For Internal Camera Components Patents (Class 348/374)
  • Patent number: 11419207
    Abstract: The present disclosure provides an embedding reinforced circuit board, a camera module, and an electronic device. The embedding reinforced circuit board, comprising a circuit board and a reinforcing plate. The circuit board comprises a first surface and a second surface opposite to the first surface. The first surface is provided with a component installation area. The second surface is provided with an accommodating groove. The width of at least one side of the cross-sectional area of the accommodating groove is wider than the width of the corresponding side of the component installation area. The cross-sectional area of the accommodating groove is parallel to the first surface or the second surface. The reinforcing plate is disposed in the accommodating groove.
    Type: Grant
    Filed: December 7, 2020
    Date of Patent: August 16, 2022
    Assignee: GUANGZHOU LUXVISIONS INNOVATION TECHNOLOGY LIMITED
    Inventors: Bo Chen, HaiChao Du
  • Patent number: 11418688
    Abstract: Embodiments provide a camera module including a lens unit, a first board formed with an electromagnetic circuit, a second board spaced apart from the first board, the second board including a terminal for external electrical connection and being formed with an electromagnetic circuit, a first support member having one side coupled to the first board and the other side coming into contact with one surface of the second board, so as to maintain a constant distance between the first board and the second board, and an electromagnetic-field shield configured to receive the first board and the second board therein, the electromagnetic-field shield serving to inhibit outward leakage of an electromagnetic-field formed in each board.
    Type: Grant
    Filed: September 8, 2020
    Date of Patent: August 16, 2022
    Assignee: LG INNOTEK CO., LTD.
    Inventor: Jun Suk Yang
  • Patent number: 11415774
    Abstract: An image capturing apparatus that is made compact in the size of an apparatus body, particularly the lateral size thereof, without impairing operability thereof. The image capturing apparatus includes connection terminals for connecting external devices thereto, an air inlet port via which air is drawn in for cooling heat sources of an apparatus body, and an air outlet port via which the air is discharged. A connection terminal arrangement surface and an air outlet port arrangement surface form different surfaces and are inclined at predetermined angles with respect to an optical axis, respectively. The connection terminal arrangement surface and the air outlet port arrangement surface are arranged to be displaced in a left-right direction, as viewed from the side of the image capturing apparatus, and are arranged to overlap each other, as viewed from the front of the image capturing apparatus.
    Type: Grant
    Filed: July 21, 2020
    Date of Patent: August 16, 2022
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Kazuo Yamamoto, Yasuhiro Kojima, Yuko Teruya
  • Patent number: 11412119
    Abstract: A camera device and a mobile terminal are provided by the present disclosure. The camera device includes a lens module, a light-guiding tube and a photosensitive sensor; the light-guiding tube is arranged at a periphery of a light-entering hole of the lens module; the light-guiding tube is connected to the photosensitive sensor; and the photosensitive sensor is connected to a circuit board of the lens module.
    Type: Grant
    Filed: May 11, 2018
    Date of Patent: August 9, 2022
    Assignee: VIVO MOBILE COMMUNICATION CO., LTD.
    Inventors: Ben Liu, Yong Huang
  • Patent number: 11405569
    Abstract: Provided is a solid-state imaging device that includes a first substrate that has one principal surface on which a pixel portion in which pixels are arranged is formed, a second substrate which is bonded to a surface of the first substrate opposed to the one principal surface and in which an opening is provided in a partial region in a surface opposed to a bonding surface to the first substrate is provided. The solid-state imaging device further includes at least one sub-chip inside the opening so as not to protrude from the opening and in which a circuit having a predetermined function is formed.
    Type: Grant
    Filed: June 21, 2018
    Date of Patent: August 2, 2022
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Hiroshi Takahashi, Ryoichi Nakamura, Hidenori Maeda
  • Patent number: 11405533
    Abstract: An image capturing apparatus includes a main frame and a lens module, a middle pillar, a module board, a first housing, and a second housing assembled to the main frame respectively. The main frame has a side wall, and the first housing covers the module board. The first housing, the module board, and the middle pillar are located on a same longitudinal axis of the main frame. The first housing and the module board are opposite to the middle pillar with the main frame interposed therebetween. The module board is located between the first housing and the main frame, and the lens module is located on a horizontal axis of the main frame. The first housing and the second housing encapsulate the main frame, and the side wall leans against the first housing and the second housing.
    Type: Grant
    Filed: July 28, 2020
    Date of Patent: August 2, 2022
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Chen-Hsien Cheng, Li-Fang Chen, Ruei-Hong Hong
  • Patent number: 11391909
    Abstract: A camera module includes a metal yoke, a holder, a plastic barrel, a plurality of plastic lens elements and a plurality of metal conducting elements. The holder is connected to the metal yoke for forming an inner space. The plastic barrel is movably disposed in the inner space and includes at least one buffering part. The plastic lens elements are disposed in the plastic barrel. The metal conducting elements are at least one leaf spring and a wire element, wherein the metal conducting elements are connected to the plastic barrel. Before the at least one buffering part contacts a contacting part of the at least one leaf spring, there is a gap distance between the at least one buffering part and the contacting part of the at least one leaf spring.
    Type: Grant
    Filed: May 31, 2019
    Date of Patent: July 19, 2022
    Assignee: LARGAN DIGITAL CO., LTD.
    Inventors: Te-Sheng Tseng, Ming-Ta Chou, Wen-Hung Hsu
  • Patent number: 11388320
    Abstract: A photosensitive component, and a camera module and a manufacturing method therefor. The photosensitive component comprises at least a photosensitive element, at least a window-form circuit board and at least a packaging body, wherein the photosensitive element and the window-form circuit board are integrally packaged through the packaging body. The window-form circuit board comprises a circuit board main body which comprises at least one window arranged thereon, wherein the photosensitive element is arranged within the window.
    Type: Grant
    Filed: June 2, 2017
    Date of Patent: July 12, 2022
    Assignee: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Mingzhu Wang, Zhenyu Chen, Zhongyu Luan, Zhen Huang, Nan Guo, Fengsheng Xi, Takehiko Tanaka, Bojie Zhao, Heng Jiang, Ye Wu, Zilong Deng
  • Patent number: 11378865
    Abstract: A digital camera includes an image shake corrector that moves an imaging element to perform image shake correction, a shutter mechanism that has, at a position adjacent to a light receiving surface of the imaging element of the image shake corrector, an opening through which a member blocking light incident on the light receiving surface passes, an exterior housing that supports the shutter mechanism, and a mount base that supports the image shake corrector, in which the mount base is supported by the exterior housing.
    Type: Grant
    Filed: January 26, 2021
    Date of Patent: July 5, 2022
    Assignee: FUJIFILM Corporation
    Inventors: Kouhei Awazu, Masaaki Takagi
  • Patent number: 11378772
    Abstract: The present embodiments relate to a dual camera module comprising: a first camera module including a first lens module and a first image sensor disposed below the first lens module; and a second camera module including a second lens module and a second image sensor disposed below the second lens module, wherein the second camera module has a wider angle of view than the first camera module, and the second image sensor is disposed at a position higher than the first image sensor.
    Type: Grant
    Filed: July 21, 2020
    Date of Patent: July 5, 2022
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Young Don O, Sang Yeon Han
  • Patent number: 11363172
    Abstract: Exemplary cameras may include a housing. The housing may include a forward section defining a forward internal compartment. The housing may include a rear section defining a rear internal compartment. The rear section may include a heat dissipation element. The forward section and the rear section may be separated by an air gap that extends through an entire thickness of the housing. The housing may include a communications conduit coupling the forward internal compartment with the rear internal compartment. The cameras may include an imaging sensor disposed within the forward internal compartment. The cameras may include a processing unit disposed within the rear internal compartment and communicatively coupled with the imaging sensor.
    Type: Grant
    Filed: December 22, 2020
    Date of Patent: June 14, 2022
    Assignee: Applied Materials, Inc.
    Inventor: Itai Leshniak
  • Patent number: 11363178
    Abstract: One embodiment of a camera module includes: a lens barrel provided with at least one lens; and a lens holder having the lens barrel coupled thereto, wherein the lens barrel may have a first adhesive part formed thereon having the bottom surface thereof facing the top surface of the lens holder and adhered to the lens holder, the lens holder may have a second adhesive part formed thereon having the top surface thereof facing the bottom surface of the lens barrel and adhered to the lens barrel, and a first recessed groove having at least a portion of an adhesive deposited therein may be formed in the second adhesive part.
    Type: Grant
    Filed: May 24, 2021
    Date of Patent: June 14, 2022
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Myoung Jin An, Chul Ho Lee, Jong Cheol Choi, Sun Min Hwang
  • Patent number: 11362123
    Abstract: The present technology relates to an imaging device, a camera module, and an electronic apparatus that make it possible to reduce a profile of the camera module and to enhance sensitivity. The imaging device includes: a semiconductor substrate in which a light receiving section is formed that includes a plurality of pixels performing photoelectric conversion; and a reinforcing member that is disposed on side of the light receiving section of the semiconductor substrate and includes an opening in which a part opposed to the light receiving section is opened. The present technology is applicable to, for example, an imaging device that captures an image, a camera module that focuses light to capture an image, an electronic apparatus equipped with a camera function, a vehicle control system that is mounted on a vehicle, an endoscopic surgery system that is used in an endoscopic surgery, and the like.
    Type: Grant
    Filed: August 8, 2018
    Date of Patent: June 14, 2022
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventor: Tomoharu Ogita
  • Patent number: 11342527
    Abstract: For a purpose of simplifying a structure of a light-emitting element while maintaining luminous efficiency of the light-emitting element, the present invention provides a light-emitting element including: a cathode electrode; an anode electrode; a light-emitting layer between the cathode electrode and the anode electrode; an electron transport layer between the light-emitting layer and the cathode electrode; and a hole transport layer between the light-emitting layer and the anode electrode. The light-emitting element further includes a plurality of subpixels for each light emission wavelength of the light-emitting layer, the light-emitting layer and the electron transport layer for each of the plurality of subpixels, and the hole transport layer common to at least the plurality of subpixels.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: May 24, 2022
    Assignee: SHARP KABUSHIKI KAISHA
    Inventors: Yusuke Sakakibara, Kenji Kimoto, Tatsuya Ryohwa
  • Patent number: 11320611
    Abstract: The present disclosure generally relates to printed circuit boards or printed circuit board assemblies for fiber optic communications. In one non-limiting embodiment, a method of assembling an optoelectronic assembly includes providing a printed circuit board with a first metal coating and an optical component with a second metal coating. The method further includes positioning the optical component relative to the printed circuit board with at least some portion of the first metal coating aligned with or adjacent to at least some portion of the second metal coating, and applying solder between the first metal coating and the second metal coating to couple the optical component and the printed circuit board.
    Type: Grant
    Filed: April 27, 2020
    Date of Patent: May 3, 2022
    Assignee: II-VI DELAWARE, INC.
    Inventors: Qing Qian, Wei Li, Hui Juan Yan, Hui Yang, Wei Peng Nian, Ting Shi
  • Patent number: 11323595
    Abstract: A chip assembly and a mold assembly for fabricating the same, a camera and an electronic device are disclosed. The chip assembly includes a circuit board, a chip and a conductive wire. The chip is provided to the circuit board, and the chip and the circuit board are in a stacked arrangement. One end of the conductive wire is electrically coupled to the circuit board, the other end of the conductive wire is electrically coupled to the chip, and a partial segment of the conductive wire is attached to a side wall face of the chip.
    Type: Grant
    Filed: November 19, 2018
    Date of Patent: May 3, 2022
    Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
    Inventor: Jianglong Gong
  • Patent number: 11314034
    Abstract: An imaging apparatus includes: a wiring board; an imaging unit that includes a lens module and an imaging element mounted on the wiring board; a housing that assumes a frame shape and includes an opening in the direction of an optical axis of the imaging unit; a top cover placed over the housing; a light source that emits light to travel to the outside through the top cover; and a light guide body that surrounds the lens module and guides the light emitted from the light source, wherein the imaging unit is spaced apart from the top cover by a space, the housing includes a bulging section bulging toward the lens module without being in contact the wiring board, and the bulging section receives a load applied from the top cover via at least the light guide body.
    Type: Grant
    Filed: July 9, 2020
    Date of Patent: April 26, 2022
    Assignee: FUJITSU FRONTECH LIMITED
    Inventor: Akinori Tsujikawa
  • Patent number: 11315915
    Abstract: The disclosure relates to a display device, which includes a cover plate, a backlight unit, a display module disposed between the backlight unit and the cover plate, the display module including a first substrate close to the light exiting side of the backlight unit and a second substrate close to the cover plate, and a camera module arranged on the first substrate, the camera module including an infrared cut-off filter, wherein the first substrate extends horizontally beyond the second substrate and the backlight unit to form a mounting section for the camera module, and the infrared cut-off filter is arranged in the mounting section.
    Type: Grant
    Filed: April 30, 2019
    Date of Patent: April 26, 2022
    Assignees: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Zhonghua Li, Shipeng Wang, Jian Sang, Shaofei Guo, Dongjia Hao, Chunying Qiao
  • Patent number: 11317027
    Abstract: An imaging unit includes: an imaging sensor module having a printed wiring board on which an imaging element is provided; a flexible printed circuit board connected to a connecting portion of the printed wiring board; an elastic member provided on a face having the connecting portion of the printed wiring board; and an image stabilization unit having a fixing portion that fixes the flexible printed circuit board, the imaging sensor module is movable with respect to the image stabilization unit, and the elastic member holds the flexible printed circuit board.
    Type: Grant
    Filed: May 14, 2020
    Date of Patent: April 26, 2022
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Koji Noguchi, Yuya Okada, Mitsutoshi Hasegawa
  • Patent number: 11303789
    Abstract: A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module comprises two or more camera lenses and a circuit unit. The circuit unit comprises a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.
    Type: Grant
    Filed: June 22, 2020
    Date of Patent: April 12, 2022
    Assignee: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Feifan Chen, Qimin Mei, Liang Ding, Heng Jiang
  • Patent number: 11287668
    Abstract: A dual-aperture zoom camera comprising a Wide camera with a respective Wide lens and a Tele camera with a respective Tele lens, the Wide and Tele cameras mounted directly on a single printed circuit board, wherein the Wide and Tele lenses have respective effective focal lengths EFLW and EFLT and respective total track lengths TTLW and TTLT and wherein TTLW/EFLW>1.1 and TTLT/EFLT<1.0. Optionally, the dual-aperture zoom camera may further comprise an optical OIS controller configured to provide a compensation lens movement according to a user-defined zoom factor (ZF) and a camera tilt (CT) through LMV=CT*EFLZF, where EFLZF is a zoom-factor dependent effective focal length.
    Type: Grant
    Filed: March 7, 2020
    Date of Patent: March 29, 2022
    Assignee: Corephotonics Ltd.
    Inventors: Gal Shabtay, Ephraim Goldenberg
  • Patent number: 11289519
    Abstract: The present technology relates to a semiconductor device capable of providing a heat-stable optical system, and an electronic apparatus. A semiconductor device is provided, and the semiconductor device includes a sensor and a holding substrate that holds the sensor. In the semiconductor device, (EI×tI)+(ES×tS)>30 and 1.5<CTEI<4.5 are satisfied, where ES (GPa) represents a Young's modulus of the sensor, tS (mm) represents a thickness of the sensor, CTEI (ppm/K) represents a linear expansion coefficient of the holding substrate, EI (GPa) represents a Young's modulus of the holding substrate, and tI (mm) represents a thickness of the holding substrate. The present technology can be applied to a semiconductor package housing an image sensor, for example.
    Type: Grant
    Filed: January 17, 2018
    Date of Patent: March 29, 2022
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventor: Susumu Hogyoku
  • Patent number: 11285921
    Abstract: A device for protecting an optical sensor of a driver assistance system for a motor vehicle includes a protective casing, a motor, and a pressure balancing system. The protective device has a movable part and a fixed part. The protective casing forms a cavity that accommodates an optical sensor that includes an optical surface. Additionally, the protective casing freely rotates about an axis and includes an optical element that faces the optical surface of the optical sensor. The motor rotates the protective casing at speeds allowing the optical element to be cleaned by a centrifugal effect. The pressure balancing system includes an air vent orifice allowing fluid communication between the inside and the outside of the protective device. The air vent orifice is produced in the fixed part of the protective device.
    Type: Grant
    Filed: September 27, 2019
    Date of Patent: March 29, 2022
    Assignee: Valeo Systèmes d'Essuyage
    Inventors: Marcel Trebouet, Frédéric Bretagnol
  • Patent number: 11267408
    Abstract: A vehicular camera assembly includes a front housing portion accommodating a lens, a circuit board having a connecting element, and an electrical connector. The rear housing portion includes a rear attachment portion that has an aperture therethrough. The electrical connector electrically connects a wire harness of the vehicle to the connecting element of the circuit board. The electrical connector includes an electrically conductive element that is electrically conductively connected to a coaxial or shielded wire connecting element of the electrical connector. The rear housing portion includes an electrically conductive element that protrudes through the aperture. As the electrical connector is attached at the rear attachment portion, the electrically conductive element of the rear housing portion engages the electrically conductive element of the electrical connector to establish and maintain electrically conductive connection between the electrically conductive elements.
    Type: Grant
    Filed: February 22, 2021
    Date of Patent: March 8, 2022
    Assignee: MAGNA ELECTRONICS INC.
    Inventors: Steven V. Byrne, Jonathan D. Conger, Nazar F. Bally
  • Patent number: 11272088
    Abstract: The present disclosure provides a camera module and a mobile terminal. The camera module includes: a first camera, a second camera, an optical image stabilization (OIS) chip and a bracket. The first camera and the second camera are embedded in the bracket. A height from a top surface of a lens of the first camera to a bottom surface of the first camera is greater than a height from a top surface of a lens of the second camera to a bottom surface of the second camera. One end of the first camera away from the lens is provided with a first printed circuit board, and the first printed circuit board extends to an outside of the first camera and faces the second camera. The OIS chip is disposed on the first printed circuit board and faces the bottom surface of the second camera; the OIS chip is electrically connected to the first printed circuit board.
    Type: Grant
    Filed: March 14, 2019
    Date of Patent: March 8, 2022
    Assignee: VIVO MOBILE COMMUNICATION CO., LTD.
    Inventors: Jian Ding, Junke Gao, Lijun Zhu, Kongkong Shang, Bijun Chen, Hongzhi Yao
  • Patent number: 11256060
    Abstract: A lens module relieved against the build-up of working heat and any condensation by allowing the release of same comprises a circuit board, a support base, and an optical filter. The support base is fixed on a first surface of the circuit board. The support base defines a through hole configured to receive the optical filter. The support base further defines at least one gas pressure relieving structure. The optical filter and the circuit board seal opposite sides of the support base to form a receiving space. The gas pressure relieving structure allows communication between the receiving space and the exterior such that heat generated in the receiving space is transported out. The lens module is dustproof, waterproof, and can breathe. An electronic device including the lens module is also disclosed.
    Type: Grant
    Filed: July 8, 2019
    Date of Patent: February 22, 2022
    Assignee: TRIPLE WIN TECHNOLOGY (SHENZHEN) CO. LTD.
    Inventors: Long-Fei Zhang, Shin-Wen Chen, Yu-Shuai Li, Kun Li
  • Patent number: 11246483
    Abstract: The present invention relates to an apparatus including a base, a hollow receiving element joined to the base, and at least one positioning attachment that positions an imaging device received by the hollow receiving element to capture an image of at least one eye of a user. The present invention also relates to a method of capturing at least one image of at least one eye of a user using the above described apparatus.
    Type: Grant
    Filed: December 11, 2017
    Date of Patent: February 15, 2022
    Assignee: Ora, Inc.
    Inventors: Richard Abelson, Mark B. Abelson, Endri Angjeli, Keith Lane
  • Patent number: 11245821
    Abstract: An image pickup apparatus which is capable of efficiently dispersing heat from a circuit board. A heating element is mounted on the circuit board. A heat transfer member made of a material with higher thermal conductivity than that of a chassis is disposed between the circuit board and the chassis in a direction of an optical axis. First connecting units support the circuit board and the heat transfer member in a stacked manner at a plurality of positions including two positions different from each other in a horizontal direction. A second connecting unit supports the heat transfer member. A third connecting unit supports an exterior member of the image pickup apparatus. Both the second connecting unit and the third connecting unit are provided between the two positions of the first connecting units in the horizontal direction.
    Type: Grant
    Filed: April 13, 2021
    Date of Patent: February 8, 2022
    Assignee: Canon Kabushiki Kaisha
    Inventors: Hideki Kawashima, Keiji Honda
  • Patent number: 11240411
    Abstract: A camera for a vehicular vision system includes a camera housing having a front camera housing portion and a rear camera housing portion. An imager is disposed at a first side of a printed circuit board. A lens assembly is supported at the front camera housing portion and optically aligned with the imager. At least one attachment element is disposed at the front or rear camera housing portion and has a material having a low CTE that is less than a CTE of the front camera housing portion. The low CTE of the material of the attachment element is less than 10 ppm/° C. The printed circuit board is mounted at the attachment element. The attachment element functions to accommodate temperature-induced movement of the printed circuit board relative to the at least one lens.
    Type: Grant
    Filed: June 25, 2020
    Date of Patent: February 1, 2022
    Assignee: MAGNA ELECTRONICS INC.
    Inventors: Steven V. Byrne, Rene Dreiocker, Stefan Sauer, Yuesheng Lu
  • Patent number: 11231022
    Abstract: Broadly speaking, embodiments of the present techniques provide mechanisms for electrically connecting shape memory alloy (SMA) actuator wires of an actuation device to a power or current source via at least one connection element.
    Type: Grant
    Filed: May 17, 2018
    Date of Patent: January 25, 2022
    Assignee: CAMBRIDGE MECHATRONICS LIMITED
    Inventors: James Howarth, Andrew Benjamin Simpson Brown, Stephen Matthew Bunting, Robert Langhorne, Martin McBrien
  • Patent number: 11223794
    Abstract: A wearable camera includes a capturing unit configured to capture video data, a memory configured to store the video data captured by the capturing unit, a plurality of sound collectors that are arranged at different positions of a casing and that are configured to collect a sound and output signals, and a controller that is configured to determine a direction from which the sound is emitted based on a deviation of output timings of the signals and add the direction as attribute information to the video data.
    Type: Grant
    Filed: February 10, 2020
    Date of Patent: January 11, 2022
    Assignee: Panasonic I-PRO Sensing Solutions Co., Ltd.
    Inventor: Takayuki Haraguchi
  • Patent number: 11211419
    Abstract: Various embodiments of the present application are directed towards image sensors including composite backside illuminated (CBSI) structures to enhance performance. In some embodiments, a first trench isolation structure extends into a backside of a substrate to a first depth and comprises a pair of first trench isolation segments. A photodetector is in the substrate, between and bordering the first trench isolation segments. A second trench isolation structure is between the first trench isolation segments and extends into the backside of the substrate to a second depth less than the first depth. The second trench isolation structure comprises a pair of second trench isolation segments. An absorption enhancement structure overlies the photodetector, between the second trench isolation segments, and is recessed into the backside of the semiconductor substrate. The absorption enhancement structure and the second trench isolation structure collectively define a CBSI structure.
    Type: Grant
    Filed: July 25, 2019
    Date of Patent: December 28, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei Chuang Wu, Dun-Nian Yaung, Feng-Chi Hung, Jen-Cheng Liu, Jhy-Jyi Sze, Keng-Yu Chou, Yen-Ting Chiang, Ming-Hsien Yang, Chun-Yuan Chen
  • Patent number: 11199758
    Abstract: A vehicular camera includes a lens barrel, a lens holder and an imager PCB. The lens barrel accommodates a lens and has a threaded inner end. The lens holder has a threaded passageway for threadedly receiving the threaded inner end of the lens barrel. The lens barrel is threadedly attached to the lens holder with a biasing element applying a biasing force at the lens barrel to urge the lens barrel in a direction outward away from the lens holder. The imager PCB is attached to the lens holder with an imager of the imager PCB facing the lens, and the imager PCB is adjusted relative to the lens holder and lens barrel construction to optically align the lens at the imager. After the imager PCB is secured relative to the lens holder, the lens barrel is rotated to adjust focus of the lens at the imager.
    Type: Grant
    Filed: August 4, 2020
    Date of Patent: December 14, 2021
    Assignee: MAGNA ELECTRONICS INC.
    Inventors: Matthew C. Sesti, Robert A. Devota, Donald W. Mersino
  • Patent number: 11194118
    Abstract: The present disclosure relates to the field of optical lenses and discloses a lens module. The lens module includes a lens barrel, a first lens disposed on an object side of the lens barrel, and a fixing member pressing the first lens on the lens barrel from an object side of the first lens. The fixing member includes a top wall pressing the first lens, and a side wall extending from an outer edge of the top wall towards an image side and fixedly connected to an outer edge of the lens barrel. The top wall and the side wall define a receiving space. The receiving space receives a part of the first lens. The fixing member is provided with notches penetrating the top wall and communicating with the receiving space. The notches are filled with glue. The glue adheres and fixes the lens barrel to the fixing member.
    Type: Grant
    Filed: August 1, 2019
    Date of Patent: December 7, 2021
    Assignee: AAC Optics Solution Pte. Ltd.
    Inventor: Chuandong Wei
  • Patent number: 11190671
    Abstract: An imaging apparatus includes a casing having an inlet port and an exhaust port, at least one heat source that is disposed in the casing and includes at least an image sensor, a fan that is disposed in the casing, takes in outside air through an inlet port, and blows out the taken-in outside air toward the exhaust port, and a display panel unit that includes a display panel and is rotatably provided on a rear surface of the casing. The inlet port includes first and second inlet ports that open in different directions. When viewed in a facing direction between the display panel unit in a housed state and the casing, the entire second inlet port is provided in a portion of the casing covered by the display panel unit in the housed state.
    Type: Grant
    Filed: January 9, 2020
    Date of Patent: November 30, 2021
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Rintaro Wada, Yuji Tominaga
  • Patent number: 11180037
    Abstract: A rotatable LIDAR device including contactless electrical couplings is disclosed. An example rotatable LIDAR device includes a vehicle electrical coupling including (i) a first conductive ring, (ii) a second conductive ring, and (iii) a first coil. The example rotatable LIDAR device further includes a LIDAR electrical coupling including (i) a third conductive ring, (ii) a fourth conductive ring, and (iii) a second coil. The example rotatable LIDAR device still further includes a rotatable LIDAR electrically coupled to the LIDAR electrical coupling. The first conductive ring and the third conductive ring form a first capacitor configured to transmit communications to the rotatable LIDAR, the second conductive ring and the fourth conductive ring form a second capacitor configured to transmit communications from the rotatable LIDAR, and the first coil and the second coil form a transformer configured to provide power to the rotatable LIDAR.
    Type: Grant
    Filed: October 21, 2019
    Date of Patent: November 23, 2021
    Assignee: Waymo LLC
    Inventors: Samuel William Lenius, Pierre-yves Droz
  • Patent number: 11172110
    Abstract: According to some embodiments, a portable electronic device is described. The portable electronic device includes a housing member defining an external sidewall, a first glass cover and a second glass cover, where the second glass cover includes a first region having a first exterior surface, a second region having a second exterior surface vertically displaced from the first exterior surface, where the second region includes a first opening, a second opening, and a third opening, and a transition region having an exterior surface that extends between the first exterior surface to the second exterior surface. The portable electronic device further includes a first camera module disposed within the first opening, a second camera module disposed within the second opening, a strobe module disposed within the third opening, and a trim structure having an edge that overlays the second region of the second glass cover.
    Type: Grant
    Filed: September 27, 2019
    Date of Patent: November 9, 2021
    Assignee: APPLE INC.
    Inventors: Jody R. Akana, Molly Anderson, Bartley K. Andre, Shota Aoyagi, Anthony Michael Ashcroft, Marine C. Bataille, Jeremy Bataillou, Markus Diebel, M. Evans Hankey, Julian Hoenig, Richard P. Howarth, Jonathan P. Ive, Julian Jaede, Duncan Robert Kerr, Peter Russell-Clarke, Benjamin Andrew Shaffer, Mikael Silvanto, Sung Ho Tan, Clement Tissandier, Eugene Antony Whang, Rico Zörkendörfer
  • Patent number: 11161291
    Abstract: A molded circuit board (10) of a camera module (100), manufacturing equipment (200) and a manufacturing method for the molded circuit board. The manufacturing equipment (200) comprises a forming mold (210), which comprises a first mold (211) and a second mold (212) that can be opened or closed, where the first mold (211) and the second mold (212) form a forming cavity (213) when closed. Also, a light window forming block (214) and a base forming guide groove (215) located at the periphery of the light window forming block (214) are provided within the forming cavity (213).
    Type: Grant
    Filed: June 6, 2017
    Date of Patent: November 2, 2021
    Assignee: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Zhen Huang
  • Patent number: 11165936
    Abstract: An embodiment comprises a lens driving part including a lens, a connection substrate connected to the lens driving part, and a connector part connected to the connection substrate. The connector part comprises a substrate including, on the upper surface thereof, a cavity and a ground layer, a noise shield part located within the cavity of the substrate and contacting the ground layer, and a reinforcement member located on the noise shield part. The reinforcement member is located in the cavity of the substrate and on the upper surface of the substrate. In a top view, the length of one side of the noise shield part is less than the length of one side of the cavity of the substrate.
    Type: Grant
    Filed: June 26, 2019
    Date of Patent: November 2, 2021
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Jong Ha Park, Won Seob Shin
  • Patent number: 11165940
    Abstract: An image capturing module includes a long circuit board, a lens base, and two light-shielding adhesive layers. The long circuit board includes a surface having an assembly area. The assembly area has two opposite long sides and two opposite short sides. The assembly area is provided with a light sensor. The two long sides are separated by a specific width. The lens base includes a substrate and two side plates. The two side plates are connected to opposite sides of the substrate and are respectively fixed on the two short sides of the assembly area. A specific spacing is maintained between the substrate and the assembly area to form two notches between the two long sides and the substrate. The width of the substrate and each of the side plates is less than or equal to the specific width. The two light-shielding adhesive layers respectively close the two notches.
    Type: Grant
    Filed: November 15, 2019
    Date of Patent: November 2, 2021
    Assignee: CHICONY ELECTRONICS CO., LTD.
    Inventors: Chien-Chung Ou, Cheng-Hun Yang
  • Patent number: 11146711
    Abstract: An image capture device includes a first component that is configured to provide thermal energy. A heatsink is spaced a distance apart from the first component, and a second component is positioned between the first component and the heatsink. A conductor contacts the first component and the heatsink, and the conductor extends from the first component along sides of the second component to the heatsink.
    Type: Grant
    Filed: April 10, 2020
    Date of Patent: October 12, 2021
    Assignee: GoPro, Inc.
    Inventors: Kielan C. Crow, Nicholas Vitale, Eduardo Hernandez Pacheco
  • Patent number: 11137529
    Abstract: One embodiment of a camera module comprises: a lens part; a front body on which the lens part is mounted; a substrate part which is disposed apart from the lens part in a first direction and coupled to the front body; an image sensor which is disposed on the substrate part and disposed opposite to the lens part; and a first adhesive part which is disposed between the front body and the substrate part, wherein the front body and the substrate part are coupled by the first adhesive part, and at least one through-hole is formed between the front body and the substrate part.
    Type: Grant
    Filed: July 7, 2017
    Date of Patent: October 5, 2021
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Ji Hwan Park, Myoung Jin An, Dong Wook Park
  • Patent number: 11137606
    Abstract: There are provided an image element configured to emit imaging light, a case member configured to house the image element, and a light shielding plate that is attached to a positioning portion provided on the case member and that defines an emission region for imaging light from the image element, thereby attaching the light shielding plate to the case member with high accuracy.
    Type: Grant
    Filed: March 24, 2020
    Date of Patent: October 5, 2021
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Masayuki Takagi, Yoshitaka Hama, Takuya Ikeda
  • Patent number: 11125920
    Abstract: An optical system is provided, including a first optical member driving mechanism, a second optical member driving mechanism, and a first fixing component. The first optical member driving mechanism includes a first fixed portion, a first movable portion, a plurality of elastic members, and a first driving module. Each of the elastic members is elastically connected to the first fixed portion and the first movable portion. The second optical member driving mechanism includes a second fixed portion, a second movable portion, and a second driving module. The second movable portion is movably connected to the second fixed portion. The second driving module can drive the second movable portion to rotate relative to the second fixed portion. The first fixing component affixes the first optical member driving mechanism to the second optical member driving mechanism.
    Type: Grant
    Filed: January 25, 2019
    Date of Patent: September 21, 2021
    Assignee: TDK TAIWAN CORP.
    Inventors: Chen-Hsien Fan, Chao-Chang Hu, Sung-Mao Tsai, Liang-Ting Ho, Chih-Wei Weng, Shiang-Ming Yu, Kuen-Wang Tsai, Sin-Jhong Song
  • Patent number: 11122190
    Abstract: An image pickup apparatus which makes the load applied to a movable unit when it is displaced nearly uniform. The movable unit controlled by a control unit is capable of being in at least a predetermined direction. A first flexible board has a first connecting portion connected to the movable unit, a first wiring portion extended from the first connecting portion in a first direction different from a direction of an optical axis, and a second connecting portion placed at an end of the first wiring portion and connected to the control unit. A second flexible board has a third connecting portion connected to the movable unit, a second wiring portion extended from the third connecting portion in a second direction different from the direction of the optical axis, and a fourth connecting portion placed at an end of the second wiring portion and connected to the control unit.
    Type: Grant
    Filed: October 10, 2019
    Date of Patent: September 14, 2021
    Assignee: CANON KABUSHIKI KAISHA
    Inventor: Daisuke Toda
  • Patent number: 11114573
    Abstract: An optoelectronic module assembly includes an optoelectronic module. The module includes: an active optoelectronic component in or on a mounting substrate, an optical sub-assembly, and a spacer disposed between the mounting substrate and the optical sub-assembly so as to establish a particular distance between the active optoelectronic component and the optical sub-assembly. The optoelectronic module assembly also includes a recessed substrate including first and second surfaces, wherein the second surface is in a plane closer to the optical sub-assembly than is the first surface. The optoelectronic module is mounted on the first surface. The second surface is for mounting other components.
    Type: Grant
    Filed: December 18, 2019
    Date of Patent: September 7, 2021
    Assignee: ams Sensors Singapore Pte. Ltd.
    Inventors: Martin Lukas Balimann, Matthias Gloor, Philippe Bouchilloux, Jukka Alasirnio, Hartmut Rudmann, Nicola Spring
  • Patent number: 11106115
    Abstract: There is provided a camera apparatus, including: a transparent member that transmits light; a camera, at which a lens is provided, the camera performing imaging via the transparent member and the lens; a closing body that closes off a space between the transparent member and the lens; and a vent hole that vents the space.
    Type: Grant
    Filed: October 15, 2019
    Date of Patent: August 31, 2021
    Assignee: KABUSHIKI KAISHA TOKAI-RIKA-DENKI-SEISAKUSHO
    Inventors: Kenichi Mizutani, Masakazu Iwatsuki
  • Patent number: 11099348
    Abstract: An optical lens assembly includes a lens unit and a holder. The lens unit includes at least a front lens and a rear lens, and the holder includes a positioning portion and a holding portion extended downwardly the positioning portion. The positioning portion and the holding portion are integrated with each other. The holding portion forms a light chamber for holding the lens unit therein, wherein the light chamber allows imaging lights to enter thereinto and pass through the lens unit. The positioning portion is sealed on the outer surface of the front lens along the outer periphery of the front lens.
    Type: Grant
    Filed: September 3, 2019
    Date of Patent: August 24, 2021
    Assignee: Ningbo Sunny Automotive Optech Co., Ltd.
    Inventors: Jia Yang, Heteng Zhang
  • Patent number: 11086272
    Abstract: An illumination unit emits illumination light to a specimen. An image sensor includes multiple pixels arranged in a two-dimensional manner on a photoelectric surface. The image sensor captures an image of a magnitude distribution of an interference pattern formed due to the illumination light that has interacted with the specimen. A limiter limits at least one from among the spatial frequency of the interference pattern formed on the photoelectric surface and the incident angle of the light input to the photoelectric surface.
    Type: Grant
    Filed: November 19, 2018
    Date of Patent: August 10, 2021
    Assignee: OLYMPUS CORPORATION
    Inventor: Satoshi Watanabe
  • Patent number: 11076076
    Abstract: The present disclosure relates to the field of lens technologies and provides a lens module. The lens module includes: a lens assembly including a lens barrel and a set of lenses received in the lens barrel; and an illumination assembly fixed to the lens assembly, the illumination assembly including an illumination holder surrounding and fixed to the lens barrel and an illumination window arranged on the illumination holder. The illumination window has an annular shape and surrounds the lens assembly. The present disclosure can solve a problem in the related art that the camera and the illumination assembly are separate components, which would otherwise occupy a space.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: July 27, 2021
    Assignee: AAC Optics Solutions Pte. Ltd.
    Inventor: Jarno Matikainen