Wiring Patents (Class 347/58)
  • Patent number: 8529022
    Abstract: A flexible circuit substrate has an integrated circuit mounted on the substrate, a first set of traces arranged to connect between a first voltage source and a first set of connectors on the integrated circuit, a second set of traces arranged to connect between a second voltage source and a second set of connectors on the integrated circuit, and a gap in the flexible circuit substrate between the first and second set of traces, the gap of sufficient width to stop an electrical arc-tracking between the first set of traces and the second set of traces. The substrate may have a second gap between the first gap and other traces.
    Type: Grant
    Filed: December 7, 2011
    Date of Patent: September 10, 2013
    Assignee: Xerox Corporation
    Inventors: Mirza Sabanovic, David P Platt, Chad David Freitag, Joseph Andrew Broderick
  • Patent number: 8523329
    Abstract: An inkjet printhead substrate includes: a pair of individual conductive layers configured to supply electrical power to a heat generation element; a first common conductive layer configured to be connected to one of the pair of individual conductive layers; a second common conductive layer configured to be connected to the other of the pair of individual conductive layers; and an isolation layer configured to be provided between the one of the pair of individual conductive layers and the first common conductive layer, and between the other of the pair of individual conductive layers and the second common conductive layer, wherein the isolation layer is formed from a conductive material which has a lower solubility in ink than a material used for the pairs of individual conductive layers, the first common conductive layer and the second common conductive layer.
    Type: Grant
    Filed: February 9, 2011
    Date of Patent: September 3, 2013
    Assignee: Canon Kabushiki Kaisha
    Inventors: Yuji Tamaru, Yoshiyuki Imanaka, Hideo Tamura
  • Patent number: 8523330
    Abstract: A recording apparatus includes a liquid droplet discharging head and a tank. The liquid droplet discharging head discharges a liquid droplet. The tank supplies a liquid to the liquid droplet discharging head. The liquid droplet discharging head includes a liquid droplet discharging head circuit board including a board substrate and a writing pattern. The wiring pattern is located on the board substrate to supply power and includes a plurality of divided wiring patterns formed by dividing at least a part of the wiring pattern in a width direction of the wiring pattern.
    Type: Grant
    Filed: February 2, 2007
    Date of Patent: September 3, 2013
    Assignee: Ricoh Company, Ltd.
    Inventor: Kaichi Ueno
  • Patent number: 8517517
    Abstract: A liquid discharge head includes a recording element substrate including an energy generation element for generating energy used to discharge a liquid and a terminal electrically connected to the energy generation element, and an electric wiring board including an electrode electrically connected to the terminal via a wire to transmit an electric signal supplied from outside to the energy generation element, wherein the terminal has an area twice or more larger than a contact area between the terminal and the wire and the electrode has an area twice or more larger than a contact area between the electrode and the wire.
    Type: Grant
    Filed: June 6, 2011
    Date of Patent: August 27, 2013
    Assignee: Canon Kabushiki Kaisha
    Inventors: Hiroshi Abe, Toshiaki Hirosawa
  • Publication number: 20130215200
    Abstract: According to the present disclosure, a manufacturing method of a fine wiring pattern is disclosed. The manufacturing method includes preparing a support member, forming a first layer on the support member by thick-film printing, and forming a second layer including Ag on the first layer by the thick-film printing. The method also includes forming a predetermined fine wiring pattern by performing an etching process upon the first layer and the second layer.
    Type: Application
    Filed: January 23, 2013
    Publication date: August 22, 2013
    Applicant: ROHM CO., LTD.
    Inventor: ROHM CO., LTD.
  • Patent number: 8506055
    Abstract: A MEMS integrated circuit includes a silicon substrate having a frontside with a drive circuitry layer and a backside. A MEMS layer is disposed on the drive circuitry layer. The MEMS layer includes a plurality of MEMS devices electrically connected to the drive circuitry layer. Integrated circuit contacts are positioned at a backside of the substrate. The integrated circuit contacts are electrically connected to the drive circuitry layer via respective connector rods extending through the substrate.
    Type: Grant
    Filed: August 3, 2011
    Date of Patent: August 13, 2013
    Assignee: Zamtec Ltd
    Inventors: Gregory John McAvoy, Rónán Pádraig Seán O'Reilly, David McLeod Johnstone, Kia Silverbrook
  • Patent number: 8500251
    Abstract: An ink-jet recording apparatus includes a recording head which jets inks, and a cable which is connected to the recording head and which is provided with a driving circuit for applying a driving voltage of the recording head. The recording head is formed with nozzle arrays for jetting an ink of a dark color and an ink of a light color respectively. The nozzle array, which jets the ink of the dark color, is disposed farther from the driving circuit than the nozzle array which jets the ink of the light color. The nozzle array, which jets the ink of the dark color, is hardly affected by the heat from the driving circuit. Therefore, the deterioration of the recording quality, which would be otherwise caused by the disturbance of ink discharge from nozzles, is suppressed.
    Type: Grant
    Filed: January 3, 2005
    Date of Patent: August 6, 2013
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventor: Tomoyuki Kubo
  • Patent number: 8500250
    Abstract: A liquid discharge head includes: a recording element substrate and a plurality of electric connection units; and an electric wiring member that includes a plurality of input terminals, a plurality wirings held between films and electrically connected to the plurality of input terminals, and a plurality of lead lines conducted to the plurality of wirings. In this case, the plurality of wirings include a power line for supplying power to the energy generation elements and a signal line for supplying a signal to the energy generation elements. Relationships of A>B and B<D are satisfied, in which A is a largest width of the signal line, B is a largest width of the lead line connected to the signal line, and D is a largest width of the lead line connected to the power line.
    Type: Grant
    Filed: January 23, 2012
    Date of Patent: August 6, 2013
    Assignee: Canon Kabushiki Kaisha
    Inventors: Keisuke Iinuma, Hiromasa Amma, Kyosuke Toda
  • Patent number: 8491100
    Abstract: A piezoelectric ink jet head that includes a polymer film, for example a flex print, located between the piezoelectric element and the reservoirs in the jet body. The film provides an efficient seal for the reservoirs and also positions the electrodes on the side of the piezoelectric element in which motion is effected, which can reduce the magnitude of the drive voltage. This location of the compliant flex print material also can enhance electrical and mechanical isolation between reservoirs, which improves jetting accuracy. The compliance of the polymer also reduces strain on the ink jet head.
    Type: Grant
    Filed: December 2, 2008
    Date of Patent: July 23, 2013
    Assignee: FUJIFILM Dimatix, Inc.
    Inventors: Edward R. Moynihan, Paul A. Hoisington, Yong Zhou, Amy L. Brady, Robert G. Palifka
  • Patent number: 8485638
    Abstract: An inkjet printhead includes: a substrate having a drive circuitry layer; a plurality of nozzle assemblies disposed on an upper surface of the substrate and arranged in one or more nozzle rows extending longitudinally along the printhead; a nozzle plate extending across the printhead; and a conductive track disposed on the nozzle plate which extends longitudinally along the printhead and parallel with the nozzle rows. The conductive track is connected to a common reference plane in the drive circuitry layer via a plurality of conductor posts extending between the drive circuitry layer and the conductive track.
    Type: Grant
    Filed: October 1, 2010
    Date of Patent: July 16, 2013
    Assignee: Zamtec Ltd
    Inventors: Gregory John McAvoy, Rónán Pádraig Seán O'Reilly, Julie Catherine Hogan
  • Patent number: 8469493
    Abstract: A flexible wiring member which connects a device and an external signal source has a plurality of wire members in which a plurality of wires are formed on one surface of a substrate, and a plurality of wire members is stacked to face the device. A plurality of bumps for connecting with the device are provided to the wires on a surface, of the wirings, facing the device. Bumps of one of the wire members overlapping with the other of the wire members face the device via the through hole formed in the other of the wire members. Accordingly, it is possible to realize high densification of wires in the flexible wiring while suppressing a rise in a cost.
    Type: Grant
    Filed: June 19, 2008
    Date of Patent: June 25, 2013
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventors: Tomoyuki Kubo, Hirofumi Kondo
  • Patent number: 8469491
    Abstract: A wiring structure including printed circuits each including: a base member including one end portion facing an actuator and the other end portion of the base member drawn from the one end portion along a face of the actuator and then turned, the other end portion extending in parallel with the one end portion; output terminals formed on the one end portion and configured to output signals to the actuator; a drive IC mounted on the base member and connected to the output terminals by wirings; and input terminal formed on the other end portion and connected to the drive IC by wirings to input signals to the drive IC, wherein the printed circuits are arranged in a predetermined direction along the face of the actuator, wherein the one end portions of the respective base members are arranged in the predetermined direction, and wherein the other end portions of the respective base members are arranged in the predetermined direction.
    Type: Grant
    Filed: March 28, 2011
    Date of Patent: June 25, 2013
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventor: Toru Yamashita
  • Publication number: 20130120502
    Abstract: Provided is an inkjet print head in which, without causing an increase in print head size, printing elements that can perform ejection at a high frequency are densely arrayed. For this purpose, an ink supplying port and a wiring line, which are common to a predetermined number of printing elements, are prepared, and a substrate on which the ink supplying ports and the wiring lines are alternately arranged at the same pitches as an array pitch of the printing elements is also prepared.
    Type: Application
    Filed: November 8, 2012
    Publication date: May 16, 2013
    Applicant: CANON KABUSHIKI KAISHA
    Inventor: CANON KABUSHIKI KAISHA
  • Patent number: 8439485
    Abstract: A liquid discharge head includes a heat accumulation layer provided on a board, an energy generation element configured to generate energy to discharge liquid from a discharge port and including a heat generation resistor layer provided on the heat accumulation layer and formed of a material configured to generate heat through supply of electricity and a pair of electrodes connected to the heat generation resistor layer, and an insulation layer including a silicon compound and provided so as to cover the energy generation element, and a line formed of a metal material provided between the heat accumulation layer and the insulation layer, and in at least a portion at a position closer to a flow path than the energy generation element.
    Type: Grant
    Filed: May 20, 2011
    Date of Patent: May 14, 2013
    Assignee: Canon Kabushiki Kaisha
    Inventors: Yuji Tamaru, Yoshiyuki Imanaka, Koichi Omata, Hideo Tamura, Kousuke Kubo, Ryoji Oohashi
  • Patent number: 8439483
    Abstract: A liquid ejection head includes a chip having a liquid ejection pressure generating element and an electrode terminal for electrically connecting the liquid ejection pressure generating element to an external source, an electrical wiring board having a lead wiring to be electrically connected to the electrode terminal, and a lead sealing material for covering an electrical connection portion between the electrode terminal and the lead wiring. The lead sealing material contains an epoxy resin which has an average number of functional groups per molecule of more than two and is solid at 25° C., an acid anhydride curing agent having a polybutadiene backbone, a curing accelerator, and an inorganic filler.
    Type: Grant
    Filed: April 8, 2011
    Date of Patent: May 14, 2013
    Assignee: Canon Kabushiki Kaisha
    Inventors: Hiroki Kihara, Tadayoshi Inamoto, Isao Imamura, Yoshihiro Hamada
  • Patent number: 8425012
    Abstract: A method includes preparing a liquid ejection recording head that includes a substrate including an element generating energy used to eject liquid, a first supporting portion supporting the substrate, a wiring member including a plurality of electrode leads connected to a plurality of electrode pads provided for the substrate, and a second supporting portion supporting the wiring member, the wiring member including a vent that communicates with a region defined by the substrate, the first supporting portion, and the electrode leads and also communicates with an atmosphere, applying a sealing member to surfaces of the electrode leads, and sucking air in the region through the vent to introduce the sealing member into the region.
    Type: Grant
    Filed: December 15, 2010
    Date of Patent: April 23, 2013
    Assignee: Canon Kabushiki Kaisha
    Inventor: Kyosuke Toda
  • Patent number: 8419167
    Abstract: A liquid discharge head includes a recording element substrate including a recording element that generates energy for discharging liquid from a discharge port, a base plate including a mounted surface on which the recording element substrate is mounted, an electric wiring substrate including a portion disposed on another surface of the base plate different from the mounted surface, adjacent to the mounted surface, and configured to be electrically connected to the recording element substrate, and an shield member having electric conductivity and configured to shield the portion.
    Type: Grant
    Filed: May 10, 2011
    Date of Patent: April 16, 2013
    Assignee: Canon Kabushiki Kaisha
    Inventors: Kyota Miyazaki, Toshiaki Hirosawa, Hiroki Tajima, Akira Yamamoto
  • Patent number: 8403450
    Abstract: A liquid ejection head including: a flow channel unit including a nozzle plate, and a flow-channel-containing substrate (FCC), the nozzle plate and the FCC being laminated, a head case formed with a common liquid flow channel configured to supply the liquid to the reservoir and joined to the FCC on the side opposite from the nozzle plate; a heater configured to heat the nozzle plate; a head cover heated by the heater and formed with a bottom surface portion opposing the nozzle plate on the side opposite from the head case, wherein a distal end of the head cover comes into abutment with a portion between an area of the nozzle plate corresponding to the reservoir and an area formed with the nozzle row, and a void is formed between the area of the nozzle plate corresponding to the reservoir and the head cover.
    Type: Grant
    Filed: April 6, 2011
    Date of Patent: March 26, 2013
    Assignee: Seiko Epson Corporation
    Inventors: Masahiko Sato, Hiroyuki Hagiwara, Haruhisa Uezawa
  • Patent number: 8398211
    Abstract: A method of producing a recording head including a substrate provided with an element that generates energy utilized for ejecting a liquid, a wiring member that is connected to the substrate, and a supporting member that supports the substrate and the wiring member includes applying a sealant to a region existing between a side surface of the substrate and the supporting member through a communicating path that connects the region to an outer peripheral area of the supporting member.
    Type: Grant
    Filed: October 15, 2010
    Date of Patent: March 19, 2013
    Assignee: Canon Kabushiki Kaisha
    Inventor: Ryo Shimamura
  • Patent number: 8398209
    Abstract: An integrated structure of an inkjet head and an antenna includes a metal heat dissipation board, a flexible (or rigid) circuit board and an antenna module. The metal heat dissipation has an elongated printing ribbon. The flexible (or rigid) circuit board is mounted on the metal heat dissipation board, and has one end electrically connected with the printing ribbon and the other end having a plurality of parallel circuits mounted thereon and connected to external control circuits. The antenna module is directly mounted on and electrically connected with the flexible (or rigid) circuit board. Given the integrated structure, the antenna module is effectively mounted on the inkjet head to reduce the size of the structure and lower the cost thereof.
    Type: Grant
    Filed: November 12, 2009
    Date of Patent: March 19, 2013
    Assignee: Godex International Co., Ltd.
    Inventors: Feng-Yi Tai, Ta-Cheng Hsiung
  • Patent number: 8371678
    Abstract: The invention provides for a printhead assembly that has a number of modular PCBs and a number of printhead integrated circuits (ICs). Each of the printhead IC's is respectively connected to one of the modular PCBs for operative control. Modular supports in the assembly define a raised portion and a recessed portion at an end thereof. Each PCB has electrical connecting strips which operatively overlie the respective recessed portions. At least one connecting member operatively connects respective PCBs to each other. Each connecting member has a series of parallel spaced conducting strips. The member is shaped and configured for fitment into a cavity defined by the raised and recessed portions of two abutting supports to connect the connecting strips of two PCBs via the conducting strips. The assembly also has a printer controller configured to synchronize operation of the respective PCBs during printing.
    Type: Grant
    Filed: December 20, 2009
    Date of Patent: February 12, 2013
    Assignee: Zamtec Ltd
    Inventors: Kia Silverbrook, Norman Michael Berry, Garry Raymond Jackson, Akira Nakazawa
  • Patent number: 8371668
    Abstract: A recording element substrate which is provided with a first recording element group and a second recording element group, each group including a plurality of recording elements.
    Type: Grant
    Filed: November 9, 2009
    Date of Patent: February 12, 2013
    Assignee: Canon Kabushiki Kaisha
    Inventors: Ryo Kasai, Tatsuo Furukawa, Nobuyuki Hirayama, Tomoko Kudo
  • Patent number: 8366242
    Abstract: A liquid-ejection head unit includes a head, an electric-circuit board, electronic components, and a storage tank. The head includes a frame member and ejects droplets of liquid. The electronic components are mounted on the electric-circuit board and connected to the head. The storage tank stores liquid supplied to the head. The electric-circuit board is disposed between the frame member of the head and the storage tank to form a single multi-layered structure. The electronic components of the electric-circuit board are accommodated in at least one of a first internal space defined by the frame member of the head and the electric-circuit board and a second internal space defined by the electric-circuit board and the storage tank.
    Type: Grant
    Filed: June 29, 2010
    Date of Patent: February 5, 2013
    Assignee: Ricoh Company, Ltd.
    Inventors: Tomohiko Koda, Kenichi Yoshimura, Tomiyoshi Takano, Mitsuru Kawakami, Masami Iwama
  • Patent number: 8360556
    Abstract: A wiring board to be connected to an object includes: contact points to be connected to the object; wires connected to the contact points; and a substrate on which the contact points and the wires are formed. The substrate has a first portion which has openings and overlaps with the object when the wiring board is connected to the object, and a second portion which is continuous to the first portion. The contact points include first contact points formed in the first portion on one surface of the substrate facing the object, and second contact points formed in the second portion, on the other surface of the substrate, at areas which do not overlap with the first contact points when the substrate is bent so that the first portion is overlapped with the second portion.
    Type: Grant
    Filed: March 4, 2011
    Date of Patent: January 29, 2013
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventors: Yusuke Suzuki, Atsushi Ito
  • Patent number: 8356884
    Abstract: An inkjet printhead integrated circuit (IC) includes: a substrate having a drive circuitry layer; a plurality of nozzle assemblies disposed on an upper surface of the substrate and arranged in one or more nozzle rows extending longitudinally along the printhead IC; a nozzle plate extending across the printhead IC; and a conductive track fused to the nozzle plate which extends longitudinally along the printhead IC and parallel with the nozzle rows. The conductive track is connected to a common reference plane in the drive circuitry layer via a plurality of conductor posts extending between the drive circuitry layer and the conductive track.
    Type: Grant
    Filed: October 1, 2010
    Date of Patent: January 22, 2013
    Assignee: Zamtec Ltd
    Inventors: Gregory John McAvoy, Rónán Pádraig Seán O'Reilly, Julie Catherine Hogan
  • Patent number: 8353576
    Abstract: A liquid discharge head includes a recording element substrate having a plurality of discharge ports for discharging liquid, and a plurality of recording elements for generating energy to discharge liquid, and an electric wiring substrate electrically connecting the recording element substrate and a driving circuit substrate having a circuit for driving the plurality of recording elements, the electric wiring substrate having a plurality of first electrical contact groups including a plurality of electrical contacts, for electrically connecting with the driving circuit substrate, provided along a disposed direction in which the plurality of discharge ports are disposed. The plurality of first electrical contact groups are detachably attached to a plurality of second electrical contact groups electrically connected with the driving circuit substrate, such that adjacent first electrical contact groups do not overlap each other in the disposed direction and in a direction orthogonal to the disposed direction.
    Type: Grant
    Filed: May 10, 2011
    Date of Patent: January 15, 2013
    Assignee: Canon Kabushiki Kaisha
    Inventors: Akira Yamamoto, Toshiaki Hirosawa, Hiroki Tajima, Kyota Miyazaki
  • Publication number: 20130010034
    Abstract: A liquid discharge head includes a recording element substrate including an electrode pad, a support member including a recess that supports the recording element substrate on a bottom surface thereof, an electric wiring member, and a sealant. The electric wiring member includes an opening through which the recording element substrate is exposed, an electric lead wire extending from the opening and connected to the electrode pad, and a protrusion formed in the opening and extending between a side surface of the recording element substrate and an inner side surface of the recess facing the side surface. A distal end of the protrusion is in contact with the bottom surface of the recess. The sealant is disposed in a region surrounded by a surface of the protrusion, the bottom surface of the recess, the inner side surface of the recess, and the side surface of the recording element substrate.
    Type: Application
    Filed: June 29, 2012
    Publication date: January 10, 2013
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Rumi Nagata, Hiromasa Amma, Keisuke Iinuma
  • Patent number: 8342655
    Abstract: A liquid discharge head includes a recording element substrate including an energy generating element, a wiring substrate including wiring, a support substrate for supporting the recording element substrate and the wiring substrate so that a side end portion of the recording element substrate and a side end portion of the wiring substrate are adjacent to each other, and a sealing member, wherein the side end portion of the wiring substrate has a step portion, a distance between a second portion of the step portion on the side opposite to the support substrate and the side end portion of the recording element substrate is larger than a distance between a first portion of the step portion on the side of the support substrate and the side end portion of the recording element substrate, and a part of the wiring is formed in the first portion.
    Type: Grant
    Filed: May 12, 2011
    Date of Patent: January 1, 2013
    Assignee: Canon Kabushiki Kaisha
    Inventors: Shimpei Otaka, Takayuki Ono
  • Patent number: 8328337
    Abstract: A liquid droplet discharge apparatus includes a liquid droplet discharge head having a plurality of nozzles which discharge liquid droplets and a pressure applying mechanism which selectively applies a pressure to discharge the liquid droplets from the nozzles; a first wiring board which is flexible and which is connected to the pressure applying mechanism; and a second wiring board which is connected to the first wiring board; and the first wiring board has a pair of extending portions which extend on mutually opposite sides from a connecting portion to be connected to the pressure applying mechanism, the pair of extending portions are bent so that forward end portions thereof face each other, and the second wiring board is connected to the pair of extending portions so that the second wiring board overlaps the mutually facing forward end portions of the pair of extending portions.
    Type: Grant
    Filed: September 27, 2010
    Date of Patent: December 11, 2012
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventor: Tomoyuki Kubo
  • Patent number: 8312628
    Abstract: A method for manufacturing a liquid discharge head includes heating the surface portion of power line that is to be in contact with a member made of resin, thereby forming, from a precious metal layer and a nickel layer, an adhesion layer made of an alloy containing precious metal and nickel as major components.
    Type: Grant
    Filed: August 11, 2010
    Date of Patent: November 20, 2012
    Assignee: Canon Kabushiki Kaisha
    Inventors: Sadayoshi Sakuma, Hirokazu Komuro, Takuya Hatsui, Yuzuru Ishida
  • Patent number: 8313172
    Abstract: The first and second cables overlap with each other while at an attitude where the wiring terminal formation surfaces face the same side, and the one-end-side common wiring terminal is located on the outside of the arrangement direction of the wiring terminals of the group of the one-end-side individual electrode wirings. The one end portions of the first and second cables are bent in the same direction so that the wiring terminals respectively face element terminals of piezoelectric elements, and the wiring terminals are respectively bonded to the corresponding element terminals.
    Type: Grant
    Filed: February 17, 2011
    Date of Patent: November 20, 2012
    Assignee: Seiko Epson Corporation
    Inventor: Yoshinao Miyata
  • Patent number: 8303092
    Abstract: A printhead is provided having corresponding nozzles, chambers and heaters. Each heater has a heater element and electrodes connecting current from a power source to the heater elements to heat, and form gas bubbles in, liquid within the chambers which causes ejection of the liquid from the nozzles. Each heater element has a cross section with a lateral dimension at least triple that of the thickness of that heater element and different than a lateral dimension of each other heater element of the corresponding chamber. The thickness of each heater element is less than 0.3 microns. The heater elements and associated electrodes are arranged so that the electrodes are non-coincident with the electrodes of the other heater elements.
    Type: Grant
    Filed: March 9, 2010
    Date of Patent: November 6, 2012
    Assignee: Zamtec Limited
    Inventor: Kia Silverbrook
  • Patent number: 8292407
    Abstract: In a liquid-discharging-head substrate including a plurality of ink supply ports, if lines are provided on the substrate between adjacent elements, energy generating elements cannot be arranged in high density. A liquid-discharging-head substrate according to the present invention includes an element array in which a plurality of elements configured to generate energy for discharging liquid are arranged, a first common line, a second common line, first individual lines configured to connect the elements and the first common line, and second individual lines configured to connect the elements and the second common line. The element array is provided between the first common line and the second common line, the first individual lines are provided in an area between the element array and the first common line, and the second individual lines are provided in an area between the element array and the second common line.
    Type: Grant
    Filed: October 29, 2010
    Date of Patent: October 23, 2012
    Assignee: Canon Kabushiki Kaisha
    Inventors: Nobuyuki Hirayama, Yusuke Imahashi
  • Patent number: 8287094
    Abstract: A printhead integrated circuit has a frontside comprising drive circuitry and inkjet nozzle assemblies, a backside for attachment to an ink supply manifold and ink supply channels providing fluid communication between the backside and the inkjet nozzle assemblies. The backside has a recessed portion for accommodating part of a connector film, which supplies power to the drive circuitry.
    Type: Grant
    Filed: July 27, 2009
    Date of Patent: October 16, 2012
    Assignee: Zamtec Limited
    Inventors: Gregory John McAvoy, Rónán Pádraig Seán O'Reilly, David McLeod Johnstone, Kia Silverbrook
  • Patent number: 8256877
    Abstract: An inkjet printhead assembly comprising an ink supply manifold; printhead integrated circuits and a connector film for supplying power to drive circuitry in the printhead integrated circuits. Each printhead integrated circuit has a frontside comprising the drive circuitry and inkjet nozzle assemblies, a backside attached to the ink supply manifold, and ink supply channels providing fluid communication between the backside and the inkjet nozzle assemblies. A connection end of the connector film is sandwiched between part of the ink supply manifold and the printhead integrated circuits.
    Type: Grant
    Filed: July 27, 2009
    Date of Patent: September 4, 2012
    Assignee: Zamtec Limited
    Inventors: Gregory John McAvoy, Rónán Pádraig Seán O'Reilly, David McLeod Johnstone, Kia Silverbrook
  • Patent number: 8251494
    Abstract: A printed wiring member includes a dielectric substrate; a patterned copper layer formed on the dielectric substrate. The patterned copper layer includes i) contact pads for wire bonding; ii) connector pads for making electrical connection with an electrical connector; and iii) conductor traces between contact pads and corresponding connector pads. A nickel coating is formed on the contact pads and the connector pads, and a gold layer is formed on the nickel coating on the contact pads and the connector pads. A palladium deposit is formed on the gold layer on at least the connector pads.
    Type: Grant
    Filed: November 30, 2009
    Date of Patent: August 28, 2012
    Assignee: Eastman Kodak Company
    Inventors: Samuel Chen, Charles I. Levey
  • Patent number: 8242876
    Abstract: A trimmable resistor for use in an integrated circuit is trimmed using a heater. The heater is selectively coupled to a voltage source. The application of voltage to the heater causes the heater temperature to increase and produce heat. The heat permeates through a thermal separator to the trimmable resistor. The resistance of the trimmable resistor is permanently increased or decreased when the temperature of the resistor is increased to a value within a particular range of temperatures.
    Type: Grant
    Filed: September 17, 2009
    Date of Patent: August 14, 2012
    Assignees: STMicroelectronics, Inc., STMicroelectronics (Grenoble) SAS
    Inventors: Olivier Le Neel, Pascale Dumont-Girard, Chengyu Niu, Fuchao Wang, Michel Arnoux
  • Patent number: 8235504
    Abstract: An inkjet head includes a discharge element substrate including a base material provided with an energy generation element for generating energy to be used for discharging ink, a discharge port provided corresponding to the energy generation element, and an electrode pad electrically connected to the energy generation element, an electric contact substrate including an electric contact terminal for receiving an electric signal from an inkjet apparatus, and an electric wiring tape for electrically connecting the electric contact substrate and the discharge element substrate to each other, wherein a sealing member sealing a vicinity of an electric connection portion between the electric contact substrate and the electric wiring tape is a cured product of a composition including a silicone-modified resin, a boron trifluoride compound, and a mercaptosilane compound.
    Type: Grant
    Filed: January 25, 2011
    Date of Patent: August 7, 2012
    Assignee: Canon Kabushiki Kaisha
    Inventors: Tsubasa Takaoka, Isao Imamura
  • Patent number: 8231204
    Abstract: The present invention provides liquid ejection head enables a reduction in the distance between a print medium and an ejection port formation face of the liquid ejection head on which an ejection port is formed, improving the landing accuracy of droplets ejected from the liquid ejection head. A print head according to the present invention includes an element substrate and a supporting member. A supporting portion is located in the space between the element substrate and the supporting member. Connection wiring is formed on the supporting portion. The connection wiring is provided which connects wiring inside of the supporting member provided in the supporting member to the heat generating element.
    Type: Grant
    Filed: May 7, 2008
    Date of Patent: July 31, 2012
    Assignee: Canon Kabushiki Kaisha
    Inventors: Kazuhiro Jindai, Yuji Tsuruoka, Takashi Mori, Nobuhito Yamaguchi, Masao Furukawa, Seiichi Kamiya
  • Patent number: 8226190
    Abstract: A recording element substrate includes a recording element, a first voltage conversion circuit configured to receive a first control signal and to output the first control signal with an increased amplitude, a second voltage conversion circuit configured to receive a second control signal and to output the second control signal with an increased amplitude, a PMOS transistor connected to one end of the recording element, and an NMOS transistor connected to the other end of the recording element, wherein the PMOS transistor has a gate connected to an output of the first voltage conversion circuit, and the NMOS transistor has a gate connected to an output of the second voltage conversion circuit.
    Type: Grant
    Filed: November 25, 2009
    Date of Patent: July 24, 2012
    Assignee: Canon Kabushiki Kaisha
    Inventors: Nobuyuki Hirayama, Tatsuo Furukawa, Masataka Sakurai, Ryo Kasai, Tomoko Kudo
  • Patent number: 8220905
    Abstract: A liquid transporting apparatus includes a channel unit having a plurality of pressure chambers, a piezoelectric actuator having a vibration plate, a plurality of piezoelectric elements, a first electrode and second electrodes, and a flexible wiring member connected to the second electrodes. A support section is provided on the surface of the vibration plate, not facing the pressure chambers. A surface of the support section which does not face the vibration plate is joined to the flexible wiring member to support the flexible wiring member.
    Type: Grant
    Filed: August 20, 2007
    Date of Patent: July 17, 2012
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventor: Hiroto Sugahara
  • Patent number: 8205966
    Abstract: An inkjet print head is provided with a plurality of electrode terminals connected to a plurality of connecting terminals extending from electrical wiring members transmitting drive signals of elements generating energy for ejecting ink, and an insulating portion for insulating the extending portion of the connecting terminal to the connecting portion where the connecting terminal is connected to the electrode terminal from the print element substrate, the connecting portion being sealed by a sealant spreading due to a capillary force between the plurality of the connecting terminals. In order to prevent occurrence of the non-existence region of the sealant due to the blocking of the sealant by the insulating portion, the insulating portion is constructed of a plurality of separated convex portions in contact with the plurality of the connecting terminals respectively to form a groove between the convex portions for allowing the passing of the sealant.
    Type: Grant
    Filed: December 14, 2009
    Date of Patent: June 26, 2012
    Assignee: Canon Kabushiki Kaisha
    Inventor: Shigeki Fukui
  • Patent number: 8201926
    Abstract: A liquid ejecting head includes a flow channel forming substrate in which pressure generating chambers in communication with nozzles are formed; a piezoelectric element made up of a first electrode formed over the flow channel forming substrate, a piezoelectric layer formed over the first electrode and a second electrode formed over the piezoelectric layer; and a coating film provided by coating the piezoelectric element, wherein a hollow section formed by removing the coating film and a part of the second electrode is provided at an area opposite to the piezoelectric element, and an inclination angle ?1 of an end face of the coating film defining the hollow section with respect to the flow channel forming substrate and an inclination angle ?2 of an end face of the second electrode defining the hollow section satisfy a relationship of ?2<?1.
    Type: Grant
    Filed: March 10, 2010
    Date of Patent: June 19, 2012
    Assignee: Seiko Epson Corporation
    Inventor: Masato Shimada
  • Patent number: 8191996
    Abstract: This invention relates to a printhead element substrate having a plurality of electrothermal transducers and a plurality of switching elements which drive the plurality of electrothermal transducers. The element substrate has a level converter which is shared by adjacent electrothermal transducers and steps up an input driving signal, and a switch circuit which supplies the driving signal output from the level converter to one of the adjacent electrothermal transducers. The switch circuit switches the supply destination of the driving signal in accordance with an external input selection signal.
    Type: Grant
    Filed: February 4, 2010
    Date of Patent: June 5, 2012
    Assignee: Canon Kabushiki Kaisha
    Inventors: Koichi Omata, Yoshiyuki Imanaka, Souta Takeuchi, Takaaki Yamaguchi, Kousuke Kubo
  • Patent number: 8186809
    Abstract: A liquid discharging head improved in heat dissipation property includes a rectangular recording element substrate having electrothermal transducers generating thermal energy for discharging liquid, first electrodes for supplying electrical signals to the electrothermal transducers, and second electrodes not used for supplying electrical signals to the electrothermal transducers, and a wiring sheet having an opening through which the recording element substrate is exposed, the wiring sheet being provided with a first wiring pattern electrically connected to the first electrodes and a second wiring pattern connected to the second electrodes. A plurality of the first electrodes are formed along a first side of the recording element substrate having a predetermined length and a plurality of the second electrodes are formed along a second side of the recording element substrate, the second side being longer than the first side and extending in a direction transverse to the first side.
    Type: Grant
    Filed: February 6, 2007
    Date of Patent: May 29, 2012
    Assignee: Canon Kabushiki Kaisha
    Inventor: Yoshiyuki Touge
  • Patent number: 8182070
    Abstract: A liquid ejecting print head, which may be included in a liquid ejecting device and/or an image forming apparatus, includes a plurality of print head units arranged across a longitudinal direction of the liquid ejecting print head and aligned in a zigzag manner in a direction perpendicular to the longitudinal direction of the liquid ejecting print head, a plurality of nozzle arrays mounted on each print head unit and including a plurality of nozzle orifices for ejecting a droplet of ink, an energy generating element mounted on each print head unit and provided for each nozzle orifice for generating energy for ejecting the droplet of ink, and a wiring member including a plurality of wirings formed to run in an identical direction with respect to each print head unit and configured to transmit respective signals to the energy generating element.
    Type: Grant
    Filed: March 13, 2007
    Date of Patent: May 22, 2012
    Assignee: Ricoh Company, Ltd.
    Inventor: Kenichiroh Hashimoto
  • Patent number: 8182071
    Abstract: Provided are an inkjet printhead and a method of driving the inkjet printhead. The inkjet printhead includes a heater configured to heat ink to produce ink bubbles, an electrode configured to apply or provide the current to the heater, and a resistor connected to the electrode and separated by a distance from the heater. The resistor having a negative temperature coefficient of resistance (NTC) that can be used to compensate for the effects that temperature has on the ejection speed and mass of ejected ink droplets produced by the inkjet printhead and that result from temperature changes that occur during the operation of the inkjet printhead.
    Type: Grant
    Filed: February 19, 2009
    Date of Patent: May 22, 2012
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Keon Kuk
  • Patent number: 8172368
    Abstract: A fluid ejection device includes a plurality of firing cells and a fire line adapted to conduct an energy signal including energy pulses. Each firing cell in the plurality of firing cells includes a firing resistor, a drive switch, a first data switch, and a second data switch. The drive switch is configured to enable the firing resistor to respond to the energy signal. The first data switch is configured to receive data signals that represent an image and to latch the data signals to provide latched data signals. The second data switch is configured to receive the latched data signals and control the drive switch to enable the firing resistor to respond to the energy signal and heat fluid to be ejected based on the latched data signals.
    Type: Grant
    Filed: August 28, 2009
    Date of Patent: May 8, 2012
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Trudy Benjamin, James P. Axtell
  • Patent number: 8172367
    Abstract: In a liquid-ejecting method for ejecting liquid contained in a liquid chamber from a nozzle as a liquid droplet group, the ejection amount of each liquid droplet of the continuously ejected liquid-droplet group can be stabilized corresponding to a wide frequency band of a pulse signal. Also, when one pixel is formed with a plurality of liquid droplets using a head capable of deflecting the ejecting direction of the liquid droplet, the image quality is improved by reducing the landing positional displacement between plural liquid droplets for forming the one pixel.
    Type: Grant
    Filed: January 12, 2006
    Date of Patent: May 8, 2012
    Assignee: Sony Corporation
    Inventors: Soichi Kuwahara, Minoru Kohno, Masato Nakamura
  • Patent number: 8162444
    Abstract: There is provided a printing head which improves durability and increases reliability by reducing stress occurring in a bonding part between an electrode pad and an inner lead at cooling. The electrode pad and the inner lead are electrically connected in such a manner that in the bonding portions between the electrode pad and a stud bump, only a part of contacting portions between the electrode and the stud bump is bonded.
    Type: Grant
    Filed: May 28, 2009
    Date of Patent: April 24, 2012
    Assignee: Canon Kabushiki Kaisha
    Inventors: Shinya Miura, Junichiro Iri