Abstract: A write pole in a heat assisted magnetic recording (HAMR) head for writing to a HAMR medium is provided that includes a recessed part proximal to a near field transducer (NFT) in the HAMR head to protect the write pole from corrosion. The recessed part extends from a portion of a bottom surface of the write pole along a portion of a side of the write pole proximal to the NFT. Within the recessed part, a pole pedestal may be formed of a material that is resistant to corrosion. The pole pedestal may have a rectangular, chamfered, or L-shape. The recessed part may further be induced on the portion of bottom surface of the write pole that extends along the portion of the side of the write pole.
Type:
Grant
Filed:
September 27, 2018
Date of Patent:
November 19, 2019
Assignee:
Western Digital Technologies, Inc.
Inventors:
Mousumi Mani Biswas, Marc A Finot, Barry Cushing Stipe
Abstract: Disclosed is a communication device using magnetic coupling including a communication module linked to a first planar coil (100). The first coil (100) is designed to form a magnetic field in which the field lines are orthogonal to the plane of the first coil (100) in a first zone (10) of the plane. The device includes a unit for orienting the magnetic field such that the field lines are not orthogonal to the plane of the first coil (100) in a second zone (20) of the plane.
Type:
Grant
Filed:
July 23, 2015
Date of Patent:
December 19, 2017
Assignees:
CONTINENTAL AUTOMOTIVE FRANCE, CONTINENTAL AUTOMOTIVE GMBH
Abstract: A write head includes a first pole P1, a P1 pedestal, a first back gap layer plated on top of the first pole P1 leaving a region between the P1 pedestal and the first back gap layer for plating a coil. Further, a first insulation layer is applied on top of the P1 pedestal and the first back gap layer and the region between the P1 pedestal and the first back gap layer. The write head further includes a coil, patterned at least partially on top of the P1 pedestal and the first back gap layer and the region between the P1 pedestal and the first back gap layer, copper plated in the coil patterns, and a second insulation layer is applied to fill the spaces in between the coil turns. The resulting structure is planarized via chemical mechanical polishing.
Type:
Grant
Filed:
April 2, 2010
Date of Patent:
September 9, 2014
Assignee:
HGST Netherlands B.V.
Inventors:
Terence Tin-Lok Lam, David Kaimon Lee, Edward Hin Pong Lee, Changqing Shi