Abstract: A printhead assembly for a pagewidth ink jet printer includes an ink storage assembly that defines at least one ink storage chamber. An elongate mounting member is mounted on the ink storage assembly to be in fluid communication with the, or each, ink storage chamber. At least one printhead module is mounted on the mounting member and has a carrier that defines a recess and a printhead chip received in the recess. The recess is in fluid communication with the mounting member so that ink from the, or each, ink storage chamber can be fed to the printhead chip.

Abstract: A printhead assembly is provided comprising at least one printhead module comprising at least two printhead integrated circuits, each of which has nozzles formed therein for delivering printing fluid onto the surface of print media, a support member supporting the printhead integrated circuits and carrying the printing fluid, and an electrical connector for connecting electrical signals to the printhead integrated circuits. The assembly further comprises drive electronics arranged to control the printing operation of at least one printhead integrated circuit via the electrical connector, a plurality of longitudinally extending electrical conductors for providing power from a power supply to the drive electronics and the printhead integrated circuits, a casing comprising a support frame supporting the printhead module and at least one mounting element.

Abstract: The invention is intended to suppress failures of connected portions between electrode pads and bumps. A liquid ejection head comprises a recording device board including an energy generating device disposed thereon to generate energy for ejecting a liquid through an ejection orifice, and an electrode pad which is disposed in a recess formed in the recording device board and is electrically communicated with the energy generating device. The liquid ejection head further comprises an electrode lead for supplying power to the electrode pad externally of the recording device board, a bump for connecting the electrode pad and the electrode lead to establish electrical communication therebetween, and a sealing resin material filled in the recess to surround an electrically connected portion between the electrode pad and the bump without covering the bump.

Abstract: A recording head substrate allowing an increased number of the exothermic bodies driven at a time without increasing the substrate size so as to increase a number of nozzles arranged in high density. The recording head substrate includes a plurality of electrothermal conversion members having exothermic bodies respectively corresponding to a plurality of discharge ports; a plurality of drive elements for driving the exothermic bodies; common wiring A connected to the exothermic bodies; and common wiring B connected to the drive elements; and an electrode pad connected to the common wiring A and the common wiring B. A number of the exothermic bodies driven at a time is determined by (RlineA+RlineB)/(Rh+Rd)<0.05/(0.95 n?1).

Abstract: An ink jet printhead which has a plurality of nozzles 3 and a bubble forming chamber 7 corresponding to each nozzle respectively. At least one heater element 10 disposed in each bubble forming chamber 7 to heat a bubble forming liquid 11 to a temperature above its boiling point to form a gas bubble 12 therein. The generation of the bubble 12 causes the ejection of a drop 16 of an ejectable liquid (such as ink) through an ejection aperture 5 in each nozzle 3, to effect printing. Integrated circuit metalization layers corresponding to each of the nozzles supply electrical energy to the heater 14. The heater 14 and the integrated circuit metalization layers 23 are substantially planar and at least partially overlapping, the metallization layers electrically connected to the heater electrodes 15 by vias, the cross sectional area of all the vias being greater than 50% of the surface area of one side of the heater 14.

Abstract: A semiconductor device constituting a liquid ejection head for ejecting a liquid such as an ink, comprising a segment having a plurality of pairs of recording element and driving element, wherein a first wiring for mutually connecting a first terminal of each driving element arranged within the same segment is formed on a first wiring layer on a semiconductor substrate, and a second terminal of the driving element and a first terminal of the recording element are connected on one for one base, and a second terminal of the recording element is connected to a power source wiring formed by the wiring layer different from the first wiring layer, and an auxiliary wiring for mutually connecting the second terminal of the recording element with the same segment is formed by the first wiring layer, thereby eliminating and suitably adjusting the irregularity of wiring resistance values within the segment.

Abstract: This invention is intended to connect a dummy lead while preventing depression of a resin that seals electric connection sections, without bringing the dummy lead into contact with a recording element substrate or without taking the dummy lead for a lead electrode. The dummy lead which is provided inward of an opening of a flexible film wiring substrate to be shorter than the lead electrode, and which is not electrically connected to an electrode pad is provided to be adjacent to the lead electrode.

Abstract: The present invention includes as one embodiment a printhead having a circuit with plural resistors and a power bus. The printhead includes a metal stack formed within the circuit, which is comprised of a first metal layer and a second metal layer and at least one power via. The power via is formed within the circuit as an interface between the first metal layer and the second metal layer and acts as a corrosion separation barrier between of the resistors and the power bus.

Abstract: An ink jet printhead is provided. The printhead comprises a printhead substrate including a plurality of thin film layers and at least three side by side columnar arrays of drop generators extending along a longitudinal extent. Each columnar array of drop generators provides ink drops of a different color and has at least 96 drop generators. Each columnar array of drop generators is separated from each other by at most 1060 micrometers. The printhead substrate also includes at least three columnar arrays of transistor drive circuits formed in the printhead substrate respectively adjacent the columnar arrays of drop generators for energizing the columnar arrays of drop generators.

Abstract: A semiconductor substrate includes electronic circuitry and has a machined feature formed therein. The semiconductor substrate is formed by a process which includes providing the semiconductor substrate having the electronic circuitry formed therein, and performing a machining process on the substrate to form the machined feature therein. The machined feature includes a slot and the machining process forms cracks at ends of the slot that reduce a fracture strength of the substrate. Removing portions of the semiconductor substrate proximate the cracks such that end points of the cracks have a curved terminus as formed by the removed portions improves the fracture strength of the substrate.

Abstract: A plurality of lands and a plurality of conducting wires connected independently to each land are formed on one side surface of an insulating substrate of a flexible printed circuit board. Through-holes are formed through the insulating substrate for exposing the lands to the other side surface. Solder is provided in the through-holes. The solder connects the lands to the head terminals on an inkjet head, which is located facing the other side surface of the insulating substrate. The insulating substrate separates the solder from areas between the conducting wires and from areas between the lands, thereby preventing short circuits from occurring when manufacturing the connecting structure with a low tolerance grade.

Abstract: An ink jet print cartridge having a compact electrical interconnect structure that includes a plurality of pairs of columnar arrays of electrical contact areas disposed on a rear wall of the print cartridge and electrically connected to ink drop generators arranged in primitive groups.

Abstract: A flexible printed circuit board connected to a printer head having at least one heater discharging ink, the flexible printed circuit board including: at least one voltage supplying terminal selectively supplying an operating voltage to the at least one heater in response to receiving a printing command signal from a printer; at least one first cable connected at each end to the at least one voltage supplying terminal and at least one first bonding pad, respectively, transferring the operating voltage to the at least one heater; at least one grounded terminal; and at least one second cable connected at each end to the at least one grounded terminal and at least one second bonding pad, respectively, in which the at least one second cable is divided into at least two portions at a predetermined position and a first portion of the at least two divided portions is provided along one side of the at least one first cable, and a second portion of the at least two divided portions is provided along the other side of

Abstract: A dynamic memory based integrated circuit ink jet firing cell that includes a heater resistor, a drive transistor, and a dynamic memory circuit for storing firing data only for such heater resistor. Also disclosed is an integrated circuit firing array that includes a plurality of dynamic memory based firing cells divided into a plurality of fire groups of firing cells, each fire group having a plurality of subgroups; data lines for providing energizing data to the firing cells; control lines for providing control information to the firing cells wherein all firing cells within a subgroup are connected to a common subset of the control lines so as to be controlled to concurrently store energizing data; and a plurality fire lines for supplying energizing energy to the firing cells, wherein all firing cells of a fire group receive energizing energy from only one fire line.

Abstract: A printhead assembly includes an elongate printhead mounted along a spine. A conductive film is provided in electrical contact along the printhead. Power and data from a flexible circuit bearer are conveyed to the conductive film, and hence the printhead, by pressing the flexible circuit bearer against the film. The flexible circuit bearer is forced against the film by an angled member arranged to bias the flexible circuit bearer towards the spine thereby pressing the intermediately located flexible circuit bearer into abutment with the conductive film.

Abstract: An ink jet print head is provided which includes: a print element substrate; a plate accommodating the print element substrate by enclosing a side peripheral portion of the print element substrate; an electric wiring tape member disposed on the plate and having electric wiring portions for the print element substrate; a first sealant filling a space surrounding the print element substrate enclosed by the plate; and a second sealant covering a part of the electric wiring portions. In this construction, stress concentrations in the electric connections are alleviated even if the electric wiring tape used to support the second sealant has a reduced stiffness due to a reduced thickness of the tape. For this purpose, the plate H1401? is provided with protrusions H1402 as support members that support the second sealant H1308 through the extension portions H1305 of the electric wiring tape.

Abstract: A print head of an ink-jet printer including a main chip area having at least one ink jetting portion disposed on a substrate to jet ink, and at least one bonding pad connected with a corresponding lead end of a wiring of a circuit part to control the ink jetting portion; and a scribe lane area disposed around the main chip area and forming a cutting region in which the main chip area is divided from main chip areas of other print heads by cutting, the scribe lane area having a damping pattern portion formed to be electrically and physically isolated from the main chip area and the substrate.

Abstract: A substrate (10; 110; 210; 310) for an ink jet printhead comprising: at least three slots (12a, 12b, 12c) of elongated shape, oriented parallel to one another lengthwise in a vertical direction (13); three corresponding actuating banks (16a, 16b, 16c); a plurality of drive circuits (18); and a plurality of terminals (21, 21a, 21b), lesser in number than the ejection actuators (16), connected to the drive circuits (18) for receiving external signals, wherein at least two (12a, 12b) of the three slots are arranged side by side along the respective long edges in an upper portion (10a) of the substrate, and the third slot (12c) is arranged in a lower portion (10b) of the substrate, and wherein moreover the terminals (21) connected to the drive circuits are arranged in a line along the edges (11a, 11b) of the substrate (10) parallel to the slots and therefore to this given vertical direction (13). This substrate has a robust structure and is less likely to crack in the zone of the slots.

Abstract: An individual electrode layer electrically connected to an individual electrode layer having an opening is formed beneath a heater layer and a common electrode layer along an ink flow path.

Abstract: Several improvements have been made in inkjet print cartridges to realize 5 ng drop weights at ejection frequencies of 18 KHz. These improvements include small nozzle openings, improved heater resistor efficiency, and better ink supply reliability.

Abstract: A base plate for use in a recording head, which is used by an ink jet head for printing by discharging ink onto a recording medium, the recording head being provided with energy converting element for discharging the ink by generating a bubble in the ink by converting electric energy to thermal energy, and an anti-cavitation film to protect the energy converting element from shocks generated at the time of bubble growth and extinction, the anti-cavitation film being used as electrodes for detecting the state of the ink by energizing the ink. The base plate comprises a first diode having the a cathode thereof connected to the anti-cavitation film and an anode thereof connected to a ground potential; and a second diode having the anode thereof connected to the anti-cavitation film and the cathode thereof connected to a power supply potential.

Abstract: In a case where first wirings (wirings for a driving power supply (VH)) commonly connected to a plurality of electro-thermal converting elements and adapted to supply an electric power to the plurality of electro-thermal converting elements and second wirings (high voltage grounding wirings (GNDH)) for connecting source areas of respective switching elements to grounding potential are provided, resistance of the second wiring is selected to be smaller than resistance of the first wiring.

Abstract: An ink jet heater chip having improved thermal. The chip includes a semiconductor substrate, a first metal resistive, a second metal conductive layer on a first portion of the resistive layer and on a second portion of the resistive layer defining a heater resistor element. A passivation layer having a thickness defined by a deposition process is deposited on the second metal conductive layer and heater resistor element. A cavitation layer is deposited on the passivation layer and etched. A dielectric layer is deposited and etched to provide a dielectric layer overlying the first portion of the resistive layer. An electrical conduit via is etched in the dielectric layer. A third metal conductive layer is deposited in the via for electrical contact with the second metal conductive layer. Separately deposited dielectric and passivation layers enable independent control of the thickness of the dielectric and passivation layers.

Abstract: A liquid discharge head substrate used for a liquid discharge head is adapted to discharge liquid by applying discharge energy to the liquid. The substrate is a semiconductor substrate including an energy conversion element for converting electric energy into the discharge energy and a function element made of a ferroelectric material.

Abstract: An ink jet head includes a head body (11) which is provided with a plurality of nozzles and a plurality of pressure chambers and actuators (14) respectively corresponding to the nozzles. Input terminals (37) of the actuators (14) are arranged locally between left-side and right-side central actuator columns (14A, 14A). A driver IC (13) is mounted on the head body (11) by flip chip bonding.

Abstract: An inkjet recording apparatus performs recording by using an inkjet head having a depression between a nozzle member and a wiring member in a direction in which the inkjet head and a wiper relatively move. In the inkjet recording apparatus, the wiper can perform good wiping of the surface of the wiring member and the surface of the nozzle member.

Abstract: An electrode wiring line is formed on a supporting board which supports a printing element board constituting a printing head, and it is connected with the electrode wiring lines of a flexible board, thereby to interconnect electrode wiring lines which are formed on both the sides of the printing element board in order to feed a signal or the like of identical sort. Thus, a region for the electrode wiring line on one side of the flexible board can be omitted, with the result that the number of the wiring lines of the flexible board can be increased, or the density of these wiring lines can be heightened.

Abstract: A dynamic memory based integrated circuit ink jet firing cell that includes a heater resistor, a drive transistor, and a dynamic memory circuit for storing firing data only for such heater resistor. Also disclosed is an integrated circuit firing array that includes a plurality of dynamic memory based firing cells divided into a plurality of fire groups of firing cells, each fire group having a plurality of subgroups; data lines for providing energizing data to the firing cells; control lines for providing control information to the firing cells wherein all firing cells within a subgroup are connected to a common subset of the control lines so as to be controlled to concurrently store energizing data; and a plurality fire lines for supplying energizing energy to the firing cells, wherein all firing cells of a fire group receive energizing energy from only one fire line.

Abstract: A fluid-ejection mechanism of one embodiment of the invention is disclosed that includes one or more electrical contacts and one or more electrically grounded electrostatic discharge (ESD) shunt mechanisms. The electrical contacts make contact with corresponding contacts of one or more fluid-ejection assemblies that are otherwise exposed. The ESD shunt mechanisms to protect the electrical contacts from ESD when the electrical contacts are exposed.

Abstract: The described embodiments relate to methods and systems for forming and protecting electrical interconnect assemblies. In one embodiment, an electrical interconnect assembly forming method forms an electrical interconnect between one or more conductors of a first support structure and one or more conductors of a second support structure. The method also distributes a generally flowable material over the electrical interconnect and exposes the generally flowable material to conditions sufficient to render the generally flowable material into a generally non-flowable state that provides fluid protection to the electrical interconnect and supports the electrical interconnect to reduce stress concentration at the electrical interconnect.

Abstract: A fluid ejector includes a fluid channel having a resistive heater and terminating in a nozzle, a common bus formed transverse to the fluid channel and between the resistive heater and the nozzle, a connection line laterally adjacent to the fluid channel, and a connection structure for electrically connecting the common bus with the resistive heater and the connection line, the connection structure including a first set of one or more layers for electrical connection and a second set of one or more layers for covering the common bus and connection line. The first set of one or more layers includes a doped polysilicon layer on or overlaid by an optional tantalum-silicide layer. The second set of one or more layers includes a nitride layer on or overlaid by a tantalum layer.

Abstract: The present invention provides a fluid injection head structure and a method of fabricating the same. The fluid injection head structure is disposed on a substrate and has a bubble generator, a functional device for control the bubble generator, a first conductive trace composed of poly-silicon, a chamber, a manifold in flow communication with the chamber, and a second conductive trace. The second conductive trace electrically couples the functional device with the bubble generator and the first conductive trace. Moreover, the chamber further has at least one orifice through the substrate and a gate and the first conductive trace are formed in the same photo-etching process (PEP).

Abstract: An ink jet recording head has a plurality of discharge energy generating devices for discharging recording liquid; a recording element base plate arranged on the face opposite the surface where the devices are arranged, having a plurality of recording liquid supply ports for supplying recording liquid to the devices; and a supporting member that holds and fixes the recording element base plate. For the supporting member, a plurality of recording liquid supply paths are arranged to supply recording liquid to the supply ports of the recording element base plate, respectively, and the width of the supply paths is formed to be smaller than the opening width of the inlet portions of the supply ports. Further, stepped portions created between the respective supply paths and supply ports are buried by a bonding agent forced out from the bonding face of the recording element base plate and the supporting member.

Abstract: A narrow ink jet printhead having efficient FET drive circuits that are configured to compensate for parasitic resistances of power traces. The ink jet printhead further includes ground busses that overlap active regions of the FET drive circuits.

Abstract: An electrical device includes an interconnect and a pair substrates at least one of which includes an integrated circuit, the pair of substrates being bonded together by a bond that includes a structure having multiple widths and a composition that is selected from the group consisting of a graded material and a first material upon a second material.

Abstract: A liquid ejection print head includes a base accommodated in a frame and having electrothermal transducers supplied with energy from an external source for having liquid to eject the liquid to effect printing, a conductive layer for forming an electrical wiring, and a tape member for supporting the conductive layer. The tape member has connecting portions, which include (i) branch portions, which are electrically connected to the transducers via electrode portions on the base, and (ii) reinforcement portions, which are connected to dummy electrode portions on the base and are more rigid than the branch portions so as to prevent deformation of the branch portions.

Abstract: An ink jet printhead includes a printhead substrate having a plurality of thin film layers and three side by side columnar arrays of drop generators formed in the printhead substrate and extending along a longitudinal extent. Each columnar array has ink drop generators that are separated by an ink drop generator pitch P. The ink drop generators produce ink drops having an ink drop volume that enables multi-pass printing of a resolution that is not less than 1/(2P) dpi along a print axis parallel to the longitudinal extent. Three columnar arrays of FET drive circuits formed in the printhead substrate are employed to energize corresponding columnar arrays of ink drop generators.

Abstract: This invention relates to a printhead in which a plurality of resistors are selectively activated by an external control circuit to produce the ejection of droplets of ink through nozzles located in correspondence with the resistors. Selection and activation are performed according to a matrix having a plurality of vertical lines corresponding to the number of resistors per group of nozzles and a plurality of horizontal lines corresponding to the number of groups of nozzles in the head. The groups of nozzles in the polychromatic head comprise real nozzles and fictitious nozzles, as a result of which the groups of nozzles have a regular layout, and are uniformly distributed and equivalent to the corresponding layout of a monochromatic head. With this solution, polychromatic heads having the same number and the same disposition of contacts with the external circuit and the same height as a monochromatic head can be manufactured simply.

Abstract: A method for encapsulating electrical traces on a flexible circuit or TAB circuit and electrical connections between the flexible circuit or TAB circuit and a printhead substrate to inhibit ink corrosion thereof. The method includes applying a first adhesive to a first surface of the flexible circuit or TAB circuit. A second adhesive is applied to first surface of the flexible circuit or TAB circuit whereby the first and second adhesives effectively coat exposed portions of the traces and connections. The first and second adhesives are thermally curable epoxy compositions that are miscible with each other and the first adhesive has a first viscosity and first thixotropy index that is lower than a second viscosity second thixotropy index of the second adhesive. After applying the adhesive, the first and second adhesives are cured.

Abstract: Methods of forming thermal ink jet resistor structures for use in nucleating ink are described. In one embodiment, the method comprises forming a layer of conductive material over a substrate, and patterning and etching the layer of conductive material effective to form one or more arrays of resistors. Individual arrays comprise multiple, parallel-connected resistor elements and the resistor elements are configured such that failure of any one resistor element will not render its associated resistor array inoperative for nucleating ink. The resistor elements of individual arrays are formed such that collectively, the resistor elements are not independently addressable. Other embodiments are described.

Abstract: The invention described in the specification relates to an improved ink jet printer cartridge structure which includes a substrate carrier or nose piece upon which semiconductor devices for ink jet printheads are mounted. The substrate carrier has a top surface containing one or more substrate locator wells each well having well walls, a well base and at least one ink feed slot in each well base and side walls attached to the top surface along the perimeter thereof. One or more of the side walls contain fins for heat removal from the substrate carrier and at least two alignment devices attached adjacent at least one of the side walls for precisely aligning the substrate carrier in a printer carriage.

Abstract: A recording apparatus comprising: a printing head which has a plurality of recording elements and performs recording on the recording medium; a head holder which holds the printing head; a flexible wiring board comprising a flexible insulating band and a plurality of conductive wires and a driver element for actuating the printing head, which are provided on the flexible insulating band; and a heatsink for releasing heat generated by the driver element, wherein the heatsink is disposed between the flexible wiring board and the head holder.

Abstract: In one embodiment, the present invention recites a fluid ejection device comprising a first drop ejector associated with a firing chamber. The first drop ejector is configured to cause fluid having a first drop weight to be ejected from the firing chamber, wherein the first drop ejector includes a first heating element and first drive circuitry electrically coupled with the first heating element. The present embodiment further comprises a first bore disposed within an orifice layer disposed proximate the first drop ejector and associated with the first drop ejector. The present embodiment also comprises a second drop ejector associated with the firing chamber. The second drop ejector is configured to cause fluid having a second drop weight to be ejected from the firing chamber, wherein the second drop ejector includes a second heating element and second drive circuitry electrically coupled with the second heating element.

Abstract: A fluid-ejection mechanism of one embodiment of the invention is disclosed that includes one or more electrical contacts and one or more electrically grounded electrostatic discharge (ESD) shunt mechanisms. The electrical contacts make contact with corresponding contacts of one or more fluid-ejection assemblies that are otherwise exposed. The ESD shunt mechanisms to protect the electrical contacts from ESD when the electrical contacts are exposed.

Abstract: A flexible-film wire substrate is bent at first, second and third bent portions. Wires of a flexible wire pattern are deflected at least between the second bent portion and the third bent portion so that a pitch increases from the second bent portion toward the third bent portion. By bending the first, second and third bent portions so that the wires are substantially orthogonal to each bending line, the flexible-film wire substrate can be excellently bent without influencing the flexible wire pattern on the flexible-film wire substrate.

Abstract: A fluid ejection device includes a substrate, drop generators formed on the substrate at a high density, primitive select lines, and a ground line. The drop generators are arranged in primitives of drop generators. Each drop generator includes a heater resistor having a high resistance. Each primitive select line is separately electrically coupled to a corresponding one of the primitives and is configured to connect to a power source. The ground line is electrically coupled to all of the primitives.

Abstract: An ink jet recording head comprises a flat substrate having an end face and front and back flat main surfaces having a larger area as compared to the end face, an energy generating member for generating energy to be utilized to discharge the ink from a discharge port formed on the front flat main surface side of the substrate, a wiring electrode connected to the energy generating member formed on the front flat main surface of the substrate, and a connection electrode, connected to the wiring electrode, for receiving an electrical signal supplied from outside of the substrate, wherein the connection electrode is provided on another surface, different from the front and back flat main surfaces of the substrate. An ink jet recording apparatus comprises the ink jet recording head and a member for mounting the ink jet recording head.

Abstract: A manufacturing method of semiconductor devices, micromachines such as semiconductor device, narrow pitch connectors, electrostatic actuators or piezoelectric actuators, and ink jet heads, ink jet printers, liquid crystal panels, and electronic appliances, including them characterized in that short circuit due to dusts floating in the air will not take place. In a method where a silicon wafer (30) undergoes dicing to manufacture semiconductor devices (20), a groove (30a) covered by an insulating layer and spanning a dicing line is formed in the above described silicon wafer, and the silicon wafer undergoes dicing along the dicing line.

Abstract: An ink jet heater chip having improved thermal. The chip includes a semiconductor substrate, a first metal resistive, a second metal conductive layer on a first portion of the resistive layer and on a second portion of the resistive layer defining a heater resistor element. A passivation layer having a thickness defined by a deposition process is deposited on the second metal conductive layer and heater resistor element. A cavitation layer is deposited on the passivation layer and etched. A dielectric layer is deposited and etched to provide a dielectric layer overlying the first portion of the resistive layer. An electrical conduit via is etched in the dielectric layer. A third metal conductive layer is deposited in the via for electrical contact with the second metal conductive layer. Separately deposited dielectric and passivation layers enable independent control of the thickness of the dielectric and passivation layers.

Abstract: In a heater apparatus of an ink-jet print head and a fabrication method thereof, heaters and/or wires are formed to have a dopant doped therein by an ion implantation process carried out to regulate a resistance of the heaters and/or the wires, after forming the wire/heater pattern having the heaters and the wires with an electric conductor layer. Alternatively, the heaters and the wires can be formed of a heater pattern and a wire pattern respectively made of a heater layer and a wire layer, instead of forming the wire/resistance heat emitting body pattern with an electric conductor layer.