Abstract: A resistor, including a resistive element made of a metal plate, has a low resistance resulting from connection terminal electrodes formed on both ends of the lower surface of the resistive element. The object thereof is to achieve weight reduction and lower costs by reducing the height of the resistor. To achieve the above object, the ends of the lower surface of the resistive element are provided with recesses for accommodating the connection terminal electrodes, while at least the intermediate area of the lower surface of the resistive element between the connection terminal electrodes is covered with an insulator. Alternatively, a recess may be formed in the middle of the lower surface of the resistive element for using the ends of the lower surface as a pair of connection terminal electrodes, the recess being internally covered with an insulator.

Abstract: An electrical component having a base body includes a layer stack of mutually overlapping, electrically conductive electrode layers that are separated from one another by electrically conductive ceramic layers. The electrically conductive ceramic layers are composed of a ceramic whose specific electrical resistance exhibits a negative temperature coefficient. The electrically conductive ceramic layers are produced of ceramic green films that are sintered in common with the electrode layers, and outside electrodes that are electrically conductively connected to the electrode layers are arranged at two opposite outside surfaces of the base body. A method for the manufacture of the component and to the employment of the component is also provided.

Abstract: The substrate (2) containing the via-hole (3) is inserted into an electrophoretic cell (1) and an electrode (6) (the “first electrode”) is placed on top of a first orifice of the via-hole(s) (3), to be implemented with electrical component(s), so that the electrode (6) totally covers the first orifice. Electrically charged either conductive and/or non-conductive particles are provided by immersing the volume of the via-hole(s) (3) in a conductive medium (17) consisting of the electrically charged particles. An electric field is created between the first electrode (6) and a second electrode (4) through the via-hole(s) (3) and the conductive medium (17) and the electrically charged particles are precipitated on the inner surface of the first electrode (6) that is directed to the second orifice of the via-hole(s) (3), until a desired portion of the volume of the via-hole(s) (3) is filled with a first layer of the charged particles having a desired thickness.

Abstract: An integrated circuit includes a bilayer thin film resistor in which the lower layer is a seed layer that controls the crystal structure of the upper layer. The thickness of the lower layer and the thickness of the upper layer may be chosen to form a resistor with a TCR having a design value.

Abstract: A voltage variable material (“VVM”) including an insulative binder that is formulated to intrinsically adhere to conductive and non-conductive surfaces is provided. The binder and thus the VVM is self-curable and applicable in a spreadable form that dries before use. The binder eliminates the need to place the VVM in a separate device or to provide separate printed circuit board pads on which to electrically connect the VVM. The binder and thus the VVM can be directly applied to many different types of substrates, such as a rigid FR-4 laminate, a polyimide, a polymer or a multilayer PCB via a process such as screen or stencil printing. In one embodiment, the VVM includes two types of conductive particles, one with a core and one without a core. The VVM can also have core-shell type semiconductive particles.

Abstract: A heater for heating a rigid fluid line or hose for freeze protection. The heater has a base made of an outer base layer, a middle base layer attached to the outer base layer; and an inner base layer attached to the middle base layer. The inner base layer can be uncured silicone (before assembly processing). A resistance wire is wound around an electrically non-conductive core and located on the inner base layer. The resistance wire can be a high gauge wire providing for a small moment of flexure. A cover includes an inner cover layer covering said resistance wire. This inner cover layer can be uncured silicone (before assembly processing). A middle cover layer is attached to the inner cover layer, and an outer cover layer is attached to the inner cover layer. The outer cover layer protects the heater from abrasion.

Abstract: The organic NTC composition according to the present invention is a mixture of a conjugated organic semiconductor polymer and a thermoplastic resin or thermosetting resin. For example, the mixed amount of the thermoplastic resin or thermosetting resin is preferably equal to or lower than two times the amount of the conjugated organic semiconductor polymer, and a conjugated organic semiconductor polymer selected from solvent-soluble polyaniline, polythiophene, polypyrrole and their derivatives is preferably used. This organic NTC composition makes it possible to provide an organic NTC device without using any expensive material and facilitates easy production at low temperatures.

Abstract: The present invention relates to a resetable over-current protection device. The device is characterized in that: disconnected areas are maintained at end faces of formed cutting regions of the protection device, wherein one or two of the end faces of the formed cutting regions are partly formed with electrically conductive layers so as to increase the lifespan of the device and allows easy manufacturing of the device. The present invention also provides a method of manufacturing the resetable over-current protection device. The method is characterized in that a polymer-based sheet is divided into a plurality of components from which resetable over-current protection devices are subsequently manufactured into the resetable over-current protection devices to save the cost of material.

Abstract: A PTC circuit protection device to protect electronic devices against excessive temperatures and electrical currents. The device comprises a polymeric resistor element, a first electrode, and a second electrode. The polymeric resistor element changes resistance in response to temperature changes. The resistor element has an upper surface and a lower surface. The first electrode is in electrical contact with both the upper surface and the lower surface. The second electrode is in electrical contact with both the upper surface and the lower surface. The circuit protection device has a first effective area of resistance and a second effective area of resistance that is electrically in parallel with the first effective area.

Abstract: A chip resistor includes: an insulating chip substrate 11 having an upper surface formed with a resistive film 12 and a pair of left and right upper electrodes 13 at two ends thereof; a cover coat 14 covering the resistive film; auxiliary upper electrodes 15 formed on upper surfaces of the upper electrodes 13 to overlap the cover coat 14; a left and a right side electrodes 16 formed on a left and a right end surfaces 11a of the insulating substrate 11; and metal plate layers formed on surfaces of the auxiliary upper electrodes and side electrodes. The cover coat 14 is formed with an uppermost over coat 19 covering a region where the auxiliary upper electrodes 15 overlap the cover coat 14, whereby the upper electrodes 13 and the auxiliary upper electrodes 15 are protected from migration caused by sulfur gases.

Abstract: A resistor having reliability in electrical connection between an upper surface electrode and a side face electrode, and in bonding strength between a first thin film and a second thin film is provided. The resistor includes upper surface electrodes formed on a main surface a substrate and side face electrodes disposed to side faces of the substrate and connected electrically to the pair of upper surface electrodes, respectively. The upper surface electrode includes a first upper surface electrode layer and a bonding layer overlying the first upper surface electrode layer. The side face electrode includes a first thin film disposed to a side face of the substrate, a second thin film composed of copper-base alloy film and connected electrically to the first thin film, a first plating film formed by nickel plating for covering the second thin film, and a second plating film covering the first plating film.

Abstract: An electrical component includes a base body that contains dielectric layers. The dielectric layers are superimposed and contain ceramic. The component also includes outer contacts on an exterior of the base body, and a resistor in an interior of the base body located between two of the dielectric layers. The resistor is connected to the outer contacts, and is made from a layer that forms a path between the outer contacts. The path between the outer contacts has multiple bends.

Abstract: A resistor for an electron gun assembly is configured to apply a voltage, which is divided with a predetermined resistance division ratio, to an electrode provided in the electron gun assembly. The resistor includes an insulating substrate, an electrode element provided in association with each of a plurality of terminal portions on the insulating substrate, a resistor element having a pattern for connecting the electrode elements and obtaining a predetermined resistance value, and an insulating coating layer that covers the resistor element. In at least one terminal portion B, the electrode element is disposed spaced apart from the insulating coating layer, and an intermediate resistor element is disposed between the electrode element and the insulating coating layer. The intermediate resistor element has a resistance value that is different from a resistance value of the electrode element.

Abstract: A high precision power resistor having the improved property of reduced resistance change due to power is disclosed. The resistor includes a substrate having first and second flat surfaces and having a shape and a composition; a resistive foil having a low TCR of about 0.1 to about 1 ppm/° C. and a thickness of about 0.03 mils to about 0.7 mils cemented to one of the flat surfaces with a cement, the resistive foil having a pattern to produce a desired resistance value, the substrate having a modulus of elasticity of about 10×106 psi to about 100×106 psi and a thickness of about 0.5 mils to about 200 mils, the resistive foil, pattern, type and thickness of cement, and substrate being selected to provide a cumulative effect of reduction of resistance change due to power. The present invention also provides for a method of producing a high precision power resistor.

Abstract: The present invention discloses a surface mountable laminated thermistor device which utilizes current-used double sided metal foil clad substrate as a base material and a PTC conductive composite that complies with circuit connection design combinations among electrodes to obtain a surface mountable laminated thermistor device with a parallel manner, and vastly simplify the fabrication process of the surface mountable laminated thermistor device.

Abstract: A chip resistor includes an insulating substrate 2 in the form of a chip having an upper surface and an opposite pair of side surfaces, a resistor film 4 formed on the upper surface of the insulating substrate 2, a pair of upper electrodes 5 formed on the upper surface of the insulating substrate 2 to flank the resistor film 4 in electrical connection thereto, a cover coat 6 covering the resistor film 4, an auxiliary upper electrode 7 formed on each of the upper electrodes 5 and including a first portion 7a adjoining the relevant side surface of the insulating substrate 2 and a second portion 7b overlapping the cover coat 6, and a side electrode 8 formed on each of the side surfaces of the insulating substrate 2 and electrically connected to at least the upper electrode 5 and the auxiliary upper electrode 7.

Abstract: Disclosed are methods for making microwave circuits using thickfilm components, the thickfilm components including: a first, multi-layer thickfilm dielectric deposited on a ground plane; a thickfilm conductor deposited on the first thickfilm dielectric; a second, multi-layer thickfilm dielectric deposited on the first dielectric and conductor to encapsulate the conductor; a thickfilm ground shield layer deposited over the first and second dielectrics; and thickfilm resistors deposited in close proximity to the first and second dielectrics.

Abstract: A transparency, e.g. a laminated windshield has a pair of spaced bus bars on an electric conductive member e.g. an electric conductive coating on a glass sheet. The perimeter of the coating is spaced from the peripheral edge of the sheet to provide a non-conductive strip. Ends the bus bars extend into the non-conductive strip to minimize/eliminate hot spots at the end portions of the bus bars. An additional feature to reduce hot spots includes bus bars having different lengths with portions of the coating between the bus bars not extending beyond the ends of the longer bus bar. In another, the windshield has a vision area, a bus bar between the top edge of the coating and the top edge of the vision area and a bus bar between the bottom edge of the coating and bottom edge of the vision area.

Abstract: Circuit boards (1100, 1500, 1600, 1700) and methods for fabricating circuit boards that include heaters for maintaining temperature sensitive components at an operating temperature are provided. Resistive traces (602, 702,704) are included in the circuit boards proximate temperature sensitive apparatus (1004, 1304, 1602, 1712). Thermally conductive patches (802, 902, 904) are interposed between the resistive traces and the temperature sensitive components. The thermally conductive patches establish zones of relatively uniform temperatures. According to a preferred embodiment of the invention the temperature sensitive apparatus comprises a fluid conduit (1004).

Abstract: In accordance with the invention, a temperature compensating device comprises one or more integrated sheet thermistors. Because the sheet thermistors are relatively thick and integral with the substrate, they are less susceptible to changes in air temperature and to temperature gradients. Moreover, the sheet thermistors can be made smaller in area, permitting more compact, less expensive devices that exhibit improved high frequency performance. The devices can advantageously be fabricated using the low temperature co-fired ceramic (LTCC) process.

Abstract: The object of this invention is to provide a panel-type heating element having an excellent durability and high effectiveness in power saving. To attain this object, the present invention provides a panel-type heating element consisting of a base which a thin film containing zinc oxide and tin oxide can form a layer upon. The panel-type heating element is advantageously manufactured by a method comprising spraying a solution containing a zinc compound and a tin compound on a base. The solution then oxidizes by heating the base in a high temperature reaction chamber to form a thin film consisting of sediment containing zinc oxide and tin oxide on the surface of the base. As a result, the thin film gives the base excellent acid, water and chemical resistance, and heats quickly.

Abstract: The present invention provides for a flip chip resistor having a substrate having opposite ends, a pair of electrodes formed from a first electrode layer disposed on the opposite ends of the substrate, a resistance layer electrically connecting the pair of electrodes, a protective layer overlaying the resistance layer, and a second electrode layer overlaying the first electrode layer and at least a portion of the protective layer. The present invention provides for higher reliability performance and enlarging the potential soldering area despite small chip size.

Abstract: A method of making a chip resistor is provided. According to this method, an aggregate board is first prepared which includes a first region and a second region which are spaced from each other via an excess portion. Then, a conductor pattern is formed which extends to bridge the first region and the second region. Subsequently, a resistor element is formed in each of the first region and the second region for connection to the conductor pattern. Then, the aggregate board is cut at the excess portion. The conductor pattern includes a thinner-walled portion extending across the excess portion and a thicker-walled portion connected to the thinner-walled portion and spaced from the excess portion.

Abstract: A surface mountable laminated circuit protection device comprises a first metal layer including a first unit and a second unit, a first insulating layer disposed on the first metal layer, and a second metal layer disposed on the first insulated layer. There is also a composite electroplated layer containing carbon black disposed on the second metal layer, and a first conductivity composite material layer having positive temperature coefficient (PTC) characteristics disposed on the composite electroplated layer containing carbon black. Above the first conductivity composite material layer having PTC characteristics is a third metal layer. Furthermore, there is a first conducting mechanism for conducting the first metal layer and the second metal to each other; and a second conducting mechanism for conducting the third metal layer and the first metal to each other.

Abstract: A process for manufacturing a composite polymeric circuit protection device in which a polymeric assembly is provided and is then subdivided into individual devices. The assembly is made by providing first and second laminates, each of which includes a laminar polymer element having at least one conductive surface, providing a pattern on at least one of the conductive surfaces on one laminate, securing the laminates in a stack in a desired configuration, at least one conductive surface of at least one of the laminates forming an external conductive surface of the stack, and making a plurality of electrical connections between a conductive surface of the first laminate and a conductive surface of the second laminate. The laminar polymer elements may be PTC conductive polymer compositions, so that the individual devices made by the process exhibit PTC behavior.

Abstract: A method of manufacturing a resistor foil, comprised of a copper layer having a first side and a second side. A tiecoat metal layer having a thickness of between 5 Å and 70 Å is disposed on the first side of the copper layer. A first layer of a first resistor metal having a thickness of between 100 Å and 500 Å is disposed on the tiecoat metal layer, and a second layer of a second resistor metal having a thickness of between 100 Å and 500 Å is disposed on the first layer of the first resistor metal. The first resistor metal has a resistance different from the second resistor metal.

Abstract: A composite circuit protection device includes a laminar insulating member and first and second laminar circuit protection devices.

Abstract: The present invention discloses a structure for composite materials of a positive temperature coefficient thermistor and a method of making the same. A carbon black is electroplated onto a surface of the metal electrodes of a metal laminated material to form a continuous porous structure having carbon black. Then a thermal laminating process is used to laminate the metal laminated material and a conductive crystallized polymeric composite material plaque filled with carbon black, to form a fine point between surfaces of the metal electrodes of metal laminated material and the conductive crystallized polymeric composite material plaque filled with carbon black. In the meantime, it can also lower down interfacial resistance by allowing carbon black particles of conductive crystallized polymeric composite material filled with carbon black to fully contact with the surface electroplated layer of the metal electrodes.

Abstract: A sensor component comprises a ceramic support (12) with a metal film (14) applied thereto. At least one connecting wire (16) is electrically connected to the metal film (14) in a contact area (18). A fixing glaze (20) is applied to the metal film (14) and the at least one connecting wire (16) in the contact area (18). The ceramic support (12) has at least one recess (24) in the area of the fixing glaze (20).

Abstract: A surface mount resistor is formed from an elongated resistive body having first and second terminal ends and a raised center portion formed therebetween. The raised center portion includes slots in its edges which form a serpentine current path through the raised center portion of the resistor. A dielectric surrounds and encapsulates the raised center portion and an electrically conductive material coats the first and second terminal ends. The method for manufacturing involves utilizing an elongated ribbon which is of unitary construction and which is formed to create a carrier strip and a raised center portion for the resistors ultimately to be formed.

Abstract: The invention relates to a microactuator arranged on a thermally insulating layer (2) and having a resistance layer (4) made from doped diamond, which is provided with an electrical supply and an electrical leakage (9).

Abstract: A thermistor having multiple metal layers about at least a portion of a semiconductor body. The thermistor includes a first thick film electrode layer, a reactive metal layer, a barrier metal layer and, optionally, a layer to facilitate attachment to an electrical contact. Also, a method of making the thermistor is described.

Abstract: A chip thermistor includes a chip element assembly having a substantially rectangular shape and three pairs of side surfaces facing each other, and a pair of external electrodes each having a main electrode portion and a side-surface electrode portion, wherein the external electrodes have gaps therebetween, each main electrode portion is disposed on each of a first pair of the side surfaces having a substantially rectangular shape, each side-surface electrode portion is disposed on an end portion of each of four side surfaces which define a second and third pair of the side surfaces, the end portion that is connected with each of the first pair of the substantially rectangular side surfaces each having the main electrode portion thereon, and each of the gaps is on each of the four side surfaces.

Abstract: A chip polymer PTC thermistor for surface mount assembly having a superior long-term connection reliability between side electrode and main and sub electrodes. The thermister comprises; a rectangular parallelepiped conductive polymer(11) having PTC properties; a first main electrode(12a) and a first sub electrode(12b) disposed on a first face of the conductive polymer; a second main electrode(12c) and a second sub electrode(12d) disposed on a second face opposite the first face of the conductive polymer; and first and second side electrodes(13a,13b) folding around and over the entire surface of side faces of the conductive polymer, the side electrodes electrically coupling the electrodes disposed on the two faces of the conductive polymer, and a thickness of the side electrodes is not less than one twentieth of the distance between the first main electrode(12a) and the second sub electrode(12d) and the distance between the first sub electrode(12b) and second main electrode(12a,12c).

Abstract: A current-limiting device includes a current-limiting material, such as a molded thermoset material, and first and second electrodes structured for carrying current through the current-limiting material. The first electrode electrically engages a first portion of the current-limiting material, and the second electrode electrically engages a second portion of the current-limiting material. A mechanism provides a non-uniform pressure distribution between one or both of the first and second electrodes and the current-limiting material.

Abstract: A surface mount resistor includes an elongated piece of resistive material having strips of conductive material attached to its opposite ends. The strips of conductive material are separated to create an exposed central portion of the resistive material therebetween. According to the method the resistive strip is attached to a single co extensive strip of conductive material and a central portion of the conductive material is removed to create the exposed central portion of the resistive strip.

Abstract: A chip thermistor includes a layered structure having a thermistor element and a substrate stacked one above the other with an electrically insulating layer in between. The thermistor element has a pair of surface electrodes on surfaces of a planar thermistor body, and a pair of outer electrodes each on a corresponding one of mutually opposite end parts of this layered structure. Each of these outer electrodes is electrically connected to a corresponding one of the surface electrodes. The pair of surface electrodes is preferably each formed so as to cover a major portion of one of the main surfaces of the thermistor body and to reach the opposite main surface through one of its side surfaces, while in a mutually separated and electrically insulated relationship. The substrate may preferably be another thermistor body.

Abstract: A built-in resistor for cathode-ray tube which comprises an insulating substrate, a resistance layer formed on one main surface of the insulating substrate, a plurality of terminal electrodes mounted on the resistance layer, and a plurality of terminals connected respectively with the terminal electrodes, wherein the plurality of terminals are individually constituted by a base body made of a non-magnetic alloy, and by a surface layer which is formed on the surface of the base body and made of an oxide of the non-magnetic alloy, the plurality of terminals have a relative permeability of not more than 1.005, and the surface layer of each of the terminals is partially provided with an insulating covering layer. The nonmagnetic alloy is a Ni—Cr-based alloy, and the surface layer is formed through an oxidation treatment under a condition where the formation of NiO can be suppressed.

Abstract: A resistor chip has a pair of mutually separated upper-surface electrodes on the upper surface of an electrically insulating substrate in a form of a chip, an resistor film having end portions which are each over a corresponding one of these upper-surface electrodes, a cover coating made of a glass material which is over a portion of this resistor film, and a pair of plated metallic layers each over a corresponding one of end surfaces of the substrate. Edge sections of the insulator film over the upper-surface electrodes are not covered by the cover coating and are each directly covered by one of these plated metallic layers.

Abstract: A laminate type varistor has at least one pair of first and second inner electrodes and a varistor layer. The at least one pair of first and second electrodes and the varistor layer are laminated. A first outer electrode and a second outer electrode electrically are connected to the first inner electrode and the second inner electrode, respectively. In the laminate type varistor, the first inner electrode and the first inner electrode are separated by a predetermined distance from the outer electrode so that the first inner electrode has no electrode surface facing to an electrode surface of the second inner electrode.

Abstract: A thin-film resistor that enables a pattern to be simply formed by means of wet etching, that has an excellent resistance temperature characteristic, and that can be easily manufactured, and a method for manufacturing this thin-film resistor, as well as a wiring substrate with this thin-film resistor formed therein. A thin resistor film according to this invention has a structure in which crystal grains deposit in the matrix of amorphous titanium nitride. The thin resistor film is formed on a substrate. The crystal grains includes at least one of crystal titanium nitride and crystal titanium. The thin resistor film can be manufactured using a simple process and can provide a wide range of resistance values with a small tolerance and a temperature coefficient of resistance close to zero.

Abstract: A wiring board having an insulating substrate of aluminum oxide ceramics and a surface wiring layer formed on the surface of said insulating substrate, wherein the aluminum oxide ceramics constituting said insulating substrate contains a manganese compound in an amount of from 2.0 to 10.0% by weight in terms of MnO2, and has a relative density of not smaller than 95%, and said surface wiring layer contains copper in an amount of from 10 to 70% by volume and at least one high-melting metal selected from the group consisting of tungsten and molybdenum in an amount of from 30 to 90% by volume, and further contains copper as a matrix, said copper matrix having a diffusion structure in which are diffused the particles of said high-melting metal having an average particle diameter of from 1 to 10 &mgr;m.

Abstract: Thermistor chips are produced by first obtaining elongated strips made of a sintered ceramic plate having a specified resistance-temperature characteristic and having thereon a plurality of mutually parallel grooves extending perpendicularly to its direction of elongation. On each of these strips, ohmic electrodes are formed, one extending continuously from one of its main surfaces to one of its side surfaces and another extending continuously from the other oppositely facing main surface to the opposite side surface. This may done by covering the strip completely with an electrically conductive film and separating it into two areal parts by forming a longitudinally extending slit on each of the main surfaces. These strips are then stacked one on top of another by aligning the grooves on each of these strips and adhesively attached together with a glass paste in between.

Abstract: A surface mountable electrical devices includes a PTC resistive element having opposite first and second surfaces and lateral faces interconnecting the first and second surfaces, spaced apart first and third electrode layers formed on the first surface, a second electrode layer formed on the second surface, and a conductive layer. Each two adjacent lateral faces defines a corner that has a terraced face. The conductive layer has a first lateral segment formed on the third electrode layer, a second lateral segment formed on the second electrode layer, and a transverse segment formed on the terraced face of one of the corners and having a terraced cross-section.

Abstract: A heating device for heating a windshield of a vehicle includes a first layer adapted to be mounted to a fourth surface of a windshield. The heating device also includes at least one resistance element embedded in the first layer for connection to a source of power to heat a predetermined area of the windshield.

Abstract: A laminated-type varistor includes a laminated structure and a pair of external electrodes disposed on a surface of the laminated structure. The laminated structure includes effective sintered body layers and internal electrodes. The internal electrodes are connected to the external electrodes and are disposed apart from each other in the direction perpendicular to lamination surfaces. Each of the internal electrodes has a multilayer electrode structure in which a plurality of electrode layers are arranged in layers while an ineffective sintered body layer is disposed therebetween. The laminated-type varistor has increased maximum peak current and maximum energy and reduction in clamping voltage.

Abstract: A resistive temperature sensor is constituted by an insulating body mainly composed of alumina; and a temperature sensing resistor mainly composed of a conductive material containing a metal silicide. The insulating body and the temperature sensing resistor are laminated and sintered to form a lamination sintered body in which a resistance circuit is formed.

Abstract: A multilayer circuit board and an associated heating apparatus is provided for heating electrical components. The multilayer circuit board includes a trace layer having at least one electrical trace terminating with a contact pad that is positioned to electrically contact a respective lead of an electrical component mounted upon the multilayer circuit board. The multilayer circuit board also includes a heating layer disposed in thermal contact with the electrical component mounted upon the multilayer circuit board. The heating layer includes a first electrically resistive heating element disposed upon an insulating substrate in general alignment with the electrical component mounted upon the multilayer circuit board. The electrically resistive heating element provides heat to maintain the operating temperature of the electrical component within a desired range.

Abstract: A chip thermistor is produced by providing a planar rectangular thermistor block with a pair of electrodes formed on its surfaces, each of the electrode being formed so as to be in part on a different one of the main surfaces and extending continuously at least onto one of the side surfaces. The thermistor block thus prepared is cut transversely to obtain a plurality of thermistor elements. A specified number of these thermistor elements are then aligned and stacked one on top of another with their main surfaces facing each other. A layer of an insulating material such as glass with thickness greater than 10 .mu.m is inserted between each mutually adjacently stacked pair of these thermistor elements. Outer electrodes are formed on the outer surfaces of the stacked structure so as to electrically connect to the electrodes on the stacked thermistor elements on their aligned end surfaces.

Abstract: An integrated circuit inverted thin film resistor structure and method of manufacture having interconnect defining resistor contacts and leads resident within and coplanar with a supporting layer, resistive material uniformly overlaying the supporting layer and contacts, the resistive material diffused into the resistor/interconnect contact region.

Abstract: An insert is provided to be attached to a shield on a surgical trocar obturator handle. The insert is actuated by the surgical trocar cannula handle so that it causes the shield to expose the sharpened obturator tip after insertion of the obturator and shield within the cannula. After usage, the insert is deactivated so that the shield again covers the obturator. The obturator can then be removed from the cannula handle and obturator shield, and the obturator handle can be discarded safely.