Abstract: An electronic apparatus capable of separating and dissipating heat generated by a plurality of heat sources. The electronic apparatus includes a main circuit board and an image pickup device unit, as heat sources. A first duct unit is disposed between the main circuit board and the image pickup device unit, and dissipates heat from the image pickup device unit to an outside. A second duct unit is disposed at a position where the second duct unit and the first duct unit sandwich the main circuit board, and dissipates heat from the main circuit board to the outside.

Abstract: Optoelectronic modules, such as imaging cameras, proximity sensors, range cameras, structured-light/pattern generators, and image projectors, and methods for their manufacture, are disclosed. The optoelectronic modules exhibit particularly small dimensions. The optoelectronic modules include an optical assembly, an intermediate substrate, and a base substrate. The optical assembly includes a flange portion. An adhesive layer between the flange portion and the intermediate substrate, and an additional adhesive layer between the intermediate substrate and the base can be substantially non-transmissive to light and can resist dimensional changes dues to moisture absorption, for example.

Abstract: A photographing module and electric bracket thereof. The electric bracket can be made into any shape, having not only a function of a traditional base that supports a motor, but also serving to dispose a circuit, so as to ensure stability and security of a circuit of the photographing module. The electric bracket can also integrate therein a drive coil or an EMI shielding conductive layer, so as to reduce a material loss and manufacturing cost, while increasing reliability of shielding protection.

Abstract: A display apparatus for position detection and separation of a plurality of display panels, and a control method thereof. A display apparatus includes a cabinet, a plurality of display panels disposed in a first direction of the cabinet, an indicator disposed in a second direction opposite to the first direction, a communicator configured to receive an external signal for detecting positions of the plurality of display panels, and a controller configured to control the indicator corresponding to the display panel which becomes a position detection target to be turned-on based on the external signal received by the communicator.

Abstract: An onboard electronic device cover configured to be engageably secured to a base member, which is to be fixed to a window glass of a vehicle, to cover an electronic device which is to be held on an installation part, includes: a mutual engaging mechanism capable of mutually engaging the onboard electronic device cover with the base member. The mutual engaging mechanism includes: an engaging part provided to one of the base member and the cover; an engaged part provided to the other of the base member and the cover and capable of engaging with the engaging part; and an urging member configured to urge the engaging part toward the engaged part. When the cover is pushed toward the window glass, the engaging part engages with the engaged part with being urged in a direction following a surface of the window glass by the urging member.

Abstract: A holder for a camera module includes first and second surfaces, an optical filter receiving groove is recessed from the first surface to the second surface to form a step portion and a glue receiving portions extend from angled abutments of the step portion. A sensor receiving groove is recessed from the second surface to the first surface, and the sensor receiving groove communicates with the optical filter receiving groove. At least one escape passage is defined in the holder, the at least one escape passage communicates with the optical filter receiving groove and the sensor receiving groove. The at least one escape passage abuts the glue receiving portions and provides an escape path for captured moisture and gases expanding or shrinking because of temperature variations.

Abstract: The present disclosure relates to a semiconductor device, a solid-state image pickup element, an image pickup device, and an electronic apparatus that are enabled to reduce restrictions on materials and restrictions on device configuration. A CSP imager and a mounting substrate are connected together with a connection portion other than a solder ball. With such a configuration, restrictions on materials and restrictions on device configuration are reduced, which has conventionally occurred because it is limited to a configuration in which solder balls are used for connection. The present disclosure can be applied to image pickup devices.

Abstract: The present disclosure relates to the field of optical lenses and discloses a lens module, including a lens barrel, a first lens, a second lens and a third lens, which are accommodated in the lens barrel and are sequentially stacked from an object side to an image side. The first lens includes a first optical portion and a first connection portion surrounding the first optical portion. An image side surface of the first connection portion includes a first planar surface, a first engaging oblique surface extending from the first planar surface in a direction facing towards an optical axis, and a second planar surface extending from the first engaging oblique surface in the direction facing towards the optical axis. The lens module provided by the present disclosure can improve the matching accuracy between the lenses and the lens barrel, and thus guarantees the performance of the lens module.

Abstract: An infrared camera assembly for a vehicle. The assembly includes: a vehicle component having a front surface; a shutterless far-infrared (FIR) camera mounted within the vehicle component, wherein the shutterless FIR camera is utilized to output at least one thermal video stream processed by the autonomous vehicle system; and a protective window disposed on at least a portion of the front surface of the vehicle component, where the protective window is positioned to be aligned with a lens of the FIR camera, so as to allow the shutterless FIR camera to capture images therethrough.

Abstract: An imaging chip packaging structure includes a circuit substrate, an imaging chip, and a pedestal. The circuit substrate has a first through hole extending through the circuit substrate. The imaging chip comprises a photosensitive area, and the first through hole through the substrate exposes the photosensitive area. The pedestal is integrated with the circuit substrate. The pedestal is formed on a first surface of the circuit substrate and comprises a second through hole on an optical path of the light reaching the imaging chip.

Abstract: An assembly method of a camera module is provided. The camera module includes a first and second lens set respectively including at least one lens. The assembly steps include: providing a substrate, a lens holder, and an image sensing device, wherein the image sensing device is located in a space formed by the substrate and the lens holder, and the lens holder includes a limiting portion; disposing the second lens set in the space; assembling a barrel in the limiting portion, wherein the first lens set is disposed in the barrel, the second lens set is located between the first lens set and the image sensing device, and the first and second lens sets and the image sensing device have a common optical axis; inspecting the imaging of the image sensing device; and adjusting a position of the barrel in the limiting portion according to the inspection result.

Abstract: A portable electronic device including a housing, a retractable antenna rod, and a camera. The housing includes an opening on a side of the housing and a longitudinal axis. The retractable antenna rod extends out from the opening and is coupled to the housing at a first end of the retractable antenna rod. The retractable antenna rod is movable along the longitudinal axis of the housing. The camera is coupled to a second end of the retractable antenna rod. The camera is positionable within the opening of the housing when the retractable antenna rod is retracted into the housing.

Abstract: The present invention provides an image capturing module and a portable electronic device, including a circuit substrate, an image sensing chip, a filter element, and a lens assembly. The upper surface of the circuit substrate includes a chip placing area, a first solder area, and a second solder area. The upper surface of the image sensing chip includes an image sensing area, a carrier area, a first conductive area, and a second conductive area, and the carrier area surrounds the image sensing area. The lower surface of the filter element has a light transmitting area and a connecting area surrounding the light transmitting area. The first conductive area and the second conductive area of the image sensing chip are electrically and respectively connected to the first solder area and the second solder area of the circuit substrate.

Abstract: The present disclosure discloses a camera optical lens. The camera optical lens including, in an order from an object side to an image side, a first lens having a positive refractive power, a second lens having a negative refractive power, a third lens having a positive refractive power, a fourth lens having a negative refractive power, a fifth lens having a positive refractive power, and a sixth lens having a negative refractive power. The camera optical lens further satisfies specific conditions.

Abstract: A camera module includes: a circuit board; a photosensitive chip located on and coupled to the circuit board; a package body packaged on the circuit board; and a bracket located on a side of the package body away from the circuit board; wherein the bracket is provided with a step away from the package body, a sidewall of the step is inclined with respect to an optical axis of the camera module, a distance between the sidewall of the step and the optical axis gradually increase along a direction from the circuit to the package body, and an angle between the sidewall of the step and the optical axis ranges from 0.5° to 30°.

Abstract: An imaging optical lens assembly includes, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element and a sixth lens element. The first lens element with positive refractive power has a convex object-side surface. The second lens element has negative refractive power. The third lens element with refractive power has both an object-side surface and an image-side surface being aspheric. The fourth lens element with refractive power has both an object-side surface and an image-side surface being aspheric. The fifth lens element with refractive power has both an object-side surface and an image-side surface being aspheric. The sixth lens element with refractive power has both an object-side surface and an image-side surface being aspheric.

Abstract: A sensor cleaning system for a vehicle is disclosed that includes a sensor assembly. The sensor assembly may include a fluid-dispensing nozzle for a vehicle sensor, a housing within a body of a vehicle, and a driving member which can move the nozzle between a stowed position within the housing and a deployed position.

Abstract: An apparatus for mitigating contamination of an optical device comprises an open-topped, closed-sided, and closed-bottomed housing cup partially defining a protected volume to enclose the optical device. A housing cap encloses a top of the housing cup and partially defines the protected volume. The housing cap includes a top collar having an open central aperture. A top cover laterally spans the central aperture of the top collar. An interface structure circumscribes the top cover to suspend the top cover downwardly into the housing cup from the top collar. The interface structure prevents direct contact between the top cover and the top collar.

Abstract: An image pickup apparatus includes: an image pickup device including: a light receiving section configured to receive light entering from a light receiving surface; and a plurality of convex electrodes disposed on an opposing surface; an optical system configured to condense the light on the light receiving section; and a wiring board including a plurality of bonded terminals on a main surface, the plurality of bonded terminals respectively bonded to the plurality of convex electrodes, wherein the plurality of convex electrodes are not arranged in a light receiving section facing region that faces a region provided with the light receiving section.

Abstract: An electronic device includes a substrate with a plurality of LDS antennas and a conductive member, the substrate defines a first surface and a second surface opposite to the first surface. A decorative ink layer coats to the first surface of the substrate facing the interior of the electronic device, several LDS ink layers coat to the decorative ink layer, the LDS antennas are disposed on the corresponding LDS ink layers. The LDS antenna defines feed-in portion connecting with the conductive member, the conductive member comprises a flexible printed circuit and an anisotropic conductive adhesive connecting the flexible printed circuit and feed-in portion. Therefore, the transmission and reception of signal data can be realized through the connection between the flexible print circuit and the LDS antenna thereby enhance the effect of signal transmission and meet the needs of flexibility and miniaturization.

Abstract: The invention relates to a lens device (9) for a camera (4) of a motor vehicle (1), including at least one lens (11) and including a lens retainer (10) for retaining the at least one lens (11), wherein the lens retainer (10) has an adhesive area (16) at an outside, to which an adhesive (14) can be applied for connecting the lens device (9) to a camera housing (15) of the camera (4), wherein the lens retainer (9) has a base surface (19) and a plurality of elevations (21) in the adhesive area (16), wherein the respective elevations (21) are formed raised to the base surface (19).

Abstract: An assembling method of a camera module includes the following steps. Firstly, a sensing chip is installed on a strip-like substrate. Then, the strip-like substrate is bent, so that a bent substrate in a bent state is formed. Then, the bent substrate and an optical lens are placed on a fastening table and an alignment module, respectively. Then, an installation angle of the optical lens is adjusted by the alignment module according to an active alignment. Then, the optical lens and the bent substrate are combined together. After the bent substrate is restored from the bent state to a non-bent state, the camera module is produced. The assembling method is suitable for assembling the longer camera module.

Abstract: A panel vibration type sound generating display device is disclosed. The display device includes a display panel for displaying an image; a sound generating actuator connected to the display panel and configured to vibrate the display panel to generate sound; a support structure spaced apart from the display panel with an air gap between the support structure and the display panel; and a baffle part disposed between the support structure and the display panel to surround the air gap.

Abstract: A housing assembly includes: a support including a peripheral side wall and a lug, the peripheral side wall defining a first accommodating space configured to accommodate a dual-camera assembly, and the lug being connected to an outer peripheral side of the peripheral side wall away from the first accommodating space; and a middle frame having a second accommodating space and a groove in communication with the second accommodating space, the support being accommodated in the second accommodating space, and the lug being fitted with the groove. The present disclosure further provides a dual-camera module and a mobile terminal.

Abstract: An array imaging apparatus having discrete camera modules is disclosed. In one embodiment, the apparatus comprises a substrate; and heterogeneous camera modules attached to the substrate and in a geometric relationship with each other, the heterogeneous camera modules having a substantially similar photometric response.

Abstract: The present invention provides a portable electronic device, an image-capturing module thereof and a carrier assembly thereof. The image-capturing module includes a circuit substrate, an image-sensing chip, at least one electronic component, a dispensing package, and a lens assembly. The circuit substrate has a top surface and a bottom surface. The image-sensing chip is electrically connected to the circuit substrate, and the image-sensing chip has an image-sensing area. The at least one electronic component is disposed on the bottom surface of the circuit substrate and electrically connected to the circuit substrate. The dispensing package is disposed on the bottom surface of the circuit substrate to cover the at least one electronic component. The lens assembly includes a holder structure disposed on the top surface of the circuit substrate and a lens structure being held by the holder structure and corresponding to the image-sensing area.

Abstract: In a camera apparatus, a camera case is fixed to a windshield from within a cabin of a vehicle. A camera module includes an optical unit and a camera substrate. The optical unit includes a lens. The camera substrate includes an image sensor. The optical unit includes a lens barrel portion and a base portion. The lens barrel portion holds the lens therein. The base portion has a reference surface that serves as a reference for positioning when the camera module is fixed to the camera case and to which the lens barrel portion is fixed so as to have a fixed positional relationship. The camera substrate is fixed to the optical unit in a position in which an optical axis of the lens passes through a center of a light receiving surface of the image sensor and is perpendicular to the light receiving surface of the image sensor.

Abstract: A novel display system includes a host and a display. In a particular embodiment the host includes a data scaler and a dual frame buffer. Frames of image data are down-scaled before being transferred to the display, and is up-scaled while being loaded into the frame buffer or the display. The down-scaled frames of image data include less data than the frames of image data. In another embodiment, the process of loading the image data into the display begins before an entire frame of data is loaded into the frame buffer. Increasingly sized portions of the image data, each corresponding to a different color field, are asserted on the display and displayed one at a time. The portions of the frame that were not previously displayed are displayed along with the initial portions of a subsequent frame.

Abstract: Embodiments provide a lens moving apparatus including a bobbin in which a lens is mounted, a first coil and a magnet configured to electromagnetically interact with each other so as to move the bobbin, a housing configured to accommodate the bobbin therein, an elastic member including an inner frame coupled to the bobbin, an outer frame coupled to the housing, and a frame connection portion configured to connect the inner frame and the outer frame to each other, and a support member connected to the elastic member and configured to support the housing, and the outer frame includes a first coupling portion coupled to the housing, a second coupling portion coupled to the support member, the second coupling portion being spaced apart from the first coupling portion, and a single connection portion configured to connect the first coupling portion and the second coupling portion to each other.

Abstract: Folded digital camera module comprising an optical path folding element (OPFE) for folding light from a first optical path with a first optical axis to a second optical path with a second optical axis perpendicular to the first optical axis, an image sensor, and a lens module carrying a lens with a symmetry axis parallel to the second optical axis. The camera module is adapted to perform optical image stabilization (OIS) involving at least one tilt motion of the OPFE tilt around an axis such that the OPFE tilt creates an image Roll movement and a shift movement, the OPFE tilt-created image Roll movement compensating for a folded camera module-induced Roll movement and the shift movement cancelable by a movement of the lens module.

Abstract: A lens holder able to equalize air pressure at all times with the ambient atmosphere includes a packaging member and a support member. The packaging member has upper and lower surfaces, and the packaging member includes a first through hole and a groove in communication with the first through hole. The support member has first and second surfaces and includes a second through hole and a vent hole in communication with the second through hole. The packaging member is mounted to the second surface of the support member, the first through hole is in communication with the second through hole, and the vent hole of the support member is in communication with the groove of the packaging member. A camera module including the lens holder is also provided.

Abstract: The invention provides apparatuses and methods relevant to image sensors configured for dual mode operation. The invention comprises an image sensor having an image sensor substrate having an array of pixels formed thereon. The array of pixels comprises (i) a first pixel region comprising a first array of pixels, which first array of pixels comprising pixels configured for peak sensitivity to wavelength(s) below 700 nm, and (ii) a second pixel region comprising a second array of pixels, which second array of pixels comprising pixels of a first pixel type and pixels of a second pixel type. Pixels of the first pixel type may be configured for peak sensitivity to wavelength(s) between 700 nm and 1000 nm. Pixels of the second pixel type may be configured for peak sensitivity to wavelength(s) below 700 nm. The invention additionally provides apparatuses incorporating the image sensor and methods for fabricating said image sensor.

Abstract: One embodiment of a camera module includes: a lens barrel provided with at least one lens; and a lens holder having the lens barrel coupled thereto, wherein the lens barrel may have a first adhesive part formed thereon having the bottom surface thereof facing the top surface of the lens holder and adhered to the lens holder, the lens holder may have a second adhesive part formed thereon having the top surface thereof facing the bottom surface of the lens barrel and adhered to the lens barrel, and a first recessed groove having at least a portion of an adhesive deposited therein may be formed in the second adhesive part.

Abstract: The lens barrel includes an image-capturing lens unit, a mount portion including a mount member connectable to an image-capturing apparatus, and protrusion portions provided in the mount portion at multiple positions in a circumferential direction of the lens barrel. Each protrusion portion protrudes to an image side further than an image-side lens surface of a final lens disposed at a most image-side position in the image-capturing lens unit. The mount portion includes, inside the protrusion portions in a radial direction of the lens barrel, light-shielding portions capable of shielding light passing though the image-side lens surface toward inner circumferential surfaces of the protrusion portions.

Abstract: There is provided a solid state image capturing apparatus including an image capturing element for photoelectric converting an incident light; a light shielding filter for shielding a part of the incident light; and a metal plate partly having an opening for fixing the light shielding filter at a position for blocking the opening, an end of the opening of the metal plate being etched and antireflection treated. Also, a camera module and an electronic device are provided.

Abstract: The invention relates to a method for manufacturing a camera (4) for a motor vehicle (1), in which an interface device (14) for connecting the camera (4) with a data bus of the motor vehicle (1) is selected from at least two different interface devices (14) and is arranged on a circuit board (13), the circuit board (13) is arranged in an interior space (12) of a front housing (10), a rear housing (15) is manufactured and connected with the front housing (10), wherein the rear housing (15) has a through-opening (16), through which the interface device (15) is passed partly, wherein in manufacture of the rear housing (15) the through-opening (16) is formed in dependency on the selected interface device (14), wherein an outer contour of the rear housing (15) is maintained.

Abstract: A camera module includes a housing having an internal space, a first moving body disposed in the internal space of the housing, a second moving body disposed in an internal space of the first moving body, a driving wire for OIS formed of a shape memory alloy, and having both ends connected to the housing and a central portion connected to the first moving body, and a driving wire for AF formed of a shape memory alloy, and having both ends connected to the first moving body and a central portion connected to the second moving body. The driving wire for OIS includes a pair of driving wires for OIS disposed opposing each other configured to move the first moving body in one axis direction, and the driving wire for AF includes a pair of the driving wires for AF disposed on one side surface among internal surfaces of the first moving body spaced apart from each other upwardly and downwardly configured to move the second moving body in an upward direction and a downward direction.

Abstract: One embodiment of a camera module can comprise: a housing having a first electrode pattern and a first recessed part, which are formed on the upper surface thereof; an auto-focusing unit mounted in the first recessed part and electrically connected to the first electrode pattern; a lens barrel accommodated inside the housing; a first holder which is disposed at the lower part of the housing and to which the lens barrel is coupled; and a printed circuit board disposed at the lower part of the first holder and electrically connected to the housing.

Abstract: A camera module in one embodiment may comprise: a lens unit; a first casing to which the lens unit is coupled; a printed circuit board which is disposed on the rear side of the lens unit so as to be spaced from the lens unit, and is disposed in the direction of the optical axis of the lens unit so as to face the lens unit; a second casing which is disposed on the rear side of the first casing and accommodates the printed circuit board, and of which the front portion is coupled to the rear portion of the first casing; and a shield member which is electrically connected to the lens unit and is grounded to the second casing.

Abstract: An imaging module of the invention includes: a connector including: a first implanted conductor; a second implanted conductor longer than the first implanted conductor; a first groove that includes a second mounting terminal constituting part of the first implanted conductor; a second groove that includes a third mounting terminal constituting part of the second implanted conductor; and a third groove that is located between the first groove and the second groove; and a coaxial cable including: an internal conductor that is provided in the first groove and is electrically connected to the second mounting terminal; a sheath conductor that is provided in the second groove and is electrically connected to the third mounting terminal; and a coated portion that is provided in the third groove.

Abstract: Image sensors may include phase detection pixels that are used to determine the distance between the image sensor and objects in a scene. To account for variations in the angular response of phase detection pixels across a pixel array, calibration may be performed. During calibration, an image sensor may take images of targets at known distances from the sensor. The known distances may be used to determine scaling factors that account for differences between the initially calculated distances between the sensor and the targets and the actual distances between the sensor and the targets. The scaling factors may then be stored on the image sensor for future reference. During subsequent use of the image sensor, the image sensor may then obtain the appropriate scaling factor in real time for more accurate phase and distance determinations.

Abstract: A digital video camera, including a heat management system, which includes at least one inlet and at least one outlet in the housing to enable air to flow through the housing. The heat management system also includes a first heat sink thermally connected to an image sensor(s), and a second heat sink thermally connected to a data processing unit(s), and a centrifugal fan. The centrifugal fan is configured to draw air into the front of the fan in an axial direction and push air radially out in a sideways direction, whereby air travels through the inlet(s) over the first heat sink and then over the second heat sink to the outlet(s).

Abstract: A housing assembly includes: a support including a peripheral side wall and a lug, the peripheral side wall defining a first accommodating space configured to accommodate a dual-camera assembly, and the lug being connected to an outer peripheral side of the peripheral side wall away from the first accommodating space; and a middle frame having a second accommodating space and a groove in communication with the second accommodating space, the support being accommodated in the second accommodating space, and the lug being fitted with the groove. The present disclosure further provides a dual-camera module and a mobile terminal.

Abstract: A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module comprises two or more camera lenses and a circuit unit. The circuit unit comprises a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.

Abstract: An imaging apparatus comprises a housing which includes a resin containing a plurality of fillers, each filler having a longitudinal direction, an imaging optical system fixed to an opening provided in the housing, and an imaging device stored in the housing and configured to capture an object image formed through the imaging optical system. the longitudinal directions of first fillers in a first part of the housing facing an exterior of the housing are positioned along a direction from the inside to the outside of the housing, and the longitudinal directions of second fillers in a second part of housing facing an interior of the housing are positioned along an interior wall of the housing.

Abstract: There is provided a solid state image capturing apparatus including an image capturing element for photoelectric converting an incident light; a light shielding filter for shielding a part of the incident light; and a metal plate partly having an opening for fixing the light shielding filter at a position for blocking the opening, an end of the opening of the metal plate being etched and antireflection treated. Also, a camera module and an electronic device are provided.

Abstract: An optical sensor package module and a manufacturing method thereof are provided. The optical sensor package module includes a substrate, a sensor chip and a shielding assembly. The sensor chip is disposed on the substrate and includes an array of pixels located at a top side thereof for receiving light. The shielding assembly surrounds the sensor chip for limiting influx of light onto the sensor chip, and the shielding assembly has a first aperture to expose at least a first subset of the pixels that is configured to receive corresponding light.

Abstract: An imaging unit includes: an optical system; a semiconductor package including an image sensor, and a connection electrode formed on a back surface; a cable; an electronic component; and a multi-layer substrate having a rectangular plate shape and including: a first electrode and a second electrode arranged side-by-side with each other on a front surface, the semiconductor package being mounted on the first electrode, and the cable being connected to the second electrode; and a third electrode on a back surface, the electronic component being mounted on the third electrode. The multi-layer substrate includes walls on at least two opposing sides of the back surface, and the semiconductor package is disposed such that a light receiving surface of the image sensor is arranged horizontally with respect to the multi-layer substrate.

Abstract: An electronic device includes a display screen, a transparent cover plate, and a sensing unit. The transparent cover plate has a first region and a second region. The first region corresponds to the display screen. The second region includes a non-through hole provided at an inner surface of the transparent cover plate. The sensing unit is arranged in the non-through hole.

Abstract: A portable information handling system display has an OLED film disposed over front and rear faces of a substrate, such as a carbon fiber material. A protective cover is disposed over the OLED film with a folded portion along an end of the substrate, the protective cover hardened at the front and rear faces and left unhardened along the folded portion. In one example embodiment, a transparent bezel is placed over the folded portion with the OLED film presenting system information through the bezel, such as battery state, etc.