Electrical Connection Detail Patents (Class 360/245.8)
  • Patent number: 10330576
    Abstract: A sensor for measuring shear force and a dummy for testing a vehicle using the same are provided herein. A sensor for measuring shear force which is configured to quantitatively accurately measure shear force applied to a human body who sits on a vehicle seat, and a dummy for measuring shear force using the sensor are provided, wherein the sensor for measuring shear force includes an upper block, an intermediate block and a lower block and is configured such that a first strain gauge is mounted upright between the upper block and the intermediate block and a second strain gauge is mounted upright between the intermediate block and the lower block so that the shear force can be accurately measured without being affected by horizontal tensile force.
    Type: Grant
    Filed: August 30, 2017
    Date of Patent: June 25, 2019
    Assignees: Hyundai Motor Company, Kia Motors Corporation, University Industry Foundation, Yonsei University Wonju Campus
    Inventors: Tae Uk Kang, Han Sung Kim, Seong Guk Kim, Dong Hyun Kim, Dong Hyun Hwang, Han A. Lee, Ye Eun Song
  • Patent number: 10283150
    Abstract: Disclosed herein are suspension assembly structures for data storage devices that include physical or virtual crossovers of the pairs of differential signal traces to improve immunity to crosstalk and other interference. In an embodiment, the suspension assembly structure comprises a first trace for carrying a first component of a current to a differential transducer on a slider, a second trace for carrying a second component of the current to the differential transducer on the slider, and third and fourth traces for providing a differential write current to a writer of the data storage device, wherein the first trace physically crosses over the second trace at a first distance from a tail of the suspension assembly structure.
    Type: Grant
    Filed: August 2, 2017
    Date of Patent: May 7, 2019
    Assignee: Western Digital Technologies, Inc.
    Inventors: John Contreras, Rehan Zakai, Albert Wallash, Tzong-Shii Pan
  • Patent number: 10222279
    Abstract: Described is a force sensor stack configured to measure incident force. Data from the force sensor stack may be used to determine a weight of an object, determine a force distribution of the object resting on the force sensor stack, and so forth. The force sensor stack may comprise a plurality of force sensor layers. Each of the force sensor layers may be responsive to a different range of applied forces. The combined force sensor stacks may thus provide a wide dynamic range. A pressure concentrator layer may be configured to direct the incident force to particular portions of the force sensor layers.
    Type: Grant
    Filed: June 19, 2014
    Date of Patent: March 5, 2019
    Assignee: AMAZON TECHNOLOGIES, INC.
    Inventors: Louis Leroi Legrand, III, Debanjan Mukherjee
  • Patent number: 9905273
    Abstract: An apparatus includes an actuator assembly, a dampening assembly coupled to the actuator assembly, and a vibration sensor assembly coupled to the dampening assembly and coupled to the actuator assembly by way of the dampening assembly. A method includes attaching a dampening assembly to an actuator assembly and attaching a vibration sensor assembly to the dampening assembly. The dampening assembly is positioned between the vibration sensor assembly and the actuator assembly.
    Type: Grant
    Filed: April 26, 2016
    Date of Patent: February 27, 2018
    Assignee: Seagate Technology LLC
    Inventors: Antanas Daugela, Neal F. Gunderson, Reed D. Hanson, Ricardo P. Freeman, Andrew R. Motzko, Erik J. Lindquist
  • Patent number: 9836090
    Abstract: The present disclosure provides an electronic device and a method for controlling the electronic device, capable of solving the problem that the screen of the electronic device is fragile in use. The electronic device comprises a display unit having an electro-deformable layer provided on its surface. The method comprises: detecting a state parameter of the electronic device; determining whether the electronic device is in a predetermined state based on the state parameter; and applying, upon determining that the electronic device is in the predetermined state, a predetermined current to the electro-deformable layer, such that a strength of the electro-deformable layer is increased from a first, default strength to a second strength.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: December 5, 2017
    Assignees: Beijing Lenovo Software Ltd., Lenovo (Beijing) Limited
    Inventor: Chen Chen
  • Patent number: 9812160
    Abstract: A stainless steel dual stage actuated disk drive head suspension baseplate including a plated electrical contact area having nickel and gold. The baseplate can be heat treated. The nickel and gold can be in a mixture.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: November 7, 2017
    Assignee: Hutchinson Technology Incorporated
    Inventors: Jeffry S. Bennin, Jacob D. Bjorstrom, Shawn P. Bopp, Reed T. Hentges, Michael T. Hofflander, Richard R. Jenneke, Craig A. Leabch, Mark S. Lewandowski, Zachary A. Pokornowski, Brian D. Schafer, Brian J. Stepien, John A. Theget, John E. Theisen, John L. Wagner
  • Patent number: 9489971
    Abstract: A system includes a first preamplifier, a second preamplifier and a flex circuit. The first preamplifier is configured to be connected to a first plurality of recording heads. The second preamplifier is configured to be connected to a second plurality of recording heads. At least one of the first plurality of recording heads and at least one of the second plurality of recording heads are configured to concurrently perform read and or write operations. The flex circuit is a single flex circuit configured to connect the first and second preamplifiers to the plurality of recording heads.
    Type: Grant
    Filed: January 29, 2015
    Date of Patent: November 8, 2016
    Assignee: SEAGATE TECHNOLOGY LLC
    Inventors: Karsten Klarqvist, Andrew R. Motzko, Rick P. Freeman
  • Patent number: 9396747
    Abstract: An interleave circuit includes a metal base, an insulating layer, a first conductor member having first branch conductors, a second conductor member having second branch conductors, and a jumper conductor, which is a part of the metal base. The jumper conductor includes a branch-side metal portion, a pad-side metal portion, and a bridge portion. The bridge portion is formed between the branch-side metal portion and the pad-side metal portion. The branch-side metal portion electrically conducts to connecting terminals of the first branch conductors via branch-side connecting members. The pad-side metal portion electrically conducts to an electrode pad via a pad-side connecting member. The bridge portion includes a crossover portion which crosses over a third conductor member.
    Type: Grant
    Filed: August 26, 2015
    Date of Patent: July 19, 2016
    Assignee: NHK SPRING CO., LTD.
    Inventor: Sei Kawao
  • Patent number: 9076957
    Abstract: A terminal extending from a wiring member to face an electrode of a piezoelectric element and including a proximal end part and a distal end part with respect to the wiring member, the distal end part being connected to the electrode of the piezoelectric element through a conductive adhesive, comprising an insulating layer that faces the electrode of the piezoelectric element; a wiring layer laid on the insulating layer and connected to the electrode at the distal end part; and at least one liquid stopping recess provided on a surface facing the electrode at the proximal end part, the liquid stopping recess spanning between both edges of the insulating layer in an direction intersecting an extending direction of the proximal end part.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: July 7, 2015
    Assignee: NHK Spring Co., Ltd.
    Inventors: Yoichi Ikeji, Jun Soga, Hideki Fuchino, Hiroshi Ono, Hiroaki Kamijo
  • Patent number: 9070418
    Abstract: A cutting jig cuts bonding material of a terminal joint between a magnetic head's slider and a flexure's wiring terminal. A base of the jig receives the slider. A blade moves along the base and faces a front side wall of the slider in a moving direction. An upright portion of the jig is formed on the base and has a stop face that faces a rear side wall of the slider in the moving direction. The blade moves toward the slider to come into contact with the bonding material, and is pressed to the front side wall of the slider. The bonding material is interposed in the moving direction while the rear side wall of the slider is brought into contact with and is stopped by the stop face when the slider is set on the base and the bonding material is cut.
    Type: Grant
    Filed: January 15, 2013
    Date of Patent: June 30, 2015
    Assignee: NHK Spring Co., Ltd.
    Inventors: Sei Kawao, Takeshi Shimoda, Shinpei Kakiuchi
  • Patent number: 9025282
    Abstract: An integrated lead flexure for a disk drive head suspension formed from layers of material including a spring metal layer, a conductive material layer and an insulating material layer between the spring metal and conductive material layers. One embodiment includes a gimbal region having flying traces and one or more elongated tethers extending from the spring metal layer and along a distance of the flying traces that is less than the length of the flying traces. Another embodiment includes a load beam spring region traversing portion having unsupported traces and one or more elongated tethers extending from the spring metal layer and along a distance of the unsupported traces that is less than the length of the unsupported traces.
    Type: Grant
    Filed: February 3, 2012
    Date of Patent: May 5, 2015
    Assignee: Hutchinson Technology Incorporated
    Inventor: Mark A. Miller
  • Publication number: 20150109704
    Abstract: A suspension substrate of the present invention includes an insulating layer, a spring material layer, and a plurality of wirings, wherein one wiring of the plurality of wirings includes a head-side wiring part and a plurality of division wiring parts, respectively bifurcated from the head-side wiring part. The spring material layer includes a spring-material-layer main body, a first spring-material-layer separated body and a second spring-material-layer separated body. The division wiring parts of the one wiring are respectively connected with the first spring-material-layer separated body, via a pair of conductive connection parts, respectively extending through the insulating layer. The first spring-material-layer separated body is located on one side relative to the longitudinal axis, while the second spring-material-layer separated body is located on the other side relative to the longitudinal axis.
    Type: Application
    Filed: August 18, 2014
    Publication date: April 23, 2015
    Inventor: Yoichi MIURA
  • Patent number: 8995090
    Abstract: A wiring circuit substrate, comprising: a metal support layer; an insulating layer formed on the metal support layer; a conductive layer for wiring formed on the insulating layer; and an opening formed so as to open at a same location in the insulating layer and the conductive layer for wiring, wherein the metal support layer includes: a support section that supports the insulating layer and the conductive layer for wiring, and a terminal section that extends from one edge side to the other edge side of the opening, the terminal section being separated from the support section; and the conductive layer for wiring includes a wiring that is connected to the terminal section by a connecting section.
    Type: Grant
    Filed: February 24, 2012
    Date of Patent: March 31, 2015
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Jin Nishiyama, Yuji Narita
  • Patent number: 8885297
    Abstract: Various embodiments concern a dual stage actuation flexure having a motor contact paddle for connecting to a terminal of a piezoelectric motor. The flexure comprises a paddle having a top side and a bottom side, the paddle comprising at least one void, each void extending through the paddle from the bottom side to the top side. The paddle further comprises a stainless steel base, a conductor comprising a layer of metal, and a dielectric layer having a first section and a second section, the first section positioned between the conductor and the stainless steel base to overlap the stainless steel base and the second section extending beyond the stainless steel base to not overlap the stainless steel base. The bottom side of the paddle is configured to connect to the terminal with electrically conductive adhesive.
    Type: Grant
    Filed: July 21, 2014
    Date of Patent: November 11, 2014
    Assignee: Hutchinson Technology Incorporated
    Inventors: Jacob D. Bjorstrom, Nole D. German, Paul V. Pesavento, Zachary A. Pokornowski, Ryan N. Ruzicka, Kurt C. Swanson, Allan D. Tokuda
  • Publication number: 20140313619
    Abstract: First and second laminated structures are respectively formed at one surface and the other surface of an insulating layer. A laminate is formed of the first laminated structure, the insulating layer and the second laminated structure. A heat-assisted wiring trace is included in the first laminated structure, and a support substrate and a connection terminal are included in the second laminated structure. The surface of the connection terminal is exposed at the other surface of the insulating layer. A first portion of the laminate including the connection terminal has a thickness smaller than the thickness of second and third portions of the laminate including portions on both sides of the connection terminal.
    Type: Application
    Filed: March 31, 2014
    Publication date: October 23, 2014
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yuu SUGIMOTO, Takatoshi SAKAKURA
  • Patent number: 8842505
    Abstract: According to one embodiment, a first magnetic head is used to record or reproduce data on or from the first disk surface and includes a first two-terminal element including a first positive terminal and a first negative terminal. A second magnetic head is used to record or reproduce data on or from the second disk surface and includes a second two-terminal element including a second positive terminal and a second negative terminal. A current control unit includes a first current terminal which is commonly connected to the first positive terminal and the second negative terminal and a second current terminal that is commonly connected to the first negative terminal and the second positive terminal and can switch a current polarity between the first current terminal and the second current terminal.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: September 23, 2014
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Yuuichi Yamada
  • Patent number: 8817423
    Abstract: An Extended Circuit Integrated Suspension (ECIS) design and manufacture thereof, to allow for circuit elements to be disposed onto the load beam on the opposite side of the flexure circuit. An Extended Circuit Integrated Suspension (ECIS) may include a load beam; a flexure circuit comprising a plurality of traces; and a connection portion which connects the load beam laterally to the flexure circuit. The load beam, the flexure circuit, and the connecting portion may be formed as a single component from a single panel, and the connection portion is oriented so that the connection portion is folded to place the flexure circuit onto a first side of the load beam. Applications for the use of the extended circuit are many, and a semi-collocated micro-actuator (SCLMA) is illustrated for example.
    Type: Grant
    Filed: October 9, 2012
    Date of Patent: August 26, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Martin John McCaslin, Alex Enriquez Cayaban
  • Patent number: 8804135
    Abstract: A method of measuring attitude angles of a tongue of a head suspension, the tongue including a fitting face on which a plurality of electrodes are arranged, emits a single collimated laser beam to an area of a fitting face containing at least two of electrodes, detects a reflected beam from the fitting face, extracts electrode reflective components corresponding to the electrodes from the reflected beam, and according to the electrode reflective components, measures the attitude angles of the tongue.
    Type: Grant
    Filed: September 10, 2012
    Date of Patent: August 12, 2014
    Assignee: NHK Spring Co., Ltd.
    Inventors: Akio Mashima, Kenichiro Nakano, Shinichi Gotoh, Yasushi Nasuno
  • Patent number: 8792214
    Abstract: Various embodiments concern a dual stage actuation flexure having a motor contact paddle for connecting to a terminal of a piezoelectric motor. The flexure comprises a paddle having a top side and a bottom side, the paddle comprising at least one void, each void extending through the paddle from the bottom side to the top side. The paddle further comprises a stainless steel base, a conductor comprising a layer of metal, and a dielectric layer having a first section and a second section, the first section positioned between the conductor and the stainless steel base to overlap the stainless steel base and the second section extending beyond the stainless steel base to not overlap the stainless steel base. The bottom side of the paddle is configured to connect to the terminal with electrically conductive adhesive.
    Type: Grant
    Filed: December 12, 2013
    Date of Patent: July 29, 2014
    Assignee: Hutchinson Technology Incorporated
    Inventors: Jacob D. Bjorstrom, Nole D. German, Paul V. Pesavento, Zachary A. Pokornowski, Ryan N. Ruzicka, Kurt C. Swanson, Allan D. Tokuda
  • Patent number: 8773819
    Abstract: Actuator elements are accommodated in openings formed in a conductive plate. These actuator elements are secured to the conductive plate by a resin bonding material. An electrode of each actuator element and the conductive plate are electrically connected to each other by a bridge junction consisting of an conductive paste. A paste application device discharges the conductive paste toward the bridge junction by air. A control unit configured to control the discharge of the conductive paste sets the air pressure according to the elapsed time of use of the conductive paste so that the height of the paste above the resin bonding material is not less than a target height. The target height is maintained by increasing the air pressure with increase of the elapsed time of use of the conductive paste.
    Type: Grant
    Filed: April 25, 2013
    Date of Patent: July 8, 2014
    Assignee: NHK Spring Co., Ltd.
    Inventors: Yoichi Ikeji, Haruyuki Yamamoto, Tsuyoshi Amemiya, Hiroshi Ono
  • Patent number: 8767352
    Abstract: A suspension board with circuit includes a conductive pattern, including a slider arranged on a surface side of the suspension board with circuit and mounted with a magnetic head, the magnetic head being electrically connected with the conductive pattern; and a light emitting device arranged on the back surface side of the suspension board with circuit and electrically connected with the conductive pattern, in which the conductive pattern includes a first terminal provided on a surface of the suspension board with circuit and electrically connected with the magnetic head; and a second terminal provided on the back surface of the suspension board with circuit and electrically connected with the light emitting device.
    Type: Grant
    Filed: October 4, 2013
    Date of Patent: July 1, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Tetsuya Ohsawa, Hayato Abe, Yoshinari Yoshida, Toshiki Naito
  • Patent number: 8760815
    Abstract: The wired circuit board includes a metal supporting board, a metal foil formed on the metal supporting board, a first insulating layer formed on the metal supporting board so as to cover the metal foil, and a conductive pattern formed on the first insulating layer and having a plurality of wires. The metal foil is arranged along a lengthwise direction of each of the wires so as not to be opposed to part of the wires in a thickness direction and so as to be opposed to a remainder of the wires in the thickness direction.
    Type: Grant
    Filed: May 9, 2008
    Date of Patent: June 24, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Jun Ishii, Takahiko Yokai
  • Publication number: 20140160599
    Abstract: A suspension board with circuit includes a metal supporting layer, an insulating base layer formed on the metal supporting layer, a conductive layer formed on the insulating base layer, and a slider supported on the metal supporting layer via a pedestal. The conductive layer includes a conductive overlapping portion which overlaps a plane on which the slider is projected when projected in a thickness direction. The conductive overlapping portion is provided to be spaced apart from the slider.
    Type: Application
    Filed: November 21, 2013
    Publication date: June 12, 2014
    Applicant: NITTO DENKO CORPORATION
    Inventors: Naotaka HIGUCHI, Hitoki KANAGAWA, Tadashi TAKAHASHI
  • Patent number: 8749923
    Abstract: A main object of the present invention is to provide a suspension substrate which can decrease the whole thickness thereof and limit the generation of warpage. To attain the object, the present invention provides a suspension substrate comprising: an insulation layer, a pair of wirings consisting of an upper wiring formed on one surface of the insulation layer and a lower wiring formed on the other surface of the insulation layer, and a metal substrate formed on the surface of the insulation layer on the lower wiring side.
    Type: Grant
    Filed: December 18, 2009
    Date of Patent: June 10, 2014
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventor: Kenro Hirata
  • Patent number: 8737020
    Abstract: A suspension circuit board comprises a metal support board, a first insulation layer disposed on the metal support board a conductive layer disposed on the first insulation layer, the conductive layer forming a wire; and a second insulation layer disposed on the first insulation layer and the conductive layer. The suspension circuit board is configured that, upon applying a load in a thickness direction to the conductive layer at a position corresponding to the first insulation opening, F1<F2, when a stress generated in the conductive layer at a position corresponding to a periphery of the first insulation opening is represented as a first stress F1 and a stress generated in the conductive layer at a position corresponding to a periphery of the metal support board opening is represented as a second stress F2.
    Type: Grant
    Filed: December 2, 2010
    Date of Patent: May 27, 2014
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Shinichiro Busujima, Yoichi Miura, Kenro Hirata, Tempei Yamaoka
  • Patent number: 8711521
    Abstract: A suspension for a head gimbal assembly includes a flexure having a laminated structure including a substrate layer, an insulating layer formed on the substrate layer, and a conducting layer formed on the insulating layer. And first bonding pads are formed on the conducting layer at a first surface of the flexure, so as to electrically connect with a slider via solder balls, and second bonding pads are formed on the substrate layer at a second surface of the flexure opposite to the first surface, so as to electrically connect with extra components formed at the second surface via solder balls. The suspension can connect slider and other extra components at two opposite surfaces of the flexure with a simplified and compacted structure and a reduced cost.
    Type: Grant
    Filed: September 30, 2011
    Date of Patent: April 29, 2014
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Xian wen Feng, Fu quan Pang, Hai ming Zhou
  • Patent number: 8675311
    Abstract: An interleaved conductor structure for electrically connecting the read/write electronics to a read/write head in a hard disk drive is provided. The interleaved conductor structure may allow for an increased characteristic-impedance range, greater interference shielding and a reduction of signal loss that is contributed by a lossy conductive substrate. The electrical traces may have different widths, be offset, or even wrap around each other at the via connections.
    Type: Grant
    Filed: December 22, 2010
    Date of Patent: March 18, 2014
    Assignee: HGST Netherlands B.V.
    Inventors: John T. Contreras, Nobumasa Nishiyama, Edgar D. Rothenberg, Rehan A. Zakai, Yiduo Zhang
  • Publication number: 20140063660
    Abstract: Various embodiments concern a DSA suspension of a disk drive. The DSA suspension comprises a support configured to attach to the disk drive, the support comprising a proximal portion, a distal portion, and a linkage portion therebetween. The DSA head suspension system further comprises at least one motor mounted on the support, each motor positioned between the proximal portion and the distal portion. The DSA suspension further comprises a damper attached to some or all of the proximal portion, the motor(s), the distal portion, and the linkage portion. The damper can be a single layer or multilayered. The damper can comprise viscoelastic material. The damper can be adhesive. The damper may only be attached to the support and the motors and not to other components of the DSA suspension.
    Type: Application
    Filed: July 31, 2013
    Publication date: March 6, 2014
    Applicant: Hutchinson Technology Incorporated
    Inventors: Jacob D. Bjorstrom, Zachary A. Pokornowski
  • Patent number: 8609992
    Abstract: The problem of the present invention is to provide a circuit board comprising a shape retention unit capable of thinning while maintaining mechanical strength. The present invention solves the above-mentioned problem by providing a circuit board comprising a metal supporting substrate, a first insulating layer formed on the above-mentioned metal supporting substrate, and a wiring layer formed on the above-mentioned first insulating layer, wherein an open area is formed in the above-mentioned metal supporting substrate, and the circuit board comprises a shape retention unit having a second insulating layer contacting with the above-mentioned metal supporting substrate and a reinforcing layer formed on the above-mentioned second insulating layer, and bridging the above-mentioned metal supporting substrate divided by the above-mentioned open area.
    Type: Grant
    Filed: December 24, 2010
    Date of Patent: December 17, 2013
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Junichi Chiyonaga, Hiromichi Takatsu, Yoichi Miura, Yoichi Nagai
  • Publication number: 20130321958
    Abstract: Actuator elements are accommodated in openings formed in a conductive plate. These actuator elements are secured to the conductive plate by a resin bonding material. An electrode of each actuator element and the conductive plate are electrically connected to each other by a bridge junction consisting of an conductive paste. A paste application device discharges the conductive paste toward the bridge junction by air. A control unit configured to control the discharge of the conductive paste sets the air pressure according to the elapsed time of use of the conductive paste so that the height of the paste above the resin bonding material is not less than a target height. The target height is maintained by increasing the air pressure with increase of the elapsed time of use of the conductive paste.
    Type: Application
    Filed: April 25, 2013
    Publication date: December 5, 2013
    Applicant: NHK SPRING CO., LTD.
    Inventors: Yoichi IKEJI, Haruyuki YAMAMOTO, Tsuyoshi AMEMIYA, Hiroshi ONO
  • Patent number: 8598460
    Abstract: An interleaved conductor structure for electrically connecting the read/write electronics to a read/write head in a hard disk drive is provided. The interleaved conductor structure may allow for an increased characteristic-impedance range, greater interference shielding and a reduction of signal loss that is contributed by a lossy conductive substrate. The electrical traces may have different widths, be offset, or even wrap around each other at the via connections.
    Type: Grant
    Filed: December 22, 2010
    Date of Patent: December 3, 2013
    Assignee: HGST Netherlands B.V.
    Inventors: John T. Contreras, Nobumasa Nishiyama, Edgar D. Rothenberg, Rehan A. Zakai, Yiduo Zhang
  • Publication number: 20130314821
    Abstract: A terminal area includes a metal plate, an electrically insulating layer, and a conductor layer. An opening section is formed in the metal plate and the insulating layers A gold plating layer is formed on a surface of the conductor layer inside the opening section. A porous metal layer of a first transition element is formed on a surface of the gold plating layer. Through-holes of the porous metal layer reach the surface of the gold plating layer. An electrically conductive adhesive is provided between an electrode of an actuator element and the porous metal layer. An anchor portion of the electrically conductive adhesive gets into the through holes and is cured. Conductive particles of the electrically conductive adhesive contact the gold plating layer.
    Type: Application
    Filed: April 5, 2013
    Publication date: November 28, 2013
    Applicant: NHK SPRING CO., LTD.
    Inventor: Mikio Arai
  • Patent number: 8593765
    Abstract: A head gimbal assembly having a stage fixed to a head-slider. A piezoelectric element which comprises; an upper surface, a first side surface, a second side surface, a lower surface, a first electrode, a second electrode, and a gap between the first and second electrodes on the lower surface, the piezoelectric element moving the stage by extension or contraction thereof according to a voltage applied to the first and second electrodes. A transmission wiring part which has a connection pad for the piezoelectric element. A cross-connector for physically and electrically cross-connecting the first electrode and the connection pad. An adhesive fixing part which is formed from an insulating adhesive and adhesively fixes the lower surface of the piezoelectric element to the transmission wiring part, between an end of the second electrode at the gap and the cross-connector.
    Type: Grant
    Filed: December 20, 2010
    Date of Patent: November 26, 2013
    Assignee: HGST Netherlands B.V.
    Inventors: Yoshio Uematsu, Tatsumi Tsuchiya, Tadaaki Tomiyama
  • Patent number: 8587903
    Abstract: A suspension is configured to support a magnetic head slider having a recording head element for recording to a magnetic recording medium and a microwave generating element that applies a high-frequency magnetic field to the magnetic recording medium when recording is conducted by the recording head element. The suspension has a flexure that supports the magnetic head slider, a microwave signal transmission line and a recording signal transmission line. The microwave signal transmission line is connected to the microwave generating element and configured to transmit microwave signals for generating the high-frequency magnetic field. The microwave signal transmission line and the recording signal transmission line are supported between the main body part and the support part, a portion of which has a first lamination structure where a first ground layer is conductive and a first insulating layer supports the microwave signal transmission.
    Type: Grant
    Filed: November 22, 2011
    Date of Patent: November 19, 2013
    Assignee: TDK Corporation
    Inventors: Eriko Ajioka, Yoshikazu Soeno
  • Patent number: 8587904
    Abstract: A suspension board with circuit includes a conductive pattern, including a slider arranged on a surface side of the suspension board with circuit and mounted with a magnetic head, the magnetic head being electrically connected with the conductive pattern; and a light emitting device arranged on the back surface side of the suspension board with circuit and electrically connected with the conductive pattern, in which the conductive pattern includes a first terminal provided on a surface of the suspension board with circuit and electrically connected with the magnetic head; and a second terminal provided on the back surface of the suspension board with circuit and electrically connected with the light emitting device.
    Type: Grant
    Filed: October 28, 2009
    Date of Patent: November 19, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Tetsuya Ohsawa, Hayato Abe, Yoshinari Yoshida, Toshiki Naito
  • Patent number: 8582245
    Abstract: An electrical connection structure for a piezoelectric element and a head suspension with the piezoelectric element employing the electrical connection structure are provided. The electrical connection structure fixes and connects a terminal of a wiring member to an electrode of the piezoelectric element, which is arranged to face the terminal, with a conductive adhesive so that no peeling due to thermal expansion occurs between the terminal and the conductive adhesive. The electrical connection structure includes a through hole formed through the terminal and a connection part formed around the through hole on an opposite side of a piezoelectric element on the terminal. The conductive adhesive is applied and solidified so that the conductive adhesive extends between a surface of the connection part and a surface of the electrode of the piezoelectric element through the through hole.
    Type: Grant
    Filed: February 21, 2012
    Date of Patent: November 12, 2013
    Assignee: NHK Spring Co., Ltd.
    Inventors: Masao Hanya, Isamu Kuchiwaki
  • Publication number: 20130242436
    Abstract: A terminal structure includes an insulating layer hole formed through an insulating layer, a ground via that passes through the insulating layer hole and electrically connects a wiring layer formed on the insulating layer and a metal layer formed under the insulating layer to each other, and a terminal face defined on a surface of the metal layer and bonded through a conductive adhesive to an electrode of a piezoelectric element.
    Type: Application
    Filed: February 11, 2013
    Publication date: September 19, 2013
    Applicant: NHK SPRING CO., LTD.
    Inventors: Ryosuke YONEKURA, Yoshihiro TERAMOTO
  • Patent number: 8535792
    Abstract: Compositions and methods for producing compositions comprising a monoamine-endcapped polyimide component. Based on a gas chromatography mass spectroscopy analysis of a surface rinse of the composition performed at room temperature, the composition can have at least one surface with less than or equal to 5 ppb releasable phosphorous residuals, and less than or equal to 5 ppb releasable volatile organic compound residuals. The composition can also comprise less than or equal to 10 ppb combined releasable residuals. Because of the very low levels of residual contamination, the compositions can be used to produce a variety of articles, including a disk drive.
    Type: Grant
    Filed: June 30, 2011
    Date of Patent: September 17, 2013
    Assignee: Sabic Innovative Plastics IP B.V.
    Inventors: Daniel Francis Lowery, Jamuna Chakravarti, Aaron Royer
  • Publication number: 20130229729
    Abstract: A main object of the present invention is to provide a suspension substrate such that design freedom of a wiring layer is improved while restraining the upsizing in accordance with an increase in a wiring layer. The present invention solves the problem by providing a suspension substrate comprising a metal supporting substrate, a first insulating layer, a first wiring layer, a second insulating layer, and a second wiring layer laminated in this order, characterized in that the first wiring layer has a functional element wiring layer connected to a functional element, and the second wiring layer has a signal transmission wiring layer comprising a pair of wiring layers and connected to a recording and reproducing element.
    Type: Application
    Filed: October 28, 2011
    Publication date: September 5, 2013
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventor: Tsuyoshi Yamazaki
  • Patent number: 8503133
    Abstract: A flexure with conductors is provided with a flexure tail portion. The flexure tail portion includes a metal base, an electrically insulating layer, and a conductive member. The metal base is formed with a plurality of apertures. A damper is attached to the flexure tail portion. The damper includes a viscoelastic member and a metallic constrained plate. The viscoelastic member has first and second surfaces. The first surface of the viscoelastic member is secured to the flexure tail portion. The constrained plate is secured to the second surface of the viscoelastic member. The constrained plate extends longitudinally relative to the metal base along the conductive member. The conductive member and the constrained plate face each other with the viscoelastic member therebetween.
    Type: Grant
    Filed: August 18, 2010
    Date of Patent: August 6, 2013
    Assignee: NHK Spring Co., Ltd.
    Inventors: Hajime Arai, Hideki Fuchino
  • Publication number: 20130176645
    Abstract: An interleaved circuit has first branch conductors branching from a first conductor, second branch conductors branching from a second conductor, a metal base having an opening, an insulating layer formed on the metal base, an electrically insulating first cover resin layer, and an electrically insulating second cover resin layer. The first branch conductors are formed on the insulating layer. The first branch conductors are covered by the first cover resin layer. The second branch conductors are formed on the first cover resin layer. The second branch conductors are individually located between the first branch conductors. The second branch conductors are covered by the second cover resin layer.
    Type: Application
    Filed: January 3, 2013
    Publication date: July 11, 2013
    Applicant: NHK SPRING CO., LTD.
    Inventor: NHK SPRING CO., LTD.
  • Publication number: 20130176646
    Abstract: An interleaved circuit has first branch conductors branching from a first conductor, second branch conductors branching from a second conductor, a metal base, an insulating layer of a dielectric, and a cover resin layer. The metal base comprises an opening. The first branch conductors and the second branch conductors are arranged alternately in a transverse direction of the insulating layer. A slit is formed in the insulating layer and the cover resin layer. The slit comprises a pair of opposite walls and an air gap between the opposite walls. Air introduced into the air gap forms an air layer. The slit extends longitudinally relative to the interleaved circuit along at least a part of the branch conductors.
    Type: Application
    Filed: January 3, 2013
    Publication date: July 11, 2013
    Applicant: NHK SPRING CO., LTD.
    Inventor: NHK Spring Co., Ltd.
  • Publication number: 20130163110
    Abstract: Approaches for a hard-disk drive (HDD) having a balanced resistive temperature detector (RTD). A HDD includes a head slider comprising a single RTD. A read/write IC comprises a balance resistor having the same resistance as the single RTD when the head slider is not in physical contact with the disk. The same amount of current flows through the single RTD and the balance resistor except when the head slider is in physical contact with the disk. Detecting a voltage change across the single RTD enables physical contact between the head slider and the disk to be accurately detected using a circuit with low noise. Alternately, the head slider may include two RTDs connected in sequence, and the balance resistor may possess the same resistance as the two RTDs. The two RTDs may vary inversely with environmental changes to avoid the need to recalibrate the balance resistor after any environmental change.
    Type: Application
    Filed: December 21, 2011
    Publication date: June 27, 2013
    Inventors: Samir Y. Garzon, Rehan Ahmed Zakai, John Thomas Contreras
  • Patent number: 8467638
    Abstract: A suspension board with circuit includes a circuit board including a metal supporting board, an insulating layer formed on the metal supporting board, a conductive layer formed on the insulating layer, and an optical waveguide disposed on the circuit board. The optical waveguide includes an under clad layer, a core layer formed on the under clad layer, and an over clad layer formed on the core layer and included in the core layer when projected in the thickness direction of the core layer. The optical waveguide is provided with a positioning portion to position the optical waveguide and a near-field light generating unit for generating near-field light by a light emitted from the optical waveguide, and a protective layer to cover the positioning portion.
    Type: Grant
    Filed: November 12, 2010
    Date of Patent: June 18, 2013
    Assignee: Nitto Denko Corporation
    Inventor: Hajime Nishio
  • Publication number: 20130128388
    Abstract: A suspension is configured to support a magnetic head slider having a recording head element for recording to a magnetic recording medium and a microwave generating element that applies a high-frequency magnetic field to the magnetic recording medium when recording is conducted by the recording head element. The suspension has a flexure that supports the magnetic head slider, a microwave signal transmission line and a recording signal transmission line. The microwave signal transmission line is connected to the microwave generating element and configured to transmit microwave signals for generating the high-frequency magnetic field. The microwave signal transmission line and the recording signal transmission line are supported between the main body part and the support part, a portion of which has a first lamination structure where a first ground layer is conductive and a first insulating layer supports the microwave signal transmission.
    Type: Application
    Filed: November 22, 2011
    Publication date: May 23, 2013
    Applicant: TDK CORPORATION
    Inventors: Eriko AJIOKA, Yoshikazu SOENO
  • Publication number: 20130088796
    Abstract: A method of measuring attitude angles of a tongue of a head suspension, the tongue including a fitting face on which a plurality of electrodes are arranged, emits a single collimated laser beam to an area of a fitting face containing at least two of electrodes, detects a reflected beam from the fitting face, extracts electrode reflective components corresponding to the electrodes from the reflected beam, and according to the electrode reflective components, measures the attitude angles of the tongue.
    Type: Application
    Filed: September 10, 2012
    Publication date: April 11, 2013
    Applicant: NHK SPRING CO., LTD.
    Inventors: Akio Mashima, Kenichiro Nakano, Shinichi Gotoh, Yasushi Nasuno
  • Patent number: 8416536
    Abstract: A head suspension has a base, a piezoelectric element, a load beam, and a wiring member to supply electric power to the piezoelectric element so that the piezoelectric element deforms to move the load beam relative to the base. The wiring member has a conductive base layer, an insulating layer, and a wiring layer layered in this order. The wiring layer has a wiring electrode. The piezoelectric element has an element electrode. A through hole is formed through the conductive base layer and insulating layer, to expose the wiring electrode to the element electrode. A projection is formed on at least one of the wiring electrode and element electrode, to face the other electrode through the through hole. The projection brings the electrodes into contact with each other and a conductive adhesive joins the electrodes and together.
    Type: Grant
    Filed: December 15, 2010
    Date of Patent: April 9, 2013
    Assignee: NHK Spring Co., Ltd.
    Inventors: Hideki Fuchino, Sachie Yamada
  • Patent number: 8395866
    Abstract: A disk drive suspension circuit has copper signal conductors connected by vias through an insulative layer to respective stainless steel flying leads. The stainless steel flying leads are activated and plated with one or more metals, with a final layer over the flying lead being a layer such as gold, suitable for bonding to form bond pads. The gold bond pads may be attached using thermosonic welding, solder ball bonding, or other suitable methods to an electrical component such as wires or a the disk drive's pre-amp circuit.
    Type: Grant
    Filed: August 13, 2009
    Date of Patent: March 12, 2013
    Assignee: Magnecomp Corporation
    Inventors: Christopher Schreiber, Christopher Dunn
  • Publication number: 20130021699
    Abstract: A suspension board with circuit includes an external slider on which a magnetic head is mounted and an external electronic element provided in its vicinity. The suspension board with circuit includes a metal supporting board, a first insulating layer laminated on a top surface thereof, a first conductive pattern including a first terminal and laminated on the top surface side of the first insulating layer, a second insulating layer laminated on a back surface of the metal supporting board, and a second conductive pattern including a second terminal and laminated on the back surface side of the second insulating layer. The suspension board with circuit is formed with a communication space extending therethrough in a top-back direction and respective end edges of the first insulating layer and the second insulating layer protrude into the communication space to positions inner than that of an end edge of the metal supporting board.
    Type: Application
    Filed: July 19, 2012
    Publication date: January 24, 2013
    Applicant: NITTO DENKO CORPORATION
    Inventor: Tetsuya OHSAWA
  • Patent number: 8350159
    Abstract: A base insulating layer is formed on a suspension body, and write wiring traces and read wiring traces are formed on the base insulating layer. The write wiring trace and the read wiring traces are formed on a body region of the base insulating layer, and the write wiring trace is formed on an auxiliary region of the base insulating layer. The base insulating layer is bent along a bend portion. This causes the write wiring trace to be positioned above the write wiring trace.
    Type: Grant
    Filed: March 25, 2010
    Date of Patent: January 8, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Tetsuya Oosawa, Naoyuki Tanaka, Mitsuru Honjo