Ic/circuit Component On Suspension Element Patents (Class 360/244.1)
  • Patent number: 9865287
    Abstract: A suspension board with circuit includes a first layer made of a metal supporting board, a second layer having insulating properties and provided at one side in a thickness direction of the first layer, and a third layer provided at one side in the thickness direction of the second layer and made of copper or a copper alloy. The first layer includes a first opening portion passing through in the thickness direction. The first opening portion is provided with a conductor layer that is, when projected in a direction orthogonal to the thickness direction, overlapped with the first layer. The conductor layer includes a first conductor circuit having a first electronic component-connecting terminal for being electrically connected to a first electronic component and made of copper or a copper alloy. The third layer includes a second conductor circuit having a second electronic component-connecting terminal for being electrically connected to a second electronic component.
    Type: Grant
    Filed: March 3, 2016
    Date of Patent: January 9, 2018
    Assignee: NITTO DENKO CORPORATION
    Inventors: Hiroyuki Tanabe, Yuu Sugimoto, Yoshito Fujimura
  • Patent number: 9659590
    Abstract: An apparatus comprises a waveguide having an input end that receives energy in a transverse electric (TE00) mode from an energy source along a substrate-parallel plane. The apparatus also includes a near-field transducer located proximate an output end of the waveguide that receives the energy in the TE00 mode. The output end of the waveguide is at an oblique angle to a cross-track line at an intersection of a media-facing surface and the substrate-parallel plane. The near-field transducer includes an enlarged portion at the oblique angle to the cross-track line.
    Type: Grant
    Filed: October 30, 2015
    Date of Patent: May 23, 2017
    Assignee: SEAGATE TECHNOLOGY LLC
    Inventor: Chubing Peng
  • Patent number: 9437227
    Abstract: A thermally assisted magnetic recording head slider includes a light source unit having a light emitting element emitting laser light and a submount holding the light emitting element, and slider including a thin-film laminated part having a main magnetic pole layer, a near-field light generating element and an optical waveguide. A combination of the light emitting element and near-field light generating element is composed of a first pattern or second pattern. The light source unit is mounted on a light source placing surface so that a substrate surface of the light emitting element is orthogonal to a laminated surface of the thin-film laminated part. A plurality of electrode pads are formed on the outer end surface of the slider. The light source unit has a first element electrode and second element electrode.
    Type: Grant
    Filed: September 30, 2015
    Date of Patent: September 6, 2016
    Assignee: SAE Magnetic (H.K.) Ltd.
    Inventors: Takashi Honda, Seiichi Takayama, Ryuji Fujii
  • Patent number: 9064513
    Abstract: A disk drive suspension assembly has a load beam and a laminated flexure attached to the load beam. The laminated flexure includes a structural layer with a head mounting tongue, and first and second conductive layers. A first dielectric layer is disposed between the structural layer and the first conductive layer, and a second dielectric layer is disposed between the first conductive layer and the second conductive layer. The first conductive layer includes a first plurality of adjacent traces, and the second conductive layer includes a second plurality of adjacent traces that are staggered relative to the first plurality of adjacent traces. The adjacent traces of each plurality are electrically common and joined at a distal junction adjacent the head mounting tongue and joined at a proximal junction at the flexure tail terminal region.
    Type: Grant
    Filed: May 15, 2014
    Date of Patent: June 23, 2015
    Assignee: Western Digital Technologies, Inc.
    Inventors: Tzong-Shii Pan, Cliff Zhang
  • Patent number: 8988813
    Abstract: A microwave-assisted magnetic recording and reproducing apparatus includes a microwave power generator, a microwave magnetic field generating element, and a thin film magnetic head that may record a data signal in high density in a magnetic recording medium that has a high coercivity. A magnetic recording medium, a magnetic head that records information in the magnetic recording medium, a microwave power generator provided independently of the magnetic head, and a differential signal supply unit used to supply microwave power generated by the microwave power generator as differential signals to a microwave magnetic field generating element provided at the magnetic head are included.
    Type: Grant
    Filed: May 19, 2014
    Date of Patent: March 24, 2015
    Assignee: TDK Corporation
    Inventor: Eriko Ajioka
  • Patent number: 8941951
    Abstract: Various embodiments concern a method for manufacturing a disk drive head suspension component. Such methods can comprise providing a head suspension component comprising a layer of insulating material on a spring metal layer. Such methods can further comprise forming a strain gauge element and a trace seed layer by depositing a first metal on the insulating material layer, such as by sputtering. The strain gauge element and the trace seed layer can be formed simultaneously by the depositing of the first metal as part of the same process step. The first metal can be of a strain gauge class of metal having relatively high resistivity, such as constantan. Such methods can further comprise plating a second metal on the trace seed layer to form one or more traces.
    Type: Grant
    Filed: November 27, 2013
    Date of Patent: January 27, 2015
    Assignee: Hutchinson Technology Incorporated
    Inventors: Jeffry S. Bennin, Jacob D. Bjorstrom, Peter F. Ladwig, Paul V. Pesavento, Zachary A. Pokornowski
  • Patent number: 8941952
    Abstract: A head stack assembly (HSA) for a disk drive includes an actuator body, at least one actuator arm extending from the actuator body, and a flexible printed circuit (FPC). The FPC may include a FPC conductive layer having a plurality of FPC traces that terminate at respective ones of a plurality of electrically conductive FPC bond pads. The FPC may include a metallic FPC stiffener layer having a surface that underlies and faces the FPC bond pads. The FPC stiffener layer surface may include a plurality of recessions having a depth of at least 25 microns. A FPC dielectric layer may be disposed between the FPC conductive layer and the metallic FPC stiffener layer. One or more of the plurality of FPC bond pads may be internally patterned to define a FPC bond pad mesh with a plurality of openings therethrough.
    Type: Grant
    Filed: June 10, 2014
    Date of Patent: January 27, 2015
    Assignee: Western Digital Technologies, Inc.
    Inventors: Tzong-Shii Pan, Cliff Zhang
  • Patent number: 8869385
    Abstract: An apparatus for positioning a component relative to an associated component. The apparatus includes a component receiver and onto which the component is disposed. The apparatus also includes an associated component receiver and onto which the associated component is disposed. The component receiver orients the component into a position for retaining the component to the associated component. The apparatus further includes a retention device driver for inserting a retention device, the retention device retaining the component to the associated component in the position. The apparatus also includes an optical position verifier for verifying the position of the component and the associated component.
    Type: Grant
    Filed: September 24, 2007
    Date of Patent: October 28, 2014
    Assignee: HGST Netherlands B.V.
    Inventors: Jen-Yuan Chang, Khaled M. Fawzi, Russell D. Moates, Edgar D. Rothenberg
  • Patent number: 8767352
    Abstract: A suspension board with circuit includes a conductive pattern, including a slider arranged on a surface side of the suspension board with circuit and mounted with a magnetic head, the magnetic head being electrically connected with the conductive pattern; and a light emitting device arranged on the back surface side of the suspension board with circuit and electrically connected with the conductive pattern, in which the conductive pattern includes a first terminal provided on a surface of the suspension board with circuit and electrically connected with the magnetic head; and a second terminal provided on the back surface of the suspension board with circuit and electrically connected with the light emitting device.
    Type: Grant
    Filed: October 4, 2013
    Date of Patent: July 1, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Tetsuya Ohsawa, Hayato Abe, Yoshinari Yoshida, Toshiki Naito
  • Patent number: 8760812
    Abstract: A head stack assembly (HSA) for a disk drive includes a flexible printed circuit (FPC). The FPC includes a plurality of electrically conductive FPC traces, each leading to a respective one of a plurality of FPC bond pads. The HSA also includes a head gimbal assembly (HGA) having a laminated flexure with a plurality of electrically conductive flexure bond pads that are bonded to the plurality of FPC bond pads. The laminated flexure includes a flexure tail having an overlap region that overlaps the FPC. A structural layer of the laminated flexure includes a jumper in the overlap region. The jumper is electrically connected to at least two of the plurality of flexure electrical traces in the flexure conductive layer. The jumper is disposed at least 50 microns from any of the plurality of FPC electrical traces or FPC bond pads.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: June 24, 2014
    Assignee: Western Digital Technologies, Inc.
    Inventors: Yih-Jen D. Chen, Tzong-Shii Pan, Yanning Liu
  • Publication number: 20140160906
    Abstract: According to one embodiment, A first magnetic head is used to record or reproduce data on or from the first disk surface and includes a first two-terminal element including a first positive terminal and a first negative terminal. A second magnetic head is used to record or reproduce data on or from the second disk surface and includes a second two-terminal element including a second positive terminal and a second negative terminal. Ae current control unit includes a first current terminal which is commonly connected to the first positive terminal and the second negative terminal and a second current terminal that is commonly connected to the first negative terminal and the second positive terminal and can switch a current polarity between the first current terminal and the second current terminal.
    Type: Application
    Filed: March 14, 2013
    Publication date: June 12, 2014
    Applicant: Kabushiki Kaisha Toshiba
    Inventor: Yuuichi Yamada
  • Publication number: 20130329320
    Abstract: A suspension includes a positive write trace and a negative write trace. The positive write trace is separated into at least two positive write trace sections located at two different layers respectively, and the negative write trace is separated into at least two negative write trace sections located at two different layers respectively. Each positive write trace section and each negative write trace section are alternately arranged along a longitudinal direction on two different layers, and the positive write trace sections at different layers are connected together via conductive crossovers, and the negative write trace sections are connected together via conductive crossovers. The present invention can obtain balanced propagation time in the stacked trace structure to reduce signal distortion, and obtain widened frequency bandwidth.
    Type: Application
    Filed: July 13, 2012
    Publication date: December 12, 2013
    Applicant: SEA Magnetics (H.K.) Ltd.
    Inventors: Zhao yu Teng, Chong Xi Song, Yun Zhang, Yan Liu
  • Patent number: 8599654
    Abstract: A head gimbal assembly has a flexure forming a part of a suspension configured to extend along a surface of a recording medium. A flexible substrate is provided on the flexure. A slider is mounted onto at least a part of the flexible substrate so as to oppose the surface of the recording medium, and is configured to generate near field light from an introduced light flux. A light supply portion is mounted on the flexure and is provided between the flexure and the slider. The flexible substrate has an end surface forming a mirror surface that faces an end surface of the light supply portion and is inclined with respect to an optical axis of the light supply portion. The light supply portion is optically coupled to the slider via the mirror surface of the flexible substrate.
    Type: Grant
    Filed: September 29, 2010
    Date of Patent: December 3, 2013
    Assignee: Seiko Instruments Inc.
    Inventors: Masakazu Hirata, Manabu Oumi, Norio Chiba, Sachiko Tanabe, Yoko Shinohara
  • Patent number: 8587904
    Abstract: A suspension board with circuit includes a conductive pattern, including a slider arranged on a surface side of the suspension board with circuit and mounted with a magnetic head, the magnetic head being electrically connected with the conductive pattern; and a light emitting device arranged on the back surface side of the suspension board with circuit and electrically connected with the conductive pattern, in which the conductive pattern includes a first terminal provided on a surface of the suspension board with circuit and electrically connected with the magnetic head; and a second terminal provided on the back surface of the suspension board with circuit and electrically connected with the light emitting device.
    Type: Grant
    Filed: October 28, 2009
    Date of Patent: November 19, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Tetsuya Ohsawa, Hayato Abe, Yoshinari Yoshida, Toshiki Naito
  • Patent number: 8587903
    Abstract: A suspension is configured to support a magnetic head slider having a recording head element for recording to a magnetic recording medium and a microwave generating element that applies a high-frequency magnetic field to the magnetic recording medium when recording is conducted by the recording head element. The suspension has a flexure that supports the magnetic head slider, a microwave signal transmission line and a recording signal transmission line. The microwave signal transmission line is connected to the microwave generating element and configured to transmit microwave signals for generating the high-frequency magnetic field. The microwave signal transmission line and the recording signal transmission line are supported between the main body part and the support part, a portion of which has a first lamination structure where a first ground layer is conductive and a first insulating layer supports the microwave signal transmission.
    Type: Grant
    Filed: November 22, 2011
    Date of Patent: November 19, 2013
    Assignee: TDK Corporation
    Inventors: Eriko Ajioka, Yoshikazu Soeno
  • Patent number: 8503133
    Abstract: A flexure with conductors is provided with a flexure tail portion. The flexure tail portion includes a metal base, an electrically insulating layer, and a conductive member. The metal base is formed with a plurality of apertures. A damper is attached to the flexure tail portion. The damper includes a viscoelastic member and a metallic constrained plate. The viscoelastic member has first and second surfaces. The first surface of the viscoelastic member is secured to the flexure tail portion. The constrained plate is secured to the second surface of the viscoelastic member. The constrained plate extends longitudinally relative to the metal base along the conductive member. The conductive member and the constrained plate face each other with the viscoelastic member therebetween.
    Type: Grant
    Filed: August 18, 2010
    Date of Patent: August 6, 2013
    Assignee: NHK Spring Co., Ltd.
    Inventors: Hajime Arai, Hideki Fuchino
  • Patent number: 8422171
    Abstract: A disk drive head stack assembly includes a laminar flexible printed circuit (FPC) having first and second conductive layers, with a dielectric layer between. An integrated circuit (IC) chip is mounted to the laminar FPC. The IC chip may have a first plurality of terminals closer to the first conductive layer than to the second conductive layer, and second plurality of terminals that is offset towards the second conductive layer relative to the first plurality of terminals. First and second pluralities of conductive bumps contact and connect conductive traces of the first and second conductive layers to the first and second plurality of terminals, respectively. An average height of the second plurality of conductive bumps may be greater than that of the first plurality of conductive bumps. The second plurality of conductive bumps is aligned with and passes through a plurality of openings through the dielectric layer.
    Type: Grant
    Filed: February 24, 2012
    Date of Patent: April 16, 2013
    Assignee: Western Digital Technologies, Inc.
    Inventor: Albert J. Guerini
  • Patent number: 8411391
    Abstract: A head gimbal assembly comprises a slider having reproduction/reproducing elements for reproducing and recording information to/from a surface of a recording medium. A suspension flexibly supports the slider opposite to a surface of a recording medium. A light source is disposed on the suspension for emitting a light beam. An optical waveguide is disposed between the slider and the laser light source for introducing a light beam from the light source into the slider.
    Type: Grant
    Filed: September 28, 2009
    Date of Patent: April 2, 2013
    Assignee: Seiko Instruments Inc.
    Inventors: Masakazu Hirata, Manabu Oumi, Majung Park, Mizuaki Suzuki
  • Patent number: 8400891
    Abstract: An apparatus includes a read/write head disposed on a slider, a control circuit disposed on the slider, and an adjustable delay line disposed on the slider. The adjustable delay line delays transmission of aligned write data to the read/write head by an adjustable delay. The adjustable delay is controlled by the control circuit a function of read synchronization data provided by the read/write head.
    Type: Grant
    Filed: June 26, 2009
    Date of Patent: March 19, 2013
    Assignee: Seagate Technology LLC
    Inventor: Mark Anthony Gubbins
  • Patent number: 8351159
    Abstract: Approaches for protecting a component when a hard-disk drive (HDD) experiences a mechanical shock. An HDD includes a suspension comprising a load beam, a gimbal, and a flexure tongue. A component, such as a microactuator, is mounted on the suspension. The flexure tongue extends to at least the edge of the microactuator that is furthest from the gimbal. The flexure tongue prevents the microactuator from contacting the load beam when the HDD receives a mechanical shock. Alternately, the flexure tongue may comprise a tip portion that extends beyond the edge of the microactuator that is furthest from the gimbal, and the tip portion of the flexure tongue may deform to act as shock absorber when the HDD receives a mechanical shock. Alternately or additionally, a padding material may be used to prevent the microactuator or the flexure tongue from contacting the load beam when the HDD receives a mechanical shock.
    Type: Grant
    Filed: October 14, 2009
    Date of Patent: January 8, 2013
    Assignee: HGST Netherlands B.V.
    Inventors: Toshiki Hirano, Haruhide Takahashi, Shinobu Hagiya, Shigenori Takada, Kousaku Wakatsuki
  • Patent number: 8279560
    Abstract: A flexure tail of a head gimbal assembly (HGA) is aligned with a flex cable of a head stack assembly (HSA). At least one solder ball is adhered to a bond pad on the flex cable. The solder ball is entered into a first alignment hole in the flexure tail while the solder ball is solid.
    Type: Grant
    Filed: March 4, 2009
    Date of Patent: October 2, 2012
    Assignee: Western Digital Technologies, Inc.
    Inventor: Tzong-Shii Pan
  • Patent number: 8247700
    Abstract: A wired circuit board has a metal supporting board, an insulating layer formed on the metal supporting board, a conductive pattern formed on the insulating layer and having a pair of wires arranged in spaced-apart relation, and a semiconductive layer formed on the insulating layer and electrically connected to the metal supporting board and the conductive pattern. The conductive pattern has a first region in which a distance between the pair of wires is small and a second region in which the distance between the pair of wires is larger than that in the first region. The semiconductive layer is provided in the second region.
    Type: Grant
    Filed: March 12, 2009
    Date of Patent: August 21, 2012
    Assignee: Nitto Denko Corporation
    Inventors: Jun Ishii, Yasunari Ooyabu, Visit Thaveeprungsriporn
  • Patent number: 8134807
    Abstract: A disk drive data storage system. The system comprises a data storage disk, a movable member positioned near the data storage disk, and a sensor assembly, supported and movable by the movable member, for writing data to and reading data from the data storage disk. The system also comprises an integrated circuit that is electrically coupled to the sensor assembly and that moves with the movable member when the movable member moves the sensor assembly. The integrated circuit comprises a face and a backside, and the integrated circuit is in a fixed physical position relative to the movable member such that the backside is oriented toward the movable member.
    Type: Grant
    Filed: August 24, 2007
    Date of Patent: March 13, 2012
    Assignee: Texas Instruments Incorporated
    Inventors: Priscilla Escobar-Bowser, Axel Alegre De La Soujeole, Indumini Wijayanayake Ranmuthu, Ramlah Razak
  • Patent number: 8107177
    Abstract: Impedance compensation features are used along the transmission-line path between a transmitter/driver/source and the receiver/transducer to compensate for the impedance discontinuities or mismatches (for example, those caused by physical interconnection features) and/or to improve the frequency response of the signal transfer along the transmission line. The impedance compensation features are non-uniformities with impedance characteristics selected to compensate for the target impedance discontinuities. The compensation features can be non-uniformities (geometric structures designed to have specific impedance characteristics) in the electrically conductive traces that are integrated in the interconnect transmission line between the transmitter/driver/source and the receiver/transducer. The effective impedance level of the transmission line can be lowered or raised using the compensation features.
    Type: Grant
    Filed: December 23, 2008
    Date of Patent: January 31, 2012
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: John Thomas Contreras, Luiz Franca-Neto
  • Patent number: 8107185
    Abstract: A magnetic disk device includes a magnetic head assembly, which includes magnetic heads, support plates, and a flexible wiring substrate that are integrally formed. The magnetic heads include heating elements for making head element parts protrude toward magnetic disks by thermal expansion, the support plate supports the magnetic head, the flexible wiring substrate is provided along the support plate and electrically connects the magnetic heads to a circuit system, and the magnetic head assembly and the magnetic disks are assembled in a case. The magnetic disk device includes a sensor and a floating distance control circuit. The sensor detects at least one of atmospheric pressure, temperature, and humidity in the case. The floating distance control circuit increases or decreases current supplied to the heating element on the basis of the output of the sensor and controls the floating distance of the magnetic head so that the floating distance is constant.
    Type: Grant
    Filed: September 18, 2009
    Date of Patent: January 31, 2012
    Assignee: Alps Electronics Co., Ltd.
    Inventors: Kazuhiro Okamoto, Yuki Ono, Yukihiro Gorai, Mitsuru Watanabe, Akihiro Sato, Keitaro Kikuchi
  • Patent number: 8040635
    Abstract: A substrate for suspension which is produced at low costs and can sufficiently attain the prevention of damage by electrostatic discharge and restraint of noises. The substrate for suspension includes: a metallic substrate, an insulating layer formed on the metallic substrate and having an opening from which the metallic substrate is exposed, a grounding-wiring layer formed on the insulating layer and arranged near the opening, and a ground terminal formed in the opening and contacting the metallic substrate and the grounding-wiring layer. The ground terminal is made of a metal having a melting point of 450° C. or lower.
    Type: Grant
    Filed: June 20, 2007
    Date of Patent: October 18, 2011
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Yoichi Miura, Tooru Serizawa, Shinichiro Busujima
  • Patent number: 8035924
    Abstract: A suspension for disc drive includes a base plate, a load beam, and a flexure. The flexure includes a metal base member and a circuit member disposed along the metal base member. The circuit member extends in a longitudinal direction of the load beam. The circuit member includes a resin base member formed of an electrically insulating resin and conductors. The conductors are formed into predetermined circuit patterns by etching a deposited copper layer deposited on the resin base member. Each conductor has a cross section in the shape of a trapezoid such that the width of a surface of the conductor which faces the resin base member is greater than that of a surface of the conductor on the side opposite from the resin base member.
    Type: Grant
    Filed: March 27, 2008
    Date of Patent: October 11, 2011
    Assignee: NHK Spring Co., Ltd.
    Inventors: Tsukasa Higashi, Hidenori Ogawa
  • Patent number: 8031437
    Abstract: Embodiments of the present invention provide a highly reliable hard disk drive (HDD). In an HDD according to an embodiment of the present invention, solder at a solder joint for joining a pad of a head slider and a pad of a transmission wiring comprises the main component of Sn and atomic percent to atomic percent of indium. The solder exhibits the ? phase within the range of ?150° C. to 120° C. Accordingly, even if the HDD is left at a low temperature for a long time, the solder joint is not broken.
    Type: Grant
    Filed: November 20, 2008
    Date of Patent: October 4, 2011
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Hiroyuki Suzuki, Yoshio Uematsu
  • Patent number: 7984545
    Abstract: Approaches for helping to decrease the amount of inactive gas necessary for reflow to interconnect connection terminals of a head slider and a suspension. Inactive gas is blown from a nozzle of a reflow apparatus toward interconnection joints of a head slider and a suspension. The head slider is bonded onto a gimbal tongue. The nozzle comprises a duct through which the inactive gas passes and a porous member fitted in an ejection outlet of the tube. Placing the porous member close to the head slider achieves effective reduction of oxygen concentration around solder balls.
    Type: Grant
    Filed: July 25, 2008
    Date of Patent: July 26, 2011
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Yuhsuke Matsumoto, Tatsumi Tsuchiya, Hideto Imai, Tamaki Ushimoto
  • Patent number: 7952834
    Abstract: In accordance with various embodiments, a printed structure of a flex circuit assembly includes a plurality of adjacent land portions formed on a heat conductive stiffener member and which support electrically conductive paths for connection to an integrated circuit. A corresponding plurality of separation channels are formed between the adjacent electrically conductive paths, and thermal energy generated by operation of the integrated circuit is transferred through the separation channels to the stiffener member. In some embodiments, the separation channels retain a fluid, such as air or a low density inert gas, which flows through the separation channels in response to rotation of a rotatable member adjacent the flex circuit assembly. In other embodiments, a dielectric, thermally conductive material fills the separation channels.
    Type: Grant
    Filed: February 22, 2008
    Date of Patent: May 31, 2011
    Assignee: Seagate Technology LLC
    Inventors: Rick Pfahl Freeman, Andrew R. Motzko
  • Publication number: 20100290158
    Abstract: A head suspension with a piezoelectric actuator secures basic characteristics such as vibration and impact characteristics without deteriorating a displacement stroke of the piezoelectric actuator. The head suspension has a load beam and a piezoelectric actuator, the piezoelectric actuator supporting a base part of the load beam and configured to displace a front end of the load beam in a sway direction. The piezoelectric actuator has an actuator base and at least a piezoelectric element, the actuator base connected to the base part of the load beam and having at least an opening, the piezoelectric element attached to the opening and deforming in response to a voltage applied thereto to conduct displacement of the front end of the load beam.
    Type: Application
    Filed: March 30, 2010
    Publication date: November 18, 2010
    Applicant: NHK SPRING CO., LTD.
    Inventors: Masao Hanya, Toshiki Ando
  • Patent number: 7782571
    Abstract: A wired circuit board includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, a first semi-conductive layer formed on the conductive pattern, an insulating cover layer formed on the first semi-conductive layer, and a second semi-conductive layer formed on the insulating cover layer. The first semi-conductive layer and the second semi-conductive layer are electrically connected to the metal supporting board.
    Type: Grant
    Filed: April 5, 2007
    Date of Patent: August 24, 2010
    Assignee: Nitto Denko Corporation
    Inventors: Jun Ishii, Yasunari Ooyabu
  • Patent number: 7724475
    Abstract: Embodiments of the present invention provide a conductive member, in which electric characteristics can be improved by matching impedance all the way from a conductive wire to a pad. In one embodiment, a conductive member comprises: a back side metal layer; an insulating layer formed on the back side metal layer; a conductive wire formed on the insulating layer; and a pad formed on the insulating layer and electrically connected to the conductive wire; at least one opening and at least one supporting structure being formed at a position corresponding to the pad on the back side metal layer.
    Type: Grant
    Filed: February 3, 2006
    Date of Patent: May 25, 2010
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventor: Nobumasa Nishiyama
  • Patent number: 7715150
    Abstract: The head gimbal assembly includes a slider and a micro-actuator assembly sharing power for the micro-actuator assembly to aid in positioning the slider and for an amplifier included in the slider to generate an amplified read signal when the slider read accesses data on a rotating disk surface included in a hard disk drive. The slider includes a read-write head providing a read differential signal pair to an amplifier to generate an amplified read signal reported when read accessing a rotating disk surface near the slider, which includes a read head employing a spin valve or employing a tunneling valve. Hard disk drive including a head stack assembly, which includes at least one of the head gimbal assemblies. Manufacturing the head gimbal assembly, the head stack assembly, and the hard disk drive, as well as these items as products of the invention's manufacturing processes.
    Type: Grant
    Filed: July 6, 2006
    Date of Patent: May 11, 2010
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Brian D. Strom, Na Young Kim, Sung Chang Lee, Vinod Sharma, Joseph Chang
  • Publication number: 20100061019
    Abstract: A magnetic storage system includes a magnetic storage medium and a transducer positioned adjacent the magnetic storage medium. The transducer has a reader positioned adjacent writer and a reader bias coil located on the transducer. Transducer circuitry is configured to apply a bias signal to the reader bias coil during a read-write operation. The reader bias coil generates a reader bias field proximate the reader.
    Type: Application
    Filed: September 5, 2008
    Publication date: March 11, 2010
    Inventors: Mourad Benakli, Michael Leigh Mallary
  • Patent number: 7673381
    Abstract: A method of manufacturing a head suspension includes forming a rigid part chain product where the rigid parts are provided continuously, including forming a plate-like framework for formation of the rigid part including formation margins for formation of the rails and forming a deformable part along a longitudinal curve of each formation margin and forming the rails by bending the formation margins to rise, forming a resilient member chain product where the resilient members are provided continuously, forming the flexures, forming the bases, and a stacking and coupling step stacking and coupling the rigid part chain product, the resilient member chain product, the bases, and the flexures, to form a stacked set, and cutting and separating respective head suspensions from the stacked set.
    Type: Grant
    Filed: May 8, 2006
    Date of Patent: March 9, 2010
    Assignee: NHK Spring Co., Ltd.
    Inventors: Kenichi Takikawa, Masao Hanya, Noriyuki Saito
  • Publication number: 20100033875
    Abstract: A suspension board with circuit includes a metal supporting board extending in a longitudinal direction, an insulating layer formed on the metal supporting board, and a conductive pattern formed on the insulating layer. In the suspension board with circuit, a magnetic-head mounting region where a slider with a magnetic head mounted thereon is mounted is located in one end portion in the longitudinal direction, and the thickness of the metal supporting board in at least a part of the magnetic-head mounting region is smaller than that in a region other than the magnetic-head mounting region.
    Type: Application
    Filed: July 29, 2009
    Publication date: February 11, 2010
    Applicant: Nitto Denko Corporation
    Inventors: Yoshinari Yoshida, Hitoki Kanagawa
  • Publication number: 20090097161
    Abstract: According to one embodiment, a disk device includes a disk, a drive section which is configured to support and rotate the disk, a head, and a head actuator assembly. The head actuator assembly includes a board unit including a base portion on which an electronic component is mounted, a main flexible printed circuit board which is configured to extend from the base portion and have a connecting end portion attached to the carriage, and a reinforcing plate including a bent portion fixed to the main flexible printed circuit board, and a vibration damper which is configured to include a sheet-shaped viscoelastic material stuck on the bent portion and a sheet-shaped reinforcing material, more rigid than the viscoelastic material and stuck on the viscoelastic material in superposed relation, and suppress vibration of the reinforcing plate.
    Type: Application
    Filed: September 29, 2008
    Publication date: April 16, 2009
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Hitoshi Naruse, Akio Toda, Kazuhiro Yoshida
  • Patent number: 7505229
    Abstract: A disk drive electrical interconnect includes one or more electrical contacts for providing a controlled discharge form a disk drive head in a manner that reduces the potential for damaging the head in preparation for testing or the like. In some embodiments the electrical interconnect includes a charge dissipation electrical contact that is interconnected with a read element of the head using an electrical trace. A resistor is disposed in series between the charge dissipation electrical contact and the read element. A probe may engage the charge dissipation electrical contact to remove the electrical charge from the read element at a desired rate because of the resistor. Once the electrical charge has been sufficiently dissipated, another probe may engage another contact of the electrical interconnect to provide a desired electrical signal to the head.
    Type: Grant
    Filed: January 7, 2005
    Date of Patent: March 17, 2009
    Assignee: Maxtor Corporation
    Inventor: Albert J. Wallash
  • Patent number: 7497378
    Abstract: A magnetic stripe reading device including a magnetic head assembly including a mounting element, at least one information reading sensor having output contacts, the sensor being mounted in the mounting element and a flat cable coupled to the output contacts of the at least one information reading sensor, a portion of the flat cable being arranged in a doubled-over configuration over the output contacts, thereby to provide anti-tampering protection to the output contacts.
    Type: Grant
    Filed: December 8, 2006
    Date of Patent: March 3, 2009
    Assignee: Verifone, Inc.
    Inventor: Arnon Aviv
  • Publication number: 20080239576
    Abstract: A suspension for disc drive includes a base plate, a load beam, and a flexure. The flexure includes a metal base member and a circuit member disposed along the metal base member. The circuit member extends in a longitudinal direction of the load beam. The circuit member includes a resin base member formed of an electrically insulating resin and conductors. The conductors are formed into predetermined circuit patterns by etching a deposited copper layer deposited on the resin base member. Each conductor has a cross section in the shape of a trapezoid such that the width of a surface of the conductor which faces the resin base member is greater than that of a surface of the conductor on the side opposite from the resin base member.
    Type: Application
    Filed: March 27, 2008
    Publication date: October 2, 2008
    Applicant: NHK Spring Co., Ltd.
    Inventors: Tsukasa Higashi, Hidenori Ogawa
  • Publication number: 20080212236
    Abstract: A suspension having a magnetic head assembly 1 mounted thereon is provided, wherein the magnetic head assembly comprises: a write head 1-2; a read head 1-1; and a resistive heating element 1-3 for controlling the flying heights of the magnetic heads, wherein the wires HTx and GTx for the resistive heating element is disposed such that they sandwich the wires RxX and RxY for the read head. The wires for the resistive heating element may be disposed between the wires for the write head and the wires for the read head. Furthermore, the waveform of the current or voltage to the resistive heating element has a time constant of 1 ?sec or more, the resistive heating element having wires disposed near the wires of the read head.
    Type: Application
    Filed: April 4, 2008
    Publication date: September 4, 2008
    Applicant: Hitachi Global Storage Technologies Japan, Ltd.
    Inventors: Naoki Satoh, Masayuki Kurita, Mikio Tokuyama, Junguo Xu
  • Publication number: 20080074793
    Abstract: A disk medium having an IC chip capable of delivering information to an external source contactlessly even if several media are stacked. In the disk medium, an annular slot constituting a non-film portion without metal film is formed close to the boundary between an information non-recording area and an information recording area. The area formed with the metal film is separated into an outer antenna portion and a second antenna portion. The second is a C-shaped member in which a central non-film area on the inner peripheral side and the annular slot are connected via a notch. Signal input/output electrodes constituting the terminals of the IC chip for supplying power to the antenna are connected to the metal films of the first and second antenna over the annular slot at a narrow portion.
    Type: Application
    Filed: April 24, 2007
    Publication date: March 27, 2008
    Inventors: Isao Sakama, Minoru Ashizawa
  • Publication number: 20080030902
    Abstract: A disk media has an IC chip which is mounted thereon at a boundary peripheral portion of a metal film layer formation region with respect to a metal film layer non-formation region. The IC chip is mounted on a top surface of the metal film layer. An “L”-shaped slit is formed in the metal film layer at the mount position of the IC chip while causing signal input/output electrodes of IC chip to be connected to portions of the metal film layer which are placed on the opposite sides of the slit. With such an arrangement, it is possible to use the metal film layer as an antenna of IC chip while enabling the impedance of IC chip to match the impedance of the antenna formed by the metal film layer.
    Type: Application
    Filed: April 24, 2007
    Publication date: February 7, 2008
    Inventors: Isao Sakama, Minoru Ashizawa
  • Patent number: 7287315
    Abstract: The present invention provides a measurement apparatus for obtaining a suitable position on a suspension where a more miniature magnetic head slider is to be mounted to the suspension, the apparatus including a front camera having a photographing optical axis within a plane parallel to a plane of extension of a suspension and directed to the suspension, and a side camera having a photographing optical axis within the parallel plane and which is different from that of the front camera. Coordinates of a top portion of a convex surface of a dimple formed in the suspension are obtained with these cameras. The resultant coordinates and coordinates of the deepest portion of a recess surface of the dimple are correlated with each other, whereby in actual mounting of the magnetic head slider, the deepest portion of the recess surface of the dimple which is readily recognized is measured.
    Type: Grant
    Filed: October 25, 2004
    Date of Patent: October 30, 2007
    Assignee: TDK Corporation
    Inventors: Kenichi Hayami, Masaaki Kaneko
  • Patent number: 7239467
    Abstract: The storage media recording/writing system includes a media drive circuit, a head retaining means, a head moving means, a head drive circuit, a signal processing circuit, and a controller to control these. The head drive circuit possesses a first semiconductor integrated circuit having an amplifier that amplifies the read signal from the head, and a second semiconductor integrated circuit placed between the first semiconductor integrated circuit and the signal processing circuit, which has a circuit that receives write data from the signal processing circuit and generates a drive signal to drive a write head. Further, the first semiconductor integrated circuit is mounted on a part near the front of the head retaining means, and the second semiconductor integrated circuit is installed on the side of the moving means.
    Type: Grant
    Filed: April 29, 2004
    Date of Patent: July 3, 2007
    Assignee: Hitachi, Ltd.
    Inventors: Hiroyasu Yoshizawa, Yoichiro Kobayashi, Toshio Shinomiya, Noriyuki Fujii, Masaki Yoshinaga
  • Patent number: 7170715
    Abstract: Embodiments include a method for forming a head suspension assembly. A spacer layer is formed in or on a silicon wafer. A transfer film including an opening defining the shape of a slider support membrane is provided, and the opening is filled with a resin material. The transfer film with the resin material therein is positioned over the silicon wafer so that at least a portion of the resin material is positioned adjacent to the spacer layer. The resin material is baked to form a glassy carbon material. The spacer layer is etched to form a trench in the silicon wafer adjacent to the glassy carbon material, and a slider is positioned on the glassy carbon material over the trench.
    Type: Grant
    Filed: February 27, 2004
    Date of Patent: January 30, 2007
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventor: Jeffrey S. Lille
  • Patent number: 7130155
    Abstract: A head actuator assembly comprises a plate-like suspension having a distal end portion mounting with a magnetic head, and a trace having a relay FPC attached to the suspension through a lining plate. A head IC is mounted on the relay FPC and positioned near the magnetic head. In an area which faces the head IC, insulation layers of the FPC are removed, and an opening is formed in the lining plate and suspension. A wiring pattern of the relay FPC is exposed through this opening.
    Type: Grant
    Filed: July 15, 2004
    Date of Patent: October 31, 2006
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Makoto Katsumata
  • Patent number: 7095594
    Abstract: A method and apparatus for collocating an interface circuit with a disk drive read/write head is described. In one embodiment the interface circuit is attached to the load arm on one side and the miniflex interconnect on the other. The read/write head is mounted on the miniflex directly below the interface circuit. The interface circuit comprises a read signal preamplifier, a write driver, and head selection circuitry. A common multiplexer circuit is used to perform the other conventional read/write circuit functions. The common multiplexer circuit includes a head selection block to determine which heads are activated, a head driver block, and a read receiver block. The common multiplexer circuit is mounted at the base of the miniflex.
    Type: Grant
    Filed: September 17, 2001
    Date of Patent: August 22, 2006
    Assignee: Texas Instruments Incorporated
    Inventors: Peter Maimone, Al Morton, Chi-Fa Chiou
  • Patent number: RE40975
    Abstract: A head suspension assembly including a load beam having a rigid region, a mounting region on a proximal end of the load beam, and a flexure on a distal end of the load beam. The flexure has a read/write head attachment region for supporting a read/write head on the distal end of the load beam. Deformation of the head suspension assembly displaces the head attachment region. A strain transducer circuit that acts as a strain gauge is mounted on the head suspension assembly. The resistance of the transducer circuit varies with strain in the circuit, which, in turn, varies with displacement of the read/write head. The magnitude of resistance change of the transducer circuit indicates the magnitude of head off-neutral motion.
    Type: Grant
    Filed: June 9, 2006
    Date of Patent: November 17, 2009
    Assignee: Hutchinson Technology Incorporated
    Inventors: Robert B. Evans, Todd A. Krinke