Abstract: The present disclosure is directed to an air filter sensor system that can monitor a status of a filter and provide information to a remote system regarding the filter's status. The system can receive, by a computing server via one or more computer networks and from each of a plurality of sensor assemblies coupled to a corresponding plurality of air filters, information indicative of filter contamination levels respectively associated with each corresponding air filter of the plurality of air filters. Each of the respective filter contamination levels being provided by one sensor assembly of the plurality of sensor assemblies based at least in part on a difference in detected air pressure between first and second sides of the corresponding air filter.

Abstract: In one embodiment, a sensor includes a capsule having a cavity and a sheath, a transducer coupled to electronic circuitry in the cavity, and a clip outside the capsule. The capsule and the clip are configured to hold in vivo an object within an opening between the capsule and the clip. The transducer is configured to detect an incoming signal indicative of a physiological parameter of the object being held, and the electronic circuitry is configured to wirelessly transmit a signal containing information about the physiological parameter obtained from the incoming signal. The sensor is part of a measurement system to measure the physiological parameter. Another embodiment describes a method using the measurement system.

Abstract: An electronic device has a keyboard with an internal membrane. The membrane has a set of strain gauges configured to respond to a key press, such as when a collapsible dome collapses into contact with the membrane. The strain gauges are connected in a half Wheatstone bridge configuration and are positioned on the membrane in order to limit effects of temperature and subtle flexure of the membrane. The strain gauges are also configured to magnify detection of a resistance differential when a keycap is pressed with sufficient force.

Abstract: A differential pressure transducer assembly having an internal bellows coupling configured to improve reliability and ease assembly. The differential pressure transducer assembly includes a header, a sensing element mounted on the header, a first pressure port having a first pressure media channel in communication with a first side of the sensing element, a second pressure port having a second pressure media channel in communication with a second side of the sensing element, and a bellows coupling disposed between the header and the second pressure port. The bellows coupling may be configured to flex during assembly to compensate for tolerance mismatches. The bellows coupling may further reduce or prevent external stress from being applied to one or more of the header and the sensing element.

Abstract: Described herein is a force attenuator for a force sensor. The force attenuator can linearly attenuate the force applied on the force sensor and therefore significantly extend the maximum sensing range of the force sensor. The area ratio of the force attenuator to the force sensor determines the maximum load available in a linear fashion.

Abstract: A shaped body, in particular for a pressure sensor, can have a membrane and having a supporting section supporting the membrane. The membrane can be produced at least in layers from a ceramic material by means of additive manufacturing, in particular 3D screen printing, and having an outer circumferential shape with at least one corner.

Abstract: A force sensor includes an annular diaphragm that includes an inner perimeter and an outer perimeter; the diaphragm has an outer annular portion having a tapered thickness that increases with decreasing radial distance from the outer perimeter; the diaphragm has an inner annular portion having a tapered thickness that increases with decreasing radial distance from the inner perimeter; a first strain gauge at the outer annular portion; and a second strain gauge at the inner annular portion.

Abstract: A strain gauge includes a flexible resin substrate; a functional layer formed of a metal, an alloy, or a metal compound, directly on one surface of the substrate; a resistor formed of a film including Cr, CrN, and Cr2N, on one surface of the functional layer; and an insulating resin layer with which the resistor is coated.

Abstract: A chemical mechanical polishing method is provided, including polishing a batch of wafers in sequence on a polishing surface of a polishing pad; conditioning the polishing surface with a pad conditioner, wherein the pad conditioner is operable to apply downward force according to a predetermined downward force stored in a controller to condition the polishing surface; measuring the downward force applied by the pad conditioner with a measurement tool when the pad conditioner is at a home position and after conditioning the polishing surface; comparing the downward force measured by the measurement tool and the predetermined downward force with the controller to determine whether a difference between the downward force measured by the measurement tool and the predetermined downward force exceeds a range of acceptable values; and calibrating the downward force applied by the pad conditioner with the controller when the difference exceeds the range of acceptable values.

Abstract: A pressure sensor includes a cylindrical case defining an inner space in communication with an outer space; a pressure detector provided in the inner space and configured to detect a gauge pressure of a target fluid; an atmospheric pressure detector configured to detect an atmospheric pressure; and an electronic component configured to calculate an absolute pressure of the target fluid on a basis of the gauge pressure and the atmospheric pressure. The absolute pressure is obtained without requiring airtightness of the case between the inner space and the outer space, and thus, there is no requirement for a seal member to be included between the inner space and the outer space.

Abstract: A pressure sensing element, including a substrate, a device layer coupled to the substrate, a diaphragm being part of the device layer, and a plurality of piezoresistors coupled to the diaphragm. A plurality of bond pads is disposed on the device layer, and an electrical field shield is bonded to the top of device layer and at least one of the bond pads. At least one stress adjustor is part of the electrical field shield, where the stress adjustor is a cut-out constructed and arranged to reduce thermal hysteresis of the pressure sensing element caused by stress relaxation of the electrical field shield during a cooling and heating cycle. The stress adjustor may be a thin film deposited on top of the electrical field shield, which may apply residual stress to the piezoresistors. The pressure sensing element may include a cavity integrally formed as part of the substrate.

Abstract: A pressure sensor includes a housing, a pressure chamber defined within the housing, and a pressure transducer. The pressure sensor also includes a header that seals the pressure chamber and supports the pressure transducer in the pressure chamber. A plurality of pins extend through respective openings in the header. The sensor pins have first ends electrically connected to the pressure transducer in the pressure chamber and second ends electrically connected to sensor electronics outside the pressure chamber. The pins are electrically insulated from the header. The header is configured so that the electrical insulation of at least one pin from the header is less than the electrical insulation of the remaining pins from the header.

Abstract: Devices, systems, and methods for adjusting the high flex point of a deformable sensor are disclosed herein. A deformable sensor may include an enclosure comprising a housing and a deformable membrane coupled to an upper portion of the housing, where the enclosure is configured to be filled with a medium, a contact mechanism coupled to the housing and selectively adjustable such that adjusting a position of the contact mechanism causes a change in a location of a high flex point of the deformable membrane, and an internal sensor, disposed within the enclosure, having a field of view configured to be directed through the medium and toward a bottom surface of the deformable membrane, where the internal sensor is configured to output a deformation region within the deformable membrane when placed in contact an object.

Abstract: A micromechanical pressure sensor system, including: a substrate; a pressure sensor component connected to the substrate; and an essentially hollow frustum-shaped sleeve structure, which is connected to the substrate, which surrounds the pressure sensor component at least laterally and which has an opening at a side of the sleeve structure facing away from the substrate.

Abstract: A pressure sensor comprises a sensor housing, a diaphragm provided in the sensor housing, and a snubber insertable into the sensor housing. The sensor housing includes a coupler coupling with a pressure measurement target and a housing passage passing through the coupler and guiding a fluid that flows into the sensor housing from the pressure measurement target. The diaphragm is deformable by a pressure of the fluid that flows into the sensor housing from the pressure measurement target. The snubber is inserted into the sensor housing through the housing passage and fastens to the sensor housing in a state in which at least a portion of the sensor housing forming the housing passage is deformed. The snubber guides flow of the fluid and transmits the pressure of the fluid to the diaphragm.

Abstract: A pressure sensor is configured to monitor a first resistance value of a first resistor and a second resistance value of a second resistor. The first resistor and the second resistor are configured to be sensing elements of a sensing component of a pressure sensor. The pressure sensor is configured to determine, based on a difference between the first resistance value and the second resistance value satisfying a threshold, that a measurement from the sensing component is unreliable. The pressure sensor is configured to perform, based on determining that the measurement from the sensing component is unreliable, an action associated with the pressure sensor.

Abstract: A stress sensor formed by a membrane plate; a first bonding region arranged on top of the membrane plate; a cover plate arranged on top of the first bonding region, the first bonding region bonding the membrane plate to the cover plate; three-dimensional piezoresistive elements extending across the membrane plate that are embedded in the bonding layer; and planar piezoresistive elements that extend across the membrane plate and are surrounded by and separated from the bonding layer.

Abstract: An inner housing part has through-holes for connecting first lead pins (power supply terminal, output terminal, ground terminal) with the connector pins. The inner housing part has grooves that house second lead pins for adjusting output signals of a sensor chip. Three of the grooves each has a shape in which a distance between opposing sides of the groove is less than a diameter of the second lead pin that corresponds to the groove. The inner housing part is fixed to a case by a thermoset adhesive so as to house lead pins arranged in the case included in a sensor element. The second lead pins are fitted in the grooves, suppressing lifting of the inner housing part during curing of the adhesive.

Abstract: A pressure sensor including: a cylindrical casing extending in an axial direction; a diaphragm joined to the distal end side of the casing, extending in a direction intersecting the axis of the casing and deforming in accordance with pressure received on the distal end side; and a sensor section disposed inside the casing and outputting an electric signal corresponding to the deformation of the diaphragm. The diaphragm is provided with a plate-shaped base part and three or more protruding parts protruding from the distal end side surface of the base part toward the distal end side and set apart from each other. The relationships 0.05?H?2.5T and 0.05?(S2/S1)?0.8 are satisfied, where T (thickness), H (length), S1 (area of base distal end surface) and S2 (total area of protruding distal end surfaces) are as defined herein.

Abstract: A pressure-sensor device has a component sensitive to pressure, a structure for housing or supporting the pressure-sensitive component, and at least one elastically deformable body that is overmoulded to the housing or supporting structure.

Abstract: A sensor attachment structure of an oil pressure sensor suitable for use as a control valve of an automobile transmission includes a sensor case inserted into an accommodation space of a valve upper body portion such that a body portion of the sensor case is capable of rotating about a vertical central axis. A stopper projects in a horizontal direction from the body portion, the stopper being movable vertically in a guide groove of the accommodation space, and rotatable relative to a restricting portion of the upper body to restrict a vertical movement of the stopper to prevent the oil pressure sensor from falling off the upper body in an operation stage before the oil pressure sensor is fixed in a built-in manner between the upper and lower bodies of the control valve.

Abstract: A semiconductor pressure sensor for measuring an external pressure exerted on the sensor, including: a membrane; a first resistor connected between a first bias node and a first output node; a second resistor connected between the first bias node and a second output node; a first and second current source connected to the first resp. second output node for generating a differential voltage signal indicative of the external pressure to be measured. The resistors including piezo-resistive strips arranged in particular crystallographic directions. The circuit may have a third and four resistor pair for compensating package stress. The Piezo-resistive strips may be formed as p-doped regions within an n-well, the biasing node being electrically connected to the n-well.

Abstract: A pressure sensor includes a diaphragm suspended across a cavity in a substrate. A first group of piezoresistors is provided in the diaphragm proximate a first outer edge of the diaphragm, the piezoresistors of the first group being coupled to one another to form a first Wheatstone bridge. A second group of piezoresistors is provided in the diaphragm proximate a second outer edge of the diaphragm, the piezoresistors of the second group being coupled to one another to form a second Wheatstone bridge. The first and second Wheatstone bridges exhibit mirror symmetry relative to one another. Output signals from each of the first and second Wheatstone bridges are processed at respective first and second differential amplifiers. The output signals from each of the first and second differential amplifiers are processed at a third differential amplifier to produce a pressure output signal with enhanced sensitivity and reduced impact from process variation.

Abstract: A differential pressure sensor is a body with first and second interior channels connected to process fluid inlets and separated by a barrier. Each side of a MEMS pressure sensing diaphragm in the barrier is fluidly connected to a process fluid inlet. The diaphragm is mounted on a hollow pedestal such that one side of the diaphragm is fluidly connected to a process fluid inlet through an interior channel in the pedestal that is adhesively attached to an annular bottom of a cylindrical cavity inside the body. The other side of the diaphragm is fluidly connected to the other process fluid inlet and is fluidly isolated from the first fluid inlet by the adhesive at the bottom of the pedestal. Deformation of the diaphragm due to a pressure difference between the process fluid inlets detected by sensors on the diaphragm indicates a differential pressure.

Abstract: A method for producing a pressure sensor comprises providing a substrate with a depression; attaching a micromechanical sensor element to the substrate in the depression; attaching an evaluation circuit to the substrate next to the depression; electrically connecting the evaluation circuit to the sensor element; covering the substrate around the depression by means of a potting die such that the depression is closed; potting the evaluation circuit between the substrate and the potting die; and removing the potting die.

Abstract: A pressure transducer comprising a resistive pressure sensor element with a measurement membrane which has at least four resistor elements. The resistor elements are arranged in a full-bridge circuit, having a longitudinal direction in which the full bridge circuit is to be supplied with a constant current. When being supplied with the constant current, a longitudinal voltage has a first pressure dependency and a first temperature dependency, and a diagonal voltage has a second pressure dependency and a second temperature dependency, the second pressure dependency being greater than the first pressure dependency at a given temperature. The pressure transducer has a processing circuit which is designed to determine a measured pressure value at least using the diagonal voltage and optionally the longitudinal voltage.

Abstract: A pressure sensor is provided. The pressure sensor has a differential pressure sensor adapted to measure differential pressure between two differential pressure sensor inputs in a first differential pressure range. The pressure sensor further includes a first absolute pressure sensor and a second absolute pressure sensor adapted to measure an absolute pressure in an absolute pressure range. The pressured sensor is further provided with a measuring unit configured to determine a differential pressure in a second differential pressure range on the basis of absolute pressure measurements taken by the first and second absolute pressure sensors.

Abstract: A differential pressure transmitter is disclosed, which comprises a body for housing a high-pressure sensor and a low-pressure sensor, a plurality of high-pressure process connectors formed in said body and fluidly coupled to said high-pressure sensor for transmitting a first pressure of a process fluid to said high-pressure sensor, each of said high-pressure process connectors comprising a conduit having an opening for receiving the process fluid, a plurality of low-pressure process connectors formed in said body and fluidly coupled to said low-pressure sensor for transmitting a second pressure of a process fluid to said low-pressure sensor, each of said low-pressure process connectors comprising a conduit having an opening for receiving the process fluid, wherein said second pressure is equal to or less than said first pressure, wherein said openings of the high-pressure connectors are spaced relative to said openings of the low-pressure connectors to allow a plurality of pair-wise connections to the proces

Abstract: A pressure detecting device is mounted in a measurement target and instrument includes a strain inducer to which pressure of a pressure medium is applied and which generates strain in accordance with the pressure and a strain detecting element that is bonded onto a surface opposite to a pressure receiving surface of the strain inducer, in which the strain detecting element includes one or multiple central strain resistant bridges which are arranged at a central portion of the strain detecting element in a bonded surface direction, and one or multiple outer peripheral strain resistant bridges which are arranged at an outer periphery, and in which, for example, deformation of the strain detecting element caused by an external force when being screw-fixed to the measurement target instrument is obtained through the multiple strain resistant bridges. An error of detection pressure caused by the deformation in a pressure value detected through the central strain resistant bridge is corrected.

Abstract: Pressure sensors having vertical diaphragms or membranes. A vertical diaphragm may be located in a first silicon wafer between a first and second cavity, where the first and second cavities are covered by a second silicon wafer. One or more active or passive devices or components may be located on a top of the vertical diaphragm.

Abstract: Provided herein is a vibration-type angular velocity sensor capable of improving detection precision of angular velocities around the Z axis and preventing detection precision of angular velocities around the X and Y axes from deteriorating. A weight 3 is columnar or conic. The outline of an outer peripheral portion of a diaphragm 1 has such shape that a straight portion ST is formed at each of four corner portions of a square. Four vibration exciting electrodes 11 are respectively located in four regions partitioned by a first imaginary line L1 and a second imaginary line L2. Four angular velocity sensing electrodes 13 are respectively located in four regions partitioned by a first imaginary diagonal line CL1 and a second imaginary diagonal line Cl2.

Abstract: Systems, methods, and apparatus for compensation of a sensor are presented. A method is provided that includes determining a response of a sensor. For example, a temperature response of a pressure sensor may be characterized. In an example implementation, the sensor may be coupled to one or more input terminals, for example, that are configured for connecting to an input voltage source. The sensor may also be coupled to one or more configurable resistor networks. The sensor may further be coupled to one or more output terminals configured for providing an output signal. The method further includes determining one or more compensation resistance values for compensating the determined response of the sensor. The method includes selectively configuring, based at least in part on determining the one or more compensation resistance values, the one or more configurable resistor networks for compensating the response of the sensor.

Abstract: A physical quantity sensor includes a diaphragm which is able to be bent and deformed; and a bending amount element, provided in the diaphragm, which outputs a signal based on the amount of bending of the diaphragm. The bending amount element includes a center side element which is provided closer to the center of the diaphragm and an edge portion side element which is provided closer to an edge portion of the diaphragm than the center side element.

Abstract: A pressure sensor includes a pressure sensing element and a top cap. The pressure sensing element includes a bonded wafer substrate having a buried sealed cavity. A wall of the buried sealed cavity forms a sensing diaphragm. One or more sense elements may be supported by the sensing diaphragm and one or more bond pads are supported by the upper side of the bonded wafer substrate. Each of the bond pads may be positioned adjacent to the sensing diaphragm and electrically connected to one or more of the sense elements. The top cap may be secured to the upper side of the bonded wafer substrate such that an aperture in the top cap facilitates passage of a media in a downward direction to the sensing diaphragm. The top cap may be configured to isolate the bond pads from the media.

Abstract: A membrane to compensate for effects on a volume of oil, the membrane is a metal capable of an elastic deformation and having a shape selected to optimize the elastic deformation in a desired manner so as to compensate for the effects on the volume of oil.

Abstract: The invention relates to an auxiliary oil gauge assembly having a body connected to a mechanical oil gauge and to the stock sending unit. The body is configured to allow oil to flow to the mechanical gauge as well as the stock sending unit to facilitate providing both mechanical and electrical oil pressure feedback to the observer. Further, the auxiliary oil gauge assembly is configured to safely mount to the engine block without penetrating the user's leg space. The fastener assembly for mounting the body to the engine is independently rotatable with respect to the body, thus allowing the user to orient the gauge independently of securing the body to the engine.

Abstract: A piezoresistive sensor device and a method for making a piezoresistive device are disclosed. The sensor device comprises a silicon wafer having piezoresistive elements and contacts in electrical communication with the elements. The sensor device further comprises a contact glass coupled to the silicon wafer and having apertures aligned with the contacts. The sensor device also comprises a non-conductive frit for mounting the contact glass to a header glass, and a conductive non-lead glass frit disposed in the apertures and in electrical communication with the contacts. The method for making a piezoresistive sensor device, comprises bonding a contact glass to a silicon wafer such that apertures in the glass line up with contacts on the wafer, and filling the apertures with a non-lead glass frit such that the frit is in electrical communication with the contacts.

Abstract: A miniature pressure transducer is disclosed which is able to operate at high temperatures. The pressure transducer is provided on a substrate comprising an elongate silicon base portion with one or more contact areas formed at one end and a diaphragm formed at the opposite distal end. A plurality of piezoresistive elements are provided on the diaphragm, preferably in a Wheatstone Bridge arrangement, and connected to the contact areas using interconnects. The diaphragm extends across substantially the entire effective width of the elongate base portion providing a compact width while still maintaining a sensitive pressure sensing capability.

Abstract: A fluid pressure sensor package can be easily assembled to have different types of probe tubes depending upon different application environments. The sensor package includes a sealed casing accommodating a sensor chip for sensing a pressure of a fluid introduced into the casing. A probe tube extends from the casing for introducing the fluid into contact with the sensor chip. The casing has a top opening, and has a side wall formed on its interior surface with a stepped shoulder for bearing a flange at the lower end of the probe tube. The flange is sealingly bonded to the sidewall of the casing by a sealer. Since the probe tube is prepared as a separate member from the casing, the casing can be a common base for various probe tubes having fluid channels of different lengths or diameters.

Abstract: A diaphragm is formed at a predetermined location of a sensor chip made of semiconductor material, and a sensor gauge for differential pressure or pressure sensing-use is provided on the sensor chip that includes at least the diaphragm. The sensor gauge has a plurality of sensor gauges synergistically forming a bridge circuit, and are connected to one another with semiconductor resistors, the semiconductor resistors and the sensor gauges are covered with an insulating film, and the number of contact holes, passing through a portion of the insulating film, for electrode line-out use for forming contacts electrically connected to the semiconductor resistors does not exceed the number of sensor gauges.

Abstract: There is described a temperature compensation scheme for a pressure sensitive metal diaphragm transducer. The transducer employs a Wheatstone bridge fabricated from p-type piezoresistors. The Wheatstone bridge is glassed directly onto the metal diaphragm. As the temperature of operation increases, the diaphragm exhibits a temperature variation of the Modulus of Elasticity. The Modulus of the metal diaphragm decreases with increasing temperature. Because of this, the same pressure applied to the metal diaphragm causes it to deflect further, which in turns causes increased strain applied to the bridge. Because of this effect, the sensitivity of the transducer increases with increasing temperature. A resistor is now placed in series with the Wheatstone bridge. The resistor is in series with the biasing voltage and because the TCS of the diaphragm is of an opposite sign, the series resistor has an even higher TCR in series with the bridge.

Abstract: A miniature pressure transducer is disclosed which is able to operate at high temperatures. The pressure transducer is provided on a substrate comprising an elongate silicon base portion with one or more contact areas formed at one end and a diaphragm formed at the opposite distal end. A plurality of piezoresistive elements are provided on the diaphragm, preferably in a Wheatstone Bridge arrangement, and connected to the contact areas using interconnects. The diaphragm extends across substantially the entire effective width of the elongate base portion providing a compact width whilst still maintaining a sensitive pressure sensing capability.

Abstract: A pressure restrictor for use with a pressure sensing element comprising a cylindrical member of a given diameter and length having a plurality of apertures directed from a first end to a second end is disclosed. A pressure restrictor housing holds and positions the cylindrical member in close proximity to the pressure sensing element at the second end by clamping the pressure restrictor between the housing and element. The apertures provided in the pressure restrictor are the sole path for application of pressure to the sensing element. The sensing element is a double diaphragm silicon sensor where one diaphragm is exposed to pressure and the other diaphragm is not exposed to pressure. Each diaphragm has located thereon a half-bridge wherein both half bridges are connected to provide a full bridge. The full bridge provides an output strictly proportional to pressure.

Abstract: A low-pressure transducer including a disc-shaped metal diaphragm to which a fluid pressure is applied, wherein the diaphragm contains a raised beam formed by thinning the entire exterior surface of the diaphragm except for the beam; and at least one silicon strain gage glass bonded to the beam, wherein the low-pressure transducer can accurately gage pressures at least as low as 15 psi. The present invention also comprises a method for manufacturing a pressure transducer including the steps of forming a cylindrical diaphragm having a top surface and a lower surface; establishing a diameter and a thickness of the diaphragm relative to an operational plane by a creating a hole axially through the transducer body that terminates at the lower surface; and creating a raised surface in the shape of a cross beam integral to the operational surface; and bonding one or more strain gages thereupon.

Abstract: An integrated circuit device is provided which comprises a substrate, a conductive line configured to experience a pressure, and a magnetic tunnel junction (“MTJ”) core formed between the substrate and the current line. The conductive line is configured to move in response to the pressure, and carries a current which generates a magnetic field. The MTJ core has a resistance value which varies based on the magnetic field. The resistance of the MTJ core therefore varies with respect to changes in the pressure. The MTJ core is configured to produce an electrical output signal which varies as a function of the pressure.

Abstract: A fluid pressure sensor package can be easily assembled to have different types of probe tubes depending upon different application environments. The sensor package includes a sealed casing accommodating a sensor chip for sensing a pressure of a fluid introduced into the casing. A probe tube extends from the casing for introducing the fluid into contact with the sensor chip. The casing has a top opening, and has a side wall formed on its interior surface with a stepped shoulder for bearing a flange at the lower end of the probe tube. The flange is sealingly bonded to the sidewall of the casing by a sealer. Since the probe tube is prepared as a separate member from the casing, the casing can be a common base for various probe tubes having fluid channels of different lengths or diameters.

Abstract: A diaphragm is formed at a predetermined location of a sensor chip made of semiconductor material, and a sensor gauge for differential pressure or pressure sensing-use is provided on the sensor chip that includes at least the diaphragm. The sensor gauge has a plurality of sensor gauges synergistically forming a bridge circuit, and are connected to one another with semiconductor resistors, the semiconductor resistors and the sensor gauges are covered with an insulating film, and the number of contact holes, passing through a portion of the insulating film, for electrode line-out use for forming contacts electrically connected to the semiconductor resistors does not exceed the number of sensor gauges.

Abstract: A pressure sensor header for a pressure transducer includes a header shell having a sensor cavity formed therein, a sensor element disposed in the sensor cavity, a fluid medium disposed in the sensor cavity, an isolation diaphragm closing the sensor cavity, and a joining arrangement disposed at an interface of the isolation diaphragm and the header shell, the joining arrangement joining the isolation diaphragm with the header shell. The isolation diaphragm is an integral unit comprising a thin membrane surrounded by a thicker outer ring. The joining arrangement has a recessed female joining element formed in one of the outer ring of the isolation diaphragm and the header shell, and a protruding male joining element formed on the other one of the outer ring of the isolation diaphragm and the header shell, the male joining element received in the female joining element.

Abstract: A sensor integrated on a semiconductor device (1), in particular a flow sensor, comprises a measuring element (2) on a membrane (5). In order to prevent a buckling of the membrane (5) a tensile coating (9) is applied. The coating covers the membrane, but it preferably leaves all the active electronic components integrated on the semiconductor chip (1) uncovered, such that their electrical properties are not affected.

Abstract: A pressure sensor header for a pressure transducer includes a header shell having a sensor cavity formed therein, a sensor element disposed in the sensor cavity, a fluid medium disposed in the sensor cavity, an isolation diaphragm closing the sensor cavity, and a joining arrangement disposed at an interface of the isolation diaphragm and the header shell, the joining arrangement joining the isolation diaphragm with the header shell. The isolation diaphragm is an integral unit comprising a thin membrane surrounded by a thicker outer ring. The joining arrangement has a recessed female joining element formed in one of the outer ring of the isolation diaphragm and the header shell, and a protruding male joining element formed on the other one of the outer ring of the isolation diaphragm and the header shell, the male joining element received in the female joining element.