Abstract: There is provided a solid state image capturing apparatus including an image capturing element for photoelectric converting an incident light; a light shielding filter for shielding a part of the incident light; and a metal plate partly having an opening for fixing the light shielding filter at a position for blocking the opening, an end of the opening of the metal plate being etched and antireflection treated. Also, a camera module and an electronic device are provided.

Abstract: An optical sensor package module and a manufacturing method thereof are provided. The optical sensor package module includes a substrate, a sensor chip and a shielding assembly. The sensor chip is disposed on the substrate and includes an array of pixels located at a top side thereof for receiving light. The shielding assembly surrounds the sensor chip for limiting influx of light onto the sensor chip, and the shielding assembly has a first aperture to expose at least a first subset of the pixels that is configured to receive corresponding light.

Abstract: An imaging unit includes: an optical system; a semiconductor package including an image sensor, and a connection electrode formed on a back surface; a cable; an electronic component; and a multi-layer substrate having a rectangular plate shape and including: a first electrode and a second electrode arranged side-by-side with each other on a front surface, the semiconductor package being mounted on the first electrode, and the cable being connected to the second electrode; and a third electrode on a back surface, the electronic component being mounted on the third electrode. The multi-layer substrate includes walls on at least two opposing sides of the back surface, and the semiconductor package is disposed such that a light receiving surface of the image sensor is arranged horizontally with respect to the multi-layer substrate.

Abstract: An electronic device includes a display screen, a transparent cover plate, and a sensing unit. The transparent cover plate has a first region and a second region. The first region corresponds to the display screen. The second region includes a non-through hole provided at an inner surface of the transparent cover plate. The sensing unit is arranged in the non-through hole.

Abstract: A portable information handling system display has an OLED film disposed over front and rear faces of a substrate, such as a carbon fiber material. A protective cover is disposed over the OLED film with a folded portion along an end of the substrate, the protective cover hardened at the front and rear faces and left unhardened along the folded portion. In one example embodiment, a transparent bezel is placed over the folded portion with the OLED film presenting system information through the bezel, such as battery state, etc.

Abstract: A camera module includes a lens barrel holder and a substrate. The substrate may include a circuit board embedded in the substrate. The circuit board may include multiple electrical components mounted to a first side of the circuit board, where the electrical components are not exposed outside. The circuit board may also include multiple electrical connections on another side of the circuit board, an image sensor mounted to the electrical connections, and an upper opening in the circuit board for light to pass through. The substrate may include an upper opening configured to receive, at least partially inside the substrate, a lower portion of the lens barrel holder. The substrate may include a lower opening connected to the upper opening and configured to receive the image sensor. The lens barrel holder may include extensions, such as a flange or tabs, and an adhesive bond between the extensions and the substrate.

Abstract: A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module comprises two or more camera lenses and a circuit unit. The circuit unit comprises a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.

Abstract: The image sensing device includes a pixel region in a pixel array area and a dummy pixel region in a periphery area. The pixel region includes a radiation region, a floating diffusion region, a transfer transistor, a source-follower transistor, a reset transistor and a select transistor. The dummy pixel region includes a radiation region and a floating diffusion region. A gate of one of the transfer transistor, the reset transistor and the select transistor in the pixel region is electrically connected to the radiation region or the floating diffusion region in the dummy pixel region.

Abstract: An imaging apparatus that forms an image of a light beam transmitted through an imaging lens on an imaging element includes a laminated material that is provided on the imaging element, the light beam being transmitted through the laminated material, the laminated material being provided at a position at which an end portion of an upper surface of the laminated material allows an outermost light beam out of light beams to be transmitted therethrough, the light beams entering a pixel in an outer end portion of the imaging element in an effective pixel area, the position having a width Hopt.

Abstract: An electronic device includes: a camera module, a camera window formed to cover the camera module and installed in a first opening, a bracket receiving the camera window and the camera module and adhered to a rear cover by a third waterproof member, a fourth waterproof member adhering the window cover and the bracket, a second opening formed in the bracket and connected to the inside of the middle frame, and a filter member disposed in the second opening and blocking movement of water and forming a movement path of air, wherein a gap is formed between an edge of the rear cover forming the first opening and an edge of the camera window and a movement region is formed by a space between the rear cover and the bracket and connected to the second opening, such that air and water are introduced.

Abstract: An imaging optical lens assembly includes, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element and a sixth lens element. The first lens element with positive refractive power has a convex object-side surface. The second lens element has negative refractive power. The third lens element with refractive power has both an object-side surface and an image-side surface being aspheric. The fourth lens element with refractive power has both an object-side surface and an image-side surface being aspheric. The fifth lens element with refractive power has both an object-side surface and an image-side surface being aspheric. The sixth lens element with refractive power has both an object-side surface and an image-side surface being aspheric.

Abstract: Various techniques are disclosed for providing an infrared imaging module that exhibits a small form factor and may be used with one or more portable devices. Such an infrared imaging module may be implemented with a housing that includes electrical connections that may be used to electrically connect various components of the infrared imaging module. In addition, various techniques are disclosed for providing system architectures for processing modules of infrared imaging modules. In one example, a processing module of an infrared imaging module includes a first interface adapted to receive captured infrared images from an infrared image sensor of the infrared imaging module. The processing module may also include a processor adapted to perform digital infrared image processing on the captured infrared images to provide processed infrared images. The processing module may also include a second interface adapted to pass the processed infrared images to a host device.

Abstract: An imaging lens includes a first lens group and a second lens group, arranged in this order from an object side to an image plane side. The first lens group includes a positive first lens, a positive second lens, and a negative third lens. The second lens group includes a fourth lens, a fifth lens, and a sixth lens. The first lens is formed in a shape so that surfaces thereof on the object and image plane sides have positive curvature radii. The fifth lens is formed in a shape so that a surface thereof on the object side has a positive curvature radius. The sixth lens is formed in a shape so that a surface thereof on the object side and a surface thereof on the image plane side are aspheric. The first to third lenses are arranged specifically and have specific Abbe's numbers.

Abstract: A heater system for resisting fog and ice buildup on advanced driver assistance cameras provides a chamber covering the camera lens and providing a transparent window through which the camera lens may be directed. A heating element communicates with an air gap between the lens and the transparent window and the periphery of the transparent window to provide heating of the transparent window without blocking an image received by the camera lens.

Abstract: An information processing apparatus includes: an input unit that inputs an image of real space captured by an image capturing apparatus; a measurement value input unit that inputs a measurement value regarding a position and orientation of the image capturing apparatus measured by a sensor attached to the image capturing apparatus; a position and orientation derivation unit that, based on three-dimensional information of a feature in the real space and the input image, derives a position and orientation of the image capturing apparatus; a determination unit that, based on the measurement value and the position and orientation of the image capturing apparatus derived by the position and orientation derivation unit, makes a determination as to whether derivation of the position and orientation of the image capturing apparatus performed by the position and orientation derivation unit has failed; and an output unit that outputs a result provided by the determination unit.

Abstract: An imaging device capable of obtaining high-quality imaging data is provided. The imaging device includes a photoelectric conversion element, a first transistor, a second transistor, a third transistor, a fourth transistor, a fifth transistor, a sixth transistor, and a first capacitor. Variation in the threshold voltage of amplifier transistors can be compensated. Furthermore, the imaging device can have a difference detecting function for holding differential data between imaging data for an initial frame and imaging data for a current frame and outputting a signal corresponding to the differential data.

Abstract: A bracket assembly for use in a mobile terminal includes a metal support and a multi-contact spring. The metal support is configured to support an electronic component of the mobile terminal. The multi-contact spring includes a first pressure contact part, a second pressure contact part, a first elastic part, a second elastic part, and a fixing part. The multi-contact spring is fixed to a frame of the mobile terminal by a fastener extending through the fixing part into the frame. The first elastic part is connected to the first pressure contact part and the fixing part and is configured to provide a first restoring force to the first pressure contact part such that the first pressure contact part abuts against a metal cover of the mobile terminal and is grounded.

Abstract: A control apparatus includes: an acquisition unit adapted to acquire annotation information input by a user with respect to a first image shot by a shooting unit; a conversion unit adapted to convert the annotation information into a camera command defining an operation of the shooting unit; and an execution unit adapted to cause the shooting unit to execute an operation based on the camera command when shooting a second image shot after the first image.

Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.

Abstract: A system for producing a 360 degree media is provided. The system includes an adapter and a computer having a front camera facing in a first direction and a rear camera facing in a second direction. The first direction and the second direction are opposite one another. The adapter includes a front lens facing in the first direction and a rear lens facing in the second direction when the adapter is releasably attached to the computer. The front lens and the rear lens expand a capturable image of the front camera and the rear camera so that the computer may capture and produce the 360 degree media.

Abstract: A bezel for die level packaging of a camera module may include (a) a recessed lip surrounding an aperture of the bezel and facing in a first direction, wherein the recessed lip is configured for seating thereon an image sensor, and (b) a planar rim surrounding the aperture and facing in a second direction opposite the first direction, wherein the planar rim is configured for bonding thereto a wafer-level lens unit implementing a wafer-level lens for delivering light to the image sensor through the aperture, wherein transverse extent of the planar rim across the aperture in a dimension orthogonal to the first direction exceeds corresponding transverse extent of the recessed lip.

Abstract: A camera module is provided. The camera module includes a number of camera assembles. Each of the camera assembles includes a lens unit and an electromagnetic driving unit. The electromagnetic driving unit includes at least one magnetic element for controlling the movement of the corresponding lens unit. The distance between two of the magnetic elements, which are closest to each other and respectively positioned in two of the camera assemblies, is greater than the distance between two of the light through holes, to which the two of the camera assemblies are arranged to correspond.

Abstract: A camera module is provided. The camera module includes a number of camera assembles. Each of the camera assembles includes a lens unit and an electromagnetic driving unit. The electromagnetic driving unit includes at least one magnetic element for controlling the movement of the corresponding lens unit. The distance between two of the magnetic elements, which are closest to each other and respectively positioned in two of the camera assemblies, is greater than the distance between two of the light through holes, to which the two of the camera assemblies are arranged to correspond.

Abstract: A lens driving device capable of efficiently inhibiting garbage from falling to the side of a photosensitive sensor includes a lens support for retaining a lens, a fixed member, one or two spring members for connecting the lens support and the fixed member, and an electromagnetic driving assembly. The fixed member includes a substrate defining a circular through hole, a cylindrical dividing wall extending from an edge defining the circular through hole, several protruding parts protruding from the substrate outside the dividing wall, and concave parts formed between the protruding parts and the dividing wall. The lens support is provided with an end face capable of contacting a second front end face of the protruding parts and opposite to the concave parts, and a ring-shaped end surface arranged opposite to an end face of the dividing wall.

Abstract: An optical image capturing system includes, along the optical axis in order from an object side to an image side, a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, and a seventh lens. At least one lens among the first to the sixth lenses has positive refractive force. The seventh lens can have negative refractive force, wherein both surfaces thereof are aspheric, and at least one surface thereof has an inflection point. The lenses in the optical image capturing system which have refractive power include the first to the seventh lenses. The optical image capturing system can increase aperture value and improve the imaging quality for use in compact cameras.

Abstract: The present disclosure relates to a semiconductor package, a sensor module, and a production method for dissipating heat generated by a chip. In a solid-state image sensing element package, an image sensing element chip is bonded and fixed to a heat dissipation plate with a die bond material, the heat dissipation plate having positioning holes and mounting holes for accurately mounting on a lens barrel unit. A circuit board is bonded to a bottom surface of the heat dissipation plate with circuit board adhesive resin. Bonding pads that are electrodes of the image sensing element chip are electrically connected to lead terminals that are electrodes of the circuit board by conduction wires through conduction wire connection clearance holes formed through the heat dissipation plate. The present disclosure is applicable to a CMOS solid-state image sensing apparatus used for an image sensing apparatus such as a camera, for example.

Abstract: A sensor package and a method of manufacturing the same are provided. A sensor package includes a substrate on which an image sensor is mounted, an electronic component mounted on the substrate, and a transparent member coupled to the electronic component and covering the image sensor.

Abstract: Mechanisms for providing optical image stabilization in at least one direction as well as auto-focus in a digital camera comprise a plurality of springs mechanically coupled to at least a lens module carrying a lens of the digital camera, wherein the plurality of springs provides overall low stiffness to movement of the lens in two, first and second directions orthogonal to each other, and provides high stiffness to torsion of the lens module.

Abstract: There is provided a solid state image capturing apparatus including an image capturing element for photoelectric converting an incident light; a light shielding filter for shielding a part of the incident light; and a metal plate partly having an opening for fixing the light shielding filter at a position for blocking the opening, an end of the opening of the metal plate being etched and antireflection treated. Also, a camera module and an electronic device are provided.

Abstract: An imaging module 100 includes a lens unit 10 which has a lens group 12, and an imaging element unit 20 which is fixed to the lens unit 10 and has an imaging element 27 which images a subject through the lens group 12. The lens unit 10 has a lens drive unit 16, and a flexible substrate 13A which includes a wiring group 13a which is electrically connected to the lens drive unit 16. The imaging element unit 20 has a wiring connection portion 24 which is electrically connected to the wiring group 13a included in the flexible substrate 13A. The flexible substrate 13A is folded in the middle of the flexible substrate 13A.

Abstract: Arrayed imaging systems include an array of detectors formed with a common base and a first array of layered optical elements, each one of the layered optical elements being optically connected with a detector in the array of detectors.

Abstract: A vision system of a vehicle includes a camera having a front housing portion and a circuit element having an imager disposed thereat. One of the front housing portion and the circuit element includes a protrusion protruding therefrom and the other of the front housing portion and the circuit element includes a receiving portion for at least partially receiving the protrusion when the circuit element is positioned at the front housing portion to align the imager with the lens. When the circuit element is positioned at the front housing portion to align the imager with the lens, the protrusion is at least partially received at the receiving portion and is attached thereat, and no other part of the lens holder is attached at the circuit element when the circuit element is positioned at the front housing portion to align the imager with the lens.

Abstract: A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that that comprises a transparent, translucent, non-opaque, or otherwise optically-transmissive, external surface.

Abstract: A multi-element lens includes a first assembly having first and second optical elements supported respectively on a top and a bottom of a first glass substrate. A second assembly has third and fourth optical elements supported on a top and bottom of a second glass substrate. The first and second assemblies are bonded together and diced to form multiple multi-element lenses.

Abstract: The lens drive adapter is detachably attachable to a lens barrel on which an operation member and a lens electric contact portion are provided. The adapter includes a drive unit including a drive member configured to transmit a driving force to the operation member, an adapter electric contact portion configured to contact the lens electric contact portion to be electrically connected therewith, and two adapter coupling portions configured to couple with the lens barrel at its two circumferential locations to fix the adapter to the lens barrel. The adapter electric contact portion is provided, in a first direction corresponding to an optical axis direction of the lens barrel, at a position different from that of the drive member and between the two adapter coupling portions.

Abstract: The present disclosure relates to the technical field of electro-acoustic products. Disclosed is a speaker module installed in an electronic terminal, comprising: a housing receiving therein a speaker unit which is electrically connected with an external circuit of the module via an FPCB; and a sensor configured to detect ambient noise, the sensor being electrically connected with the FPCB, the sensor being installed at a position adjacent to a sound exit hole of the electronic terminal, and the sensor being used to transmit a detected ambient noise signal to a CPU of the electronic terminal via the FPCB. The electronic terminal installed with the speaker module may automatically tune the sound volume of the speaker module according to the amount of noise in the external environment, thereby ensuring a user to timely hear a prompt tone generated by the electronic terminal in any environment, and effectively avoiding missing an important event or call due to failure to hear the prompt tone.

Abstract: An electronic apparatus has a connection assembly and an electronic module. The connection assembly has a first connection portion. The first connection portion has a first connecting surface, a first buckle assembly, and a first magnetic attraction element. The first buckle assembly is disposed on the first connecting surface. The first magnetic attraction element is mounted in the first housing. The electronic module is detachably connected with the connection assembly and has a second connection portion. The second connection portion has a second connecting surface, a second buckle assembly, and a second magnetic attraction element. The second connecting surface selectively abuts the first connecting surface. The second buckle assembly is disposed on the second connecting surface and is detachably engaged with the first buckle assembly. The second magnetic attraction element is mounted in the second housing.

Abstract: A cooling system for a vehicle sensor module includes an active internal gas circulation system and a cold plate. The sensor module includes a light detector sensor disposed in a sealed housing. The housing is at least partially transparent. A cold plate is disposed on an end of the housing, and seals the housing. The active internal gas circulation system is disposed within the housing, and defines a first fluid flow path across the cold plate.

Abstract: A camera module including a PCB mounted with an image sensor; a holder member disposed at the PCB; a lens module coupled to the holder member; an actuator disposed at an upper surface of the lens module; and an electronic circuit pattern extending along an outer surface of the holder member. Further, a first end of the electronic circuit pattern is electrically connected to the PCB, and a second end of the electronic circuit pattern is electrically connected to the actuator.

Abstract: A camera having a substantially cubic form factor comprises, among other components, an image sensor, a lens assembly, a printed circuit board, and a heat sink. A heat sink operates to provide a thermally conductive path to an external surface of the camera. The heat sink comprises an external portion structured around a perimeter of the lens window and at least one arm extending perpendicular from the external portion to the interior of the camera. The at least one arm is thermally coupled to the at least one electronic component on the printed circuit board so as to conduct heat away from the electronics to the exterior of the camera.

Abstract: An optical apparatus includes plural optical lens groups, an optical sensor and a casing. After a light beam passes through any of the plural optical lens groups, a travelling direction of the light beam is changed. Moreover, after the light beam passes through at least one of the plural optical lens groups, the light beam is sensed by the optical sensor and converted into an image signal by the optical sensor. The plural optical lens groups and the optical sensor are accommodated and fixed within the casing. The optical apparatus has a single optical lens module, and is able to implement different optical function simultaneously. Consequently, the overall volume of the optical apparatus is minimized, and the fabricating cost of the optical apparatus is reduced.

Abstract: An assembly method of a SMA assembly, includes disposing a lens holder unit on a SMA unit, the lens holder unit being provided with a first spring, a lens holder and a coil that are mounted on the first spring, with the first spring pressed against a mounting surface of the SMA unit; and bonding the first spring of the lens holder unit with the mounting surface of the SMA unit. The assembly process is simplified, the coating and soldering space become big to facilitate the bonding process, and the joining force between the SMA unit and the lens holder unit is enhanced.

Abstract: A three-surface wafer-level lens system for imaging a wide field-of-view scene onto an image plane includes (a) a first wafer-level lens with (i) a first substrate having a first planar surface facing the image plane, and (ii) a first lens element bonded to the first planar surface and having a first lens surface facing the image plane, and (b) a second wafer-level lens with (i) a second substrate having a second planar surface facing away from the image plane, (ii) a third substrate bonded to the second substrate and having a third planar surface facing the image plane, (iii) a second lens element bonded to the second planar surface and having a second lens surface facing away from the image plane, and (iv) a third lens element bonded to the third planar surface and having a third lens surface facing the image plane.

Abstract: An apparatus for safeguarding a machine having a machine part performing a working movement, has a light source, a camera unit and a control unit. The light source and camera unit are attached to the machine part so as to concurrently move together with the machine part. The camera unit has an objective body with an optical lens element, an electronic image sensor arranged on a component support, an aperture stop, and a coupling part having a one-piece body by means of which the objective body and the component support are joined in a defined relative position to one another. The one-piece body fixedly rests on the component support thereby holding the aperture stop at a defined position relative to the electronic image sensor without individual adjustment. The control unit is designed to stop the working movement of the machine part depending on a signal produced by the camera unit.

Abstract: Fabricating optical devices can include mounting a plurality of singulated lens systems over a substrate, adjusting a thickness of the substrate below at least some of the lens systems to provide respective focal length corrections for the lens systems, and subsequently separating the substrate into a plurality of optical modules, each of which includes one of the lens systems mounted over a portion of the substrate. Adjusting a thickness of the substrate can include, for example, micro-machining the substrate to form respective holes below at least some of the lens systems or adding one or more layers below at least some of the lens systems so as to correct for variations in the focal lengths of the lens systems.

Abstract: The imaging unit of the present disclosure is an imaging unit rotatable about a first axis. The imaging unit includes a lens holder and an operating member. The lens holder holds a lens on its surface, has a first gear on its rear face, and is rotatable about a second axis in forward and backward directions. The operating member has a second gear engaged with the first gear, is rotatable about a third axis in forward and backward directions, and faces the rear face of the lens holder. A plane with the first axis as a normal, a plane with the second axis as a normal, and a plane with the third axis as a normal are orthogonal to each other. The lens holder rotates by rotating the operating member.

Abstract: The present invention relates to a camera module, the camera module including a PCB (Printed Circuit Board) mounted with an image sensor, a housing configured to protect the image sensor and mounted therein with camera constituent parts, and plural pieces of lenses mounted on the housing, wherein a surface of the housing is metalized.

Abstract: A launch monitor having a camera can be used to measure a trajectory parameter of a ball. In one example, a method can include changing a mode of the camera from a low-speed mode to a high-speed mode. The camera can include an image sensor array having a plurality of pixels. The camera can generate a video frame using more pixels in the low-speed mode than in the high-speed mode. A first video frame can be received, the video frame comprising values captured during the high-speed mode from a first subset of the plurality of pixels. A second video frame can be received, the video frame comprising values captured during the high-speed mode from a second subset of the plurality of pixels. The trajectory parameter of the ball can be calculated using the first video frame and the second video frame.

Abstract: A method for producing an image pickup apparatus includes: a process of cutting an image pickup chip substrate where electrode pads are formed around each of the light receiving sections to fabricate image pickup chips; a process of bonding image pickup chips determined as non-defective products to a glass wafer to fabricate a joined wafer; a process of filling a sealing member among the image pickup chips on the joined wafer; a machining process including a thinning a thickness of the joined wafer to flatten a machining surface and a forming through-hole interconnections, each of which is connected to each of the electrode pads; a process of forming a plurality of external connection electrodes, each of which is connected to each of the electrode pads via each of the through-hole interconnections; and a process of cutting the joined wafer.

Abstract: A camera module for a vision system of a vehicle includes a housing, a lens and at least one circuit board having circuitry disposed in the housing with an imaging array sensor disposed at the circuit board. An elongated thermally conductive element has a first portion in thermal conductive contact with the circuit board and a second portion extending from the first portion towards and through the housing such that the second portion protrudes through an aperture through the housing and protrudes from the housing exterior of the camera module. A heat sink is disposed exterior of the housing. The second portion of the thermally conductive element protrudes at least partially into the heat sink and is in thermally conductive contact with the heat sink. The thermally conductive element is configured to transfer heat from the circuit board to the heat sink to reduce heat within the camera module.