Below Coil Patents (Class 360/123.52)
  • Multilayer seed pattern inductor and manufacturing method thereof
    Patent number: 11605484
    Abstract: A multilayer seed pattern inductor includes a magnetic body and an internal coil part. The magnetic body contains a magnetic material. The internal coil part is embedded in the magnetic body and includes connected coil conductors disposed on two opposing surfaces of an insulating substrate. Each of the coil conductors includes a seed pattern formed of at least two layers, a surface coating layer covering the seed pattern, and an upper plating layer formed on an upper surface of the surface coating layer.
    Type: Grant
    Filed: February 27, 2020
    Date of Patent: March 14, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Woon Chul Choi, Myung Jun Park, Hye Min Bang, Jun Ah, Myung Sam Kang, Jung Hyuk Jung