Electrical Connection Detail Patents (Class 360/245.8)
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Patent number: 11289120Abstract: A head gimbal assembly for supporting a disk drive includes a flexure, a slider, a load beam and a gimbal affixed to the load beam. The flexure includes a first end extending along the load beam through a center region of a longitudinal axis of the head gimbal assembly and second end that includes a plurality of bond pads electrically coupled to the slider. The gimbal includes a detab, a connector region, a stator region and a central tongue region. The gimbal includes a gimbal tether configured to reduce stress on a first portion of the gimbal by coupling the first portion of the gimbal to a second portion of the gimbal.Type: GrantFiled: March 25, 2021Date of Patent: March 29, 2022Assignee: Seagate Technology LLCInventor: Mark Pallay
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Patent number: 11210628Abstract: Aspects of the invention include a computer-implemented method, in which includes determining whether a combination of a first commodity and a computing system satisfies a manufacturing requirement. Additionally, whether a combination of a second commodity and the computing system satisfies the manufacturing requirement is predicted based at least in part on a comparison of the combination of the first commodity and the computing system and the combination of the second commodity and the computing system. Then either the first commodity or the second commodity is inserted into a computer system based at least in part on a comparison of an actual performance of the first commodity and a predicted performance of the second commodity in the computing system.Type: GrantFiled: February 14, 2020Date of Patent: December 28, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Edward C. McCain, Pascal R. Bastien, Bradley Steen, Daniel Alexander Thorne, Lucas Dane LaLima, Tyler Michael Shiling, Emily Venuto, Daniela Yaniv, Nicholas Ziemis
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Patent number: 11043234Abstract: A spin torque reversal assisted magnetic recording (STRAMR) structure is disclosed wherein a spin torque oscillator (STO) is formed in the write gap (WG) and generates one or both of a radio frequency (RF) field on a magnetic bit to lower the required write field during a write process, and a spin torque on a field generation layer (FGL) in the STO that flips a FGL magnetization to a direction opposing the WG field thereby increasing reluctance in the WG and causing larger write field output from the main pole (MP). The FGL is between two spin preserving layers that each conduct spin polarized current from an adjoining spin polarization (SP) layer. Current is applied from the MP and trailing shield to the SP layers, and returns to a direct current source through a lead from the FGL. STO sidewalls are self-aligned to a MP tip upper portion.Type: GrantFiled: August 21, 2019Date of Patent: June 22, 2021Assignee: Headway Technologies, Inc.Inventor: Yan Wu
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Patent number: 10706876Abstract: A recording head for writing data on tracks of a data storage medium. The recording head includes a writer having a write pole and a trailing shield. The write pole includes a pole tip configured to write on the tracks of the data storage medium. The recording head also includes a writing-assistance wire that is positioned between the pole tip and the trailing shield in a down-track direction.Type: GrantFiled: June 13, 2019Date of Patent: July 7, 2020Assignee: SEAGATE TECHNOLOGY LLCInventors: Tim Rausch, Edward Charles Gage, Zengyuan Liu
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Patent number: 10700446Abstract: A connector is provided having a shaft member and a wire substrate. The wire substrate is wound helically on a surface of the shaft member. The wire substrate includes a band-shaped base material, a plurality of conductive wires provided on one surface of the base material, and a plurality of contact pads provided on another surface of the base material. Each of the conductive wires is connected to each of the contact pads, and the contact pads are exposed on an outside of the wire substrate aligned so as to open a gap in a length direction of the shaft member, in a state where the wire substrate is wound helically on the surface of the shaft member.Type: GrantFiled: January 3, 2018Date of Patent: June 30, 2020Assignee: Molex, LLCInventors: Naoyoshi Tamura, Takeshi Tsukahara, Taku Yanagihashi
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Patent number: 10614845Abstract: According to one embodiment, a magnetic disk device includes a base that includes a bottom wall and side walls standing along a circumference of the bottom wall, a housing that includes a cover facing the bottom wall and closing the base, an actuator assembly that is housed inside the housing and is rotatable around a rotation axis, a head movably supported by the actuator assembly, a control circuit board provided outside of the housing, a first sensor disposed on the control circuit board, and a second sensor disposed inside the housing.Type: GrantFiled: August 24, 2018Date of Patent: April 7, 2020Assignees: Kabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage CorporationInventor: Norio Yoshikawa
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Patent number: 10524355Abstract: In a suspension board, a ground layer and a first insulating layer are formed on a support substrate. The ground layer has electric conductivity higher than that of the support substrate. A power wiring trace is formed on the first insulating layer. A second insulating layer is formed on the support substrate to cover the ground layer and the first insulating layer. A write wiring trace is formed on the second insulating layer to at least partially overlap with the ground layer. A distance between the ground layer and the write wiring trace in a stacking direction of the support substrate, the first insulating layer and the second insulating layer is set larger than a distance between the power wiring trace and the write wiring trace in the stacking direction.Type: GrantFiled: April 17, 2017Date of Patent: December 31, 2019Assignee: NITTO DENKO CORPORATIONInventors: Daisuke Yamauchi, Hiroyuki Tanabe
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Patent number: 10330576Abstract: A sensor for measuring shear force and a dummy for testing a vehicle using the same are provided herein. A sensor for measuring shear force which is configured to quantitatively accurately measure shear force applied to a human body who sits on a vehicle seat, and a dummy for measuring shear force using the sensor are provided, wherein the sensor for measuring shear force includes an upper block, an intermediate block and a lower block and is configured such that a first strain gauge is mounted upright between the upper block and the intermediate block and a second strain gauge is mounted upright between the intermediate block and the lower block so that the shear force can be accurately measured without being affected by horizontal tensile force.Type: GrantFiled: August 30, 2017Date of Patent: June 25, 2019Assignees: Hyundai Motor Company, Kia Motors Corporation, University Industry Foundation, Yonsei University Wonju CampusInventors: Tae Uk Kang, Han Sung Kim, Seong Guk Kim, Dong Hyun Kim, Dong Hyun Hwang, Han A. Lee, Ye Eun Song
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Patent number: 10283150Abstract: Disclosed herein are suspension assembly structures for data storage devices that include physical or virtual crossovers of the pairs of differential signal traces to improve immunity to crosstalk and other interference. In an embodiment, the suspension assembly structure comprises a first trace for carrying a first component of a current to a differential transducer on a slider, a second trace for carrying a second component of the current to the differential transducer on the slider, and third and fourth traces for providing a differential write current to a writer of the data storage device, wherein the first trace physically crosses over the second trace at a first distance from a tail of the suspension assembly structure.Type: GrantFiled: August 2, 2017Date of Patent: May 7, 2019Assignee: Western Digital Technologies, Inc.Inventors: John Contreras, Rehan Zakai, Albert Wallash, Tzong-Shii Pan
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Patent number: 10222279Abstract: Described is a force sensor stack configured to measure incident force. Data from the force sensor stack may be used to determine a weight of an object, determine a force distribution of the object resting on the force sensor stack, and so forth. The force sensor stack may comprise a plurality of force sensor layers. Each of the force sensor layers may be responsive to a different range of applied forces. The combined force sensor stacks may thus provide a wide dynamic range. A pressure concentrator layer may be configured to direct the incident force to particular portions of the force sensor layers.Type: GrantFiled: June 19, 2014Date of Patent: March 5, 2019Assignee: AMAZON TECHNOLOGIES, INC.Inventors: Louis Leroi Legrand, III, Debanjan Mukherjee
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Patent number: 9905273Abstract: An apparatus includes an actuator assembly, a dampening assembly coupled to the actuator assembly, and a vibration sensor assembly coupled to the dampening assembly and coupled to the actuator assembly by way of the dampening assembly. A method includes attaching a dampening assembly to an actuator assembly and attaching a vibration sensor assembly to the dampening assembly. The dampening assembly is positioned between the vibration sensor assembly and the actuator assembly.Type: GrantFiled: April 26, 2016Date of Patent: February 27, 2018Assignee: Seagate Technology LLCInventors: Antanas Daugela, Neal F. Gunderson, Reed D. Hanson, Ricardo P. Freeman, Andrew R. Motzko, Erik J. Lindquist
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Patent number: 9836090Abstract: The present disclosure provides an electronic device and a method for controlling the electronic device, capable of solving the problem that the screen of the electronic device is fragile in use. The electronic device comprises a display unit having an electro-deformable layer provided on its surface. The method comprises: detecting a state parameter of the electronic device; determining whether the electronic device is in a predetermined state based on the state parameter; and applying, upon determining that the electronic device is in the predetermined state, a predetermined current to the electro-deformable layer, such that a strength of the electro-deformable layer is increased from a first, default strength to a second strength.Type: GrantFiled: December 18, 2015Date of Patent: December 5, 2017Assignees: Beijing Lenovo Software Ltd., Lenovo (Beijing) LimitedInventor: Chen Chen
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Patent number: 9812160Abstract: A stainless steel dual stage actuated disk drive head suspension baseplate including a plated electrical contact area having nickel and gold. The baseplate can be heat treated. The nickel and gold can be in a mixture.Type: GrantFiled: December 18, 2015Date of Patent: November 7, 2017Assignee: Hutchinson Technology IncorporatedInventors: Jeffry S. Bennin, Jacob D. Bjorstrom, Shawn P. Bopp, Reed T. Hentges, Michael T. Hofflander, Richard R. Jenneke, Craig A. Leabch, Mark S. Lewandowski, Zachary A. Pokornowski, Brian D. Schafer, Brian J. Stepien, John A. Theget, John E. Theisen, John L. Wagner
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Patent number: 9489971Abstract: A system includes a first preamplifier, a second preamplifier and a flex circuit. The first preamplifier is configured to be connected to a first plurality of recording heads. The second preamplifier is configured to be connected to a second plurality of recording heads. At least one of the first plurality of recording heads and at least one of the second plurality of recording heads are configured to concurrently perform read and or write operations. The flex circuit is a single flex circuit configured to connect the first and second preamplifiers to the plurality of recording heads.Type: GrantFiled: January 29, 2015Date of Patent: November 8, 2016Assignee: SEAGATE TECHNOLOGY LLCInventors: Karsten Klarqvist, Andrew R. Motzko, Rick P. Freeman
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Patent number: 9396747Abstract: An interleave circuit includes a metal base, an insulating layer, a first conductor member having first branch conductors, a second conductor member having second branch conductors, and a jumper conductor, which is a part of the metal base. The jumper conductor includes a branch-side metal portion, a pad-side metal portion, and a bridge portion. The bridge portion is formed between the branch-side metal portion and the pad-side metal portion. The branch-side metal portion electrically conducts to connecting terminals of the first branch conductors via branch-side connecting members. The pad-side metal portion electrically conducts to an electrode pad via a pad-side connecting member. The bridge portion includes a crossover portion which crosses over a third conductor member.Type: GrantFiled: August 26, 2015Date of Patent: July 19, 2016Assignee: NHK SPRING CO., LTD.Inventor: Sei Kawao
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Patent number: 9076957Abstract: A terminal extending from a wiring member to face an electrode of a piezoelectric element and including a proximal end part and a distal end part with respect to the wiring member, the distal end part being connected to the electrode of the piezoelectric element through a conductive adhesive, comprising an insulating layer that faces the electrode of the piezoelectric element; a wiring layer laid on the insulating layer and connected to the electrode at the distal end part; and at least one liquid stopping recess provided on a surface facing the electrode at the proximal end part, the liquid stopping recess spanning between both edges of the insulating layer in an direction intersecting an extending direction of the proximal end part.Type: GrantFiled: March 14, 2013Date of Patent: July 7, 2015Assignee: NHK Spring Co., Ltd.Inventors: Yoichi Ikeji, Jun Soga, Hideki Fuchino, Hiroshi Ono, Hiroaki Kamijo
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Patent number: 9070418Abstract: A cutting jig cuts bonding material of a terminal joint between a magnetic head's slider and a flexure's wiring terminal. A base of the jig receives the slider. A blade moves along the base and faces a front side wall of the slider in a moving direction. An upright portion of the jig is formed on the base and has a stop face that faces a rear side wall of the slider in the moving direction. The blade moves toward the slider to come into contact with the bonding material, and is pressed to the front side wall of the slider. The bonding material is interposed in the moving direction while the rear side wall of the slider is brought into contact with and is stopped by the stop face when the slider is set on the base and the bonding material is cut.Type: GrantFiled: January 15, 2013Date of Patent: June 30, 2015Assignee: NHK Spring Co., Ltd.Inventors: Sei Kawao, Takeshi Shimoda, Shinpei Kakiuchi
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Patent number: 9025282Abstract: An integrated lead flexure for a disk drive head suspension formed from layers of material including a spring metal layer, a conductive material layer and an insulating material layer between the spring metal and conductive material layers. One embodiment includes a gimbal region having flying traces and one or more elongated tethers extending from the spring metal layer and along a distance of the flying traces that is less than the length of the flying traces. Another embodiment includes a load beam spring region traversing portion having unsupported traces and one or more elongated tethers extending from the spring metal layer and along a distance of the unsupported traces that is less than the length of the unsupported traces.Type: GrantFiled: February 3, 2012Date of Patent: May 5, 2015Assignee: Hutchinson Technology IncorporatedInventor: Mark A. Miller
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Publication number: 20150109704Abstract: A suspension substrate of the present invention includes an insulating layer, a spring material layer, and a plurality of wirings, wherein one wiring of the plurality of wirings includes a head-side wiring part and a plurality of division wiring parts, respectively bifurcated from the head-side wiring part. The spring material layer includes a spring-material-layer main body, a first spring-material-layer separated body and a second spring-material-layer separated body. The division wiring parts of the one wiring are respectively connected with the first spring-material-layer separated body, via a pair of conductive connection parts, respectively extending through the insulating layer. The first spring-material-layer separated body is located on one side relative to the longitudinal axis, while the second spring-material-layer separated body is located on the other side relative to the longitudinal axis.Type: ApplicationFiled: August 18, 2014Publication date: April 23, 2015Inventor: Yoichi MIURA
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Patent number: 8995090Abstract: A wiring circuit substrate, comprising: a metal support layer; an insulating layer formed on the metal support layer; a conductive layer for wiring formed on the insulating layer; and an opening formed so as to open at a same location in the insulating layer and the conductive layer for wiring, wherein the metal support layer includes: a support section that supports the insulating layer and the conductive layer for wiring, and a terminal section that extends from one edge side to the other edge side of the opening, the terminal section being separated from the support section; and the conductive layer for wiring includes a wiring that is connected to the terminal section by a connecting section.Type: GrantFiled: February 24, 2012Date of Patent: March 31, 2015Assignee: Dai Nippon Printing Co., Ltd.Inventors: Jin Nishiyama, Yuji Narita
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Patent number: 8885297Abstract: Various embodiments concern a dual stage actuation flexure having a motor contact paddle for connecting to a terminal of a piezoelectric motor. The flexure comprises a paddle having a top side and a bottom side, the paddle comprising at least one void, each void extending through the paddle from the bottom side to the top side. The paddle further comprises a stainless steel base, a conductor comprising a layer of metal, and a dielectric layer having a first section and a second section, the first section positioned between the conductor and the stainless steel base to overlap the stainless steel base and the second section extending beyond the stainless steel base to not overlap the stainless steel base. The bottom side of the paddle is configured to connect to the terminal with electrically conductive adhesive.Type: GrantFiled: July 21, 2014Date of Patent: November 11, 2014Assignee: Hutchinson Technology IncorporatedInventors: Jacob D. Bjorstrom, Nole D. German, Paul V. Pesavento, Zachary A. Pokornowski, Ryan N. Ruzicka, Kurt C. Swanson, Allan D. Tokuda
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Publication number: 20140313619Abstract: First and second laminated structures are respectively formed at one surface and the other surface of an insulating layer. A laminate is formed of the first laminated structure, the insulating layer and the second laminated structure. A heat-assisted wiring trace is included in the first laminated structure, and a support substrate and a connection terminal are included in the second laminated structure. The surface of the connection terminal is exposed at the other surface of the insulating layer. A first portion of the laminate including the connection terminal has a thickness smaller than the thickness of second and third portions of the laminate including portions on both sides of the connection terminal.Type: ApplicationFiled: March 31, 2014Publication date: October 23, 2014Applicant: NITTO DENKO CORPORATIONInventors: Yuu SUGIMOTO, Takatoshi SAKAKURA
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Patent number: 8842505Abstract: According to one embodiment, a first magnetic head is used to record or reproduce data on or from the first disk surface and includes a first two-terminal element including a first positive terminal and a first negative terminal. A second magnetic head is used to record or reproduce data on or from the second disk surface and includes a second two-terminal element including a second positive terminal and a second negative terminal. A current control unit includes a first current terminal which is commonly connected to the first positive terminal and the second negative terminal and a second current terminal that is commonly connected to the first negative terminal and the second positive terminal and can switch a current polarity between the first current terminal and the second current terminal.Type: GrantFiled: March 14, 2013Date of Patent: September 23, 2014Assignee: Kabushiki Kaisha ToshibaInventor: Yuuichi Yamada
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Patent number: 8817423Abstract: An Extended Circuit Integrated Suspension (ECIS) design and manufacture thereof, to allow for circuit elements to be disposed onto the load beam on the opposite side of the flexure circuit. An Extended Circuit Integrated Suspension (ECIS) may include a load beam; a flexure circuit comprising a plurality of traces; and a connection portion which connects the load beam laterally to the flexure circuit. The load beam, the flexure circuit, and the connecting portion may be formed as a single component from a single panel, and the connection portion is oriented so that the connection portion is folded to place the flexure circuit onto a first side of the load beam. Applications for the use of the extended circuit are many, and a semi-collocated micro-actuator (SCLMA) is illustrated for example.Type: GrantFiled: October 9, 2012Date of Patent: August 26, 2014Assignee: Nitto Denko CorporationInventors: Martin John McCaslin, Alex Enriquez Cayaban
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Patent number: 8804135Abstract: A method of measuring attitude angles of a tongue of a head suspension, the tongue including a fitting face on which a plurality of electrodes are arranged, emits a single collimated laser beam to an area of a fitting face containing at least two of electrodes, detects a reflected beam from the fitting face, extracts electrode reflective components corresponding to the electrodes from the reflected beam, and according to the electrode reflective components, measures the attitude angles of the tongue.Type: GrantFiled: September 10, 2012Date of Patent: August 12, 2014Assignee: NHK Spring Co., Ltd.Inventors: Akio Mashima, Kenichiro Nakano, Shinichi Gotoh, Yasushi Nasuno
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Patent number: 8792214Abstract: Various embodiments concern a dual stage actuation flexure having a motor contact paddle for connecting to a terminal of a piezoelectric motor. The flexure comprises a paddle having a top side and a bottom side, the paddle comprising at least one void, each void extending through the paddle from the bottom side to the top side. The paddle further comprises a stainless steel base, a conductor comprising a layer of metal, and a dielectric layer having a first section and a second section, the first section positioned between the conductor and the stainless steel base to overlap the stainless steel base and the second section extending beyond the stainless steel base to not overlap the stainless steel base. The bottom side of the paddle is configured to connect to the terminal with electrically conductive adhesive.Type: GrantFiled: December 12, 2013Date of Patent: July 29, 2014Assignee: Hutchinson Technology IncorporatedInventors: Jacob D. Bjorstrom, Nole D. German, Paul V. Pesavento, Zachary A. Pokornowski, Ryan N. Ruzicka, Kurt C. Swanson, Allan D. Tokuda
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Patent number: 8773819Abstract: Actuator elements are accommodated in openings formed in a conductive plate. These actuator elements are secured to the conductive plate by a resin bonding material. An electrode of each actuator element and the conductive plate are electrically connected to each other by a bridge junction consisting of an conductive paste. A paste application device discharges the conductive paste toward the bridge junction by air. A control unit configured to control the discharge of the conductive paste sets the air pressure according to the elapsed time of use of the conductive paste so that the height of the paste above the resin bonding material is not less than a target height. The target height is maintained by increasing the air pressure with increase of the elapsed time of use of the conductive paste.Type: GrantFiled: April 25, 2013Date of Patent: July 8, 2014Assignee: NHK Spring Co., Ltd.Inventors: Yoichi Ikeji, Haruyuki Yamamoto, Tsuyoshi Amemiya, Hiroshi Ono
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Patent number: 8767352Abstract: A suspension board with circuit includes a conductive pattern, including a slider arranged on a surface side of the suspension board with circuit and mounted with a magnetic head, the magnetic head being electrically connected with the conductive pattern; and a light emitting device arranged on the back surface side of the suspension board with circuit and electrically connected with the conductive pattern, in which the conductive pattern includes a first terminal provided on a surface of the suspension board with circuit and electrically connected with the magnetic head; and a second terminal provided on the back surface of the suspension board with circuit and electrically connected with the light emitting device.Type: GrantFiled: October 4, 2013Date of Patent: July 1, 2014Assignee: Nitto Denko CorporationInventors: Tetsuya Ohsawa, Hayato Abe, Yoshinari Yoshida, Toshiki Naito
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Patent number: 8760815Abstract: The wired circuit board includes a metal supporting board, a metal foil formed on the metal supporting board, a first insulating layer formed on the metal supporting board so as to cover the metal foil, and a conductive pattern formed on the first insulating layer and having a plurality of wires. The metal foil is arranged along a lengthwise direction of each of the wires so as not to be opposed to part of the wires in a thickness direction and so as to be opposed to a remainder of the wires in the thickness direction.Type: GrantFiled: May 9, 2008Date of Patent: June 24, 2014Assignee: Nitto Denko CorporationInventors: Jun Ishii, Takahiko Yokai
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Publication number: 20140160599Abstract: A suspension board with circuit includes a metal supporting layer, an insulating base layer formed on the metal supporting layer, a conductive layer formed on the insulating base layer, and a slider supported on the metal supporting layer via a pedestal. The conductive layer includes a conductive overlapping portion which overlaps a plane on which the slider is projected when projected in a thickness direction. The conductive overlapping portion is provided to be spaced apart from the slider.Type: ApplicationFiled: November 21, 2013Publication date: June 12, 2014Applicant: NITTO DENKO CORPORATIONInventors: Naotaka HIGUCHI, Hitoki KANAGAWA, Tadashi TAKAHASHI
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Patent number: 8749923Abstract: A main object of the present invention is to provide a suspension substrate which can decrease the whole thickness thereof and limit the generation of warpage. To attain the object, the present invention provides a suspension substrate comprising: an insulation layer, a pair of wirings consisting of an upper wiring formed on one surface of the insulation layer and a lower wiring formed on the other surface of the insulation layer, and a metal substrate formed on the surface of the insulation layer on the lower wiring side.Type: GrantFiled: December 18, 2009Date of Patent: June 10, 2014Assignee: Dai Nippon Printing Co., Ltd.Inventor: Kenro Hirata
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Patent number: 8737020Abstract: A suspension circuit board comprises a metal support board, a first insulation layer disposed on the metal support board a conductive layer disposed on the first insulation layer, the conductive layer forming a wire; and a second insulation layer disposed on the first insulation layer and the conductive layer. The suspension circuit board is configured that, upon applying a load in a thickness direction to the conductive layer at a position corresponding to the first insulation opening, F1<F2, when a stress generated in the conductive layer at a position corresponding to a periphery of the first insulation opening is represented as a first stress F1 and a stress generated in the conductive layer at a position corresponding to a periphery of the metal support board opening is represented as a second stress F2.Type: GrantFiled: December 2, 2010Date of Patent: May 27, 2014Assignee: Dai Nippon Printing Co., Ltd.Inventors: Shinichiro Busujima, Yoichi Miura, Kenro Hirata, Tempei Yamaoka
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Patent number: 8711521Abstract: A suspension for a head gimbal assembly includes a flexure having a laminated structure including a substrate layer, an insulating layer formed on the substrate layer, and a conducting layer formed on the insulating layer. And first bonding pads are formed on the conducting layer at a first surface of the flexure, so as to electrically connect with a slider via solder balls, and second bonding pads are formed on the substrate layer at a second surface of the flexure opposite to the first surface, so as to electrically connect with extra components formed at the second surface via solder balls. The suspension can connect slider and other extra components at two opposite surfaces of the flexure with a simplified and compacted structure and a reduced cost.Type: GrantFiled: September 30, 2011Date of Patent: April 29, 2014Assignee: SAE Magnetics (H.K.) Ltd.Inventors: Xian wen Feng, Fu quan Pang, Hai ming Zhou
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Patent number: 8675311Abstract: An interleaved conductor structure for electrically connecting the read/write electronics to a read/write head in a hard disk drive is provided. The interleaved conductor structure may allow for an increased characteristic-impedance range, greater interference shielding and a reduction of signal loss that is contributed by a lossy conductive substrate. The electrical traces may have different widths, be offset, or even wrap around each other at the via connections.Type: GrantFiled: December 22, 2010Date of Patent: March 18, 2014Assignee: HGST Netherlands B.V.Inventors: John T. Contreras, Nobumasa Nishiyama, Edgar D. Rothenberg, Rehan A. Zakai, Yiduo Zhang
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Publication number: 20140063660Abstract: Various embodiments concern a DSA suspension of a disk drive. The DSA suspension comprises a support configured to attach to the disk drive, the support comprising a proximal portion, a distal portion, and a linkage portion therebetween. The DSA head suspension system further comprises at least one motor mounted on the support, each motor positioned between the proximal portion and the distal portion. The DSA suspension further comprises a damper attached to some or all of the proximal portion, the motor(s), the distal portion, and the linkage portion. The damper can be a single layer or multilayered. The damper can comprise viscoelastic material. The damper can be adhesive. The damper may only be attached to the support and the motors and not to other components of the DSA suspension.Type: ApplicationFiled: July 31, 2013Publication date: March 6, 2014Applicant: Hutchinson Technology IncorporatedInventors: Jacob D. Bjorstrom, Zachary A. Pokornowski
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Patent number: 8609992Abstract: The problem of the present invention is to provide a circuit board comprising a shape retention unit capable of thinning while maintaining mechanical strength. The present invention solves the above-mentioned problem by providing a circuit board comprising a metal supporting substrate, a first insulating layer formed on the above-mentioned metal supporting substrate, and a wiring layer formed on the above-mentioned first insulating layer, wherein an open area is formed in the above-mentioned metal supporting substrate, and the circuit board comprises a shape retention unit having a second insulating layer contacting with the above-mentioned metal supporting substrate and a reinforcing layer formed on the above-mentioned second insulating layer, and bridging the above-mentioned metal supporting substrate divided by the above-mentioned open area.Type: GrantFiled: December 24, 2010Date of Patent: December 17, 2013Assignee: Dai Nippon Printing Co., Ltd.Inventors: Junichi Chiyonaga, Hiromichi Takatsu, Yoichi Miura, Yoichi Nagai
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Publication number: 20130321958Abstract: Actuator elements are accommodated in openings formed in a conductive plate. These actuator elements are secured to the conductive plate by a resin bonding material. An electrode of each actuator element and the conductive plate are electrically connected to each other by a bridge junction consisting of an conductive paste. A paste application device discharges the conductive paste toward the bridge junction by air. A control unit configured to control the discharge of the conductive paste sets the air pressure according to the elapsed time of use of the conductive paste so that the height of the paste above the resin bonding material is not less than a target height. The target height is maintained by increasing the air pressure with increase of the elapsed time of use of the conductive paste.Type: ApplicationFiled: April 25, 2013Publication date: December 5, 2013Applicant: NHK SPRING CO., LTD.Inventors: Yoichi IKEJI, Haruyuki YAMAMOTO, Tsuyoshi AMEMIYA, Hiroshi ONO
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Patent number: 8598460Abstract: An interleaved conductor structure for electrically connecting the read/write electronics to a read/write head in a hard disk drive is provided. The interleaved conductor structure may allow for an increased characteristic-impedance range, greater interference shielding and a reduction of signal loss that is contributed by a lossy conductive substrate. The electrical traces may have different widths, be offset, or even wrap around each other at the via connections.Type: GrantFiled: December 22, 2010Date of Patent: December 3, 2013Assignee: HGST Netherlands B.V.Inventors: John T. Contreras, Nobumasa Nishiyama, Edgar D. Rothenberg, Rehan A. Zakai, Yiduo Zhang
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Publication number: 20130314821Abstract: A terminal area includes a metal plate, an electrically insulating layer, and a conductor layer. An opening section is formed in the metal plate and the insulating layers A gold plating layer is formed on a surface of the conductor layer inside the opening section. A porous metal layer of a first transition element is formed on a surface of the gold plating layer. Through-holes of the porous metal layer reach the surface of the gold plating layer. An electrically conductive adhesive is provided between an electrode of an actuator element and the porous metal layer. An anchor portion of the electrically conductive adhesive gets into the through holes and is cured. Conductive particles of the electrically conductive adhesive contact the gold plating layer.Type: ApplicationFiled: April 5, 2013Publication date: November 28, 2013Applicant: NHK SPRING CO., LTD.Inventor: Mikio Arai
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Patent number: 8593765Abstract: A head gimbal assembly having a stage fixed to a head-slider. A piezoelectric element which comprises; an upper surface, a first side surface, a second side surface, a lower surface, a first electrode, a second electrode, and a gap between the first and second electrodes on the lower surface, the piezoelectric element moving the stage by extension or contraction thereof according to a voltage applied to the first and second electrodes. A transmission wiring part which has a connection pad for the piezoelectric element. A cross-connector for physically and electrically cross-connecting the first electrode and the connection pad. An adhesive fixing part which is formed from an insulating adhesive and adhesively fixes the lower surface of the piezoelectric element to the transmission wiring part, between an end of the second electrode at the gap and the cross-connector.Type: GrantFiled: December 20, 2010Date of Patent: November 26, 2013Assignee: HGST Netherlands B.V.Inventors: Yoshio Uematsu, Tatsumi Tsuchiya, Tadaaki Tomiyama
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Patent number: 8587904Abstract: A suspension board with circuit includes a conductive pattern, including a slider arranged on a surface side of the suspension board with circuit and mounted with a magnetic head, the magnetic head being electrically connected with the conductive pattern; and a light emitting device arranged on the back surface side of the suspension board with circuit and electrically connected with the conductive pattern, in which the conductive pattern includes a first terminal provided on a surface of the suspension board with circuit and electrically connected with the magnetic head; and a second terminal provided on the back surface of the suspension board with circuit and electrically connected with the light emitting device.Type: GrantFiled: October 28, 2009Date of Patent: November 19, 2013Assignee: Nitto Denko CorporationInventors: Tetsuya Ohsawa, Hayato Abe, Yoshinari Yoshida, Toshiki Naito
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Patent number: 8587903Abstract: A suspension is configured to support a magnetic head slider having a recording head element for recording to a magnetic recording medium and a microwave generating element that applies a high-frequency magnetic field to the magnetic recording medium when recording is conducted by the recording head element. The suspension has a flexure that supports the magnetic head slider, a microwave signal transmission line and a recording signal transmission line. The microwave signal transmission line is connected to the microwave generating element and configured to transmit microwave signals for generating the high-frequency magnetic field. The microwave signal transmission line and the recording signal transmission line are supported between the main body part and the support part, a portion of which has a first lamination structure where a first ground layer is conductive and a first insulating layer supports the microwave signal transmission.Type: GrantFiled: November 22, 2011Date of Patent: November 19, 2013Assignee: TDK CorporationInventors: Eriko Ajioka, Yoshikazu Soeno
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Patent number: 8582245Abstract: An electrical connection structure for a piezoelectric element and a head suspension with the piezoelectric element employing the electrical connection structure are provided. The electrical connection structure fixes and connects a terminal of a wiring member to an electrode of the piezoelectric element, which is arranged to face the terminal, with a conductive adhesive so that no peeling due to thermal expansion occurs between the terminal and the conductive adhesive. The electrical connection structure includes a through hole formed through the terminal and a connection part formed around the through hole on an opposite side of a piezoelectric element on the terminal. The conductive adhesive is applied and solidified so that the conductive adhesive extends between a surface of the connection part and a surface of the electrode of the piezoelectric element through the through hole.Type: GrantFiled: February 21, 2012Date of Patent: November 12, 2013Assignee: NHK Spring Co., Ltd.Inventors: Masao Hanya, Isamu Kuchiwaki
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Publication number: 20130242436Abstract: A terminal structure includes an insulating layer hole formed through an insulating layer, a ground via that passes through the insulating layer hole and electrically connects a wiring layer formed on the insulating layer and a metal layer formed under the insulating layer to each other, and a terminal face defined on a surface of the metal layer and bonded through a conductive adhesive to an electrode of a piezoelectric element.Type: ApplicationFiled: February 11, 2013Publication date: September 19, 2013Applicant: NHK SPRING CO., LTD.Inventors: Ryosuke YONEKURA, Yoshihiro TERAMOTO
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Patent number: 8535792Abstract: Compositions and methods for producing compositions comprising a monoamine-endcapped polyimide component. Based on a gas chromatography mass spectroscopy analysis of a surface rinse of the composition performed at room temperature, the composition can have at least one surface with less than or equal to 5 ppb releasable phosphorous residuals, and less than or equal to 5 ppb releasable volatile organic compound residuals. The composition can also comprise less than or equal to 10 ppb combined releasable residuals. Because of the very low levels of residual contamination, the compositions can be used to produce a variety of articles, including a disk drive.Type: GrantFiled: June 30, 2011Date of Patent: September 17, 2013Assignee: Sabic Innovative Plastics IP B.V.Inventors: Daniel Francis Lowery, Jamuna Chakravarti, Aaron Royer
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Publication number: 20130229729Abstract: A main object of the present invention is to provide a suspension substrate such that design freedom of a wiring layer is improved while restraining the upsizing in accordance with an increase in a wiring layer. The present invention solves the problem by providing a suspension substrate comprising a metal supporting substrate, a first insulating layer, a first wiring layer, a second insulating layer, and a second wiring layer laminated in this order, characterized in that the first wiring layer has a functional element wiring layer connected to a functional element, and the second wiring layer has a signal transmission wiring layer comprising a pair of wiring layers and connected to a recording and reproducing element.Type: ApplicationFiled: October 28, 2011Publication date: September 5, 2013Applicant: DAI NIPPON PRINTING CO., LTD.Inventor: Tsuyoshi Yamazaki
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Patent number: 8503133Abstract: A flexure with conductors is provided with a flexure tail portion. The flexure tail portion includes a metal base, an electrically insulating layer, and a conductive member. The metal base is formed with a plurality of apertures. A damper is attached to the flexure tail portion. The damper includes a viscoelastic member and a metallic constrained plate. The viscoelastic member has first and second surfaces. The first surface of the viscoelastic member is secured to the flexure tail portion. The constrained plate is secured to the second surface of the viscoelastic member. The constrained plate extends longitudinally relative to the metal base along the conductive member. The conductive member and the constrained plate face each other with the viscoelastic member therebetween.Type: GrantFiled: August 18, 2010Date of Patent: August 6, 2013Assignee: NHK Spring Co., Ltd.Inventors: Hajime Arai, Hideki Fuchino
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Publication number: 20130176645Abstract: An interleaved circuit has first branch conductors branching from a first conductor, second branch conductors branching from a second conductor, a metal base having an opening, an insulating layer formed on the metal base, an electrically insulating first cover resin layer, and an electrically insulating second cover resin layer. The first branch conductors are formed on the insulating layer. The first branch conductors are covered by the first cover resin layer. The second branch conductors are formed on the first cover resin layer. The second branch conductors are individually located between the first branch conductors. The second branch conductors are covered by the second cover resin layer.Type: ApplicationFiled: January 3, 2013Publication date: July 11, 2013Applicant: NHK SPRING CO., LTD.Inventor: NHK SPRING CO., LTD.
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Publication number: 20130176646Abstract: An interleaved circuit has first branch conductors branching from a first conductor, second branch conductors branching from a second conductor, a metal base, an insulating layer of a dielectric, and a cover resin layer. The metal base comprises an opening. The first branch conductors and the second branch conductors are arranged alternately in a transverse direction of the insulating layer. A slit is formed in the insulating layer and the cover resin layer. The slit comprises a pair of opposite walls and an air gap between the opposite walls. Air introduced into the air gap forms an air layer. The slit extends longitudinally relative to the interleaved circuit along at least a part of the branch conductors.Type: ApplicationFiled: January 3, 2013Publication date: July 11, 2013Applicant: NHK SPRING CO., LTD.Inventor: NHK Spring Co., Ltd.
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Publication number: 20130163110Abstract: Approaches for a hard-disk drive (HDD) having a balanced resistive temperature detector (RTD). A HDD includes a head slider comprising a single RTD. A read/write IC comprises a balance resistor having the same resistance as the single RTD when the head slider is not in physical contact with the disk. The same amount of current flows through the single RTD and the balance resistor except when the head slider is in physical contact with the disk. Detecting a voltage change across the single RTD enables physical contact between the head slider and the disk to be accurately detected using a circuit with low noise. Alternately, the head slider may include two RTDs connected in sequence, and the balance resistor may possess the same resistance as the two RTDs. The two RTDs may vary inversely with environmental changes to avoid the need to recalibrate the balance resistor after any environmental change.Type: ApplicationFiled: December 21, 2011Publication date: June 27, 2013Inventors: Samir Y. Garzon, Rehan Ahmed Zakai, John Thomas Contreras