Abstract: Apparatus and methods are used to calibrate an array of individually controllable elements within a lithographic apparatus. A calibration unit can switch between a first state in which the modulated beam of radiation passes into a projection system for projecting the modulated beam of radiation onto a substrate and a second state in which a portion of the modulated beam of radiation is inspected by the calibration unit. The calibration unit generates calibration data, or alternatively, updates calibration data, based on the inspection of the modulated beam of radiation. An array controller uses the calibration data to provide control signals to elements of an array of individually controllable elements, which are subsequently configured in response to the control signals.

Abstract: A mirror serves for guiding a radiation bundle. The mirror has a basic body and a coating of a reflective surface of the basic body, the coating increasing the reflectivity of the mirror. A heat dissipating device serves for dissipating heat deposited in the coating. The heat dissipating device has at least one Peltier element. The coating is applied directly on the Peltier element. A temperature setting apparatus has at least one temperature sensor for a temperature of the reflective surface. A regulating device of the Temperature setting apparatus can be connected to the at least one Peltier element and is signal-connected to the at least one temperature sensor. The result is a mirror in which a heat dissipating capacity of the heat dissipating device is improved.

Abstract: The present invention provides a detection apparatus for detecting a foreign particle on a substrate, including a plate having a first pattern on a first face, a second pattern laid out on a second face different from the first face, a driving mechanism configured to bring the substrate and the plate into contact with each other, a measurement unit configured to measure a relative position deviation between the first pattern and the second pattern in a state in which the substrate and the plate are in contact with each other, and a processing unit configured to execute processing for detecting a foreign particle on the substrate based on the position deviation measured by the measurement unit.

Abstract: The present invention provides a holding apparatus which includes a base having, on a surface thereof, a convex portion for supporting a back surface of a substrate and a containing portion for containing a liquid, and supports the substrate via the convex portion and the liquid, the apparatus including a heat storage structure including a latent heat storage member configured to store heat transferred from the substrate, and arranged in the containing portion, and a member configured to exert, to the heat storage structure, a force in a first direction from the base to the substrate.

Abstract: A stage apparatus has a base; a movable portion including a stage movable relative to the base; a flexible utility line for supplying utility to the movable portion; and a cover for covering the utility line, the cover including: a housing member provided to one of the base and the movable portion, in which an opening is formed; and a sealing member provided to the other of the base and the movable portion, which is arranged opposite to a side, in which the opening is formed, of the housing member with a gap therebetween, and has a side for sealing the opening.

Abstract: A fluid handling structure to confine immersion liquid in a space between a projection system and a facing surface of a substrate, of a table to support the substrate, or both, is disclosed. The fluid handling structure includes a transponder to dissolve at least some of the gas in a bubble in the immersion liquid or to control a bubble in the immersion liquid so that it avoids entering an optical path of a beam from the projection system.

Abstract: When a transition from a first state where one stage is positioned at a first area directly below projection optical system to which liquid is supplied to a state where the other stage-is positioned at the first area, both stages are simultaneously driven while a state where both stages are close together in the X-axis direction is maintained. Therefore, it becomes possible to make a transition from the first state to the second state in a state where liquid is supplied in the space between the projection optical system and the specific stage directly under the projection optical system. Accordingly, the time from the completion of exposure operation on one stage side until the exposure operation begins on the other stage side can be reduced, which allows processing with high throughput. Further, because the liquid can constantly exist on the image plane side of the projection optical system, generation of water marks on optical members of the projection optical system on the image plane side is prevented.

Abstract: In an immersion lithography apparatus or device manufacturing method, the position of focus of the projected image is changed during imaging to increase focus latitude. In an embodiment, the focus may be varied using the liquid supply system of the immersion lithographic apparatus.

Abstract: The invention relates to a method for determining a suppression factor of a suppression system. The suppression system is arranged to suppress migration of a contaminant gas out of a first system. The suppression factor is an indication of the performance of the suppression system. The method includes introducing a tracer gas in the sub-system, providing a detection system configured to detect the amount of tracer gas that has migrated out of the first system, determining a first suppression factor for the suppression system for the tracer gas. The method further includes determining a second suppression factor for the suppression system for the contaminant gas based on the first suppression factor.

Abstract: An exposure method exposes a substrate by projecting an image of a pattern onto the substrate through a liquid by using a projection optical system while moving the substrate in a predetermined direction. A temperature distribution of the liquid in a direction intersecting the predetermined direction is measured. A projection state of the image of the pattern is adjusted on the basis of information about the measured temperature distribution. The substrate is exposed to the image of the pattern in the projection state.

Abstract: An immersion lithography apparatus comprises a temperature controller configured to adjust a temperature of a projection system, a substrate and a liquid towards a common target temperature. Controlling the temperature of these elements and reducing temperature gradients may improve imaging consistency and general lithographic performance. Measures to control the temperature may include controlling the immersion liquid flow rate and liquid temperature, for example, via a feedback circuit.

Abstract: A method and apparatus for ultraviolet (UV) and extreme ultraviolet (EUV) lithography patterning is provided. A UV or EUV light beam is generated and directed to the surface of a substrate disposed on a stage and coated with photoresist. A laminar flow of a layer of inert gas is directed across and in close proximity to the substrate surface coated with photoresist during the exposure, i.e. lithography operation. The inert gas is exhausted quickly and includes a short resonance time at the exposure location. The inert gas flow prevents flue gasses and other contaminants produced by outgassing of the photoresist, to precipitate on and contaminate other features of the lithography apparatus.

Abstract: Provided are a lithography apparatus, a method for lithography and a stage system. The lithography apparatus includes a reticle stage having a reticle, at least one nozzle on at least one surface of the reticle stage and configured to allow shielding gas to flow to a surface of the reticle to form an air curtain, and a gas supply unit configured to supply the nozzle with the shielding gas.

Abstract: An exposure apparatus includes a nozzle member which has at least one of a supply port for supplying a liquid and a recovery port for recovering the liquid, and a nozzle adjusting mechanism which adjusts at least one of a position and a posture of the nozzle member depending on a position or a posture of a substrate. The exposure apparatus forms an immersion area of the liquid on the substrate, and performs exposure for the substrate through the liquid in the immersion area. Accordingly, the liquid is satisfactorily retained between the projection optical system and the substrate, thereby making it possible to realize the exposure highly accurately.

Abstract: An immersion liquid is supplied to a space between a projection system and a substrate, and a patterned beam of radiation is projected through the liquid onto a target portion of the substrate using the projection system. A liquid retaining member is replaced with a table member that holds the substrate at an opposite position to the projection system while the liquid is maintained in contact with the projection system so as to transit from a first state to a second state, the first state in which the liquid is maintained between the projection system and the liquid retaining member, the second state in which the liquid is maintained between the projection system and the table member.

Abstract: There is provided an immersion type lithographic apparatus. The immersion type lithographic apparatus is provided with at least one immersion space and an immersion system configured to at least partially fill the immersion space with a liquid. The apparatus is configured to rinse at least part of the immersion space with a rinsing liquid before the apparatus is used to project a patterned beam of radiation onto a substrate, and the apparatus is configured to move a substrate holder with respect to a projection system during the rinsing, such that the position of the immersion space changes with respect to the substrate holder during the rinsing.

Abstract: The invention relates to a lithography system, for example for projecting an image or an image pattern on to a target (1) such as a wafer, said target being included in said system by means of a target table (2), clamping means being present for clamping said target on said table. Said clamping means comprises a layer of stationary liquid (3), included at such thickness between target and target table that, provided the material of the liquid (C) and of the respective contacting faces (A, B) of the target (1) and target table (2), a pressure drop (PCap) arises.

Abstract: A substrate table of an immersion lithographic apparatus is disclosed which comprises a barrier configured to collect liquid. The barrier surrounds the substrate and is spaced apart from the substrate. In this way any liquid which is spilt from the liquid supply system can be collected to reduce the risk of contamination of delicate components of the lithographic projection apparatus.

Abstract: A lithographic apparatus is arranged to project a pattern from a patterning device onto a substrate through a liquid confined in a space adjacent the substrate. The apparatus includes a structure substantially parallel to a surface of a substrate table configured to hold the substrate, to divide the space into two parts. The structure has an aperture to allow transmission of the pattern and a recess at the bottom side of the structure to extract a fluid from the space.

Abstract: A lithographic projection apparatus includes a substrate table to hold a substrate, a projection system to project a patterned beam of radiation onto the substrate and a liquid confinement structure to confine a liquid in a space between the projection system and the substrate, the substrate, the substrate table, or both, to form a part of a boundary of the space. In addition, a closing plate forms a part of a boundary of the space in place of the substrate, the substrate table, or both, when moved without substantially disturbing the liquid, the liquid confinement structure, or both.

Abstract: A lithographic apparatus is provided that includes a substrate holder configured to hold a substrate, and a heat pipe to maintain the substrate holder at a substantially uniform temperature. The heat pipe has a chamber containing a liquid reservoir and a vapor space, and a heating element at least partly in contact with liquid in the chamber.

Abstract: A substrate processing method for a substrate having a photosensitive film on a top surface thereof, includes cleaning a back surface of the substrate after the formation of the photosensitive film and before exposure processing; transporting the substrate to a temperature adjuster such as a cooling unit, while holding the substrate with a first holder; adjusting a temperature of the substrate with the temperature adjuster; transporting the substrate from the temperature adjuster to the exposure device with a second holder; and transporting the substrate after the exposure processing to a first platform while holding the substrate with a third holder.

Abstract: An exposure apparatus EXS forms an immersion area AR2 of a liquid LQ on the side of the image plane of a projection optical system PL and performs exposure of a substrate P via the projection optical system PL and the liquid LQ of the immersion region AR2. The exposure apparatus EXS has an optical cleaning unit (80) which irradiates a predetermined irradiation light Lu, having an optical cleaning effect, onto, for example, the upper surface (31) of the substrate stage PST which makes contact with the liquid LQ for forming the immersion area AR2. Thus, it is possible to prevent deterioration of the exposure accuracy and measurement accuracy due to pollution of the member in contact with the liquid in the immersion region.

Abstract: In EUV lithography apparatuses (10), it is proposed, in order to lengthen the lifetime of contamination-sensitive components, to arrange them in a protection module. The protection module comprises a housing (23-29) having at least one opening (37-47), in which at least one component (13a, 13b, 15, 16, 18, 19) is arranged and at which one or more gas feeds (30-36) are provided in order to introduce a gas flow into the housing (23-29), which emerges through the at least one opening (37-47). In order to effectively prevent contaminating substances from penetrating into the protection module, a light source (48-56) is arranged at the at least one opening (37-47), which light source illuminates the opening (37-47) with one or more wavelengths by which the contaminating substances can be dissociated before they penetrate through the opening (37-47).

Abstract: A device serves for controlling temperature of an optical element provided in vacuum atmosphere. The device has a cooling apparatus having a radiational cooling part, arranged apart from the optical element, for cooling the optical element by radiation heat transfer. A controller serves for controlling temperature of the radiational cooling part. Further, the device comprises a heating part for heating the optical element. The heating part is connected to the controller for controlling the temperature of the heating part. The resulting device for controlling temperature in particular can be used with an optical element in a EUV microlithography tool leading to a stable performance of its optics.

Abstract: A liquid confinement system for use in immersion lithography is disclosed in which the meniscus of liquid between the liquid confinement system and the substrate is pinned substantially in place by a meniscus pinning feature. The meniscus pinning feature comprises a plurality of discrete outlets arranged in a polygonal shape.

Abstract: A reticle for lens heating mitigation includes a substrate, a target pattern and a redistributive pattern. The substrate includes a live pattern region and the target pattern is disposed within the live pattern region for constructing the target pattern onto a wafer. The redistributive pattern is also disposed within the live pattern region for redistributing energy onto a lens without being printed onto the wafer and without correcting said target pattern to be printed onto the wafer.

Abstract: An exposure apparatus and method exposes a substrate via a projection optical system and liquid. A liquid immersion member having a lower surface and a recovery port at its lower surface side supplies liquid to form a liquid immersion region below the projection optical system and recovers the liquid via the recovery port. First and second tables, on which a substrate is mountable, are positionable opposite to the lower surface of the liquid immersion member. A drive system moves the first and second tables below the projection optical system relative to the liquid immersion member to replace one of the tables positioned opposite to the lower surface of the liquid immersion member with the other of the tables, whereby the liquid immersion region is transferred from the one to the other of the tables while the liquid immersion region is maintained below and in contact with the projection optical system.

Abstract: A lithographic projection apparatus projects a pattern from a patterning device onto a substrate using a projection system. The apparatus has a liquid supply system to supply a liquid to a space between the projection system and the substrate. The apparatus also has a fluid removal system including a chamber to hold liquid and having an open end adjacent to a volume in which fluid will be present. The open end removes, through a pressure differential across-the open end when liquid is present in the chamber, substantially only liquid from the volume when liquid in the volume is adjacent to the open end but not gas from the volume when gas in the volume is adjacent to the open end.

Abstract: A lithographic apparatus is disclosed that includes an encoder type sensor system configured to measure a position of a substrate table of the lithographic apparatus relative to a reference structure. The encoder type sensor system includes an encoder sensor head and an encoder sensor target and the lithographic apparatus comprises a recess to accommodate the encoder sensor target.

Abstract: A lithographic projection apparatus is disclosed in which measures are taken to prevent or reduce the presence of bubbles in liquid through which the projection beam radiates. This may be done, for example, by ensuring that a gap between a substrate and a substrate table is filled with immersion liquid or by causing a localized flow radially outwardly from the optical axis in the vicinity of the edge of the substrate.

Abstract: A lithographic apparatus includes a source configured to generate a radiation beam comprising desired radiation and undesired radiation using a plasma, an illumination system configured to condition the radiation beam and to receive hydrogen gas during operation of the lithographic apparatus, and a support structure constructed to hold a patterning device. The patterning device is capable of imparting the radiation beam with a pattern in its cross-section to form a patterned radiation beam. A substrate table is constructed to hold a substrate, and a projection system is configured to project the patterned radiation beam onto a target portion of the substrate. The lithographic apparatus is configured such that the radiation beam on entering the projection system includes at least 50% of the undesired radiation that is generated by the plasma and includes wavelengths of radiation that interact with the hydrogen gas to generate hydrogen radicals.

Abstract: A method and an apparatus to protect a reticle against particles and chemicals in an actinic EUV reticle inspection tool are presented. The method and apparatus utilizes a pair of porous metal diffusers in the form of showerheads to provide a continual flow of clean gas. The main showerhead bathes the reticle surface to be inspected in smoothly flowing, low pressure gas, isolating it from particles coming from surrounding volumes. The secondary showerhead faces away from the reticle and toward the EUV illumination and projection optics, supplying them with purge gas while at the same time creating a buffer zone that is kept free of any particle contamination originating from those optics.

Abstract: An immersion lithographic apparatus is disclosed that includes a fluid confinement system configured to confine fluid to a space between a projection system and a substrate. The fluid confinement system includes a fluid inlet to supply fluid, the fluid inlet connected to an inlet port and an outlet port. The immersion lithographic apparatus further includes a fluid supply system configured to control fluid flow through the fluid inlet by varying the flow rate of fluid provided to the inlet port and the flow rate of fluid removed from the outlet port.

Abstract: A pellicle frame is mechanically attached to a reticle, without use of an adhesive. An embodiment includes mechanically attaching a pellicle frame to a front surface of a reticle, removing the pellicle frame from the reticle, cleaning the reticle, and mechanically reattaching the pellicle frame to the reticle. Embodiments further include using a clamp to mechanically attach the pellicle frame to the reticle. Embodiments further include forming the pellicle frame with a flange having an opening in the center, and forming the clamp with two portions, one portion with a protrusion that fittingly engages the opening in the flange and with a second opening, and the second portion with a segment that extends behind the reticle and with a second protrusion that fittingly engages the second opening.

Abstract: An immersion lithographic apparatus is disclosed in which a gas knife is shaped and a liquid removal device is positioned to improve removal of liquid from the surface of the substrate.

Abstract: In a lithographic method, a characteristic of a projection system is measured before and after periods of heating (exposures) and cooling to provide data to calibrate a model of lens heating. The model has a part modeling the effect of cooling and a part modeling the effect of heating on the characteristic.

Abstract: A gas manifold to direct a gas flow between two parallel plates of an optical component of a lithographic apparatus, the gas manifold having an inlet to provide a gas flow to the gas manifold, a lattice comprising a plurality of through holes to homogenize the gas flow, a contractor downstream of the lattice to reduce the cross sectional area through which the gas flow flows, and an outlet downstream of the contractor to provide the gas flow to the two parallel plates.

Abstract: A method of removing liquid from a substrate supported on a substrate table and from a gap between the substrate and the substrate table includes: providing a liquid removal device with at least one outlet connected to an under pressure source, the outlet forming an elongated extractor of a predetermined geometry; relatively moving the substrate table and the liquid removal device such that the extractor is adapted to pass over all of the substrate and gap and such that substantially at any given time any local part of the extractor at the edge of a non-dried portion of the gap has, in a plane, its local tangent orientated at an angle of between about 35° and 90° to the local tangent of the gap.

Abstract: An exposure apparatus includes a nozzle member which has at least one of a supply port for supplying a liquid and a recovery port for recovering the liquid, and a nozzle adjusting mechanism which adjusts at least one of a position and a posture of the nozzle member depending on a position or a posture of a substrate. The exposure apparatus forms an immersion area of the liquid on the substrate, and performs exposure for the substrate through the liquid in the immersion area. Accordingly, the liquid is satisfactorily retained between the projection optical system and the substrate, thereby making it possible to realize the exposure highly accurately.

Abstract: A gas gauge (100) is provided for use in a vacuum environment having a measurement gas flow channel (105). The gas gauge comprises a measurement nozzle (110) in the measurement gas flow channel (105). The measurement nozzle (110) is configured to operate at a sonically choked flow condition of a volumetric flow being sourced from a gas supply (120) coupled to the measurement gas flow channel (105). The gas gauge (100) further comprises a pressure sensor (127) operatively coupled to the measurement gas flow channel (105) downstream from the sonically choked flow condition of the volumetric flow to measure a differential pressure of the volumetric flow for providing an indication of a gap (130) between a distal end of the measurement nozzle (135) and a target surface (140) proximal thereto.

Abstract: A gas manifold to direct a gas flow between two plates of an optical component of a lithographic apparatus, the gas manifold having an inlet, a diffuser downstream of the inlet, a flow straightener downstream of the inlet, a contractor downstream of the flow straightener, and an outlet downstream of the contractor.

Abstract: A immersion lithographic apparatus is disclosed in which one or more liquid diverters are positioned in a space surrounded by a liquid confinement structure. A function of the liquid diverter(s) is to hinder the formation of one or more recirculation zones of immersion liquid which may lead to variations in refractive index of the immersion liquid in the space and thereby imaging errors.

Abstract: An immersion lithography apparatus that includes a substrate holder on which a substrate is held, a projection system having a final optical element and that projects an exposure beam onto the substrate through an immersion liquid, and a liquid confinement member having an aperture through which the exposure beam is projected, a lower surface including a non-fluid removal area surrounding the aperture, and a liquid recovery outlet from which the immersion liquid is recovered, also includes a movable member. The movable member is movable relative to the liquid confinement member in a substantially horizontal direction, and has an opening through which the exposure beam is projected. The movable member has upper and lower surfaces that surround the opening, and is movable while a portion of the upper surface faces the non-fluid removal area in the lower surface of the liquid confinement member.

Abstract: A liquid immersion photolithography system includes an exposure system that exposes a substrate with electromagnetic radiation and includes a projection optical system that focuses the electromagnetic radiation on the substrate. A liquid supply system provides liquid flow between the projection optical system and the substrate. A liquid confinement structure of the liquid supply system confines the liquid to a space adjacent the substrate at least during projection of the pattern, the liquid confinement structure including an extractor to remove liquid from the space, the extractor including a two dimensional array of extraction openings.

Abstract: An immersion lithography apparatus and a cleanup method used for the immersion lithography apparatus in which an immersion liquid is supplied from a liquid supply member to a gap between an optical element of a projection optics and a workpiece during an immersion lithography process. A surface of an object, which is different from the workpiece, is provided such that the surface of the object and the optical element are opposite to each other. During a cleanup process, a cleaning liquid is supplied from the liquid supply member onto the surface of the object.

Abstract: A liquid immersion exposure apparatus includes an optical system via which a substrate is exposed with an exposure beam, and a cleaning device which performs a cleaning operation by filling a space adjacent the optical system with a liquid including bubbles.

Abstract: Disclosed are cooling apparatus and methods of cooling a template. The cooling apparatus includes a reticle and an optical cooling material. The reticle includes patterning for at least partially reflecting patterning radiation incident on a first side of the reticle. The optical cooling material is in thermally-conductive coupling with the reticle mount and is configured to produce cooling when exposed to a laser radiation. More particularly, the optical cooling material includes a glass material that exhibits anti-Stokes fluorescence that produces cooling of the glass material when exposed to an infrared laser beam. In some embodiments, the cooling apparatus may be incorporated with a reticle mount. The reticle mount is in thermally-conductive coupling with a second side of the reticle.

Abstract: According to one embodiment, an EUV exposure apparatus includes a mirror which reflects an EUV light beam irradiated from a light source and a wafer stage which is irradiated with the EUV light beam reflected by the mirror. When exposure of a first wafer is to be performed, the first wafer is mounted on the wafer stage, and the wafer stage allows the first wafer to be irradiated with the EUV light beam. In addition, when cleaning of the mirror is to be performed, the EUV light beam is reflected by a reflection substrate, and the wafer stage allows the mirror to be irradiated with the reflected light beam.

Abstract: An exposure apparatus which projects exposure light from a pattern of an illuminated original onto a substrate, comprises a projection system including an optical element and configured to project the exposure light onto the substrate, an enclosure configured to enclose the projection system, and a cleaning mechanism configured to clean the optical element by irradiating the optical element with ultraviolet light under an environment in which oxygen is present within the enclosure, the cleaning mechanism including a light source configured to generate ultraviolet light, a tubular member including an exit window and configured to partially enclose an optical path between the light source and the optical element, and a regulating device configured to regulate an environment of a space inside the tubular member so that a partial pressure of oxygen becomes lower in the space inside the tubular member than in a space which is outside the tubular member.