense the response of the W layer. The W layer can comprise a thin film, with various types of optional protective layers over the film. Applications include sensing temperature, fluid flow rates, fluid levels, pressure and chemical environments. For a planar heater, the W layer comprises a plurality of conductive strands distributed on the substrate, with the strands generally parallel and serpentine shaped for a rectangular substrate, and extending along respective lines of longitude that merge at opposite poles of the substrate for a circular substrate.

Abstract: A method for fabricating the embedded thin film resistors of a printed circuit board is provided. The embedded thin film resistors are formed using a resistor layer built in the printed circuit board. Compared with conventional discrete resistors, embedded thin film resistors contribute to a smaller printed circuit board as the space for installing conventional resistors is saved, and better signal transmission speed and quality as the capacitive reactance effect caused by two connectors of the conventional resistors is avoided. The method for fabricating the embedded thin film resistors provided by the invention can be conducted using the process and equipment for conventional printed circuit boards and thereby saving the investment on new types of equipment. The method can be applied in the mass production of printed circuit boards and thereby reduce the manufacturing cost significantly.

Abstract: Circuit panels are provided with resistors in vias extending between the top and bottom surfaces of the panels. The resistors may be formed by depositing a composite in each via, as by depositing a dispersion of a conductive material and a dielectric or by depositing one or more thin layers of a conductor. The resistors may be disposed at interior locations buried within a multilayer circuit board formed by laminating one or more panels having such resistors with one or more additional elements.

Abstract: A method and apparatus for aspirating a liquid (e.g., blood) from a container uses an electrically biased thermistor element, mounted proximate the tip of a liquid-aspirating probe, to determine that the probe is safely submerged within a body of liquid to be aspirated at all times during the aspiration process. Also disclosed are different aspiration probe assemblies that are useful in the method and apparatus of the invention.

Abstract: A combination run capacitor/positive temperature coefficient resistor/overload (CAP/PTCR/OL) module is described. The cover of the combination housing includes a capacitor compartment and terminal openings for receiving blade terminals of a run capacitor. The terminal openings in the cover align with blade receiving receptacles coupled to the PTCR start circuit. The blade terminals of a run capacitor are inserted into the receptacle openings and into electrical engagement with the blade receiving receptacles. The capacitor is supported and protected by a potting mixture filling the capacitor compartment.

Abstract: A resistor is provided that is made by laminating at least two resistive layers, where these resistors have conductive particles held in a binder resin. The resistors are laminated such that a top resistor covers a bottom resistor, and a surface of the top resistor is exposed. The resistivity of the top resistor is made smaller than that of the bottom resistor. The top resistor contains carbon fiber and carbon black, where the central particle size of the carbon fiber ranges from 3.5 to 9.0 &mgr;m. The resistor has excellent durability and micro-linearity characteristics. The resistor may also be used as a variable resistor.

Abstract: SMD current-sense resistors are manufactured by dividing a drawn laminated wire structure that consists of a core of a resistive alloy and a jacket made of copper, e.g. After removing part of the copper jacket, jacket sections used as connector contact layers remain only at the ends of the resistor.

Abstract: A plurality of protective resistors can be easily inserted between circuit forming elements, and opposite ends of each protective resistor can be properly press-contacted to each circuit forming element. The protective resistor can be easily replaced when broken. A resistor array board comprises a porous plate having a plurality of through-holes arranged in array and opening at opposite surfaces thereof; and a plurality of protective resistors removably loosely inserted into the through-holes, respectively. Each of the protective resistors are resiliently retained by an electrically conductive spring element, and opposite ends of each of the protective resistors are press-contacted with the circuit forming elements which are arranged in opposing relation on surfaces of the porous plates.

Abstract: A resistor may be embedded into a substrate. A portion of the resistor may be exposed, by segmenting the substrate, for instance, so that the resistor may be trimmed to a desired resistance level. Alternatively, a portion of a resistor may be embedded into a substrate, with another portion of the resistor being disposed on the outer surface of the substrate. The portion of the resistor on the outer surface may be trimmed to adjust the resistance of the resistor to a desired level.

Abstract: An FBT (fly-back transformer), its bleeder resistor (installed on the top of the FBT), and a device for coupling the bleeder resistor are disclosed. The bleeder resistor 100 is accommodated within a resistor case 180, and the resistor case 180 is installed on the top of an FBT case 110. A resistor pattern 140 is printed on the substrate 130 of the bleeder resistor 100. Openings 150 are formed within the wavy portions of the resistor pattern 140, and the resistor case 180 has a plurality of isolating sheets 160 within its interior 170, so that the isolating sheets 160 can be inserted into the openings 150. When manufacturing the bleeder resistor, the glass coating, the baking, the epoxy resin dipping are eliminated, but the voltage breakdown resisting property is improved. Further, the manufacturing cost is lowered owing to the simplification of the process.

Abstract: A process for forming a thick-film resistor whose dimensions can be accurately obtained, thereby yielding a precise resistance value. The method includes providing on a substrate a photoimageable layer that preferably forms a permanent dielectric layer of a multilayer structure. An opening is photodefined in the surface of the photoimageable layer, and then overfilled with an electrically-resistive material to form a resistive mass having an excess portion that lies on the surface of the photoimageable layer surrounding the opening. Following curing which causes the surface of the resistive material to become recessed below the surface of the photoimageable layer, the excess portion of the resistive mass is removed, preferably by abrading or a similar operation, such that the lateral dimensions of the resistive mass are determined by the lateral dimensions of the opening in the photoimageable layer.

Abstract: A ceramic heater has a structure in which a resistance heating element mainly composed of a metal having a high melting point is embedded in a ceramic substrate. With an average grain size for component grains of the ceramic substrate taken as dB and that for component grains of the resistance heating element taken as dH, a dH/dB ratio is adjusted to not greater than 0.8.

Abstract: A component package includes a case with a bond shelf and a conductive layer formed on the bond shelf. The bond shelf is characterized by an inward edge and an outward edge and at least one reticulation, each reticulation being characterized by an outward edge and an inward edge. The reticulation inward edge is co-linear with the bond shelf inward edge. The conductive layer includes a mounting pad for each reticulation and a serpentine conductor connecting the mounting pads, the mounting pad being disposed between the inward edge of the reticulation and the outward edge of the reticulation. The component package further includes a chip transistor mounted on a first mounting pad and a chip resistor mounted in a first reticulation. A semiconductor circuit mounted in the component package includes a bonding pad connected to a pad on the chip transistor and one end of the chip resistor.

Abstract: A three dimensional polysilicon resistor and a method by which the three dimensional polysilicon resistor is manufactured. A semiconductor substrate has formed upon its surface an insulating layer. The insulating layer has a minimum of one aperture formed at least partially through the insulating layer. A polysilicon layer is formed upon the insulating layer and formed conformally into the aperture(s) within the insulating layer. The polysilicon layer is then patterned to form a resistor which includes the portion of the polysilicon layer which resides within the aperture(s).

Abstract: The present invention includes a programmable thin film filament resistor and method of constructing same. The finished construction includes: a core member of hydrogenated amorphous silicon; upper and lower electrodes made of a barrier metal such as molybdenum or tungsten applied to the upper and lower surfaces of the core member; and, backing layers, typically made of aluminum, applied to the outside surfaces of the electrodes. An insulator may be added to the upper surface of the core member. A programming voltage is applied to the electrodes, creating a discharge path between the upper and lower electrodes. When a critical current is reached, a filament is formed as the aluminum of the backing layers, the barrier metal of the electrodes, and the amorphous silicon are fused together. The result is a filament resistor with linear properties within a defined operating range. In an alternate embodiment, the upper and lower electrodes are overlapped in an alternating pattern, creating fusion zones.

Abstract: A resistor substrate in which a resistor layer having an electroconductive powder and carbon fibers dispersed in a heat resistant resin is molded into a substrate comprising a heat resistant thermosetting molding material, and the surface of the resistor layer is in a mirror-finished state. The resistor substrate is manufactured by printing the resistor layer on a metal plate and heat-curing the same, molding the resistor layer formed on the metal plate in a die into a substrate shape with a heat resistant thermosetting resin and peeling the metal plate and transferring the resistor layer to the substrate molded from the heat resistant thermosetting resin.

Abstract: A heating block made from a heat conductive material has a passage through which a fluid heated by the heater can flow. A groove preferably having a looped configuration extends into the block from a peripheral surface in the block. A heater made from an electrically conductive and heat conductive material is disposed in the groove, preferably in a looped configuration corresponding to the looped configuration of the groove. A heat conductive member disposed in the groove is provided with a hole to receive the heater in an enveloping relationship. The member may be defined by a pair of separable portions. The member is preferably disposed in the looped relationship in the groove. Localized deformation of the heating block holds the member and the heater in a fixed relationship with the block. The heater may deteriorate or become defective with extended usage and may have to be replaced. To accomplish this, the heater and the member may be removed as a unit from the block after removing the deformation.

Abstract: An electronic circuit device decreases dispersion in the output of the circuit caused by changes in the resistance of the resistors resulting from stress. Resistor positions are selected on the circuit board so that a change in the circuit output caused by a change in resistance of a first resistor group becomes equal to a change caused by a change in resistance caused by a second resistor group, these changes being in opposite directions so as to cancel each other. Alternately, a plurality of resistors are connected to form a composite resistor such that the effect upon resistance of the composite resistor caused by the resistor having decreased resistance is cancelled by the effect upon resistance of the composite resistor caused by a resistor having an increased resistance.

Abstract: A resistor 1 in which at least one resistance film 4 is embedded in a ceramic sintered body 3, glass is diffused into the sintered body 3 to form a glass diffusion layer 6, and both end faces 4a and 4b of the resistance film 4 are respectively exposed to both end faces 3a and 3b of the ceramic sintered body 3.

Abstract: The power resistor has a metal housing and heatsink, the bottom wall of which is planar and has a bolt hole therethrough for tight securing of the resistor to a chassis. A planar film-type power resistor is mounted in the housing and encapsulated therein, being held close to the bottom wall of the housing. Heat from the film-type resistor passes through the bottom wall into the chassis, the result being that the power rating of the resistor is high. The metal housing is die-cast of a zinc alloy, at extremely low cost yet with substantially the same heat-transmission characteristic as that of conventional die-castable aluminum alloys.

Abstract: A vacuum-molded electrical radiant heating unit having a resistance heating coil embedded in a ceramic fiber body is prepared by a process in which a resistance heating coil (5) is placed on a sieve-like tray (1), above a suction box, and a slip is applied thereto composed of ceramic fibres, so that a ceramic fibre layer (4) builds up under the action of suction. Portions of the sieve-tray (1) are closed, in regions beneath the resistance heating coil (5) by means of spacing strips (11). These strips, which cover some of the perforations in the sieve-tray (1), are placed beneath the resistance-heating coil (5), in a manner such that the impervious regions of the sieve tray (1) are narrower than the width dimensions of the heating coil (5).

Abstract: A ceramic base component packaging assembly with high thermal transfer rates. The packaging assembly includes a molded plastic cover that receives spring washers, ceramic pads, resistive elements or other electronic components, and a thermally conductive ceramic base. The spring washers press the electronic elements against the ceramic base ensuring good thermal transfer. The ceramic base is an effective thermal conductor and electrical isolator for the device.

Abstract: An overvoltage resistor formed in the substrate semiconductor material of an integrated circuit. The overvoltage resistor is formed from a resistive layer formed over a well of a semiconductor material having a conductivity type which is opposite to the conductivity type of the substrate material. The overvoltage resistor is not connected to the voltage supplies of the integrated circuit, thereby eliminating the virtual pn-diode which would otherwise be formed between the well and the substrate and allowing the overvoltage resistor to protect the integrated circuit from voltages outside the range of supply voltages.

Abstract: A heated handgrip is disclosed wherein a tubular sleeve is overlayed by a sheath with a heating wire sandwiched between the sleeve and the sheath.The sheath and the sleeve are connected threadedly and lock means are provided to preclude relative motion between the sheath and the sleeve.

Abstract: A heated hand grip is disclosed having an internal sleeve and an external protective jacket where the sleeve is formed with external, helical lands and grooves about which a strand of resistance wire is sewed and anchored snugly. The disclosure includes a method of manufacturing the heated hand grip.

Abstract: In a magnetic sensor, a first series-connected magnetic resistance element circuit is connected parallel to a second series-connected magnetic resistance element circuit, which finally forms a bridge circuit. The magnetic resistance elements are subdivided into two or three subdivided pieces. These subdivided pieces are arranged at a predetermined interval and connected with each other by conductors having low resistivity.

Abstract: A nonfocused infrared panel emitter and method of making the same. The panel emitter includes a primary emitter positioned between an insulating layer and a secondary emitter. Preferably, the primary emitter comprises a metal foil having a pattern formed by etching. The secondary emitter may be either a woven alumina cloth, or a sheet of glass which is transparent to infrared radiation. In one embodiment of the invention, a layer of somewhat compressible, high temperature resistant paper is placed on either side of the metal foil to accommodate expansion and contraction thereof. In one method of making the panel emitter, a mesh sheet is positioned adjacent the metal foil and the sheet is vaporized by heating to create a void adjacent the foil to allow for thermal expansion and contraction of the foil.

Abstract: A resistance heating coil is placed on a sieve like tray above a suction box, and a slip of ceramic fibers is placed in the suction box, so that a ceramic fiber layer builds up when suction is applied. Portions of the sieve like tray are closed in regions beneath the resistance heating coil by strips in such a manner that the impervious regions of the sieve like tray are narrower than the width dimensions of the heating coil so that the space inside the heating coil remains free of fiber material during the vacuum moulding operation. This allows the heater to be operated at a higher temperature without the risk of crystallization of the fibers.

Abstract: An electric contact or circuit breaker device comprises a base member and an operating member. In a surface of the base member, there is provided at least one elongated indentation wherein an electric conductor is inserted and is without electrical connection with the base member. The operating member includes a cover layer of a resilient material which extends over each indentation in the base member. The cover layer is electrically conducting in order to establish electric connection between the cover layer and the conductor, when a pressure is applied to the cover layer in a direction towards or into the indentation. When the pressure ceases, the resiliency of the cover layer will break the electric connection. The electric contact device thus provided can be sealed in a simple and effective manner against intrusion of dirt and damp and the parts of the device are subjected to minimum mechanical wear.

Abstract: A device for heating tables containing an evaporable substance such as scents, deodorizers or insecticides includes an elongated heating support of insulating material having a planar surface and a longitudinal opening therethrough. The heating support is preferably T-shaped, the planar surface being the top of the T. The planar surface is coated with an enamel coating so that residue from the evaporable substances is easily removed. A cylindrical resistance heating element is inserted into the cylindrical opening, the cylindrical element being of a lesser length than the length of the heating support. The arm portions of the T-shaped support may be each provided with a longitudinally extending hole for limiting lateral transfer of heat through the support. Conductors for supplying electricity to the heating element enter the cylindrical opening at a point displaced from the outward edges thereof so that the outward edges of the heating support member is completely insulated.

Abstract: Down spouts have at least one section that is a length of an extruded conduit having lengthwise portions extending from end-to-end thereof with a backing, substantially coextensive in length connected thereto and with a heating element between the backing and the seat defined by the lengthwise portions. Where the down spout includes one or more elbows, shorter sections of the same extrusion are used to form them with those that are disposed angularly having the heating element disposed in an underlying position and with the abutting ends of the sections mitered and sealed together.

Abstract: A drip edge strip for a shingled roof is tapered and includes a first portion to be secured to the roof and provided with channels extending from end-to-end thereof and a second portion to underlie the first course of shingles and to cover the channels. A heating cable extends lengthwise of the channels.