Abstract: A mobile device includes a housing having a transceiver configured to transmit and/or receive a signal. A stand attachable to the housing has a profile that increases stability of the housing in a resting position. The stand may also be attachable to a further housing such as an interface device configured for connection or attachment to the housing of the mobile device. The stand may include a first portion connectable to the wireless mobile device, a second portion, and an antenna having holes and being sandwiched between the first portion and the second portion. The antenna holes may be configured for allowing passage of liquid material during molding together the first portion, the second portion and the antenna to form a molded stand. The antenna may be operationally coupled to the transceiver. A base plate having hole(s) and connector(s) may also be sandwiched between the first portion and the antenna.

Abstract: Aspects of a method and system for configurable antenna in an integrated circuit package are provided. In this regard, a phased array antenna embedded in a multi-layer integrated circuit (IC) package may be utilized for transmitting and/or receiving signals. An IC enabled to transmit and/or receive signals may be bonded to the multi-layer IC package and may communicate a reference signal and/or one or more phase shifted versions of said reference signal to the antenna. One or more phase shifters (fabricated, for example, in planar transmission line) may be embedded in the multi-layer IC package and may be controlled via an IC bonded to the multi-layer IC package. The phased array antenna may comprise a plurality of antenna elements which may each comprise an interconnection for communicatively coupling to an associated transmitter and/or receiver, a feeder line, a quarter wavelength transformer, and a radiating portion (e.g., a folded dipole).

Abstract: An RFID tag in one embodiment. The RFID tag includes at least one integrated circuit and an antenna pattern coupled to the integrated circuit, wherein the antenna pattern has an inductor pattern which limits the effect of misplacement of the integrated circuit relative to the inductor pattern. Other embodiments and methods of making these apparatuses are described.

Abstract: A mobile radio communication device has an antenna, a circuit board to which the antenna is connected and on which a plurality of electronic elements are mounted, an inner casing formed of resin and housing the circuit board, and an outer casing of resin covering the inner casing. The antenna is located on that portion on an outer face of the inner casing which is covered by the outer casing, and the antenna is disposed to penetrate into the inside of the inner casing through a hole formed on the inner casing, and the feeding end of the antenna is connected to the circuit board. This allows the antenna to be spaced apart from other electronic elements on the circuit board in the lower body without protruding the antenna outside, to achieve a sufficient antenna property by elimination of effects from other electronic elements.

Abstract: A wireless communication device includes a housing and an antenna unit. The antenna unit is disposed on the outer or inner surface of the housing. A protective layer is optionally disposed to cover the outer surface of the antenna unit and, even more, at least a portion of the housing. Thus, the antenna unit separated from the circuit board does not occupy the layout region of the circuit board, so that the layout region of the circuit board can be used for other purposes. Moreover, the antenna unit formed on the housing can enhance the performance of the wireless communication device for transceiving signals.

Abstract: A GPS receiving antenna device that can suitably be provided on the exterior of a vehicle is provided with low cost. An antenna case includes a top cover and a bottom plate joined with each other. The top cover stores an antenna module that receives a signal and a packing member provided at the joining part between the top cover and the bottom plate to keep the antenna case tightly sealed. The top cover and the bottom plate are provided with engagement parts and claw parts, respectively, and the top cover and the bottom plate are joined with each other as the packing member is pressed.

Abstract: The present invention provides an antenna system for transmitting and receiving radar signals comprising a first non-conductive material embedding a plurality of parasitic antenna elements, where the first non-conductive material interfaces a second non-conductive material embedding a plurality of electrical feed elements, and wherein the first non-conductive material covers one or more adjacent interconnecting joints.

Abstract: A protective circuit module including a layered insulating substrate, a printed circuit pattern disposed within the insulating substrate, and a loop antenna electrically connected to the printed circuit pattern. Ends of the loop antenna can be inserted into the insulating substrate and connected to the printed circuit pattern. Portions of the printed circuit pattern may extend out of the insulating substrate, and may be connected to the loop antenna. The protective circuit module can be included in a secondary battery pack comprising a secondary battery. The loop antenna can be adhered to the secondary battery.

Abstract: Grating lobe free scanning in a phased array with sparse element spacing is obtained by restricting the maximum scan angle for elements in the array, and cladding the array. Array elements may be integrated into the cladding.

Abstract: A compensating multi layer material includes two compensating layers adjacent to one another. A multi-layer embodiment of the invention produces subwavelength near-field focusing, but mitigates the thickness and loss limitations of the isotropic “perfect lens”. An antenna substrate comprises an indefinite material.

Abstract: An electronic device comprises a housing having an antenna molded into the housing.

Abstract: A device package for radio frequency transceivers that comprises radio electronics, a filter and an antenna. The filter and antenna are realized using one or more metallization layers in the housing of the device package. The filter and antenna in the housing of the device package allows the realization of a compact RF transceiver with a small form-factor.

Abstract: A peripheral apparatus includes a housing, a semiconductor device, and an antenna. The peripheral apparatus generates and transmits radio frequency (RF) control signals to a host device. The semiconductor device is contained within the housing and generates the RF control signals. The antenna is fully contained within the semiconductor device and transmits the RF control signals to the host device.

Abstract: According to an embodiment of the present invention, a subassembly for a phased array radar includes a substrate generally lying in a first plane, the substrate including a plurality of transmit/receive modules coupled to a mounting surface and a plurality of radiating elements formed adjacent the mounting surface, and a multi-function board generally lying in a second plane parallel to the first plane. The multi-function board is in spaced apart relation to the substrate and may include RF manifolding and logic/power distribution functions for the transmit/receive modules.

Abstract: An embedded assembly (200) and method for fabricating the same is provided. The embedded assembly includes an organic substrate (102) and at least one movable element (104). The embedded assembly also includes at least one antenna element (106). The method includes providing (502) the organic substrate, and embedding (504) the at least one moveable element on the organic substrate. The method also includes embedding (506) the at least one antenna element on the organic substrate.

Abstract: Apparatus and methods are provided for integrally packaging antenna devices with semiconductor IC (integrated circuit) chips, wherein IC chips are packaged with dielectric resonators antennas that are integrally constructed as part of a package molding (encapsulation) process, for example, to form compact integrated radio/wireless communications systems for millimeter wave applications.

Abstract: The present invention relates to an antenna arrangement for a portable radio communication device, such as a mobile phone, including RF circuitry and a portable radio communication device comprising such an antenna arrangement. The antenna arrangement is characterized in that a first connection portion (17; 25) of an antenna element (10) extends in a first direction in a plane defined by the substantially planar antenna element (10) and a second connection portion (18; 26) of the antenna element (10) extends in a second direction opposite said first direction, such that the sum of said extensions is constant.

Abstract: A wireless communication device includes: a case that includes a dielectric member made of a first dielectric material, the dielectric member being coated with a coating layer made of a second dielectric material; a wireless communication circuit that is housed in the case; an antenna element that is electrically connected to the wireless communication circuit, the antenna element being made of a conductive material and provided on a surface of the dielectric member; and an adhesive layer that is disposed between the antenna element and the dielectric member to adhere the antenna element onto the dielectric member, the adhesive layer being made of a third dielectric material.

Abstract: A biodegradable RFID card includes a multiple-layer laminate with each layer being formed of a biodegradable material composition of a blend of between about 30-70% PLA and about 30-70% by weight of one or more polyesters. The biodegradable RFID card further includes an RFID assembly disposed on at least one of the laminate layers, with the RFID assembly including an integrated circuit and an antenna.

Abstract: There is provided a mobile apparatus including: a thin film provided as a substrate; at least one conductive pattern formed on at least one surface of the thin film; a circuit part formed on the at least one surface of the thin film to connect to the connect to the conductive pattern; and a housing formed integral with the thin film. Also, there is provided a method of manufacturing the same.

Abstract: Systems and methods are disclosed for insert-molding various electronic and mechanical parts as part of a housing of an electrical device. The insert molded components can comprise antennas, flex members and circuits, electronic, mechanical, and interface units that have been insert molded as part of a plastic housing that contains the electrical device.

Abstract: The invention relates to an arrangement with a transponder (2) and a metal component (1) provided for the transponder (2). An antenna for the transponder (2) is formed by a recess (3) in the metal component (1).

Abstract: The invention relates to micro-resonant devices (MRDs) that generate resonance at radio frequencies not present in an animal or human body, or present at low, background levels in the body. These individual, often monolithic devices, can be located in three-dimensional space and tracked anywhere in a target area, e.g., in a human or animal body, or within a cell within a body, using a conventional magnetic resonance imaging (MRI) scanner or other transducers, e.g., radiofrequency transducers. The MRDs generate high sensitivity contrast in conventional clinical MRI scanners, have a diameter of anywhere from a few nanometers to 1000 microns, and can in some embodiments be manufactured using Micro-Electro-Mechanical Systems (MEMS) technology. The devices are optionally coated to isolate them from the environment, and this coating can be a biocompatible coating for medical and biotechnology uses.

Abstract: An apparatus and method is provided to shield contactless portable electronic consumer devices such as radio frequency identification devices (RFID), tokens, mini-cards, key fobs, cellular phones, smartcards, etc. from wireless interrogation. In one embodiment, a contactless portable consumer device which includes a first antenna is shielded from unauthorized wireless interrogation with a radio frequency (RF) shield. The RF shield includes electrically conductive, non-ferromagnetic material and is configured to prevent unauthorized data transfer between a second antenna external to the portable consumer device and the first antenna.

Abstract: A method of producing an antenna device for use with a portable radio communication apparatus includes the steps of (i) providing a dielectric substrate, having first and second opposing surfaces; and an ejection apparatus, having a container filled with a liquid conductive substance, an ejection opening in liquid communication with the container, and an implement for ejecting a liquid conductive substance from the opening in the container; (ii) ejecting the liquid electrically conductive substance from the ejecting apparatus, onto the first surface of the dielectric substrate; and (iii) moving the dielectric substrate and the ejection opening relative to each other while ejecting the liquid conductive substance to form, upon being solidified, a conductive antenna pattern on the first surface of the dielectric substrate.

Abstract: An electronic apparatus comprising a housing, a metallic antenna and a printed circuit board is provided. The housing comprises a metallic front casing and an insulating rear casing. The metallic front casing has a display panel and a number of buttons. The insulating rear casing is buckled to the metallic front casing. The insulating rear casing has an outer surface. The metallic antenna is disposed on part of the outer surface. The printed circuit board is disposed in the housing. The printed circuit board is electronically connected to the metallic antenna, the display panel and the buttons.

Abstract: There is provided an antenna integrally formed with a case and a method of manufacturing the same. An antenna integrally formed with a case according to an aspect of the invention includes: a case unit formed of a dielectric material; a radiator including a radiation unit tightly fixed to an outer surface of the case unit and terminal units each extending from an end portion of the radiation unit, passing through the case unit, and exposed on the inside of the case unit; and contact pins provided on a board disposed adjacent to the case unit and electrically connected to the individual terminal units.

Abstract: An electronic device includes: a first molded body having a recessed cross section and made of resin; a second molded body having a recessed cross section and made of resin, the second molded body being fitted inside the first molded body; and an antenna pattern sandwiched between the first and second molded body. Among the surfaces of the first molded body, the surface on the side not adjacent to the antenna pattern constitutes an outer surface.

Abstract: A housing for a portable electronic device including a housing portion; and an antenna element embedded within the housing portion, and operable at a resonant frequency, wherein the antenna element includes at least one folded portion and has a thickness substantially equal to at least four skin depths at the resonant frequency.

Abstract: An air tank for a self-contained breathing apparatus that incorporates a coil antenna for use in a magneto-inductive system. The coil antenna is formed as a part of the tank. The antenna is embedded within the sidewall of the air cylinder to form the air tank. The self-contained breathing apparatus may include a magneto-inductive device operatively connected to the coil antenna for conducting magneto-inductive communications. A microphone and speaker or headset may be included to facilitate voice communications over the magneto-inductive system.

Abstract: The present invention provides an embedded antenna. It is to form meanders on a radiating element of the embedded antenna for dividing the resonant length of the radiating element into several short resonant length to extend the bandwidth of the radiating element. It is also to form meanders on the radiating element to extend the resonant length. This design can minimize the size of the embedded antenna and achieve the same as performance of a larger size antenna.

Abstract: The invention relates to a method for mounting a radiating antenna element used especially in the manufacture of small-sized radio devices and a radio device with a radiator mounted by the method. A thin thermoplastic plate coated with a metal foil is used in the manufacture of the antenna. A radiator pattern is formed in the metal foil. The antenna component obtained is placed (401) on the surface of some plastic part of the radio device, preferably on the inner surface of the thermoplastic cover of the radio device. The plastic layer of the antenna component becomes positioned against said plastic part, and the component is fastened (402, 403) by fusing together the mating plastic materials, which are against each other. In the complete antenna, the radiator is electrically connected to the other parts of the radio device by means of contacts.

Abstract: A near field communication loop antenna (308) is mechanically coupled to the cover (300) of a cellular telephone. The antenna (308) is coupled on the inside of the cover (300) between a keypad (302) and the cover (300), whereby the antenna (308) surrounds the keys (314) and is sandwiched between the keypad assembly (302) and the cover (300). A near field communication antenna (406) is coupled to the outside surface of the cover (300) surrounding a display and sandwiched between a lens (400) and the phone cover (300). A near field communication antenna embedded in the phone cover material, whereby the antenna surrounds either the keys or the display, is disclosed as well.

Abstract: In a semiconductor device in which a copper plating layer is used for a conductor of an antenna and in which an integrated circuit and the antenna are formed over the same substrate, an object is to prevent an adverse effect on electrical characteristics of a circuit element due to diffusion of copper, as well as to provide a copper plating layer with favorable adhesiveness. Another object is to prevent a defect in the semiconductor device that stems from poor connection between the antenna and the integrated circuit, in the semiconductor device in which the integrated circuit and the antenna are formed over the same substrate. In the semiconductor device, a copper plating layer is used for the antenna, an alloy of Ag, Pd, and Cu is used for a seed layer thereof, and TiN or Ti is used for a barrier layer.

Abstract: A cladding (3; 3?; 3?) for a microwave antenna (1; 1h; 1v) comprises at least one cladding plate (4) having at least one portion which has a cross-section in the shape of a piece of logarithmic spiral in a first section plane, the section angle ? between the radius and the normal of the spiral fulfilling the condition tan ?=??R, wherein ?R is the dielectric constant of the material of the cladding plate (4).

Abstract: Methods, systems, and apparatuses for automated manufacturing microstrip element antennas is described. The microstrip element antenna comprises a printed circuit layer, a dielectric layer and a ground plane layer. Mass manufacturing process for such microstrip element antennas without any substantial manual assembly process is described. Automation of the manufacturing steps leads to lower production costs, faster production and a higher yield.

Abstract: A radio frequency identification (“RFID”) system antenna having adhesive pre-applied to one or more of its contact pads to allow for high speed attachment of the antenna to the RFID die or die strap. Also disclosed is a method for attaching an RFID antenna having pre-applied adhesive to a die or die strap.

Abstract: A dual interface inlay having a bottom sheet; an antenna wire mounted to the top surface of the bottom sheet; end portions of the antenna wire formed with squiggles or meanders forming contact areas of increased surface area for subsequent attachment of a chip or chip module to the antenna wire; conductive material applied to the end portions of the antenna wire; a top sheet disposed over the bottom sheet for lamination thereto; and recesses formed in a bottom surface of the top sheet, at positions corresponding to the contact area. The antenna wire may be insulated wire, and insulation may be removed from the end portions of the antenna wire. Silicon cushions may be disposed in the bottom sheet under the contact areas.

Abstract: Electronic apparatus having an antenna chip with a substrate and an antenna structure, and a method of producing the same. The antenna chip is integrated or packaged in a package having a clip mounting surface for mounting the antenna chip, and an encapsulating material. The encapsulating material typically is a plastic mold used in the industrial packaging of integrated circuits. Between the antenna structure and the chip mounting surface, a first void is disposed in the substrate.

Abstract: The invention is directed to a security tag (7?) for protecting an article (1) against theft, with an electronically detectable first security element (3) and a covering layer (4) covering said first security element completely. The covering layer (4) is covered completely with a label (6) made of tearable material, which on its side facing the covering layer (4) is provided with an adhesive whose bonding strength is at least somewhat lower than that of the adhesive applied to the covering layer (4). Arranged between the covering layer (4) and the label (6) is a second security element (5), which overlaps the covering layer (4) at least in part and is provided on its side facing the covering layer (4) with an adhesive whose bonding strength is somewhat greater than that of the adhesive applied to the label (6). The covering layer (4) and the second security element (5) are completely covered by the label (6).

Abstract: A self-contained tracking unit includes an elongated housing with a hollow interior cavity housing a GPS receiver, a microprocessor and a transmitter. The housing is mounted between a pair of projecting ribs on a sidewall of the container and has a depth less than the distance of the projecting ribs. An antenna is mounted within the housing, on the forward wall, and an antenna ground plane connected to the antenna is mounted in the housing parallel to the antenna and on the rearward wall of the housing.

Abstract: The present invention is directed to a method of forming a circuit assembly, such as including a radio frequency identification device (RFID), wherein first and second portions of an antenna of the circuit assembly are provided on respective first and second substrates, with the associated electrical circuit, having first and second electrical contacts on respective opposite sides thereof, positioned between the first and second substrates. Alternatively, first and second portions of an antenna of the circuit assembly are provided on a substrate, with the associated electrical circuit, having first and second electrical contacts on respective opposite sides thereof, electrically joined to the respective antenna portions. Highly efficient manufacture is thus promoted.

Abstract: An antenna of a mobile communication terminal has a plate-shaped dielectric; a conductor line formed to the dielectric and having a leading end connected to a transceiving section of the mobile communication terminal and a terminal end extendingly formed into a shape curved from the leading end and located at a middle part of the plate-shaped dielectric; and an assistance radiator electrically connected to the terminal end of the conductor line and mounted to surround the plate-shaped dielectric. According to the antenna, since there is provided the assistance radiator, it is possible to shorten the length of the antenna while maintaining the overall length of the conductor line to be same and to improve the average radiation gain of the antenna.

Abstract: An electronic device comprises a housing having an antenna molded into the housing.

Abstract: An attachment rack apparatus with antenna is provided, including a first connection unit, a second connection unit and an antenna unit. The first connection unit includes a first attachment plate and a second attachment plate. One end of the first and second attachment plates are connected together. The two attachment plates are arcs facing each other to form a non-closed space. The bottom of the second connection unit is attached to the joint of the first and the second attachment plates. The top of the second connection unit is attached to the antenna unit. The second connection unit provides the antenna unit with space and mechanism for adjustment in angles, positions and orientations. The present invention is applicable to a holder with suction disc for holding electronic devices in a vehicle.

Abstract: A cladding (2) for a microwave antenna comprises at least one plate (3a, 3b, 3c, 3d) which has, in a first section plane (x=0; y=0), a cross section in the shape of a logarithmic spiral, characterized in that the plate (3a, 3b, 3c, 3d) has a cross section in the shape of a logarithmic spiral also in at least one second section plane perpendicular to the first one.

Abstract: The present invention provides an electronic device. The electronic device comprises a circuit board; and a dipole antenna, having a first conducting portion and a second conducting portion that are electrically coupled to the circuit board respectively and disposed substantially along an outline of the circuit board.

Abstract: Apparatus, system, and method for wireless module enabled component carrier for parts inventory and tracking are described.

Abstract: The present invention provides a semiconductor device which is not easily damaged by external local pressure. The present invention further provides a manufacturing method of a highly-reliable semiconductor device, which is not destroyed by external local pressure, with a high yield. A structure body, in which high-strength fiber of an organic compound or an inorganic compound is impregnated with an organic resin, is provided over an element substrate having a semiconductor element formed using a single crystal semiconductor region, and heating and pressure bonding are performed, whereby a semiconductor device is manufactured, to which the element substrate and the structure body in which the high-strength fiber of an organic compound or an inorganic compound is impregnated with the organic resin are fixed together.

Abstract: The present invention provides a semiconductor device which is not easily damaged by external local pressure. The present invention further provides a method for manufacturing a highly-reliable semiconductor device, which is not destructed by external local pressure, with a high yield. A structure body, in which high-strength fiber of an organic compound or an inorganic compound is impregnated with an organic resin, is provided over an element layer having a semiconductor element formed using a non-single crystal semiconductor layer, and heating and pressure bonding are performed, whereby a semiconductor device is manufactured, to which the element layer and the structure body in which the high-strength fiber of an organic compound or an inorganic compound is impregnated with the organic resin are firmly fixed together.