Electrical Connection Detail Patents (Class 360/245.8)
  • Patent number: 7532438
    Abstract: A wireless disk drive suspension and method of manufacture in which curvilinear deflections of the plastic film and conductive traces relative to the flexure metal layer provide for containment of the strains accompanying pitch and roll adjustment of the flexure and allow adjustment free of adjusting difficulties and spring back compromise of the adjustment. The curvilinear deflection of the laminate toward the flexure central longitudinal axis and an accompanying bringing in of the flexure frame struts provides a less wide flexure that can more closely approach a disk drive hub for greater capacity in a disk drive.
    Type: Grant
    Filed: July 11, 2005
    Date of Patent: May 12, 2009
    Assignee: Magnecomp Corporation
    Inventors: Shijin Mei, Peter Hahn, Keith Hong
  • Patent number: 7525767
    Abstract: In a hard disk drive, suspension termination pads meet the flex cable termination pads at an intersecting angle. The width of these pads is approximately the same width as the conductor widths. Alignment robustness is attained by choosing an intersection angle that coincides to the arc that the wireless suspension termination pad array normally traverses during alignment.
    Type: Grant
    Filed: February 21, 2006
    Date of Patent: April 28, 2009
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventor: A. David Erpelding
  • Publication number: 20090097163
    Abstract: Embodiments of the present invention help to provide a sealed hard disk drive (HDD) with high reliability. According to one embodiment, a HDD is a hermetically sealed HDD. A base has an opening of a through-hole on its bottom; a feedthrough is provided so as to close the opening. A flange of the feedthrough has a larger outline than the opening, and its rim is joined to the base with solder at the solder joint. The solder at the solder joint is mainly composed of Sn and contains 15 atomic percent to 27 atomic percent of indium. This solder reaches the ? phase from ?150° C. to 120° C. Accordingly, even if the HDD has been exposed at low temperature for a long time, the solder joint is not broken so that helium gas does not leak.
    Type: Application
    Filed: October 8, 2008
    Publication date: April 16, 2009
    Inventors: Hiroyuki Suzuki, Teruhiro Nakamiya, Takashi Kouno
  • Patent number: 7518830
    Abstract: A flexure for attachment to a load beam in an integrated lead disk drive suspension assembly. The flexure includes a spring metal layer having slider mounting region, a first surface and a second surface opposing the first surface. A first group of conductive leads extends along at least a portion of the first surface and is separated from the spring metal layer by a first dielectric layer. A second group of conductive leads extends along at least a portion of the second surface and is separated from the spring metal layer by a second dielectric layer. A conductive interconnection extends between a conductive lead from the first group of conductive leads and a conductive lead from the second group of conductive leads. One or more leads from each of the first and second groups of conductive leads can be attached to a magnetic head.
    Type: Grant
    Filed: April 19, 2006
    Date of Patent: April 14, 2009
    Assignee: Hutchinson Technology Incorporated
    Inventors: Paritosh C. Panchal, Ryan D. Kariniemi, Reed T. Hentges, Ramesh K. Dandu, Mark M. Kiviahde
  • Publication number: 20090021866
    Abstract: The magnetization state of a ferromagnetic material is controlled by applying a current pulse to it while externally applying a weak magnetic field to it. The magnetic state of a ferromagnetic material can be switched between a uniformly magnetized state and a multiple magnetic domain structure by controlling the direction and intensity of the magnetic field applied to it and the intensity and pulse width of the current pulse. When an external magnetic field is applied, the possibility of occurrence of the reversal of the magnetic state upon application of the current pulse shows a hysteresis, and the reversal of the magnetic state can be controlled reliably. The intensity of the magnetic field to be applied may be as weak as a few gauss. Furthermore, by using such magnetic information recording elements, a magnetic information recording device (memory) that can achieve a high degree of integration can be produced.
    Type: Application
    Filed: July 17, 2008
    Publication date: January 22, 2009
    Applicant: RIKEN
    Inventors: Yoshihiko Togawa, Ken Harada, Tsuyoshi Matsuda, Yoshichika Otani, Takashi Kimura
  • Publication number: 20080304184
    Abstract: A magnetic, head in one embodiment includes a substrate; a write transducer; leads coupled to the write transducer; and a resistor coupled between one of the leads and the substrate or a common line. A magnetic storage system in another embodiment includes a cable having a characteristic impedance associated with a pair of conductors; a write signal generator coupled to the pair of conductors; at least one first device coupled to the cable in series with the write signal generator and at least one of the cable conductors, the at least one first device providing a first impedance; at least one second device providing a second impedance and coupled to a second end of the cable in series with at least one of the cable conductors and the first device; and a head having a write transducer coupled to the at least one second device.
    Type: Application
    Filed: June 7, 2007
    Publication date: December 11, 2008
    Inventors: Robert Glenn Biskeborn, Philipp Herget
  • Patent number: 7450346
    Abstract: An apparatus and method for reducing heat absorption around solder pads on an electrical lead suspension (ELS). The method provides a base-metal layer having at least one opening. A dielectric layer is also provided above the base-metal layer, the dielectric layer covering a portion of the base-metal layer and at least one of the openings in the base-metal layer. A signal conductive layer is provided above dielectric layer. The signal conductive layer carries at least one solder pad portion, wherein the solder pad portion is placed above the portion of the dielectric layer such that the solder pad portion does not align with the at least one opening in the base-metal layer. In so doing, the heat absorption with respect to the base-metal layer is reduced.
    Type: Grant
    Filed: January 18, 2005
    Date of Patent: November 11, 2008
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Satya Prakash Arya, Xinzhi Xing
  • Patent number: 7441323
    Abstract: A head suspension for supporting a head slider over a storage media in a dynamic storage device is provided with a head suspension component having a spring metal layer, an electrically conductive layer and a dielectric layer interposed between the metal layer and the electrically conductive layer. A plurality of electrically conductive traces with bond pads are formed in the electrically conductive layer. A feature datum is also formed in the electrically conductive layer on a detachable carrier strip. The feature datum defines a first edge in the electrically conductive layer parallel to an edge of the bond pads.
    Type: Grant
    Filed: January 18, 2005
    Date of Patent: October 28, 2008
    Assignee: Hutchinson Technology Incorporated
    Inventor: Raymond R. Wolter
  • Patent number: 7400471
    Abstract: A ramp loading unit, for use in a disk drive that includes a head and a record carrier, that includes a holding part that holds a head support part apart from the record carrier. The ramp loading unit also includes a sliding part which the head support part elastically contacts. The sliding part includes a patterned sliding surface with a protruding part that has a width that can partially contact the head support part, wherein the position of the protruding part changes in the width direction of the sliding surface along the length direction of the sliding surface orthogonal to the width direction, so that a contact position of the head support part with the protruding part changes as the head support part slides on the sliding part in the length direction of the sliding surface.
    Type: Grant
    Filed: August 11, 2004
    Date of Patent: July 15, 2008
    Assignee: Fujitsu Limited
    Inventor: Shinichi Takahashi
  • Publication number: 20080148553
    Abstract: Embodiments of the present invention pertain to extracting particles from a slider to enable particle quantification. According to one embodiment, a slider, which is associated with a head stack assembly, is submerged into a solution. Particles are extracted from the slider without extracting particles from the entire head stack assembly.
    Type: Application
    Filed: December 20, 2006
    Publication date: June 26, 2008
    Inventors: Yiqi Feng, Hui Yan Hu, Sai H. Wong, Yi Zhao Yao
  • Publication number: 20080151432
    Abstract: A micro-electromechanical signal transmission line is made from an electrically conductive material. It has a first distal end and a second distal end. The second distal end is free to move with respect to said first distal end. There exists an unsupported region between the first distal end and the second distal end. The unsupported region is juxtaposed at a controlled distance from at least one grounded conductive surface.
    Type: Application
    Filed: December 20, 2006
    Publication date: June 26, 2008
    Inventors: Toshiki Hirano, Nobumasa Nishiyama, Haruhide Takahashi
  • Patent number: 7375913
    Abstract: A suspension having a magnetic head assembly 1 mounted thereon is provided, wherein the magnetic head assembly comprises: a write head 1-2; a read head 1-1; and a resistive heating element 1-3 for controlling the flying heights of the magnetic heads, wherein the wires HTx and GTx for the resistive heating element is disposed such that they sandwich the wires RxX and RxY for the read head. The wires for the resistive heating element may be disposed between the wires for the write head and the wires for the read head. Furthermore, the waveform of the current or voltage to the resistive heating element has a time constant of 1 ?sec or more, the resistive heating element having wires disposed near the wires of the read head.
    Type: Grant
    Filed: June 27, 2006
    Date of Patent: May 20, 2008
    Assignee: Hitachi Global Storage Technologies Japan, Ltd.
    Inventors: Naoki Satoh, Masayuki Kurita, Mikio Tokuyama, Junguo Xu
  • Patent number: 7359158
    Abstract: A suspension for disc drive has a base portion including a base plate, a load beam, a pair of hinge members, a wired flexure, etc. The wired flexure has a metal base and a wiring portion on the metal base. The hinge members are fixed overlapping the rear end portion of the load beam and the front end portion of the base plate. The wired flexure extends through a gap between the hinge members and ranges over the load beam and the base plate.
    Type: Grant
    Filed: May 27, 2004
    Date of Patent: April 15, 2008
    Assignee: NHK Spring Co., Ltd.
    Inventors: Kenichi Takikawa, Noriyuki Saito, Masao Hanya
  • Publication number: 20080080096
    Abstract: There is provided a head slider supporting device and a storage device capable of reducing the influence of a crosstalk between wirings. A head slider supporting device has one terminal connected to a magnetic head slider and the other terminal connected to a preamplifier IC. The head slider supporting device includes a supporting portion (flexure) that includes a conductor for supporting the magnetic head slider; an insulation portion that includes a dielectric contacting the supporting portion; a heater signal line 31a that is a wiring for connecting the magnetic head slider and preamplifier IC in order to control a heater provided in the magnetic head slider and that contacts the insulation portion; a heater GND line 30a that is a wiring for connecting the magnetic head slider and preamplifier IC in order to connect a heater and a ground and that contacts the insulation portion; and a GND connection line 30b that is a wiring for connecting the heater GND line 30a and supporting portion.
    Type: Application
    Filed: April 18, 2007
    Publication date: April 3, 2008
    Applicant: Fujitsu Limited
    Inventor: Hajime Miura
  • Publication number: 20080074795
    Abstract: A recording apparatus, including: a recording head including an actuator; a head holder holding the head; a circuit board disposed on the holder and configured to be connected to an external signal source; a drive circuit operable to drive the actuator; a flexible wiring member which includes wires that connect the actuator and the circuit board, which is elongated in a direction in which the wires extend, which is connected to the actuator and the circuit board at longitudinally opposite ends thereof, respectively, and on which the drive circuit is mounted between the longitudinal opposite ends, the wires including (a) a common voltage wire which connects common-voltage portions of the drive circuit and the circuit board and (b) a drive signal wire for driving the actuator; and a radiator having heat conductivity and electric conductivity and disposed between the head and the circuit board so as to extend along the wiring member, the radiator being heat-conductively and electrically joined to: (a) the common
    Type: Application
    Filed: September 25, 2007
    Publication date: March 27, 2008
    Inventor: Isao Kobayashi
  • Patent number: 7349184
    Abstract: A reference plane is added to the freestanding conductors of a wireless suspension to maintain a continuous reference plane therein. Post processing steps to the flexure are used after the underlying steel has been etched and prior to any forming or welding steps. Two screens are used to add an insulator layer and a conductor layer, such as copper, in the areas of the freestanding conductors. The insulator screen is sized to allow an insulator to overlap the original polyimide. The copper screen for the reference has a slightly longer screen pattern than the insulator screen. The conductor screen is sized such that the reference will overlap the insulator and make contact with the underlying steel at both ends of the freestanding conductors.
    Type: Grant
    Filed: August 31, 2004
    Date of Patent: March 25, 2008
    Assignee: Hitachi Global Storage Technologies
    Inventor: A. David Erpelding
  • Patent number: 7342749
    Abstract: A method for removing a lead-free solder from a slider pad is provided to permit re-utilization of a head/slider used in a magnetic disk drive. In one embodiment, a slider pad formed on a head/slider and a lead pad are connected to each other through a lead-free solder fillet. A cutting tool is heated beforehand to a temperature near the melting point of the lead-free solder. The cutting tool is moved in parallel with a surface of the slider pad to cut the solder fillet while softening the solder fillet. The solder fillet is removed so as not to impose a stress on the slider pad and in a state in which the head/slider can be re-utilized.
    Type: Grant
    Filed: July 11, 2005
    Date of Patent: March 11, 2008
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Nobuyuki Hashi, Yuhsuke Matsumoto, Takuya Satoh, Tatsushi Yoshida
  • Publication number: 20080049361
    Abstract: Connecting pieces extend outward from the support plate in the opposite directions along a crossline. A flexure body is connected to the connecting pieces. A pad is fixed to the support plate at a position ahead of the crossline. A wiring pattern extends from a pad. The wiring pattern defines a first straight portion extending forward from the flexure body along a first straight line. A second straight portion extends along a second straight line intersecting with the first straight line. A curved portion connects the first straight portion to the second straight portion. The curved portion expands outward from at least one of the first and second straight lines. The support plate merely suffers from a bending at a position ahead of the imaginary crossline even if the solder generates a stress based on its shrinkage. The wiring pattern serves to absorb the stress.
    Type: Application
    Filed: January 9, 2007
    Publication date: February 28, 2008
    Inventors: Hiroaki Kushima, Shinji Koganezawa, Takeshi Ohwe, Takuma Kido, Yasuo Suzuki
  • Patent number: 7336445
    Abstract: A magnetic recording device makes use of an “anchored” conductive stud which is securely attached within its surrounding insulator materials. The conductive stud is formed over a conductive layer which is coupled to or part of a read or a write head element of the magnetic recording device. The conductive stud has a top stud portion and a bottom undercut portion formed over the conductive layer. In one illustrated embodiment, the bottom undercut portion has a width that is greater than the width of the top stud portion. Since an insulator is formed around the conductive stud and over its bottom undercut portion, a secure coupling between the conductive stud and the conductive layer is provided. Preferably, the conductive layer is made of copper (Cu), the conductive stud is made of gold (Au), and the insulator is alumina (Al2O3). A seed layer may be formed between the conductive stud and the conductive layer. A method of making the conductive stud using a photolithography process is also disclosed.
    Type: Grant
    Filed: January 4, 2006
    Date of Patent: February 26, 2008
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Rainer Klaus Krause, Jan Marien, Johannes Thomas Paul, Gunther Wilhelm Sandmann, Gerhard Anton Scherb, Hubert Erwin Schuy, Stefan Seifried
  • Patent number: 7330338
    Abstract: Apparatus and method for adjusting at least one of a pitch and roll parameter of a gimbal for a head suspension assembly having a pair of members contacting at least one gimbal arm at spaced apart locations and having an additional member contacting the gimbal arm intermediate the spaced apart locations and wherein the members move together to cause plastic deformation of the gimbal arm. A like apparatus and method may be used sequentially or concurrently on a second gimbal arm, and may have an inverted orientation with respect to the first apparatus.
    Type: Grant
    Filed: May 5, 2004
    Date of Patent: February 12, 2008
    Assignee: Hutchinson Technology Incorporated
    Inventors: Thomas H. Wick, Mark S. Hedeen, Jeremy J. Stroschein, John L. Schumann, Justin M. Eggert
  • Patent number: 7319573
    Abstract: Embodiments of the invention provide a magnetic disk drive which has improved electrical properties owing to a reduction in the loss of transmission line, improved vibration properties owing to a reduction in the stiffness of wiring around the head, and a flat impedance in the transmission line. In one embodiment, a magnetic disk drive comprises a suspension; a magnetic head coupled with the suspension and configured to write and read information to and from a magnetic recording medium; and a transmission line disposed on the suspension to transmit writing and reading information to and from the magnetic head. The transmission line includes a writing line and a reading line, a lower conductor disposed underneath the writing line and the reading line, and an insulating layer interposed between the lower conductor and the writing and reading lines.
    Type: Grant
    Filed: June 16, 2004
    Date of Patent: January 15, 2008
    Assignee: Hitachi Global Storage Technologies Japan, Ltd.
    Inventor: Nobumasa Nishiyama
  • Patent number: 7313855
    Abstract: A method of making a multi-piece head suspension for a rigid disk drive. The method includes providing a first layer including a mounting region with an integral boss tower attached to a stiffener by one or more positioning tabs; attaching a second layer including a spring region to an interface between the mounting region and the stiffener; attaching a flexure to the stiffener; and removing the positioning tabs. The flexure can optionally be a portion of the second layer.
    Type: Grant
    Filed: December 13, 2006
    Date of Patent: January 1, 2008
    Assignee: Hutchinson Technology, Inc.
    Inventors: Shane J. Van Sloun, Mark R. Christianson, Stevenson J. Marek, James R. Mahoney, Mark A. Schmidt, Brandon K. Fraser, Jeffry S. Bennin
  • Patent number: 7299536
    Abstract: A system and method for an improved magnetic head arm assembly (HAA), reducing complexity of design and difficulty of manufacture, is disclosed.
    Type: Grant
    Filed: April 6, 2006
    Date of Patent: November 27, 2007
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Jeffery L. Wang, Takehiro Kamigama, Chi Hung Yuen, Liu Jun Zhang
  • Patent number: 7293347
    Abstract: A manufacturing method of an HAA includes a step of fixing a first lead conductor member onto a suspension, a step of attaching a second lead conductor member to at least one actuator arm, a step of fixing the suspension onto the at least one actuator arm, a step of electrically connecting the first lead conductor member fixed on the suspension with the second lead conductor member attached on the at least one actuator arm, a step of, thereafter, fixing a head slider provided with at least one head element onto the suspension, and a step of electrically connecting the at least one head element with the first lead conductor member.
    Type: Grant
    Filed: November 9, 2004
    Date of Patent: November 13, 2007
    Assignee: TDK Corporation
    Inventors: Takehiro Kamigama, Masashi Shiraishi
  • Patent number: 7239484
    Abstract: A magnetic head slider or a precise positioning actuator is electrically and mechanically connected to a suspension, by performing molten-solder connections using solder balls with cores that will not melt even at a solder-melting temperature.
    Type: Grant
    Filed: March 1, 2004
    Date of Patent: July 3, 2007
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventor: Satoshi Yamaguchi
  • Patent number: 7218481
    Abstract: Apparatus and method for selectively applying a voltage to one major surface of a pair of piezoelectric motors (PZTs) on a disk drive head suspension with a primary plane of a load beam of the head suspension parallel to the major surfaces of the PZT elements electrically insulated from the load beam. Electrical connections to the PZTs are made via wires, solder, conductive epoxy or electro-mechanical attachment of a plated surface of the PZT with a bond pad on an electrically isolated substrate. Lead extensions or separate pieces may be used to connect to the PZTs. The PZTs may be located on a major surface of the load beam, or may be assembled in a pre-fabricated motor assembly before being installed in the head suspension. Apertures in the load beam and other layers permit physical installation of the PZT motors and enable electrical connection to the PZTs.
    Type: Grant
    Filed: October 7, 2003
    Date of Patent: May 15, 2007
    Assignee: Hutchinson Technology Incorporated
    Inventors: Jeffry S. Bennin, Scott C. Giere, Jason S. Griesbach, Brett L. Haugen, Jason R. Heffelfinger, Dennis M. Ingle, Tony S. Peterson
  • Patent number: 7203033
    Abstract: A low cost, flex head gimbal assembly has a substrate with an attachment region, a flexure region and an integrated gimbal. The flex head gimbal assembly is electrically and mechanically connected to an actuator arm via solder bumps in the attachment region. A stiff plate is attached to the substrate between the attachment region and the flexure region. A flex cable and electrical interconnections extend from the attachment region across the flexure region to the gimbal. Electrical leads extend from the solder bumps to the flex cable. The substrate is bent at the stiff plate to achieve the desired z-height and to impart the pre-load to the assembly.
    Type: Grant
    Filed: March 17, 2003
    Date of Patent: April 10, 2007
    Assignee: Seagate Technology LLC
    Inventor: Zine-Eddine Boutaghou
  • Patent number: 7114238
    Abstract: A multi-layer suspension comprised of a rectangular base plate section, a load beam and a flexure, said load beam can be further divided into a bending area adjacent to the base plate and a rigid area contiguous to said bending section, said suspension assembly is made up of three layers, wherein an adhesive layer is sandwiched between two stainless steel layers with parts of one of said stainless steel layers being etched off. The method for making such suspension including the steps of making three layer raw material, etching off parts of the stainless steel, etching off parts of the polyimide, and the forming and de-tab. The structure of multi-layer suspension of the present invention overcomes the problems of etching variations and misalignment exist in the traditional production of the suspension.
    Type: Grant
    Filed: October 18, 2002
    Date of Patent: October 3, 2006
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventor: Masashi Shiraishi
  • Patent number: 7095594
    Abstract: A method and apparatus for collocating an interface circuit with a disk drive read/write head is described. In one embodiment the interface circuit is attached to the load arm on one side and the miniflex interconnect on the other. The read/write head is mounted on the miniflex directly below the interface circuit. The interface circuit comprises a read signal preamplifier, a write driver, and head selection circuitry. A common multiplexer circuit is used to perform the other conventional read/write circuit functions. The common multiplexer circuit includes a head selection block to determine which heads are activated, a head driver block, and a read receiver block. The common multiplexer circuit is mounted at the base of the miniflex.
    Type: Grant
    Filed: September 17, 2001
    Date of Patent: August 22, 2006
    Assignee: Texas Instruments Incorporated
    Inventors: Peter Maimone, Al Morton, Chi-Fa Chiou
  • Patent number: 7088543
    Abstract: A suspension having a magnetic head assembly 1 mounted thereon is provided, wherein the magnetic head assembly comprises: a write head 1-2; a read head 1-1; and a resistive heating element 1-3 for controlling the flying heights of the magnetic heads, wherein the wires HTx and GTx for the resistive heating element is disposed such that they sandwich the wires RxX and RxY for the read head. The wires for the resistive heating element may be disposed between the wires for the write head and the wires for the read head. Furthermore, the waveform of the current or voltage to the resistive heating element has a time constant of 1 ?sec or more, the resistive heating element having wires disposed near the wires of the read head.
    Type: Grant
    Filed: September 30, 2003
    Date of Patent: August 8, 2006
    Assignee: Hitachi Global Storage Technologies Japan, Ltd.
    Inventors: Naoki Satoh, Masayuki Kurita, Mikio Tokuyama, Junguo Xu
  • Patent number: 7070421
    Abstract: Embodiments of the invention provide a rotating disk storage device including a connection structure between an FPC and a printed board and providing allowance for dimensional tolerances. In one embodiment, the rotating disk storage device includes a disk enclosure, an FPC supporting portion, and a flexible printed circuit board assembly provided with an FPC terminal area that extends along a front surface of the FPC supporting portion and further beyond an end portion of the FPC supporting portion. When the printed board is mounted on the disk enclosure, a connector terminal contacts and gives pressure to an FPC terminal formed in the FPC terminal area. This causes the FPC terminal area to flex in the direction of an arrow.
    Type: Grant
    Filed: December 10, 2004
    Date of Patent: July 4, 2006
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Hirofumi Nozaki, Shinichi Kimura, Hiroki Kitahori, Kenji Kuroki
  • Patent number: 7051423
    Abstract: This invention relates to a testing method for a head IC which makes it possible to simplify checking of the head. The head IC is installed on a head suspension, and probes are placed on terminals of the head suspension to check electric characteristics of the head IC. With this invention, contact of the probes for checking the head IC when the head IC has been installed, but before installing the head, becomes easier.
    Type: Grant
    Filed: September 10, 2003
    Date of Patent: May 30, 2006
    Assignee: Fujitsu Limited
    Inventor: Akio Gouo
  • Patent number: 7032294
    Abstract: A switchable shunt has an insulating layer separating conductive lead and spring metal layers. The shunt includes a base region formed on the spring metal layer, one or more arms formed in the conductive lead layer and at least one of the insulating and spring metal layers, one or more pad regions electrically coupled to an arm and formed in at least the conductive lead layer, and one or more gaps. Each arm extends through a gap and is resiliently biased toward a shunted state with the pad region in electrical contact with the base region. The shunt is movable to an electrically open state where the pad and base regions are electrically isolated. A method of making the shunt includes etching the shunt from laminated material and pushing the arm and pad through the gap. The shunt may be operated by applying a force to the arm.
    Type: Grant
    Filed: January 22, 2003
    Date of Patent: April 25, 2006
    Assignee: Hutchinson Technology Incorporated
    Inventors: Stevenson J. Marek, Craig A. Leabch, Larry C. Webb, Jr., Mark A. Miller, Anthony J. Liberko, Raymond R. Wolter, Steven R. Lagergren
  • Patent number: 7016156
    Abstract: Magnetic disk apparatus includes an electric wiring capable of satisfying an electric condition under which high frequency recording higher than or equal to 200 MHz, a magnetic head having at least a recording device to a magnetic recording medium, and also the electric wiring corresponding to a recording current supplying device to this magnetic head are formed on a suspension member for mechanically suspending the magnetic head, the recording current being supplied to a magnetic head recording device by employing such electric wiring, the characteristic impedance of which is higher than a maximum impedance of the magnetic head recording device.
    Type: Grant
    Filed: October 12, 2004
    Date of Patent: March 21, 2006
    Assignee: Hitachi, Ltd.
    Inventors: Yohji Maruyama, Hiroshi Ikekame, Hisashi Takano
  • Patent number: 7002780
    Abstract: An actuation assembly includes a movable actuator arm, a suspension assembly, a slider, and means for attaching the slider to the gimbal. The actuator arm supports the suspension assembly, which includes a gimbal carrying a gimbal bond pad that is electrically isolated from the gimbal. The slider includes an air bearing surface and a gimbal opposing face opposite the air bearing surface. The means for attaching the slider to the gimbal provide a direct contact between the gimbal and the slider and elevate a plane of the gimbal opposing face with respect to the gimbal bond pad. The means for attaching the slider to the gimbal is integral with the gimbal.
    Type: Grant
    Filed: October 1, 2001
    Date of Patent: February 21, 2006
    Assignee: Seagate Technology LLC
    Inventors: Michael L. Rancour, Richard L. Segar, Sandeepan Bhattacharya
  • Patent number: 6993824
    Abstract: A method is provided for controlling the pitch static attitude of a slider in an integrated lead suspension head gimbal assembly. The integrated lead suspension includes a load beam, a mount plate, a hinge and a flexure made out of a multi-layer material. The flexure legs and the outrigger leads are simultaneously plastically deformed to define the pitch static attitude. The flexure legs and the outrigger leads are deformed at approximately the same longitudinal location.
    Type: Grant
    Filed: August 28, 2003
    Date of Patent: February 7, 2006
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: William W. Childers, Drew B. Lawson, Tzong-Shii Pan, Surya Pattanaik
  • Patent number: 6965499
    Abstract: A head suspension or head suspension component article configured for solder ball bonding of a head slider to electrical traces on article. The article including electrical traces formed from electrically conductive material with the electrical traces having a bonding region adapted for electrical bonding to a head slider. Also included is a support structure providing support for at least portions of the electrical traces and including a head slider mounting region adapted to receive the head slider. This structure is configured to mechanically and thermally isolate the bonding region of the electrical traces from the head slider mounting region to reduce mechanical and thermal effects of a solder ball bonding process on the article during solder ball bonding of the head slider to the electrical traces. The support structure may be reduced at or around the bonding region, or the conductive material may be increased to dissipate more heat.
    Type: Grant
    Filed: April 23, 2003
    Date of Patent: November 15, 2005
    Assignee: Hutchinson Technology Incorporated
    Inventors: Yiduo Zhang, Raymond R. Wolter, Craig A. Leabch
  • Patent number: 6963471
    Abstract: A wired flexure comprises a metallic substrate, a polyimide layer formed on the metallic substrate, and read conductors and write conductors formed on the polyimide layer. The polyimide layer has a thick-walled portion and a thin-walled portion that are different in thickness. The read and write conductors extend covering the thick- and thin-walled portions. In order to obtain a desired impedance, the width of the conductors in the thin-walled portion is smaller than that of the conductors in the thick-walled portion.
    Type: Grant
    Filed: April 7, 2003
    Date of Patent: November 8, 2005
    Assignee: NHK Spring Co., Ltd.
    Inventors: Hajime Arai, Ikuo Someya
  • Patent number: 6956722
    Abstract: A lead conductor member for a thin-film magnetic head, includes a plurality of head connection pads to be connected to a plurality of terminal electrodes of a thin-film magnetic head element, a plurality of external connection pads used for external connections, a plurality of trace conductors, one end of each of the plurality of trace conductors being connected to the plurality of head connection pads and the other ends of the plurality of trace conductors being connected to the plurality of external connection pads, respectively, and at least one pair of test connection pads capable of being temporally and electrically short-circuited with at least one pair of trace conductors of the plurality of trace conductors, respectively.
    Type: Grant
    Filed: September 17, 2002
    Date of Patent: October 18, 2005
    Assignees: TDK Corporation, SAE Magnetics (H.K.) Ltd.
    Inventors: Takeshi Wada, Takashi Honda, Masashi Shiraishi
  • Patent number: 6944936
    Abstract: A method for manufacturing an integrated lead suspension or component having an integrated circuit (IC) with an array of terminals. The suspension or component is formed from a laminated sheet of material including a spring metal layer and a conductive material layer separated by an insulating layer. The method includes forming an IC window in the spring metal layer, forming integrated conductive leads in the conductive material layer and forming holes in the insulating layer. The IC can then be mounted to the suspension or component in the IC window, and the array of terminals electrically interconnected to the integrated conductive leads through the insulating layer.
    Type: Grant
    Filed: October 4, 2002
    Date of Patent: September 20, 2005
    Assignee: Hutchinson Technology Incorporated
    Inventor: Todd A. Krinke
  • Patent number: 6943302
    Abstract: A flexible printed circuit board of the present invention directly relays connecting portions of a magnetic head placed on a suspension to connecting portions of a base end of a carriage arm in a head suspension assembly of a magnetic disk apparatus. The flexible printed circuit board includes a laminate composed of at least a base layer, a plurality of conductive circuits formed on the base layer, a cover layer covering the conductive circuits, and a conductive polymer layer formed in the insulating material portion in the surface of the laminate. The flexible printed circuit board includes a stainless layer below the base layer or on a lower side of the conductive polymer layer on the base layer side.
    Type: Grant
    Filed: December 27, 2002
    Date of Patent: September 13, 2005
    Assignee: Achilles Corporation
    Inventors: Teruyoshi Kageyama, Shinya Okino, Mamoru Ito
  • Patent number: 6940694
    Abstract: A magnetic head assembly equipped with a slider having a magnetic head and a gimbal spring on which the slider is mounted with an adhesive. The gimbal spring is supported by beam portions of a load beam. A thin-film wiring pattern formed on the load beam extends to a surface of the gimbal spring. A tip of the wiring pattern acts as a terminal portion that is connected to input/output terminals integrally formed on the slider. The slider is locked on the gimbal spring by electrically conducting bonding and an adhesive. A plurality of dummy patterns having the same height as the wiring pattern are provided at a position corresponding to where the adhesive is dropped on the surface of the gimbal spring. The adhesive is placed in an area sandwiched by the dummy patterns on the gimbal spring.
    Type: Grant
    Filed: July 29, 2004
    Date of Patent: September 6, 2005
    Assignee: Fujitsu Limited
    Inventors: Takeshi Ohwe, Toru Watanabe, Ryosuke Koishi, Seizi Yoneoka
  • Patent number: 6927946
    Abstract: A technique for electrically interconnecting a disk drive suspension assembly and a micro-actuator mounting a transducer-carrying slider. A first set of termination pads is provided on a generally planar surface of the micro-actuator, adjacent a front edge portion of the micro-actuator. A set of leads is provided on the suspension assembly so as to extend generally orthogonally to the first set of termination pads and in adjacent relationship therewith. Electrical connections are provided between the first set of termination pads and the suspension assembly leads. A second set of termination pads can be provided on the micro-actuator planar surface adjacent to a front edge portion of the slider and a third set of termination pads can be provided on the slider front edge portion. The second and third sets of termination pads are then electrically connected.
    Type: Grant
    Filed: November 9, 2004
    Date of Patent: August 9, 2005
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Victor Wing Chun Shum, Surya Pattanaik
  • Patent number: 6902099
    Abstract: The invention provides a magnetic head capable of positively preventing electrostatic breakdown of an MR magnetic head device, and a method of manufacturing the magnetic head. A circuit board comprises at least a pair of leads for constructing a circuit, lands connected respectively to the leads, and solder bumps formed respectively on the lands. The solder bumps are arranged in an adjacent relationship and, when the solder bumps are crushed, peripheral portions of the solder bumps are pressed or spread so as to overlap with each other. The magnetic head includes the circuit board.
    Type: Grant
    Filed: April 10, 2002
    Date of Patent: June 7, 2005
    Assignee: Alps Electric Co., Ltd.
    Inventors: Michiharu Motonishi, Michiaki Moroe
  • Patent number: 6892442
    Abstract: The invention allows a thin-film magnetic head that meets specifications required by the customer to be provided in a short period of time and manufacturing costs to be reduced. A slider includes a first surface and a second surface each facing opposite directions. Two magnetic head element portions are formed in the slider near an end face orthogonal to the direction of air flow. One of the element portions is placed to face the first surface. The other element portion is placed to face the second surface. The element portions are placed in symmetrical positions with respect to a place parallel to the first and second surfaces. On the end face four pad-shaped electrodes are provided for electrically connecting the two element portions to an external device. The electrodes are selectively connected to any of the element portions through four conductors.
    Type: Grant
    Filed: March 21, 2002
    Date of Patent: May 17, 2005
    Assignee: TDK Corporation
    Inventor: Yoshitaka Sasaki
  • Patent number: 6865058
    Abstract: An actuator assembly includes a rotatable actuator arm mounted on the base of a disc drive. The actuator arm includes a metallic member seated on a non-metallic body. A proximal end of a load beam is mounted on the actuator arm and a distal end of the load beam supports a head. The actuator assembly also includes a connection between the metallic member and the load beam that secures the load beam to the actuator arm.
    Type: Grant
    Filed: June 20, 2002
    Date of Patent: March 8, 2005
    Assignee: Seagate Technology LLC
    Inventors: Todd Warren Kube, Alexander Wei Chang, Bruce Lynn Blakeslee, Ernest Paul Lee, William Leon Rugg
  • Patent number: 6851177
    Abstract: A manufacturing method of an HAA includes a step of fixing a first lead conductor member onto a suspension, a step of attaching a second lead conductor member to at least one actuator arm, a step of fixing the suspension onto the at least one actuator arm, a step of electrically connecting the first lead conductor member fixed on the suspension with the second lead conductor member attached on the at least one actuator arm, a step of, thereafter, fixing a head slider provided with at least one head element onto the suspension, and a step of electrically connecting the at least one head element with the first lead conductor member.
    Type: Grant
    Filed: September 17, 2001
    Date of Patent: February 8, 2005
    Assignee: TDK Corporation
    Inventors: Takehiro Kamigama, Masashi Shiraishi
  • Patent number: 6847505
    Abstract: The present invention couples shunting pads to the conductor leads of a suspension assembly for supporting a slider in a magnetic storage system, which can be use to temporarily shunt the leads to prevent against damage to the heads by electrostatic discharge. In one embodiment, the suspension assembly includes shunting pads that are sized and positioned to allow shunting using a probe. In another embodiment, a suspension assembly includes a built-in shunting tab that when applied, temporarily shunts the MR read head and prevents any transient voltage from developing across the head. In a further embodiment a tool having multiple probes is integrated into a jig, which is used for holding and shunting one or more suspension assemblies during processing. In one embodiment, the present invention is applied to an integrated lead suspension assembly.
    Type: Grant
    Filed: March 14, 2002
    Date of Patent: January 25, 2005
    Assignee: Hitachi Global Storage Technologies, The Netherlands B.V.
    Inventor: Jih-Shiuan Luo
  • Patent number: 6833978
    Abstract: A technique for electrically interconnecting a disk drive suspension assembly and a micro-actuator mounting a transducer-carrying slider. A first set of termination pads is provided on a generally planar surface of the micro-actuator, adjacent a front edge portion of the micro-actuator. A set of leads is provided on the suspension assembly so as to extend generally orthogonally to the first set of termination pads and in adjacent relationship therewith. Electrical connections are provided between the first set of termination pads and the suspension assembly leads. A second set of termination pads can be provided on the micro-actuator planar surface adjacent to a front edge portion of the slider and a third set of termination pads can be provided on the slider front edge portion. The second and third sets of termination pads are then electrically connected.
    Type: Grant
    Filed: April 24, 2002
    Date of Patent: December 21, 2004
    Assignee: Hitachi Global Storage Technologies
    Inventors: Victor Wing Chun Shum, Surya Pattanaik
  • Patent number: RE39478
    Abstract: A magnetic head suspension assembly is fabricated with an integral piece which includes a load beam section, a flexure section, a rest mount section and a leaf spring section between the load beam and rear mount. A tongue extends from the load beam to the flexure and has a down-facing load dimple which contacts the non-air bearing surface of an attached air bearing slider. The flexure includes narrow thin legs adjacent to a cutout that delineates the load beam tongue. The head suspension is characterised by a high first bending mode frequency and low pitch and roll stiffness.
    Type: Grant
    Filed: June 13, 1996
    Date of Patent: January 23, 2007
    Assignee: Western Digital (Fremont), Inc.
    Inventors: Michael R. Hatch, Chak M. Leung