With Terminal Patents (Class 361/540)
  • Patent number: 11315738
    Abstract: A tantalum capacitor includes: a tantalum body having a tantalum wire exposed from one surface of the tantalum body; a molded portion including first and second surfaces opposing in a thickness direction, third and fourth surfaces opposing in a width direction, and fifth and sixth surfaces opposing in a longitudinal direction, the molded portion surrounding the tantalum body; an anode lead frame including an anode connection member and an anode terminal, which are connected to the tantalum wire, exposed through the second surface of the molded portion; and a cathode lead frame spaced apart from the anode lead frame, and exposed through the second surface of the molded portion, wherein end portions of the tantalum wire, the anode connection member, and the anode terminal in the longitudinal direction are on a same plane.
    Type: Grant
    Filed: May 18, 2020
    Date of Patent: April 26, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hun Chol Jung, Wan Suk Yang, Yeong Su Cho
  • Patent number: 11227725
    Abstract: A solid electrolytic capacitor having high reliability while maintaining suitable electrical characteristics, and a method for producing the same. The solid electrolytic capacitor includes a plurality of capacitor elements, an exterior body covering the plurality of capacitor elements, a contact layer metallic bonded to an anode terminal portion that is an end portion of the anode body, an anode-side electrode layer provided so as to cover the contact layer, a cathode-side electrode layer electrically connected to the cathode body, an anode-side external electrode provided on the surface of the anode-side electrode layer, and a cathode-side external electrode provided on the surface of the cathode-side electrode layer.
    Type: Grant
    Filed: December 11, 2019
    Date of Patent: January 18, 2022
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takahiro Kumakawa, Renki Yamazaki, Shinya Suzuki
  • Patent number: 11211204
    Abstract: A solid electrolytic capacitor that includes a plurality of linear conductors arranged in parallel and made of a valve action metal in which a dielectric layer is formed on a surface of the valve action metal; a conductive polymer layer covering the plurality of linear conductors and shared by linear conductors; a conductor layer covering conductive polymer layer; an anode terminal in contact with end faces of the plurality of linear conductors; and a cathode terminal electrically connected to conductor layer.
    Type: Grant
    Filed: March 13, 2020
    Date of Patent: December 28, 2021
    Assignee: JAPAN CAPACITOR INDUSTRIAL CO., LTD.
    Inventors: Osamu Yokokura, Tomoki Nobuta, Kazutoyo Horio, Kazumasa Fujimoto
  • Patent number: 11145468
    Abstract: A solid electrolytic capacitor includes a capacitor element, an anode lead frame, a cathode lead frame, and an exterior member. The capacitor element includes an anode part and a cathode part. The cathode lead frame includes a cathode mount, a cathode connection part connected to the cathode mount, and a cathode terminal connected to the cathode connection part. The cathode lead frame bends in one direction at a first boundary between the cathode mount and the cathode connection part, and further bends in another direction at a second boundary between the cathode connection part and the cathode terminal. At least one of the cathode mount and the cathode terminal has a projection at an edge of the at least one of the cathode mount and the cathode terminal. The edge is at a side close to the cathode connection part. The projection projects in a first direction along which the anode part and the cathode part are aligned.
    Type: Grant
    Filed: November 14, 2019
    Date of Patent: October 12, 2021
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Yuichiro Yamada, Masahiro Sato, Yasuyuki Komatsu, Mikio Kobashi, Atsushi Nagatomi
  • Patent number: 11139122
    Abstract: A very high capacity capacitor or energy storage comprising a two-layer electrode structure with a separator and an electrolytic fluid, where the electrodes are parallel and connected to one of two terminals. The electrodes are connected to the terminal along a large length so that the connection to the terminal has a low resistance and so that charging may take place faster and with less heat generation.
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: October 5, 2021
    Assignee: MacroCaps ApS
    Inventor: Rayk-Peter Schaufl
  • Patent number: 11031188
    Abstract: A solid electrolytic capacitor includes a capacitor element, an anode frame, a cathode frame, and an exterior body. The capacitor element includes an anode body, a dielectric body disposed on a surface of the anode body, and a cathode part. The anode frame is electrically connected to the anode body. The cathode frame is electrically connected to the cathode part. The exterior body seals the capacitor element in a state that a part of the anode frame and a part of the cathode frame are exposed from the exterior body. At least one of the anode frame and the cathode frame has at least one groove on a surface adhered to the exterior body. The at least one groove intersects with an extending direction in which the anode frame or the cathode frame extends from the capacitor element to outside of the exterior body.
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: June 8, 2021
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Masahiro Ueda, Kenji Taki
  • Patent number: 10629383
    Abstract: A solid electrolytic capacitor that includes a capacitor element having a linear through conductor made of a valve function metal, a dielectric layer disposed on the through conductor, and a cathode-side functional layer disposed on the dielectric layer. The through conductor includes a core portion and a porous portion covering a peripheral surface of the core portion. Both end faces of the core portion of the through conductor are in contact with a pair of anode terminals on the pair of end faces of the body, respectively. A cathode terminal is electrically connected to the cathode-side functional layer.
    Type: Grant
    Filed: March 29, 2017
    Date of Patent: April 21, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Tomoki Nobuta, Kazumasa Fujimoto, Osamu Yokokura
  • Patent number: 10529496
    Abstract: An electronic component includes: a capacitor array including a plurality of multilayer capacitors which are sequentially arranged in a first direction, and first and second metal frames disposed on both side surfaces of the capacitor array and connected to first and second external electrodes of the plurality of multilayer capacitors, respectively; the first and second metal frames include first and second support portions, and first and second mounting portions, respectively; and the first and second mounting portions include first and second portions opposing each other toward the center of the capacitor array, and third and fourth portions positioned outside the first and second portions, respectively, and a length of each of the first and second portions is shorter than a length of each of the third and fourth portions.
    Type: Grant
    Filed: October 24, 2018
    Date of Patent: January 7, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Beom Joon Cho, Sang Soo Park, Ki Young Kim, Woo Chul Shin
  • Patent number: 10515761
    Abstract: An electronic component includes: a capacitor array including a plurality of multilayer capacitors which are sequentially arranged in a first direction, and first and second metal frames disposed on both side surfaces of the capacitor array and connected to first and second external electrodes of the plurality of multilayer capacitors, respectively; the first and second metal frames include first and second support portions, and first and second mounting portions, respectively; and the m first and second mounting portions include first and second portions opposing each other toward the center of the capacitor array, and third and fourth portions positioned outside the first and second portions, respectively, and a length of each of the first and second portions is shorter than a length of each of the third and fourth portions.
    Type: Grant
    Filed: January 29, 2019
    Date of Patent: December 24, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Beom Joon Cho, Sang Soo Park, Ki Young Kim, Woo Chul Shin
  • Patent number: 9936589
    Abstract: An electrical device for soldering to a circuit board with a solder includes a capacitor, a lead frame including a solder dam, and a solder joint electrically coupling the capacitor to the lead frame. The solder dam includes one of a physical barrier to flow or an area of reduced wettability to the solder. The solder dam is between the solder joint and the circuit board. The solder dam is on one or both of a lead portion and main portion of the lead frame. In one embodiment, the first solder dam extends substantially the full width of the first lead portion. The solder dam may be a barrier and/or include a metal oxide. A method of manufacturing the device includes soldering a lead frame to a capacitor with a solder and modifying a surface on the lead frame to include a physical barrier and/or an area of reduced wettability.
    Type: Grant
    Filed: February 29, 2016
    Date of Patent: April 3, 2018
    Assignee: Presidio Components, Inc.
    Inventor: Hung Van Trinh
  • Patent number: 9776281
    Abstract: A capacitor containing a solid electrolytic capacitor element including a sintered porous anode body and a relatively large diameter anode lead wire is provided. The lead wire is electrically connected to the anode body for connection to an anode termination. Further, the lead wire has a diameter that is at least about 10% of the height of the porous anode body to improve the points of contact between the anode body and wire to reduce ESR. A portion of the lead wire extends from a surface of the anode body in a longitudinal direction. At least one notch can be formed in the portion of the lead wire that extends from the anode body. The notch can be formed via a laser or by cutting, punching, or sawing and can serve as the point of electrical connection between the anode termination and the lead wire.
    Type: Grant
    Filed: May 30, 2012
    Date of Patent: October 3, 2017
    Assignee: AVX Corporation
    Inventors: Lotfi Djebara, Stanislav Zednicek, Jiri Snitil, Jiri Navratil, Ludek Kubes
  • Patent number: 9711294
    Abstract: There are provided a tantalum capacitor having groove parts extended from a lower surface of a positive electrode terminal to an inner part of a wire connection part; and a method of manufacturing a tantalum capacitor, the method including: forming a wire connection part of a positive electrode terminal by applying pressure to a portion of a conductive metal plate upwardly from a bottom surface thereof.
    Type: Grant
    Filed: March 26, 2015
    Date of Patent: July 18, 2017
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hong Kyu Shin, Wan Suk Yang, Kyung Sup Choi
  • Patent number: 9576740
    Abstract: A tantalum capacitor may include two tantalum wires exposed through two surfaces of a capacitor body opposing each other, first and second positive electrode terminals, connected to the tantalum wires, respectively, and disposed on two surfaces of a molded part opposing each other, and a negative electrode terminal disposed between the first and second positive electrode terminals. The negative electrode terminal may be electrically connected to the capacitor body by a via electrode or a pad electrode disposed between the negative electrode terminal and the capacitor body.
    Type: Grant
    Filed: October 7, 2014
    Date of Patent: February 21, 2017
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hong Kyu Shin, Jae Bum Cho, Jae Hyuk Choi, Wan Suk Yang, Hyoung Sun Ham, Hyun Sub Oh
  • Patent number: 9490076
    Abstract: A solid electrolytic capacitor that includes: a laminated body having a plurality of capacitor elements stacked to have principal surfaces thereof overlapped with each other. The capacitor elements each include a valve-action metallic substrate having two principal surfaces opposed to each other, a dielectric oxide film covering a surface of the valve-action metallic substrate, and a cathode layer covering a surface of the dielectric oxide film. The laminated body has two principal surfaces and more than one side surface, and has at least one of the side surfaces with the valve-action metallic substrates exposed. An anode terminal is electrically connected to the side surface of the laminated body having the valve-action metallic substrates exposed therefrom, and the cathode layers and the anode terminal are insulated with insulators interposed therebetween, the insulators being obtained from the cathode layers.
    Type: Grant
    Filed: June 4, 2014
    Date of Patent: November 8, 2016
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Shinji Otani, Koji Fujimoto, Yoshihiro Koshido
  • Patent number: 9431179
    Abstract: A method of manufacturing a solid electrolytic capacitor chip, which includes mounting a solid electrolytic capacitor element on the front surface side of a cathode lead of a lead frame serving as a cathode terminal; electrically connecting an anode and a cathode of the solid electrolytic capacitor element respectively to an anode terminal and the cathode terminal of the lead frame; and injecting an exterior resin from a resin injection port of a mold by transfer molding so as to seal the solid electrolytic capacitor element with the exterior resin. The resin injection port is located such that the exterior resin injected from the injection port branches and flows toward both the front surface side and the rear surface side and of the lead frame.
    Type: Grant
    Filed: July 30, 2013
    Date of Patent: August 30, 2016
    Assignee: SHOWA DENKO K.K.
    Inventors: Kazumi Naito, Katsutoshi Tamura, Masahiro Suzuki
  • Patent number: 9336956
    Abstract: A tantalum capacitor includes a capacitor body containing tantalum powder and having a tantalum wire extending downwardly; a molded part enclosing the capacitor body and exposing an end portion of the tantalum wire; a positive electrode lead frame disposed on a lower surface of the molded part and connected to the end portion of the tantalum wire; a negative electrode lead frame disposed on the lower surface of the molded part; and a conductive adhesive layer disposed between the capacitor body and the negative electrode lead frame.
    Type: Grant
    Filed: March 14, 2014
    Date of Patent: May 10, 2016
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Bum Cho, Kyoung Sup Choi, Hong Kyu Shin, Jeong Oh Hong, Wan Suk Yang, Hyun Sub Oh
  • Patent number: 9330852
    Abstract: There is provided a tantalum capacitor including: a capacitor body containing tantalum powder and having a tantalum wire exposed to one end thereof; a positive electrode lead frame including a positive electrode terminal part and a positive electrode connection part formed by upwardly bending a portion of the positive electrode terminal part from the outside toward the inside and connected to the tantalum wire; a negative electrode lead frame having the capacitor body mounted thereon; and a molded part formed to enclose the capacitor body while exposing a lower surface of the positive electrode terminal part of the positive electrode lead frame and a lower surface of the negative electrode lead frame.
    Type: Grant
    Filed: January 30, 2014
    Date of Patent: May 3, 2016
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Ho Kwak, Hun Chol Jung, Jeong Oh Hong, Sung Soo Cha, Hee Dong Myung, Hee Sung Choi
  • Patent number: 9312314
    Abstract: The invention relates to a light apparatus (1) for generating light. The light apparatus includes a light emission structure (2) including light emission material (9), a capacitor structure (3) including at least two capacitor electrode films (11, 12) and a dielectric film (14) between the capacitor electrode films, and a film encapsulation (30) including at least one film for encapsulating and thereby protecting at least the light emission material. The capacitor structure is integrated in the light apparatus such that the capacitor electrode films and the dielectric film are at least partly arranged in parallel to the light emission structure. Since films, in particular, thin films, are used for the capacitor structure and the encapsulation and since the capacitor structure is integrated in the light apparatus, the light apparatus can be relatively thin.
    Type: Grant
    Filed: January 18, 2013
    Date of Patent: April 12, 2016
    Assignee: Koninklijke Philips N.V.
    Inventors: Dirk Hente, Holger Spahr, Sami Hamwi, Alexander Rohr, Wolfgang Kowalsky, Torsten Rabe
  • Patent number: 9263193
    Abstract: A solid electrolytic capacitor includes: a porous sintered body; an anode wire extending in a first direction and connected to the porous sintered body such that one end portion of the anode wire in the first direction is exposed; a resin package covering the porous sintered body and the anode wire; and a lead including a terminal exposed from the resin package and a lead side connector connected to the terminal. The anode wire includes a base and a connector placed at one side of the base in the first direction, a sectional area of the connector is smaller than that of the base, and the connector and the lead side connector are welded together.
    Type: Grant
    Filed: October 24, 2014
    Date of Patent: February 16, 2016
    Assignee: Rohm Co., Ltd.
    Inventors: Takafumi Yamanaka, Naotsugu Sugimura
  • Patent number: 9007743
    Abstract: Provided is a solid electrolytic capacitor that is excellent in productivity, has improved volumetric efficiency aiming for capacity increase, a stable fillet shape when mounted, and has excellent ESL characteristics. Included is a capacitor stack element composed of a stack of capacitor elements. The capacitor element includes one anode part of an anode body made of linear, foil-like, or plate-like valve metal and a cathode part composed of dielectric, solid electrolyte, graphite, and silver paste layers, which are sequentially formed to another surface of the anode body separated by insulating resin. A fillet formation part with a recessed part is provided to an end surface of anode and cathode terminals of a mounting electrode side of a first direction end surface of the electrode substrate to which the capacitor stack element is mounted. Further, the anode and cathode terminals for element connection reach the end surface of the first direction.
    Type: Grant
    Filed: April 13, 2012
    Date of Patent: April 14, 2015
    Assignee: Nec Tokin Corporation
    Inventors: Akihiro Kawai, Kenji Araki
  • Patent number: 8982536
    Abstract: A capacitor with improved ESR and improved volumetric efficiency. The capacitor has an anode body wherein the anode body comprises a face and an inward offset which is inset from the face by a distance. An anode wire extends from a front side of the anode body wherein the front side is adjacent the face. A dielectric is on the anode body and a conductive cathode layer is on the dielectric. A cathode lead is in the inward offset and in electrical contact with the conductive cathode layer wherein the conductive cathode layer is between the cathode lead and the inward offset.
    Type: Grant
    Filed: October 12, 2012
    Date of Patent: March 17, 2015
    Assignee: Kemet Electronics Corporation
    Inventors: Joao Candeias, John T Kinard
  • Patent number: 8922976
    Abstract: A decoupling device including a lead frame, multiple capacitor units, a protective layer and a packaging element is provided. The lead frame includes a cathode terminal portion and at least two opposite anode terminal portions disposed at two ends of the cathode terminal portion. The two anode terminal portions are electrically connected with each other through a conductive line. The capacitor units are connected in parallel and disposed on the lead frame. Each capacitor unit has a cathode portion and an opposite anode portion. The cathode portion is electrically connected with the cathode terminal portion. The anode portion is electrically connected with the anode terminal portion. The protective layer wraps at least one of the anode portion and the cathode portion of the capacitor unit. The packaging element covers the lead frame, the capacitor units and the protective layer. The packaging element exposes a bottom surface of the lead frame.
    Type: Grant
    Filed: January 15, 2012
    Date of Patent: December 30, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Yi-Hsiu Pan, Yu-Ting Cheng, Li-Duan Tsai, Chi-Lun Chen, Cheng-Liang Cheng
  • Patent number: 8896986
    Abstract: A solid electrolytic capacitor with an anode and a dielectric on the anode. A cathode is on the dielectric and a conductive coating on the dielectric. A cathode lead is electrically connected to the conductive coating by an adhesive selected from the group consisting of a transient liquid phase sinterable material and polymer solder.
    Type: Grant
    Filed: May 24, 2011
    Date of Patent: November 25, 2014
    Assignee: Kemet Electronics Corporation
    Inventors: Antony P. Chacko, John E. McConnell, Philip M. Lessner, Randolph S. Hahn, John Bultitude
  • Patent number: 8896984
    Abstract: A solid electrolytic capacitor includes a capacitor element including a cathode portion and an anode portion, a cathode terminal bonded to the cathode portion, an anode terminal bonded to the anode portion, and an enclosure resin covering the capacitor element. The cathode terminal includes a cathode lower surface portion, a cathode connection portion, and a cathode support portion. The cathode connection portion is connected to an end portion of the cathode lower surface portion on an anode side and bonded to the cathode portion through a conductive adhesive. The cathode support portion is connected to a side portion of the cathode lower surface and brought into contact with a lower surface of the cathode portion on an end portion side of the cathode portion without involving the conductive adhesive therebetween.
    Type: Grant
    Filed: February 8, 2013
    Date of Patent: November 25, 2014
    Assignee: Panasonic Corporation
    Inventors: Kazuo Kawahito, Takashi Iwakiri
  • Patent number: 8885326
    Abstract: A solid electrolytic capacitor includes: a porous sintered body; an anode wire extending in a first direction and connected to the porous sintered body such that one end portion of the anode wire in the first direction is exposed; a resin package covering the porous sintered body and the anode wire; and a lead including a terminal exposed from the resin package and a lead side connector connected to the terminal. The anode wire includes a base and a connector placed at one side of the base in the first direction, a sectional area of the connector is smaller than that of the base, and the connector and the lead side connector are welded together.
    Type: Grant
    Filed: April 25, 2012
    Date of Patent: November 11, 2014
    Assignee: Rohm Co., Ltd.
    Inventors: Takafumi Yamanaka, Naotsugu Sugimura
  • Patent number: 8848343
    Abstract: An improved capacitor is described. The capacitor has an anode with an anode lead wire extending from a first face of the anode. A dielectric layer is on the anode and a cathode is on the dielectric. An anode lead with an anode base and a cavernous anode protrusion extending from the base is provided wherein the anode lead wire is in electrical contact with the anode protrusion. A cathode lead with a cathode base is provided wherein the cathode base is in electrical contact with the cathode on a side face wherein the side face is adjacent the first face and the cathode base and said anode base are coplanar.
    Type: Grant
    Filed: October 12, 2012
    Date of Patent: September 30, 2014
    Assignee: Kemet Electronics Corporation
    Inventors: David Jacobs, Sheng Jie Xu, Shao Jian Chen, Xiao Juan Ye, Keith Lee Moore
  • Patent number: 8842419
    Abstract: A capacitor containing a solid electrolytic capacitor element including a sintered porous anode body and a relatively large width and/or thickness anode lead tape is provided. The tape is electrically connected to the anode body for connection to an anode termination. Further, the tape has a width that is at least about 20% of the width of the anode body to improve the points of contact between the anode body and tape to reduce ESR. A portion of the tape extends from a surface of the anode body in a longitudinal direction. At least one notch can be formed in the portion of the tape that extends from the anode body. The notch can be formed via a laser or by cutting, punching, or sawing and can serve as the point of electrical connection between the anode termination and the lead tape.
    Type: Grant
    Filed: May 30, 2012
    Date of Patent: September 23, 2014
    Assignee: AVX Corporation
    Inventors: Lotfi Djebara, Pavel Bosak, Ludek Kubes
  • Publication number: 20140211376
    Abstract: A solid capacitor includes a body, a strip-shaped positive connection terminal and a strip-shaped negative connection terminal extending from the body comprising. Length directions of the positive connection terminal and the negative connection terminal are substantially parallel with each other while width directions of the positive connection terminal and the negative connection terminal are substantially perpendicular to each other.
    Type: Application
    Filed: May 31, 2013
    Publication date: July 31, 2014
    Inventors: JYUN-DA LIAO, CHUN-YUAN TIEN, CHIA-MING YEH, YUN-WEN SU
  • Patent number: 8780532
    Abstract: There is provided a solid electrolytic capacitor, including: a condenser element including a chip body molded by sintering, a positive electrode terminal contact layer formed on one area of the chip body to be exposed to the outside, an insulating layer formed in the entire area or some area other than one area in which the positive electrode terminal contact layer is formed, and a negative electrode layer stacked on the insulating layer; a negative electrode extracting layer stacked to be electrically connected with the negative electrode layer; a negative electrode terminal stacked on the negative electrode extracting layer; a positive electrode terminal stacked on the positive electrode terminal contact layer.
    Type: Grant
    Filed: February 24, 2011
    Date of Patent: July 15, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Kwang Kim, Jun Suk Jung, Chang Sub Song
  • Patent number: 8773844
    Abstract: A decoupling device including a lead frame and at least one capacitor unit assembly is provided. The lead frame includes a cathode terminal portion and at least two opposite anode terminal portions located at two ends of the cathode terminal portion. The two anode terminal portions are electrically connected with each other through a conductive line. The capacitor unit assembly includes multiple capacitor elements. The multiple capacitor elements of the capacitor unit assembly is connected in parallel, arrayed on the same plane and disposed on the lead frame. Each capacitor element has a cathode portion and an anode portion opposite to each other. The cathode portion of the capacitor element is electrically connected with the cathode terminal portion. The anode portion of the capacitor element is electrically connected with the anode terminal portion. When multiple capacitor unit assemblies exists, the capacitor unit assemblies are arrayed in a stacked way.
    Type: Grant
    Filed: March 21, 2011
    Date of Patent: July 8, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Cheng-Liang Cheng, Yi-Hsiu Pan, Yu-Ting Cheng, Li-Duan Tsai
  • Patent number: 8749955
    Abstract: A capacitor comprising a capacitor element including a substrate having first and second faces, a porous first rough surface layer formed on the first face and having pores, a first inner conductive polymer layer formed in the pores, a first outer conductive polymer layer formed on the inner conductive polymer layer, a porous second rough surface layer formed on the second face and having pores, a second inner conductive polymer layer formed in the pores, a second outer conductive polymer layer formed on the second inner conductive polymer layer, and a dielectric layer formed on surfaces of the first and the second rough surface layer. A surface area of the second rough surface layer is smaller than that of the first rough surface layer. The second outer conductive polymer layer is thicker than the first outer conductive polymer layer. This structure enables to eliminate warpage of a capacitor element.
    Type: Grant
    Filed: November 20, 2012
    Date of Patent: June 10, 2014
    Assignee: Panasonic Corporation
    Inventors: Mitsuru Iwai, Hiroki Kamiguchi, Akiyoshi Oshima, Yuta Moriura
  • Publication number: 20140133068
    Abstract: A capacitor comprising a capacitor element including a substrate having first and second faces, a porous first rough surface layer formed on the first face and having pores, a first inner conductive polymer layer formed in the pores, a first outer conductive polymer layer formed on the inner conductive polymer layer, a porous second rough surface layer formed on the second face and having pores, a second inner conductive polymer layer formed in the pores, a second outer conductive polymer layer formed on the second inner conductive polymer layer, and a dielectric layer formed on surfaces of the first and the second rough surface layer. A surface area of the second rough surface layer is smaller than that of the first rough surface layer. The second outer conductive polymer layer is thicker than the first outer conductive polymer layer. This structure enables to eliminate warpage of a capacitor element.
    Type: Application
    Filed: November 20, 2012
    Publication date: May 15, 2014
    Inventors: Mitsuru Iwai, Hiroki Kamiguchi, Akiyoshi Oshima, Yuta Moriura
  • Patent number: 8693167
    Abstract: An electronic component includes a lead wire, a functional element, and an outer housing. The lead wire includes a leader electrode made of metal containing aluminum, a metal wire containing tin, and a welded section formed by welding a first end of the metal wire to a first end of the leader electrode. A second end of the leader electrode is connected to the functional element. The outer housing seals the functional element therein such that a second end of the metal wire is led out therefrom. The lead wire further includes a resin film coating the welded section at least at a portion not covered with the outer housing. Resin material for the resin film has pierce strength of 0.05 MPa/?m per unit thickness or greater and an elastic coefficient of 10 GPa or less.
    Type: Grant
    Filed: August 23, 2011
    Date of Patent: April 8, 2014
    Assignee: Panasonic Corporation
    Inventors: Yasuhiro Yano, Douyuu Hachisu, Junji Yamane
  • Publication number: 20140078647
    Abstract: A stacked-type solid electrolytic capacitor package structure includes a capacitor unit, a package unit and a conductive unit. The conductive unit includes a plurality of stacked-type capacitors stacked on top of one another and electrically connected with each other, and each stacked-type capacitor has a positive portion and a negative portion. The package unit includes a package body for enclosing the capacitor unit. The conductive unit includes a first conductive terminal and a second conductive terminal. The first conductive terminal has a first embedded portion electrically connected to the positive portion and enclosed by the package body and a first lateral exposed portion connected to the first embedded portion. The second conductive terminal has a second lateral exposed portion, a second front exposed portion, a second rear exposed portion, and a second embedded portion electrically connected to the negative portion and enclosed by the package body.
    Type: Application
    Filed: September 14, 2012
    Publication date: March 20, 2014
    Applicant: APAQ TECHNOLOGY CO., LTD.
    Inventors: Chi-Hao CHIU, Kun-Huang CHANG, Chun-Hung LIN
  • Publication number: 20140071591
    Abstract: A decoupling device including a lead frame and at least one capacitor unit set is provided. The lead frame includes a cathode terminal portion and at least two anode terminal portions disposed at two sides of the cathode terminal portion and opposite to each other. The anode terminal portions are electrically connected through a conductive line. One of the anode terminal portions extends along a first direction to form an extending portion, and the extending portion is bended along a second direction perpendicular to the first direction to form an anode side plate. Each capacitor unit set includes a plurality of capacitor units. The capacitor unit sets are connected in parallel on a same plane and disposed on the lead frame. Each capacitor unit has a cathode portion electrically connected to the cathode terminal portion and an anode portion electrically connected to the anode side plate along the first direction.
    Type: Application
    Filed: January 16, 2013
    Publication date: March 13, 2014
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventor: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
  • Patent number: 8659877
    Abstract: A solid electrolytic capacitor includes a capacitor element, an anode terminal, and a cathode terminal. The capacitor element includes an anode body, an anode member buried in the anode body, a dielectric layer formed on part of a surface of the anode body, an electrolyte layer formed on the dielectric layer, and a cathode layer formed on the electrolyte layer. The anode member extends in a predetermined direction along a lower surface of the anode body, and has a lower end portion exposed at the lower surface of the anode body. The anode terminal is electrically connected to the lower end portion. The cathode terminal is electrically connected to the cathode layer at a position below the lower surface of the anode body. The anode and cathode terminals are spaced apart from each other in a direction substantially perpendicular to a direction in which the anode member extends.
    Type: Grant
    Filed: December 5, 2011
    Date of Patent: February 25, 2014
    Assignee: SANYO Electric Co., Ltd.
    Inventor: Kazuyoshi Murata
  • Patent number: 8652920
    Abstract: A process for forming a laminate with capacitance and the laminate formed thereby. The process includes the steps of providing a substrate and laminating a conductive foil on the substrate wherein the foil has a dielectric. A conductive layer is formed on the dielectric. The conductive foil is treated to electrically isolate a region of conductive foil containing the conductive layer from additional conductive foil. A cathodic conductive couple is made between the conductive layer and a cathode trace and an anodic conductive couple is made between the conductive foil and an anode trace.
    Type: Grant
    Filed: March 1, 2012
    Date of Patent: February 18, 2014
    Assignee: Kamet Electronics Corporation
    Inventors: John D. Prymak, Chris Stolarski, Alethla Melody, Antony P. Chacko, Gregory J. Dunn
  • Patent number: 8619409
    Abstract: An electrochemical device, e.g., an electric double layer capacitor, is applicable to high-temperature reflow soldering wherein a lead-free solder is used, and is provided with an electric storage element, a package having the electric storage element sealed therein, and a positive electrode terminal and a negative electrode terminal, each of which is led out from the electric storage element and is provided with a part sealed in the package with the electric storage element and other part led out to the outside the package. On a part of the positive electrode terminal and on a part of the negative electrode terminal, increased thermal resistance sections for suppressing heat transfer to the electric storage element via the terminals from other parts of the positive electrode terminal and other parts of the negative electrode terminal are arranged, respectively.
    Type: Grant
    Filed: September 30, 2009
    Date of Patent: December 31, 2013
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Kazushi Yawata, Naoto Hagiwara, Katsuei Ishida
  • Patent number: 8614880
    Abstract: A solid electrolytic capacitor in which a capacitor element having a positive electrode lead wire protruded from a front face of the capacitor element and a positive electrode lead terminal connected to the positive electrode lead wire is sealed with an exterior sealing element of synthetic resin except for a part of the positive electrode lead terminal. The positive electrode lead terminal is provided with a positive electrode base frame arranged along a lower surface of the exterior sealing element so as to correspond to the positive electrode lead wire, a raised connecting piece arranged to extend upward from an edge of the positive electrode base frame along a front end face and having an upper edge to which the positive electrode lead wire is connected, and reinforcing pieces provided at both side edges of the raised connecting piece.
    Type: Grant
    Filed: December 28, 2009
    Date of Patent: December 24, 2013
    Assignee: Showa Denko K.K.
    Inventors: Kazumi Naito, Katutoshi Tamura
  • Patent number: 8582278
    Abstract: A capacitor containing a solid electrolytic capacitor element that includes an anode, dielectric, and a cathode that includes a solid electrolyte is provided. An anode lead extends from the anode and is electrically connected to an anode termination. Likewise, a cathode termination is electrically connected to the cathode. The cathode termination contains an upstanding portion that is oriented generally perpendicular to the lower surface of the capacitor element, and first and second planar portions that are oriented generally parallel to the lower surface of the capacitor. The first and second planar portions are interconnected by a folded region so that the first portion is positioned vertically above the second portion. Thus, after encapsulating the capacitor element with a molding material, the second planar portion remains exposed for subsequent connection to an electrical component.
    Type: Grant
    Filed: March 11, 2011
    Date of Patent: November 12, 2013
    Assignee: AVX Corporation
    Inventor: Stanislav Zednicek
  • Patent number: 8576544
    Abstract: A capacitor assembly that includes a conductive polymer electrolytic capacitor that is enclosed and hermetically sealed within a ceramic housing in the presence of an inert gas is provided. Without intending to be limited by theory, the present inventors believe that the ceramic housing is capable of limiting the amount of oxygen and moisture supplied to the conductive polymer of the capacitor. In this manner, the conductive polymer is less likely to oxidize in high temperature environments, thus increasing the thermal stability of the capacitor assembly.
    Type: Grant
    Filed: January 9, 2012
    Date of Patent: November 5, 2013
    Assignee: AVX Corporation
    Inventors: Bharat Rawal, Gang Ning, Brady Jones, Zebbie Lynn Sebald, Stanislav Zednicek, Zdenek Sita
  • Patent number: 8570712
    Abstract: A solid electrolytic capacitor includes a capacitor element, an outer package member covering the capacitor element, an anode terminal, and a cathode terminal. The capacitor element includes an anode body, an anode member buried in the anode body, a dielectric layer formed on part of a surface of the anode body, an electrolyte layer formed on the dielectric layer, and a cathode layer formed on the electrolyte layer. The anode member has a lower end portion exposed at a lower surface of the anode body. The anode terminal is electrically connected to the lower end portion, and has a surface partially exposed at a lower surface of the outer package member. The cathode terminal is electrically connected to the cathode layer at a position below the lower surface of the anode body, and has a surface partially exposed at the lower surface of the outer package member.
    Type: Grant
    Filed: December 5, 2011
    Date of Patent: October 29, 2013
    Assignee: SANYO Electric Co., Ltd.
    Inventor: Kazuyoshi Murata
  • Patent number: 8559166
    Abstract: A solid electrolytic capacitor includes a capacitor element, an anode lead frame, a cathode lead frame, and a mold resin portion. The anode lead frame includes an anode terminal portion and a rising portion, and the anode terminal portion is exposed at the bottom surface of the mold resin portion. The rising portion is formed integral with the anode terminal portion, and rises to the anode portion. In the rising portion, a through hole is formed. The cathode lead frame includes a cathode terminal portion, a pair of side surface portions and a step portion. Thus, a solid electrolytic capacitor allowing highly accurate and reliable attachment of the capacitor element to the lead frame without using any additional member is provided.
    Type: Grant
    Filed: June 21, 2011
    Date of Patent: October 15, 2013
    Assignee: SANYO Electric Co., Ltd.
    Inventors: Keiko Matsuoka, Shoji Umeda, Yoshiyuki Fushimi, Koji Tezuka
  • Patent number: 8514550
    Abstract: A capacitor containing a solid electrolytic capacitor element that includes an anode, dielectric, and a cathode that includes a solid electrolyte is provided. An anode lead extends from the anode and is electrically connected to an anode termination. Likewise, a cathode termination is electrically connected to the cathode. The cathode termination contains a planar portion that is oriented generally parallel to a lower surface of the capacitor element. An interior slot is defined by the planar portion within which is disposed a conductive adhesive that connects the cathode termination to the capacitor element. By disposing the adhesive within a slot of a planar portion of the cathode termination, the present inventors have discovered that the tendency of the adhesive to bleed toward the edges of the termination can be limited. Among other things, this improves the mechanical stability of the capacitor upon encapsulation and also improves electrical performance.
    Type: Grant
    Filed: March 11, 2011
    Date of Patent: August 20, 2013
    Assignee: AVX Corporation
    Inventor: Ales Vyroubal
  • Patent number: 8470680
    Abstract: A process for forming a laminate with capacitance and the laminate formed thereby. The process includes the steps of providing a substrate and laminating a conductive foil on the substrate wherein the foil has a dielectric. A conductive layer is formed on the dielectric. The conductive foil is treated to electrically isolate a region of conductive foil containing the conductive layer from additional conductive foil. A cathodic conductive couple is made between the conductive layer and a cathode trace and an anodic conductive couple is made between the conductive foil and an anode trace.
    Type: Grant
    Filed: July 28, 2008
    Date of Patent: June 25, 2013
    Assignees: Kemet Electronics Corporation, Motorola, Inc.
    Inventors: John D. Prymak, Chris Stolarski, Alethia Melody, Antony P. Chacko, Gregory J. Dunn
  • Patent number: 8456804
    Abstract: A solid electrolytic capacitor including a capacitor element having an anode member and a cathode member, an anode terminal electrically connected with the anode member, a cathode terminal electrically connected with the cathode member, and a mold resin portion covering the capacitor element; wherein the cathode terminal has an upper step portion, a lower step portion, and a side portion, the upper step portion is connected with the cathode member, the lower step portion is exposed out of the mold resin portion, the side portion is extended along with a side surface of the cathode member from the upper step portion and is connected with the side surface, and the side portion is longer than the upper step portion, in a direction in which the cathode terminal and the anode terminal are aligned.
    Type: Grant
    Filed: May 26, 2011
    Date of Patent: June 4, 2013
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Keiko Matsuoka, Shoji Umeda
  • Patent number: 8446708
    Abstract: A solid electrolytic capacitor includes a capacitor element having two opposite cathode surfaces, a cathode terminal metal plate having a first cathode connecting portion electrically connected to one of the two opposite cathode surfaces, and an auxiliary cathode metal plate having a second cathode connecting portion electrically connected to the other one of the two opposite cathode surfaces of the capacitor element. The cathode terminal metal plate includes a groove electrically connected to the first cathode connecting portion. The auxiliary cathode metal plate includes an end portion that is electrically connected to the second cathode connecting portion and engages with the groove. The cathode terminal metal plate further includes an outer terminal portion.
    Type: Grant
    Filed: June 2, 2011
    Date of Patent: May 21, 2013
    Assignee: Fujitsu Limited
    Inventors: Tomokazu Nakashima, Masayuki Itoh
  • Patent number: 8416558
    Abstract: A solid electrolytic capacitor according to the present invention comprises a capacitor element including an anode lead-out part and a cathode lead-out part, an anode lead frame connected to the anode lead-out part via a conductive member, and a cathode lead frame connected to the cathode lead-out part, and the anode lead frame is connected to the anode lead-out part via an anode side assistance frame in addition to said conductive member.
    Type: Grant
    Filed: March 16, 2009
    Date of Patent: April 9, 2013
    Assignee: SANYO Electric Co., Ltd.
    Inventor: Akinari Kurokawa
  • Patent number: 8410536
    Abstract: A process for forming a laminate with capacitance and the laminate formed thereby. The process includes the steps of providing a substrate and laminating a conductive foil on the substrate wherein the foil has a dielectric. A conductive layer is formed on the dielectric. The conductive foil is treated to electrically isolate a region of conductive foil containing the conductive layer from additional conductive foil. A cathodic conductive couple is made between the conductive layer and a cathode trace and an anodic conductive couple is made between the conductive foil and an anode trace.
    Type: Grant
    Filed: January 6, 2012
    Date of Patent: April 2, 2013
    Assignee: Kemet Electronics Corporation
    Inventors: John D. Prymak, Chris Stolarski, Alethia Melody, Antony P. Chacko, Gregory J. Dunn
  • Patent number: 8411417
    Abstract: A solid electrolytic condenser includes a condenser element, an anode wire including one end inserted into the condenser element, a cathode drawing layer formed on outer side of the condenser element, terminal reinforcements arranged respectively under opposite side portions of a bottom surface of the condenser element, a liquid epoxy resin filled in spaces between the terminal reinforcements and between the bottom surface of the condenser element and top surfaces of the terminal reinforcements, a molding part surrounding the condenser element while exposing the other end of the anode wire, an end portion of the cathode drawing layer, and bottom surfaces of the terminal reinforcements, and anode and cathode terminals formed by a plating layer provided on the bottom surfaces of the terminal reinforcements and on opposite side surfaces of the molding part. The liquid epoxy resin includes fillers of a smaller size than those in the molding part.
    Type: Grant
    Filed: April 16, 2010
    Date of Patent: April 2, 2013
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Kwang Kim, Kwan Hyeong Kim, Jun Suk Jung, Jae Yik Howang, Chong Hoon Pak, Jae Jun Park