Abstract: A field deployable optical assembly for use in testing a light-responsive sample is disclosed. The assembly includes a microfluidic device, a first optical package, and a second optical package. The first optical package includes a light emitting diode (LED), a first optical device, and a first light-path control, the first optical package configured to guide and focus light from the LED onto the sample. The microfluidic device includes a tethered control substance. In response to a substance within the sample being associated with, and attaching to, the tethered control, the sample emits light. The second optical package includes a photo sensor, a second optical device, and a second light-path control, the second optical package configured to guide and focus the light emitted from the sample onto the photo sensor.

Abstract: A test piece for an optoelectronic image analysis systems is disclosed. One embodiment has a planar substrate, on which a plurality of geometrical patterns of differing shapes and/or sizes are arranged in a durable, predetermined surface coverage. The geometrical patterns contrast optically against the substrate. The surface coverage of geometrical patterns on the substrate is provided such that an overlapping of the geometrical patterns is avoided. In addition, a method of fabrication of a test piece is provided, in which a metal film is deposited on a glass/ceramic substrate, subsequently the metal film is exposed according to a predetermined pattern, and finally the film is etched to create the geometrical pattern on the glass/ceramic substrate.

Abstract: Methods for forming calibration standards for an inspection system and calibration standards are provided. One method includes scanning a first and a second specimen with an optical system. Master standard particles having a lateral dimension traceable to a national or international authority or first principles measurements are deposited on the first specimen. Product standard particles are deposited on the second specimen. In addition, the method includes determining a lateral dimension of the product standard particles by comparing data generated by scanning the two specimens. One calibration standard includes particles having a lateral dimension of less than about 100 nm deposited on a specimen. A distribution of the lateral dimension has a full width at half maximum of less than about 3%. The uncertainty of the lateral dimension is less than about 2%. Therefore, the standard meets the requirements for the 130 nm technology generation of semiconductor devices.

Abstract: Methods of manufacturing calibration wafers by forming a first layer of a material on a layer of a substrate material. In a first embodiment, calibration spheres are deposited on the first layer of material followed by an etch process that removes exposed portions of the first layer of a material. The calibration spheres are removed leaving pillars of the first layer of a material formed on the layer of a substrate material. The calibration spheres can be of various sizes forming pillars of various sizes. The calibration wafer with the various size pillars is scanned in a scan tool to determine the scan tool sensitivity. In a second embodiment, a layer of a second material is deposited on and around the various size pillars forming bumps over the various size pillars.

Abstract: A method of controllably adding at least one contaminant to a surface of a silicon wafer. The method includes providing a solution containing a known concentration of one or more contaminants and having a known pH. The solution is applied to a surface of a silicon wafer and allowed to remain there for a predetermined period of time so that the one or more contaminants adsorb to the wafer surface. The solution is then removed while leaving the adsorbed one or more contaminants on the surface.