Abstract: A circuit can include a die configured to electronically control particular elements and a flex circuit having copper leads coated with a non-gold corrosion inhibitor, the flex circuit being electrically connected to the die by the copper leads.

Abstract: A liquid ejecting head includes a head chip in which two or more nozzle groups are disposed, a first inlet that communicates with one of the nozzle groups and a second inlet that communicates with the other nozzle group a wiring member that is disposed between the first second inlets, a first connection flow path that is connected to the first inlet, a second connection flow path that is connected to the second inlet, and a wiring substrate to which the wiring member is connected between the first connection flow path and the second connection flow path.

Abstract: A unit head has a head main body having a nozzle surface, and a substrate case having a fastening surface fastened to a fixation frame of a frame and accommodating a relay substrate. The fastening surface of a substrate case is formed at a position closer to a surface of an opposite side to a fixation frame than a side surface of a fastening surface side of the head main body, and the head main body is positioned further at an ink ejecting side than the fixation frame with the faster surface being fixed to the fixation frame, the other end of a first cable whose one end is connected to the electrode terminal of a piezoelectric element is connected to the relay substrate, a second cable connected to the relay substrate is drawn to an opposite side to a nozzle surface from a position close to a surface of an opposite side to the fastening surface, and the other end of the second cable is connected to a drive substrate.

Abstract: A liquid ejection head includes a substrate including a first supply port row in which a plurality of supply ports are arranged, a first energy generating element row in which a plurality of energy generating elements are arranged, a second supply port row in which a plurality of supply ports are arranged, a second energy generating element row in which a plurality of energy generating elements are arranged, a first wiring layer and a second wiring layer for driving the energy generating elements, and a through hole configured to electrically connect the first wiring layer and the second wiring layer. The first energy generating element row, the first supply port row, the second supply port row, and the second energy generating element row are arranged in parallel in this order and the through hole is arranged between the first supply port row and the second supply port row.

Abstract: A recording head includes a substrate whose first surface has an element that generates energy used for ejecting liquid; a first portion that supports a second surface of the substrate; a wiring member having multiple electrode leads connected to multiple electrode pads provided in the substrate; a second portion that supports the wiring member; and a sealant that seals a section including a connection section between the electrode pads and the electrode leads. A region surrounded by the substrate, the second portion, and the electrode leads is provided with an ascending portion that increases in height in a direction extending from the second surface toward the first surface, the ascending portion increasing in height from a first end to a second end of the region in an arrayed direction of the electrode leads.

Abstract: According to the present disclosure, a manufacturing method of a fine wiring pattern is disclosed. The manufacturing method includes preparing a support member, forming a first layer on the support member by thick-film printing, and forming a second layer including Ag on the first layer by the thick-film printing. The method also includes forming a predetermined fine wiring pattern by performing an etching process upon the first layer and the second layer.

Abstract: A substrate for a liquid ejecting head according to an exemplary embodiment of the present invention includes a first area having a plurality of ejection heaters and a driving circuit that is configured to supply electric energy to the plurality of ejection heaters disposed thereon, a second area having a signal supplying circuit that is configured to supply an electric signal to the driving circuit disposed thereon, and a heater that is configured to heat the substrate and that includes a first portion disposed in the first area and a second portion disposed in the second area. The magnitude of a current supplied to the first portion differs from the magnitude of a current supplied to the second portion.

Abstract: A liquid ejection head substrate according to an exemplary embodiment of the present invention includes a plurality of ejection heaters arranged in a first region, a drive circuit that is arranged in the first region and configured to supply electric energy to the plurality of ejection heaters, a signal supply circuit that is arranged in a second region and configured to supply an electric signal to the drive circuit, and a substrate heating heater including a first portion arranged in the first region and a second portion arranged in the second region, in which a resistance value per unit length along a direction of a current of the first portion is different from a resistance value per unit length along a direction of a current of the second portion.

Abstract: A printhead die is provided that includes a substrate and a slot extending through the substrate, the slot including a first slot segment and a discrete second slot segment, the second slot segment being offset from the first slot segment along a major axis and along an orthogonal minor axis.

Abstract: A printing apparatus that discharges liquid droplets onto a recording medium, includes a movable carriage; discharging units, which are installed on the carriage and include nozzles that discharge a liquid, pressure chambers that communicate with the nozzles, and piezoelectric elements provided for each of the pressure chambers; a first circuit substrate, which is installed outside of the carriage, and on which is installed a control signal supply unit that generates control signals; a second circuit substrate, which is installed on the carriage, and on which are installed a booster circuit that generates a plurality of voltages; in which a path length of the control wiring between the first circuit substrate and the second circuit substrate is longer than the path length of the wiring between the second circuit substrate and the piezoelectric elements.

Abstract: There is provided a liquid jetting apparatus including: a main body, a liquid jetting head including a plurality of nozzles, a first board including a data generation circuit which generates a jetting control data, a second board, and first and second wiring members respectively connecting the liquid jetting head and the first and second boards, wherein the first wiring member is provided with jetting-data transmission wires, and the first wiring member is arranged to bend on an inner side of the second wiring member.

Abstract: A printhead may include a flow channel unit configured to discharge liquid. The printhead may include an actuator unit configured to apply discharge energy to the liquid in the flow channel unit. The printhead may include a flat flexible substrate connected to the actuator unit and configured to supply a drive signal to the actuator unit. The printhead may include a plurality of contact points disposed in an outline of the actuator unit in plan view and configured to electrically connect the actuator unit and the flat flexible substrate. The printhead may include a reinforcing member configured to fix a reinforcing portion, which includes at least part of an outer periphery of the actuator unit and the flat flexible substrate.

Abstract: An inkjet head according to an embodiment includes a base portion, a driving element, a wire, a protection portion, and a boundary portion. The base portion includes a mounting surface. The driving element is mounted on the base portion. The wire is formed on the mounting surface and connected to the driving element. The protection portion is formed on the mounting surface, covering a portion of the driving element and the wire, and possesses an insulation property. The boundary portion is provided at an end of the protection portion contacting the wire that is exposed. The boundary portion is thinner than the protection portion and possesses an insulation property. Thus, an inkjet head in which stripping of an insulating portion can be restrained is provided.

Abstract: A liquid ejection head includes two or more substrates disposed side by side, each having energy generating elements and primary terminals electrically connected to the respective energy generating elements, and an electrical wiring member having primary flying leads electrically connected to the respective primary terminals by means of gang bonding. Each of the substrates has an auxiliary terminal located adjacent to the primary terminals and the auxiliary terminals of the two or more substrates are disposed adjacent to each other. The electrical wiring member has an auxiliary flying lead connected to the auxiliary terminals of the substrates by means of a gang bonding system.

Abstract: A liquid droplet ejecting head is disclosed. The liquid droplet ejecting head includes an electromechanical transducer element; a first substrate which includes a first wiring member; a reinforcing member which is mounted on the first substrate; and a second substrate which includes a second wiring member and which is mounted on the reinforcing member, wherein liquid droplets are ejected when driving power is supplied to the electromechanical transducer element via the first wiring member and the second wiring member.

Abstract: A droplet discharging head includes: a nozzle substrate that includes a nozzle opening to discharge a droplet therethrough; a liquid chamber substrate that includes liquid pressure chambers communicating with the nozzle openings; a vibration plate arranged to face the nozzle substrate with the liquid chamber substrate interposed therebetween; piezoelectric elements that are provided to face the liquid pressure chambers with the vibration plate interposed therebetween and are arranged in a predetermined direction; a driving element provided, in a flip-chip implementation, on a flow path substrate that includes the nozzle substrate, the liquid chamber substrate, the vibration plate, and the piezoelectric elements; and a first reinforcing wire that is disposed to at least one of the flow path substrate and the driving element, has a band shape extending in a direction along a row of the piezoelectric elements, and is connected to a common electrode shared by the piezoelectric elements.

Abstract: A liquid ejection head is disclosed that includes piezoelectric elements constituting driving element rows in which plural driving piezoelectric element columns that generate energy for ejecting liquid droplets from nozzles are arranged side by side; a wiring board arranged on the side opposite to a surface in which the nozzles are formed; and two sheets of flexible printed circuits that are provided to correspond to the piezoelectric elements and have output terminal parts connected to the plural driving piezoelectric element columns and input terminal parts connected to the wiring board, the input terminal parts being drawn to the side of the wiring board. The flexible printed circuits are arranged facing each other with their input terminal parts not facing each other, and the input terminal parts of the flexible printed circuits are folded in a direction where the flexible printed circuits face each other and are connected to the wiring board.

Abstract: A printhead assembly for a printing device is provided that includes a printhead comprising non-volatile memory elements. The memory elements include memristive elements. Each memristive element includes an active region disposed between two electrodes. The active region includes a switching layer formed of a switching material capable of carrying a species of dopants and a conductive layer in electrical contact with the switching layer, the conductive layer being formed of a dopant source material that includes the species of dopants that are capable of drifting into the switching layer under an applied potential.

Abstract: A sealant contains a dicyclopentadiene type epoxy resin represented by formula 1 below, a hydrogenated bisphenol A epoxy resin, and a photo-induced cationic polymerization initiator, in which the content of the dicyclopentadiene type epoxy resin is 15 to 40 parts by mass relative to 100 parts by mass of the total mass of epoxy resins contained in the sealant. where n represents an integer of 0 to 2.

Abstract: According to one embodiment, an inkjet head includes actuators configured to pressurize ink. The actuators include piezoelectric elements provided on an insulating layer, first electrodes electrically connected to the piezoelectric elements, and second electrodes connected to the piezoelectric elements and configured to hold the piezoelectric elements in cooperation with the first electrodes. The first electrodes of all the actuators are electrically connected to a common first energization pattern. The second electrodes of all the actuators are individually electrically connected to second energization patterns. The first energization pattern and the second energization patterns are separated from each other without overlapping each other on the insulating layer.

Abstract: In an embodiment, a method of compensating for capacitance change in a piezoelectric element of a fluid ejection device includes sensing a current driving a piezoelectric element, determining from the current that capacitance of the piezoelectric element has changed, and altering a rise time of the current driving the piezoelectric element to compensate for the changed capacitance.

Abstract: A liquid ejection apparatus including: a head having: nozzles arranged in a nozzle-row direction; and ejection-energy applying portions; a drive IC for driving the ejection-energy applying portions; a control circuit board for controlling the drive IC; a wiring member on which the drive IC is mounted; and a support member for supporting the wiring member. The wiring member extends toward the control circuit board from a connection portion thereof connected to the ejection-energy applying portions, the wiring member having a first wiring portion extending in a first direction intersecting the nozzle-row direction and a second wiring portion extending in a second direction intersecting the first direction. The support member supports at least one of the first wiring portion and the second wiring portion, the at least one being located between the ejection-energy applying portions and the control circuit board.

Abstract: A liquid discharge head includes an element substrate including an energy generating element; a supporting member adhesively supporting the element substrate; a sheet member adhesively bonded to the supporting member to adjoin the inner surface of an opening accommodating the element substrate in the sheet member and an end section of the element substrate; a wiring substrate bonded to the sheet member to adjoin the inner surface of an opening accommodating the element substrate in the wiring substrate and the end section of the element substrate and including a wire electrically connected to the energy generating element; and a sealant sealing a part electrical connecting the wiring substrate and element substrate, wherein the height of a wiring substrate surface opposite to that contacting the sheet member from supporting member is smaller than the element substrate surface opposite to that contacting the supporting member from the supporting member.

Abstract: A method for producing a liquid-ejecting head including a passage-forming substrate and a protective substrate. The passage-forming substrate has pressure-generating chambers communicating with nozzle orifices, piezoelectric devices that change the inner pressures of the pressure-generating chambers, and liquid supply channels for supplying the pressure-generating chambers. The protective substrate has a piezoelectric-device accommodating portion and a through-hole, through which wirings to lead electrodes extended from the piezoelectric devices pass thorough.

Abstract: The present invention related to an inkjet printhead, adaptive for an ink cartridge including one ink-supplying tank, the inkjet printhead includes: a nozzle plate having a plurality of nozzles; and an inkjet chip for controlling ink jetting and having a total area region having a length and a width, the total area region including: a non-wiring region for installing one single ink-supplying flow channels; and a wiring region for installing an internal circuit including a plurality inkjet unit assembly, each inkjet unit of the inkjet unit assembly including a heater installed correspondingly to the nozzle; wherein an area of the wiring region of the inkjet chip is or less than 82% of a total area of the inkjet chip.

Abstract: A liquid discharge head substrate includes a base; a pair of wiring lines; a heat-generating resistive layer, which is in contact with the wiring lines, and which has a portion corresponding to a space between the wiring lines, the portion forming an electrothermal transducer; an insulating layer which covers the heat-generating resistive layer and the wiring lines and which contains Si; a protective layer which covers at least one region of the insulating layer which contains Ir; and an intermediate layer which is placed between the insulating layer and the protective layer. The intermediate layer contains a material represented by the formula TaxSiyNz, where x is 5 atomic percent to 80 atomic percent, y is 3 atomic percent to 60 atomic percent, z is 10 atomic percent to 60 atomic percent.

Abstract: The power supply includes a transformer for generating a first output voltage by a first secondary winding, and a superimposing voltage by a second secondary winding, and a driver. Furthermore, the circuit includes first and second rectifying and smoothing circuits for respectively rectifying and smoothing the first output voltage and superimposing voltage, and an adder for adding the rectified and smoothed superimposing voltage on the rectified and smoothed first output voltage to output a second output voltage. The first and second output voltages are fed back respectively by DC coupling, the fed-back first and second output voltages are respectively adjusted by first and second feedback factors, and the adjusted feedback components are combined and amplified to be applied to the driver for PWM-control.

Abstract: A semiconductor device including segments, a power supply pad and conductive patterns is provided. Each segment includes driving units for discharging a liquid. Each driving unit includes a driving circuit and an element driven by the driving circuit to apply discharging energy to the liquid. The conductive pattern includes a first conductive portion connected to the power supply pad, a second rectangular conductive portion, a third conductive portion connected to the driving portions, and a connection portion which connects the second and third conductive portions. These conductive portions elongate in a first direction. In a second direction, a length of the second conductive portion is larger than a length of the first conductive portion. The second conductive portion is connected to the first conductive portion at a first corner and the connection portion at a second corner diagonal to the first corner.

Abstract: A liquid discharge head includes a recording element substrate including an electrode pad, a support member including a recess that supports the recording element substrate on a bottom surface thereof, an electric wiring member, and a sealant. The electric wiring member includes an opening through which the recording element substrate is exposed, an electric lead wire extending from the opening and connected to the electrode pad, and a protrusion formed in the opening and extending between a side surface of the recording element substrate and an inner side surface of the recess facing the side surface. A distal end of the protrusion is in contact with the bottom surface of the recess. The sealant is disposed in a region surrounded by a surface of the protrusion, the bottom surface of the recess, the inner side surface of the recess, and the side surface of the recording element substrate.

Abstract: A printing element substrate, including a printing element, a switching element which drives the printing element based on an input control signal, a first current source which generates a predetermined current, a second current source which generates a current based on an input voltage, and a current generation circuit which generates the control signal by amplifying a current obtained by adding a current generated by the second current source to a current generated by the first current source, and then generates the control signal by amplifying a current generated by the first current source.

Abstract: A liquid ejecting head includes a main liquid ejecting head body, in which is formed a liquid flow channel through which a liquid flows, that ejects the liquid from a nozzle opening using a pressurizing unit; a driving board configured so as to supply power to the pressurizing unit; a connector provided at an end portion of the driving board; and a holding member configured so as to hold the driving board in a bent state and erected relative to one end surface of the main liquid ejecting head body. The holding member has a stopping portion that holds an end of the driving board in which the connector is provided, and the configuration is such that the stopping portion prevents the driving board from opening in the direction of the bend.

Abstract: Electronic circuitry compensates for variations or sags in electrical voltage within a thermal ink-jetting (TIJ) printing apparatus. Ground potential and other supply-related voltages are monitored and corresponding signals are provided. The signals are used, directly or by other circuitry, to affect the biasing of one or more transistors coupling TIJ resistors to supply voltage or ground nodes. Printing errors and related problems associated with voltage variations are reduced or eliminated accordingly.

Abstract: A liquid discharge head includes a recording element substrate including an energy generation element for generating energy used to discharge a liquid and a terminal electrically connected to the energy generation element, and an electric wiring board including an electrode electrically connected to the terminal via a wire to transmit an electric signal supplied from outside to the energy generation element, wherein the terminal has an area twice or more larger than a contact area between the terminal and the wire and the electrode has an area twice or more larger than a contact area between the electrode and the wire.

Abstract: A flexible wiring substrate that is used in a liquid ejection head having an element substrate provided with energy generating elements for generating energy for ejecting liquid includes: a bending portion; a base member including resin; electrical wiring lines formed on the base member and electrically connected to the element substrate, the electrical wiring lines extending over a ridge of the bending portion; and a metal layer that is arranged on an area of the base member in which no electrical wiring lines are provided and that is not electrically connected to the element substrate, the metal layer extending over the ridge.

Abstract: A liquid discharge head includes piezoelectric members including: a pressure chamber applying a pressure for discharging liquid to liquid; a first electrode provided on an inner surface side of the pressure chamber; and a second electrode provided outside the pressure chamber, the piezoelectric members being arranged in a first direction intersecting with an ink flow direction and in a second direction crossing the ink flow direction and the first direction so that the flow directions of the liquid flowing through the pressure chamber of the piezoelectric members are arranged along one another. The head includes first common wiring lines connected to the first electrodes arranged in the first direction; and second common wiring lines connected to the second electrodes 23 arranged in the second direction. The first common wiring lines are arranged in the second direction and the second common wiring lines are arranged in the first direction.

Abstract: A piezoelectric actuator is provided, including a piezoelectric layer arranged on one surface of a base member; a plurality of driving electrodes arranged on one surface of the piezoelectric layer; a plurality of leading electrodes led from the driving electrodes to apply a voltage to the driving electrodes; and a low dielectric layer arranged between the piezoelectric layer and the leading electrode, and having a dielectric constant lower than that of the piezoelectric layer. Surroundings of driving areas of the piezoelectric layer including areas facing the plurality of driving electrodes are joined to the base member. The plurality of leading electrodes extend to outside of the driving areas, respectively, some of the plurality of leading electrodes being led in a predetermined first direction, and others of the plurality of leading electrodes being led in a second direction different from the first direction.

Abstract: A liquid discharge recording head includes: a recording element substrate, an electric wiring board, and a supporting plate that supports the recording element substrate and the electric wiring board, with a gap formed between the recording element substrate and the electric wiring board, and a connecting member that electrically connects, across the gap, an electrode provided in the recording element substrate and an electrode terminal provided in the electric wiring board. A first resin agent that is filled in the gap, a second resin agent seals the electrode, the electrode terminal, and the connecting member, and a third resin agent that is provided between the first resin agent and the supporting plate and has a lower modulus of elasticity than the first resin agent and the second resin agent.

Abstract: A flexible circuit includes a sprocket opening and electrically conductive lines connected to a print head.

Abstract: Embodiments of a printhead are disclosed.

Abstract: A multi-dimensional data registration integrated circuit is configured for driving array-arrangement devices. The array-arrangement devices comprise a plurality of first hierarchy sets, each which comprises a plurality of second hierarchy sets. The multi-dimensional data registration integrated circuit comprises a first hierarchy address selection circuit, a second hierarchy address selection circuit and a data supply circuit. The first hierarchy address selection circuit scans the first hierarchy sets, and selects a unit of the first hierarchy sets to activate it. The second hierarchy address selection circuit scans the second hierarchy sets. The data supply circuit writes a plurality of data into each designated unit of the second hierarchy sets according to the scanning sequence of the second hierarchy address selection circuit.

Abstract: A semiconductor device including segments, a power supply pad and conductive patterns is provided. Each segment includes driving units for discharging a liquid. Each driving unit includes a driving circuit and an element driven by the driving circuit to apply discharging energy to the liquid. The conductive pattern includes a first conductive portion connected to the power supply pad, a second rectangular conductive portion, a third conductive portion connected to the driving portions, and a connection portion which connects the second and third conductive portions. These conductive portions elongate in a first direction. In a second direction, a length of the second conductive portion is larger than a length of the first conductive portion. The second conductive portion is connected to the first conductive portion at a first corner and the connection portion at a second corner diagonal to the first corner.

Abstract: A method and structure for an ink jet print head which includes the use of two or more flexible circuits and a piezoelectric element array. A first pad array is included on a first flex circuit to power a first portion of the piezoelectric element array of the print head, and a second pad array is included on a second flex circuit to power a second portion of the piezoelectric element array of the print head. Using two flex circuits requires only half as many traces to be formed on each flex circuit, which can relax spacing requirements and design tolerances.

Abstract: The liquid ejection head for ejecting liquid from nozzles includes: pressure chambers connecting to the nozzles; a common liquid chamber which is connected to the pressure chambers, is arranged across the pressure chambers from the nozzles, and is defined by at least a multi-layer wiring substrate which has a recess-shaped structure including a base section forming one of a ceiling and a floor of the common liquid chamber and a projecting section forming a side wall of the common liquid chamber; electrical wires which are formed at least partially inside the multi-layer wiring substrate; and a connection electrode which is provided in a top of the projecting section of the multi-layer wiring substrate.

Abstract: A wiring member for a liquid ejection head enables reducing the size of the liquid ejection head. A flexible printed circuit has on one end a plurality of individual electrode wiring terminals corresponding to individual element electrode terminals of piezoelectric elements; individual electrode wires corresponding to the individual electrode wiring terminals; a common electrode wiring terminal corresponding to a common electrode terminal of the piezoelectric elements; and a common electrode wire corresponding to the common electrode wiring terminal. The individual electrode wiring terminals, common electrode wiring terminal, and individual electrode wires are disposed on one side of the flexible printed circuit, and the common electrode wire is disposed on the other side of the flexible printed circuit.

Abstract: A recording head includes a recording element substrate having a plurality of discharge ports discharging a liquid and energy generating elements generating energy used to discharge the liquid from the discharge ports; an electrical wiring substrate having an opening portion in which the recording element substrate is provided and for applying a driving signal to the recording element substrate; an electrical connection portion in which an electrode portion of the recording element substrate and an electrode portion of the electrical wiring substrate are electrically connected to each other by a wire; and a sealing material covering and sealing the electrical connection portion. The electrical connection portion is provided with a reference member as a reference of at least one of an upper limit position and a lower limit position of the height of the surface of the sealing material with respect to the thickness direction of the recording element substrate.

Abstract: Electronic circuitry compensates for variations or sags in electrical voltage within a thermal ink-jetting (TIJ) printing apparatus. Ground potential and other supply-related voltages are monitored and corresponding signals are provided. The signals are used, directly or by other circuitry, to affect the biasing of one or more transistors coupling TIJ resistors to supply voltage or ground nodes. Printing errors and related problems associated with voltage variations are reduced or eliminated accordingly.

Abstract: A circuit substrate includes a first terminal connected to a storage device, a second terminal to which voltage higher than voltage which is applied to the first terminal is applied, and a third terminal. The third terminal is disposed adjacent to the first terminal and the second terminal and connected to an overvoltage detection section provided in a printer. A convex portion is provided on a substrate surface between the first terminal and the second terminal, and a configuration is made such that a liquid droplet easily spreads from the second terminal to the third terminal rather than the liquid droplet spreading from the second terminal to the first terminal.

Abstract: A semiconductor device including segments, a power supply pad and conductive patterns is provided. Each segment includes driving units for discharging a liquid. Each driving unit includes a driving circuit and an element driven by the driving circuit to apply discharging energy to the liquid. The conductive pattern includes a first conductive portion connected to the power supply pad, a second rectangular conductive portion, a third conductive portion connected to the driving units, and a connection portion which connects the second and third conductive portions. These conductive portions are elongated in a first direction. In a second direction, a length of the second conductive portion is greater than a length of the first conductive portion. The second conductive portion is connected to the first conductive portion at a first corner and to the connection portion at a second corner diagonal to the first corner.

Abstract: A thermal printhead die is formed from an SOI structure as a MEMS device. The die has a printing surface, a buried oxide layer, and a mounting surface opposite the printing surface. A plurality of ink delivery sites are formed on the printing surface, each site having an ink-receiving and ink-dispensing structure. An ohmic heater is formed adjacent to each structure, and an under-bump metallization (UBM) pad is formed on the mounting surface and is electrically connected to the ohmic heater, so that ink received by the ink-delivery site and electrically heated by the ohmic heater may be delivered to a substrate by sublimation. A through-silicon-via (TSV) plug may be formed through the thickness of the die and electrically coupled through the buried oxide layer from the ohmic heater to the UBM pad. Layers of interconnect metal may connect the ohmic heater to the UBM pad and to the TSV plug.

Abstract: A MEMS integrated circuit includes a silicon substrate having a frontside with a drive circuitry layer and a backside. A MEMS layer is disposed on the drive circuitry layer. The MEMS layer includes a plurality of MEMS devices electrically connected to the drive circuitry layer. Connector posts extends from the drive circuitry layer to a contact pad positioned in a roof of the MEMS layer and through-silicon connectors extending linearly from the contact pad, through the drive circuitry layer and the silicon substrate, towards the backside of the silicon substrate. Each through-silicon connector terminates at a backside integrated circuit contact, such that each integrated circuit contact is electrically connected to the drive circuitry layer via the contact pad positioned in the roof of the MEMS layer.