Fluid- Or Gas Pressure-actuated Patents (Class 338/36)
  • Patent number: 11262771
    Abstract: A pressure capsule/header assembly for a process fluid pressure transmitter is provided. An isolator plug has an isolation diaphragm at a first end thereof and a second end spaced from the first end. The isolator plug has a fill fluid passageway fluidically coupling the first end to the second end. A header has a first end configured to carry a pressure sensor and a second end spaced from the first end. The header has at least one electrical interconnect extending from the first end to the second end. A biaxial support ring is disposed about an outer surface of the header. The biaxial support ring and the header define a tapered interference interface therebetween. The header is welded to the isolator plug at a first weld and the biaxial support ring is welded to the isolator plug at a location that is spaced from the second end of the header.
    Type: Grant
    Filed: September 23, 2019
    Date of Patent: March 1, 2022
    Assignee: Rosemount Inc.
    Inventors: Eric Petersen, Nicholas E. Meyer, David M. Strei
  • Patent number: 10837852
    Abstract: An integrated seal and diaphragm member for a pressure sensor assembly may include a diaphragm portion and a seal portion integral with the diaphragm portion. In some cases, the integrated seal and diaphragm member includes one or more retention features integral with the diaphragm portion and/or the seal portion. In some cases, the seal portion may be thicker than the diaphragm portion and may extend around the perimeter of the diaphragm portion. In some instances, the seal portion may be configured to deform to form a seal with a pressure port of an external component or device without causing the diaphragm portion to move toward the pressure port in any significant way.
    Type: Grant
    Filed: December 3, 2018
    Date of Patent: November 17, 2020
    Assignee: Honeywell International Inc
    Inventors: Jason Dennis Patch, Paul Rozgo
  • Patent number: 10495534
    Abstract: A sensor body for a flow through pressure sensor includes a strain gage surface to receive a strain gage. The strain gage surface has a curved section and a length extending along a portion of a length of the sensor body. A bore wall thickness is defined as a radial distance between the bore and an outer surface of the sensor body, including the strain gage surface. The curved section can have a substantially greater bore wall thickness over its area relative to the planar surface because a greater responsive surface area for strain measurement is available. Thus a larger strain gage may be used and pressure measurement accuracy increased.
    Type: Grant
    Filed: June 6, 2016
    Date of Patent: December 3, 2019
    Assignee: WATERS TECHNOLOGIES CORPORATION
    Inventors: Gabriel Kelly, Gregory Puszko
  • Patent number: 10486961
    Abstract: In accordance with an embodiment, a MEMS structure is produced on a front side of a substrate. A decoupling structure which has recesses is produced in the substrate, which decoupling structure decouples a first region from a second region of the substrate in terms of stresses. In a rear side, situated opposite the front side, of the substrate, a first cavity is produced by means of a first etching process and a second cavity is produced by means of a second etching process. The first cavity and the second cavity are produced such that the second cavity encompasses the first cavity and such that the second cavity adjoins a base region of the MEMS structure and a base region of the decoupling structure.
    Type: Grant
    Filed: August 20, 2018
    Date of Patent: November 26, 2019
    Assignee: INFINEON TECHNOLOGIES AG
    Inventor: Matthias Steiert
  • Patent number: 10395632
    Abstract: An electronic system that can be combined with a wind musical instrument with lateral holes comprising a tubular body defining, on the inside, an air column, comprises at least one device for emitting elastic mechanical waves in the body of the instrument, at least one device for receiving elastic mechanical waves positioned to receive the waves emitted by at least one emission device after their propagation in the material of the body of the instrument and designed to provide at least one reception signal characteristic of the waves received and a device for detecting and locating the disturbance induced by an action of closing at least one lateral hole of the instrument, configured to detect and identify a configuration of closing of the lateral holes of the instrument from the analysis of at least one reception signal, the detection and location device positioned removably inside the air column of the instrument.
    Type: Grant
    Filed: April 18, 2016
    Date of Patent: August 27, 2019
    Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventor: Florent Souvestre
  • Patent number: 10302517
    Abstract: A hydraulic sensor attachment structure includes an accommodating portion, a sensor case, and a lid disposed over the accommodating portion. In the hydraulic sensor attachment structure, an oil passage body includes the accommodating portion and a hydraulic pressure detection port. A hydraulic sensor includes a sensor main body, and the sensor case that covers the sensor main body. The accommodating portion includes a support portion that supports the hydraulic sensor from below. The sensor case includes a detection port portion. The accommodating portion includes a fastening portion and the lid includes a fastening portion. By fastening the fastening portion of the accommodating portion and the fastening portion of the lid by rotating the lid in one direction of the circumferential directions, the sensor case is held by the support portion and the lid in the up-down direction and is fixed to the oil passage body.
    Type: Grant
    Filed: November 22, 2017
    Date of Patent: May 28, 2019
    Assignee: NIDEK TOSOK CORPORATION
    Inventors: Tomoka Osawa, Hironobu Wakabayashi, Toshiaki Nakamura, Ryunosuke Oikawa
  • Patent number: 9939085
    Abstract: A pipe damp is for joining submerged pipes provided with flanges. The pipe clamp includes at least two segments connected by at least one hinge. The pipe clamp is further provided with a threaded bolt arranged to open and close the pipe clamp. The pipe clamp is provided with at least one strain gauge arranged to measure the tension of the pipe clamp around the flange of the pipe when the pipe clamp is dosed by the threaded bolt. A method is for tensioning a pipe clamp. Use of strain gauges to measure the tension of a pipe clamp is provided.
    Type: Grant
    Filed: August 22, 2013
    Date of Patent: April 10, 2018
    Assignee: Depro AS
    Inventors: Rune Oyen, Odd Rune Holland, Arne Hodne
  • Patent number: 9880064
    Abstract: A measuring arrangement with a ceramic measuring cell and a metal process connection for connecting the measuring cell to a measuring environment, with the measuring cell being fastened in the process connection without gaskets and in a diffusion-resistant fashion, with the measuring cell being fastened at a ceramic ring, which is arranged at a metal ring for fastening in the process connection.
    Type: Grant
    Filed: June 26, 2014
    Date of Patent: January 30, 2018
    Assignee: VEGA GRIESHABER KG
    Inventor: Thomas Kopp
  • Patent number: 9870885
    Abstract: Techniques for detecting vacuum loss in a vacuum interrupter are disclosed. For example, a sensing system of a vacuum interrupter includes a sensor including a material that oxidizes in the presence of air and is at least partially positioned in an evacuated space of a vacuum interrupter, the sensor being configured to produce an indication of impedance of the material; and a control system coupled to the sensor, the control system including an electronic processor and an electronic storage that stores instructions that, when executed, cause the electronic processor to access an indication of impedance produced by the sensor, determine a measure of impedance of the material of the sensor based on the accessed indication of impedance, and determine a condition of the evacuated space based on the determined measure of impedance.
    Type: Grant
    Filed: May 11, 2015
    Date of Patent: January 16, 2018
    Assignee: Cooper Technologies Company
    Inventors: John Albert Kovacich, Paul Newcomb Stoving, Christopher Randall Hastreiter, Rose Ellen Weisburgh, Robert Raymond Schuetz, Lisa Carol Sletson, Ross Stuart Daharsh
  • Patent number: 9835513
    Abstract: In a sensor module for measuring a pressure of a fluid, having at least one supporting element, at least one electronic circuit, particularly an integrated circuit, arranged on at least one circuit carrier, and with at least one pressure measuring chip that has at least one pressure measuring membrane, wherein at least sections of the circuit carrier are surrounded by a protective material to protect it from surrounding fluids, it is provided as essential to the invention that the pressure measuring chip and the circuit carrier are arranged vertically one underneath the other, and that the pressure measuring chip is at least partially mechanically decoupled from the supporting element.
    Type: Grant
    Filed: September 30, 2015
    Date of Patent: December 5, 2017
    Assignee: HELLA KGAA HUECK & CO.
    Inventors: Peter Müller, Torsten Eggers
  • Patent number: 9739680
    Abstract: This disclosure provides example methods, devices and systems associated with flat covered leadless pressure sensor assemblies suitable for operation in extreme environments. In one embodiment, a system may comprise a semiconductor substrate having a first side and a second side; a diaphragm disposed on the first side of the semiconductor substrate; a first cover coupled to the first side of the semiconductor substrate such that it overlays at least the diaphragm, wherein a pressure applied at the first cover is transferred to the diaphragm; and a sensing element disposed on the second side of the semiconductor substrate, wherein the sensing element is used to measure the pressure.
    Type: Grant
    Filed: October 31, 2016
    Date of Patent: August 22, 2017
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Alexander A. Ned, Joseph R. VanDeWeert, Leo Geras
  • Patent number: 9736930
    Abstract: A flexible electronic module is provided, including a flexible substrate having a supporting portion, a body portion, and a connection portion, wherein the supporting portion is connected with the body portion via the connection portion; a first trench formed between the supporting portion and the body portion; an electronic component disposed over a portion of the supporting portion; and a conductive line disposed over the supporting portion, the connection portion, and the body portion for connecting the electronic component.
    Type: Grant
    Filed: April 10, 2014
    Date of Patent: August 15, 2017
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ming-Huan Yang, Wei-Ting Chen, Chih-Chia Chang
  • Patent number: 9702038
    Abstract: Disclosed is a pressure sensor that outputs a temperature change caused in an electrical resistor according to a pressure of a gas, as a resistance change in the electrical resistor. The pressure sensor includes: a base substrate including a recess formed therein, a floating film formed on the base substrate, a heater formed on a surface of the floating film and configured to heat the floating film when a current flows therein, and a temperature sensor formed as the electrical resistor on the surface of the floating film. The temperature sensor changes a voltage drop with respect to a current flowing therein according to the temperature of the floating film.
    Type: Grant
    Filed: June 9, 2015
    Date of Patent: July 11, 2017
    Assignee: TOKYO ELECTRON LIMITED
    Inventor: Tomohide Minami
  • Patent number: 8863582
    Abstract: A pressure transducer assembly including: a pressure sensor header; a transducer assembly member; and a joining arrangement disposed at an interface of the header and the transducer assembly member, for joining the header with the transducer assembly member, the joining arrangement including: a recessed female joining element formed in one of the header and the transducer assembly member; and a protruding male joining element formed on the other of the header and the transducer assembly member, the male joining element received in the female joining element.
    Type: Grant
    Filed: August 14, 2013
    Date of Patent: October 21, 2014
    Assignee: Kulite Semiconductor Products, Inc.
    Inventor: Nora Kurtz
  • Patent number: 8237537
    Abstract: A pressure transducer comprising a corrosion resistant metal diaphragm, having an active region, and capable of deflecting when a force is applied to the diaphragm; and a piezoresistive silicon-on-insulator sensor array disposed on a single substrate, the substrate secured to the diaphragm, the sensor array having a first outer sensor near an edge of the diaphragm at a first location and on the active region, a second outer sensor near an edge of the diaphragm at a second location and on the active region, and at least one center sensor substantially overlying a center of the diaphragm, the sensors connected in a bridge array to provide an output voltage proportional to the force applied to the diaphragm. The sensors are dielectrically isolated from the substrate.
    Type: Grant
    Filed: March 22, 2011
    Date of Patent: August 7, 2012
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Anthony D. Kurtz, Nora Kurtz, legal representative
  • Patent number: 7911316
    Abstract: A sensor array for a pressure transducer having a diaphragm with an active region, and capable of deflecting when a force is applied to the diaphragm. The sensor array disposed on a single substrate, the substrate secured to the diaphragm. The sensor array having a first outer sensor near an edge of the diaphragm at a first location and on the active region, a second outer sensor near an edge of the diaphragm at a second location and on the active region, and at least one center sensor substantially overlying a center of the diaphragm. The sensors connected in a bridge array to provide an output voltage proportional to the force applied to the diaphragm. The sensors dielectrically isolated from the substrate.
    Type: Grant
    Filed: January 12, 2010
    Date of Patent: March 22, 2011
    Assignee: Kulite Semiconductor Products, Inc.
    Inventor: Anthony D. Kurtz
  • Patent number: 7432795
    Abstract: A pressure sensor header for a pressure transducer includes a header shell having a sensor cavity formed therein, a sensor element disposed in the sensor cavity, a fluid medium disposed in the sensor cavity, an isolation diaphragm closing the sensor cavity, and a joining arrangement disposed at an interface of the isolation diaphragm and the header shell, the joining arrangement joining the isolation diaphragm with the header shell. The isolation diaphragm is an integral unit comprising a thin membrane surrounded by a thicker outer ring. The joining arrangement has a recessed female joining element formed in one of the outer ring of the isolation diaphragm and the header shell, and a protruding male joining element formed on the other one of the outer ring of the isolation diaphragm and the header shell, the male joining element received in the female joining element.
    Type: Grant
    Filed: February 6, 2007
    Date of Patent: October 7, 2008
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Anthony D. Kurtz, Adam Kane
  • Patent number: 7369032
    Abstract: A pressure transducer assembly including: a pressure sensor header; a transducer assembly member; and a joining arrangement disposed at an interface of the header and the transducer assembly member, for joining the header with the transducer assembly member, the joining arrangement including: a recessed female joining element formed in one of the header and the transducer assembly member; and a protruding male joining element formed on the other of the header and the transducer assembly member, the male joining element received in the female joining element.
    Type: Grant
    Filed: January 14, 2005
    Date of Patent: May 6, 2008
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Anthony D. Kurtz, Adam Kane
  • Patent number: 7212096
    Abstract: A pressure sensor header for a pressure transducer includes a header shell having a sensor cavity formed therein, a sensor element disposed in the sensor cavity, a fluid medium disposed in the sensor cavity, an isolation diaphragm closing the sensor cavity, and a joining arrangement disposed at an interface of the isolation diaphragm and the header shell, the joining arrangement joining the isolation diaphragm with the header shell. The isolation diaphragm is an integral unit comprising a thin membrane surrounded by a thicker outer ring. The joining arrangement has a recessed female joining element formed in one of the outer ring of the isolation diaphragm and the header shell, and a protruding male joining element formed on the other one of the outer ring of the isolation diaphragm and the header shell, the male joining element received in the female joining element.
    Type: Grant
    Filed: June 14, 2004
    Date of Patent: May 1, 2007
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Anthony D. Kurtz, Adam Kane
  • Patent number: 7194375
    Abstract: A pressure sensor 11 is provided with a connecter housing 30 having a pressure sensing element 20 arranged on an end surface thereof, a sensor housing 40 constructed to have the connecter housing 30 inserted thereinto, a pressure chamber 452 defined between the end surface of the connecter housing 30 and the sensor housing 40, and a compensation circuit 21 for performing the processing and operation of a measured signal of the pressure sensing element 20 to output the measured signal.
    Type: Grant
    Filed: December 15, 2004
    Date of Patent: March 20, 2007
    Assignee: Toyoda Koki Kabushiki Kaisha
    Inventor: Tomonari Yamakawa
  • Patent number: 6696964
    Abstract: A device for monitoring the filling of a bag (10) comprises a resistor element to be mounted on the outside surface of the bag, the resistor element being a flexible potentiometer (20), the resistance whereof being changed by bending of the potentiometer due to increasing bulging of the bag wall under continuing filling of the bag. The flexible potentiometer can be connected to an alarm device (24) reacting at a predetermined resistance value of the resistor element.
    Type: Grant
    Filed: February 6, 2002
    Date of Patent: February 24, 2004
    Assignee: Crafcare AB
    Inventor: Ola Håkansson
  • Patent number: 6570485
    Abstract: A transducer packaging assembly for use in a sensing unit subjected to high forces of acceleration includes a base having a cavity. A pressure sensitive semiconductor die is bonded to a large backplate having a shape so that it nestles into the cavity but is spaced from a surface of the cavity. A planar cover secured to the base has a hole larger than the die but smaller than the backplate, and thin wires extend from the die to electrical connections on the assembly. A viscous fluid fills a space between the backplate and the cavity, and a space between the backplate and the cover, and transmits a pressure to be measured to the pressure sensitive die. The viscous fluid has a sufficiently high viscosity to oppose movement of the backplate relative to the cavity while cushioning the pressure sensitive die and the backplate from forces of acceleration.
    Type: Grant
    Filed: November 17, 2000
    Date of Patent: May 27, 2003
    Assignee: Honeywell International Inc.
    Inventors: Thomas G. Stratton, Terrence D. Bender, Joel J. Bodin, Reinhart Ciglenec, Frank F. Espinosa, Edgar R. Mallison
  • Patent number: 6313729
    Abstract: A semiconductor component is fashioned of a chip carrier comprising an approximately planar chip carrier surface on which chip carrier surface a semiconductor chip with a pressure sensor is secured, and composed of electrode terminals penetrating the chip carrier and electrically connected to the semiconductor chip, with a surface-mounted arrangement. The chip overlapping the chip carrier.
    Type: Grant
    Filed: November 2, 1998
    Date of Patent: November 6, 2001
    Assignee: Siemens Aktiengesellschaft
    Inventors: Jürgen Winterer, Gottfried Beer
  • Publication number: 20010030596
    Abstract: A protective construction for a piezo-resistive silicon pressure transducer intended for connection to a pressure source that exhibits pressure transients. The construction includes the transducer, a conduit for providing pressure communication between the pressure source and the transducer and a flow restrictive device positioned within the conduit.
    Type: Application
    Filed: December 8, 2000
    Publication date: October 18, 2001
    Inventor: William J. Barbier
  • Publication number: 20010002119
    Abstract: The invention relates to a method of producing a pressure sensor component with a chip carrier which has a substantially planar chip carrier surface and a semiconductor chip with an integrated pressure sensor on the chip carrier surface.
    Type: Application
    Filed: January 17, 2001
    Publication date: May 31, 2001
    Applicant: Siemens Aktiengesellschaft
    Inventors: Jurgen Winterer, Eric Bootz, Bernd Stadler, Achim Neu, Thies Janczek
  • Publication number: 20010001550
    Abstract: A semiconductor device die comprising one or more stress-isolated regions is described. In one embodiment, stress isolation is achieved by providing a nominally rigid rim region which forms part of the stress isolated region. The rim region is attached to a nominally rigid periphery or frame region by a flexible, spring-like stress-isolation region such that displacements and twisting of the frame region due to mounting and packaging stresses are mitigated, do not propagate to the stress-isolated region, and do not effect the output signal. The stress isolation flexible region includes first and second members etched from the semiconductor device material to mechanically isolate the diaphragm from its periphery. The first member is formed by etching a first deep trench. The combination of the first deep trench etch and a second deep trench etch define the second member. In one embodiment, the stress-isolated region comprises a pressure-sensitive deformable diaphragm for sensing pressure.
    Type: Application
    Filed: November 12, 1998
    Publication date: May 24, 2001
    Inventors: JANUSZ BRYZEK, DAVID W. BURNS, STEVEN S. NASIRI
  • Patent number: 6211772
    Abstract: A semiconductor composite sensor using a plurality of semiconductor piezoresistive gauge elements connected in series. The piezoresistive elements are separated so that a high potential terminal of one of the resistive elements having the same resistance values and the substrate of the other of the resistive elements will be connected with equal potential values. Potential difference values between semiconductor regions serving as respective resistive elements and the substrates are made equal.
    Type: Grant
    Filed: September 5, 1997
    Date of Patent: April 3, 2001
    Assignee: Hitachi, Ltd.
    Inventors: Susumu Murakami, Satoshi Shimada, Seiichi Ugai, Yukio Takahashi, Shuichi Shimizu
  • Patent number: 6201467
    Abstract: The pressure sensor component has a chip carrier with an approximately planar chip carrier surface. A semiconductor chip with an integrated pressure sensor is placed on the chip carrier surface. A pressure-detecting surface area of the pressure sensor is exposed to a pressure to be measured. The component is encapsulated with electrically insulating material that encloses the semiconductor chip and/or the chip carrier at least in regions. A chimney-shaped connection piece that projects up relative to the pressure-detecting area of the pressure sensor penetrates through the encapsulation and is connected to the pressure sensor. The connection piece, which is a separate structural element is incorporated in the component encapsulation and it encloses at least the pressure-detecting surface area in a pressure-tight manner with its end bearing on the semiconductor chip. The connection piece is open toward the outside at its opposite end so as to expose the pressure sensor to the pressure to be measured.
    Type: Grant
    Filed: August 25, 1999
    Date of Patent: March 13, 2001
    Assignee: Infineon Technologies AG
    Inventors: Jürgen Winterer, Eric Bootz, Bernd Stadler, Achim Neu, Thies Janczek
  • Patent number: 6046667
    Abstract: A pressure transducer which has a housing containing a sensing element and a noncorrosive fluid in contact with the sensing element. A porous material isolates the fluid from a harsh liquid or a liquid containing solids while allowing transmission of the pressure of the liquid.
    Type: Grant
    Filed: December 23, 1997
    Date of Patent: April 4, 2000
    Assignee: Honeywell Inc.
    Inventor: Milton W. Mathias
  • Patent number: 5999082
    Abstract: A pressure transducer employing a metal isolation diaphragm. A volume of oil is located between the metal diaphragm and a silicon sensor received in a base member. In order to reduce errors at very low pressure caused by the oil exerting a tension on the deflecting portion of said silicon sensor, the metal diaphragm has an extending dome or dimple above the location of the silicon sensor. The silicon sensor is also recessed below the supporting base plate so that the separation between the silicon sensor and the metal diaphragm increases. The base plate also contains a series of shallow, narrow concentric grooves which further reduces surface tension between the metal diaphragm and the base plate.
    Type: Grant
    Filed: March 25, 1998
    Date of Patent: December 7, 1999
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Anthony D. Kurtz, John R. Hayer, Robert Gardner, Lou DeRosa, Leo Geras
  • Patent number: 5973590
    Abstract: A semiconductor sensor device including a semiconductor diaphragm member having a top surface coated with an oxide layer; P+ sensor elements fusion bonded to the oxide layer at a relatively central area of the diaphragm; P+ finger elements fusion bonded to the oxide layer extending from the sensors to an outer contact location of the diaphragm for each finger; and an external rim of P+ material fusion bonded to the oxide layer and surrounding the sensors and fingers. A first glass wafer member is electrostatically bonded at a bottom surface to the fingers and rim to hermetically seal the sensors and fingers of the diaphragm member. The first glass wafer includes a depression above the sensors and has a plurality of apertures, where each aperture is associated with a separate finger at the contact location and each aperture being smaller than the associated finger lining up with the contact location wherein each contact location can be accessed via the associated aperture in the first glass wafer member.
    Type: Grant
    Filed: March 12, 1998
    Date of Patent: October 26, 1999
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Anthony D. Kurtz, Alexander Ned, Scott J. Goodman
  • Patent number: 5891751
    Abstract: A reduced size, hermetically sealed semiconductor transducer and methods for fabricating the same. In a preferred embodiment, the transducer comprises a transducer wafer including a diaphragm which deflects upon the application of a force thereto. At least one semiconductor transducer element and one electrical contact are disposed on a top surface of the transducer wafer, with the electrical contact coupled to the semiconductor element and extending to a peripheral portion of the wafer. A cover member is provided that is dimensioned to surround the semiconductor element. A peripheral glass frit bond is formed between the cover member and the transducer wafer, and between the cover member and at least a portion of the electrical contact. An aperture is formed in a top portion of the cover member, positioned above a region bounded by the peripheral glass bond. This aperture functions to prevent air gap formation in the peripheral glass frit bond.
    Type: Grant
    Filed: September 9, 1996
    Date of Patent: April 6, 1999
    Assignee: Kulite Semiconductor Products, Inc .
    Inventors: Anthony D. Kurtz, Alexander Ned
  • Patent number: 5812047
    Abstract: An improved resistor and connection region structure in which the geometries of the connection regions for a pair of radial resistors correspond to the connection region geometries for a pair of tangential resistors, thus inherently eliminating the need for varying connection regions to compensate for offset. In particular, the radial resistors are formed by placing two legs in parallel with each other and connecting those legs in series on opposite sides of the membrane, with the connection region on the interior of the membrane. The tangential resistors, on the other hand, are formed on the opposite sides by placing two legs in series with each other and connecting those legs in series, with an interior connection region connecting them.
    Type: Grant
    Filed: February 18, 1997
    Date of Patent: September 22, 1998
    Assignee: Exar Corporation
    Inventor: Robertus P. van Kampen
  • Patent number: 5760675
    Abstract: Disclosed is the method of producing a piezo-device utilizing an ultra-thin Mo-C film as a piezoresistive material for a general class of improved piezo-device with the high sensitivity and the weak temperature dependence.
    Type: Grant
    Filed: September 19, 1996
    Date of Patent: June 2, 1998
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Seong-Jae Lee, Kyoung-Wan Park, Min-Cheol Shin
  • Patent number: 5594405
    Abstract: A pressure transducer has a cylindrical body with a thread formed on at least part of the outer surface. A resistance element is wound in the thread and an internal bore receives pressurized fluid. The resistance element is strained by application of pressure to vary its resistance.
    Type: Grant
    Filed: August 26, 1994
    Date of Patent: January 14, 1997
    Assignee: Microhydraulics, Inc.
    Inventor: George Kadlicko
  • Patent number: 5581226
    Abstract: A high pressure sensor structure (11, 111, 211) includes a housing (12, 112, 212) having an upper cavity portion (13, 113, 213) and a lower cavity portion (16, 116, 216). A diaphragm (18, 118, 218) separates the upper cavity portion (13, 113, 213) from the lower cavity portion (16, 116, 216). A semiconductor chip (26, 126, 226) is attached to the upper surface of the diaphragm (18, 118, 218) within the upper cavity portion (13, 113, 213). The diaphragm (18, 118, 218) has a thickness (21, 121, 221) and an exposed width (23, 123, 223) such that the semiconductor chip (26, 126, 226) generates a measurable output signal when the lower surface of the diaphragm (18, 118, 218) is exposed to a high pressure environment.
    Type: Grant
    Filed: November 2, 1994
    Date of Patent: December 3, 1996
    Assignee: Motorola, Inc.
    Inventor: Mahesh Shah
  • Patent number: 5541570
    Abstract: An improved carbon-free force sensitive ink for a force sensor. The ink when deposited and dried can function at temperatures of up to 350.degree. F. and pressures of up to 10,000 psi. The preferred ink includes a thermoplastic polyimide binder, conductive particles, intrinsically semi-conductive particles, and dielectric particles, all of an average particle size of 1.0 micron or less. The preferred semi-conductive particles are molybdenum disulfide, ferric and ferrous oxide particles. The preferred conductive particles are conductive metal oxide compounds that deviate from stoichiometry based on an oxygen value of two, such as conductive tin oxide, Fe.sub.3 O.sub.4 iron oxide, and mixtures of them. The preferred dielectric particles are silica. The binder is present in an amount of 20 to 80% by volume. The sensor and a method of making the sensor are also disclosed.
    Type: Grant
    Filed: December 9, 1994
    Date of Patent: July 30, 1996
    Assignee: Force Imaging Technologies, Inc.
    Inventor: Donald J. McDowell
  • Patent number: 5483994
    Abstract: A pressure sensor die is provided with a flexible membrane and a plunger which combine to amplify a low pressure signal while also providing media isolation between a fluid being measured and the internal components of a pressure sensor. One embodiment of the pressure sensor disposes an end of the plunger in direct contact with a pressure sensor die while another embodiment disposes an elastomeric diaphragm between the plunger and the pressure sensor die. This second embodiment creates a chamber between the plunger and the pressure sensor die in which a fluid is captured by movement of the plunger. The captured fluid is decreased in volume by movement of the plunger and the resulting increase in pressure in transmitted to a pressure sensitive portion of a pressure sensor die. The device is particularly useful in conjunction with applications where media isolation is required between the fluid being measured and the components of the pressure sensor, such as kidney dialysis machines.
    Type: Grant
    Filed: February 1, 1995
    Date of Patent: January 16, 1996
    Assignee: Honeywell, Inc.
    Inventor: D. Joseph Maurer
  • Patent number: 5353003
    Abstract: A force sensor is provided which incorporates a pressure transducer disposed within a housing structure. A force transmitting means, such as a shaft slidable within an opening, is provided to communicate force from an external source to a diaphragm of a pressure sensor. An elastomeric conductor is disposed between electronic components on the diaphragm of a pressure sensor die and conductive leads that are used to communicate signals from the pressure sensor die to components external to the present invention. In certain preferred embodiments, the present invention provides a preselected quantity of resilient material between a first end of the slidable shaft and the diaphragm of the pressure sensor die. Other embodiments place the first end of the shaft in direct contact with the diaphragm.
    Type: Grant
    Filed: October 16, 1992
    Date of Patent: October 4, 1994
    Assignee: Honeywell Inc.
    Inventor: Dean J. Maurer
  • Patent number: 5329271
    Abstract: A semiconductor strain sensor includes a silicon substrate, a strain resistive element and electrodes. The silicon substrate has a deformable portion which is deformed when stress is applied to it. The strain resistive element is formed on the deformable portion and has an at least a first layer and a second layer which form a heterojunction between them. The first layer is doped with impurities so that a two-dimensional carrier gas layer is formed in the second layer near the heterojunction. The two-dimensional carrier gas layer has carriers originating from the impurities. The electrodes electrically contact the two dimensional carrier gas layer. Change of resistance of the strain resistive element in accordance with the stress is detected through the electrodes.
    Type: Grant
    Filed: May 4, 1992
    Date of Patent: July 12, 1994
    Assignee: Nippondenso Co., Ltd.
    Inventors: Hajime Inuzuka, Tsuyoshi Nakagawa, Kunihiko Hara
  • Patent number: 5264820
    Abstract: A pressure transducer for measuring high differential pressure media in a harsh environment where a diaphragm assembly is mounted to an intermediate support number which is mounted to a main support member where the high pressure media impinges on the diaphragm to create a force opposing that provided by the diaphragm support structure thereby loading the diaphragm in compression. The strain sensitive piezoresistive elements are protected and sealed from the low pressure media by a passivation layer and electrical signal leads are attached to bonding pads formed on the diaphragm assembly which are sealed to the intermediate support member by a sealing cap.
    Type: Grant
    Filed: March 31, 1992
    Date of Patent: November 23, 1993
    Assignee: Eaton Corporation
    Inventors: John A. Kovacich, Christopher C. Hoinsky, Peter D. Van Vessem, Ricardo A. Rago
  • Patent number: 5231508
    Abstract: A signaling gauge may utilize a magnetically actuated variable resistor made up of a plurality of noncaptivating, magnetically actuated switch elements, each of which is mounted in an influence zone of a path of a magnet carried on an arm of a condition sensor such as a gauge movement. The arm may be an indicating pointer of the gauge. The gauge may alternatively utilize a magnetically-sensitive, variable-resistance element in a contactless arrangement with a magnet. The variable resistance element may include a plurality of noncaptivating, magnetically actuated switch elements and associated resistors mounted in an influence zone of a path of a magnet. The contactless arrangement eliminates the need for electromechanical contacts.
    Type: Grant
    Filed: April 10, 1991
    Date of Patent: July 27, 1993
    Inventor: Frank W. Murphy, Jr.
  • Patent number: 5079954
    Abstract: The present invention provides a vacuum gauge having two integrated circuits connected in a half bridge circuit to register subatmospheric gas pressure from a change in thermal gas conductivity. One of the integrated circuits serves to generate an electrical current proportional to the ambient temperature and a function of its power output conducted by the gas. The other of the integrated circuits acts as a reference to generate an electrical current proportional to ambient temperature. The half bridge circuit acts to subtract the currents so that subatmospheric pressure can be read on an ammeter as a function of gas thermal conductivity.
    Type: Grant
    Filed: December 27, 1990
    Date of Patent: January 14, 1992
    Assignee: The BOC Group, Inc.
    Inventor: Charles D. O'Neal, III
  • Patent number: 5068635
    Abstract: A stress sensor for detecting a stress, including a ceramic hollow member, a pair of support members for supporting the ceramic hollow member, and at least one resistor provided on the ceramic hollow member. The ceramic hollow member is deformable according to a stress applied thereto in a direction in which a hollow of the hollow member extends. The support members are disposed at opposite ends of the hollow member, so as to support the hollow member such that the stress is imparted to the hollow member through the pair of support members. The resistor or resistors is/are disposed on one of the inner and outer surfaces of the hollow member. The stress is detected based on a change in the electrical resistance value of the resistor or resistors which is caused by the deformation of the hollow member.
    Type: Grant
    Filed: July 20, 1989
    Date of Patent: November 26, 1991
    Assignee: NGK Insulators, LTD.
    Inventor: Yasuhito Yajima
  • Patent number: 5065129
    Abstract: A precision pressure sensor in the form of a load cell has a mounting ring closed at one end by an end wall which has axially outwardly facing dead-end holes therein to form sensor beams each having an axially outwardly facing plane surface to which strain gages are bonded. The dead-end holes have bottoms forming sensor membranes. Opposite the closed end the mounting ring encloses a cavity forming a sensor space which is closed by a closure plug that simultaneously has a bore for admitting fluid under pressure to be measured into the sensor space. A ring groove in the end wall has approximately radially sloping surfaces which together with the dead-end holes determine the minimum cross-section of the measuring beams. The ring groove also determines the minimum thickness of the sensor membranes.
    Type: Grant
    Filed: July 23, 1990
    Date of Patent: November 12, 1991
    Assignee: Hottinger Baldwin Measurements, Inc.
    Inventors: Reimar Hellwig, Ralf Waegner
  • Patent number: 5045829
    Abstract: A pressure sensor that utilizes an extension type conductive elastomer that will exhibit a decrease in its electrical resistance in response to an extension thereto. Like sheets of the conductive elastomer and an electrically insulative elastomer are overlaid and sandwiched between supporting members within a housing of the pressure sensor. The housing and each supporting member are preferably cylindrical or ring shaped, and which conductive elastomer has a pair of spaced electrodes electrically connected thereto at opposite points on its periphery. The periphery of the electrically insulative elastomer is squeezed continuously in a circle between the supporting members, while that of the conductive elastomer that includes recesses is squeezed therebetween discontinuously in the sections between the electrodes.
    Type: Grant
    Filed: March 2, 1990
    Date of Patent: September 3, 1991
    Inventors: Hiroshi Kuramochi, Yasuo Okuda, Sigeyosi Ogihara
  • Patent number: 5045830
    Abstract: A hydraulic actuating apparatus includes a cylindrical case having a fitting at one end connectable to a source of pressurized oil, the fitting having a passage for communication with the pressurized oil, a slider slidably carried by the cylindrical case, the slider being slidable in response to the oil pressure, a first spring device for biasing the slider in a predetermined direction to resist the force on the slider applied by the oil pressure, a slidable contact device carried by the slider, an oil pressure sensor which includes a resistor and a ground conductor, the slidable contact device being slidably engaged with the resistor, the resistor being fixed with respect to the slidable contact device, and a second spring device for biasing the slider in the predetermined direction. The second spring device is connected to the slider, with the second spring device having a smaller spring constant than the first spring device.
    Type: Grant
    Filed: January 17, 1989
    Date of Patent: September 3, 1991
    Assignee: Toyo Denso Kabushiki Kaisha
    Inventors: Toshiji Shibazaki, Junio Chuzenji, Mikio Sasahara, Masaru Okano, Yoshihiro Ozaki, Naoto Kishida
  • Patent number: 5004996
    Abstract: A hydraulic actuating apparatus for sensing hydraulic pressure and producing an output signal representative of the sensed hydraulic pressure includes a base portion, a case, and a variable resistor unit. A slider is movably connected to the variable resistor unit, and the variable resistor unit is connected to the base, the slider being movable relative to the variable resistor unit by an amount proportional to the hydraulic pressure applied to the slider. The variable resistor unit has a resistance which changes in response to movement of the slider. A resilient member is provided which is resiliently deformable by movement of the slider relative to the variable resistor unit, the resilient means exerting a restoring force on the slider opposing the movement of the slider caused by the hydraulic pressure. An adjusting mechanism is provided for setting an initial resistance value of the variable resistor unit, the variable resistor unit having a portion which is in contact with the adjusting mechanism.
    Type: Grant
    Filed: August 28, 1989
    Date of Patent: April 2, 1991
    Assignee: Toyo Denso Kabushiki Kaisha
    Inventors: Toshiji Shibazaki, Masaru Okano, Naoto Kishida, Yoshihiro Ozaki, Kunihiko Iyama
  • Patent number: 4952904
    Abstract: The marginal adhesion of platinum to silicon nitride is a serious issue in the fabrication of microbridge mass air flow sensors. High temperature stabilization anneals (500.degree.-1000.degree. C.) are necessary to develop the properties and stability necessary for effective device operation. However, the annealing process results in a significant reduction in the already poor platinum/silicon nitride adhesion. Annealing at relatively high temperatures leads to the development of numerous structural defects and the production of non-uniform and variable sensor resistance values. The use of a thin metal oxide adhesion Layvr, approximately 20 To 100 angstromw in thickness is very effective in maintaining platinum adhesion to silicon nitride, and through the high temperature anneal sequence.
    Type: Grant
    Filed: December 23, 1988
    Date of Patent: August 28, 1990
    Assignee: Honeywell Inc.
    Inventors: Robert G. Johnson, James O. Holmen, Ronald B. Foster, Uppili Sridhar
  • Patent number: 4947150
    Abstract: A pressure sender is provided with a variable electrical resistance corresponding to a sensed pressure, to be placed in series with a voltage source and a pressure gauge. The pressure sender is diaphragm-actuated, which diaphragm controls the positioning of an electrical contact against a ceramic thick film rheostat. An electrically conductive metal clip secures the rheostat in position as well as completes the electrical connection between the rheostat and the electrical circuit of which the pressure sender is a part. The electrical contact is rockingly mounted so that deflection of the diaphragm displaces the electrical contact through an arcuate travel path along various resistance positions of the thick film ceramic rheostat. Current from the electrical circuit will flow through the metal clip to input contacts of the rheostat, and then to the resistance positions.
    Type: Grant
    Filed: February 15, 1989
    Date of Patent: August 7, 1990
    Assignee: Stewart Warner Corporation
    Inventor: Henry Wasserstrom