Antenna Embedded, Potted, Or Coated Patents (Class 343/873)
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Publication number: 20100156750Abstract: A feeding structure of a housing with an antenna, in which a flat antenna can be attached inconspicuously to the outer surface of the housing which is hard to be affected by a metal component and power can be supplied to the flat antenna without providing a through hole causing inferior appearance. The feeding structure of the housing with an antenna comprises a housing 2, a decorative film 3 covering at least a part of the outer wall face of the housing 2, a flat antenna 6 held between the outer wall face of the housing 2 and the decorative film 3, and an electrode 7 provided on the inner wall face of the housing 2. In the feeding structure, a capacitor is formed by arranging a feeding part 6a of the flat antenna 6 and the electrode 7 opposite to each other in both faces of the housing 2 and power transmission and communication are performed in a noncontact manner for the flat antenna 6 on the outside of the housing 2 from the inside of the housing 2 by connecting an inductor 8 with the electrode 7.Type: ApplicationFiled: February 19, 2007Publication date: June 24, 2010Inventors: Tatsuo Ishibashi, Shuzo Okumura
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Publication number: 20100149047Abstract: A portable terminal includes a non-conductive resin chassis that is formed by molding a molding material and internally provided with a printed circuit board on which a wireless circuit is formed, and an antenna pattern that is disposed on a wall surface of the chassis and in a region excluding a eject pin track formed when the chassis electrically connected with the printed circuit board is formed, wherein the antenna pattern is constituted by sequentially laminating a copper layer, a nickel layer and a gold layer by electroless plating, and the nickel layer is rendered amorphous.Type: ApplicationFiled: July 30, 2009Publication date: June 17, 2010Applicant: KABUSHIKI KAISHA TOSHIBAInventor: Akihiro Tsujimura
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Publication number: 20100149050Abstract: The present invention relates to an antenna device comprising a dielectric carrier, a flexible film and a radiating element, wherein the flexible film is arranged on the dielectric carrier and the radiating element is arranged between the dielectric carrier and the flexible film.Type: ApplicationFiled: April 29, 2008Publication date: June 17, 2010Applicant: Laird Technologies ABInventors: Torsten Östervall, Ulf Palin
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Patent number: 7737908Abstract: A disclosed antenna apparatus includes: a punched out antenna element made of a sheet metal; a punched out ground element made of a sheet metal, the ground element facing the antenna element; and a surface mount type coaxial connector mounted across the antenna element and the ground element.Type: GrantFiled: October 17, 2006Date of Patent: June 15, 2010Assignee: Fujitsu Component LimitedInventors: Masahiro Yanagi, Shigemi Kurashima, Hideki Iwata, Takashi Yuba, Masahiro Kaneko, Yuriko Segawa, Takashi Arita, Toshihiro Kusagaya, Kazuhiko Ikeda, Hiroshi Matsumiya, Kazuo Nomura
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Patent number: 7733272Abstract: An antenna apparatus is disclosed that includes an element member made of sheet metal, a ground member made of sheet metal, and a connection part that is integrally formed with the element member and the ground member.Type: GrantFiled: January 24, 2007Date of Patent: June 8, 2010Assignee: Fujitsu Component LimitedInventors: Shigemi Kurashima, Takashi Yuba, Hideki Iwata, Masahiro Yanagi, Takashi Arita, Toshihiro Kusagaya
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Patent number: 7733281Abstract: A method of installing multiple over-the-air antennas is disclosed. The method includes the steps of mounting a satellite antenna to a installation surface, such that the mounting allows the satellite antenna to be aimed at a satellite, attaching a broadband access antenna to one of the installation surface and a portion of the satellite antenna, such that the attaching allows the broadband access antenna to be aimed at a broadband access source, connecting first wiring from the broadband access antenna to a first downconverter and second wiring from the satellite antenna to a second downconverter, providing outputs of the first and second downconverters to a cable in communication with at least a satellite receiver and positioning, on at least a coarse scale, the satellite antenna and the broadband access antenna such that they are approximately pointed at the satellite and the broadband access source, respectively.Type: GrantFiled: September 10, 2004Date of Patent: June 8, 2010Assignee: Broadcom CorporationInventors: Jeyhan Karaoguz, James Bennett
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Patent number: 7733291Abstract: According to various aspects, exemplary embodiments are provided of antenna radial systems. In one exemplary embodiment, an antenna radial system generally includes a washer having a channel disposed along a first side of the washer. A radial includes a locking portion configured to be received within the channel. The radial also includes elongate portions extending outwardly from the locking portion such that an angle is defined between each elongate portion and the locking portion. A bushing cooperates with the washer for sandwiching the radial's locking portion therebetween to thereby help retain the radial's locking portion within the channel.Type: GrantFiled: October 12, 2007Date of Patent: June 8, 2010Assignee: Laird Technologies, Inc.Inventor: Imad M. Swais
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Publication number: 20100134380Abstract: An antenna device disposed in an electronic device which has a housing and a control circuit includes a metallic antenna, a carrier film and a plastic base. The metallic antenna is electrically connected with the control circuit for receiving and sending a signal. The carrier film bears the metallic antenna on one surface thereof. The plastic base is integrated with the assembly of the metallic antenna and the carrier film with the metallic antenna and sandwiched between the carrier film and the plastic base. The antenna device prevents the antenna from the wear and tear normally encountered during everyday use.Type: ApplicationFiled: December 1, 2008Publication date: June 3, 2010Applicant: CHENG UEI PRECISION INDUSTRY CO., LTD.Inventors: Chao-Hui Yu, Hung-Jen Chen, Yu-Yuan Wu
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Patent number: 7720544Abstract: A system for enabling telemetry in implantable medical devices is provided. One aspect of this disclosure relates to an implantable medical device having radio-frequency telemetry capabilities. The device includes a housing and electronic circuitry contained within the housing. The device also includes an antenna connected to the electronic circuitry, the antenna having a helical portion and a whip portion, the whip portion separate from a feed conductor and adapted to enhance a radiation pattern of the antenna. According to various embodiments, the antenna and circuitry are adapted to facilitate transmission and reception of modulated radio-frequency energy at a specified carrier frequency. At least a portion of the antenna is embedded in a dielectric compartment, according to various embodiments. Other aspects and embodiments are provided herein.Type: GrantFiled: June 9, 2006Date of Patent: May 18, 2010Assignee: Cardiac Pacemakers, Inc.Inventors: Timothy J. Christman, Jason J. Edwardson, Bart A. Carey
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Publication number: 20100114245Abstract: An antenna for an implantable medical device (IMD) is provided that is formed on the same substrate as the telemetry circuitry for the IMD. The telemetry circuitry is formed on a portion of the substrate within the interior of a housing for the IMD, while at least one antenna is formed on an exterior portion of the substrate on the exterior of the housing to allow for far field telemetry. At least one electrical interconnect is formed on the substrate for connecting the antenna to the telemetry circuitry, where the electrical interconnect may comprise a controlled impedance line to minimize loss. A conformally-shaped hermetic cover, such as a ceramic material, may be formed in a desired shape around the exterior portion of the substrate and antenna and cofired together to form a monolithic structure encasing the antenna and exterior portion of the substrate.Type: ApplicationFiled: December 19, 2008Publication date: May 6, 2010Inventors: Joyce K. Yamamoto, Quentin Scott Denzene, Michael William Barror
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Publication number: 20100090925Abstract: A method is provided for adding an RF powder to a sheet-like object having a high property value, such as a variety of cards, paper money, and securities. The RF powder makes it very difficult to produce, for example, counterfeit cards, documents and bills. Also, an RF powder-added base sheet to which the RF powder has been added is provided. In the method for adding the RF powder, the RF powder includes a plurality of RF powder particles 11 and is disposed on a surface of a base sheet 10 to add the RF powder to the base sheet. Each RF powder particle 11 has a magnetic field coupling circuit element in a high frequency magnetic field having a specific frequency. The RF powder is disposed on a surface of a base sheet by a printing technique. The RF powder-added base sheet 10 includes an RF powder including a plurality of RF powder particles 11 disposed within a printed object on a surface of a base sheet.Type: ApplicationFiled: November 26, 2007Publication date: April 15, 2010Inventors: Yuji Furumura, Naomi Mura, Shinji Nishihara, Katsuhiro Fujino, Katsuhiko Mishima, Susumu Kamihashi
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Publication number: 20100073255Abstract: According to an exemplary embodiment, an overmolded semiconductor package includes at least one semiconductor die situated over a package substrate. The overmolded semiconductor package further includes a mold compound overlying the at least one semiconductor die and the package substrate. The overmolded semiconductor package further includes a conductive layer situated on an outer surface of the mold compound and having an opening. The overmolded semiconductor package further includes an antenna feed line situated in the mold compound and having a portion exposed in the opening in the conductive layer, thereby providing an antenna input on the outer surface of the mold compound.Type: ApplicationFiled: September 25, 2008Publication date: March 25, 2010Applicant: SKYWORKS SOLUTIONS, INC.Inventors: Thomas Noll, Gye-An Lee
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Patent number: 7671809Abstract: Disclosed is an antenna device for transceiving a wireless signal with an ion-implanted antenna pattern implanted inside a casing of an electronic device. The ion-implanted antenna pattern is connected to an antenna module of a motherboard of the electronic device in order to feed the wireless signal transceived by the ion-implanted antenna pattern, while the connection could be either by an antenna signal feeding line connected to the ion-implanted antenna pattern and the antenna module, or by an antenna coupling element coupled with the ion-implanted antenna pattern and connected to an antenna signal feeding line.Type: GrantFiled: April 17, 2006Date of Patent: March 2, 2010Assignee: Getac Technology CorporationInventors: Yu-Chiang Cheng, Ping-Cheng Chang, Cheng-Zing Chou
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Patent number: 7667664Abstract: The present invention provides an embedded antenna. It is to form meanders on a radiating element of the embedded antenna for dividing the resonant length of the radiating element into several short resonant length to extend the bandwidth of the radiating element. It is also to form meanders on the radiating element to extend the resonant length. This design can minimize the size of the embedded antenna and achieve the same as performance of a larger size antenna.Type: GrantFiled: January 8, 2008Date of Patent: February 23, 2010Assignee: Arcadyan Technology CorporationInventor: Wen-Szu Tao
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Publication number: 20100039347Abstract: A housing, functioning as an antenna includes an antenna base including two protruding flanges. The housing is formed by injection molding a molten plastic material over and around the antenna base, whereby the antenna base is embedded in the housing, and the protruding flanges are exposed out of the housing. A method for fabricating the housing is also described.Type: ApplicationFiled: June 30, 2009Publication date: February 18, 2010Applicant: CHI MEI COMMUNICATION SYSTEMS, INC.Inventors: Hsin-Yi Chen, Yuan-Hsiao Chao
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Patent number: 7663558Abstract: A mobile device includes a housing having a transceiver configured to transmit and/or receive a signal. A stand attachable to the housing has a profile that increases stability of the housing in a resting position. The stand may also be attachable to a further housing such as an interface device configured for connection or attachment to the housing of the mobile device. The stand may include a first portion connectable to the wireless mobile device, a second portion, and an antenna having holes and being sandwiched between the first portion and the second portion. The antenna holes may be configured for allowing passage of liquid material during molding together the first portion, the second portion and the antenna to form a molded stand. The antenna may be operationally coupled to the transceiver. A base plate having hole(s) and connector(s) may also be sandwiched between the first portion and the antenna.Type: GrantFiled: December 12, 2007Date of Patent: February 16, 2010Assignee: Motorola, Inc.Inventor: Ngoc Minh Luong
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Patent number: 7663568Abstract: An antenna apparatus is disclosed that includes a synthetic resin case having an antenna element accommodating portion and a ground element accommodating portion, an antenna element made of punched sheet metal that is accommodated within the antenna element accommodating portion, a ground element made of punched sheet metal that is accommodated within the ground element accommodating portion and aligned with the antenna element, a surface mount coaxial connector that is mounted over an interface between the antenna element and the ground element, and a cover that covers the antenna element and the ground element.Type: GrantFiled: May 25, 2007Date of Patent: February 16, 2010Assignee: Fujitsu Component LimitedInventors: Takashi Yuba, Shigemi Kurashima, Hideki Iwata, Masahiro Yanagi, Takashi Arita, Toshihiro Kusagaya, Kazuhiko Ikeda, Hiroshi Matsumiya, Kazuo Nomura
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Patent number: 7663209Abstract: Provided are an inlet for an electronic tag comprising an insulating film, antennas each made of a conductor layer and formed over one surface of the insulating film, a slit formed in a portion of each of the antennas and having one end extending toward the outer edge of the antenna, a semiconductor chip electrically connected with each of the antennas via a plurality of bump electrodes, and a resin for sealing the semiconductor chip therewith; and a manufacturing process of the inlet. By the present invention, formation of a thin and highly-reliable inlet for a non-contact type electronic tag can be actualized.Type: GrantFiled: June 16, 2006Date of Patent: February 16, 2010Assignee: Renesas Technology Corp.Inventors: Michio Okamoto, Yuichi Morinaga, Yuji Ikeda, Takeshi Saito
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Publication number: 20100033400Abstract: A spray non-contact cutting type antenna fabrication method is disclosed to have an antenna radiator be formed on a plastic shell by means of spray-painting a metallic spray paint on the surface of the plastic shell and then cutting the metallic coating into shape, and then to cover the plastic shell with a cover layer by means of an insert molding or spray paining technique to have the antenna radiator be enveloped in the cover layer.Type: ApplicationFiled: August 5, 2008Publication date: February 11, 2010Inventors: Daniel CHANG, Chih-Wei Chang
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Patent number: 7659857Abstract: Methods and systems for wireless devices are disclosed. According to one system, a radio frequency identification (RFID) tag includes an RFID circuit packaged within a chip carrier package. The chip carrier package bonds out a first antenna connection for the RFID circuit. An antenna including a conductive lead is interfaced with the first antenna connection. The chip carrier package and the first conductive lead are coupled to a first side of a first spacer. A second spacer having a second dielectric constant greater than the first dielectric constant is coupled to a second side of the first spacer. The second spacer isolates the RFID circuit from a metal surface.Type: GrantFiled: June 29, 2007Date of Patent: February 9, 2010Inventor: Patrick F. King
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Publication number: 20100019985Abstract: Antenna assemblies for an implantable medical device are disclosed. The implantable medical device comprises a hermetically sealed housing, typically formed of titanium materials, and electronics, including a transceiver, disposed therein. An antenna is disposed in an air, gas or plastic dielectric filled compartment within a header, which is attached to the housing. The header is premolded so as to create the compartment. The antenna is then placed within the compartment, which is then sealed.Type: ApplicationFiled: July 24, 2008Publication date: January 28, 2010Inventors: Jacob Bashyam, James Long, Steven R. Johnson
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Patent number: 7650683Abstract: A method for manufacturing wireless communication devices for use in tracking or identifying other items comprises a number of cutting techniques that allow the size of the antenna for the wireless communication device. Further, the chip for the wireless communication device is nested so as to be flush with the surface of the substrate of the wireless communication device. Rollers cut the tabs that form the antenna elements. In a first embodiment, a plurality of rollers are used, each on effecting a different cut whose position may be phased so as to shorten or lengthen the antenna element. In a second embodiment, the rollers are independently positionable to shorten or lengthen the antenna element.Type: GrantFiled: August 30, 2006Date of Patent: January 26, 2010Inventors: Ian J. Forster, Patrick F. King
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Patent number: 7652626Abstract: A direction-finding co-linear antenna is provided by collinearly aligning an exposed reference antenna with a primary antenna that is surrounded by a dielectric sleeve with a predetermined thickness and the reference and primary antennas are separated by a ground plane. The direction-finding co-linear antenna provides a simple, light-weight and inexpensive arrangement with fewer antennas and reduced antenna spacing that avoids unwanted detection because of a smaller electronic footprint that consists of the area of a single antenna plus a few inches of dielectric material in the sleeves rather than four widely spaced antennas positioned in an array. The direction-finding co-linear antenna apparatus also requires less electronic processing because the antenna only needs to address the RF from two antennas rather than from four or five antennas in a conventional array arrangement.Type: GrantFiled: December 5, 2007Date of Patent: January 26, 2010Assignee: The United States of America as represented by the Secretary of the ArmyInventors: Ernest Potenziani, II, Michael T. Cummings
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Publication number: 20090322629Abstract: The invention provides a cover adapted to a communication device, a communication device including the same and a method for manufacturing the same. The cover according to the invention includes a cover body and an antenna. The cover body has a bottom surface. Particularly, the antenna is fixed at a predetermined position on the bottom surface by an insert molding process.Type: ApplicationFiled: April 29, 2009Publication date: December 31, 2009Applicant: ASUSTek Computer Inc.Inventors: Chien Ming Hung, Shen Yuan Lee
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Publication number: 20090322646Abstract: A reconfigurable electromagnetic antenna which comprises a radiating element consisting of a fluid substance that conducts electricity, the volume of the fluid substance being variable and that also comprises a matrix of electrodes on which the fluid substance is moved by electro-wetting. The properties of the antenna in frequency, polarization or even in radiation pattern evolve dynamically. The reconfiguration of the antenna in frequency, in polarization or in radiation pattern is continuous and reversible.Type: ApplicationFiled: June 11, 2009Publication date: December 31, 2009Applicant: France TelecomInventors: Emmanuel Dreina, Michel Pons, Marc Berenguer
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Patent number: 7639187Abstract: Antennas, handheld electronic devices containing antennas, and methods for using antennas and handheld electronic devices are provided. A handheld device may have a conductive case. The antenna can be formed as part of a button such as a pushbutton. The pushbutton may protrude from the conductive case sufficiently to allow good transmission and reception of wireless signals. The protruding antenna contains a radiating element, while the conductive case serves as a ground. The radiating element may be formed from a low-profile antenna structure such as a planar antenna structure formed on a circuit board substrate. The pushbutton may be used to control operation of the handheld electronic device. With one suitable arrangement, actuation of the pushbutton antenna causes the antenna to protrude from the case and turns on transceiver circuitry in the handheld device.Type: GrantFiled: September 25, 2006Date of Patent: December 29, 2009Assignee: Apple Inc.Inventors: Ruben Caballero, Teodor Dabov, Zhijun Zhang, John Benjamin Filson, Emery Artemus Sanford
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Patent number: 7639184Abstract: A metalized circuit suitable for application as a radio frequency antenna is produced by forming an antenna coil pattern on a flexible substrate. The antenna coil pattern is formed using a conductive ink which is patterned on the substrate. The conductive ink is cured and an electrical-short layer is formed across the coils of the conductive ink pattern. An insulating layer is formed over top of the electrical-short layer, a metal layer electroplated on top of the conductive layer, and then the electrical-short layer is removed. The use of the electrical-short layer during the electroplating allows for the voltage at the different points on the conductive ink layer to be relatively similar, so that a uniform electroplate layer is formed on top of the conductive ink layer. This results in a better quality radio frequency antenna at a reduced cost.Type: GrantFiled: July 26, 2005Date of Patent: December 29, 2009Assignee: RCD Technology Inc.Inventor: Robert R. Oberle
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Publication number: 20090315786Abstract: Disclosed is an antenna with an extended electrical length, including radiators (110, 210, 310), (410 and 510) having S-shaped or spiral-shaped cells (112, 212, 312 and 512). The cells (112, 212, 312 and 512) are formed on the front surface of the boards (120, 220, 320, 420 and 520), and two or more of the cells are connected in series by connectors (114, 214 and 314) formed on the rear surface of the board. Furthermore, the antenna includes a ground stub (150) and a parasitic element (160) electromagnetically coupled to the radiators (110, 210, 310, 410 and 510), and has a good radiation characteristic. Furthermore, the antenna can include the cells (112, 212, 312 and 512) of different sizes and can thus have a multi-band characteristic.Type: ApplicationFiled: March 30, 2007Publication date: December 24, 2009Applicant: E.M.W. Antenna Co., Ltd.Inventors: Byung Hoon Ryou, Won Mo Sung, Gi Ho Kim, Yun Bok Lee, Jun Woo Park
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Publication number: 20090303138Abstract: A wireless electronic device is provided that includes an encapsulation and a substrate enclosed within the encapsulation. The substrate has first and second opposing regions and electronic circuitry formed on or embedded in the substrate. The wireless electronic device further includes a signal chip for generating a signal under the control of the electronic circuit, the signal chip being connected to the first region of the substrate. Additionally, the wireless electronic device includes a dual-function battery antenna mounted to the second region of the substrate. The dual-function battery antenna supplies electrical power to the electronic circuitry and/or the signal chip. The dual-function battery antenna operates as an antenna for transmitting and/or receiving wireless signals conveyed from and/or received by the wireless electronic device.Type: ApplicationFiled: July 27, 2007Publication date: December 10, 2009Applicant: University of Florida Research Foundation, IncInventors: Jenshan Lin, Huikai Xie
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Publication number: 20090295675Abstract: An IC package antenna of which a metal radiating member is firstly provided on a board to form an antenna base board; the board is formed thereon at least a feed point; and the IC package antenna is packaged with an IC packaging housing and a packaging bottom portion to form an IC chip. The IC packaging housing has a plurality of connecting pins extending outward from inside of itself; wherein the inner end of at least one connecting pin is soldering connected with a feed point of the base board of the antenna. Such an IC package antenna can allow standardized and miniaturized antenna designing, and is applicable to Surface Mount Technology (SMT).Type: ApplicationFiled: October 3, 2008Publication date: December 3, 2009Inventor: Chia-Lun Tang
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Patent number: 7619530Abstract: An RFID tag includes an RFID unit and an antenna unit. The RFID unit is formed in a form of a minute dipole antenna having a predetermined length and includes an IC chip. The antenna unit includes an antenna pattern and an RFID mounting portion. Lengths of the RFID unit and the antenna unit are substantially identical. The RFID unit and the antenna can be manufactured independently.Type: GrantFiled: November 29, 2005Date of Patent: November 17, 2009Assignees: Fujitsu Limited, Fujitsu Frontech LimitedInventor: Hiroshi Kawamata
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Patent number: 7619576Abstract: A self-contained radio apparatus for the transmission of data includes a resiliently deformable patch, a resiliently deformable antenna carried by the patch, a post secured to the patch and upstanding from an upper surface of the patch, the post providing at an end remote from the patch a mounting for a radio device, and, electrical conductors extending from the antenna to the end of the post remote from the patch for operably connecting the antenna to a radio device mounted on the post. The radio apparatus is useful for attaching to objects that undergo bending stresses, such as tires.Type: GrantFiled: May 11, 2004Date of Patent: November 17, 2009Assignee: Michelin Recherche et Technique S.A.Inventors: John Peter Beckley, Victor Alexandrovich Kalinin, George P. O'Brien, Arthur R. Metcalf
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Patent number: 7595765Abstract: Embedded surface wave antenna elements incorporating different dielectric materials or other features are provided. The different dielectric materials can arranged adjacent a feed, to absorb energy that can cause undesirable reflections in the antenna element. In addition or alternatively, different dielectric materials can be arranged to alter the velocity of energy through the antenna element, and to control or attenuate the formation of nulls in the far field at angles of interest. The control or attenuation of nulls in the far field at angles of interest can further be controlled through contouring an antenna element ground plane in a lens region of the antenna element. A buried feed arrangement is also described.Type: GrantFiled: June 29, 2006Date of Patent: September 29, 2009Assignee: Ball Aerospace & Technologies Corp.Inventors: Vincent A. Hirsch, Bradley M. McCarthy, Thomas S. Watson, John Mehr, Thomas M. Crawford
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Patent number: 7592968Abstract: An antenna comprising a resonant structure having a first portion disposed in a first plane, and a second portion disposed in a non-parallel plane. The resonant structure is embedded in a non-conductive or dielectric material and the second portion is formed from electrically conductive vias.Type: GrantFiled: March 23, 2006Date of Patent: September 22, 2009Assignee: TDK CorporationInventor: Joseph Modro
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Publication number: 20090224985Abstract: A portable radio device is shown with an outer cover (202) and a radiating antenna element (206, 207, 208, 226, 227) inside the outer cover (202). At a location corresponding to the location of the radiating antenna element (206, 207, 208, 226, 227), there is thermoplastic material (203, 215, 217, 219) the loss tangent value of which is less than 0.005. The outer cover (202) has, on the outer surface thereof and at a location corresponding to the location of the radiating antenna element (206, 207, 208, 226, 227), a coating (204, 209, 216, 218, 220) that is one of: diamond coating, diamond-like coating, diamond-based nanocomposite coating.Type: ApplicationFiled: March 8, 2006Publication date: September 10, 2009Inventor: Helena Pohjonen
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Patent number: 7581308Abstract: Method of connecting an antenna wire to a transponder chip. A transponder chip in a recess in a substrate, and an antenna wire mounted to the surface of the substrate and having end portions spanning the recess. The end portions are spaced wider than the chip, to allow the chip to be inserted into the recess from the same side as the antenna. The end portions may then be repositioned to be over corresponding terminals of the chip, for bonding thereto. The recess may be substantially larger than the chip, so that the chip and/or the substrate may be moved from side-to-side in the recess for positioning the terminals under the end portions, for bonding thereto. Insulation may be removed from the end portions prior to mounting the chip in the recess, to enhance subsequent bonding.Type: GrantFiled: July 5, 2007Date of Patent: September 1, 2009Assignee: Advanced Microelectronic and Automation Technology Ltd.Inventor: David Finn
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Publication number: 20090213017Abstract: A housing for a wireless communication device includes a substrate and an antenna pattern formed on the substrate. The antenna pattern is an electrically conductive coating of conductive ink. A method for making the housing and a wireless communication device using the housing is also disclosed.Type: ApplicationFiled: January 15, 2009Publication date: August 27, 2009Applicants: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., FIH (HONG KONG) LIMITEDInventors: Fu-Keng Yang, Bing Zhang, Yi-Ping Zeng, Jian-Jun Zhan
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Publication number: 20090207090Abstract: An integrated antenna and chip package and method of manufacturing thereof. The package includes a first substrate having a first surface and a second surface, The second surface is configured to interface the chip package to a circuit board. A second substrate of the package is disposed on the first surface of the first substrate and is made of a dielectric material. One or more antennas are disposed on the second substrate and a communication device is coupled to the antenna, wherein the communication device is disposed on the second substrate in substantially the same plane as the antenna. A lid is coupled to the first substrate and is configured to encapsulate the antenna and the communication device. The lid has a lens that is configured to allow radiation from the antenna to be emitted therethrough and a shoulder configured to transfer heat produced from the communication device.Type: ApplicationFiled: February 15, 2008Publication date: August 20, 2009Applicant: Vubiq IncorporatedInventors: Michael Gregory Pettus, James Robert Amos Bardeen
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Patent number: 7573431Abstract: The broadband small antenna has equal magnetic electric proportions, circular polarization, and an isoimpedance magnetodielectric (?r??r) shell for controlled wave expansion. The shell is a radome without bandwidth limitation, with reflectionless boundary conditions to free space, providing loading and broad bandwidth antenna size miniaturization. The system is spherically structured based upon size, quality (Q) and bandwidth.Type: GrantFiled: February 13, 2006Date of Patent: August 11, 2009Assignee: Harris CorporationInventor: Francis Eugene Parsche
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Patent number: 7569916Abstract: Microelectronic assemblies interconnected using a separable network interface and electronic systems using the microelectronic assemblies to physically separate high performance signals and lower performance signals to enhance system performance are disclosed.Type: GrantFiled: March 14, 2007Date of Patent: August 4, 2009Assignee: Paricon Technologies Corp.Inventor: Roger E. Weiss
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Patent number: 7570219Abstract: The present invention is an improved antenna system. In an embodiment of the invention, the antenna system of the present invention may be a dielectric resonator antenna which may include a dielectric cap that may surround a plurality of feed probes. The antenna system may be suitable for coupling to a projectile whereby the dielectric cap forms a front end, or nose, of the projectile. The plurality of feed probes may produce orthogonal vector components of a field to provide circular polarization. Additionally, feed probes may be optimally spaced within the dielectric cap to ensure the phase center of the antenna system may be co-located with a platform axis of rotation whereby no carrier phase rollup compensation may be required.Type: GrantFiled: May 16, 2006Date of Patent: August 4, 2009Assignee: Rockwell Collins, Inc.Inventors: Lee M. Paulsen, Brian J. Herting
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Publication number: 20090189818Abstract: A housing for a wireless communication device includes a decorative film having an antenna pattern formed thereon, a protective coating covering the antenna pattern, and a substrate moldingly attached to the decorative film and the protective coating. The antenna pattern is a conductive ink coating. The antenna pattern and the protective coating are sandwiched between the decorative film and the substrate.Type: ApplicationFiled: January 15, 2009Publication date: July 30, 2009Applicants: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., FIH (HONG KONG) LIMITEDInventors: Fu-Keng Yang, Bing Zhang, Yi-Ping Zeng, Jian-Jun Zhan
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Publication number: 20090189817Abstract: A housing for a wireless communication device includes a decorative film, an antenna pattern formed on the decorative film, and a substrate moldingly attached to the decorative film and the antenna pattern. The antenna is made of a metal coating. The antenna pattern is sandwiched between the decorative film and the substrate.Type: ApplicationFiled: January 15, 2009Publication date: July 30, 2009Applicants: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., FIH (Hong Kong) LimitedInventors: Fu-Keng Yang, Bing Zhang, Yi-Ping Zeng, Jian-Jun Zhan
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Publication number: 20090184882Abstract: A manufacture method of semiconductor package with an antenna includes: providing a substrate with a first surface and an opposite second surface, wherein the first surface has a predetermined circuit; arranging a functional element on the first surface and electrically connecting the functional element with the predetermined circuit of the substrate; encapsulating the functional element and a portion of the first surface of the substrate by an encapsulating body; and printing an antenna electrically connected with the predetermined circuit on the surface of the encapsulating body. A semiconductor package with an antenna is also disclosed.Type: ApplicationFiled: May 23, 2008Publication date: July 23, 2009Inventor: En-Min Jow
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Publication number: 20090184881Abstract: A structural phased array antenna and method for manufacturing are disclosed. An integrated structural antenna aperture can be used to reduce net weight, cost, and volume where an array of antenna elements are incorporated into a structural member, e.g. in a spacecraft. A structural material layer, such as a structural foam, may be used with the array of individual antenna element cavities machined into the layer. The antenna element cavities are lined with a conductive material, such as plated aluminum. Facesheets may be bonded to the front and/or backside of the structural material layer in order to increase strength and/or stiffness using an RF transparent material. The array of antenna elements may be coupled to filters at the back side of structural material layer.Type: ApplicationFiled: January 23, 2008Publication date: July 23, 2009Applicant: The Boeing CompanyInventors: Steven J. Bullock, Kenneth H. Griess, Thomas F. Klein, III, Otis F. Layton, Julio A. Navarro, Manny S. Urcia
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Publication number: 20090179817Abstract: An induction card with a printed antenna comprises: an upper cover film; an upper middle layer installed below the upper cover film; one or two surfaces of the upper middle layer being coated or printed with an upper patter layer; a pad thick layer installed below the upper middle layer; a hole being formed in the pad thick layer; an antenna coil layer installed below the pad thick layer; a printed antenna coil being formed on the antenna coil layer; a lower middle layer installed below the lower plastic layer; one or two surfaces of the lower middle layer being coated or printed with a lower patter layer; and a lower cover layer installed below the lower middle layer; the lower cover layer being installed with magnetic tape; and the lower cover layer is used as a protecting layer.Type: ApplicationFiled: January 16, 2008Publication date: July 16, 2009Inventor: Wen-Cheng Yin
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Publication number: 20090174618Abstract: A radio frequency (RF) module integrated with an active antenna includes a silicon chip carrier, an active antenna circuit and a main circuit unit. The active antenna circuit unit is integrated into the silicon chip carrier via a semiconductor process. The active antenna circuit unit further includes an antenna loop formed on the silicon chip carrier for receiving and transmitting an RF signal. The active circuit unit is mounted on the silicon chip carrier and electrically connected to the active antenna circuit unit for processing the RF signal. Thereby the module is made compact.Type: ApplicationFiled: January 9, 2008Publication date: July 9, 2009Inventors: Chung-Er Huang, Chih-Hao Liao
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Publication number: 20090174612Abstract: Antenna support structures and antennas are provided for wireless electronic devices such as portable electronic devices. Antenna resonating elements may be formed from conductive coatings on two-shot molded interconnect device dielectric antenna support structures. The conductive coatings may be formed from wet-plated copper or other conductive materials. The antenna support structure may have tabs that electrically connect antenna resonating elements to the case of a wireless electronic device that serves as an antenna ground plane. The antenna support structure may be curved about its longitudinal axis so that the antenna resonating elements on the support structure protrude upwards to enhance antenna performance. In a portable electronic device such as a portable computer, the antenna support structure may be mounted within a dielectric portion of the computer housing that is located between the display portion of the housing and the base of the housing.Type: ApplicationFiled: June 19, 2008Publication date: July 9, 2009Inventors: Enrique Ayala, Gregory Allen Springer, Douglas B. Kough, Matthew Ian McDonald
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Patent number: 7551141Abstract: An electronic assembly with integrated circuit capacitively coupled to antenna. The electronic assembly includes a strap assembly and an antenna assembly. The antenna assembly includes a first substrate and antenna elements. The strap assembly includes a second substrate and an integrated circuit embedded within the second substrate and substantially flush with a surface of the second substrate. Interconnections are formed to the integrated circuit. The interconnections are formed on the surface of the second substrate. The antenna assembly and the strap assembly are affixed to one another with the surface of the second substrate facing the antenna elements. The antenna elements capacitively couples to the integrated circuit through the interconnections with no direct contact. A non-conductive layer is disposed between the antenna elements and the interconnections providing the capacitive coupling.Type: GrantFiled: November 7, 2005Date of Patent: June 23, 2009Assignee: Alien Technology CorporationInventors: Mark A. Hadley, Curt L. Carrender, John Stephen Smith
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Publication number: 20090153421Abstract: Aspects of a method and system for an integrated antenna and antenna management are provided. In this regard, one or more reactances coupled to an antenna in a hybrid circuit may be tuned and signals may be transmitted and/or received based on the tuning. The hybrid circuit may comprise an integrated circuit (IC) bonded to a multi-layer package. The antenna may be embedded within and/or on the multi-layer package. The reactances may be within and/or on the IC and/or the multi-layer package. In this regard, the IC may be bonded to or mounted to an underside of the multi-layer package. The reactances may be tuned via one or more switching elements and/or logic, circuitry, and/or code within the IC. The reactances may comprise one or more inductors and/or capacitor arrays. The multi-layer package may comprise one or more layers of ferromagnetic and/or ferrimagnetic material.Type: ApplicationFiled: December 12, 2007Publication date: June 18, 2009Inventors: Ahmadreza Rofougaran, Maryam Rofougaran