Insulation Detail Patents (Class 360/123.46)
  • Patent number: 11107619
    Abstract: An inductor includes: a body including a coil portion; and an external electrode disposed on an external surface of the body, wherein the coil portion includes an insulator having an opening and a coil pattern filling the opening, and a maximum thickness of the coil pattern is greater than a thickness of the insulator in contact with a side surface of the coil pattern.
    Type: Grant
    Filed: June 7, 2018
    Date of Patent: August 31, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Sun Kim, Jin Soo Kim
  • Patent number: 11031556
    Abstract: In an embodiment, a method includes: growing a phase change material on a platform configured for a semiconductor workpiece process; setting the phase change material to an amorphous state; performing the semiconductor workpiece process within a semiconductor processing chamber; and measuring resistance across two points along the phase change material.
    Type: Grant
    Filed: April 2, 2019
    Date of Patent: June 8, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chien-Mao Chen, Hung-Jen Hsu
  • Patent number: 8826515
    Abstract: A write head includes a first pole P1, a P1 pedestal, a first back gap layer plated on top of the first pole P1 leaving a region between the P1 pedestal and the first back gap layer for plating a coil. Further, a first insulation layer is applied on top of the P1 pedestal and the first back gap layer and the region between the P1 pedestal and the first back gap layer. The write head further includes a coil, patterned at least partially on top of the P1 pedestal and the first back gap layer and the region between the P1 pedestal and the first back gap layer, copper plated in the coil patterns, and a second insulation layer is applied to fill the spaces in between the coil turns. The resulting structure is planarized via chemical mechanical polishing.
    Type: Grant
    Filed: April 2, 2010
    Date of Patent: September 9, 2014
    Assignee: HGST Netherlands B.V.
    Inventors: Terence Tin-Lok Lam, David Kaimon Lee, Edward Hin Pong Lee, Changqing Shi
  • Patent number: 8339749
    Abstract: Embodiments of the invention reduce generation of a magnetic field with a polarity reverse to that of the recording magnetic field, without deteriorating a gradient in the magnetic field. An embodiment of a magnetic disk device according to the present invention suppresses deviation and erase of already recorded data. In an embodiment, the perpendicular magnetic recording head includes the main magnetic pole, an auxiliary magnetic pole, a trailing shield disposed on the trailing side of the main magnetic pole with a non-magnetic film placed in-between, and side shields disposed on both the sides of the main magnetic pole in the direction of the track width with a non-magnetic film placed in-between. The trailing shield has on the trailing side a portion where film thickness is thinner on the trailing side than the thickness of its element in the height direction in its position facing the main magnetic pole.
    Type: Grant
    Filed: November 19, 2008
    Date of Patent: December 25, 2012
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Masafumi Mochizuki, Hideaki Maeda, Shuji Nishida, Takaaki Izumida
  • Patent number: 8238057
    Abstract: The present invention relates to a magnetic head and particularly to improvement of its recording element. The recording element includes a first magnetic film, a second magnetic film, a coil film, and an insulating film. The first magnetic film has a first pole portion. The second magnetic film has a second pole portion opposed to the first pole portion with a magnetic gap film therebetween and is joined to the first magnetic film at a back gap portion that is located in a rearward position with respect to a medium facing surface. The coil film extends around the back gap portion, and the insulating film encloses the coil film. Moreover, the second magnetic film entirely covers the insulating film.
    Type: Grant
    Filed: February 19, 2009
    Date of Patent: August 7, 2012
    Assignee: TDK Corporation
    Inventors: Yuji Ito, Seiji Yari
  • Patent number: 7903370
    Abstract: A thin-film magnetic head which suppresses the TPTP phenomenon due to the environment temperature is provided. The thin-film magnetic head includes, an electromagnetic coil element having a coil layer and coil-insulating layer, and an overcoat layer. A width of the coil-insulating layer in a track-width direction is larger than a width that is needed to insulate the whole coil layer, and is at least 46 ?m, and a length of the coil-insulating layer in a direction perpendicular to the track-width direction is larger than a length that is needed to insulate the whole coil layer, and is at least 75 ?m. In addition, a heat expansion coefficient of the coil-insulating layer is larger than or equal to 30×10?6/K, and a Young's modulus of the coil-insulating layer is larger than or equal to 1 GPa and smaller than or equal to 4 GPa.
    Type: Grant
    Filed: June 1, 2007
    Date of Patent: March 8, 2011
    Assignee: TDK Corporation
    Inventors: Katsuki Kurihara, Hiraku Hirabayashi, Norikazu Ota
  • Patent number: 7692894
    Abstract: A thin film magnetic head is provided. The thin film magnetic head includes an upper coil wire group and a lower coil wire group. Two columns of coil contact groups that are formed on both end portions of individual coil wires of the upper coil wire group and the lower coil wire group, connect both end portions of the coil wires. An insulating resist layer buries a space between coil contacts of the coil contact groups. An inorganic insulating layer buries a space between the two columns of coil contact groups. The upper coil wire group, the lower coil wire group, and the two columns of coil contact groups form a thin film coil that applies a magnetic recording field to the magnetic material layer. The insulating resist layer and the inorganic insulating layer are located at the same lamination height as the two columns of coil contact groups.
    Type: Grant
    Filed: November 29, 2006
    Date of Patent: April 6, 2010
    Assignee: TDK Corporation
    Inventor: Kiyoshi Kobayashi
  • Patent number: 7627942
    Abstract: A method for fabricating a magnetic write head with a coil with a high aspect ratio using a Chemical Vapor Deposition process such as Atomic Layer Deposition (ALD), High Speed ALD, Plasma Enhanced ALD (PEALD), Plasma Enhanced Chemical Vapor Deposition (PECVD) or Low Pressure Chemical Vapor Deposition (LPCVD) to form encapsulating films over the coils without voids is disclosed. Materials which can be used for encapsulation include Al2O3, SiO2, AlN, Ta2O5, HfO2, ZrO2, and YtO3. The use of an ultra-conformal deposition process allows the pitch of the coils to be smaller than it is possible in the prior art. The method also allows materials with a smaller coefficient of thermal expansion than hardbake photoresist to be used with resulting improvements in thermal protrusion characteristics.
    Type: Grant
    Filed: March 25, 2005
    Date of Patent: December 8, 2009
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Richard Hsiao, Wipul Pemsiri Jayasekara, Howard Gordon Zolla
  • Patent number: 7397625
    Abstract: A magnetic head structure having enhanced protrusion and having a first pole structure, a second pole structure forming a yoke with the fist pole, a coil structure disposed in the yoke, and a layer of partially cured polymer operatively coupled to the yoke. Also disclosed is a magnetic head having a first pole structure, a second pole structure forming a yoke with the fist pole, a coil structure disposed in the yoke, and a layer of at least partially insulative material operatively coupled to the read and/or write head for providing enhanced protrusion, the at least partially insulative material having a coefficient of thermal expansion higher than a coefficient of thermal expansion of fully cured hard bake novalac. Further embodiments include disk drive systems having the head structures described herein.
    Type: Grant
    Filed: August 10, 2005
    Date of Patent: July 8, 2008
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventor: Jeffrey S. Lille