Abstract: An integrated circuit (IC) with an impedance sensor fabricated on a surface of the substrate is disclosed. The impedance sensor includes a bottom conductive plate formed on the substrate. A sensing membrane is formed on the bottom conductive plate. A top conductive plate is formed on the sensing membrane, in which the top conductive plate is a fusion of conductive nanoparticles having a random three dimensional porosity that is permeable to a reagent.

Abstract: Provided is a resistor for current detection, wherein connection failure etc. due to electro-migration is prevented from being generated in state that the resistor is mounted on a mounting board. The resistor has a resistance body (11) and electrodes (12). The electrode (12) includes first electrode portion (12a) connected to the resistance body (11) and second electrode portion (12b) formed on the first electrode portion (12a). The second electrode portion (12b) consists of material having higher resistivity than the first electrode portion (12a) and solder, which is used for mounting the resistor on the mounting board.

Abstract: A resistor pack assembly includes a first mounting plate, a second mounting plate, a cylindrical suppression resistor, and a cylindrical cover. The first mounting plate has a circular face, a first connection terminal, and a second connection terminal. The second mounting plate has a circular face, a third connection terminal and a fourth connection terminal. The cylindrical suppression resistor has a first flat surface and a second flat surface opposite the first flat surface, and is located between the first mounting plate and the second mounting plate, wherein the first flat surface contacts the circular face of the first mounting plate and the second flat surface contacts the circular face of the second mounting plate. The cylindrical cover has an inner diameter aperture, wherein the first mounting plate, the second mounting plate, and the cylindrical suppression resistor are located within the inner diameter aperture of the cylindrical cover.

Abstract: Thermally stable four-terminal resistor (current sensor) is characterized by having the capacity to adjust both resistance and temperature coefficient of resistance (TCR), during manufacturing process. The four-terminal resistor includes 3 or 4 elementary resistors R1-R3 forming a closed loop. Resistor R1 is the principal low-ohmic value resistor. The terminals of resistor R1 serve as “Force” terminals of the four-terminal resistor. Resistors R2, R3 form a voltage divider intended to minimize the TCR of the four-terminal resistor and connected in parallel to resistor R1. The terminals of resistor R3 serve as “Sense” terminals of the four-terminal resistor. Resistor R2 may be split into two resistors: R2a, R2b to simplify the implementation of four-terminal resistor. Elementary resistors R1, R2 must have the same sign of TCR. Target resistance and TCR minimization in four-terminal resistor are reached by adjustment of resistance of the elementary resistors.

Abstract: An over-current protection device comprises a resistance material with positive or negative temperature coefficient and an upper surface and a lower surface; a first electrode layer having a first groove, disposed on the upper surface; a first surface mount pad disposed on the upper surface; a second electrode layer disposed on the lower surface, electrically connecting to the first surface mount pad; a second surface mount pad disposed on the lower surface, electrically connecting to the first electrode layer; a second groove electrically separating the first surface mount pad from the first electrode layer; and a third groove electrically separating the second electrode layer from the second surface mount pad. The first groove divides the first electrode layer into two connected regions. The first and second surface mount pads are separated from each other and one end of the first groove connects to the second groove.

Abstract: A micro heater includes a first electrode, a second electrode, a first carbon nanotube, and a second carbon nanotube. The first carbon nanotube extends from the first electrode. The second carbon nanotube branches from the second electrode. The first carbon nanotube and the second carbon nanotube intersect with each other to define a node therebetween.

Abstract: A power resistor includes first and second opposite terminations, a resistive element formed from a plurality of resistive element segments between the first and second opposite terminations, at least one segmenting conductive strip separating two of the resistive element segments, and at least one open area between the first and second opposite terminations and separating at least two resistive element segments. Separation of the plurality of resistive element segments assists in spreading heat throughout the power resistor. The power resistor or other electronic component may be packaged by bonding to a heat sink tab with a thermally conductive and electrically insulative material.

Abstract: Thermally stable four-terminal resistor (current sensor) is characterized by having the capacity to adjust both resistance and temperature coefficient of resistance (TCR), during manufacturing process. The four-terminal resistor includes 3 or 4 elementary resistors R1-R3 forming a closed loop. Resistor R1 is the principal low-ohmic value resistor. The terminals of resistor R1 serve as “Force” terminals of the four-terminal resistor. Resistors R2, R3 form a voltage divider intended to minimize the TCR of the four-terminal resistor and connected in parallel to resistor R1. The terminals of resistor R3 serve as “Sense” terminals of the four-terminal resistor. Resistor R2 may be split into two resistors: R2a, R2b to simplify the implementation of four-terminal resistor. Elementary resistors R1, R2 must have the same sign of TCR. Target resistance and TCR minimization in four-terminal resistor are reached by adjustment of resistance of the elementary resistors.

Abstract: Disclosed herein are a disc varistor having a capability to absorb a double amount of surge and a method of manufacturing the varistor. The varistor includes a disc-shaped first ceramic body having first and second electrodes on opposite surfaces thereof, and a disc-shaped second ceramic body having third and fourth electrodes on opposite surfaces thereof. A first lead wire is in interposed between the second and third electrodes and electrically connected to the second and third electrodes. The varistor also includes a second lead wire. The second lead wire has a body portion electrically connected to the first electrode of the first ceramic body, a first extension extending from the body portion to the second ceramic body, and a second extension extending from the first extension to the fourth electrode.

Abstract: A semiconductor device and a method for manufacturing the same that includes terminal patterns and resistor patterns disposed between and electrically connected to the terminal patterns.

Abstract: A signal switching device is disclosed that is capable of transmitting signals with less signal loss while securing a good isolation characteristic. The signal switching device includes a first section formed from a superconducting material connected to a first transmission path. The first section has a smaller cross section at the input end than at the output end or, the signal switching device may include a first section formed from a superconducting material connected to a first transmission path in series, and a second section formed from a superconducting material connected to a second transmission path in parallel. The cross section of the second section is smaller than that of the second transmission path. The length of the second transmission path is determined in such a way that an input impedance of the second transmission path is sufficiently large when the second section is in a superconducting state.

Abstract: A surface mounting chip network component in which a network having three or more odd number of terminals are formed on the surface of an insulating substrate and Tomb Stone Phenomenon is suppressed. Even number of network circuits are formed on the surface of the insulating substrate (2) and the same number of terminals (1) are arranged, respectively, on the opposite sides of the insulating substrate (2). Alternatively, even number of network circuits are formed on the surface of the insulating substrate (2) and the terminals (1) are arranged on the side edges of the insulating substrate (2) point-symmetrically with respect to the center of the surface of the insulating substrate (2).

Abstract: The present invention provides a diffusion resistor that is formed in the substrate. A diffusion region is formed within the substrate that contains a first and second contact region. These contact regions extend downward from the surface of the substrate. A third contact is located within the diffusion region between the first and second contacts. This contact also extends downward from the surface of the substrate. These contacts are connected to metal layers. The first and second contacts form the two ends of the diffusion resistor. The third contact forms a Schottky diode such that application of a voltage to this contact forms a depletion region within the diffusion region. The depletion region changes in size depending on the voltage applied to the third contact to change the resistance of the depletion resistor.

Abstract: The low resistance value resistor 11 has two electrodes 12,13 of metal strips having a high electrical conductivity. The metal strips are affixed on the resistor body by means of rolling and/or thermal diffusion bonding. A fused solder layer is formed on a surface of each electrode comprised by the metal strip. Thus, sufficient bonding strength and superior current distribution in the resistor body is obtained. Further, a portion of the resistor body is trimmed by removing a portion of the body material along a direction of current flow between the electrodes to adjust a resistance value. Thus, a precise resistor value and superior characteristics of temperature coefficient of resistance (TCR) can be obtained.

Abstract: A semiconductor resistor comprises a resistor body formed on a semiconductor substrate and first and second conductive terminals electrically connected to the resistor body at opposite ends thereof. The semiconductor resistor further includes at least first and second conductive paths between at least one of the first and second conductive terminals and the resistor body. The at least one conductive terminal is configured such that a resistance of the at least one conductive terminal between the at least first and second conductive paths is substantially matched to a resistance of the resistor body between the at least first and second conductive paths. In this manner, a current distribution between the at least first and second conductive paths is substantially matched.

Abstract: An electrical component includes a base body that contains dielectric layers. The dielectric layers are superimposed and contain ceramic. The component also includes outer contacts on an exterior of the base body, and a resistor in an interior of the base body located between two of the dielectric layers. The resistor is connected to the outer contacts, and is made from a layer that forms a path between the outer contacts. The path between the outer contacts has multiple bends.

Abstract: A power converter includes a shunt resistor constituted by a shunt resistance and a plurality of main electrodes made of a sheet-like resistive material. In the shunt resistor, plates lower in volume electric resistivity than the resistive material, higher in thermal conductivity than the resistive material and thicker in thickness than the resistive material are fixedly attached by solder, to the side surfaces of the main electrodes opposite to the side surfaces with which the main electrodes are fixedly attached to an insulating layer. At least one plate main electrode for electrically connecting with main circuit wiring is provided in each of the plates. At least one constricted portion is formed between each of the plate main electrodes and the shunt resistance. Plate detection electrodes for detecting a voltage between the opposite ends of the shunt resistance is provided on the plates near the shunt resistance portion.

Abstract: Common centroid layout for parallel resistors in an amplifier with matched AC performance. An amplifier is disclosed that is formed on a silicon substrate that includes first and second differential legs, each driving first and second resistive loads. The first resistive load comprises first and second parallel resistive loads connected on one side thereof to one end of the first differential leg and the other side of each of the first and second parallel resistive loads separately connected to a first reference voltage. The second resistive load comprises third and fourth resistive loads each connected on one side thereof to one end of the second differential leg and the other side of each of the third and fourth parallel resistive loads connected separately to the first reference voltage. Each of the first, second, third and fourth resistive loads is fabricated of a strip of resistive material disposed on the surface of the substrate and having a finite resistivity, length, width and thickness.

Abstract: A method of making resistors includes providing a sacrificial layer. Conductive material is then formed over a region of the sacrificial layer. Resistive material is then deposited over the first surface of the sacrificial layer such that the resistive material covers the sacrificial layer and the conductive material. A portion of the sacrificial layer is then removed to expose the conductive material. A method of making resistors includes the steps of providing a sacrificial layer, removing at least a portion of the sacrificial layer from regions of the sacrificial layer so as to create a plurality of cavities within the sacrificial layer, plating said cavities with a conductive material, disposing resistive material over the first surface of the sacrificial layer such that resistive material covers the sacrificial layer and said conductive material, and removing at least a portion of said sacrificial layer to expose the conductive material.

Abstract: An electrical component includes a base body that contains dielectric layers. The dielectric layers are superimposed and contain ceramic. The component also includes outer contacts on an exterior of the base body, and a resistor in an interior of the base body located between two of the dielectric layers. The resistor is connected to the outer contacts, and is made from a layer that forms a path between the outer contacts. The path between the outer contacts has multiple bends.

Abstract: A microelectronic assembly, including a microelectronic element such as a semiconductor chip and a dielectric material covering the chip and forming a body having a bottom surface. The assembly includes conductive units having portions exposed at the bottom surface, posts extending upwardly from said exposed portions and top flanges spaced above the bottom surface.

Abstract: The low resistance value resistor 11 has two electrodes 12, 13 of metal strips having a high electrical conductivity. The metal strips are affixed on the resistor body by means of rolling and/or thermal diffusion bonding. A fused solder layer is formed on a surface of each electrode comprised by the metal strip. Thus, sufficient bonding strength and superior current distribution in the resistor body is obtained. Further, a portion of the resistor body is trimmed by removing a portion of the body material along a direction of current flow between the electrodes to adjust a resistance value. Thus, a precise resistor value and superior characteristics of temperature coefficient of resistance (TCR) can be obtained.

Abstract: A resistor for driving a motor for an air conditioner blower is provided, in which internal resistance bodies are stacked over one after another between insulation plates in the resistor, to accordingly reduce the volume of the entire of the resistor is reduced, and the resistance bodies are separated into a plurality of metal thin plates not a single plate and stacked over one after another, to thereby increase a line width. Also, a temperature fuse is disposed externally. The air conditioner fan blower motor driving resistor is obtained by stacking resistance bodies made of at least two metal thin plates over one after another. The resistance bodies are formed of an independent resistance body forming a second resistance body and a third resistance body on two separate thin plates, and another independent resistance body forming a first resistance body on another thin plate.

Abstract: An electrical current sensor and utility electricity meter, the current sensor comprising a &pgr; resistor shunt configuration, wherein the resistors comprise layered conductors at substantially equal temperatures to provide a zero temperature coefficient sensor. A fiscal electricity meter is described together with a four-layered current sensor fabricated using PCB techniques.

Abstract: A superconducting conductor and its method of manufacture includes an electrical conductor having a thermal conductor attached to and along a length of superconductor member and separated from the superconductor member by an electrically-insulative material. The member may include a length of superconductor composite having superconducting material and a non-superconducting, electrically conductive matrix material. The electrical conductor is configured to control the manner in which the superconductor transitions from its superconducting state to its non-superconducting (i.e., normal) state due to, for example, a fault current condition. The electrically-insulative material has a thickness for allowing heat from the superconductor to be conveyed to the thermal conductor. The superconducting conductor may be used in conjunction with a superconducting current-limiting device.

Abstract: An array resistor network that has a high density of resistors per unit area. The array resistor network includes a ceramic substrate having a top and bottom surface. Apertures extend through the substrate between the top and bottom surfaces. Recesses are located on opposite edges of the substrate. Resistors are located on the top surface. Each resistor is located between a recess and an apertures. Inner conductors are connected to one end of the resistors. The Inner conductors are located on the top surface and extend through the aperture onto the bottom surface. Outer conductors are connected to another end of the resistors. The outer conductors are located on the top surface and extend along the recess onto the second surface.

Abstract: The superconductor structure for conducting an electric current in a predetermined direction has a metallic support and one or more conductor tracks. The conductor tracks have at least one electrically insulating interlayer deposited on the support and a high Tc superconductor layer deposited on the interlayer. Between its superconducting layer and the support, the conductor track has at least one connecting part, which extends in the current-conducting direction, for electrically connecting the superconducting layer and the support in parallel. The superconductor structure may be provided in particular for a current limiter device.

Abstract: A low profile mount for a disc varistor. A thermally sensitive switch is provided both for single and multiple electrode embodiments. The switch may be placed in a shorting circuit and include a spring biased conductor prevented from closure by a heat sensitive element which softens in responsive to excessive heat. The varistor may be fused to prevent excessive current from a short circuited but not open circuited varistor. Methods are also provided.

Abstract: A low resistance high current sense resistor is formed on a semiconductor die using conventional semiconductor processing techniques. The resistor die has one or two resistive layers which are photolithographically divided into a plurality of series and parallel resistor sections connected to first and second main terminals. First and second sense terminals are connected across one or a pattern of plural ones of the resistors to produce an output related to the current between the main terminals. Fusible links permit the trimming of the final resistance value.

Abstract: A current limiting apparatus and method for use in a power system is provided. Current flows from a power system to a first magnetic field producing contact. A Hall effect device is disposed between the first magnetic field producing contact and another magnetic field producing contact. In this manner, the Hall effect device is subjected to a magnetic field produced by the two contacts. The limited current is then provided to another portion of the power system or to another power system.

Abstract: Known Hall sensors are fastened to a printed circuit board by way of component holders in order to achieve an exact positioning and securing on a printed circuit board in relation to a magnet ring of a rotor of an adjusting motor. A component holder for a Hall sensor is partially injection molded only onto connecting prongs of the Hall sensor or is injection molded onto connecting prongs and at least partially onto a housing of the Hall sensor. The component holder for a Hall sensor according to the invention is provided for adjusting motors, such as window regulator motors of motor vehicles.

Abstract: A resistor network for terminating active electronic circuits such as stub series terminated logic and emitter coupled logic circuits. The network has a substrate with top and bottom surfaces and a common via extending through the substrate. Several resistor pairs are located on the first surface surrounding the common via. Each resistor pair has first and second vias. Resistors are connected between the first and second vias. Several solder spheres are located on the bottom surface. Each of the solder spheres are electrically connected to one of the first, second or common vias.

Abstract: A monolithic resistor is provided with a central resistive metallic foil strip positioned between and attached to a pair of wings formed from an electrically conductive metallic foil. The wings include large surface areas to dissipate heat. A plurality of terminal pins are formed in the conductive strips for connection to an integrated circuit board, as well as a current source.

Abstract: On transition from the superconducting state to the normal conducting state, current limiters having a high-temperature superconductor increase their electrical resistance and thereby limit an electric current which is flowing through them. To provide electrical stabilization, the high-temperature superconductor is combined with a silver foil having a layer thickness of <50 &mgr;m to form an extensive composite conductor with good conductivity. The ratio of the layer thickness of the high-temperature superconductor to that of the silver foil should be >10. To produce this composite conductor, the silver sheet is placed on one side on a 2 mm thick MgO powder layer and, on the other side, is covered with a 600 &mgr;m thick so-called green sheet which contains a high-temperature superconductor powder and an organic binder.

Abstract: A circuit arrangement (100) is coupled to a resistor (150) having at least two portions (110, 120). The arrangement (100) provides a substantially linear performance of the resistor (150). The arrangement (100) comprises a differential difference amplifier (160) (with input stages (170, 180) and output stage (190)) and a feedback unit (130). The input stages (170, 180) modify first (161) and second (162) measurement signals (e.g., (V.sub.B -V.sub.A) and (V.sub.A -GND), respectively) from the resistor portions (110, 120) to intermediate signals (OPH, OMH, OPL, OML). The output stage (190) differentially amplifies sums (at nodes 191, 192) of the intermediate signals and provides a control signal (CONTROL) which corresponds to a magnitude difference between the first and second measurement signals. The feedback unit (130) receives the control signal and supplies a corrective current (I) to the resistor (150) to offset non-linearity.

Abstract: A resistor network for terminating active electronic devices has low cross talk noise between the adjoining resistors and the conductors that connect the resistors to other electronic packages. A substrate has a top and a bottom surface. Resistors are located on the top surface. Conductors are also located on the top surface and are electrically connected to each end of the resistors. Vias extend through the substrate and electrically connect to the conductors. Solder spheres are positioned on the bottom surface and are electrically connected to the vias. An end of each of the resistors is electrically connected in common through a common conductor. The commoned resistors are electrically connected to a common via through the common conductor. The resistor network minimizes cross talk noise between the resistors and provides a high density interconnection.

Abstract: A heating panel has a resistive heating layer formed on a substrate. Insulating layers can be formed on the substrate. The heating layer has electrodes on opposite edges connected to different phases of a multiphase power source. Capacitive currents caused in the substrate by the different phases cancel each other. Thus, leakage current is minimized through a conductor connected between the substrate and ground. The heating panel can be adapted for two phase or three phase systems. The heating panels are particularly useful for defining a heating cavity of an oven or pots on a cook top.

Abstract: A surface mounted thin film precision voltage divider is provided by incorporating two resistors on a single base of the same size and configuration as prior art surface mounted thin film precision resistors. Because the resistors were made at the same time, using the same materials and under the same conditions, the resistors react substantially equally to changes in temperature, aging, thermal shock, short time overload, high temperature exposure, resistance to bond exposure, moisture resistance, load life and low temperature operation. The voltage divider replaces two conventional surface mounted thin film precision resistors at a fraction of the cost.

Abstract: A method of fabricating a low-inductance, in-line resistor includes the steps of: depositing a superconductive layer 12 on a base layer 14; patterning an interconnect region 16 on the superconductive layer 12; and converting the interconnect region 16 of the superconductive layer 12 to a resistor material region 18. The resistor region 18 and the superconductive layer 12 are substantially in the same plane. The method can further include the steps of depositing a conductive layer 22 on the resistor region 18 and on the photo-resist layer 20, and lifting off the photo-resist layer 20 to leave the conductive layer 22 on the resistor region 18. As such, the conductive layer 22 provides a low sheet resistivity for the resistor region 18.

Abstract: A low insertion loss, wide bandwidth, microwave switch has a superconducting transmission line that can reversibly go from a superconducting state to a normal state by the application of a DC voltage. When in the normal state, the switch is "off" and microwave signals are attenuated. To reduce the voltage necessary to cause switching, the width of the transmission line is decreased. This decrease in voltage is accomplished in a controlled manner so that there are no spurious reflections produced on the line, resulting in a wide operating bandwidth. Previous microwave switches use other means to switch between superconducting and normal and suffer from disadvantages such as relatively slow switching time, complexity or narrow bandwidths as a result.

Abstract: A chip-type composite electronic component according to the present invention comprises an insulating substrate (1), a common electrode (2) formed on the substrate (1), a plurality of individual electrodes (3a-3h) formed on the substrate (1) to be spaced from the common electrode (2), and a plurality of electronic elements (4a-4e) each interposed between each of the individual electrodes (3a-3h) and the common electrode (2). Each of the common electrode (2) and individual electrodes (3a-3h) has a plated solder layer as an outermost layer. Each of the electronic elements (4a-4e) has a direct current resistance of no less than 47K .OMEGA., and the solder layer of the common electrode (2) has a layer thickness which is no more than 2.9 times as great as that of the solder layer of the individual electrodes (3a-3h).

Abstract: In accordance with the present invention, trim pads used in trimming on-chip resistive elements are formed in the scribe channels interposed between respective dice on a wafer. Metal traces connect the trim pads to their associated resistive elements formed on the dice. Thus, each trim pad formed within the scribe channels results in a corresponding increase in the usable silicon surface area of the dice, thereby saving valuable silicon real estate.

Abstract: The positive temperature coefficient thermistor heater is composed of a positive temperature coefficient thermistor element, and electrodes formed on the both principal faces of the thermistor element. At least one of the electrodes consists of split electrodes. The positive temperature coefficient thermistor heater device has a positive temperature coefficient thermistor heater in which at least one of the electrodes consists of split electrodes, and radiator plates disposed on the both principal faces of the thermistor element. The split electrodes of the positive temperature coefficient thermistor heater are equal in area to each other, or different from each other.

Abstract: A thermistor type temperature sensor includes a mounting sheet made of insulating ceramic; a plurality of thermistor elements disposed on the mounting sheet; a detecting device, disposed on the mounting sheet, for electrically conducting with the thermistor elements and detecting changes in the resistance value of the thermistor elements; and a cover sheet for hermetically sealing the thermistor elements and the detecting device by thermocompression-bonding with the mounting sheet.

Abstract: A heating panel has a metal substrate, ceramic inner and outer insulating layers on the substrate. A film of resistive material forms a heating layer on one of the insulating layers. The heating layer has electrodes on opposite edges connected to different phases of a multiphase power source. Another electrode is connected to a neutral of the power source. Capacitive currents caused in the substrate by the different phases cancel each other. Thus, leakage current is minimized through a conductor connected between the substrate and ground. The heating panel can be adapted for two phase or three phase systems. The heating panels are particularly useful for defining a heating cavity of an oven.

Abstract: A chip resistor is provided which comprises an insulating chip substrate, a resistor element formed on the chip substrate, a first pair of electrode terminals branching out from one end of the resistor element, and a second pair of electrode terminals branching out from the other end of the resistor element. One of the first pair electrode terminals is a current terminal while the other of the first pair electrode terminals is a voltage terminal. Similarly, one of the second pair electrode terminals is a current terminal, and the other of the second pair electrode terminals is a voltage terminal.

Abstract: A superconducting current limiter comprising a bar or tube of high temperature superconducting material of the composite type made up of glass and a high temperature superconducting oxide, the volume fraction of the glass lying in the range 10% to 40%, the bar or tube being selected to comply with the following inequalities:.rho.>10.sup.-4 .OMEGA..multidot.mj.sub.c >10.sup.+5 A/m.sup.2.rho.x.sup.2 <10.sup.11 W/m.sup.3in which inequalities:.rho. designates the resistivity of the material in the normal, i.e. the non-superconducting, state;j.sub.c designates the critical current density;.rho.x.sup.2 designates the power density dissipated in the bar or tube during the transition stage;it being specified that the critical current density is defined as the density which produces an electric field of 10.sup.-4 V/m along the tube or bar and that it is accepted that limitation takes place for a current density equal to five times the critical current density.

Abstract: A resistor circuit includes a pair of linear conductive films and a resistive film. The resistive film is formed on an area between the conductive films and electrically connected to the conductive films. A pair of terminals are electrically connected to portions of the conductive films respectively. A current source is electrically connected between the terminals to deliver an electrical current thereto. A pair of voltage output terminals are electrically connected to portions of the conductive films respectively. At least one of the voltage output terminals is disposed at a portion of the conductive films other than a portion at which the terminals are formed. An output voltage from the voltage output terminals is exactly proportional to a current flowing between them independent of changes in an ambient temperature. The circuit may be implemented in an integrated circuit environment using, e.g., multiple thin film resistors.

Abstract: A vehicle fan motor controller includes a simple planar ceramic base providing a plurality of printed resistors. The resistors include electrically conductive paths printed on the ceramic overcoated with a thick resistive film. The thick film substantially covers the base to promote heat transfer to air moving in the fan duct in which the controller is placed. The thick film resistors are on both sides of the base to reduce overall size and improve heat transfer. A thermal fuse comprising a spring metal member held in a normally closed position by a meltable material opens in response to a predetermined high temperature.

Abstract: An apparatus and method is provided for dividing a voltage with a resistor voltage divider and for employing the voltage divider in an integrated circuit. The resistor voltage divider utilizes inaccessible compensation taps that are placed between nonlinearly spaced output taps. The compensation taps reduce the impact of tap resistance on the voltage divider transfer function. The number of inaccessible compensation taps placed between output taps is dependant upon a chosen tap density that is substantially maintained across the body of the resistor voltage divider. The resistor may be used in integrated circuits employing amplifiers, such as volume control circuitry.