Abstract: A head actuator assembly comprises a plate-like suspension having a distal end portion mounting with a magnetic head, and a trace having a relay FPC attached to the suspension through a lining plate. A head IC is mounted on the relay FPC and positioned near the magnetic head. In an area which faces the head IC, insulation layers of the FPC are removed, and an opening is formed in the lining plate and suspension. A wiring pattern of the relay FPC is exposed through this opening.

Abstract: A method and apparatus for collocating an interface circuit with a disk drive read/write head is described. In one embodiment the interface circuit is attached to the load arm on one side and the miniflex interconnect on the other. The read/write head is mounted on the miniflex directly below the interface circuit. The interface circuit comprises a read signal preamplifier, a write driver, and head selection circuitry. A common multiplexer circuit is used to perform the other conventional read/write circuit functions. The common multiplexer circuit includes a head selection block to determine which heads are activated, a head driver block, and a read receiver block. The common multiplexer circuit is mounted at the base of the miniflex.

Abstract: This invention relates to a testing method for a head IC which makes it possible to simplify checking of the head. The head IC is installed on a head suspension, and probes are placed on terminals of the head suspension to check electric characteristics of the head IC. With this invention, contact of the probes for checking the head IC when the head IC has been installed, but before installing the head, becomes easier.

Abstract: A dedicated read IC chip is mounted on a head suspension. The dedicated read IC chip is located closer to a read element. A stray capacitance of a wiring can be reduced. Even if the electric resistance value of the read element increases, the magnetic information data of a higher density can be read out. Moreover, the dedicated read IC chip generates little heat. Even if the dedicated read IC chip is located on the head suspension, an excessive heat cannot be transmitted to the head suspension from the dedicated read IC chip. The mechanical properties and shape of the head suspension can be maintained as expected.

Abstract: The method of manufacturing a magnetic head is capable of correctly setting a raw bar, which includes small sliders, on to a supporting jig, machining the raw bars precisely and improving yield of manufacturing sliders. The method comprises the steps of forming a magnetizable layer, on a surface of a substrate whose thickness is greater than a length of said slider; and cutting said wafer into a raw bar after forming the layers.

Abstract: A head suspension assembly having a magnetic head, an arm which is supported so as to rotate, a suspension having one end which is fixed to an end of the arm and an other end which mounts the magnetic head, a nonvolatile memory which is mounted on the suspension assembly, and stores control parameters of the magnetic head, a connecting terminal which is mounted to the arm, and a signal transmission line which electrically connects the connecting terminal to the nonvolatile memory and the magnetic head. The connecting terminal enables transmission of signals at least one of to and from the head suspension assembly, the nonvolatile memory and the magnetic head.

Abstract: A height-restriction plate having a size in plan view larger than that of an IC chip is bonded to an upper face of the IC chip which is fixed to a FPC formed along a suspension. The IC chip is sealed at the periphery thereof with an adhesive which reaches the height-restriction plate and the FPC.

Abstract: A head suspension or head suspension component for use in supporting a read/write head in a storage device, the head suspension or head suspension component including an integrated circuit chip as a structural element of the head suspension or head suspension component. The chip is included as part of a load beam or as a stiffener for a load beam. A flexure or other gimballing device is mounted to the chip or to a portion of the load beam that is mounted to the chip. The chip may be configured for improved heat dissipation or resonant characteristics. The chip is mounted to head suspension components in various ways, including the use of attachment features formed in the chip. A method of making a head suspension or head suspension component that includes mounting a chip as a structural element of the head suspension or head suspension component is also included.

Abstract: A write-inhibit signal is generated by a head-disk interaction sensor during a write process that is integrated with a suspension of a hard disk drive (HDD) when fly-height modulation of the slider is detected during a write process The suspension load beam includes a dimple and a laminated flexure. The laminated flexure includes a surface that is adapted to receive a slider and a surface that is adapted to contact the dimple. The head-disk interaction sensor is fabricated as part of the laminations of the flexure. The head-disk interaction sensor can be an accelerometer that senses an acceleration of the flexure when the slider contacts the disk of the disk drive and/or a pressure sensor that senses a pressure between the flexure and the dimple when the slider contacts the disk. A write-inhibit circuit is responsive to the sensor signal by inhibiting the write process.

Abstract: A method for manufacturing an integrated lead suspension or component having an integrated circuit (IC) with an array of terminals. The suspension or component is formed from a laminated sheet of material including a spring metal layer and a conductive material layer separated by an insulating layer. The method includes forming an IC window in the spring metal layer, forming integrated conductive leads in the conductive material layer and forming holes in the insulating layer. The IC can then be mounted to the suspension or component in the IC window, and the array of terminals electrically interconnected to the integrated conductive leads through the insulating layer.

Abstract: A method of fabricating a magnetic head device comprising a slider having a magnetic head element, a suspension structure made of a thin resilient material and having one end supporting the slider and the other end to be attached to another member, and a head IC chip. The head IC chip is mounted on the suspension structure so as to face a magnetic recording disc and at a position spaced from the slider-supporting one end of the suspension structure by an intervening portion of the suspension structure. The position is selected so that the intervening portion is effective to suppress a temperature increase in the head IC chip due to at least thermal conduction through the intervening portion.

Abstract: A head assembly is provided with a mounting surface, and an integrated circuit chip which is mounted on the mounting surface and processes signals. The integrated circuit chip is covered by a layer which prevents generation of foreign particles from the integrated circuit chip by the provision of the layer.

Abstract: A head suspension assembly having a magnetic head, an arm which is supported so as to rotate, a suspension having one end which is fixed to an end of the arm and an other end which mounts the magnetic head, a nonvolatile memory which is mounted on the suspension assembly, and stores control parameters of the magnetic head, a connecting terminal which is mounted to the arm, and a signal transmission line which electrically connects the connecting terminal to the nonvolatile memory and the magnetic head. The connecting terminal enables transmission of signals at least one of to and from the head suspension assembly, the nonvolatile memory and the magnetic head.

Abstract: The present invention features a magnetic read head having an IC component provided within or adjacent to the head case. No low-level, analog signals, which are generally highly susceptible to electrical noise, leave the head structure. Power and ground signals are provided to the hybrid head. Digitized data corresponding to encoded information upon the magnetic stripe on a credit card, ID badge, or similar article is provided at output terminals. Decoding is performed by an ASIC or similar device located at the read head. A data strobe signal and/or a magnetic medium detected signal may also be provided by the read head.

Abstract: There is provided a pre-amplifier with a baseplate configured for mounting to an actuator in a disc drive. The baseplate is directly fixed to the actuator at one point, with a damping layer between a second surface of the baseplate and the actuator. The damping layer helps to constrain the baseplate from rotational movement relative to the actuator. Preferably, the baseplate is fixed to the actuator by a grounding pin coupled to the baseplate.

Abstract: An actuator assembly of a disc drive having an actuator arm rotatably mounted adjacent a data disc. The actuator arm has a top surface and a bottom surface, and includes a head gimbal assembly support portion located at one end of the actuator arm. The actuator assembly further includes an arm circuit fastened to the top surface of the actuator arm. The actuator assembly may additionally include a head gimbal assembly that electrically couples the data transducer and the arm circuit. The gimbal circuit is partially routed along the head gimbal assembly and over the top surface of the actuator arm. Alignment apertures on the arm circuit and the head gimbal circuit and alignment pins on the actuator arm may be used for positioning of the circuits over the top surface of the actuator arm.

Abstract: The storage media recording/writing system includes a media drive circuit, a head retaining means, a head moving means, a head drive circuit, a signal processing circuit, and a controller to control these. The head drive circuit possesses a first semiconductor integrated circuit having an amplifier that amplifies the read signal from the head, and a second semiconductor integrated circuit placed between the first semiconductor integrated circuit and the signal processing circuit, which has a circuit that receives write data from the signal processing circuit and generates a drive signal to drive a write head. Further, the first semiconductor integrated circuit is mounted on a part near the front of the head retaining means, and the second semiconductor integrated circuit is installed on the side of the moving means.

Abstract: A dedicated read IC chip is mounted on a head suspension. The dedicated read IC chip is located closer to a read element. A stray capacitance of a wiring can be reduced. Even if the electric resistance value of the read element increases, the magnetic information data of a higher density can be read out. Moreover, the dedicated read IC chip generates little heat. Even if the dedicated read IC chip is located on the head suspension, an excessive heat cannot be transmitted to the head suspension from the dedicated read IC chip. The mechanical properties and shape of the head suspension can be maintained as expected.

Abstract: A control IC is mounted on a circuit board and is used for driving both a one-inch stepper motor and a half-inch stepper motor. The control IC includes at least a number of pads required for driving the half-inch stepper motor. When the control IC drives the one-inch stepper motor or the half-inch stepper motor, the saturation voltage, the arrangement of the pads having the same functions for driving the one-inch stepper motor and the half-inch stepper motor, and the read/write constants for reading and writing from/into a floppy disk are set to be equal for both the one-inch stepper motor and the half-inch stepper motor.

Abstract: Devices for transducing electromagnetic information are formed on and from a wafer substrate. The devices comprise a head attached to a flexible element such as a gimbal. To create such a device, a transducer and an optional amplifier are formed on a wafer that is then cut into rows containing a number of such transducers. The rows are then processed from directions generally normal to the wafer surface upon which the transducer was formed, by removing material to form a head and flexible elements such as a gimbal, creating a media-facing surface on the head and at least one aperture adjacent the head. Conductive leads may be formed on a non-media-facing surface of a flexible element to connect the transducer with drive electronics. Conventional problems of connecting the head to the flexure and/or gimbal are eliminated, as both are made from the same wafer on which the transducer is formed.

Abstract: A disk drive includes a housing, an actuator arm rotatably mounted in the housing, a suspension fixed at a base end portion thereof to a front end portion of the actuator arm, a head slider mounted on a front end portion of the suspension and having an electromagnetic transducer, and a head IC mounted on the suspension in adjacent relationship with the head slider. The disk drive further includes a radiating flexible printed circuit sheet mounted on the suspension and the actuator arm, the radiating flexible printed circuit sheet having a first end portion fixed to the suspension and thermally connected to the head IC and a second end portion fixed to the actuator arm.

Abstract: A HGA includes a magnetic head slider having at least one thin-film magnetic head element, an IC chip having a circuit for the at least one thin-film magnetic head element, and a suspension for supporting the magnetic head slider and the IC chip. All surfaces of the IC chip are coated by additional insulation layers.

Abstract: A technique to be applied to improve the reliability of a magnetic disk apparatus is disclosed.

Abstract: A head suspension assembly 4 has an arm 17 supported so as to rotate, an elastically flexible suspension 16 having one end which is fixed to an end of the arm and the other end has a magnetic head 2 mounted thereon, and a signal transmission line 18 fixed on the suspension and the arm which connects the magnetic head with a main FPC.

Abstract: An HGA includes a magnetic head slider with at least one thin-film magnetic head element, a resilient flexure made of a stainless steel, supporting the magnetic head slider, a load beam made of a stainless steel, supporting the flexure, for applying a predetermined load to the magnetic head slider, a drive IC chip with a circuit for the at least one thin-film magnetic head element, a lead conductor member on which the drive IC chip is mounted, and a high-thermal-conductivity member made of a material with a higher thermal conductivity than that of the stainless steel and inserted between the lead conductor member and the load beam in a region containing at least a section on which the drive IC chip is mounted.

Abstract: This invention relates to a head suspension with a head IC and makes it possible to simplify checking of the head IC and reduce the cost of the head suspension. A first connection terminal 21 that electrically connects to the head 4; a second connection terminal 22 that connects to external circuits; third and fourth connection terminals 23, 24 that electrically connect to the head IC 20, which processes the electrical signal from the head; a first conductive path 28 that connects the first connection terminal 21 with the third connection terminal 23; a second conductive path 26 that connects the second connection terminal 22 with the fourth connection terminal 24; and a measurement terminal 25 that is located between the second connection terminal 22 and fourth connection terminal 24 are formed on the head suspension 9. With this invention, contact of the probes for checking the head IC when the head IC has been installed before installing the head becomes easier.

Abstract: A head suspension assembly in which a trace having a written pattern is disposed on an arm and a suspension. A slider with a magnetic head formed thereon, and a head amplifier IC are mounted on the wiring pattern. An under fill is injected between the head amplifier IC and the wiring pattern, and an outer surface of the head amplifier IC is coated with a resin.

Abstract: A HSA includes a magnetic head slider with at least one thin-film magnetic head element, an actuator fixed to the magnetic head slider for performing precise positioning of the at least one thin-film magnetic head element, an IC chip having a first circuit for the thin-film magnetic head element and a second circuit for driving the actuator, and a suspension for supporting the actuator and the IC chip.

Abstract: The present invention provides a wiring integrated flexure including a stainless-steel substrate for supporting a magnetic head slider thereon, a wiring conductor formed on the stainless-steel substrate, posts made of a flexible resin and interposed between the stainless-steel substrate and the wiring conductor for electrically isolating the wiring conductor from the stainless-steel substrate, and the posts disposed along the lengthwise direction of the wiring conductor with spacing from each other. A method of manufacturing the wiring integrated flexure is also provided.

Abstract: A magnetic head apparatus including a magnetic head slider having at least one thin film magnetic head element, a suspension mounting the magnetic head slider on one face thereof, an IC chip mounted with a circuit for the thin film magnetic head element and a support arm fixedly supporting the suspension in which the IC chip is mounted on the one face of the suspension and is thermally coupled to the support arm.

Abstract: A head suspension or head suspension component that includes a spring metal support layer, an insulating layer and a conductive layer, into which three dimensional heat dissipation structures have been integrally formed to dissipate heat from the head suspension, especially in an area adjacent to an integrated circuit mounted on the head suspension. The heat dissipation structures may include a plurality of heat fins formed into or onto one or more conductive traces of the conductive layer, or may include a plurality of projections or indentations formed into or onto conductive traces. Use of a partial etching technique allows for simultaneous etching of both the traces and the heat fins within the traces, thereby decreasing production costs and increasing head suspension reliability. Heat fins may also be formed into the support layer in a region adjacent to the conductive layer heat fins, if desired in order to dissipate even more heat from the region.

Abstract: A wired flexure comprises a metallic substrate, a polyimide layer formed on the metallic substrate, and read conductors and write conductors formed on the polyimide layer. The polyimide layer has a thick-walled portion and a thin-walled portion that are different in thickness. The read and write conductors extend covering the thick- and thin-walled portions. In order to obtain a desired impedance, the width of the conductors in the thin-walled portion is smaller than that of the conductors in the thick-walled portion.

Abstract: An information storage device (10, 510, 610, 710) includes a cradle (12, 512, 612, 712) which can removably receive a cartridge (11, 411, 511, 611, 711). The cartridge contains a rotatably supported disk (91, 326-327), and a pivotal actuator arm (101) which supports a read/write head (107, 331-334) for movement adjacent the disk. A coil (117) on the arm interacts with an external magnetic field to effect pivotal movement of the arm. The cartridge may contain a spin motor (92) for effecting rotation of a disk. A preamplifier (111) and an electrostatic discharge buffer (112) are provided for the head. A read-only memory (186) contains characteristic information about the cartridge, and an hour meter (191) contains information about the cumulative amount of time that the cartridge has been used. A connector (71) is provided to electrically couple external circuitry to electrical components within the cartridge.

Abstract: A protective mounting for a microchip on a suspension is provided by locating the microchip in an opening in the load beam extending from the edge rail side through to the slider side and attaching the microchip there to a flexible circuit conductor extending on the slider side.

Abstract: A protective mounting for a microchip on a suspension is provided by locating the microchip in an opening in the load beam extending from the edge rail side through to the slider side and attaching the microchip there to a flexible circuit conductor extending on the slider side.

Abstract: A magnetic head supporting apparatus having a magnetic head for reading and writing information on a magnetic disc, a slider for mounting the magnetic head, and a suspension for supporting the slider. An IC chip for controlling a signal of the magnetic head is mounted on a heat insulating substrate which substantially prevents conduction of heat therethough, and the heat insulating substrate is mounted to the suspension.

Abstract: To restrain temperature rise by controlling heat radiation from an IC. More specifically, an area of junctioning pads which are in contact with an IC is enlarged to substantially overlap the whole or at least half or more of the area of the IC. Further, the IC is covered with an overcoat which protrudes to other parts of a head supporting mechanism.

Abstract: A suspension has an extending end and the other end. A head IC chip mounting portion is provided between the extending end and the other end of the suspension. A head slider is loaded on a first surface of the suspension at a position on the side of the extending end with respect to the head IC chip mounting portion, the head slider integrally including a head. A head IC chip is mounted at the head IC chip mounting portion of the suspension. First wiring patterns extend along the suspension between a portion of the suspension, at which portion the head slider is loaded, and the head IC chip mounting portion. Second wiring patterns extend along the suspension between the head IC chip mounting portion and the other end of the suspension. The head IC chip is mounted at the head IC chip mounting portion in a condition in which a certain portion of the head IC chip is positioned on the side of a second surface of the suspension, which second surface is opposite to the first surface.

Abstract: A magnetic head includes a suspension; a slider mounted on the suspension and having a magnetic head element; and an integrated circuit bare chip mounted on the suspension and having a control circuit for the magnetic head element. The entire surface of the IC bare chip is covered with a photo-curable and thermosetting resin material. The photo-curable and thermosetting resin material covering the IC bare chip is irradiated with light in order to harden the resin surface. Thereafter, the entire photo-curable and thermosetting resin material is heated and hardened.

Abstract: A head suspension assembly includes a magnetic head slider with at least one thin-film magnetic head element, a head IC chip with a circuit for the at least one thin-film magnetic head element, and a support member for supporting the magnetic head slider and the head IC chip. The support member has a recess portion for reducing a protruded height of the head IC chip at a position for mounting the head IC chip.

Abstract: A magnetic head supporting apparatus having a magnetic head for reading and writing information on a magnetic disc, a slider for mounting said magnetic head, and a suspension for supporting the slider. An IC chip for controlling a signal of the magnetic head is mounted on a heat insulating substrate, and the heat insulating substrate is mounted to the suspension.

Abstract: There is disclosed a magnetic disc device wherein temperature increase in the head IC chip can effectively suppressed. The magnetic head device comprises a slider having a magnetic head, a suspension structure having one end supporting the slider, and a head IC chip, the head IC chip being mounted on the suspension structure at a side adapted to be faced to a magnetic recording disc. A flow of air produced by the rotation of the magnetic disc cols the head IC chip in operation.

Abstract: A height-restriction plate having a size in plan view larger than that of an IC chip is bonded to an upper face of the IC chip which is fixed to a FPC formed along a suspension. The IC chip is sealed at the periphery thereof with an adhesive which reaches the height-restriction plate and the FPC.

Abstract: A magnetic head supporting apparatus includes a magnetic head for reading and writing information on a magnetic disc, a slider having the magnetic head, and a suspension for supporting the slider. An IC chip for controlling a signal of the magnetic head is mounted on a first surface of a heat insulating substrate, and a second surface of the heat insulating substrate opposite to the first surface thereof is mounted to the suspension.

Abstract: The invention provides greatly shortened electrical paths for the wires or traces connecting a disk drive suspension slider to the preamplifier circuit chip without problems of chip wastage by supporting the disk drive suspension assembly of a slider, a flexure, a load beam and a mounting plate, all in operative association on the preamplifier circuit chip, and supporting the chip on the actuator arm.

Abstract: One joint member having a melting point different from that of the other joint member is joined to each bonding pad of a slider and further joined to each bonding pad of a suspension through the other joint member. The slider is exfoliated from the suspension in the state that the one joint member is attached to the slider by heating and melting the other joint member.

Abstract: An HGA includes a magnetic head slider with at least one thin-film magnetic head element, a resilient flexure made of a stainless steel, supporting the magnetic head slider, a load beam made of a stainless steel, supporting the flexure, for applying a predetermined load to the magnetic head slider, a drive IC chip with a circuit for the at least one thin-film magnetic head element, a lead conductor member on which the drive IC chip is mounted, and a high-thermal-conductivity member made of a material with a higher thermal conductivity than that of the stainless steel and inserted between the lead conductor member and the load beam in a region containing at least a section on which the drive IC chip is mounted.

Abstract: An integrated lead suspension or flexure having an integrated circuit (IC) mounting region on which an IC chip with an array of solder-covered terminals can be mounted. The suspension or flexure include a stainless steel layer, integrated conductive leads and an insulating layer between the conductive leads and the stainless steel layer. The stainless steel layer has an IC window for receiving an array of terminals of an IC. The integrated conductive leads extend along the stainless steel layer into the IC window, and include an array of bond pads in the IC window corresponding to the array of terminals of the IC to be mounted to the suspension or flexure. The insulating layer extends into the IC window and includes an array of solder mask holes corresponding to the array of conductive lead bond pads.

Abstract: A suspension has an extending end and the other end. A head IC chip mounting portion is provided between the extending end and the other end of the suspension. A head slider is loaded on a first surface of the suspension at a position on the side of the extending end with respect to the head IC chip mounting portion, the head slider integrally including a head. A head IC chip is mounted at the head IC chip mounting portion of the suspension. First wiring patterns extend along the suspension between a portion of the suspension, at which portion the head slider is loaded, and the head IC chip mounting portion. Second wiring patterns extend along the suspension between the head IC chip mounting portion and the other end of the suspension. The head IC chip is mounted at the head IC chip mounting portion in a condition in which a certain portion of the head IC chip is positioned on the side of a second surface of the suspension, which second surface is opposite to the first surface.

Abstract: An HGA includes a magnetic head slider with at least one thin-film magnetic head element, a drive IC chip with a circuit for the at least one thin-film magnetic head element, a resilient flexure made of a stainless steel for supporting the magnetic head slider and the drive IC chip, a load beam made of a high-thermal-conductivity material with a higher thermal conductivity than that of the stainless steel, supporting the flexure, a base plate, and a hinge made of a stainless steel, fixed to a base section of the load beam and to the base plate, for applying a predetermined load to the magnetic head slider.