Abstract: A wired circuit board that can control characteristic impedance at connection points between the read wire and write wire of a suspension board with circuit and terminal portions of the wired circuit board connected thereto with a simple structure, to improve signal transmission efficiency for fine pitch wiring or for high frequency signal. A conductive board 25 is adhesively bonded to an insulating base layer 18 of the wired circuit board 1 at one side thereof opposite to the other side on which a suspension-board-side connection terminal portion 11 having a first terminal portion 13 to connect with a read wire 6R of a suspension board with circuit 3 and a second terminal portion 14 to connect with a write wire 6W of the suspension board with circuit 3 is formed, in such a relation that an opening 27 can correspond in position to either of the first terminal portion 13 and the second terminal portion 14, and a stiffener board 24 is adhesively bonded to the conductive board 25 via an adhesive layer 28.

Abstract: A magnetic head device which can accommodate higher data transfer rates can be implemented by using lead wires. A magnetic head device 1 according to the present invention includes a head slider 3 having a magnetic head 2 having a data reading element and a data writing element, a reading lead RL for transferring data between the data reading element and external devices, the reading lead configured by a pair of lead wires which are twisted together, and a writing lead WL for transferring data between the data writing element and external devices, the writing lead configured by a pair of lead wires which are untwisted but arranged in parallel to each other. Thus, the magnetic head device can accommodate higher data transfer rates by using the writing lead WL configured by a pair of lead wires which are untwisted but arranged in parallel to each other.

Abstract: The present invention provides a method for improving the static attitude of a head suspension assembly by improving the manufacture of electrical interconnects by providing a laterally directed tension on the electrical interconnect during manufacture, thereby substantially inhibiting deformation of the gimbal region of the interconnect and the creation of non-planar slider standoffs.

Abstract: A suspension having a magnetic head assembly 1 mounted thereon is provided, wherein the magnetic head assembly comprises: a write head 1-2; a read head 1-1; and a resistive heating element 1-3 for controlling the flying heights of the magnetic heads, wherein the wires HTx and GTx for the resistive heating element is disposed such that they sandwich the wires RxX and RxY for the read head. The wires for the resistive heating element may be disposed between the wires for the write head and the wires for the read head. Furthermore, the waveform of the current or voltage to the resistive heating element has a time constant of 1 &mgr;sec or more, the resistive heating element having wires disposed near the wires of the read head.

Abstract: A load beam and a disc drive data storage system using the same are disclosed. The load beam includes a resilient section adapted for attachment to a support arm, and a substantially rigid section coupled to the resilient section and coupleable to a gimbal. The resilient and rigid load beam sections are separated by a preload bend. A first slide capture is included on the rigid load beam section and is adapted to slidably secure a conductor sleeve to the rigid section such that the sleeve can move longitudinally therethrough. The first slide capture substantially constrains conductor sleeve movement orthogonal to longitudinal movement. A first longitudinal inhibiting capture is included on the resilient load beam section and is adapted to secure the sleeve to the resilient section such that longitudinal displacement of the conductor sleeve proximate the firsts longitudinal inhibiting capture is constrained.

Abstract: The present invention provides a head suspension assembly, which cantilevers a read/write magnetic transducer head adjacent the rotating surface of a disk in a disk drive, and the method of constructing the head suspension assembly using adhesives adhesive control and distribution features designed to improve both the performance characteristics and manufacturing yields of head suspension assemblies. Such adhesive control and distribution features in accord with the present invention may include through-hole features and component perimeter overlays that impede the flow of adhesive onto surfaces and component interfaces of the flex suspension assembly where the presence of such adhesives may degrade the suspension assembly's performance attributes.

Abstract: A tall-electrode trace interconnect array includes a dielectric support substrate for supporting least two tall-electrode trace conductors. A dielectric support structure on the support substrate supports outside longitudinal walls of the two tall-electrode trace conductors. The dielectric support structure is formed to be absent from a longitudinal space between the two tall-electrode trace conductors thereby defining an ambient air dielectric to reduce and control inter-electrode capacitance and increase resonant frequency and effective electrical bandwidth of the trace interconnect array. A method for forming the array is also disclosed.

Abstract: The invention provides a magnetic head capable of positively preventing electrostatic breakdown of an MR magnetic head device, and a method of manufacturing the magnetic head. A circuit board comprises at least a pair of leads for constructing a circuit, lands connected respectively to the leads, and solder bumps formed respectively on the lands. The solder bumps are arranged in an adjacent relationship and, when the solder bumps are crushed, peripheral portions of the solder bumps are pressed or spread so as to overlap with each other. The magnetic head includes the circuit board.

Abstract: A low cost, flex head gimbal assembly has a substrate with an attachment region, a flexure region and an integrated gimbal. The flex head gimbal assembly is electrically and mechanically connected to an actuator arm via solder bumps in the attachment region. A stiff plate is attached to the substrate between the attachment region and the flexure region. A flex cable and electrical interconnections extend from the attachment region across the flexure region to the gimbal. Electrical leads extend from the solder bumps to the flex cable. The substrate is bent at the stiff plate to achieve the desired z-height and to impart the pre-load to the assembly.

Abstract: Apparatus and method of adjusting the common mode impedance while enabling maintenance of the differential mode impedance of a pair of traces located with respect to a ground plane formed by a load beam or trace assembly of a disk drive head suspension. The ground plane has apertures with isolated conductive islands in the apertures for setting a desired common mode impedance. The method includes a cut and try approach using sample coupons to adjust the ratio of backed area to island area to adjust the common mode impedance while maintaining the differential mode impedance by maintaining the ratio of unbacked area to the sum of the backed and island areas.

Abstract: The present invention is directed to a disk drive that includes a head disk assembly on a base plate, a cover sealably attached to the base plate to enclose the head disk assembly, and a printed circuit board fastened beneath the head disk assembly. The printed circuit board has a port connector at one end of the board opposite an end having power and signal connectors.

Abstract: A transducer assembly in which an electric current is passed through plating solution in recesses of a metal substrate to plate electrical contact bumps having bump fronts in the recesses and exposed bump backs. The transducer is partially formed on the substrate, sealing the exposed bump backs. One or more vacuum processes are performed to complete formation of the transducer. At least a portion of the metal substrate is etched away to expose the bump fronts of the electrical contact bumps.

Abstract: A wired flexure comprises a metallic substrate, a polyimide layer formed on the metallic substrate, and read conductors and write conductors formed on the polyimide layer. The polyimide layer has a thick-walled portion and a thin-walled portion that are different in thickness. The read and write conductors extend covering the thick- and thin-walled portions. In order to obtain a desired impedance, the width of the conductors in the thin-walled portion is smaller than that of the conductors in the thick-walled portion.

Abstract: The present invention provides a method for the creation and removal of shunts for the prevention of ESD/EOS damage to electrical components. In one embodiment of the present invention, the conductive pathway is provided and removed by exposing the interconnect's carbonizable and ablatable substrate to a radiant energy source such as a laser beam. The present invention also provides for interconnects that include at least two conductive wires or leads engaged on at least one surface by a carbonizable and ablatable material. The conductive wires may each include a branched dead end lead portion interleaved with the branched dead end lead portion of the other. Alternatively, the conductive wires may extend in close proximity to each other in a curved or sinuous or serpentine or backtracking pattern.

Abstract: A write/read head supporting mechanism including a slider having an electromagnetic transducer element or an optical module, a suspension for supporting the slider and including a ground region, and a microactuator disposed between the slider and the suspension for displacing said slider. Further, at least a part of the microactuator includes an electrically conductive region, and the ground region of the suspension is electrically connected to the slider by the electrically conductive region of the microactuator, such that the slider is grounded so as to prevent an electrostatic breakdown of the electromagnetic transducer element or the optical module.

Abstract: A trace interconnect assembly designed for transmitting electrical signals to and from a head assembly in a hard disk drive is disclosed. The interconnect assembly includes one or more single-layer thin, elongated, and generally flat substrate-free trace interconnects. The trace interconnects are new conductors etched out of a planar length of preferably a high tensile and high yield strength metal such as beryllium copper. They are shaped to match the surface topology of the suspension assembly. Trace interconnects have a rigid region and flexible regions that match a rigid region and flexible regions in the suspension assembly. Different additional elements include support braces, standoffs, trace tangs, bond pads, and stacked interconnects. Coupling a head assembly to the interconnect assembly creates a head interconnect harness. Methods of manufacture for the trace interconnect assembly, a multi-conductor stacked version, a head suspension assembly, and the head interconnect harness are disclosed.

Abstract: Magnetic disk apparatus includes an electric wiring capable of satisfying an electric condition under which high frequency recording higher than or equal to 200 MHz, a magnetic head having at least a recording device to a magnetic recording medium, and also the electric wiring corresponding to a recording current supplying device to this magnetic head are formed on a suspension member for mechanically suspending the magnetic head, the recording current being supplied to a magnetic head recording device by employing such electric wiring, the characteristic impedance of which is higher than a maximum impedance of the magnetic head recording device.

Abstract: A magnetic head using a mechanical switch and an electrostatic discharge device network is disclosed. A mechanical switch is in series and parallel configuration with a silicon electrostatic discharge network. The electrostatic discharge network can be controlled in an on or off state for testing, evaluation or diagnostics of the armature or MR head.

Abstract: A method of wiring a head suspension assembly includes fixing a tube binding a plurality of wires on a suspension assembly, and fixing the wires extending from the fixed tube on the suspension while leading them to a top side of the suspension. The suspension has a tab frame with first and second frames. Each wire led to the top side of the suspension is bonded to the second frame of a tab frame. An insulation film is removed from each connecting portion of the wires to connect the wires to respective connecting pads of the slider. A first frame is bent substantially perpendicular to the suspension, and the second frame is bent substantially perpendicular to the first frame, thereby positioning the wires bonded to the second frame at the connecting pads on the slider. The wires are then ultrasonically welded to the respective connecting pads on the slider.

Abstract: A new type of suspension circuit electrical bonding pad is described for electrically and mechanically connecting process for the magnetic recording head. The new type of bonding pad will serve as the joint material as well as the joint interface. Thus there is no need to apply the conductive material in between the bonding pads and magnetic recording head terminals, consequently reducing the process leading time and simplifying the magnetic recording head assemble process.

Abstract: The suspension for a head assembly is capable of securely limiting the small static electricity, which cannot be limited by improving a factory environment. In the suspension of the present invention, a gimbal section is provided to a front end of the suspension and capable of holding a slider. A terminal section is provided to a base end of the suspension and electrically connected to a magnetic disk drive unit. Terminals are formed in the terminal section and connected to a cable pattern, which will be connected to the slider. A short pattern is formed in an edge part of the terminal section, and one end of the short pattern is connected to a first terminal of the terminals. The edge part of the terminal section is bent so as to elastically make the other end of the short pattern contact a second terminal of the terminals. A slit is formed in the terminal section, so that the second terminal is capable of leaving from the short pattern.

Abstract: A low height disk drive having an overall height of approximately one inch (1″). The drive includes a head disk assembly, including a base plate, two disks rotatably supported on the base plate, a motor for rotating the disks, at least two heads for reading information from and writing information on respective ones of the disks; an actuator, supported on the base plate and responsive to control signals, for selectively positioning the heads with respect to the disks, and a cover sealably attached to the base plate to enclose the storage device, the head, and the actuator. The disk drive also includes control circuitry for generating control signals, and for providing information signals to and receiving information signals from the heads. The head disk assembly and the control circuitry have a combined height of approximately one inch or less.

Abstract: A switchable shunt has an insulating layer separating conductive lead and spring metal layers. The shunt includes a base region formed on the spring metal layer, one or more arms formed in the conductive lead layer and at least one of the insulating and spring metal layers, one or more pad regions electrically coupled to an arm and formed in at least the conductive lead layer, and one or more gaps. Each arm extends through a gap and is resiliently biased toward a shunted state with the pad region in electrical contact with the base region. The shunt is movable to an electrically open state where the pad and base regions are electrically isolated. A method of making the shunt includes etching the shunt from laminated material and pushing the arm and pad through the gap. The shunt may be operated by applying a force to the arm.

Abstract: The present invention includes a polymeric/copper ring gimbal adhesively attached to a load beam. Such a gimbal further includes at least one deformation inhibiter for inhibiting and/or preventing the deformation of the gimbal, such deformation inhibiters comprising a forwardly or distally extending non-water absorbent appendage. Such a deformation inhibiting appendage may be an extension of the conductive traces forming the electrical pathway on the gimbal.

Abstract: An apparatus for protecting a magnetoresistive head from electrostatic discharge. The apparatus includes an actuator assembly including the magnetoresistive head, and a connector board including a plurality of conductive traces in electrical contact with the magnetoresistive head. The connector board defines a plurality of openings therein, each of the openings having sides surfaces in electrical contact with one of the traces. The apparatus further includes a conductive shunting member including a plurality of protruding members adapted to be inserted into the openings and contact the side surfaces of the openings. The shunting member, when so inserted into the openings shorts the traces to provide protection of the magnetoresistive head from electrostatic discharge.

Abstract: A floppy disk drive comprising a magnetic head, a flexible printed circuit, and a plurality of connecting lands. The magnetic head is adapted to move in a radial direction of a recording medium which is rotated by a spindle motor for recording and reproducing an information on and from the recording medium. The flexible printed circuit is provided on a carrier for moving the magnetic head. The plurality of connecting lands is provided on the flexible printed circuit for respective lead wires which have been drawn out from the magnetic head. The connecting lands are apart from each other and located in a direction where the lead wires are drawn from the magnetic head and the connecting lands are electrically connected to each other. End portions of the lead wires are selectively connected to the connecting lands.

Abstract: A head gimbal assembly is provided with a slider that flies above the surface of a disk, and a head for reading/writing data from/onto the surface of the disk. One or more conductive wires are connected to the head and are used to transmit data. A load beam supports the wire(s) thereon and holds the head/slider near a front end of the load beam. Each wire forms a wire loop between the head connecting point edge and the wire fixing point. A predetermined portion of each wire loop is pressed from above on the surface of the load beam, and then pushed toward the head connecting point edge, thereby plastically deforming a section between the head connecting point edge and the predetermined portion of the wire loop.

Abstract: A tall-electrode trace interconnect array includes a dielectric support substrate for supporting least two tall-electrode trace conductors. A dielectric support structure on the support substrate supports outside longitudinal walls of the two tall-electrode trace conductors. The dielectric support structure is formed to be absent from a longitudinal space between the two tall-electrode trace conductors thereby defining an ambient air dielectric to reduce and control inter-electrode capacitance and increase resonant frequency and effective electrical bandwidth of the trace interconnect array. A method for forming the array is also disclosed.

Abstract: Magnetic disk apparatus includes an electric wiring capable of satisfying an electric condition under which high frequency recording higher than or equal to 200 MHz, a magnetic head having at least a recording device to a magnetic recording medium, and also the electric wiring corresponding to a recording current supplying device to this magnetic head are formed on a suspension member for mechanically suspending the magnetic head, the recording current being supplied to a magnetic head recording device by employing such electric wiring, the characteristic impedance of which is higher than a maximum impedance of the magnetic head recording device.

Abstract: Mechanically formed standoffs in a disk drive integrated circuit interconnect reduces the cost of manufacturing and improves the reliability of the electrical interconnections thereof. Connection pads defined along the interconnect are bonded with bonding pads of a signal producing source and a signal processing source. The standoffs provide mechanical stops during the bonding process, enabling sufficient bonding material to form between bonding areas. The standoffs are mechanically formed with a punch and die assembly either directly through a bonding pad predefined along traces on the interconnect or adjacent the bonding pad. The standoffs formed through the bonding pads are covered with solder or other electrically conductive bonding material.

Abstract: A lower cost metal layer free flexible conductive laminate segment is connected to a relatively smaller amount of the more expensive metal layer containing flexible conductive laminate segment to connect a slider to signal circuitry in a cost efficient way while avoiding biasing of the slider movement by the conductor.

Abstract: The magnetic disk apparatus includes an electric wiring capable of satisfying an electric condition under which high frequency recording higher than or equal to 200 MHz can be accomplished. A magnetic head having at least a recording device for recording to a magnetic recording medium is provided as well as an electric wiring corresponding to a recording current supplying device for this magnetic head are formed on a suspension member for mechanically suspending the magnetic head. The recording current is supplied to a magnetic head recording device by employing such electric wiring, the characteristic impedance of which is higher than a maximum impedance of the magnetic head recording device.

Abstract: In a disk drive suspension the conventional load beam spring section is replaced by the spring metal layer of the flexible conductor that forms the flexure providing more accurate spring function without the need of critical etching steps in the load beam spring section.

Abstract: A method and system for protecting a magnetoresistive (MR) head from electrostatic discharge damage is disclosed. The MR head includes an MR sensor having a first end and a second end. The MR head is coupled with a suspension assembly including a first lead coupled with the first end of the MR sensor, a second lead coupled with the second end of the MR sensor, and an insulating film supporting first and second portions of the first and second leads. In one aspect, the method and system include providing first and second test pads coupled with the first and second leads, respectively. The first and second test pads are for testing the MR head. The method and system also include providing a permanent resistor coupled to the first and second test pads. The permanent resistor has a resistance of less than approximately ten thousand ohms. In another aspect, the suspension assembly includes first and second head gimbal assembly pads coupled to the first and second leads, respectively.

Abstract: A head slider and head IC are mounted on a head suspension, the head IC being mounted on a head IC mounting surface. One or more through holes are provided on the head IC mounting surface of the head suspension and the head IC is mounted by injecting a bonding agent between the mounting surface and the head IC through the through holes. The bonding agent is evenly distributed beneath the head IC, so that the head suspension is well balanced.

Abstract: A magnetic head device which can accommodate higher data transfer rates can be implemented by using lead wires. A magnetic head device 1 according to the present invention includes a head slider 3 having a magnetic head 2 having a data reading element and a data writing element, a reading lead RL for transferring data between the data reading element and external devices, the reading lead configured by a pair of lead wires which are twisted together, and a writing lead WL for transferring data between the data writing element and external devices, the writing lead configured by a pair of lead wires which are untwisted but arranged in parallel to each other. Thus, the magnetic head device can accommodate higher data transfer rates by using the writing lead WL configured by a pair of lead wires which are untwisted but arranged in parallel to each other.

Abstract: The present invention is a package for incorporating a micromotor into a head gimbal assembly. The head gimbal assembly includes a slider package and a micromotor package assembled on a load beam. The slider package and micromotor package include circuitry which allow a read/write signal to be conducted from the read/write head on the slider to the load beam. Solder joints form the electrical and mechanical connections between the load beam, the micromotor, and the slider.

Abstract: A disk drive system includes a base, a disk rotatably attached to the base, and an actuator assembly pivotally attached to the base. The actuator assembly moves the transducer to selected areas of the disk where information representative of data is to be written or read. The actuator assembly maintains the transducer in a transducing relationship with the disk. The actuator assembly includes an arm and a head gimbal assembly. The head gimbal assembly includes a suspension. The arm has a length from the point where it pivots to the end of the arm. The arm and suspension can be thought of as having a fixed length for a certain sized disk drive. The length of the arm is greater than 4.0 times the length of the suspension. The ratio of the length of the arm to the length of the suspension is in the range of 4.0 to 20.0. The arm is made of a material with a stiffness-to-mass ratio in the range of 6.0 to 20.0×106 m.

Abstract: A thin film magnetic head having a miniaturized slider, in which a wire connecting a head device with a bonding pad is free of a short circuit with an adjacent wire due to a ground layer for plating under a bump. A wire-insulating layer composed of an organic resin material and the like insulates the wires from each other and covers the upper layers thereof, and is provided with an opening so as to expose an end terminal. A manufacturing process is also disclosed.

Abstract: A suspension has a head slider loading prearranged portion on which a head slider integrally having a head is loaded, a head IC chip mounting prearranged portion on which a head IC chip is mounted, and wiring patterns which extend from the head slider loading prearranged portion. The head slider is loaded and supported on the head slider loading prearranged portion of the suspension. The head IC chip is mounted on the head IC chip mounting prearranged portion of the suspension. The head IC chip mounting prearranged portion includes through holes formed in the suspension and head IC chip mounting terminals on a surface of the suspension, which surface is opposite to a surface on which the head slider loading prearranged portion is provided, the terminals being electrically connected with the extending ends of said wiring patterns via the through holes, the terminals being provided in an arrangement corresponding to terminals of the head IC chip.

Abstract: Mechanically formed standoffs in a disk drive integrated circuit interconnect reduces the cost of manufacturing and improves the reliability of the electrical interconnections thereof. Connection pads defined along the interconnect are bonded with bonding pads of a signal producing source and a signal processing source. The standoffs provide mechanical stops during the bonding process, enabling sufficient bonding material to form between bonding areas. The standoffs are mechanically formed with a punch and die assembly either directly through a bonding pad predefined along traces on the interconnect or adjacent the bonding pad. The standoffs formed through the bonding pads are covered with solder or other electrically conductive bonding material.

Abstract: The efficiency of wire bundle conductors is realized in a disk drive suspension without wire bundle biasing of the slider movement by interposing a section of flexible conductive laminate conductor between the wire bundle terminus and the slider, thereby obtaining the nearly bias free connection of the flexible conductive laminate conductor to the slider and as well substantially the superior electrical performance of the wire bundle conductor.

Abstract: A disk drive having a connection structure between a head and a main flexible printed circuit sheet, allowing a signal to be supplied to and taken out of a head in response to size reduction and thickness reduction of the disk drive. The disk drive includes an actuator arm rotatably mounted in a housing, and a suspension having a base end portion fixed to a front end portion of the actuator arm and a front end portion for supporting the head. The main flexible printed circuit sheet is fixed at its one end portion to the actuator arm. An interconnection flexible printed circuit sheet is mounted along one side surface of the actuator arm so as to extend substantially parallel to the upper surface of the actuator arm, and connects terminals of the suspension and terminals of the main flexible printed circuit sheet.