Abstract: A shunt resistor 10, 110 includes a flat resistive element 11; a first electrode block 12 that is made of a conductive metal material and is laminated on a lower surface 11a of the resistive element 11; and a second electrode block 13, 113 that is made of a conductive metal material and is laminated on an upper surface 11b of the resistive element 11, in which the second electrode block 13, 113 is a block body including an electrode portion 14 connected to the resistive element 11 and an extension portion 15, 115 extending downward from a side surface of the electrode portion 14.

Abstract: A sensor arrangement including at least two displaced first sensors arranged in parallel in a first plane and adapted to measure a quantity of a fluid flow and a control unit adapted to determine, from the measured quantity of the fluid flow, information indicating at least a range of directions of the fluid flow in two dimensions.

Abstract: A chip resistor includes: a board having a device formation surface, a back surface opposite from the device formation surface and side surfaces connecting the device formation surface to the back surface, a resistor portion provided on the device formation surface, a first connection electrode and a second connection electrode provided on the device formation surface and electrically connected to the resistor portion, and a resin film covering the device formation surface with the first connection electrode and the second connection electrode being exposed therefrom. Intersection portions of the board along which the back surface intersects the side surfaces each have a rounded shape.

Abstract: A chip resistor including, a substrate having a main surface, a first resistance circuit formed at the main surface of the substrate, a second resistance circuit formed at the main surface of the substrate apart from the first resistance circuit, a common internal electrode formed at the main surface of the substrate and electrically connected to the first resistance circuit and the second resistance circuit, a first internal electrode formed at the main surface of the substrate and electrically connected to the first resistance circuit, a second internal electrode formed at the main surface of the substrate and electrically connected to the second resistance circuit, and a dummy resistance circuit formed in a region between the first resistance circuit and the second resistance circuit at the main surface of the substrate so as to be in an electrically floating state.

Abstract: Provided is a voltage divider circuit having a small area and good accuracy of a division ratio. Among a plurality of resistors of the voltage divider circuit, each of resistors having a large resistance value, that is, resistors (1/4R, 1/2R, 1R, 9R, 10R) having high required accuracy of ratio includes first unit resistors (5A) that have a first resistance value and are connected in series or connected in parallel to each other, and each of resistors having a small resistance value, that is, resistors (1/16R, 1/8R) having low required accuracy of ratio includes second unit resistors (5B) that have a second resistance value smaller than the first resistance value and are connected in parallel to each other.

Abstract: An apparatus for easing installation of electronic devices. A plurality of resistors and wires in various configurations and values join to form a unitary circuit. The unitary circuit includes a predetermined Ohm value, or other electrical value. The unitary circuit allows for facilitated installation onto additional circuits, such as security system. A first resistor and a second resistor join in series-parallel or parallel-series to each other. The first resistor joins to a first black wire and a first gray wire. The second resistor joins to a first black wire, a second black wire, and a second gray wire. The components are twist tied together and joined with shrink tube, hard tube, and finally labeled shrink tube. This forms a prepackaged bundle of electrical components with labeled resistor values. The first resistor and second resistor each have a value of 1 kilohm or 2 kiliohms.

Abstract: A display device having a data voltage generation circuit and a common voltage generation circuit that are both coupled to a common reference voltage is provided. By utilizing a common ground, variations between the data signals relative to the common voltage may be reduced, thereby improving voltage precision and color accuracy. In one embodiment, the data voltage generation circuit may be a gamma adjustment circuit that utilizes a resistor string having a center grounding point. The common voltage generation circuit may share the resistor string and the grounding point with the gamma adjustment circuit. Thus, data voltage signals and common voltage signals may be derived based on the same voltage reference point. Further, by sharing the resistor string, the total number of circuit components in the display device may be reduced, thereby reducing overall chip area and/or manufacturing costs.

Abstract: A resistor device includes a resistor plate and an electrode structure. The electrode structure includes an electrode layer and an auxiliary layer. The electrode layer is disposed at a first face of the resistor plate and includes a first portion and a second portion overlying a first side and a second side of the resistor plate, respectively, and a current path is conducted between the first portion and the second portion through the resistor plate. The auxiliary layer is disposed at a second face of the resistor plate and includes at least a first block and a second block overlying the first side of the resistor plate, and at least a third block overlying the second side of the resistor plate, wherein the first, second and third blocks of the auxiliary layer are separated from one another so that any current flow among the blocks is blocked.

Abstract: Provided is a barium titanate-based semiconductor ceramic composition which contains no Pb, which can have an increased Curie temperature, which exhibits slight deterioration with time, and which has high reliability, containing a barium titanate-based semiconductor ceramic represented by the composition formula (Ba1-x-y-zSry(A1Bi)xA2z)TiO3, where A1 is an alkali metal element, A2 is a rare-earth element, 0.03?x?0.20, 0.02?y?0.20, and 0.0005?z?0.015, and x?0.10?y?(5/4)·x. In addition, 0.01 to 0.20 molar parts of Mn per 100 molar parts of Ti is preferably added thereto.

Abstract: A metal strip resistor is provided. The metal strip resistor includes a metal strip forming a resistive element and providing support for the metal strip resistor without use of a separate substrate. There are first and second opposite terminations overlaying the metal strip. There is plating on each of the first and second opposite terminations. There is also an insulating material overlaying the metal strip between the first and second opposite terminations. A method for forming a metal strip resistor wherein a metal strip provides support for the metal strip resistor without use of a separate substrate is provided. The method includes coating an insulative material to the metal strip, applying a lithographic process to form a conductive pattern overlaying the resistive material wherein the conductive pattern includes first and second opposite terminations, electroplating the conductive pattern, and adjusting resistance of the metal strip.

Abstract: A manufacturing technique for constructing passive electronic components in vertical configurations is disclosed. Electrically passive components are constructed in a structure that is substantially perpendicular to target platform including a first plane to provide a larger electrode contact area and a smaller physical dimension. Passive components structured to be substantially perpendicular to a plane associated with a target platform can be directly connected to pad contacts of an integrated circuit or substrate or can be embedded in a package to reduce the area overhead of a passive component while improving the effectiveness of the passive components in their applications.

Abstract: A printed wiring board is formed by adhering a coverlay film having a resistance layer formed on a surface of the coverlay film body to a printed wiring board body having a conductive layer formed on a surface of a substrate through an adhesive layer. The resistance layer is separated from and opposed to the conductive layer through the adhesive layer.

Abstract: A semiconductor ceramic and a positive-coefficient characteristic thermistor are provided which have a stable PTC characteristic, a high double point, and a wide operating temperature range. The semiconductor ceramic contains, as a main component, a barium titanate-based composition having a perovskite structure expressed by a general formula AmBO3. Out of 100 mol % of the Ti, an amount in a range of 0.05 mol % or more to 0.3 mol % or less of Ti is replaced with W as a semiconductor forming agent, the ratio m of A sites mainly to B sites is 0.99?m?1.002, and an actually-measured sintered density is 70% or more and 90% or less of the theoretical sintered density. In the positive-coefficient characteristic thermistor, a component body is formed of the semiconductor ceramic.

Abstract: A chip resistor having first and second opposite ends includes a rigid insulated substrate having a top surface and an opposite bottom surface, a first electrically conductive termination pad and a second electrically conductive termination pad, both termination pads on the top surface of the rigid insulated substrate, a layer of resistive material between the first and second electrically conductive termination pads, and a first and a second flexible lead, each made of an electrically conductive metal with a solder enhancing coating. The first flexible lead attached and electrically connected to the first electrically conductive termination pad and the second flexible lead attached and electrically connected to the second electrically conductive termination pad. Each of the flexible leads has a plurality of lead sections facilitating bending around the end of the chip resistor.

Abstract: A semiconductor ceramic includes a BamTiO3-based composition, as a main component, having a perovskite structure represented by general formula AmBO3. The molar ratio m between the A site and the B site satisfies 1.001?m?1.01. Part of Ba constituting the A site is replaced with Bi, Ca, a rare-earth element, and Na. The molar content of the Ca when the total number of moles of the elements constituting the A site is 1 mole is 0.05 to 0.20 (preferably 0.125 to 0.175). A PTC thermistor includes a component body formed of the semiconductor ceramic. Accordingly, there is provided a lead-free semiconductor ceramic that substantially does not contain lead and that has desired PTC characteristics and high reliability.

Abstract: A semiconductor ceramic includes a BamTiO3-based composition, as a main component, having a perovskite structure represented by general formula AmBO3. Part of Ba constituting an A site is replaced with at least an alkali metal element, Bi, and a rare-earth element, and the molar ratio m between the A site and a B site is 0.990?m?0.999 (preferably 0.990?m?0.995). Preferably, part of the Ba is replaced with Ca, and the content of the Ca when the total number of moles of the elements constituting the A site is 1 mole is 0.042 to 0.20 (preferably 0.125 to 0.175) on a molar basis. A PTC thermistor includes a component body formed of the semiconductor ceramic. Accordingly, there are provided satisfactory rise characteristics even if an alkali metal element is present.

Abstract: A multiple stage open coil electrical resistance heater uses a unique coil configuration on either side of a dividing support plate so that the air passing through the heater is heated uniformly when one or more stages of the heater are energized. The coil configuration also creates a termination zone on one side of the heater so that the terminations of the coils can be situated on the cool side of the heater. The heater coils also includes specially configured terminals to facilitate connection to power using an elongated member such as a stud or bolt.

Abstract: An insulation board for a resistor grid and methods for manufacturing the same are disclosed. The insulation board consists of a plurality of longitudinal voids. One or more longitudinal structural members are disposed in the longitudinal voids. The longitudinal structural members may be shaped to conform to the shape of the longitudinal voids. The method of constructing the insulation board includes providing a profiled block and inserting one or more longitudinal structural members in the longitudinal voids. Alternatively, the insulation board may be constructed by providing one or more longitudinal structural members and molding a profiled block over the longitudinal structural members. One or more rows of transverse pin holes may be provided along the length of the insulation board for engaging pins of resistive elements of the resistor grid.

Abstract: A metal strip resistor is provided. The metal strip resistor includes a metal strip forming a resistive element and providing support for the metal strip resistor without use of a separate substrate. There are first and second opposite terminations overlaying the metal strip. There is plating on each of the first and second opposite terminations. There is also an insulating material overlaying the metal strip between the first and second opposite terminations. A method for forming a metal strip resistor wherein a metal strip provides support for the metal strip resistor without use of a separate substrate is provided. The method includes coating an insulative material to the metal strip, applying a lithographic process to form a conductive pattern overlaying the resistive material wherein the conductive pattern includes first and second opposite terminations, electroplating the conductive pattern, and adjusting resistance of the metal strip.

Abstract: A semiconductor ceramic includes a BaTiO3-based composition, as a main component, having a perovskite structure represented by general formula AmBO3. Part of the A site Ba is replaced with an alkali metal element, Bi, Ca, Sr, and a rare-earth element. When the molar amounts of Ca and Sr are x and y, respectively, and the total number of moles of the elements constituting the A site is 1 mole, 0.05?x?0.20, 0.02?y?0.12, and 2x+5y?0.7. A PTC thermistor includes a component body formed of the semiconductor ceramic. Even when an alkali metal element and Bi are present, there is provided a lead-free semiconductor ceramic with high reliability in which the surface discoloration is not caused and the degradation of resistance over time can be suppressed even after the application of an electric current for a long time.

Abstract: A current sense resistor and a method of manufacturing a current sensing resistor with temperature coefficient of resistance (TCR) compensation is disclosed. The resistor has a resistive strip disposed between two conductive strips. A pair of main terminals and a pair of voltage sense terminals are formed in the conductive strips. A pair of rough TCR calibration slots are located between the main terminals and the voltage sense terminals, each of the rough TCR calibration slots have a depth selected to obtain a negative starting TCR value observed at the voltage sense terminals. A fine TCR calibration slot is formed between the pair of voltage sense terminals. The fine TCR calibration slot has a depth selected to obtain a TCR value observed at the voltage sense terminals that approaches zero. The resistor can also have a resistance calibration slot located between the pair of main terminals. The resistance calibration slot has a depth selected to calibrate a resistance value of the resistor.

Abstract: A resistor device includes a resistor plate having a first aperture, a second aperture, a third aperture and a fourth aperture respectively arranged on a first side, a second side, a third side and a fourth side thereof. A first electrode plate is coupled to the first side of the resistor plate and includes a first measurement zone and a second measurement zone disposed at opposite sides of the first aperture; and a second electrode plate is coupled to the third side of the resistor plate and including a third measurement zone and a fourth measurement zone disposed at opposite sides of the third aperture, wherein the first measurement zone and the third measurement zone are disposed at opposite sides of the second aperture, and the second measurement zone and the fourth measurement zone are disposed at opposite sides of the fourth aperture.

Abstract: A non-film based, thermally conditionable light transmitting article is provided. The article includes an adhesively coated resistive wire and a substrate suitably selected for light transmittance. The adhesively coated resistive wire is solely and directly adhesively affixed to the substrate so as to be thereby supported upon and by the substrate. A layer of adhesive, in the form of an adhesive linkage originating from the adhesive of the adhesively coated resistive wire, is present between the resistive wire and the substrate.

Abstract: A method for post-thermal-trimming annealing a thermally-trimmable resistor thermally-isolated on a substrate, the method comprising: trimming said thermally-trimmable resistor by applying a first power-measured signal to a heating resistor; and applying a second power-measured signal corresponding to a desired average annealing temperature to said heating resistor, wherein said second power-measured signal has a lower power level than said first power-measured signal.

Abstract: A resistor assembly for use at microwave frequencies, has a substrate with first and second contacts or metalizations at either end of the substrate. A third contact or metallization is provided on one side of the substrate generally in the middle thereof. First and second resistors, as thin film resistors, are provided on the substrate extending between the first and second contacts and the third, central contact. A third resistor is provided on the other side of the substrate, connecting the first and second contacts, so as to form a delta configuration of three resistors. This then provides a resistor configuration that can be used to implement a three port Wilkinson splitter or combiner.

Abstract: A heating system in the form of a multi-layer, yet relatively thin and flexible panel. The panel contains a number of layers including first, second and third electrically insulating layers. A first electrically conductive resistive layer (heater layer) is sandwiched between the first and second insulating layers. A second electrically conductive resistive layer (resistive neutral plane layer) is sandwiched between the second and third insulating layers. The heater layer has a neutral electrical connection and a live electrical connection. The neutral and live electrical connections are electrically connected to each other at the panel only by electrically resistive material of the heater layer extending between the neutral and live electrical connections. The resistive neutral plane layer has a neutral electrical connection electrically connected with the neutral connection of the heater layer.

Abstract: A chip resistor having first and second opposite ends includes a rigid insulated substrate having a top surface and an opposite bottom surface, a first electrically conductive termination pad and a second electrically conductive termination pad, both termination pads on the top surface of the rigid insulated substrate, a layer of resistive material between the first and second electrically conductive termination pads, and a first and a second flexible lead, each made of an electrically conductive metal with a solder enhancing coating. The first flexible lead attached and electrically connected to the first electrically conductive termination pad and the second flexible lead attached and electrically connected to the second electrically conductive termination pad. Each of the flexible leads has a plurality of lead sections facilitating bending around the end of the chip resistor.

Abstract: A circuit for trimming a thermally-trimmable resistor, measuring a temperature coefficient of resistance of the thermally-trimmable resistor, and annealing a thermally-trimmable resistor post-trimming, the circuit comprising: a thermally-isolated area on a substrate housing the thermally-trimmable resistor; heating circuitry for applying a signal to a heating resistor; and a constant-power module adapted to maintain power dissipated in the heating resistor substantially constant over a duration of the signal by varying at least one parameter of the signal as a result of a change in resistance of the heating resistor during the signal.

Abstract: An open coil electrical resistance heater uses a number of offset insulators to support the coil of the heater. The offset insulators configure the run of coil in a sinusoidal shape to hold the insulators in a more secure manner and reduce vibration and noise generation during heat operation. The sinusoidal configuration of the coil also reduces the problem of shadowing of portions of the resistance wire coil.

Abstract: A first terminal electrode is provided directly on one longitudinal end surface of a chip thermistor element, a third terminal electrode is provided directly on the other end surface, a second terminal electrode is provided on a top surface via an insulating layer, a resistor layer is provided adjacent to the second terminal electrode, the second terminal electrode is electrically connected to the resistor layer, and the resistor is electrically connected to the first terminal electrode. Voltage is applied between the input terminal electrode and the ground terminal electrode, the voltage between the output terminal electrode and the ground terminal electrode is measured, and the output voltage is converted to a temperature to detect a change in the temperature.

Abstract: A semiconductor device may include a resistance pattern including a resistance material on a substrate. The resistance pattern may include first and second spaced apart base elements, a bridge element, and first, second, third, and fourth extension elements. The first and second base elements may be substantially parallel, and the bridge element may be connected between respective center portions of the first and second spaced apart base elements. The first and second extension elements may be connected to opposite ends of the first base element and may extend toward the second base element, and the third and fourth extension elements may be connected to opposite ends of the second base element and may extend toward the first base element. Related methods are also discussed.

Abstract: A resistor circuit includes first to Mth resistor circuit units. A (2j?1)th resistor circuit unit includes a (2j?1)th first fuse element and a (2j?1)th resistor provided in series between a (2j?1)th node and a 2jth node, and a (2j?1)th second fuse element provided in parallel with the (2j?1)th first fuse element and the (2j?1)th resistor between the (2j?1)th node and the 2jth node. A 2jth resistor circuit unit includes a 2jth first fuse element and a 2jth resistor provided in series between the 2jth node and a (2j+1)th node, and a 2jth second fuse element that is provided in parallel with the 2jth first fuse element and the 2jth resistor between the 2jth node and the (2j+1)th node. The (2j?1)th first fuse element, the (2j?1)th second fuse element, the 2jth first fuse element, and the 2jth second fuse element are disposed in a fuse region. The (2j?1)th resistor is disposed in a first resistor region formed in a first direction with respect to the fuse region.

Abstract: The invention relates to a resistor network (2) such as a resistor ladder network, comprising at least a resistor body (4) which is provided with at least a column (6) of taps (8) situated between a first tap and a second tap, wherein, in use, at least two taps can be connected with respective first and second sources of reference input potentials, and wherein each tap of the at least one column of taps can be used for outputting an output potential via a contact area which is connected with the concerning tap, wherein the resistor body (4) comprises a multiple of resistor sub-bodies (5), wherein each resistor sub-body (5) is connected with a column (6) of taps (8), and wherein the only electrical connections between the resistor sub-bodies (5) are established by electrical connections via taps (8) connected with the resistor sub-bodies (5). Furthermore the invention relates to a method for manufacturing a resistor network (2) such as a resistor ladder network.

Abstract: A thin film resistor (5) of an integrated circuit comprises an elongate resistive film (7) extending between electrical contact pads (10,11). A low impedance element (20) overlays and is electrically coupled to a portion of the resistive film (7) in an intermediate portion (22) thereof adjacent a second side edge (17) of the resistive film (7) for conducting current in parallel with the intermediate portion (22), and for reducing current density in the intermediate portion (22). First and second transverse edges (28,29) formed by spaced apart first and second slots (26,27) which extend from a first side edge (16) into the resistive film (7) define with a first side edge (16) of the resistive film (7) and the low impedance element (20) first and second trimmable areas (30,31) in the intermediate portion (22).

Abstract: An electro-optical device includes: a substrate; a plurality of wiring lines which is formed on the substrate; and an IC which is mounted on the substrate so as to be electrically connected to the plurality of wiring lines. At least a pair of wiring lines among the plurality of wiring lines include a first conductive layer formed on the substrate and a second conductive layer formed on at least the first conductive layer. The first conductive layer and the second conductive layer have different resistance values. The first conductive layer of one of the pair of wiring lines has a plurality of first resistors each extending toward the other wiring line, and the second conductive layer of the other wiring line has a second resistor extending toward the one wiring line. The plurality of first resistors is connected to the second resistor.

Abstract: A method for fabricating the embedded thin film resistors of a printed circuit board is provided. The embedded thin film resistors are formed using a resistor layer built in the printed circuit board. Compared with conventional discrete resistors, embedded thin film resistors contribute to a smaller printed circuit board as the space for installing conventional resistors is saved, and better signal transmission speed and quality as the capacitive reactance effect caused by two connectors of the conventional resistors is avoided. The method for fabricating the embedded thin film resistors provided by the invention can be conducted using the process and equipment for conventional printed circuit boards and thereby saving the investment on new types of equipment. The method can be applied in the mass production of printed circuit boards and thereby reduce the manufacturing cost significantly.

Abstract: In a method for sorting PTC elements having different resistance-temperature characteristics, a predetermined voltage that allows a current to sufficiently decay is applied to each of PTC elements A and B, and the PTC elements are sorted on the basis of the difference between the times required for the currents passing through the PTC elements B to reach a predetermined value (e.g., 52 mA).

Abstract: A thin film resistor (5) of an integrated circuit comprises an elongate resistive film (7) extending between electrical contact pads (10,11). A low impedance element (20) overlays and is electrically coupled to a portion of the resistive film (7) in an intermediate portion (22) thereof adjacent a second side edge (17) of the resistive film (7) for conducting current in parallel with the intermediate portion (22), and for reducing current density in the intermediate portion (22). First and second transverse edges (28,29) formed by spaced apart first and second slots (26,27) which extend from a first side edge (16) into the resistive film (7) define with a first side edge (16) of the resistive film (7) and the low impedance element (20) first and second trimmable areas (30,31) in the intermediate portion (22).

Abstract: An electrical assembly includes at least two PTC-resistor elements, each of which has a base body having a flat shape. Each base body has main surfaces that contain electrodes. A carrier plate has spacers for positioning base bodies of the at least two PTC resistor elements. A width each spacer is about equal, in at least one area, to a distance between facing electrodes of adjacent PTC-resistor elements.

Abstract: A chip resistor having first and second opposite ends includes a rigid insulated substrate having a top surface and an opposite bottom surface, a first electrically conductive termination pad and a second electrically conductive termination pad, both termination pads on the top surface of the rigid insulated substrate, a layer of resistive material between the first and second electrically conductive termination pads, and a first and a second flexible lead, each made of an electrically conductive metal with a solder enhancing coating. The first flexible lead attached and electrically connected to the first electrically conductive termination pad and the second flexible lead attached and electrically connected to the second electrically conductive termination pad. Each of the flexible leads has a plurality of lead sections facilitating bending around the end of the chip resistor.

Abstract: Electro-thermal trimming of thermally-trimmable resistors is used to trim one or more of the plurality of resistors in or associated with an analog electric circuit. The TCR of each of a subset of a plurality of electro-thermally-trimmable resistors can be trimmed independently from the resistance in order to adjust the output parameter of an analog electric circuit without changing other parameters that would be affected by a change in resistance.

Abstract: A resistor assembly for use at microwave frequencies, has a substrate with first and second contacts or metalizations at either end of the substrate. A third contact or metallization is provided on one side of the substrate generally in the middle thereof. First and second resistors, as thin film resistors, are provided on the substrate extending between the first and second contacts and the third, central contact. A third resistor is provided on the other side of the substrate, connecting the first and second contacts, so as to form a delta configuration of three resistors. This then provides a resistor configuration that can be used to implement a three port Wilkinson splitter or combiner.

Abstract: Provided are a chip network resistor contacting a printed circuit board (PCB) through solder balls and a semiconductor module having the chip network resistor. The chip network resistor includes: a body formed of an insulating material; a resistor formed on the body; external electrodes connected to the resistor and disposed on a lower surface of the body so as to have solder ball pad shapes; and conductive balls adhered on the external electrodes.

Abstract: A process for manufacturing a composite polymeric circuit protection device in which a polymeric assembly is provided and is then subdivided into individual devices. The assembly is made by providing first and second laminates, each of which includes a laminar polymer element having at least one conductive surface, providing a pattern on at least one of the conductive surfaces on one laminate, securing the laminates in a stack in a desired configuration, at least one conductive surface of at least one of the laminates forming an external conductive surface of the stack, and making a plurality of electrical connections between a conductive surface of the first laminate and a conductive surface of the second laminate. The laminar polymer elements may be PTC conductive polymer compositions, so that the individual devices made by the process exhibit PTC behavior.

Abstract: A resistance circuit included in a semiconductor apparatus, which is formed of a plurality of thin film metal resistors connected in series, capable of achieving a precise resistance adjustment over a wide range by disconnecting or changing the resistors by laser beam irradiation. With three thin film metal resistors R1, R2, and R3 connected in series, for example, each having resistance adjustable ranges ?R1, ?R2, and ?R3, resistance adjustment accuracies R1_step, R2_step, and R3_step, and the total resistance adjustable range ?R0 specified by the relation ?R0=?R1+?R2+?R3, the resistance circuit is formed to satisfy relational expressions, R1_step??R2, R2_step??R3, and R3_step?0.001×?R0<R2_step?0.01×?R0<R1_step?0.1×?R0. This resistance circuit is suitably incorporated into high precision constant voltage generating, and voltage detecting circuits.

Abstract: An axial leaded over-current protection device comprised of a plurality of PTC devices, a first terminal metal strip, and a second terminal metal strip. One end of the first terminal metal strip diverges into a plurality of electrode strips, and the plurality electrode strips are connected to an electrode layer of each PTC device. The second terminal metal strip is connected to the other electrode layer of each PTC device, i.e., the one not being connected to the first terminal metal strip. Accordingly, the first terminal metal strip and second terminal metal strip are respectively connected to the two electrode layers of each PTC device and become in parallel thereby, so that the resistance of the over-current protection device can be decreased.

Abstract: There is provided a method and circuit for trimming a functional resistor on a thermally isolated micro-platform such that a second functional resistor on the same micro-platform remains substantially untrimmed; a method and circuit for providing and trimming a circuit such that at least two circuit elements of the circuit are subjected to a same operating environment and the operating environment is compensated for by distributing heat generated during operation of the circuit among the two circuit elements; a method and circuit for trimming a functional resistor on a thermally-isolated micro-platform such that a constant temperature distribution is obtained across the functional resistor; and a method and circuit for calculating a temperature coefficient of resistance of a functional resistor.

Abstract: A fixed resistor network has an insulating substrate, a plurality of film resistors arranged on a top surface of the insulating substrate, terminal electrodes formed for the film resistors on each lengthwise sidewall of the insulating substrate at a given pitch along the sidewall, and recesses provided between the terminal electrodes. The occurrence of solder bridges between the terminal electrodes during solder mounting and the occurrence of chipping in the terminal-electrode-forming areas between the recesses on the lengthwise sidewall are both reduced by making the width of the recesses along the lengthwise sidewall either 0.44 to 0.48 times or 0.525 to 0.625 times the pitch.

Abstract: A surface mounting chip network component in which a network having three or more odd number of terminals are formed on the surface of an insulating substrate and Tomb Stone Phenomenon is suppressed. Even number of network circuits are formed on the surface of the insulating substrate (2) and the same number of terminals (1) are arranged, respectively, on the opposite sides of the insulating substrate (2). Alternatively, even number of network circuits are formed on the surface of the insulating substrate (2) and the terminals (1) are arranged on the side edges of the insulating substrate (2) point-symmetrically with respect to the center of the surface of the insulating substrate (2).

Abstract: An electrical resistor has a surface mounted four terminal current sensor of a very low resistance value and capable of handling short pulses of high power. It comprises a flat metal late, 1 to 50 mils thick, of an alloy of high electrical resistivity, to which are welded, on two opposite sides, two flat metal plates of very high electrical conductivity which serve as terminations for electrical interconnection. A slot is cut, from the outside edge toward the center, into each of the two termination plates which divides them into a wide pad for connection of current carrying wires and a narrow one for voltage sensing. The depth of the slots is optimized to get the best stability of resistance readings with changing ambient temperature and under influence of the self-heating effect.