Abstract: A pattern detection method and apparatus for inspecting, with high resolution, a micro fine defect of a pattern on an inspected object, and a semiconductor substrate manufacturing method and system with a high yield. A micro fine pattern on the inspected object is inspected by annular-looped illumination through an objective lens onto a wafer, the wafer having micro fine patterns thereon. The illumination may be polarized and controlled according to an image detected on the pupil of the objective lens, and image signals are obtained by detecting a reflected light from the wafer. The image signals are compared with reference image signals and a part of the pattern showing inconsistency is detected as a defect. Simultaneously, micro fine defects on the micro-fine pattern are detected with high resolution. Further, process conditions of a manufacturing line are controlled by analyzing a cause of defect and a factor of defect.

Abstract: Disclosed is a process for analyzing the surface characteristics of opaque materials. The method comprises in one embodiment the use of a UV reflectometer to build a calibration matrix of data from a set of control samples and correlating a desired surface characteristic such as roughness or surface area to the set of reflectances of the control samples. The UV reflectometer is then used to measure the reflectances of a test sample of unknown surface characteristics. Reflectances are taken at a variety of angles of reflection for a variety of wavelengths, preferably between about 250 nanometers to about 400 nanometers. These reflectances are then compared against the reflectances of the calibration matrix in order to correlate the closest data in the calibration matrix. By so doing, a variety of information is thereby concluded, due to the broad spectrum of wavelengths and angles of reflection used.

Abstract: Inspection method, apparatus, and system for a circuit pattern, in which when various conditions which are necessary in case of inspecting a fine circuit pattern by using an image formed by irradiating white light, a laser beam, or a charged particle beam are set, its operating efficiency can be improved. An inspection target region of an inspection-subject substrate is displayed, and a designated map picture plane and an image of an optical microscope or an electron beam microscope of a designated region are displayed in parallel, thereby enabling a defect distribution and a defect image to be simultaneously seen. Item names of inspecting conditions and a picture plane to display, input, or instruct the contents of the inspecting conditions are integrated, those contents are overlapped to the picture plane and layer-displayed, and all of the item names are displayed in parallel in a tab format in the upper portion of the picture plane of the contents.

Abstract: A method and inspection system to inspect a first pattern on a specimen for defects against a second pattern that is intended to be the same where the second pattern has known responses to at least one probe. The inspection is performed by applying at least one probe to a point of the first pattern on the specimen to generate at least two responses from the specimen. Then the first and second responses are detected from the first pattern, and each of those responses is then compared with the corresponding response from the same point of the second pattern to develop first and second response difference signals. Those first and second response difference signals are then processed together to unilaterally determine a first pattern defect list.

Abstract: A test slide for the calibration, characterization, standardization, use and study of photon and electron microscopes. The slide is created by forming patterns with specific types of geometries on suitable substrates and these slides provide a standard for comparison of image forming capability of any type of microscope imaging system including, without limitation, light, UV, and X-ray photon microscopical imaging systems operating in transmission or reflection modes, and other microscope techniques. Microscopists can employ one of these slides to compare images of the slide which have been produced by the microscope system under consideration with a known, accurate, image of the slide to better understand the fidelity and accuracy of the microscope system under consideration. The test patterns can also comprise reference images which can be images created by a graphic artist or the like or which can be actual images of samples, these images being either two dimensional or three dimensional.

Abstract: The present invention relates to circuit defect detection, classification, and review in the wafer stage of the integrated circuit semiconductor device manufacturing process. The method of processing integrated circuit semiconductor dice on a wafer in a manufacturing process for dice comprises the steps of visually inspecting the dice on the wafer to determine defects thereon, summarizing the number, types, and ranges of sizes of the defects of the dice on the wafer, and determining if the wafer is acceptable to proceed in the manufacturing process.

Abstract: A method of analysing powder formed as a mixture of pharmaceutical ingredients and derived from a bulk preparation of powder by spectrophotometric analysis utilising transmission measurements. A sample powder is removed from the bulk mixture and pressed into a test wafer and spectrophotometrically analysed for the transmitted beam to provide an assay test spectrum of actual absorption characteristics of ingredients in the material of the wafer. These characteristics of the assay test spectrum are compared with predetermined assay standard spectra determined from individual standard wafers for each relevant ingredient in the powder mixture by measuring absorption characteristics of the individual ingredients from the transmitted beam at known wavelengths of the beam to assess acceptability of the homogenity and distribution of the relevant ingredient in the powder of the sample. The wafer is preferably pressed with flat and parallel opposed end faces through which the beam is directed.

Abstract: A system for obtaining, recording, displaying, storing, transmitting and receiving maintenance and other information is provided. The system, which may include an electronic maintenance apparatus that may be in the form of a hand-held digital computer, allows a user to capture and store images, sound, and/or error codes and related text or voice data and other information concerning the system or object being maintained. The information can be stored locally and/or transmitted to remote locations. Retrieval of the images and other data at a later date provides an historical perspective of the object, enabling one using the maintenance apparatus to compare and contrast the condition of the object over time. Instruction on how to accomplish a job at hand, diagnostic information and/or support information may also be transmitted to and from the maintenance apparatus.

Abstract: In a device and method for detecting the position of components and/or for checking the position of terminals of components, and an insertion head with such a device for detecting the position of components and/or for checking the position of terminals of components, the components are illuminated with vertically incident light, with multi-directional, obliquely incident light, and with horizontally incident light, so that the side surfaces of the components, and thus the projecting terminals as well are sufficiently illuminated. For the horizontal illumination, a light deflection element is employed wherein light is emitted by a light source into the light deflection element, is reflected at a first outer wall of the light deflection element, and is directed into an opening of the light deflection element in which the component is disposed.

Abstract: The invention provides an apparatus and method for imaging markings on cartridge cases. It provides for the taking of two images of the cartridge case with light for illumination projected at the cartridge case from two different predetermined angles. In a first version, two different light sources are set at the two different predetermined angles. In a second version, one light source is moved between two different positions to project light at the two different predetermined angles. In a third version, the device holding the cartridge case is rotated between two different positions so light projects at the cartridge case from the two different predetermined angles. In a fourth version, the holding device rotates the cartridge case between two different positions so that light projects at the cartridge case at the two different predetermined angles. In another aspect, the invention provides diffuse light for the taking of the images.

Abstract: A method for detecting phase features or phase defects on photomasks for optical lithography is described. The asymmetric imaging behavior through focus of defects or features with a phase other than 0° or 180° is used to distinguish them from other features on the mask. The mask is inspected at equally spaced positions about an optimum focus in both positive and negative directions. The images are subtracted from one another to produce a differential image of the mask. While opaque features as well as transmitting features at 0° and 180° behave identically at positive and negative defocus, thus leading to a zero-valued differential image, the focus asymmetry of phase defects and features produces a non-zero differential image from which these phase defects and features can be located.

Abstract: The invention relates to a method for measuring particles in suspension and a measuring instrument. In the solution the length of each fiber-like particle in suspension is one by one optically measured by a line camera in a thin equilateral capillary tube. The fiber-like particles in particular are imaged by two or more cameras in the capillary tube one or more times for measuring such properties as fiber thickness, wall-thickness and fibrillation.

Abstract: A surface inspection apparatus is provided which uses at least two sets of surface inspection systems each comprising with a paired surface illumination device (A1, B1) and detection device (A2, B2), with each set of illumination devices and detection devices creating their own irradiation regions (51A, 51B) and detection regions (23A,23B), in which the irradiation and detection regions of one pair of illumination and detection devices does not over lap the illumination and detection regions of the adjacent pair of illumination and detection devices. The surface illumination devices preferably project light at an angle of 80° or more with respect to a normal to the surface being inspected (21). The detection devices detect light scattered by dust or defects on the surface to be inspected. The surface to be inspected can be moved in a direction perpendicular to the direction of the illumination and detection regions on the surface being inspected. Thus, the entire surface can be inspected.

Abstract: A method of photomask inspection uses available technology in a novel fashion to detect defects on a photomask. The method involves inspecting a photomask using a modified microscope, image comparison software, and a CCD camera. The microscope is modified to view the photomask out of focus and at low magnifications. The photomask may be scanned at multiple focuses to implement the inspection. This image is then compared with a reference image, such as an image from another die or a database. Any discrepancies between the images indicate a defect in the photomask. Alternatively, the photomask is inspected using a low magnification, low NA objective in dark field image of the optical microscope.

Abstract: Inspection method, apparatus, and system for a circuit pattern, in which when various conditions which are necessary in case of inspecting a fine circuit pattern by using an image formed by irradiating white light, a laser beam, or a charged particle beam are set, its operating efficiency can be improved. An inspection target region of an inspection-subject substrate is displayed, and a designated map picture plane and an image of an optical microscope or an electron beam microscope of a designated region are displayed in parallel, thereby enabling a defect distribution and a defect image to be simultaneously seen. Item names of inspecting conditions and a picture plane to display, input, or instruct the contents of the inspecting conditions are integrated, those contents are overlapped to the picture plane and layer-displayed, and all of the item names are displayed in parallel in a tab format in the upper portion of the picture plane of the contents.

Abstract: Inspection method, apparatus, and system for a circuit pattern, in which when various conditions which are necessary in case of inspecting a fine circuit pattern by using an image formed by irradiating white light, a laser beam, or a charged particle beam are set, its operating efficiency can be improved. An inspection target region of an inspection-subject substrate is displayed, and a designated map picture plane and an image of an optical microscope or an electron beam microscope of a designated region are displayed in parallel, thereby enabling a defect distribution and a defect image to be simultaneously seen. Item names of inspecting conditions and a picture plane to display, input, or instruct the contents of the inspecting conditions are integrated, those contents are overlapped to the picture plane and layer-displayed, and all of the item names are displayed in parallel in a tab format in the upper portion of the picture plane of the contents.

Abstract: The broadband brightfield/darkfield wafer inspection system provided receives broadband brightfield illumination information via a defect detector, which signals for initiation of darkfield illumination. The defect detector forms a two dimensional histogram of the defect data and a dual mode defect decision algorithm and post processor assess defects. Darkfield radiation is provided by two adjustable height laser beams which illuminate the surface of the wafer from approximately 6 to 39 degrees. Each laser is oriented at an azimuth angle 45 degrees from the orientation of the Manhattan geometry on the wafer, and 90 degrees in azimuth from one another. Vertical angular adjustability is provided by modifying cylindrical lens position to compensate for angular mirror change by translating an adjustable mirror, positioning the illumination spot into the sensor field of view, rotating and subsequently moving the cylindrical lens.

Abstract: A method is described for characterizing defects on a test surface of a semiconductor wafer using a confocal-microscope-based automatic defect characterization (ADC) system. The surface to be tested and a reference surface are scanned using a confocal microscope to obtain three-dimensional images of the test and reference surfaces. The test and reference images are converted into sets of geometric constructs, or “primitives,” that are used to approximate features of the images. Next, the sets of test and reference primitives are compared to determine whether the set of test primitives is different from the set of reference primitives. If such a difference a exists, then the difference data is used to generate defect parameters, which are then compared to a knowledge base of defect reference data. Based on this comparison, the ADC system characterizes the defect and estimates a degree of confidence in the characterization.

Abstract: Inspection method, apparatus, and system for a circuit pattern, in which when various conditions which are necessary in case of inspecting a fine circuit pattern by using an image formed by irradiating white light, a laser beam, or a charged particle beam are set, its operating efficiency can be improved. An inspection target region of an inspection-subject substrate is displayed, and a designated map picture plane and an image of an optical microscope or an electron beam microscope of a designated region are displayed in parallel, thereby enabling a defect distribution and a defect image to be simultaneously seen. Item names of inspecting conditions and a picture plane to display, input, or instruct the contents of the inspecting conditions are integrated, those contents are overlapped to the picture plane and layer-displayed, and all of the item names are displayed in parallel in a tab format in the upper portion of the picture plane of the contents.

Abstract: Inspection method, apparatus, and system for a circuit pattern, in which when various conditions which are necessary in case of inspecting a fine circuit pattern by using an image formed by irradiating white light, a laser beam, or a charged particle beam are set, its operating efficiency can be improved. An inspection target region of an inspection-subject substrate is displayed, and a designated map picture plane and an image of an optical microscope or an electron beam microscope of a designated region are displayed in parallel, thereby enabling a defect distribution and a defect image to be simultaneously seen. Item names of inspecting conditions and a picture plane to display, input, or instruct the contents of the inspecting conditions are integrated, those contents are overlapped to the picture plane and layer-displayed, and all of the item names are displayed in parallel in a tab format in the upper portion of the picture plane of the contents.

Abstract: A surface inspection system is provided for detecting defects on a surface of a workpiece. The surface inspection system includes a diffused light source for emitting an elongated line of light onto the surface of the workpiece, a movable member for translating the workpiece in relation to the light source, an imaging device positioned at a vantage point such that the line of light is within its field of observation for capturing two or more sets of image data representative of a portion of the surface of the workpiece, and a data structure for storing model data, where the model data is indicative of the spatial relationship between the surface of the workpiece and the observation plane of the imaging device.

Abstract: A pattern detection method and apparatus thereof for inspecting with high resolution a micro fine defect of a pattern on an inspected object and a semiconductor substrate manufacturing method and system for manufacturing semiconductor substrates such as semiconductor wafers with a high yield. A micro fine pattern on the inspected object is inspected by irradiating an annular-looped illumination through an objective lens onto a wafer mounted on a stage, the wafer having micro fine patterns thereon. The illumination light may be circularly or elliptically polarized and controlled according to an image detected on the pupil of the objective lens and image signals are obtained by detecting a reflected light from the wafer. The image signals are compared with reference image signals and a part of the pattern showing inconsistency is detected as a defect so that simultaneously, a micro fine defect or defects on the micro fine pattern are detected with high resolution.

Abstract: The present invention relates to circuit defect detection, classification, and review in the wafer stage of the integrated circuit semiconductor device manufacturing process. The method of processing integrated circuit semiconductor dice on a wafer in a manufacturing process for dice comprising the steps of visually inspecting the dice on the wafer to determine defects thereon, summarizing the number, types, and ranges of sizes of the defects of the dice on the wafer, and determining if the wafer is acceptable to proceed in the manufacturing process.

Abstract: An inspection system for evaluating workpieces for conformance to configuration criteria including a track for causing workpieces to translate through a test section, the test section including a light source for production of a uniform sheet of light, the light source oriented with respect to the track means such that the workpieces occlude the uniform sheet of light upon passing through the test section, the test section further having a video system for receiving the occluded uniform sheet of light, providing output signals related to the intensity of the occluded uniform sheet of light incident on the video system, and a signal processing means for receiving the output signals.

Abstract: A visual reinspection of circuit patterns using a reviewing apparatus is omitted from a semiconductor circuit pattern forming process to achieve the minute analysis of detected defects in the circuit patterns quickly. A fast pattern inspecting system comprises a calculating means for calculating the graphical characteristic quantities of the defects in synchronism with the detection of the defects, and a classifying means for classifying the defects in clusters by the calculated characteristic quantities.

Abstract: Procedure and system for inspecting a component (1) with leads to determine its fitness for assembly before the component is placed on a circuit board. A narrow illuminating beam (10) is directed from a light source (9) at a light-sensitive detector (11). The component (1) is moved in relation to the illuminating beam so that at least one of the leads (4) of the component passes through the illuminating beam and so that the position of the gripper (7) holding the component as a function of time is known. The position data of the gripper is registered. The signal produced by the light-sensitive detector as a result of the illuminating beam being intercepted and shadowed by the lead is registered.

Abstract: Method of checking for the presence of connection balls of components, in particular of ball grid arrays by projecting light obliquely onto the components to create reflections and shadows at the connection balls and any impurities, detecting the reflections and shadows and evaluating the detected shadows and reflections to determine which are from connection balls and which are from impurities.

Abstract: An optical detecting apparatus designed to reduce the time taken to stabilize the operation after a moment at which a power supply for the apparatus is turned on, as well as to limit the power consumption in a standby state. Three operating modes: a normal mode, an intermittent mode, and a precharge mode are changed by controlling two switches sw-Led and sw-Ref. In the normal mode, both the switches sw-Led and sw-Ref are maintained in the on state and the circuit of the invention is used for the same operation as the conventional circuit. In the intermittent mode, for the purpose of achieving low power consumption in the standby state, both the switches sw-Led and sw-Ref are turned on and off at a predetermined on-off ratio to make the circuit operate in an intermittent manner (that is, by turning on and off light emitting diodes at a predetermined on-off ratio).

Abstract: A method of measuring solder bumps formed on a substrate mounting a semiconductor element thereon includes mounting a work to be measured on a work position mechanism, and scanning the work by an optical micro head to measure errors of a mount posture of the work. Each stage is controlled to correct the errors, and thereafter, the apex positions of the bumps are scanned and measured. The measurement results are collected by a personal computer, and the measurement results together with control data of each axis are sent to a main personal computer and displayed on its screen. An error of an apex position of each bump from a regression plane is calculated, and if the error is smaller than a reference value, the work is judged to be satisfactory.

Abstract: An automated inspection system particularly adapted for detection and discrimination of surface irregularities of specularly reflecting and other materials, such as are employed in laminate chip carriers and printed circuit boards, includes an area scan image sensor allowing illumination sources to surround an area of a surface being inspected. The illumination source preferably provides either or both bright field and dark field illumination of the surface; developing generally complementary images of surface irregularities. A self-registering rules-driven process for developing inspection masks reduces alignment operations and improves performance. Image enhancement and morphological operations to detect surface irregularities are performed by digital signal processing, preferably using a dedicated vision processor. Masks screen potential defects to critical mounting and bonding surfaces accurately without requiring alignment of data or reference images to acquired images.

Abstract: Disclosed herein are a process and apparatus for determining, with cheap and simple structure, whether a photomask is good or defective. The photomask has a mask pattern and a detection mark as parts of the pattern. The mark is formed at the same time when the pattern is formed in a mask blank. The apparatus includes a photomask holder having a hole formed through it. In a process of inspecting a photomask, it is determined whether the photomask is good by optically confirming how accurately the hole and the mark are aligned, that is, to what extent they overlap each other.

Abstract: Disclosed is a process for analyzing the surface characteristics of opaque materials. The method comprises in one embodiment the use of a UV reflectometer to build a calibration matrix of data from a set of control samples and correlating a desired surface characteristic such as roughness or surface area to the set of reflectances of the control samples. The UV reflectometer is then used to measure the reflectances of a test sample of unknown surface characteristics. Reflectances are taken at a variety of angles of reflection for a variety of wavelengths, preferably between about 250 nanometers to about 400 nanometers. These reflectances are then compared against the reflectances of the calibration matrix in order to correlate the closest data in the calibration matrix. By so doing, a variety of information is thereby concluded, due to the broad spectrum of wavelengths and angles of reflection used.

Abstract: The invention provides a unique method and apparatus for detecting defects in an electronic device. In one preferred embodiment, the electronic device is a semiconductor integrated circuit (IC), particularly one of a plurality of IC dies fabricated on a wafer of silicon or other semiconductor material. The defect detection operation is effectuated by a unique combination of critical dimension measurement and pattern defect inspection techniques. During the initial scan of the surface of the wafer, in an attempt to locate the appropriate area for a critical dimension (CD) feature or element that is to be measured, a “best fit” comparison is made between a reference image and scanned images. The critical dimension measurements are conducted on a “best fit” image. In addition, a “worst fit” comparison is made between the reference and scanned images. A “worst fit” determination represents pattern distortions or defects in the ICs under evaluation.

Abstract: A defect inspection method and apparatus therefor for a pattern to be inspected having a plurality of chips formed so as to be identical detect an image signal of a pattern to be inspected and when the image signal is to be compared with a detected image signal of an adjacent or separated pattern to be inspected on the substrate, convert the gray level so that the brightness of each of two image signals for comparing one or both of the detected image signals is almost identical in the local region by linear conversion having a gain and offset, and when a pattern is inspected using it, highly sensitive defect inspection for a pattern to be inspected for detecting a defect of a semiconductor wafer can be realized.

Abstract: A sample CD measurement system adapted for measuring the CD of a measurement portion accurately even in the case where the shape of the measurement portion and the direction of measurement are arbitrary. Before the CD measurement, a measurement reference image corresponding to the measurement portion is registered in a computer and controller. At the time of the CD measurement, the measurement reference image is read and compared with an image of the measurement portion to thereby obtain a difference in shape between the image of the measurement portion and the measurement reference image on the basis of a result of the comparison to thereby obtain the CD of the measurement portion on the basis of the difference in shape.

Abstract: A film inspecting apparatus is used for inspecting fine roughness and particle state on a surface of a thin film. In inspecting the thin film surface, shape data of the thin film are obtained by a scanning type probe microscope. The obtained shape data are analyzed to identify individual particles, and the fine roughness and particle state on the thin film surface are inspected based on the particle data obtained by the shape data analysis. The film inspecting apparatus includes a particle analyzing device for inspecting the fine roughness and particle state on the thin film surface by using the shape data obtained by the scanning type probe microscope. The particle analyzing device includes a particle extracting device for extracting the particles on the film surface from the shape data, and a particle data calculating device for calculating the particle data based on the data extracted by the particle extracting device.

Abstract: A tire configuration judging device according to the present invention comprises a light projecting (emitting) device, a photographing device, and a control device. The light projecting device irradiates slit light onto a bead portion of a tire. The photographing device photographs a slit image which is formed on the tire. The control device forms an image to be judged which represents an external configuration of the bead portion of the tire, by applying a 2-D coordinate conversion to image data for the slit image which is photographed by the photographing device. The image to be judged and a predetermined reference image are compared to each other by a comparing device such that quality of the tire is judged, and the tire is classified as a normal tire or an abnormal tire according to results of comparison.

Abstract: Apparatus and method for detecting surface defects on an article freely standing on a conveyer, which generate profile trace data corresponding to profile trace at a cross-section of the article. A surface shape inspection unit comprising an optical ranging system using laser and camera is provided for obtaining the profile trace data through triangulation-based derivation techniques. Base reference curves are derived from regular portions of the profile trace data. Profile trace data are compared to defect threshold curves to recognize a defect induced departure of the trace data with respect to the base reference curve and to produce a defect output signal. The apparatus and method according to the invention are particularly useful for detecting roughness, cavities, wane, missing wood and altered wood on lumber pieces which are conveyed at high speed.

Abstract: The present invention is a light based detection system for providing a low cost, very fast and very accurate measurements of lead positions and heights for integrated circuit board components. The alignment detections systems of the present invention are preferably located on a component placement head. The detector is a linear or rectangular array of pixels. The light path between the light source and the detector array is directed by the optical components across one or more leads in a plane that is neither parallel to nor perpendicular to the seating plane of the component. The light path is directed across the relevant leads without substantial interference from the body of the component or the other leads not being measured. A digital processor analyzes the measurements of the light sensitive detector to determine positions and/or coplanarity of the leads.

Abstract: A computer vision apparatus and methods for automatically inspecting 2-dimensional (2D) and 3-dimensional (3D) criteria of objects using a single camera and laser sources. A camera views the object under inspection which is illuminated by a first source of light to highlight the region of interest. This provides image data for 2d analysis by a computer coupled to the system. Subsequently, multiple laser sources mounted on a positioner provide the illumination for collecting images for 3 dimensional analysis. A computer with a monitor is connected to the camera to perform the inspection and analysis and for operator supervision of the system. Specific implementations provided refer to embodiments for inspecting packaged semiconductor devices such as Ball-Grid Arrays (BGAs) packages and Quad Flat Packages (QFPs) packages for package mark inspection, package defect inspection, and solder ball or lead defects.

Abstract: An automated endpoint detection process for detecting residual metal on a surface of an integrated circuit substrate after subjecting said surface to a chemical-mechanical polishing process is described. The process includes obtaining a baseline reflected radiation signal for a surface on a standard integrated circuit substrate surface that is substantially free of residual metal, directing radiation generated from a radiation source on at least a portion of the surface of the integrated circuit substrate, detecting a resulting reflected radiation signal from the surface of the integrated circuit substrate and comparing the reflected radiation signal to the baseline reflected radiation signal and thereby determining whether residual metal is present on the surface of the integrated circuit substrate.

Abstract: A wavelength measuring system includes a lens for converting an outgoing light beam from an input fiber into parallel light rays, a first wavelength dispersion element disposed on the optical axis of the parallel light rays for spectral diffraction of the parallel light rays and a second wavelength dispersion element disposed opposite to the first wavelength dispersion element so as to allow the parallel light rays, after spectral diffraction by the first wavelength dispersion element, to fall thereon. A right-angle reflecting prism divides the parallel light rays from the second wavelength dispersion element into two reflected light beams. First and second optical receivers receive the reflected light beams from the right-angle reflecting prism, respectively, and a signal processing circuit processes signals from the first and second optical receivers, respectively, thereby determining the wavelength of an incoming light beam for measurement.

Abstract: A system for detecting deposited metals on soldering points of an integrated circuit board substrate, a light source, a charge coupled device camera, and a computer. The camera captures an image of the substrate of a ball grid array integrated circuit board and converts the image into a digital image signal. The dot matrix image is transmitted to the computer for analysis by software to examine a conformity index between the image on the substrate to be detected and the image of a reference substrate, thereby providing an automatic detecting function.

Abstract: The present invention relates to an image sensor; and, more particularly, to an image sensor having test patterns for measuring characteristics of color filters. In accordance with the present invention, the separate quartz wafer or glass wafer is not required. Therefore, unnecessary cost can be saved and high price of light measuring instrument is not necessary any longer, because it is possible to measure the characteristic of exact color filter on substantial wafer. Moreover, since the measurement of color filter is available on the silicon wafer where substantial image sensor is manufactured, the results of measurement are much more exact and it is possible to promptly apply the results to successive wafer or lot. Thus, it contributes to the improvement of yield of the image sensors.

Abstract: Apparatuses and methods are disclosed for determining the alignment of leads on components. Physical and/or superficial fiducial markers on components are used to distinguishes the alignment of leads on the component. The alignment of fiducial markers on the component are detected. A predetermined fiducial alignment is provided that corresponds to a predetermined lead alignment. The detected fiducial alignment is compared to a predetermined fiducial alignment to determine the lead alignment. When used in conjunction with a pick and place machine, the methods and apparatuses provide a means for verifying and correcting the lead alignment of components prior to placement and attachment to a substrate.

Abstract: A method for determining a position of a microscope (1) in space is disclosed. In image detecting unit (3) is fixed to the microscope. In an operating state, the image detecting unit detects a field of view of the microscope from an angle to an optical axis (2) and is connected to a computer which is equipped with an image recognition program and with comparison data for determination of the position of the microscope with respect to the field of view.

Abstract: A method and inspection system to inspect a first pattern on a specimen for defects against a second pattern that is intended to be the same where the second pattern has known responses to at least one probe. The inspection is performed by applying at least one probe to a point of the first pattern on the specimen to generate at least two responses from the specimen. Then the first and second responses are detected from the first pattern, and each of those responses is then compared with the corresponding response from the same point of the second pattern to develop first and second response difference signals. Those first and second response difference signals are then processed together to unilaterally determine a first pattern defect list.

Abstract: The present invention relates to circuit defect detection, classification, and review in the wafer stage of the integrated circuit semiconductor device manufacturing process. The method of processing integrated circuit semiconductor dice on a wafer in a manufacturing process for dice comprising the steps of visually inspecting said dice on said wafer to determine defects thereon, summarizing the number, types, and ranges of sizes of the defects of said dice on said wafer, and determining if said wafer is acceptable to proceed in said manufacturing process.

Abstract: The apparatus has a fired cartridge mounting device for holding the cartridge substantially aligned with a longitudinal axis with a primer surface of the cartridge substantially perpendicular to the axis, a cartridge microscope mounted with its optical axis substantially parallel to the longitudinal axis, a focusing mechanism for focusing the microscope to image a breech face impression on the primer surface and a firing pin impression surface in the primer surface, and an axisymmetric light source mounted to project axially symmetric light onto the breech face impression and the firing pin impression surface about the longitudinal axis. Images of the breech face and the firing pin impressions can be used for comparative analysis independently of an angular orientation of the cartridge held by the mounting device.

Abstract: Substrate inspection apparatus and methods, and illumination apparatus. The inspection apparatus and method includes memory for storing the desired features of the surface of the substrate, focussed illuminator for substantially uniformly illuminating a region of the surface of the substrate to be inspected. Additionally there is a sensor for imaging the region of the substrate illuminated by the illuminator, and a comparator responsive to the memory and sensor for comparing the imaged region of the substrate with the stored desired features of the substrate. The illumination apparatus is designed to provide substantially uniform focussed illumination along a narrow linear region. This apparatus includes first, second and third reflectors elliptically cylindrical in shape, each with its long axis substantially parallel to the long axes of each of the others.