Diaphragm Patents (Class 338/42)
  • Patent number: 10620070
    Abstract: A pressure-sensor device has a component sensitive to pressure, a structure for housing or supporting the pressure-sensitive component, and at least one elastically deformable body that is overmoulded to the housing or supporting structure.
    Type: Grant
    Filed: December 22, 2015
    Date of Patent: April 14, 2020
    Assignee: ELTEK S.p.A.
    Inventors: Costanzo Gadini, Marco Bigliati
  • Patent number: 10591378
    Abstract: A sensor attachment structure of an oil pressure sensor suitable for use as a control valve of an automobile transmission includes a sensor case inserted into an accommodation space of a valve upper body portion such that a body portion of the sensor case is capable of rotating about a vertical central axis. A stopper projects in a horizontal direction from the body portion, the stopper being movable vertically in a guide groove of the accommodation space, and rotatable relative to a restricting portion of the upper body to restrict a vertical movement of the stopper to prevent the oil pressure sensor from falling off the upper body in an operation stage before the oil pressure sensor is fixed in a built-in manner between the upper and lower bodies of the control valve.
    Type: Grant
    Filed: August 2, 2017
    Date of Patent: March 17, 2020
    Assignee: NIDEC TOSOK CORPORATION
    Inventors: Tomoka Osawa, Hironobu Wakabayashi, Toshiaki Nakamura, Hiroshi Tatsuta
  • Patent number: 10317297
    Abstract: A semiconductor pressure sensor for measuring an external pressure exerted on the sensor, including: a membrane; a first resistor connected between a first bias node and a first output node; a second resistor connected between the first bias node and a second output node; a first and second current source connected to the first resp. second output node for generating a differential voltage signal indicative of the external pressure to be measured. The resistors including piezo-resistive strips arranged in particular crystallographic directions. The circuit may have a third and four resistor pair for compensating package stress. The Piezo-resistive strips may be formed as p-doped regions within an n-well, the biasing node being electrically connected to the n-well.
    Type: Grant
    Filed: June 10, 2015
    Date of Patent: June 11, 2019
    Assignee: MELEXIS TECHNOLOGIES NV
    Inventor: Appolonius Jacobus Van Der Wiel
  • Patent number: 10302514
    Abstract: A pressure sensor includes a diaphragm suspended across a cavity in a substrate. A first group of piezoresistors is provided in the diaphragm proximate a first outer edge of the diaphragm, the piezoresistors of the first group being coupled to one another to form a first Wheatstone bridge. A second group of piezoresistors is provided in the diaphragm proximate a second outer edge of the diaphragm, the piezoresistors of the second group being coupled to one another to form a second Wheatstone bridge. The first and second Wheatstone bridges exhibit mirror symmetry relative to one another. Output signals from each of the first and second Wheatstone bridges are processed at respective first and second differential amplifiers. The output signals from each of the first and second differential amplifiers are processed at a third differential amplifier to produce a pressure output signal with enhanced sensitivity and reduced impact from process variation.
    Type: Grant
    Filed: December 18, 2016
    Date of Patent: May 28, 2019
    Assignee: NXP USA, Inc.
    Inventor: Lianjun Liu
  • Patent number: 10065853
    Abstract: A differential pressure sensor is a body with first and second interior channels connected to process fluid inlets and separated by a barrier. Each side of a MEMS pressure sensing diaphragm in the barrier is fluidly connected to a process fluid inlet. The diaphragm is mounted on a hollow pedestal such that one side of the diaphragm is fluidly connected to a process fluid inlet through an interior channel in the pedestal that is adhesively attached to an annular bottom of a cylindrical cavity inside the body. The other side of the diaphragm is fluidly connected to the other process fluid inlet and is fluidly isolated from the first fluid inlet by the adhesive at the bottom of the pedestal. Deformation of the diaphragm due to a pressure difference between the process fluid inlets detected by sensors on the diaphragm indicates a differential pressure.
    Type: Grant
    Filed: May 23, 2016
    Date of Patent: September 4, 2018
    Assignee: Rosemount Aerospace Inc.
    Inventors: Jim Golden, Robert Stuelke
  • Patent number: 9957158
    Abstract: A method for producing a pressure sensor comprises providing a substrate with a depression; attaching a micromechanical sensor element to the substrate in the depression; attaching an evaluation circuit to the substrate next to the depression; electrically connecting the evaluation circuit to the sensor element; covering the substrate around the depression by means of a potting die such that the depression is closed; potting the evaluation circuit between the substrate and the potting die; and removing the potting die.
    Type: Grant
    Filed: January 3, 2017
    Date of Patent: May 1, 2018
    Assignee: ROBERT BOSCH GMBH
    Inventors: Florian Grabmaier, Eckart Schellkes, Timo Lindemann
  • Patent number: 9897502
    Abstract: A pressure transducer comprising a resistive pressure sensor element with a measurement membrane which has at least four resistor elements. The resistor elements are arranged in a full-bridge circuit, having a longitudinal direction in which the full bridge circuit is to be supplied with a constant current. When being supplied with the constant current, a longitudinal voltage has a first pressure dependency and a first temperature dependency, and a diagonal voltage has a second pressure dependency and a second temperature dependency, the second pressure dependency being greater than the first pressure dependency at a given temperature. The pressure transducer has a processing circuit which is designed to determine a measured pressure value at least using the diagonal voltage and optionally the longitudinal voltage.
    Type: Grant
    Filed: August 11, 2014
    Date of Patent: February 20, 2018
    Assignee: Endress + Hauser GmbH + Co. KG
    Inventors: Elmar Wosnitza, Davide Parrotto, Lars Karweck, Ulrich Buder, Olaf Textor
  • Patent number: 9869600
    Abstract: A pressure sensor is provided. The pressure sensor has a differential pressure sensor adapted to measure differential pressure between two differential pressure sensor inputs in a first differential pressure range. The pressure sensor further includes a first absolute pressure sensor and a second absolute pressure sensor adapted to measure an absolute pressure in an absolute pressure range. The pressured sensor is further provided with a measuring unit configured to determine a differential pressure in a second differential pressure range on the basis of absolute pressure measurements taken by the first and second absolute pressure sensors.
    Type: Grant
    Filed: June 4, 2014
    Date of Patent: January 16, 2018
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventor: Kjetil Haldorsen
  • Patent number: 9784633
    Abstract: A differential pressure transmitter is disclosed, which comprises a body for housing a high-pressure sensor and a low-pressure sensor, a plurality of high-pressure process connectors formed in said body and fluidly coupled to said high-pressure sensor for transmitting a first pressure of a process fluid to said high-pressure sensor, each of said high-pressure process connectors comprising a conduit having an opening for receiving the process fluid, a plurality of low-pressure process connectors formed in said body and fluidly coupled to said low-pressure sensor for transmitting a second pressure of a process fluid to said low-pressure sensor, each of said low-pressure process connectors comprising a conduit having an opening for receiving the process fluid, wherein said second pressure is equal to or less than said first pressure, wherein said openings of the high-pressure connectors are spaced relative to said openings of the low-pressure connectors to allow a plurality of pair-wise connections to the proces
    Type: Grant
    Filed: December 2, 2015
    Date of Patent: October 10, 2017
    Assignee: AVGI Engineering, Inc.
    Inventor: George E. Sgourakes
  • Patent number: 9739676
    Abstract: A pressure detecting device is mounted in a measurement target and instrument includes a strain inducer to which pressure of a pressure medium is applied and which generates strain in accordance with the pressure and a strain detecting element that is bonded onto a surface opposite to a pressure receiving surface of the strain inducer, in which the strain detecting element includes one or multiple central strain resistant bridges which are arranged at a central portion of the strain detecting element in a bonded surface direction, and one or multiple outer peripheral strain resistant bridges which are arranged at an outer periphery, and in which, for example, deformation of the strain detecting element caused by an external force when being screw-fixed to the measurement target instrument is obtained through the multiple strain resistant bridges. An error of detection pressure caused by the deformation in a pressure value detected through the central strain resistant bridge is corrected.
    Type: Grant
    Filed: January 29, 2014
    Date of Patent: August 22, 2017
    Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Masayuki Hio, Shinya Igarashi, Shigenobu Komatsu, Junji Onozuka, Kentaro Miyajima
  • Patent number: 9733139
    Abstract: Pressure sensors having vertical diaphragms or membranes. A vertical diaphragm may be located in a first silicon wafer between a first and second cavity, where the first and second cavities are covered by a second silicon wafer. One or more active or passive devices or components may be located on a top of the vertical diaphragm.
    Type: Grant
    Filed: May 2, 2014
    Date of Patent: August 15, 2017
    Assignee: Silicon Microstructures, Inc.
    Inventor: Holger Doering
  • Patent number: 9726490
    Abstract: Provided herein is a vibration-type angular velocity sensor capable of improving detection precision of angular velocities around the Z axis and preventing detection precision of angular velocities around the X and Y axes from deteriorating. A weight 3 is columnar or conic. The outline of an outer peripheral portion of a diaphragm 1 has such shape that a straight portion ST is formed at each of four corner portions of a square. Four vibration exciting electrodes 11 are respectively located in four regions partitioned by a first imaginary line L1 and a second imaginary line L2. Four angular velocity sensing electrodes 13 are respectively located in four regions partitioned by a first imaginary diagonal line CL1 and a second imaginary diagonal line Cl2.
    Type: Grant
    Filed: September 3, 2012
    Date of Patent: August 8, 2017
    Assignee: HOKURIKU ELECTRIC INDUSTRY CO., LTD.
    Inventors: Masahide Tamura, Osamu Kawasaki, Takayuki Nakano, Shouhei Niikawa, Hidekazu Yano, Tetsuji Imamura
  • Patent number: 9709452
    Abstract: Systems, methods, and apparatus for compensation of a sensor are presented. A method is provided that includes determining a response of a sensor. For example, a temperature response of a pressure sensor may be characterized. In an example implementation, the sensor may be coupled to one or more input terminals, for example, that are configured for connecting to an input voltage source. The sensor may also be coupled to one or more configurable resistor networks. The sensor may further be coupled to one or more output terminals configured for providing an output signal. The method further includes determining one or more compensation resistance values for compensating the determined response of the sensor. The method includes selectively configuring, based at least in part on determining the one or more compensation resistance values, the one or more configurable resistor networks for compensating the response of the sensor.
    Type: Grant
    Filed: October 30, 2014
    Date of Patent: July 18, 2017
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Haig Norian, Louis DeRosa, Joseph VanDeWeert
  • Patent number: 9683907
    Abstract: A physical quantity sensor includes a diaphragm which is able to be bent and deformed; and a bending amount element, provided in the diaphragm, which outputs a signal based on the amount of bending of the diaphragm. The bending amount element includes a center side element which is provided closer to the center of the diaphragm and an edge portion side element which is provided closer to an edge portion of the diaphragm than the center side element.
    Type: Grant
    Filed: March 24, 2015
    Date of Patent: June 20, 2017
    Assignee: Seiko Epson Corporation
    Inventors: Junichi Takeuchi, Takuya Kinugawa
  • Patent number: 9470593
    Abstract: A pressure sensor includes a pressure sensing element and a top cap. The pressure sensing element includes a bonded wafer substrate having a buried sealed cavity. A wall of the buried sealed cavity forms a sensing diaphragm. One or more sense elements may be supported by the sensing diaphragm and one or more bond pads are supported by the upper side of the bonded wafer substrate. Each of the bond pads may be positioned adjacent to the sensing diaphragm and electrically connected to one or more of the sense elements. The top cap may be secured to the upper side of the bonded wafer substrate such that an aperture in the top cap facilitates passage of a media in a downward direction to the sensing diaphragm. The top cap may be configured to isolate the bond pads from the media.
    Type: Grant
    Filed: September 12, 2013
    Date of Patent: October 18, 2016
    Assignee: Honeywell International Inc.
    Inventors: Richard A. Davis, Carl Stewart
  • Patent number: 9140618
    Abstract: A membrane to compensate for effects on a volume of oil, the membrane is a metal capable of an elastic deformation and having a shape selected to optimize the elastic deformation in a desired manner so as to compensate for the effects on the volume of oil.
    Type: Grant
    Filed: June 1, 2010
    Date of Patent: September 22, 2015
    Assignee: Schlumberger Technology Corporation
    Inventors: Benoit Deville, Frederic Pauchet
  • Patent number: 9133740
    Abstract: The invention relates to an auxiliary oil gauge assembly having a body connected to a mechanical oil gauge and to the stock sending unit. The body is configured to allow oil to flow to the mechanical gauge as well as the stock sending unit to facilitate providing both mechanical and electrical oil pressure feedback to the observer. Further, the auxiliary oil gauge assembly is configured to safely mount to the engine block without penetrating the user's leg space. The fastener assembly for mounting the body to the engine is independently rotatable with respect to the body, thus allowing the user to orient the gauge independently of securing the body to the engine.
    Type: Grant
    Filed: February 19, 2013
    Date of Patent: September 15, 2015
    Inventor: Loran L. Whittaker
  • Patent number: 8988184
    Abstract: A piezoresistive sensor device and a method for making a piezoresistive device are disclosed. The sensor device comprises a silicon wafer having piezoresistive elements and contacts in electrical communication with the elements. The sensor device further comprises a contact glass coupled to the silicon wafer and having apertures aligned with the contacts. The sensor device also comprises a non-conductive frit for mounting the contact glass to a header glass, and a conductive non-lead glass frit disposed in the apertures and in electrical communication with the contacts. The method for making a piezoresistive sensor device, comprises bonding a contact glass to a silicon wafer such that apertures in the glass line up with contacts on the wafer, and filling the apertures with a non-lead glass frit such that the frit is in electrical communication with the contacts.
    Type: Grant
    Filed: July 8, 2013
    Date of Patent: March 24, 2015
    Assignee: Kulite Semiconductor Products, Inc.
    Inventor: Nora Kurtz
  • Patent number: 8183975
    Abstract: A miniature pressure transducer is disclosed which is able to operate at high temperatures. The pressure transducer is provided on a substrate comprising an elongate silicon base portion with one or more contact areas formed at one end and a diaphragm formed at the opposite distal end. A plurality of piezoresistive elements are provided on the diaphragm, preferably in a Wheatstone Bridge arrangement, and connected to the contact areas using interconnects. The diaphragm extends across substantially the entire effective width of the elongate base portion providing a compact width while still maintaining a sensitive pressure sensing capability.
    Type: Grant
    Filed: September 22, 2009
    Date of Patent: May 22, 2012
    Assignee: GE Infrastructure Sensing, Inc.
    Inventors: Russell Craddock, James Anthony King
  • Patent number: 8022806
    Abstract: A fluid pressure sensor package can be easily assembled to have different types of probe tubes depending upon different application environments. The sensor package includes a sealed casing accommodating a sensor chip for sensing a pressure of a fluid introduced into the casing. A probe tube extends from the casing for introducing the fluid into contact with the sensor chip. The casing has a top opening, and has a side wall formed on its interior surface with a stepped shoulder for bearing a flange at the lower end of the probe tube. The flange is sealingly bonded to the sidewall of the casing by a sealer. Since the probe tube is prepared as a separate member from the casing, the casing can be a common base for various probe tubes having fluid channels of different lengths or diameters.
    Type: Grant
    Filed: August 19, 2008
    Date of Patent: September 20, 2011
    Assignee: Panasonic Electric Works Co., Ltd.
    Inventors: Kazuaki Nishimura, Naoki Yahata
  • Patent number: 7808365
    Abstract: A diaphragm is formed at a predetermined location of a sensor chip made of semiconductor material, and a sensor gauge for differential pressure or pressure sensing-use is provided on the sensor chip that includes at least the diaphragm. The sensor gauge has a plurality of sensor gauges synergistically forming a bridge circuit, and are connected to one another with semiconductor resistors, the semiconductor resistors and the sensor gauges are covered with an insulating film, and the number of contact holes, passing through a portion of the insulating film, for electrode line-out use for forming contacts electrically connected to the semiconductor resistors does not exceed the number of sensor gauges.
    Type: Grant
    Filed: February 21, 2008
    Date of Patent: October 5, 2010
    Assignee: Yamatake Corporation
    Inventors: Hirofumi Tojo, Masayuki Yoneda, Tomohisa Tokuda
  • Publication number: 20100199775
    Abstract: There is described a temperature compensation scheme for a pressure sensitive metal diaphragm transducer. The transducer employs a Wheatstone bridge fabricated from p-type piezoresistors. The Wheatstone bridge is glassed directly onto the metal diaphragm. As the temperature of operation increases, the diaphragm exhibits a temperature variation of the Modulus of Elasticity. The Modulus of the metal diaphragm decreases with increasing temperature. Because of this, the same pressure applied to the metal diaphragm causes it to deflect further, which in turns causes increased strain applied to the bridge. Because of this effect, the sensitivity of the transducer increases with increasing temperature. A resistor is now placed in series with the Wheatstone bridge. The resistor is in series with the biasing voltage and because the TCS of the diaphragm is of an opposite sign, the series resistor has an even higher TCR in series with the bridge.
    Type: Application
    Filed: February 6, 2009
    Publication date: August 12, 2010
    Applicant: Kulite Semiconductor Products, Inc.
    Inventors: Anthony D. Kurtz, Joseph Van DeWeert, Boaz Kochman
  • Publication number: 20100073123
    Abstract: A miniature pressure transducer is disclosed which is able to operate at high temperatures. The pressure transducer is provided on a substrate comprising an elongate silicon base portion with one or more contact areas formed at one end and a diaphragm formed at the opposite distal end. A plurality of piezoresistive elements are provided on the diaphragm, preferably in a Wheatstone Bridge arrangement, and connected to the contact areas using interconnects. The diaphragm extends across substantially the entire effective width of the elongate base portion providing a compact width whilst still maintaining a sensitive pressure sensing capability.
    Type: Application
    Filed: September 22, 2009
    Publication date: March 25, 2010
    Inventors: Russell CRADDOCK, James Anthony King
  • Patent number: 7584665
    Abstract: A pressure restrictor for use with a pressure sensing element comprising a cylindrical member of a given diameter and length having a plurality of apertures directed from a first end to a second end is disclosed. A pressure restrictor housing holds and positions the cylindrical member in close proximity to the pressure sensing element at the second end by clamping the pressure restrictor between the housing and element. The apertures provided in the pressure restrictor are the sole path for application of pressure to the sensing element. The sensing element is a double diaphragm silicon sensor where one diaphragm is exposed to pressure and the other diaphragm is not exposed to pressure. Each diaphragm has located thereon a half-bridge wherein both half bridges are connected to provide a full bridge. The full bridge provides an output strictly proportional to pressure.
    Type: Grant
    Filed: January 14, 2005
    Date of Patent: September 8, 2009
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Anthony D. Kurtz, Elias Geras
  • Publication number: 20090212899
    Abstract: A low-pressure transducer including a disc-shaped metal diaphragm to which a fluid pressure is applied, wherein the diaphragm contains a raised beam formed by thinning the entire exterior surface of the diaphragm except for the beam; and at least one silicon strain gage glass bonded to the beam, wherein the low-pressure transducer can accurately gage pressures at least as low as 15 psi. The present invention also comprises a method for manufacturing a pressure transducer including the steps of forming a cylindrical diaphragm having a top surface and a lower surface; establishing a diameter and a thickness of the diaphragm relative to an operational plane by a creating a hole axially through the transducer body that terminates at the lower surface; and creating a raised surface in the shape of a cross beam integral to the operational surface; and bonding one or more strain gages thereupon.
    Type: Application
    Filed: February 27, 2009
    Publication date: August 27, 2009
    Applicant: Measurement Specialties, Inc.
    Inventor: Chris Gross
  • Patent number: 7547480
    Abstract: An integrated circuit device is provided which comprises a substrate, a conductive line configured to experience a pressure, and a magnetic tunnel junction (“MTJ”) core formed between the substrate and the current line. The conductive line is configured to move in response to the pressure, and carries a current which generates a magnetic field. The MTJ core has a resistance value which varies based on the magnetic field. The resistance of the MTJ core therefore varies with respect to changes in the pressure. The MTJ core is configured to produce an electrical output signal which varies as a function of the pressure.
    Type: Grant
    Filed: October 28, 2005
    Date of Patent: June 16, 2009
    Assignee: Everspin Technologies, Inc.
    Inventors: Young Sir Chung, Robert W. Baird, Bradley N. Engel
  • Publication number: 20090051479
    Abstract: A fluid pressure sensor package can be easily assembled to have different types of probe tubes depending upon different application environments. The sensor package includes a sealed casing accommodating a sensor chip for sensing a pressure of a fluid introduced into the casing. A probe tube extends from the casing for introducing the fluid into contact with the sensor chip. The casing has a top opening, and has a side wall formed on its interior surface with a stepped shoulder for bearing a flange at the lower end of the probe tube. The flange is sealingly bonded to the sidewall of the casing by a sealer. Since the probe tube is prepared as a separate member from the casing, the casing can be a common base for various probe tubes having fluid channels of different lengths or diameters.
    Type: Application
    Filed: August 19, 2008
    Publication date: February 26, 2009
    Inventors: Kazuaki Nishimura, Naoki Yahata
  • Publication number: 20080204185
    Abstract: A diaphragm is formed at a predetermined location of a sensor chip made of semiconductor material, and a sensor gauge for differential pressure or pressure sensing-use is provided on the sensor chip that includes at least the diaphragm. The sensor gauge has a plurality of sensor gauges synergistically forming a bridge circuit, and are connected to one another with semiconductor resistors, the semiconductor resistors and the sensor gauges are covered with an insulating film, and the number of contact holes, passing through a portion of the insulating film, for electrode line-out use for forming contacts electrically connected to the semiconductor resistors does not exceed the number of sensor gauges.
    Type: Application
    Filed: February 21, 2008
    Publication date: August 28, 2008
    Applicant: Yamatake Corporation
    Inventors: Hirofumi Tojo, Masayuki Yoneda, Tomohisa Tokuda
  • Patent number: 7212096
    Abstract: A pressure sensor header for a pressure transducer includes a header shell having a sensor cavity formed therein, a sensor element disposed in the sensor cavity, a fluid medium disposed in the sensor cavity, an isolation diaphragm closing the sensor cavity, and a joining arrangement disposed at an interface of the isolation diaphragm and the header shell, the joining arrangement joining the isolation diaphragm with the header shell. The isolation diaphragm is an integral unit comprising a thin membrane surrounded by a thicker outer ring. The joining arrangement has a recessed female joining element formed in one of the outer ring of the isolation diaphragm and the header shell, and a protruding male joining element formed on the other one of the outer ring of the isolation diaphragm and the header shell, the male joining element received in the female joining element.
    Type: Grant
    Filed: June 14, 2004
    Date of Patent: May 1, 2007
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Anthony D. Kurtz, Adam Kane
  • Patent number: 7154372
    Abstract: A sensor integrated on a semiconductor device (1), in particular a flow sensor, comprises a measuring element (2) on a membrane (5). In order to prevent a buckling of the membrane (5) a tensile coating (9) is applied. The coating covers the membrane, but it preferably leaves all the active electronic components integrated on the semiconductor chip (1) uncovered, such that their electrical properties are not affected.
    Type: Grant
    Filed: December 20, 2001
    Date of Patent: December 26, 2006
    Assignee: Sensirion AG
    Inventors: Ralph Steiner Vanha, Tommaso Francesco Cliento
  • Publication number: 20040135666
    Abstract: A pressure sensor header for a pressure transducer includes a header shell having a sensor cavity formed therein, a sensor element disposed in the sensor cavity, a fluid medium disposed in the sensor cavity, an isolation diaphragm closing the sensor cavity, and a joining arrangement disposed at an interface of the isolation diaphragm and the header shell, the joining arrangement joining the isolation diaphragm with the header shell. The isolation diaphragm is an integral unit comprising a thin membrane surrounded by a thicker outer ring. The joining arrangement has a recessed female joining element formed in one of the outer ring of the isolation diaphragm and the header shell, and a protruding male joining element formed on the other one of the outer ring of the isolation diaphragm and the header shell, the male joining element received in the female joining element.
    Type: Application
    Filed: January 9, 2003
    Publication date: July 15, 2004
    Inventors: Anthony D. Kurtz, Adam Kane
  • Patent number: 6725514
    Abstract: A method of making a low-cost metal diaphragm sensor that integrates both pressure and temperature sensing in a single sensor assembly utilizes thick-film processing to form a circuit including stress and temperature sensitive elements on the outboard or exposed surface of a thin metal diaphragm separating the circuit from a pressurized fluid. Only a thin layer of dielectric separates the stress and temperature sensitive elements from the diaphragm surface. The stress sensitive elements respond to mechanical stressing of the diaphragm due to the presence of the pressurized fluid, while the temperature sensitive element responds to the temperature of the pressurized fluid. The thermal capacity of the fluid greatly exceeds that of the diaphragm, so that the temperature responsive characteristic of the temperature sensitive element accurately reflects the temperature of the pressurized fluid.
    Type: Grant
    Filed: May 31, 2002
    Date of Patent: April 27, 2004
    Assignee: Delphi Technologies, Inc.
    Inventors: James I. Moyer, Joseph M. Ratell
  • Patent number: 6700473
    Abstract: A dielectrically isolated temperature compensated pressure transducer including: a wafer including a deflectable diaphragm formed therein, the diaphragm being capable of deflecting in response to an applied pressure, and the diaphragm defining an active region surrounded by an inactive region of the wafer; a plurality of dielectrically isolated piezoresistive elements formed on the active region of the wafer and coupled together to form a Wheatstone bridge configuration so as to cooperatively provide an output signal in response to and indicative of an amount of deflection of the diaphragm, the plurality of piezoresistive elements being undesirably operative to introduce an undesirable error into the output according to exposure of the wafer to an environmental condition; and, a dielectrically isolated resistor formed on the inactive region of the wafer and electrically coupled in series to the plurality of piezoresistive elements so as to at least partially compensate for the undesirable error.
    Type: Grant
    Filed: February 14, 2000
    Date of Patent: March 2, 2004
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Anthony D. Kurtz, Andrew V. Bemis, Joseph VanDeWeert
  • Patent number: 6675655
    Abstract: A process transmitter for measuring a process pressure includes a pressure sensor in a sensor housing. An isolation diaphragm which isolates fill fluid from process fluid is spaced apart from a process fluid seal. The spacing reduces deformation of the isolation diaphragm due to a mounting force.
    Type: Grant
    Filed: March 21, 2002
    Date of Patent: January 13, 2004
    Assignee: Rosemount Inc.
    Inventors: David A. Broden, Debra K. Zeller
  • Patent number: 6595066
    Abstract: A leadless sensor of the type employing a p+ rim which surrounds contact areas, each contact area defined by a metallized portion surrounded by a p+ semiconductor material, which p+ semiconductor materials or fingers are coupled to an active sensor array. The leadless sensor is bonded to a first glass cover member having two slotted apertures which communicate with the active regions of the sensor area on the underside and a top glass contact member which has two slotted regions which communicate with the piezoresistive sensors on the top side of the semiconductor wafer. The glass contact member has a series of corner through holes which are congruent with the contact terminals associated with the semiconductor sensor and which through holes are filled with a glass metal frit to enable contact to be made to the contact terminals of the semiconductor sensor.
    Type: Grant
    Filed: April 5, 2002
    Date of Patent: July 22, 2003
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Anthony D. Kurtz, Alexander A. Ned
  • Patent number: 6577224
    Abstract: An oil filled pressure transducer of the type employing a metal diaphragm has a diaphragm of a greater thickness than a conventional diaphragm. The thick diaphragm exhibits and accommodates extremely large pressures and deflects to cause a lower pressure to be transmitted to the oil. Because of the large thickness of the metal diaphragm, the diaphragm dissipates a predetermined percentage of the applied pressure, whereas a corresponding fraction of the applied pressure is transmitted to the oil and hence to the silicon sensors. In this manner the diaphragm acts as a step-down transformer where a portion of the force or pressure applied to the diaphragm is transmitted to the pressure sensor. The pressure sensor receives a pressure which is a fraction of the applied pressure and the sensor is compensated to produce an output proportional to the actual pressure as applied to the thick diaphragm.
    Type: Grant
    Filed: March 22, 2001
    Date of Patent: June 10, 2003
    Assignee: Kulite Semiconductor Products, Inc.
    Inventor: Anthony D. Kurtz
  • Patent number: 6570485
    Abstract: A transducer packaging assembly for use in a sensing unit subjected to high forces of acceleration includes a base having a cavity. A pressure sensitive semiconductor die is bonded to a large backplate having a shape so that it nestles into the cavity but is spaced from a surface of the cavity. A planar cover secured to the base has a hole larger than the die but smaller than the backplate, and thin wires extend from the die to electrical connections on the assembly. A viscous fluid fills a space between the backplate and the cavity, and a space between the backplate and the cover, and transmits a pressure to be measured to the pressure sensitive die. The viscous fluid has a sufficiently high viscosity to oppose movement of the backplate relative to the cavity while cushioning the pressure sensitive die and the backplate from forces of acceleration.
    Type: Grant
    Filed: November 17, 2000
    Date of Patent: May 27, 2003
    Assignee: Honeywell International Inc.
    Inventors: Thomas G. Stratton, Terrence D. Bender, Joel J. Bodin, Reinhart Ciglenec, Frank F. Espinosa, Edgar R. Mallison
  • Patent number: 6538554
    Abstract: Resistors for use in electrical circuits are formed of an alloy comprising from about 50 to about 95 mol percent aluminum, from about 5 to about 50 mol percent titanium and up to about 15 mol percent of at least one additional metal or a combination of two or more additional metals.
    Type: Grant
    Filed: April 17, 1998
    Date of Patent: March 25, 2003
    Inventors: Robert E. Berger, II, Binod Kumar
  • Publication number: 20020135456
    Abstract: An oil filled pressure transducer of the type employing a metal diaphragm has a diaphragm of a greater thickness than a conventional diaphragm. The thick diaphragm exhibits and accommodates extremely large pressures and deflects to cause a lower pressure to be transmitted to the oil. Because of the large thickness of the metal diaphragm, the diaphragm dissipates a predetermined percentage of the applied pressure, whereas a corresponding fraction of the applied pressure is transmitted to the oil and hence to the silicon sensors. In this manner the diaphragm acts as a step-down transformer where a portion of the force or pressure applied to the diaphragm is transmitted to the pressure sensor. The pressure sensor receives a pressure which is a fraction of the applied pressure and the sensor is compensated to produce an output proportional to the actual pressure as applied to the thick diaphragm.
    Type: Application
    Filed: March 22, 2001
    Publication date: September 26, 2002
    Inventor: Anthony D. Kurtz
  • Patent number: 6313729
    Abstract: A semiconductor component is fashioned of a chip carrier comprising an approximately planar chip carrier surface on which chip carrier surface a semiconductor chip with a pressure sensor is secured, and composed of electrode terminals penetrating the chip carrier and electrically connected to the semiconductor chip, with a surface-mounted arrangement. The chip overlapping the chip carrier.
    Type: Grant
    Filed: November 2, 1998
    Date of Patent: November 6, 2001
    Assignee: Siemens Aktiengesellschaft
    Inventors: Jürgen Winterer, Gottfried Beer
  • Publication number: 20010030596
    Abstract: A protective construction for a piezo-resistive silicon pressure transducer intended for connection to a pressure source that exhibits pressure transients. The construction includes the transducer, a conduit for providing pressure communication between the pressure source and the transducer and a flow restrictive device positioned within the conduit.
    Type: Application
    Filed: December 8, 2000
    Publication date: October 18, 2001
    Inventor: William J. Barbier
  • Publication number: 20010002119
    Abstract: The invention relates to a method of producing a pressure sensor component with a chip carrier which has a substantially planar chip carrier surface and a semiconductor chip with an integrated pressure sensor on the chip carrier surface.
    Type: Application
    Filed: January 17, 2001
    Publication date: May 31, 2001
    Applicant: Siemens Aktiengesellschaft
    Inventors: Jurgen Winterer, Eric Bootz, Bernd Stadler, Achim Neu, Thies Janczek
  • Patent number: 6229427
    Abstract: A method for sealing a transducer of a type having a diaphragm with an active region and an inactive region, a stress sensing network associated with the active region of the diaphragm, contacts associated with the inactive region of the diaphragm, and lead-outs for coupling the stress sensing network to the contacts. The method comprises oxidizing the transducer to provide a first oxide layer which covers the diaphragm, the stress sensing network, the lead-outs and the contacts. Next, a layer of semiconductive material is deposited over the first oxide layer and is then planarized to provide a planar surface having a substantially flat and bondable surface. Finally, a cover member is bonded to the planar surface of the layer which covers the inactive region of the diaphragm to hermetically seal the stress sensing network and thereby provide a sealed transducer.
    Type: Grant
    Filed: July 21, 1997
    Date of Patent: May 8, 2001
    Assignee: Kulite Semiconductor Products Inc.
    Inventors: Anthony D. Kurtz, Alexander A. Ned
  • Patent number: 6214634
    Abstract: A sensor device (20) comprises a sensor package (22) having a cavity (24) formed therein, a sensor die (26) mounted on a bottom surface (28) of the cavity (24) and a protective coating (30) formed over the sensor die in the cavity. The protective coating (30) is formed from a material, preferably a polymer material, which is arranged to have a graduated cross-linking density such that the material at the top of the cavity (24) has a high density of cross-linking and the material at the bottom of the cavity (24), which material is in contact with the sensor die, has a low density of cross-linking.
    Type: Grant
    Filed: February 7, 2000
    Date of Patent: April 10, 2001
    Assignee: Motorola, Inc.
    Inventors: Marc Osajda, Eric Perraud
  • Patent number: 6211772
    Abstract: A semiconductor composite sensor using a plurality of semiconductor piezoresistive gauge elements connected in series. The piezoresistive elements are separated so that a high potential terminal of one of the resistive elements having the same resistance values and the substrate of the other of the resistive elements will be connected with equal potential values. Potential difference values between semiconductor regions serving as respective resistive elements and the substrates are made equal.
    Type: Grant
    Filed: September 5, 1997
    Date of Patent: April 3, 2001
    Assignee: Hitachi, Ltd.
    Inventors: Susumu Murakami, Satoshi Shimada, Seiichi Ugai, Yukio Takahashi, Shuichi Shimizu
  • Patent number: 6201467
    Abstract: The pressure sensor component has a chip carrier with an approximately planar chip carrier surface. A semiconductor chip with an integrated pressure sensor is placed on the chip carrier surface. A pressure-detecting surface area of the pressure sensor is exposed to a pressure to be measured. The component is encapsulated with electrically insulating material that encloses the semiconductor chip and/or the chip carrier at least in regions. A chimney-shaped connection piece that projects up relative to the pressure-detecting area of the pressure sensor penetrates through the encapsulation and is connected to the pressure sensor. The connection piece, which is a separate structural element is incorporated in the component encapsulation and it encloses at least the pressure-detecting surface area in a pressure-tight manner with its end bearing on the semiconductor chip. The connection piece is open toward the outside at its opposite end so as to expose the pressure sensor to the pressure to be measured.
    Type: Grant
    Filed: August 25, 1999
    Date of Patent: March 13, 2001
    Assignee: Infineon Technologies AG
    Inventors: Jürgen Winterer, Eric Bootz, Bernd Stadler, Achim Neu, Thies Janczek
  • Patent number: 6198379
    Abstract: A circuit arrangement implemented as an integrated semiconductor component has a measured value acquisition circuit that can be connected to an analysis circuit, in particular a piezoresistive measuring bridge containing piezoresistive measuring shunts diffused on a semiconductor substrate. The piezoresistive measuring shunts are connected to metallic terminal contacts by diffused terminal resistors having a negligible piezoresistive resistance. To avoid terminal-related offset errors on the measuring shunts in particular, the terminal resistors are designed as identical, elongated, generally curved area structures that taper toward the front end and are connected to a measuring shunt on the front end and to a metallic terminal contact on the opposite end.
    Type: Grant
    Filed: June 11, 1998
    Date of Patent: March 6, 2001
    Assignee: Robert Bosch GmbH
    Inventor: Oliver Schatz
  • Patent number: 6184774
    Abstract: The object of the present invention is to obtain high-precision semiconductor pressure detecting devices without unevenness in gauge resistance values. When a recrystal silicone film 23 is formed by use of laser, a crystal subgrain boundary 27 generates, and crystal fault is included in (100) direction. A metallic wiring 51 of aluminum or gold is arranged on said crystal subgrain boundary 27 crossing a gauge resistance 3A. The current running through a gauge resistance formed by said recrystal silicone film 23 runs into said metallic wiring 51 at the portion of said crystal subgrain boundary 27. Therefore, the current running through said gauge resistance is unlikely to be affected by crystal fault. High-precision and high-sensitivity semiconductor pressure detecting devices are realized with reduced affection by crystal fault.
    Type: Grant
    Filed: May 15, 1995
    Date of Patent: February 6, 2001
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Takanobu Takeuchi
  • Patent number: 6177727
    Abstract: A semiconductor component (31) and a method for coupling a semiconductor device (36) to a substrate (81). The semiconductor component (31) includes a saddle (34) and the semiconductor device (36). The saddle (34) has a plurality of sides (51, 52, 53, 54, 55) that form a semiconductor device receiving area (58). The semiconductor device (36) is inserted into the semiconductor device receiving area (58) and secured in the semiconductor device receiving area (58) using tabs (66, 67). The saddle (34) is coupled to the substrate (81) by fasteners (82,83).
    Type: Grant
    Filed: May 1, 1998
    Date of Patent: January 23, 2001
    Assignee: Motorola, Inc.
    Inventors: John W. Hart, Jr., William G. McDonald, Daniel John Wallace, Jr.
  • Patent number: 6150917
    Abstract: A piezoresistive pressure sensor (30) has four resistive diffused regions (32) coupled into a bridge configuration (33) with four junctions (36) and four inside corners (40). Each of the diffused regions has a first end connected to one of the four junctions and a second end connected to a different one of the four junctions. There are four contact diffusion terminals (34) disposed in contact with the bridge configuration, and each of the diffusion terminals is disposed at one of the four junctions such that the diffused regions are electrically connected essentially only by the contact diffusion terminals and an overlap (44, 46) is provided between each of the diffusion terminals and the inside corners to accommodate mask misalignment during manufacture. Thus, no tap is required to electrically connect the contact diffusion terminals to the resistive diffused regions of the bridge, which results in increased sensor sensitivity.
    Type: Grant
    Filed: February 27, 1995
    Date of Patent: November 21, 2000
    Assignee: Motorola, Inc.
    Inventors: Brian D. Meyer, Ira E. Baskett