Abstract: In a case where first wirings (wirings for a driving power supply (VH)) commonly connected to a plurality of electro-thermal converting elements and adapted to supply an electric power to the plurality of electro-thermal converting elements and second wirings (high voltage grounding wirings (GNDH)) for connecting source areas of respective switching elements to grounding potential are provided, resistance of the second wiring is selected to be smaller than resistance of the first wiring.

Abstract: An interconnect system for a device stall adapted to receive an inkjet device having a first set of electrical contact surfaces on a device surface. A second set of electrical contact surfaces is provided in a device stall. Respective ones of the first set and the second set are in facing alignment when the device is installed in the stall. An elastomeric layer is disposed between and in contact with the first and second sets of electrical contact surfaces, having a plurality of isolated conductive filaments or wires disposed therein between a first layer surface and a second layer surface. Conductor ends are exposed at the first and second layer surfaces, providing isolated electrical continuity between respective ones of the first set and the second set of electrical contact surfaces.

Abstract: This invention is intended to connect a dummy lead while preventing depression of a resin that seals electric connection sections, without bringing the dummy lead into contact with a recording element substrate or without taking the dummy lead for a lead electrode. The dummy lead which is provided inward of an opening of a flexible film wiring substrate to be shorter than the lead electrode, and which is not electrically connected to an electrode pad is provided to be adjacent to the lead electrode.

Abstract: An inkjet print head chip usable in an inkjet print head includes a semiconductor substrate having plural switching devices formed therein, plural heaters provided on upper sides of the switching devices and activated by the plural switching devices to heat ink, and metal wiring layers formed between the plural heaters and the switching devices which externally radiate some of the heat generated from the plural heaters.

Abstract: There is provided an ink jet recording head which can efficiently prevent ink from corroding an insulating film layer. A positive electrode is disposed on an upper surface of the insulating film layer and a negative electrode is disposed on a lower surface of the insulating film layer, which is referred to as a turnover structure. There is no electrode between any two adjacent heater resistor portions. As a result, high-density disposition of the heater resistor portions can be carried out. The heater resistor portions are thermally oxidized, so that surfaces thereof are changed into tantalum insulating films (surface oxidation films), which serve as ink protection layers. A second insulating film layer is totally covered by the heater resistor portions and the partition walls and is not exposed. Thus, ink does not contact the second insulating film layer, and the second insulating film layer is not corroded by ink.

Abstract: A printing system has a laser scanner and a print bar such as a page-width-array printhead associated with an array of photodetectors. The scanner scans the array of photodetectors, to selectively light activate photodetectors in the array. Each photodetector, when activated by the scanner triggers its associated inkjet nozzle(s) in the printhead to deposit ink on a media surface. In one embodiment the page-width-array is stationary and the media is periodically advanced as ink drops are deposited.

Abstract: A fluid injection head structure. The fluid injection head structure is formed on a substrate and has a manifold therein, bubble generators, a conductive trace, and at least two rows of chambers adjacent to the manifold in flow communication with the manifold. The conductive trace disposed on a top surface of the substrate and partially disposed between the two rows of the chambers above the manifold is used to drive the bubble generator.

Abstract: There is disclosed an ink jet printhead which comprises a plurality of nozzles 3 and one or more heater elements 10 corresponding to each nozzle 3. Each heater element 10 is configured to heat a bubble forming liquid 11 in the printhead to a temperature above its boiling point to form a gas bubble 12 therein. The generation of the bubble 12 causes the ejection of a drop 16 of an ejectable liquid (such as ink) through an ejection aperture 5 in each nozzle 3, to effect printing. The heater is formed by layers of heater material, the number of layers forming the electrodes 15 exceeds the number of layers forming the heater element 10. By depositing more layers of heater material at the electrodes 15, the electrode resistance is reduced. With less resistance, there are less power losses from the electrodes 15 and overall efficiency of the printhead is improved. With the electrodes dissipating less heat to the wafer substrate, the printhead requires less cooling.

Abstract: A flexible printed circuit board connected to a printer head having at least one heater discharging ink, the flexible printed circuit board including: at least one voltage supplying terminal selectively supplying an operating voltage to the at least one heater in response to receiving a printing command signal from a printer; at least one first cable connected at each end to the at least one voltage supplying terminal and at least one first bonding pad, respectively, transferring the operating voltage to the at least one heater; at least one grounded terminal; and at least one second cable connected at each end to the at least one grounded terminal and at least one second bonding pad, respectively, in which the at least one second cable is divided into at least two portions at a predetermined position and a first portion of the at least two divided portions is provided along one side of the at least one first cable, and a second portion of the at least two divided portions is provided along the other side of

Abstract: An interconnect system for a device stall adapted to receive an inkjet device having a first set of electrical contact surfaces on a device surface. A second set of electrical contact surfaces is provided in a device stall. Respective ones of the first set and the second set are in facing alignment when the device is installed in the stall. An elastomeric layer is disposed between and in contact with the first and second sets of electrical contact surfaces, having a plurality of isolated conductive filaments or wires disposed therein between a first layer surface and a second layer surface. Conductor ends are exposed at the first and second layer surfaces, providing isolated electrical continuity between respective ones of the first set and the second set of electrical contact surfaces.

Abstract: A printing apparatus comprises CPUs provided for corresponding one of a plurality of colors, each of which generates image data of a specified color; memories, each of which stores the image data of the specified color; system ASICs, each of which manages the memories; video output controllers, each outputting the image data supplied from the corresponding system ASICs as a video signal; and image generating sections, each generating an image based on the video signal outputted from the video output controllers.

Abstract: An integrated circuit in an ink jet printhead selectively activates one or more printing elements on the printhead based on a multi-dimensional addressing scheme. The integrated circuit includes a plurality of pass switching, power switching, and one or more ground switching devices for selectively connecting one or more power switching devices to ground to activate one or more of the printing elements to print an image on a print medium. The integrated circuit includes a number of first, second, third, and fourth control lines for selectively controlling the activation of one or more of the printing elements.

Abstract: The present disclosure relates to an inkjet printing system that includes an inkjet printhead having a plurality of electrical contacts. The plurality of electrical contacts include address contacts and enable contacts for enabling drop generators and drive current contacts for providing drive current to enable drop generators for selectively ejecting ink therefrom. The printing system includes a printing device having a plurality of electrical contacts including address contacts, enable contacts and drive current contacts. The plurality of electrical contacts are configured to establish electrical contact with corresponding electrical contacts on the inkjet printhead upon insertion of the inkjet printhead into the printing device. The printing device provides periodic address signals and enable signals to the address and enable contacts one the printhead. In addition, the printing device selectively applies drive current to accomplish forming images on print media.

Abstract: A liquid discharge head substrate used for a liquid discharge head is adapted to discharge liquid by applying discharge energy to the liquid, and has a semiconductor substrate including an energy conversion element for converting electric energy into the discharge energy. In this case, the liquid discharge head substrate comprises a function element made of a ferroelectric material, which is formed in the semiconductor substrate.

Abstract: An electrical interconnect for an inkjet printhead comprising an ink-ejecting semiconductor die is described. The ink-ejecting die further comprises a substrate having an opposing upper surface, lower surface, and a thin film stack. The upper surface of the substrate is beveled on at least one edge such that a lower portion of the bevel is below an upper portion of the bevel. A conductive material trace is disposed on top of at least a portion of the upper surface and the thin film stack and on the bevel towards the lower portion of the bevel. An electrical conductor is coupled to the conductive material trace at a predetermined location below the upper portion of the bevel.

Abstract: A liquid discharge head substrate used for a liquid discharge head adapted to discharge liquid by applying discharge energy to the liquid includes a semiconductor substrate provided with an energy conversion element for converting electric energy into discharge energy. The semiconductor substrate is further provided with a function element made of a ferroelectric material.

Abstract: An electrode wiring line is formed on a supporting board which supports a printing element board constituting a printing head, and it is connected with the electrode wiring lines of a flexible board, thereby to interconnect electrode wiring lines which are formed on both the sides of the printing element board in order to feed a signal or the like of identical sort. Thus, a region for the electrode wiring line on one side of the flexible board can be omitted, with the result that the number of the wiring lines of the flexible board can be increased, or the density of these wiring lines can be heightened.

Abstract: Power consumed by a resistor connected between a first power supply and a drive control circuit is controlled by a power driving circuit connected to a second power supply. When the value of current that flows into the resistor fluctuates, the value of current output from power driving circuit to a control terminal of the drive control circuit is controlled in such a manner that power consumed is the same as that when the resistance value of the resistor is a set value. As a result, the value of power consumed by the resistor is rendered substantially constant without being influenced by a variation in the resistance value of the driven resistor or by the power supply voltage. If such a drive circuit is used in driving the printhead of a printing apparatus, stabilized drive can be achieved with the minimum margin, power consumption can be suppressed and the lifetime of the printhead can be prolonged.

Abstract: A method of tape automated bonding a heater chip of an ink jet printer to a flexible circuit includes the step of attaching an electrically conductive bonding pad to a first portion of a surface of the heater chip. A mask is applied to a second portion of the surface of the heater chip. An exposed surface of the bonding pad is chemical dry etched for a predetermined time period to thereby remove contaminants from the etched exposed surface. The chemical dry etching is terminated at an end of the predetermined time period such that substantially none of the bonding pad is removed. Lastly, the flexible circuit is electrically connected to the etched exposed surface.

Abstract: A driver transistor structure of an inkjet print head chip and the method for making the same. Having several body contacts distributed all over the source of an active region of a large area MOSFET (Metal Oxide Semiconductor Field Effect Transistor), an equivalent RB from the MOSFET channel to the body contact is greatly diminished as the distance between them is reduced, thereby preventing the occurrence of a secondary breakdown. Since the body contact is installed inside the active region without defining in advance a body contact region and making the body contact in the field oxide layer outside the active region, about 20% of the driver transistor structure can be saved to lower the average manufacturing cost of each chip.

Abstract: An ink-jet print head preventing thermal accumulation on a nozzle plate includes a substrate, a channel formed in the substrate to supply ink, a nozzle plate connected to the substrate and including a nozzle corresponding to the channel, a heat element formed in the nozzle plate to surround the nozzle, a thermal conduction layer formed on an upper side of the heat element formed between the thermal conduction layer and the heat element, and a thermal shunt spaced-apart from the heat element by a predetermined distance not to overlap the heat element in a direction parallel to the nozzle plate and connecting the thermal conduction layer to the substrate. Redundant heat generated from the heat element is not accumulated on a membrane of the nozzle plate but is rapidly absorbed into an inorganic thermal conduction layer formed in the membrane and is transferred to the bulk silicon substrate through a metallic thermal bridge, such as the thermal shunt.

Abstract: A recording element substrate has a plurality of recording elements are provided, a wiring sheet is provided at a position to surround a periphery of the recording element substrate to transmit a recording signal to the recording element substrate, a wiring substrate is electrically connected to one end portion of the wiring sheet to input a recording signal from an exterior, and a flow path forming member supplies recording liquid to the recording element substrate. When the flow path forming member is joined to a frame body having a common liquid chamber, in a state in which the an end of the wiring substrate is supported by the flow path forming member, a liquid jet recording head is held due to opposing both end portions of another end portion of the wiring substrate being respectively inserted and engaged with a set of engaging grooves provided at the frame body.

Abstract: A method for producing an ink jet recording head having a plurality of recording element substrates each including a recording element for generating energy to be used for ink discharge and an electrode portion connected to the recording element, a wiring substrate provided with an electrode terminal to be electrically connected with the electrode portion of the plural recording element substrates and adapted to transmit an electrical pulse for ink discharge to the recording element, and an element substrate support member for supporting the plural recording element substrates, comprises a step of causing the plural recording element substrates to be supported on the element substrate support member, and a step of thereafter executing metal—metal bonding between the electrode portion of the plural recording element substrates and the electrode terminal of the wiring substrate.

Abstract: The invention provides a thin, lightweight, durable electro-optic display assembly that is significantly mote flexible than known plastic electro-optic displays. The enhanced flexibility of the plastic display assemblies according to the invention is achieved by employing laminate display structures in which there is little, if any, bonding between adjacent layers of the laminate assembly.

Abstract: Methods and apparatus are provided for forming a seal between two or more components using a thermally cured sealing material. One exemplary method includes selectively applying an electrical signal to a heating trace on a first component, applying a sealing material between at least a portion of the first component and at least a portion of a second component, and at least partially thermally curing the sealing material using thermal energy generated by the application of the electrical signal to the heating trace.

Abstract: A fluid ejection device capable of ejecting fluid onto media. The device includes a carrier having an upper surface that defines a recess. The device further includes a fluid ejecting substrate disposed therein that is configured for establishing electrical and fluidic coupling with the carrier. The fluid ejecting substrate has a generally planar orifice layer defining a plurality of orifices therein and a generally planar contact surface positioned below the orifice layer. The device further includes an encapsulant that at least partially encapsulates the fluid ejecting substrate and the carrier to form a substantially co-planar surface with the orifice layer.

Abstract: A fluid ejector includes a fluid channel having a resistive heater and terminating in a nozzle, a common bus formed transverse to the fluid channel and between the resistive heater and the nozzle, a connection line laterally adjacent to the fluid channel, and a connection structure for electrically connecting the common bus with the reistive heater and the connection line, the connection structure including a first set of one or more layers for electrical connection and a second set of one or more layers for covering the common bus and connection line. The first set of one or more layers includes a doped polysilicon layer on or overlaid by an optional tantalum-silicide layer. The second set of one or more layers includes a nitride layer on or overlaid by a tantalum layer.

Abstract: The present invention provides an ink jet recording head comprising a heat generating device for generating thermal energy utilized to discharge ink, a non-linear element having a non-linear current/voltage property and adapted to drive the heat generating means, and a current adjusting device for adjusting current flowing into the non-linear element.

Abstract: A circuit board for an ink-jet recording head which ejects ink includes a plurality of electrothermal transducers for generating thermal energy which is used for ejecting ink; and a plurality of wiring electrodes for supplying electric power to the plurality of electrothermal transducers, the plurality of wiring electrodes each having a thickness of one of at least two values according to the length of each wiring electrode, whereby the resistance of the wiring electrodes are made uniform between each wiring electrode without significantly increasing the width of the wiring electrodes.

Abstract: To suitably electrically interconnect a recording element substrate, on which power supply paths are formed in a high density, and an electric wiring substrate, on which wiring lines for supplying power to these paths are formed, bumps are formed and arranged on the recording element substrate at a predetermined pitch therebetween so as to protrude by a predetermined distance t1 from this substrate. On the electric wiring substrate, on the other hand, connecting terminals are formed and arranged with the same pitch as that of the bumps. Between each two of the bumps is formed an insulating film which protrudes in the protrusion direction of the bumps by a predetermined distance t2, where t1<t2. By fitting the connecting terminals between respective pairs of the insulating films, each connecting terminal comes in contact with a corresponding bump with a sufficient contact area provided therebetween so as not to give rise to short-circuiting or open-circuiting.

Abstract: A method of manufacturing an electronic device is provided comprising steps of providing a circuit having at least one cantilever lead, providing a die having at least one bonding region, bonding the at least one cantilever lead to the at least one bonding region, and bending the at least one bonded cantilever lead. Preferably, the electronic device comprises an inkjet cartridge.

Abstract: An electrode connecting method, a narrow-pitch connector, a pitch converter, a micro-machine, a piezoelectric actuator, an electrostatic actuator, an ink jet head, an ink jet printer, a liquid crystal device and electronic equipment, in which even if connecting subjects having different thermal expansion coefficients are connected with each other, the positional deviation between the terminal electrodes of the connecting subjects can be restrained. After terminal electrodes (28) of a connecting subject (26) are put on top of terminal electrodes (30) of a narrow-pitch connector (20), thermal compression bonding is performed on these terminal electrodes so that the terminal electrodes are connected with each other.

Abstract: In the electrode pads in the ink jet print head substrate that uses ball bumps, bonding of the ball bumps is carried out in satisfactory condition despite reduced thickness of films in the substrate. In an ink jet print head substrate, which has a heater film constituting the heater portions, a second electric wire in electrical contact with the heater film to supply it with electric power, and a first electric wire constituting a common electrode of a matrix wire for selectively driving the heater portions, the first electric wire is used as the electrode pads to which the ball bump is joined. The first electric wire does not need to be reduced in thickness even when the thickness of the protective film is reduced. Thus, an ultrasonic wave can be transferred well to the electrode pad during ultrasonic bonding.

Abstract: A heater chip for use in an inkjet printer which includes a single conductive layer to provide electrical connectivity between power and ground inputs. Wherein the unique power distribution architecture is possible by the formation of a plurality of ink vias in the heater chip which provides for an increase in the chip surface area available for electrical connectivity.

Abstract: This invention provides an ink jet printing apparatus and method with an inexpensive arrangement that allows a stable supply of an appropriate voltage to heaters without requiring varying load resistance or changing a power supply voltage. The ink jet printing apparatus of this invention has a plurality of nozzles arrayed in a print head; a plurality of energy generators installed one in each of the nozzles for generating an ejection energy to eject ink from the nozzles, the plurality of energy generators being divided into a plurality of blocks; and a drive controller f or simultaneously driving the energy generators in each block. The drive controller supplies an energy to the energy generators making up each block through different kinds of energy supply paths.

Abstract: An ink jet recording head with a heat-generating resistance layer for generating thermal energy used for ink discharge, and a wiring electrode layer electrically connected to the heat-generating resistance layer to form an electro-thermal converting element, an insulating protective layer covering the electro-thermal converting element, and an external electrical connection portion electrically connected to the electro-thermal converting element and configured to connect to an external wiring for applying a voltage to the electro-thermal converting element. Further, the external electrical connection portion is formed by a layer grown by electroless plating from the wiring electrode layer through a through hole formed in the insulating protective layer. The external electrical connection portion projects beyond the insulating protective layer and has a flat surface at the most extended projection of the external electrical connection portion.

Abstract: A recording element substrate has a plurality of recording elements are provided, a wiring sheet is provided at a position to surround a periphery of the recording element substrate to transmit a recording signal to the recording element substrate, a wiring substrate is electrically connected to one end portion of the wiring sheet to input a recording signal from an exterior, and a flow path forming member supplies recording liquid to the recording element substrate. When the flow path forming member is joined to a frame body having a common liquid chamber, in a state in which the an end of the wiring substrate is supported by the flow path forming member, a liquid jet recording head is held due to opposing both end portions of another end portion of the wiring substrate being respectively inserted and engaged with a set of engaging grooves provided at the frame body.

Abstract: A printhead cartridge mounts within a carriage of a printer. The carriage moves along a first direction within the printer. The printhead cartridge includes an inkwell for storing ink, which has a front surface and a bottom surface, a printhead mounted on the bottom surface, and a plurality of contacts for receiving signals from the printer and to provide the signals to the printhead. A centerline of the front surface, running perpendicular to the first direction, evenly defines first and second sides of the front surface. The contacts are disposed on the front surface, and a distribution of the contacts on the first side exceeds a corresponding distribution of the contacts on the second side.

Abstract: A head unit for carrying out operations for connecting and disconnecting cables and tubes to and from a plurality of functional liquid droplet ejection heads has a wiring connection assembly carried on a carriage and having a plurality of wiring connectors to be connected to main cables and a plurality of separate cables having one end thereof connected to the respective functional liquid droplet ejection heads and an opposite end thereof connected to the respective wiring connectors, and a piping connection assembly having a plurality of piping joints to be connected to main pipes and a plurality of separate pipes having one end thereof connected to respective functional liquid droplet ejection heads and opposite end thereof connected to respective piping joints.

Abstract: A method, and structure formed thereof, for processing an exposed conductive connection between an thermal inkjet head device and a flexible tape circuit connectable to control signals for driving the inkjet device. According to the method of processing, the exposed conductive connection is electrophoretically plated with a polymer to protect it against corrosive damage by coupling the exposed conductive connection to a first voltage potential and immersing it into an electrophoretic polymer solution in contact with an electrode at a second voltage potential thereby establishing a current between the electrode and the exposed connection such that the exposed connection is coated with a thin film of polymer of uniform thickness.

Abstract: The invention discloses a manufacturing processing of making a flexible printed circuit for inkjet printheads. Through the change of the flexible printed circuit structure, residual stress at the bent part can be reduced and the efficiency and precision of subsequent processes can be increased. The disclosed process is thus able to make products with high reliability and quality. The process involves the steps of: (1) preparing a flexible printed circuit substrate and making a window at a predetermined bent part; (2) coating the substrate with a metal layer so that the substrate become conductive; (3) etching the metal layer through a photolithography process to produce a conductive circuit on the flexible printed circuit; and (4) forming a cover layer (solder mask materials such as epoxy or acrylic resins) at the window. A flexible printed circuit thus produced is pre-bent, easy to attach and align, and has less residual stress and a cover layer or film at the bent part.

Abstract: An ink jet recording head comprises heating means for generating a heat energy to be utilized for discharging an ink, and a nonlinear element for driving the heating means, having MIM type current/voltage characteristics in which a resistance value during application of a low voltage indicates a high value regardless of polarity as compared with the resistance value during application of a high voltage, wherein the nonlinear element has an electric field relaxing structure for relaxing generation of a locally strong electric field.

Abstract: A power supply apparatus includes a boost circuit and a switch circuit. The boost circuit has rectifying elements and charge storage elements associated with the rectifying elements, and outputs a boosted voltage by sequentially cumulating charges in the charge storage elements in accordance with an AC input signal. The switch circuit switches a polarity of boosting in cumulating the charges in the charge storage elements. The boost circuit includes a circuit part that supplies charges to be sequentially cumulated in positive and negative directions in accordance with the AC input signal.

Abstract: A substrate for use in an ink jet recording head includes a plurality of heat generating resistive members formed on the substrate, a wiring pattern formed to be electrically connected with the heat generating resistive members, and a protection film formed on the heat generating resistive members and the wiring pattern to protect them from ink, and then, a vertically turn-up wiring structure is formed with an insulation film formed on the substrate, and one side of the wiring connected with the heat generating resistive members is arranged immediately below the heat generating resistive members in a width and a length larger than that of heat generating resistive members with the insulation film between them. For this substrate, the heat generating resistive members and the wiring positioned immediately below them are formed by polysilicon having impurities in different densities.

Abstract: Inkjet printhead chips comprise a substrate, a plurality of transducers, a plurality of interconnects and driver circuitry capable of electrically connecting the transducers and the interconnects. The substrate has a surface with opposing first and second edges, with a plurality of transducers arranged along the first edge and a plurality of interconnects arranged along the second edge. The driver circuitry is arranged on the substrate. The printhead chips can also be included in inkjet printhead chip assemblies wherein the printhead chip is arranged on a print surface of a body, and wherein the print surface is capable of being arranged generally parallel to a surface of a print-receiving medium. In this embodiment, an edgefeed is disposed between the first edge and the printhead body, and is in fluid communication with an ink reservoir.

Abstract: The current cutoff circuit is operated when the reset signal for achieving a standby state of the printing operation is active in H state, and cuts off constant current I0. Constant current is therefore cut off, thereby permitting accurate measurement of leak current of the heater power source VH by issuing a reset signal in H state when measuring leak current of the heater power source VH. In the standby state in which the printing operation is not performed, the reset signal becomes active, and operation of the current cutoff circuit cuts off constant current. The power consumption can therefore be reduced. Because the reset signal serves as a control signal for controlling the current cutoff circuit, it is not necessary to increase the number of terminals for connecting the element substrate and the wiring substrate.

Abstract: A printhead chip for an inkjet printhead includes a substrate. A plurality of nozzle arrangements is positioned on the substrate. Each nozzle arrangement includes a nozzle chamber structure that defines a nozzle chamber in which ink is received. An ink-ejecting member is operatively positioned with respect to the nozzle chamber so that displacement of the ink-ejecting member results in ejection of ink from the nozzle chamber. At least one actuator is positioned on the substrate. The, or each, actuator is displaceable with respect to the substrate on receipt of a driving signal. A motion transmitting structure is interposed between the actuator and the ink-ejecting member so that displacement of the actuator relative to the substrate is transmitted to the ink-ejecting member so that ink is ejected from the nozzle chamber.

Abstract: An ink jet recording head and an ink jet recording apparatus which can be manufactured at low cost and with a continuous length by using nonlinear elements having MIM-type electrical characteristics to drive heat generating members having a bubble jet recording system so as to prevent the nonlinear elements from being destroyed by a heat generation of the nonlinear elements.

Abstract: A driver transistor structure of an inkjet print head chip and the method for making the same. Having several body contacts distributed all over the source of an active region of a large area MOSFET (Metal Oxide Semiconductor Field Effect Transistor), an equivalent RB from the MOSFET channel to the body contact is greatly diminished as the distance between them is reduced, thereby preventing the occurrence of a secondary breakdown. Since the body contact is installed inside the active region without defining in advance a body contact region and making the body contact in the field oxide layer outside the active region, about 20% of the driver transistor structure can be saved to lower the average manufacturing cost of each chip.

Abstract: A dynamic memory based integrated circuit ink jet firing cell that includes a heater resistor, a drive transistor, and a dynamic memory circuit for storing firing data only for such heater resistor. Also disclosed is an integrated circuit firing array that includes a plurality of dynamic memory based firing cells divided into a plurality of fire groups of firing cells, each fire group having a plurality of subgroups; data lines for providing energizing data to the firing cells; control lines for providing control information to the firing cells wherein all firing cells within a subgroup are connected to a common subset of the control lines so as to be controlled to concurrently store energizing data; and a plurality fire lines for supplying energizing energy to the firing cells, wherein all firing cells of a fire group receive energizing energy from only one fire line.