Abstract: An inspecting apparatus is arranged on an electronic component mounting line for inspecting whether a mounting state of the component mounted by a mounting apparatus in a precedent process or a printing state of a cream solder by a cream solder printing apparatus in a precedent process is non-defective or defective.
Type:
Grant
Filed:
June 30, 1993
Date of Patent:
September 10, 1996
Assignee:
Matsushita Electric Industrial Co., Ltd.
Abstract: An apparatus for determining quality of a weld bead of an welded assembly of different metal sheets, wherein a slit beam of light is obliquely thrown on the weld bead to make an illuminated band on an upper surface of the welded assembly. A CCD camera disposed above the welded bead photographs the illuminated band to make an image of the illuminated band. The image is treated in an image pretreatment device so that a surface of a transverse cross section of the weld bead can be expressed in the form of one-dimensional data. Characteristics of the cross section of the weld bead are extracted from the one-dimensional data and are compared with predetermined references in a personal computer so that it is determined whether the weld bead is acceptable. Since the speed of data treatment is high, an on-line and real-time determination of the quality of the weld bead is possible.