Abstract: A thermal inkjet printhead 100 of the present invention includes a heating element 110, an ink chamber, control circuitry 108, an ink reservoir, and a memory array 106. The control circuitry 108 causes the heating element to generate thermal energy thereby causing ink within the ink chamber to generate bubbles of ink, which are then expelled through a nozzle. The ink reservoir replenishes used ink in the ink chamber. The memory array 106 stores and provides the identification parameters for the thermal inkjet printhead 100. The identification parameters are typically provided during initialization of the printer and include color(s) of ink (e.g., black, green, red, blue), a number of nozzles on the thermal inkjet printhead, an addressing frequency, nozzle spacing, heating architecture, and the like.

Abstract: Plural electrothermal transducers (heaters) belonging to each of blocks having different driving timings are constituted as one group and are connected to a common interconnecting wiring in units of one group. Plural lines are connected to the common wiring such that the plural lines are extended to return with respect to the heaters and are each arranged to extend in an adjacent or sandwiched relation to the heaters. A printhead substrate, a printhead, and a printing apparatus can be provided which can realize higher quality of a printed image and a higher printing speed by arraying the heaters at a higher density while ensuring a sufficient area for arrangement of each of the heaters.

Abstract: The purpose of this invention is to provide a head substrate capable of increasing layout efficiency. To achieve this purpose, an ink supply channel is arranged, and a plurality of printing element arrays are arranged on at least one side of the ink supply channel, and a plurality of driving element arrays are arranged adjacent to the plurality of printing element arrays. A plurality of power supply pads and a plurality of ground pads are arranged in areas between the plurality of driving element arrays.

Abstract: A plurality of lands and a plurality of conducting wires connected independently to each land are formed on one side surface of an insulating substrate of a flexible printed circuit board. Through-holes are formed through the insulating substrate for exposing the lands to the other side surface. Solder is provided in the through-holes. The solder connects the lands to the head terminals on an inkjet head, which is located facing the other side surface of the insulating substrate. The insulating substrate separates the solder from areas between the conducting wires and from areas between the lands, thereby preventing short circuits from occurring when manufacturing the connecting structure with a low tolerance grade.

Abstract: A thermal inkjet printhead includes a plurality of bonding pads to which an external voltage is applied, a plurality of common wires connected to the each of the bonding pads, respectively, a plurality of individual wires connected to each of the common wires, respectively, and heaters connected to each of the individual wires, respectively, to generate ink bubbles by heating ink, wherein each of the common wires includes a first metal layer and a first metal bump which are formed on the first metal layer.

Abstract: Ink jet printhead comprising a driving and encoding circuit (20) having a grid-like structure, including a plurality of inputs (24), a plurality of selecting elements (12), a plurality of actuating elements (IC) and at least one identifying element (21) of said printhead. Each identifying element (21) is associated with a corresponding selecting element (12) and corresponds to nodes arranged along a row or column of said grid-like structure, and is scanned, together with said actuating elements (11), during a preliminary checking step.

Abstract: An inkjet printhead chip includes a substrate, transistors, isolation structures, a dielectric layer, a resistive layer and conductive sections. Each transistor includes a gate, a source, a drain and a gate oxide disposed between the gate and the substrate. The isolation structures are on the substrate surface and isolate the transistors. The dielectric layer covers the transistors and the isolation structures, and has openings exposed the source and the drain. Several heating regions are in the resistive layer that is on the dielectric layer. In the conductive sections, the first conductive section is on the resistive layer and exposes the heating regions for forming several heating devices. Each heating device has resistance less than 95 ohm and power density less than 2 GW/m2; the second conductive section and the third conductive section are electrically coupled to the drain and the source through the openings of the dielectric layer respectively.

Abstract: A liquid-jet head includes a passage-forming substrate. A plurality of pressure generating chambers communicate with nozzles. Piezoelectric elements each include a lower electrode, a piezoelectric layer and an upper electrode. Leads for the upper and lower electrodes are drawn out. In the liquid-jet head, the lower electrode is a common electrode continuously provided in the region facing the pressure generating chambers. At least an end on one side of the lower electrode in a direction perpendicular to an arrangement direction of the pressure generating chambers is positioned in the region facing the pressure generating chambers. The lead electrode for the lower electrode is provided outside of a region corresponding to a space between the pressure generating chambers. The lead electrode for the lower electrode is connected through a common lead portion extended from the lower electrode.

Abstract: In a printhead element board including a plurality of printing elements which align in a predetermined direction, driving circuits which drive the printing elements, and an element selection circuit which selects printing elements within each group for each group having a predetermined number of adjacent printing elements, a plurality of element selection circuits are laid out adjacent to the driving circuits of the respective groups. With this layout, even if the number of printing elements increases, only the length in the printing element array direction increases without increasing the length in a direction perpendicular to the printing element array direction.

Abstract: In accordance with one aspect of the present exemplary embodiment, a printhead includes a printed circuit board having at least one base layer, with at least one electrical trace, at least one fluidic passage and at least one fluidic chamber as part of the printed circuit board. The at least one electrical trace, fluidic passage and fluidic chamber are formed using printed circuit board manufacturing processes. An integrated circuit control chip is attached to the printed circuit board using known printed circuit board techniques. At least one fluidic actuator arrangement and aperture plate are attached to the printed circuit board using known PCB attachment processes.

Abstract: An ink-jet head which includes: a flow passage unit having plural nozzles and pressure chambers respectively communicating with the nozzles, the pressure chambers being arranged along a planar surface; an energy transfer unit which is fixed to the planar surface and transfers ejection energy to ink in the pressure chambers; a driver IC which generates a driving signal supplied to the energy transfer unit; a flat flexible cable in which the driver IC is mounted and plural wirings that make connection between the driver IC and the energy transfer unit are formed; and a heat transfer body which sandwiches at least a part of the energy transfer unit between the heat transfer body and the planar surface of the flow passage unit, the heat transfer body having a thickness in a direction perpendicular to the planar surface, the thickness decreasing in a direction away from the driver IC.

Abstract: An increase in energy applied to a heating element can be prevented and the service life of a printhead can be prolonged even when the temperature of the printing element having a negative temperature coefficient rises and the resistance of the heating element decreases upon controlling a switching element for controlling a current flowing through the heating element so as to make energy as constant as possible.

Abstract: A semiconductor substrate for a micro-fluid ejection device. The substrate includes plurality of micro-fluid ejection actuators disposed adjacent a fluid supply slot in the semiconductor substrate. A plurality of power transistors, occupying a power transistor active area of the substrate, are disposed adjacent the ejection actuators and are connected through a first metal conductor layer to the ejection actuators. An array of logic circuits, occupying a logic circuit area of the substrate, is disposed adjacent the plurality of power transistors and is connected through a polysilicon conductor layer to the power transistors. A power conductor and a ground conductor for the ejection actuators is routed in a second metal conductor layer. The power conductor overlaps at least a portion of the power transistor active area of the substrate and the ground conductor overlaps at least a portion of the logic circuit area of the substrate.

Abstract: The described embodiments relate to methods and systems for forming and protecting electrical interconnect assemblies. In one embodiment, an electrical interconnect assembly forming method forms an electrical interconnect between one or more conductors of a first support structure and one or more conductors of a second support structure. The method also distributes a generally flowable material over the electrical interconnect and exposes the generally flowable material to conditions sufficient to render the generally flowable material into a generally non-flowable state that provides fluid protection to the electrical interconnect and supports the electrical interconnect to reduce stress concentration at the electrical interconnect.

Abstract: A number of steps is reduced by manufacturing an electrode pad connecting a liquid discharge head to an external wiring by the same step of a common wiring for supplying an electric power to a discharge energy generating portion. A number of manufacturing steps of a head is reduced by forming a substrate for a liquid discharge head having an electrode pad and a common wiring for supplying an electric power to a discharge energy as a metal film made of the same material as the electrode pad in accordance with a plating in a step of forming the common wiring of the metal film in accordance with a plating.

Abstract: A cartridge unit for an inkjet printer comprising a body portion housing one or more ink storage compartments; a pagewidth printhead assembly configured to receive ink from the one or more ink storage compartments and having a plurality of nozzles arranged in use to deliver the ink onto passing print media; and an electrical connector in electrical communication with the nozzles of the printhead assembly and disposed along the length of the printhead assembly for mating with a corresponding connectors of the inkjet printer to control operation of the nozzles.

Abstract: A method estimates the temperature of a thermal print head element during printing. In one embodiment, the temperature is estimated using the resistance of the thermal print head element, which typically changes with the print head element temperature. The change in resistance of the print head element is exploited to indirectly estimate the temperature of the print head element.

Abstract: A flexible wiring cable 60 connects a recording head 7 and a relay board, and includes COF (chip on film) 62 for connecting an output side wiring pattern of an IC chip 61 to the recording head 7, and general purpose FFC (flexible flat cable) 63 formed with a parallel wiring pattern. The flexible wiring cable 60 connects the output side wiring pattern of the IC chip 61 to the relay board 50 via FFC 63, thereby decreasing the use of more expensive COF 62 by the use of cheap, general purpose FFC 63. Thus, the product cost as the entire recording apparatus is reduced by using the general purpose flexible board for a part of a flexible board having a driving circuit mounted thereon and serving as a connecting means for connecting a recording means and a relay board, suppressing the manufacturing cost of parts for connecting means.

Abstract: A printhead assembly with a communications module for a wallpaper printing system, the printhead assembly comprising: a casing; a printhead module; a fluid channel member positioned adjacent to the printhead module, the fluid channel member including a plurality of ducts that substantially span the length of the printhead module; a power supply connection port positioned at a distal end of the casing, the power supply port electrically connected to at least one busbar that substantially spans the length of the printhead module; a fluid delivery connection port positioned at a distal end of the casing, the fluid delivery port in fluid communication with the fluid channel member; and, a data connection port positioned at a distal end of the casing, the data port electrically connected to at least one printed circuit board positioned within the casing, the at least one printed circuit board further electrically connected to the printhead module.

Abstract: A liquid conveying substrate comprises: rectangular electrodes which are disposed on the substrate surface and whose surfaces are covered with a dielectric with a water repellent surface; first axial electrode columns where the rectangular electrodes are coupled in an x direction; and second axial electrode columns where the rectangular electrodes are coupled in a y direction. Accordingly, electrodes necessary for conveying liquid droplets can be arranged on one substrate, and the number of mechanisms for controlling the potential can be suppressed.

Abstract: A fluid-ejecting device with simplified connectivity is disclosed herein. According to an embodiment of the present invention, a common lead is provided such that a plurality of electrical contacts on a fluid-ejecting chip are connected to the common lead, which is located on a single-layer-flex circuit. Because a common lead is provided at an edge of the single-layer-flex circuit adjacent the fluid-ejecting chip, fewer signals need to be routed through the single-layer-flex circuit to such edge, thereby reducing the complexity of such circuit. Further, bond sites at the edge of the single-layer-flex circuit adjacent the fluid-ejecting device are arranged in a manner that minimizes the required length of wire bonds for connecting such contacts to the contacts on the fluid-ejecting chip.

Abstract: A semiconductor substrate for a micro-fluid ejecting device. The semiconductor substrate includes a plurality of fluid ejection devices disposed on the substrate. A plurality of driver transistors are disposed on the substrate for driving the plurality of fluid ejection devices. A programmable memory matrix containing embedded programmable memory devices is operatively connected to the micro-fluid ejecting device for collecting and storing information on the semiconductor substrate for operation of the micro-fluid ejecting device. The programmable memory matrix provides a high density of memory bits embedded on the substrate for storing information about the micro-fluid ejecting device.

Abstract: An inkjet printhead and a method of manufacturing the inkjet printhead. The inkjet printhead includes a substrate including a trench formed to a predetermined depth in an upper portion of the substrate and an ink feed hole formed through a bottom surface of the trench to supply ink, an etch stop layer formed of a metal and formed on an inner surface of the trench, a plurality of heaters, to create bubbles by heating ink, formed on the substrate, a plurality of electrodes, to apply a current to the plurality of heaters, formed on the substrate, a chamber layer stacked on the substrate and including a plurality of ink chambers formed above respective heaters to receive ink from the ink feed hole via the trench, and a nozzle layer stacked on the chamber layer and including a plurality of nozzles to eject ink from the plurality of ink chambers.

Abstract: A printhead assembly for a pagewidth inkjet printer, having an array of printhead modules mounted to an elongate channel extending substantially across the pagewidth. A flexible printed circuit board carrying data and power to said modules and an elastomeric ink delivery extrusion are situated between the modules and the channel. More particularly, the flexible printed circuit board is sandwiched between the elastomeric ink delivery extrusion and the channel so that it extends around one edge of the extrusion to carry power and data to the printhead modules.

Abstract: An inkjet printhead and a method of manufacturing the same are provided. The inkjet printhead includes a substrate; a plurality of heaters formed on an upper portion of the substrate for heating ink for generating bubbles; a plurality of metal-oxide semiconductor (MOS) field effect transistors (FETs) formed on the substrate for addressing the heaters and applying electric current to the heaters; first, second, and third interconnecting layers that are sequentially formed on the MOS FETs and electrically connected to each other for applying signals to the MOS FETs; a chamber layer for defining an ink chamber, which is filled with ink for ejection, on an upper portion of the heaters; and a nozzle layer having a nozzle, through which the ink is ejected, on an upper portion of the chamber layer.

Abstract: Heater chips for use in printing devices, such as those including one or more ink vias and one or more heater arrays, where at least a portion of at least one the ink vias is associated with at least portions of at least two heater arrays. The first heater array can be adjacent to one side of at least a portion of the ink via and a second heater array can be adjacent to another side of at least a portion of the ink via. The heater chip can also include a bondpad supplying power to at least a portion of the first heater array and to at least a portion of the second heater array.

Abstract: There are provided driving electrodes (25) on walls (24) separating both sides of individual ink chambers (22) formed in the form of an array of multiple grooves. External circuit connecting electrodes (11) for connecting these driving electrodes (25) to an external circuit are formed on exposed surface regions of electrically conductive material (10) filled in the individual ink chambers (22) at a rear end portion of a head. Each of the aforesaid exposed surface regions has an area larger than the cross-sectional area of each ink chamber as measured along a direction perpendicular to the ink chamber array.

Abstract: A printhead assembly for an inkjet printer includes an elongate carrier. A number of printhead modules are mounted on the carrier. Each printhead module includes an ink delivery assembly and a printhead chip mounted on the ink delivery assembly. Flexible printed circuit board assemblies are attached to the carrier and to respective printhead modules for carrying data and power to said modules. A pair of busbars is electrically connected to the flexible printed circuit board assemblies for carrying power to the flexible printed circuit board assemblies. The carrier has a bearing surface and a biasing structure for individually urging the printhead modules against the bearing surface and maintaining the electrical connection between the flexible printed circuit board assemblies an the pair of busbars.

Abstract: The present invention provides a printhead substrate capable of controlling the driving of a large number of printing elements in a reduced surface area, a printhead using the printhead substrate, and a printing apparatus using the printhead. In particular, the printhead substrate, configured so that a plurality of ink supply channels are disposed in parallel on the substrate, includes a plurality of printing element arrays composed of a plurality of printing elements disposed alongside each of the plurality of ink supply channels, a plurality of drive control circuits disposed in an area between the plurality of ink supply channels that control the driving of each of the plurality of printing element arrays, and shared wiring portions disposed in the area between the plurality of ink supply channels and shared by the plurality of drive control circuits.

Abstract: A liquid discharge head includes a substrate, discharge units each including one liquid discharge port discharging the liquid, an energy generating element on the surface of the substrate and generating energy to discharge the liquid from the liquid discharge port, one liquid chamber in which the energy generating element is disposed, one liquid supply port penetrating the substrate, one liquid path extending from the liquid supply port to the liquid discharge port through the liquid chamber, a penetrating wiring penetrating the substrate, an element wiring connecting the energy generating element to the penetrating wiring and a driving element on a back surface of the substrate and driving the energy generating element through the penetrating wiring and a common liquid chamber communicating with the substrate along the surface of which the discharge units are arranged through liquid routes having an equal distance to all of the liquid supply ports.

Abstract: A liquid ejecting print head, which may be included in a liquid ejecting device and/or an image forming apparatus, includes a plurality of print head units arranged across a longitudinal direction of the liquid ejecting print head and aligned in a zigzag manner in a direction perpendicular to the longitudinal direction of the liquid ejecting print head, a plurality of nozzle arrays mounted on each print head unit and including a plurality of nozzle orifices for ejecting a droplet of ink, an energy generating element mounted on each print head unit and provided for each nozzle orifice for generating energy for ejecting the droplet of ink, and a wiring member including a plurality of wirings formed to run in an identical direction with respect to each print head unit and configured to transmit respective signals to the energy generating element.

Abstract: A circuit board for a liquid discharging apparatus in which coating performance of a protective layer and a cavitation resistive film on a heat generating element is excellent and durability is excellent and a manufacturing method of such a circuit board are provided. A surface portion of a wiring material layer is processed so that an etching speed of the surface portion is made higher than that of the material forming the wiring material layer. It is desirable to execute a process for forming at least one selected from a fluoride, a chloride, and a nitride of the material forming the wiring material layer into the surface portion of the wiring material layer.

Abstract: For providing a producing method for a liquid discharge head having an excellent reliability in the insulation of test electrode pad, the invention provides a method for producing a liquid discharge head including a liquid discharge energy generating element for generating a liquid discharge energy, a liquid discharge port, a liquid flow path, an electric circuit for driving the liquid discharge energy generating element, a first electrode pad for exchanging electrical signals with the exterior and a second electrode pad for testing the electric circuit, the method including, preparing a substrate provided with a first wiring layer for forming the first electrode pad and a second wiring layer for forming the second electrode pad, forming an insulating film on the substrate so as to expose the first wiring layer and to cover the second wiring layer, forming a metal film by an electroless plating method on the surface of the first wiring layer, and stripping the insulating film.

Abstract: A wide format printer includes a carrier that is mountable on a support structure of the wide format printer in an operative position with respect to a platen of the wide format printer. A number of printhead chips are positioned on the carrier, the printhead chips together incorporating at least fifty thousand nozzle arrangements. The printhead chips are positioned so that the printhead chips are capable of ejecting ink drops into a printing zone defined by the platen. Control circuitry is also positioned on the carrier and is configured to control operation of the printhead chips.

Abstract: An inkjet print head chip usable in an inkjet print head includes a semiconductor substrate having plural switching devices formed therein, plural heaters provided on upper sides of the switching devices and activated by the plural switching devices to heat ink, and metal wiring layers formed between the plural heaters and the switching devices which externally radiate some of the heat generated from the plural heaters.

Abstract: A flexible circuit board (15) has one end portion (15a) soldered to a connection terminal row of a side surface (13e) of an ink-jet recording head (13), and extends upwardly from the ink jet recording head (13). The flexible circuit board (15) is bent at a midpoint at substantially right angles in the longitudinal direction of the flexible circuit board (15) to form a crease portion (15c). A forward end of the board (15) extends leftward, and is then folded back by 180 degrees to form a crease portion (15d). The forward end thereof extends rightward, and the forward end portion (15b) is soldered to a terminal row disposed on the back side of a COB substrate (24). A sheet-like double-faced tape having a drum-like cut-out shape is affixed to the crease portion (15c) in advance. When the flexible circuit board is folded along a crease line, the base material of the flexible printed wiring board at the cut-out part is adhered to the doubled-faced tape.

Abstract: A number of steps is reduced by manufacturing an electrode pad connecting a liquid discharge head to an external wiring by the same step of a common wiring for supplying an electric power to a discharge energy generating portion. A number of manufacturing steps of a head is reduced by forming a substrate for a liquid discharge head having an electrode pad and a common wiring for supplying an electric power to a discharge energy as a metal film made of the same material as the electrode pad in accordance with a plating in a step of forming the common wiring of the metal film in accordance with a plating.

Abstract: A recording apparatus includes a liquid droplet discharging head and a tank. The liquid droplet discharging head discharges a liquid droplet. The tank supplies a liquid to the liquid droplet discharging head. The liquid droplet discharging head includes a liquid droplet discharging head circuit board including a board substrate and a writing pattern. The wiring pattern is located on the board substrate to supply power and includes a plurality of divided wiring patterns formed by dividing at least a part of the wiring pattern in a width direction of the wiring pattern.

Abstract: A driver IC (60) for a printhead includes a first set of data side input/output pads (62) and a second set of data side input/output pads (63). The driver IC further includes circuitry (100) that can select that data is to be input at the first set of pads and output at the second set of pads.

Abstract: A circuit article for use with an inkjet printer pen. The circuit article comprises a flexible circuit having a plurality of conductive traces disposed on a dielectric film, an adhesive film disposed adjacent the dielectric film of the flexible circuit, and a carrier film disposed adjacent the first adhesive film, opposite of the flexible circuit. The adhesive film is derived from a cross-linkable precursor comprising an epoxidized aromatic-diene block copolymer and a thermal-curing agent.

Abstract: The present invention provides an ink jet recording apparatus having high printing quality, in which each nozzle array is driven using a plurality of driver ICs. Assuming that the input terminal nozzles Y (n-3), M (n-2), C (n-1), and Bkn of four actuators form a group n, a group 4 (G4) is formed from input terminals spanning four stages, i.e. Y1, M2, C3, Bk4, and from a group 5 onward, similar groups are formed repeatedly. Input terminals of different colors are connected in succession to a driver IC 26a according to a color cycle of C?Y?Bk?M. Meanwhile, input terminals of different colors are connected in succession to a driver IC 26b according to a color cycle of Bk?M?C?Y. In all of the nozzle arrays, the driver ICs which drive the nozzles are connected alternately in staggered form.

Abstract: In one embodiment, a fluid ejection device is configured to receive a signal and ejecting fluid in response thereto, including an ink ejecting nozzle layer having a substrate with first and second surfaces joined along an edge, an insulating feature located on the first surface adjacent the edge and a flexible lead that bends around the edge and lies flush against the insulating feature.

Abstract: An ink-jet printhead, and a method of manufacturing the same, includes a substrate, an ink chamber, a manifold, and an ink channel formed between the ink chamber and the manifold to provide flow communication between the ink chamber and the manifold, a substantially flat nozzle plate formed on the upper surface of the substrate, the nozzle plate including a plurality of passivation layers, a heat dissipation layer disposed on the plurality of passivation layers, the heat dissipation layer formed of a thermally conductive material and including a first thermally conductive layer formed on the plurality of passivation layers and a second thermally conductive layer formed on the first thermally conductive layer, and a nozzle extending through the nozzle plate in flow communication with the ink chamber, and a heater and a conductor, the heater heating ink filled in the ink chamber and the conductor applying current to the heater.

Abstract: An apparatus and method for driving an ink-jet printhead in which current is applied to a heater to heat ink to be supplied in an ink chamber to generate a bubble to eject ink from the ink chamber, the apparatus including a circuit that alternately applies current to the heater to alternate a direction of current flowing through the heater.

Abstract: This invention relates to a printhead substrate capable of suppressing an increase in wiring width and an increase in the size of a substrate formed by a film forming process while increasing the number of simultaneously driven printing elements in order to improve the printing performance, a printhead using the substrate, and a printing apparatus using the printhead. The wiring lines of the substrate are formed into a common wiring line, and energy applied to a heating resistance element is prevented from deviating from a stable ink discharge range owing to the difference in the number of simultaneously driven heating resistance elements. For this purpose, a driving element is greatly downsized in comparison with a conventional one, and the operation region of a MOS transistor is shifted from the non-saturation region to the saturation region.

Abstract: A printhead assembly includes an elongate support structure that has a base portion and at least a pair of longitudinally extending side wall portions. One side wall portion extends from each edge of one side of the base portion a plurality of carriers is mountable, end-to-end, on the support structure so that each carrier engages a respective wall portion. A printhead segment is mounted on each carrier. Each printhead segment has a plurality of ink supply holes. At least one printed circuit board is mountable on an opposite side of the base portion. A plurality of tape automated bonding films are connected between the printed circuit board and each respective printhead segment.

Abstract: An ink-jet head unit including an ink-jet head having ejection-energy generating elements for generating energies for ejecting an ink from nozzles, and a row of terminals for energizing the ejection-energy generating elements, a flexible wiring board having a wiring pattern jointed in an end portion thereof to the terminals of the ink-jet head, the flexible wiring board extending in a direction perpendicular to a direction of extension of the row of terminals, and including an inclined portion extending from the end portion obliquely upwardly and outwardly of the ink-jet head, and a rigid member having a higher degree of rigidity than the flexible wiring board and disposed on the flexible wiring board in contact with at least the end portion.

Abstract: An ink ejecting head includes a nozzle sheet having nozzles for ejecting droplets; a head chip having an energy generator opposing each of the nozzles; a barrier layer interposed between the nozzle sheet and the head chip for forming the space for a liquid chamber; a pad provided in a surface of the head chip, the surface opposing the nozzle sheet; and a wiring layer disposed on a surface of the nozzle sheet, the surface adjacent to the head chip; and a bump disposed on the wiring layer, being at least in contact with the pad of the head chip, and bonded to the pad by ultrasonic bonding.

Abstract: A semiconductor substrate for a micro-fluid ejection device. The substrate includes plurality of micro-fluid ejection actuators disposed adjacent a fluid supply slot in the semiconductor substrate. A plurality of power transistors, occupying a power transistor active area of the substrate, are disposed adjacent the ejection actuators and are connected through a first metal conductor layer to the ejection actuators. An array of logic circuits, occupying a logic circuit area of the substrate, is disposed adjacent the plurality of power transistors and is connected through a polysilicon conductor layer to the power transistors. A power conductor and a ground conductor for the ejection actuators is routed in a second metal conductor layer. The power conductor overlaps at least a portion of the power transistor active area of the substrate and the ground conductor overlaps at least a portion of the logic circuit area of the substrate.

Abstract: To realize an ink jet recording head which is further improved in heat dissipation property, the ink jet recording head provided with a substrate provided with a plurality of discharging energy generating portions for discharging an ink droplet comprises: a plurality of electrical wiring electrodes for supplying electrical signals to the plurality of discharging energy generating portions provided in the substrate; a plurality of auxiliary electrodes not used for the supply of electrical signals to the plurality of discharging energy generating portions provided in the substrate, a first sheet comprising a wiring pattern electrically conductive to an electrical wiring electrode to be connected to the plurality of electrical wiring electrodes, and a second sheet comprising a wiring pattern electrically conductive to the auxiliary electrode terminal to be connected to the plurality of auxiliary electrodes, the ink jet recording head comprising a wiring sheet in which the first sheet and the second sheet are arr