Abstract: Embodiments of systems and methods for operating an electro-optical shutter with variable transmissivity are described. In some embodiments, an Information Handling System (IHS) may include a processor and a memory coupled to the processor, the memory having program instructions stored thereon that, upon execution, cause the IHS to: receive context information, and control a transmissivity of the electro-optical shutter of a camera coupled to the IHS, at least in part, based upon the context information.

Abstract: A tray feeding box includes a box body; a cover, arranged at a first end of the box body; and a bottom board, arranged at a second end of the box body away from the cover. The cover includes at least one first cover arranged at the first end of the box body. The at least one first cover is defined with a first opening. The box body is defined with a take-out gap communicated with the first opening.

Abstract: A display assistant device comprises a display, a camera, a speaker, microphones, a processor and memory. The memory stores programs comprising instructions that, when executed by the processor, enable a plurality of modes of the display assistant device. The modes include a monitoring mode and an assistant mode. In the monitoring mode, the device is configured to perform a remote monitoring function in which first video captured by the camera is streamed to a remote server system for monitoring uses. The monitoring uses include transmission of the first video to remote client devices authorized to access the first video. In the assistant mode, the device is configured to perform a second plurality of functions that excludes the monitoring function and includes a video communication function in which second video captured by the camera is transmitted to second devices participating in a video communication with a first user of the device.

Abstract: An electronic device includes a camera module and an external structure. The camera module includes an image sensor and a shielding structure that shields components of the camera module from electromagnetic interference (EMI). The external structure two-dimensionally surrounds the camera module, and a portion of the external structure is conductive. The shielding structure includes an accommodating portion that accommodates the image sensor, and a protruding portion that protrudes from the accommodating portion to contact the external structure.

Abstract: An imaging apparatus is disclosed. The imaging apparatus includes an image sensor including includes a photosensitive region and an anti-shake module including a base, a carrier, a flexible connection member, and an actuator set. The base includes a cavity, a depth of the cavity is greater than or equal to a thickness of the image sensor, the carrier and the image sensor are disposed in the cavity, and the base provides support for the carrier by using the flexible connection member. The carrier includes a through hole, a size of the through hole is greater than or equal to that of the photosensitive region, the carrier is separately electrically connected to the image sensor and the base, and a bottom surface of the carrier is fastened to a top surface of the image sensor. Each actuator in the actuator set includes a fastened end and a movable end.

Abstract: An embodiment comprises: a housing; a bobbin disposed in the housing; a coil disposed on the bobbin; a magnet disposed in a side portion of the housing, and including a first side surface facing the coil and a second side surface opposite to the first side surface; and a yoke disposed in the upper portion of the housing and overlapping the magnet in the optical axis direction, wherein: the centerline of the magnet is located on one side with reference to a reference line; a first groove adjoining one end of the first side surface of the magnet is disposed at a first end of the magnet; a second groove adjoining the other end of the first side surface of the magnet is disposed at a second end of the magnet; the reference line passes through the center of the housing and is perpendicular to the outer surface of the side portion of the housing where the magnet is disposed; and the centerline of the magnet is a straight line passing through the center between the first end and the second end of the magnet and perp

Abstract: The present invention provides an in-vehicle image pickup device wherein highly accurate optical axis adjustment of an image pickup unit with respect to a housing can be performed, while suppressing precision machining of the housing as much as possible. The present invention is provided with: camera modules having a lens holder, which has the optical axis of a lens as a normal line, and which has one or more reference surfaces that are formed therein; and a housing having an insertion hole, into which the lens holder is inserted, facing surfaces facing the reference surfaces, and adhesive filling sections penetrating from the side of the facing surfaces to the reverse side of the facing surfaces.

Abstract: There is provided a camera module including a stacked lens structure including a plurality of lens substrates. The plurality of lens substrates includes a first lens substrate including a first lens that is disposed at an inner side of a through-hole formed in the first lens substrate, and a second lens substrate including a second lens that is disposed at an inner side of a through-hole formed in the second lens substrate, wherein the first lens substrate is directly bonded to the second lens substrate. The camera module further includes an electromagnetic drive unit configured to adjust a distance between the stacked lens structure and a light-receiving element.

Abstract: An imaging panel is provided. The imaging panel includes a photoelectric conversion element, a pixel, a first conductive film, a second conductive film, a third conductive film, a fourth conductive film, and a fifth conductive film. The pixel includes a pixel circuit and supplies an image signal. The first conductive film is supplied with the image signal and the photoelectric conversion element includes a first terminal connected to the second conductive film and a second terminal connected to the pixel circuit. The pixel circuit includes a first switch, a second switch, a third switch, a transistor, and a capacitor. The first switch includes a terminal connected to the second terminal of the photoelectric conversion element and a terminal connected to a node. The transistor includes a gate electrode connected to the node and a first electrode connected to the third conductive film.

Abstract: The present disclosure provides a camera module and an electronic device. The camera module comprises a bearing base, an image sensor, a baseplate, a lens bracket, and a lens group. The image sensor is disposed at the bearing base. The baseplate is disposed at the bearing base and is separated from the image sensor. The baseplate is disposed on the periphery of the image sensor. The baseplate is electrically connected with the image sensor. The lens bracket is disposed at the bearing base. The image sensor and a part of the baseplate are disposed in the lens bracket. The lens bracket comprises a photosensitive through hole. The image sensor corresponds to the photosensitive through hole. The lens group is disposed at the lens bracket and corresponds to the image sensor through the photosensitive through hole.

Abstract: A camera module is provided, disposed in an electronic device, including a base, a holder, an image sensor, a bottom, and a first biasing element. The base is fixed to a casing of the electronic device. The holder is configured to hold an optical lens and connects to the base. The image sensor is supported by the bottom. The base is situated between the holder and the bottom. The first biasing element connects to the bottom and the base, and forces the bottom and the image sensor to move relative to the base.

Abstract: An image sensor semiconductor package (package) includes a printed circuit board (PCB) having a first surface and a second surface opposite the first surface. A complementary metal-oxide semiconductor (CMOS) image sensor (CIS) die has a first surface with a photosensitive region and a second surface opposite the first surface of the CIS die. The second surface of the CIS die is coupled with the first surface of the PCB. A transparent cover is coupled over the photosensitive region of the CIS die. An image signal processor (ISP) is embedded within the PCB. One or more electrical couplers electrically couple the CIS die with the PCB. A plurality of electrical contacts on the second surface of the PCB are electrically coupled with the CIS die and with the ISP. The ISP is located between the plurality of electrical contacts of the second surface of the PCB and the CIS die.

Abstract: An image pickup apparatus which makes the load applied to a movable unit when it is displaced nearly uniform. The movable unit controlled by a control unit is capable of being in at least a predetermined direction. A first flexible board has a first connecting portion connected to the movable unit, a first wiring portion extended from the first connecting portion in a first direction different from a direction of an optical axis, and a second connecting portion placed at an end of the first wiring portion and connected to the control unit. A second flexible board has a third connecting portion connected to the movable unit, a second wiring portion extended from the third connecting portion in a second direction different from the direction of the optical axis, and a fourth connecting portion placed at an end of the second wiring portion and connected to the control unit.

Abstract: The present disclosure relates to the field of optical lenses and provides a camera optical lens. The camera optical lens includes, from an object side to an image side: a first lens; a second lens having a positive refractive power; a third lens having a positive refractive power; a fourth lens; a fifth lens; and a sixth lens. The camera optical lens satisfies following conditions: 4.00?f1/f?6.00; and ?50.00?R5/d5??20.00. The camera optical lens can achieve a high imaging performance while obtaining a low TTL.

Abstract: The present invention provides a camera unit with a light steering mechanism and application thereof, wherein the camera unit includes a long-focal-length camera module and a wide-angle camera module, wherein the wide-angle camera module provides a wide-angle image, and a ratio between an equivalent focal length of the long-focal-length camera module and an equivalent focal length of the wide-angle camera module is not less than 4, wherein the long-focal-length camera module includes a light steering mechanism, a long-focal-length lens and a long-focal-length photosensitive assembly, wherein the light steering mechanism is used for turning the light to pass through the long-focal-length lens to be received by the long-focal-length photosensitive assembly, wherein a height dimension of the long-focal-length camera module does not exceed 5.6 mm.

Abstract: An electronic device that includes a vision system carried by a bracket assembly is disclosed. The vision system may include a first camera module that captures an image of an object, a light emitting element that emits light rays toward the object, and a second camera module that receives light rays reflected from the object. The light rays may include infrared light rays. The bracket assembly is designed not only carry the aforementioned modules, but to also maintain a predetermined and fixed separation between the modules. The bracket assembly may form a rigid, multi-piece bracket assembly to prevent bending, thereby maintaining the predetermined separation. The electronic device may include a transparent cover designed to couple with a housing. The transparent cover includes an alignment module designed to engage a module and provide a moving force that aligns the bracket assembly and the modules to a desired location in the housing.

Abstract: A camera module according to one embodiment comprises: a barrel provided with at least one lens; a retainer having an inner space and accommodating the barrel in the inner space; a holder coupled to the lower portion of the retainer; a housing disposed on the lower side of the holder and accommodating a printed circuit board; and a cover part mounted on the retainer and disposed in front of the lens. The cover part comprises: a cover glass; a first reflection suppression layer disposed on the upper side of the cover glass; a heating layer disposed on the lower side of the glass cover; and a second reflection suppression layer disposed on the lower side of the heating layer.

Abstract: An optical device comprising a lens barrel part housing one or more lens elements and comprising a first coupling formation. A support part is provided comprising a second coupling formation mechanically mated with the first for supporting the lens barrel part in front of an optical sensor. The first and second coupling formations are mated at a connection plane. At least a rear portion of the lens barrel part extends rearward from the connection plane such that at least one lens element is located between the connection plane and the optical sensor. Forward movement of the connection plane caused by thermal expansion of the support part is compensated by rearward thermal expansion of the rear portion for maintaining the image plane substantially coincident with the sensitivity plane.

Abstract: An image capturing apparatus that is made compact in the size of an apparatus body, particularly the lateral size thereof, without impairing operability thereof. The image capturing apparatus includes connection terminals for connecting external devices thereto, an air inlet port via which air is drawn in for cooling heat sources of an apparatus body, and an air outlet port via which the air is discharged. A connection terminal arrangement surface and an air outlet port arrangement surface form different surfaces and are inclined at predetermined angles with respect to an optical axis, respectively. The connection terminal arrangement surface and the air outlet port arrangement surface are arranged to be displaced in a left-right direction, as viewed from the side of the image capturing apparatus, and are arranged to overlap each other, as viewed from the front of the image capturing apparatus.

Abstract: The present disclosure provides an embedding reinforced circuit board, a camera module, and an electronic device. The embedding reinforced circuit board, comprising a circuit board and a reinforcing plate. The circuit board comprises a first surface and a second surface opposite to the first surface. The first surface is provided with a component installation area. The second surface is provided with an accommodating groove. The width of at least one side of the cross-sectional area of the accommodating groove is wider than the width of the corresponding side of the component installation area. The cross-sectional area of the accommodating groove is parallel to the first surface or the second surface. The reinforcing plate is disposed in the accommodating groove.

Abstract: Embodiments provide a camera module including a lens unit, a first board formed with an electromagnetic circuit, a second board spaced apart from the first board, the second board including a terminal for external electrical connection and being formed with an electromagnetic circuit, a first support member having one side coupled to the first board and the other side coming into contact with one surface of the second board, so as to maintain a constant distance between the first board and the second board, and an electromagnetic-field shield configured to receive the first board and the second board therein, the electromagnetic-field shield serving to inhibit outward leakage of an electromagnetic-field formed in each board.

Abstract: A camera device and a mobile terminal are provided by the present disclosure. The camera device includes a lens module, a light-guiding tube and a photosensitive sensor; the light-guiding tube is arranged at a periphery of a light-entering hole of the lens module; the light-guiding tube is connected to the photosensitive sensor; and the photosensitive sensor is connected to a circuit board of the lens module.

Abstract: Provided is a solid-state imaging device that includes a first substrate that has one principal surface on which a pixel portion in which pixels are arranged is formed, a second substrate which is bonded to a surface of the first substrate opposed to the one principal surface and in which an opening is provided in a partial region in a surface opposed to a bonding surface to the first substrate is provided. The solid-state imaging device further includes at least one sub-chip inside the opening so as not to protrude from the opening and in which a circuit having a predetermined function is formed.

Abstract: An image capturing apparatus includes a main frame and a lens module, a middle pillar, a module board, a first housing, and a second housing assembled to the main frame respectively. The main frame has a side wall, and the first housing covers the module board. The first housing, the module board, and the middle pillar are located on a same longitudinal axis of the main frame. The first housing and the module board are opposite to the middle pillar with the main frame interposed therebetween. The module board is located between the first housing and the main frame, and the lens module is located on a horizontal axis of the main frame. The first housing and the second housing encapsulate the main frame, and the side wall leans against the first housing and the second housing.

Abstract: A camera module includes a metal yoke, a holder, a plastic barrel, a plurality of plastic lens elements and a plurality of metal conducting elements. The holder is connected to the metal yoke for forming an inner space. The plastic barrel is movably disposed in the inner space and includes at least one buffering part. The plastic lens elements are disposed in the plastic barrel. The metal conducting elements are at least one leaf spring and a wire element, wherein the metal conducting elements are connected to the plastic barrel. Before the at least one buffering part contacts a contacting part of the at least one leaf spring, there is a gap distance between the at least one buffering part and the contacting part of the at least one leaf spring.

Abstract: A photosensitive component, and a camera module and a manufacturing method therefor. The photosensitive component comprises at least a photosensitive element, at least a window-form circuit board and at least a packaging body, wherein the photosensitive element and the window-form circuit board are integrally packaged through the packaging body. The window-form circuit board comprises a circuit board main body which comprises at least one window arranged thereon, wherein the photosensitive element is arranged within the window.

Abstract: The present embodiments relate to a dual camera module comprising: a first camera module including a first lens module and a first image sensor disposed below the first lens module; and a second camera module including a second lens module and a second image sensor disposed below the second lens module, wherein the second camera module has a wider angle of view than the first camera module, and the second image sensor is disposed at a position higher than the first image sensor.

Abstract: A digital camera includes an image shake corrector that moves an imaging element to perform image shake correction, a shutter mechanism that has, at a position adjacent to a light receiving surface of the imaging element of the image shake corrector, an opening through which a member blocking light incident on the light receiving surface passes, an exterior housing that supports the shutter mechanism, and a mount base that supports the image shake corrector, in which the mount base is supported by the exterior housing.

Abstract: The present technology relates to an imaging device, a camera module, and an electronic apparatus that make it possible to reduce a profile of the camera module and to enhance sensitivity. The imaging device includes: a semiconductor substrate in which a light receiving section is formed that includes a plurality of pixels performing photoelectric conversion; and a reinforcing member that is disposed on side of the light receiving section of the semiconductor substrate and includes an opening in which a part opposed to the light receiving section is opened. The present technology is applicable to, for example, an imaging device that captures an image, a camera module that focuses light to capture an image, an electronic apparatus equipped with a camera function, a vehicle control system that is mounted on a vehicle, an endoscopic surgery system that is used in an endoscopic surgery, and the like.

Abstract: One embodiment of a camera module includes: a lens barrel provided with at least one lens; and a lens holder having the lens barrel coupled thereto, wherein the lens barrel may have a first adhesive part formed thereon having the bottom surface thereof facing the top surface of the lens holder and adhered to the lens holder, the lens holder may have a second adhesive part formed thereon having the top surface thereof facing the bottom surface of the lens barrel and adhered to the lens barrel, and a first recessed groove having at least a portion of an adhesive deposited therein may be formed in the second adhesive part.

Abstract: Exemplary cameras may include a housing. The housing may include a forward section defining a forward internal compartment. The housing may include a rear section defining a rear internal compartment. The rear section may include a heat dissipation element. The forward section and the rear section may be separated by an air gap that extends through an entire thickness of the housing. The housing may include a communications conduit coupling the forward internal compartment with the rear internal compartment. The cameras may include an imaging sensor disposed within the forward internal compartment. The cameras may include a processing unit disposed within the rear internal compartment and communicatively coupled with the imaging sensor.

Abstract: For a purpose of simplifying a structure of a light-emitting element while maintaining luminous efficiency of the light-emitting element, the present invention provides a light-emitting element including: a cathode electrode; an anode electrode; a light-emitting layer between the cathode electrode and the anode electrode; an electron transport layer between the light-emitting layer and the cathode electrode; and a hole transport layer between the light-emitting layer and the anode electrode. The light-emitting element further includes a plurality of subpixels for each light emission wavelength of the light-emitting layer, the light-emitting layer and the electron transport layer for each of the plurality of subpixels, and the hole transport layer common to at least the plurality of subpixels.

Abstract: The present disclosure generally relates to printed circuit boards or printed circuit board assemblies for fiber optic communications. In one non-limiting embodiment, a method of assembling an optoelectronic assembly includes providing a printed circuit board with a first metal coating and an optical component with a second metal coating. The method further includes positioning the optical component relative to the printed circuit board with at least some portion of the first metal coating aligned with or adjacent to at least some portion of the second metal coating, and applying solder between the first metal coating and the second metal coating to couple the optical component and the printed circuit board.

Abstract: A chip assembly and a mold assembly for fabricating the same, a camera and an electronic device are disclosed. The chip assembly includes a circuit board, a chip and a conductive wire. The chip is provided to the circuit board, and the chip and the circuit board are in a stacked arrangement. One end of the conductive wire is electrically coupled to the circuit board, the other end of the conductive wire is electrically coupled to the chip, and a partial segment of the conductive wire is attached to a side wall face of the chip.

Abstract: An imaging apparatus includes: a wiring board; an imaging unit that includes a lens module and an imaging element mounted on the wiring board; a housing that assumes a frame shape and includes an opening in the direction of an optical axis of the imaging unit; a top cover placed over the housing; a light source that emits light to travel to the outside through the top cover; and a light guide body that surrounds the lens module and guides the light emitted from the light source, wherein the imaging unit is spaced apart from the top cover by a space, the housing includes a bulging section bulging toward the lens module without being in contact the wiring board, and the bulging section receives a load applied from the top cover via at least the light guide body.

Abstract: An imaging unit includes: an imaging sensor module having a printed wiring board on which an imaging element is provided; a flexible printed circuit board connected to a connecting portion of the printed wiring board; an elastic member provided on a face having the connecting portion of the printed wiring board; and an image stabilization unit having a fixing portion that fixes the flexible printed circuit board, the imaging sensor module is movable with respect to the image stabilization unit, and the elastic member holds the flexible printed circuit board.

Abstract: The disclosure relates to a display device, which includes a cover plate, a backlight unit, a display module disposed between the backlight unit and the cover plate, the display module including a first substrate close to the light exiting side of the backlight unit and a second substrate close to the cover plate, and a camera module arranged on the first substrate, the camera module including an infrared cut-off filter, wherein the first substrate extends horizontally beyond the second substrate and the backlight unit to form a mounting section for the camera module, and the infrared cut-off filter is arranged in the mounting section.

Abstract: A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module comprises two or more camera lenses and a circuit unit. The circuit unit comprises a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.

Abstract: A dual-aperture zoom camera comprising a Wide camera with a respective Wide lens and a Tele camera with a respective Tele lens, the Wide and Tele cameras mounted directly on a single printed circuit board, wherein the Wide and Tele lenses have respective effective focal lengths EFLW and EFLT and respective total track lengths TTLW and TTLT and wherein TTLW/EFLW>1.1 and TTLT/EFLT<1.0. Optionally, the dual-aperture zoom camera may further comprise an optical OIS controller configured to provide a compensation lens movement according to a user-defined zoom factor (ZF) and a camera tilt (CT) through LMV=CT*EFLZF, where EFLZF is a zoom-factor dependent effective focal length.

Abstract: A device for protecting an optical sensor of a driver assistance system for a motor vehicle includes a protective casing, a motor, and a pressure balancing system. The protective device has a movable part and a fixed part. The protective casing forms a cavity that accommodates an optical sensor that includes an optical surface. Additionally, the protective casing freely rotates about an axis and includes an optical element that faces the optical surface of the optical sensor. The motor rotates the protective casing at speeds allowing the optical element to be cleaned by a centrifugal effect. The pressure balancing system includes an air vent orifice allowing fluid communication between the inside and the outside of the protective device. The air vent orifice is produced in the fixed part of the protective device.

Abstract: The present technology relates to a semiconductor device capable of providing a heat-stable optical system, and an electronic apparatus. A semiconductor device is provided, and the semiconductor device includes a sensor and a holding substrate that holds the sensor. In the semiconductor device, (EI×tI)+(ES×tS)>30 and 1.5<CTEI<4.5 are satisfied, where ES (GPa) represents a Young's modulus of the sensor, tS (mm) represents a thickness of the sensor, CTEI (ppm/K) represents a linear expansion coefficient of the holding substrate, EI (GPa) represents a Young's modulus of the holding substrate, and tI (mm) represents a thickness of the holding substrate. The present technology can be applied to a semiconductor package housing an image sensor, for example.

Abstract: The present disclosure provides a camera module and a mobile terminal. The camera module includes: a first camera, a second camera, an optical image stabilization (OIS) chip and a bracket. The first camera and the second camera are embedded in the bracket. A height from a top surface of a lens of the first camera to a bottom surface of the first camera is greater than a height from a top surface of a lens of the second camera to a bottom surface of the second camera. One end of the first camera away from the lens is provided with a first printed circuit board, and the first printed circuit board extends to an outside of the first camera and faces the second camera. The OIS chip is disposed on the first printed circuit board and faces the bottom surface of the second camera; the OIS chip is electrically connected to the first printed circuit board.

Abstract: A vehicular camera assembly includes a front housing portion accommodating a lens, a circuit board having a connecting element, and an electrical connector. The rear housing portion includes a rear attachment portion that has an aperture therethrough. The electrical connector electrically connects a wire harness of the vehicle to the connecting element of the circuit board. The electrical connector includes an electrically conductive element that is electrically conductively connected to a coaxial or shielded wire connecting element of the electrical connector. The rear housing portion includes an electrically conductive element that protrudes through the aperture. As the electrical connector is attached at the rear attachment portion, the electrically conductive element of the rear housing portion engages the electrically conductive element of the electrical connector to establish and maintain electrically conductive connection between the electrically conductive elements.

Abstract: A lens module relieved against the build-up of working heat and any condensation by allowing the release of same comprises a circuit board, a support base, and an optical filter. The support base is fixed on a first surface of the circuit board. The support base defines a through hole configured to receive the optical filter. The support base further defines at least one gas pressure relieving structure. The optical filter and the circuit board seal opposite sides of the support base to form a receiving space. The gas pressure relieving structure allows communication between the receiving space and the exterior such that heat generated in the receiving space is transported out. The lens module is dustproof, waterproof, and can breathe. An electronic device including the lens module is also disclosed.

Abstract: The present invention relates to an apparatus including a base, a hollow receiving element joined to the base, and at least one positioning attachment that positions an imaging device received by the hollow receiving element to capture an image of at least one eye of a user. The present invention also relates to a method of capturing at least one image of at least one eye of a user using the above described apparatus.

Abstract: An image pickup apparatus which is capable of efficiently dispersing heat from a circuit board. A heating element is mounted on the circuit board. A heat transfer member made of a material with higher thermal conductivity than that of a chassis is disposed between the circuit board and the chassis in a direction of an optical axis. First connecting units support the circuit board and the heat transfer member in a stacked manner at a plurality of positions including two positions different from each other in a horizontal direction. A second connecting unit supports the heat transfer member. A third connecting unit supports an exterior member of the image pickup apparatus. Both the second connecting unit and the third connecting unit are provided between the two positions of the first connecting units in the horizontal direction.

Abstract: A camera for a vehicular vision system includes a camera housing having a front camera housing portion and a rear camera housing portion. An imager is disposed at a first side of a printed circuit board. A lens assembly is supported at the front camera housing portion and optically aligned with the imager. At least one attachment element is disposed at the front or rear camera housing portion and has a material having a low CTE that is less than a CTE of the front camera housing portion. The low CTE of the material of the attachment element is less than 10 ppm/° C. The printed circuit board is mounted at the attachment element. The attachment element functions to accommodate temperature-induced movement of the printed circuit board relative to the at least one lens.

Abstract: Broadly speaking, embodiments of the present techniques provide mechanisms for electrically connecting shape memory alloy (SMA) actuator wires of an actuation device to a power or current source via at least one connection element.

Abstract: A wearable camera includes a capturing unit configured to capture video data, a memory configured to store the video data captured by the capturing unit, a plurality of sound collectors that are arranged at different positions of a casing and that are configured to collect a sound and output signals, and a controller that is configured to determine a direction from which the sound is emitted based on a deviation of output timings of the signals and add the direction as attribute information to the video data.

Abstract: Various embodiments of the present application are directed towards image sensors including composite backside illuminated (CBSI) structures to enhance performance. In some embodiments, a first trench isolation structure extends into a backside of a substrate to a first depth and comprises a pair of first trench isolation segments. A photodetector is in the substrate, between and bordering the first trench isolation segments. A second trench isolation structure is between the first trench isolation segments and extends into the backside of the substrate to a second depth less than the first depth. The second trench isolation structure comprises a pair of second trench isolation segments. An absorption enhancement structure overlies the photodetector, between the second trench isolation segments, and is recessed into the backside of the semiconductor substrate. The absorption enhancement structure and the second trench isolation structure collectively define a CBSI structure.