Abstract: A die for a printhead is provided in examples. The die includes a number of fluidic actuator arrays. A data block is associated with each of the plurality of fluidic actuator arrays. The die includes an interface comprising a data pad and a clock pad, wherein a data bit value present at the data pad is loaded into a first data block corresponding to a first fluidic actuator array on a rising clock edge and loaded into a second data block corresponding to a second fluidic actuator array on a falling clock edge.

Abstract: A drop ejector array device includes a first plurality and a second plurality of drop ejectors that are alternatingly disposed along an array direction on the substrate surface. A voltage input terminal and a current return terminal are disposed on the substrate surface. A first power bus line connects the first plurality to the voltage input terminal. A second power bus line connects the second plurality to the voltage input terminal. The second power bus line is electrically connected to the first power bus line by a primary power bus connector line. A first current return bus line connects the first plurality to the current return terminal. A second current return bus line connects the second plurality to the current return terminal. The second current return bus line is electrically connected to the first current return bus line by a primary current return bus connector line.

Abstract: A liquid discharge head includes a plurality of discharge elements, a plurality of driving elements, a plurality of control circuits, a first ground wiring and a first power supply wiring configured to supply power to the plurality of discharge elements and the plurality of driving elements, and a second ground wiring and a second power supply wiring configured to supply power to the plurality of control circuits. The first ground wiring and the first power supply wiring include, in a first conductive layer of a plurality of conductive layers, a first wiring group extending in a first direction, and in a second conductive layer, a second wiring group extending in a second direction which intersects with the first direction. The second power supply wiring is arranged on one of the first conductive layer and the second conductive layer.

Abstract: An inkjet chip including a substrate, a plurality of control elements, an insulating layer, a plurality of first conductive patterns, a plurality of second conductive patterns and a plurality of heaters is provided. The insulating layer is disposed on the control element and has a plurality of openings. The openings each have a first length in a first direction. Each first conductive pattern has a first sidewall overlapping one of the openings and is electrically connected between one of the control elements and one of the heaters. Each second conductive pattern has a second sidewall overlapping the one of the openings and is electrically connected to one of the heaters. A distance in the first direction is included between the first sidewall and the second sidewall opposing to each other. The distance is less than the first length. A thermal bubble inkjet printhead adopting the inkjet chip is also provided.

Abstract: The present disclosure relates to the technical field of printer consumables, in particular to threshold variable feedback circuit, consumable chip and consumables. The feedback circuit comprises a control unit; a feedback module including four different feedback units connected in parallel between the output terminal and the ground; each one of the feedback units comprises a gating component and feedback component that are connected in series between the output terminal and the ground; the control unit is electrically connected with the gating component of each one of the feedback units such that the feedback module selects and outputs an electrical signal of one of the feedback units to the output terminal. Selecting different feedback units can generate different feedback voltages to respond to the verification requirements of the imaging device, so that the consumable can pass the verification of the imaging device.

Abstract: A drop ejector array device includes a first plurality and a second plurality of drop ejectors that are alternatingly disposed along an array direction on the substrate surface. A voltage input terminal and a current return terminal are disposed on the substrate surface. A first power bus line connects the first plurality to the voltage input terminal. A second power bus line connects the second plurality to the voltage input terminal. The second power bus line is electrically connected to the first power bus line by a primary power bus connector line. A first current return bus line connects the first plurality to the current return terminal. A second current return bus line connects the second plurality to the current return terminal. The second current return bus line is electrically connected to the first current return bus line by a primary current return bus connector line.

Abstract: In some examples, a fluid dispensing die includes a plurality of fluid actuators to cause dispensing of a fluid from respective nozzles of the fluid dispensing die, and an electrically conductive layer including electrically conductive ground structures to connect respective fluid actuators of the plurality of fluid actuators to a ground, wherein the electrically conductive layer includes gaps provided between the electrically conductive ground structures of the electrically conductive layer.

Abstract: A heating device includes a heater to heat an object to be heated, a temperature detector to detect a surface temperature of the heater, a power calculator to calculate a power consumption of the heater, an abnormality detector to detect an abnormality of the temperature detector, and circuitry to cause the heater to increase the surface temperature of the heater from a first temperature to a second temperature higher than the first temperature; cause the power calculator to calculate the power consumption of the heater increased to the second temperature; cause the abnormality detector to compare the power consumption calculated by the power calculator and a predetermined threshold value; and cause the abnormality detector to determine that the temperature detector is abnormal when the power consumption calculated by the power calculator is equal to or larger than the predetermined threshold value.

Abstract: Examples include a fluid ejection die embedded in a molded panel. The fluid ejection die comprises a substrate, and the substrate includes an army of nozzles extending therethrough. The substrate has a first surface in which nozzle orifices are formed and a second surface, opposite the first surface, in which nozzle inlet openings are formed. The fluid ejection die is embedded in the molded panel such that the first surface of the substrate is approximately planar with a top surface of the molded panel. The molded panel has a fluid channel formed therethrough in fluid communication with the nozzle inlet openings of the array of nozzles.

Abstract: A method of making a plurality of integrated circuit (“IC”) packages includes picking up a plurality of physically unconnected IC components; and simultaneously placing each of the physically unconnected IC components on corresponding portions of an unsingulated IC package strip that includes a sheet of integrally connected leadframes.

Abstract: A liquid discharge head that can prevent occurrence of cracks generated by a connection between an electrode pad and a wiring while reducing a manufacturing cost is provided. A bonding portion and a non-bonding portion are disposed at positions where the bonding portion and the non-bonding portion overlap an electrode and a coating film but do not overlap a through hole in a planar view of a liquid discharge head substrate.

Abstract: A liquid discharge head substrate comprising a liquid discharge element arranged above a surface of a substrate, an insulator arranged between the surface and the liquid discharge element, a liquid supply port extending through the insulator, first and second conductive patterns is provided. The first pattern connects an element arranged on the surface and the liquid discharge element. The second pattern surrounds the liquid supply port. The insulator includes first and second films that are bonded at a bonding surface along the surface. A first member arranged in the first film and a second member arranged in the second film, of the first pattern, are bonded at the bonding surface. A third member arranged in the first film and a fourth member arranged in the second film, of the second pattern, are bonded at the bonding surface.

Abstract: An inkjet head includes: an ink ejector in which an opening of a nozzle is provided in an ink ejection surface, and which includes an actuating element that performs an operation for ejecting ink; a wiring board that is provided with a circuit wiring electrically connected to the actuating element, and is disposed in a direction crossing the ink election surface on a side opposite to the ink ejection surface of the ink ejector; an exterior member that covers the ink ejector and the wiring board while exposing the ink ejection surface of the ink ejector and a part of the wiring board; and a wiring cable that is attached to a connection terminal disposed in an area exposed front the exterior member on one surface of the wiring board so as to be electrically connected to the circuit wiring.

Abstract: A print head includes a first substrate having 600 or more piezoelectric elements aligned at a density of 300 or more per inch for ejecting liquid, a second substrate, and a flexible wiring substrate that connects the first substrate and the second substrate, in which the flexible wiring substrate is a multilayer substrate in which a conductive metal and a nonconductive resin are laminated and the nonconductive resin is pressure bonded.

Abstract: A drop ejector array device includes a first plurality and a second plurality of drop ejectors that are alternatingly disposed along an array direction on the substrate surface. A voltage input terminal and a current return terminal are disposed on the substrate surface. A first power bus line connects the first plurality to the voltage input terminal. A second power bus line connects the second plurality to the voltage input terminal. The second power bus line is electrically connected to the first power bus line by a primary power bus connector line. A first current return bus line connects the first plurality to the current return terminal. A second current return bus line connects the second plurality to the current return terminal. The second current return bus line is electrically connected to the first current return bus line by a primary current return bus connector line.

Abstract: Provided is a method of producing a structure including a substrate having openings in a first surface and a lid structure formed on the first surface and having an opening portion communicating with a part of the openings. The method includes preparing a laminate by forming a layer containing a photosensitive resin composition on a base film, stacking the laminate on the first surface such that the first surface is in contact with the photosensitive resin composition-containing layer, and forming a pattern for the opening portion of the lid structure in the photosensitive resin composition-containing layer by pattern exposure of the layer through the base film. The maximum scattering light intensity of the base film at a scattering angle of 10° or more is 1/100000 or less of the light intensity at a scattering angle of 0°, at a wavelength of 400 nm.

Abstract: A liquid discharging head substrate, in which driving elements for driving discharging elements are arranged, the substrate comprising a conductive film, for supplying a power-supply voltage to the driving elements, provided to cover the driving elements in a plan view, and a power-supply pad, for receiving the power-supply voltage, provided at an end of the substrate in the plan view, wherein the conductive film has an outer shape that is not linearly symmetrical in the plan view, openings are formed in the conductive film, the conductive film has a first portion and a second portion whose impedance from the pad in the conductive film is smaller than that of the first portion, and the substrate further comprises a conductive pattern connecting the first portion and the second portion.

Abstract: A recording element substrate includes a signal supply circuit and a common line which connects the signal supply circuit to first logic circuit array for a recording element and a second logic circuit array for a memory element in common. Furthermore, the first and second logic circuit arrays extend along a direction in which the common line extends, the first logic circuit array is disposed on one side of the common line, the second logic circuit array is disposed on the other side of the common line, and the first and second logic circuit arrays are arranged so that at least a portion of the first logic circuit array and a portion of the second logic circuit array overlap with each other in a direction orthogonal to the extending direction.

Abstract: A recording element substrate includes a recording module including a plurality of recording elements and first logic circuits corresponding to the plurality of recording elements, a memory module including a plurality of memory elements and second logic circuits corresponding to the plurality of memory elements, and a common line configured to connect a signal supply circuit to the plurality of first logic circuits and the plurality of second logic circuits in common. The recording elements are arranged along an extending direction in which the common line extends, and the memory modules are disposed between the common line and the recording elements.

Abstract: In some examples, printing fluid cartridge comprises a housing and an assembly supported by the housing. The assembly comprises a molding and a non-fluid dispensing die electronic device embedded in the molding.

Abstract: A recording element substrate includes a substrate, a plurality of energy generating elements arranged on the substrate to form an element row, a plurality of supply ports arranged along the element row to form a supply port row, and a plurality of supply paths extending from the plurality of supply ports along the thickness direction of the substrate, wherein a plurality of beam portions disposed between adjacent supply ports in the direction of the supply port row has a plurality of conductor layers in which a conductor layer including a power supply conductor connected to the energy generating elements and a conductor layer including a ground conductor connected to the energy generating elements, are stacked along the thickness direction of the substrate, and wherein at least one of the plurality of conductor layers is occupied by one power supply conductor or one ground conductor.

Abstract: Disclosed is a head unit including: a plurality of ejecting units that eject liquids; a driving IC that drives the plurality of ejecting units; a first substrate; a second substrate; a first electrode; and a second electrode, the first electrode electrically connects the first wiring and the third wiring with each other, the second electrode electrically connects the second wiring and the third wiring with each other, the driving IC is overlapped with the first substrate in plan view of the first substrate, and the signal from the second substrate is transmitted from the second substrate in order of the first terminal, the first wiring, the first electrode, the third wiring, the second electrode, and the second wiring.

Abstract: A discharge element substrate comprises a plurality of discharge elements each including a first electrical contact and a second electrical contact, a plurality of driving circuits arranged in a first direction and each connected to the plurality of discharge elements, and a plurality of driving wiring lines extending in a second direction that intersects with the first direction and configured to connect the plurality of driving circuits and the first electrical contact of the plurality of discharge elements. A length, in the second direction, of a first driving wiring line connecting the first driving circuit and the first electrical contact of the first discharge element is shorter than a length, in the second direction, of a second driving wiring line connecting the second driving circuit and the first electrical contact of the second discharge element.

Abstract: An element substrate of a liquid ejection head includes: a base material; an insulating film positioned on the base material; a heating resistance element for generating heat energy for ejecting a liquid; a protective film for covering the heating resistance element; a first electrical wiring layer arranged in the insulating film, for supplying a current to the heating resistance element; a second electrical wiring layer arranged on a layer different from the first electrical wiring layer in the insulating film, for supplying a current to the heating resistance element; and at least one connecting member extending into the insulating film to connect the first electrical wiring layer and the heating resistance element, for causing the current to flow in a first direction, the heating resistance element including a connecting region, extending in a second direction intersecting the first direction, to which the at least one connecting member is connected.

Abstract: An inkjet nozzle device includes a MEMS structure in contact with ink, wherein a tantalum oxide layer is deposited on at least part of the MEMS structure for inhibiting corrosion by the ink.

Abstract: A method for manufacturing a liquid ejection head substrate, in which a heat storage layer, a pair of electrodes extending from the surface of the heat storage layer toward the back surface, a heat-generating resistor layer in contact with the pair of electrodes and the surface of the heat storage layer, and a first cover layer configured to cover the heat-generating resistor layer are stacked, includes the steps of etching the heat-generating resistor layer and the first cover layer by using a mask disposed on a substrate including the heat-generating resistor layer and the first cover layer, removing the mask, and forming a second cover layer configured to cover an end portion of the heat-generating resistor layer in that order.

Abstract: A printhead having a number of single-dimensional memristor banks is described. The printhead includes a number of nozzles to deposit an amount of fluid onto a print medium. Each nozzle includes a firing chamber to hold the amount of fluid, an opening to dispense the amount of fluid onto the print medium, and an ejector to eject the amount of fluid through the opening. The printhead also includes a number of single-dimensional memristor banks. Each memristor bank includes a number of memristors arranged in a single dimension and a number of serially-connected de-multiplexers to selectively activate a target memristor of the memristor bank. The number of serially-connected de-multiplexers is equal to the number of memristors and an output of at least one de-multiplexer is an input into a subsequent de-multiplexer.

Abstract: The present disclosure is directed to a microfluidic die that includes ejection circuitry and one time programmable memory with a minimal number of contact pads to external devices. The die includes a relatively large number of nozzles and a relatively small number of contact pads. The die includes decoding circuitry that utilizes the small number of contact pads to control the drive and ejection of the nozzles and the reading/writing of the memory with the same contact pads.

Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.

Abstract: A piezoelectric device includes an actuator substrate that includes two rows of piezoelectric element rows piezoelectric elements, and a wiring substrate that is disposed so as to face the actuator substrate. The piezoelectric element rows include individual electrodes disposed for each of the piezoelectric elements, and a common electrode common to the piezoelectric elements. The wiring substrate includes a core portion disposed on a surface on the actuator substrate side, an individual wiring portion disposed for each of the piezoelectric element rows that partially covers the core portion, and a common wiring portion disposed for each of the piezoelectric element rows that partially covers the core portion. The two rows of piezoelectric element rows are respectively disposed so as to interpose the core portion. The individual wiring portion and the common wiring portion are respectively electrically connected to the individual electrode and the common electrode.

Abstract: Printing devices and methods are described. An array of ink nozzles can be arranged in a number of primitives, wherein a first primitive of the number of primitives is interdigitated with a second primitive.

Abstract: A liquid ejecting head and a liquid ejecting apparatus are designed so as to suppress the influence of noise on control signals. The liquid ejecting head has a plurality of terminals electrically connected with a contact point provided in the liquid ejecting apparatus, and a liquid ejecting element substrate having a liquid ejecting element formed for ejecting liquid in response to the control signals transmitted from the liquid ejecting apparatus. A power source terminal for drive and a ground terminal for drive, which are provided for driving the liquid ejecting element, are arranged adjacent to each other, and a power source wiring that connects the power source terminal for drive with the liquid ejecting element substrate and a ground wiring that connects the ground terminal for drive with the liquid ejecting element substrate are at least partially arranged in parallel.

Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.

Abstract: A liquid crystal panel (LCD) may include: a flexible liquid crystal panel; and a housing unit for housing the liquid crystal panel. The housing unit may have an integrated structure which includes a bottom surface, a side surface connected from the bottom surface, and a top fixing end connected from the side surface, the liquid crystal panel may be housed between the bottom surface and the top fixing end, and the housing unit may be formed of a flexible soft material.

Abstract: A liquid crystal display with a narrow bezel area includes a liquid crystal display panel displaying an image, a light source unit supplying light to the liquid crystal display panel, a light guide plate converting light irradiated by the light source unit into planar light, a cover bottom which includes a bottom part and side walls extending from edges of the bottom part to an upper side and receives the light source unit and the light guide plate, and a supporting member which surrounds an external surface of the cover bottom, extends from an upper part of the light guide plate to the inside of the cover bottom, and supports the liquid crystal display panel.

Abstract: A printhead with a number of memristors and a parallel current distributor is described. The printhead includes a number of nozzles to deposit an amount of fluid onto a print medium. Each nozzle includes a firing chamber to hold the amount of fluid, an opening to dispense the amount of fluid onto the print medium, and an ejector to eject the amount of fluid through the opening. The printhead also includes a number of memristor cells. Each memristor cell includes a memristor to store information and a multiplexing component to select a memristor. The printhead also includes and at least one current distributor connected in parallel to a number of memristor cells.

Abstract: Even if electrostatic discharge occurs, dielectric breakdown of an insulating layer for covering an element on a base substrate is inhibited. A substrate for an ink jet recording head includes: a base substrate including an element configured to apply energy for ejecting ink to ink and an insulating protective layer for covering the element; an ejection orifice forming member including an insulating first member for forming an ink flow path for supplying ink to the element and a second member including an ejection orifice surface having ejection orifices provided therein; and a columnar conductive member extending between the second member and the base substrate in a direction intersecting the ejection orifice surface.

Abstract: At an area corresponding to a pressure chamber, the width of a lower electrode film in a nozzle row direction is narrower than the width of the pressure chamber in the same direction. A vibrating plate at the area corresponding to a pressure chamber includes an area P1, an area P2, and an area P3. The area P1 is an area on which the piezoelectric layer to be an activation portion is stacked. The area P2 is an area on which the piezoelectric layer to be an inactivation portion is stacked. The area P3 is an area on which the piezoelectric layer is not stacked. When the thicknesses of the vibrating plate at the areas P1, P2 and P3 are set to, respectively, t1, t2, and t3, the following expression is satisfied: t1>t2?t3 (1).

Abstract: There is provided a recording apparatus including: a recording section that performs recording on a recording medium; a cable relay section that is provided between a first area, in which the recording section is arranged, and a second area in which a control section for control is arranged, and that relays cables; a first cable that is configured to extend from the recording section and is connected to the cable relay section on a side of the first area; and a second cable that is configured to extend from the control section and is connected to the cable relay section on a side of the second area.

Abstract: An inkjet nozzle device includes a resistive heater element for ejecting ink droplets through a nozzle opening. The resistive heater element includes: an aluminide layer having a native passivating oxide and a tantalum oxide layer disposed on the native passivating oxide of the aluminide layer. The tantalum oxide layer is a relatively thin layer, which may be deposited using atomic layer deposition.

Abstract: A method of forming a stacked wiring includes forming a first adhesion layer on a substrate, forming a first wiring on the first adhesion layer, etching the first adhesion layer and the first wiring by the same first wet etching so that the first wiring is in a reverse trapezoid shape in which a first width of a top surface is larger than a second width of a bottom surface contacting the first adhesion layer as a cross-section in a direction intersecting with a first wiring extending direction, covering the top surface and a side surface of the first wiring with a second adhesion layer, forming a second wiring on the second adhesion layer, and etching the second adhesion layer and the second wiring by the same second wet etching so that the second adhesion layer and the second wiring remain on only the top surface of the first wiring.

Abstract: A liquid discharge head including a substrate having a plurality of energy-generating elements which generates energy used to discharge a liquid, and a supply port which is a through-hole for supplying the liquid to the energy-generating elements and which extends along an arrangement direction of the plurality of the energy-generating elements; and a discharge port forming member having a plurality of discharge ports for discharging the liquid and a pair of beam-shaped projections which are parallel to each other, which project toward the substrate, and which are formed along the arrangement direction at positions opposing to the supply port, wherein an interval of the pair of beam-shaped projections is larger than a length of the pair of beam-shaped projections in a direction orthogonal to the arrangement direction of the pair of beam-shaped projections.

Abstract: In one example, a molded printhead includes a printhead die embedded in a molding and an external electrical contact electrically connected to the printhead die and exposed outside the molding to connect to circuitry external to the printhead. The molding has a channel therein through which fluid may pass to the back part of the die. The front part of the die is exposed outside the molding and the back part of the die is covered by the molding except at the channel and the thickness of the molding varies from a lesser thickness around the die to a greater thickness away from the die.

Abstract: A liquid ejection head including a recording element substrate at one side portion of which an electrode is provided, an electric wiring board arranged opposing to the one side portion of the recording element substrate, a connecting member connecting the electrode provided at the one side portion of the recording element substrate to an electrode terminal provided on the electric wiring board, a sealing member formed across the one side portion of the recording element substrate and the electric wiring board so as to cover the connecting member, and a dummy sealing member provided so as to cover an opposite side portion on the side opposite to the one side portion of the recording element substrate.

Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.

Abstract: At an area corresponding to a pressure chamber, the width of a lower electrode film in a nozzle row direction is narrower than the width of the pressure chamber in the same direction. A vibrating plate at the area corresponding to a pressure chamber includes an area P1, an area P2, and an area P3. The area P1 is an area on which the piezoelectric layer to be an activation portion is stacked. The area P2 is an area on which the piezoelectric layer to be an inactivation portion is stacked. The area P3 is an area on which the piezoelectric layer is not stacked. When the thicknesses of the vibrating plate at the areas P1, P2 and P3 are set to, respectively, t1, t2, and t3, the following expression is satisfied: t1>t2?t3??(1).

Abstract: A wiring substrate includes a device substrate having a first surface, a sealing plate having a second surface superimposed on the first surface via an adhesive film and crossing the first surface, and wires set along the surfaces of the first surface, the adhesive film, and the second surface. The wiring substrate includes, between the wires adjacent to each other, a recessed section forming a recess with respect to a first bonding surface of the adhesive which is in contact with the first wire and a second bonding surface of the adhesive which is in contact with the second wire.

Abstract: A semiconductor device includes unit circuits arranged in a first direction, a bonding pad, and electrically conductive patterns configured to connect the unit circuits to the bonding pad. Each of the electrically conductive patterns includes a first portion connected to the bonding pad and extending in the first direction, and a second portion connected to the corresponding unit circuit. The electrically conductive patterns include a first type pattern in which the first portion is positioned on a first side of the second portion in a view from the first direction, and a second type pattern in which the first portion is positioned on a second side, which is opposite to the first side, of the second portion in a view from the first direction.

Abstract: Provided are a liquid ejection head and a liquid ejection apparatus which can reduce the distance between an ejection port and a medium as much as possible and can apply liquid to a desired position, even in the case where a member protruding more toward a liquid ejection direction than an ejection port is provided. A liquid ejection apparatus applies liquid to a medium by using a liquid ejection head including an ejection port ejecting the liquid and a member protruding more toward a liquid ejection direction than an ejection port face where the ejection port is formed, wherein a first distance between the ejection port and the medium is smaller than a sum of a second distance from the ejection port face to a tip of the member in the ejection direction and a third distance from the tip to the medium.

Abstract: A fluid ejection assembly includes a fluid slot formed in a die. The assembly also includes a nozzle column is formed along a side of the fluid slot. The assembly also includes a pair of thermal sensors to measure die temperature at the middle of the nozzle column and at a first end of the nozzle column.