With Terminal Patents (Class 361/540)
  • Patent number: 8416558
    Abstract: A solid electrolytic capacitor according to the present invention comprises a capacitor element including an anode lead-out part and a cathode lead-out part, an anode lead frame connected to the anode lead-out part via a conductive member, and a cathode lead frame connected to the cathode lead-out part, and the anode lead frame is connected to the anode lead-out part via an anode side assistance frame in addition to said conductive member.
    Type: Grant
    Filed: March 16, 2009
    Date of Patent: April 9, 2013
    Assignee: SANYO Electric Co., Ltd.
    Inventor: Akinari Kurokawa
  • Patent number: 8411417
    Abstract: A solid electrolytic condenser includes a condenser element, an anode wire including one end inserted into the condenser element, a cathode drawing layer formed on outer side of the condenser element, terminal reinforcements arranged respectively under opposite side portions of a bottom surface of the condenser element, a liquid epoxy resin filled in spaces between the terminal reinforcements and between the bottom surface of the condenser element and top surfaces of the terminal reinforcements, a molding part surrounding the condenser element while exposing the other end of the anode wire, an end portion of the cathode drawing layer, and bottom surfaces of the terminal reinforcements, and anode and cathode terminals formed by a plating layer provided on the bottom surfaces of the terminal reinforcements and on opposite side surfaces of the molding part. The liquid epoxy resin includes fillers of a smaller size than those in the molding part.
    Type: Grant
    Filed: April 16, 2010
    Date of Patent: April 2, 2013
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Kwang Kim, Kwan Hyeong Kim, Jun Suk Jung, Jae Yik Howang, Chong Hoon Pak, Jae Jun Park
  • Patent number: 8410536
    Abstract: A process for forming a laminate with capacitance and the laminate formed thereby. The process includes the steps of providing a substrate and laminating a conductive foil on the substrate wherein the foil has a dielectric. A conductive layer is formed on the dielectric. The conductive foil is treated to electrically isolate a region of conductive foil containing the conductive layer from additional conductive foil. A cathodic conductive couple is made between the conductive layer and a cathode trace and an anodic conductive couple is made between the conductive foil and an anode trace.
    Type: Grant
    Filed: January 6, 2012
    Date of Patent: April 2, 2013
    Assignee: Kemet Electronics Corporation
    Inventors: John D. Prymak, Chris Stolarski, Alethia Melody, Antony P. Chacko, Gregory J. Dunn
  • Patent number: 8400758
    Abstract: A solid electrolytic capacitor according to the present invention includes a solid electrolyte type capacitor element including a dielectric layer intervening between an anode section and a cathode section, an anode terminal connected electrically to the anode section of the capacitor element through a pad member, and a cathode terminal connected electrically to the cathode section of the capacitor element. Here, on facing surfaces of the pad member and the anode terminal, a joint part which joins the pad member and the anode terminal electrically is formed at a position adjacent to a first lateral surface of the pad member located on the cathode terminal side, and a second lateral surface of the pad member on the opposite side to the first lateral surface and a partial area of a lateral end surface of the anode terminal are flush with each other.
    Type: Grant
    Filed: July 30, 2010
    Date of Patent: March 19, 2013
    Assignee: SANYO Electric Co., Ltd.
    Inventor: Hayatoshi Ihara
  • Patent number: 8390986
    Abstract: Provided is a high power super capacitor including: a bobbin; an electrode assembly being wound into the bobbin to be in a jellyroll type; a conductive connection member being formed in each of one end and another end of the electrode assembly using electric energy; and a plug being inserted into each of one end and another end of the bobbin, and being bonded with the conductive connection member using electric energy to be electrically connected to the electrode assembly.
    Type: Grant
    Filed: March 23, 2011
    Date of Patent: March 5, 2013
    Assignee: Samhwa Capacitor Co., Ltd.
    Inventors: Young Joo Oh, Jung Rag Yoon, Kyung Min Lee, Sang Won Lee
  • Patent number: 8369065
    Abstract: An electric double layer capacitor (EDLC) includes an electric double layer cell and first and second external electrodes. The electric double layer cell includes a separator and at least one first polarizable electrode and at least one second polarizable electrode. The first and second external electrodes are formed at first and second side surfaces of the electric double layer cell facing each other, respectively. The first polarizable electrode includes a first current collection layer and a first active material layer formed on either surface of the first current collection layer facing the separator and the second polarizable electrode includes a second current collection layer and a second active material layer formed on either surface of the second current collection layer facing the separator.
    Type: Grant
    Filed: December 30, 2009
    Date of Patent: February 5, 2013
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Yeong Su Cho, Kang Heon Hur, Kwan Hyeong Kim, Chang Ryul Jung, Sang Kyun Lee, Sung Ho Lee, Dong Sup Park
  • Patent number: 8358496
    Abstract: A high reliable electric double layer capacitor is provided by increasing a sealing ability and strength of given portions of collecting terminals. In an electric double layer capacitor including a capacitor proper 1a produced by a plurality of stacked cells and an aluminum laminate film covering the exterior of the capacitor proper, a pair of collecting terminals 12 and 13 are provided at opposed portions of the capacitor proper 1a. Each collecting terminal 12 or 13 includes a first bent portion 12b or 13b that is bent to extend along a side surface 1b of the capacitor proper 1a and a second bent portion 12c or 13c that is bent to extend outward from a vertically middle position of the side surface 1b of the capacitor proper 1a.
    Type: Grant
    Filed: August 29, 2008
    Date of Patent: January 22, 2013
    Assignee: Meidensha Corporation
    Inventors: Hiroyuki Watanabe, Ron Horikoshi
  • Patent number: 8351188
    Abstract: A first lead frame has a cathode connection portion connected via a first electrically conductive member to a cathode portion, and a first connection portion having a first connection surface, and is at least partially, externally exposed. A second lead frame has a supporting connection portion connected via a second electrically conductive member to the cathode portion, and a second connection portion having a second connection surface facing the first connection surface. A third electrically conductive member interconnects the first and second connection portions. A solid electrolytic capacitor that can achieve low cost and high production yield can thus be provided.
    Type: Grant
    Filed: December 22, 2009
    Date of Patent: January 8, 2013
    Assignee: SANYO Electric Co., Ltd.
    Inventors: Akinari Kurokawa, Yoshikazu Hirata, Takuji Yoshitomi
  • Patent number: 8351187
    Abstract: A solid capacitor according to an aspect of the invention may include: a capacitor device having an anode lead wire extending from one side thereof; a case molding the capacitor device and exposing the anode lead wire to the outside thereof; cathode and anode lead frames exposed on the outside the case and electrically connected to the capacitor device; a reinforcement interposed in the case between the anode lead wire and the anode lead frame so as to support the capacitor device and electrically connecting the anode lead wire and the anode lead frame; and a resin shielding part applied to the exposed portion of the anode lead wire to prevent the infiltration of foreign substances through the anode lead wire.
    Type: Grant
    Filed: August 25, 2009
    Date of Patent: January 8, 2013
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Kwang Kim, Kwan Hyeong Kim, Chong Hoon Pak
  • Patent number: 8344735
    Abstract: The solid electrolytic capacitor includes a solid electrolyte type capacitor element including a dielectric layer intervening between an anode section and a cathode section, and an insulating substrate. The insulating substrate includes a first surface on which the capacitor element is mounted and a second surface opposite to the first surface. The first surface is provided thereon with a first anode layer to which the anode section is electrically connected and a first cathode layer to which the cathode section is electrically connected. The second surface is provided thereon with a second anode layer electrically connected to the first anode layer and a second cathode layer electrically connected to the first cathode layer. Here, a pad member with electrical insulation property projects on the first surface of the insulating substrate, and the first anode layer is formed on a tip end surface of the pad member.
    Type: Grant
    Filed: July 30, 2010
    Date of Patent: January 1, 2013
    Assignee: SANYO Electric Co., Ltd.
    Inventor: Keiko Matsuoka
  • Patent number: 8345408
    Abstract: A method for producing a solid electrolytic capacitor, which comprises the steps of: laying a plurality of solid electrolytic capacitor elements in proximity to each other in parallel on a cathode lead portion of a lead frame with a conductive adhesive, and electrically connecting the solid electrolytic capacitor elements to the cathode lead portion so that the conductive adhesive gets into a gap between the solid electrolytic capacitor elements.
    Type: Grant
    Filed: September 23, 2010
    Date of Patent: January 1, 2013
    Assignee: Showa Denko K.K.
    Inventor: Kazumi Naito
  • Patent number: 8339771
    Abstract: A capacitor containing a solid electrolytic capacitor element and a conductive adhesive disposed between the capacitor element and another optional capacitor element, an electrode termination, or both, is provided. The conductive adhesive contains a plurality of spacer particles that are substantially spherical and have a relatively large diameter. The present inventors have discovered that the use of spacer particles having the desired size and shape can provide multiple benefits to the resulting capacitor. For example, the spacer particles can limit the degree to which the adhesive is compressed during manufacture, thereby ensuring that it will have the minimum thickness needed to achieve a reliable mechanical connection to the desired part. Further, when multiple capacitor elements are employed, the spacer particles can also help ensure that proper spacing is achieved between the different elements upon manufacture of the capacitor.
    Type: Grant
    Filed: February 19, 2010
    Date of Patent: December 25, 2012
    Assignee: AVX Corporation
    Inventor: Silvie Vilcova
  • Patent number: 8325466
    Abstract: A solid electrolytic capacitor includes a capacitor element from which an anode lead projects forward and having a surface on which a cathode layer is formed, an exterior resin covering the capacitor element, and anode and cathode terminals including, respectively, an anode and cathode terminal surfaces which are exposed from a bottom surface of the exterior resin. The anode terminal is formed from one metal plate, and includes a terminal part forming the anode terminal surface, a folded part folded back at a side edge of the terminal part and arranged over a top surface of the terminal part, and an upright part bent vertically to the top surface of the terminal part at a front edge or a rear edge of a tip end part of the folded part. A tip end part of the anode lead is electrically connected to a tip end of the upright part.
    Type: Grant
    Filed: October 19, 2009
    Date of Patent: December 4, 2012
    Assignee: SANYO Electric Co., Ltd.
    Inventors: Eizo Fujii, Kazuhiro Kato, Hiroya Nishimoto, Shoji Umeda, Koji Tezuka
  • Patent number: 8320105
    Abstract: A both-side pressed terminal is connected as a first anode (cathode) lead tab terminal to an anode (a cathode) foil. A first connection surface of a connection portion of a one-side pressed terminal as a second anode (cathode) lead tab terminal is connected to an inner circumferential surface of the anode (cathode) foil. A position in a radial direction of a lead of the second anode (cathode) lead tab terminal is shifted inward to be in registration with a position in a radial direction of a lead of the first anode (cathode) lead tab terminal. Thus, an electrolytic capacitor free from position displacement of an anode (a cathode) lead tab terminal while maintaining characteristics as an electrolytic capacitor can be obtained.
    Type: Grant
    Filed: August 27, 2010
    Date of Patent: November 27, 2012
    Assignees: SANYO Electric Co., Ltd., SAGA SANYO INDUSTRIES Co., Ltd.
    Inventor: Kazumasa Fujimoto
  • Patent number: 8320106
    Abstract: In a lower-face electrode type solid electrolytic multilayer capacitor and a mounting member having the same according to the present invention, fillet forming portions are formed by forming an electrode substrate cutting portion at a predetermined portion of an edge face in longer direction or in shorter direction of an electrode substrate, and a covering resin cutting portion on an edge face of a covering resin in a staircase pattern so that the electrode substrate cutting portion is surrounded by the covering resin cutting portion. According to the present invention, it is possible to provide the lower-face electrode type solid electrolytic multilayer capacitor and the mounting member having the same, in which the productivity is excellent, the volume efficiency can be improved to achieve the high capacitance, and the stable fillet can be formed on mounting.
    Type: Grant
    Filed: November 19, 2010
    Date of Patent: November 27, 2012
    Assignee: NEC Tokin Corporation
    Inventors: Akihiro Kawai, Kenji Araki
  • Patent number: 8310817
    Abstract: In a solid electrolytic capacitor, a path of an electric current flowing from a lower layer to an upper layer of a laminate in cathode portions of respective capacitor elements connected through an electroconductive adhesive layer is opposite to paths of electric currents flowing from a canopy through joints to cathode terminals, thereby achieving reduction in ESL by mutual inductance effect in a simple structure. Since the solid electrolytic capacitor has the structure in which the laminate is surrounded by the canopy and joints, sufficient pressure resistance is ensured for the capacitor elements during resin injection. For this reason, a resin mold to cover the laminate can be formed by transfer molding, which ensures excellent heat resistance and moisture resistance.
    Type: Grant
    Filed: July 2, 2009
    Date of Patent: November 13, 2012
    Assignee: TDK Corporation
    Inventors: Masaaki Kobayashi, Hironori Sato
  • Patent number: 8305735
    Abstract: A stacked solid electrolytic capacitor with positive multi-pin structure includes a plurality of capacitor units, a substrate unit and a package unit. The positive electrode of each capacitor unit has a positive pin extended outwards therefrom. The positive pins are divided into a plurality of positive pin units that are separated from each other and electrically stacked onto each other. The negative electrode of each capacitor unit has a negative pin extended outwards therefrom. The negative pins are divided into a plurality of negative pin units. The negative pin units are separated from each other and the negative pins of each negative pin unit are electrically stacked onto each other. The substrate unit has a positive guiding substrate electrically connected to the positive pins and a negative guiding substrate electrically connected to the negative pins. The package unit covers the capacitor units and one part of the substrate unit.
    Type: Grant
    Filed: November 30, 2009
    Date of Patent: November 6, 2012
    Assignee: Apaq Technology Co., Ltd.
    Inventors: Yui-Shin Fran, Ching-Feng Lin, Chi-Hao Chiu, Chun-Chia Huang, Wen-Yen Huang
  • Publication number: 20120262847
    Abstract: Provided is a solid electrolytic capacitor that is excellent in productivity, has improved volumetric efficiency aiming for capacity increase, a stable fillet shape when mounted, and has excellent ESL characteristics. Included is a capacitor stack element composed of a stack of capacitor elements. The capacitor element includes one anode part of an anode body made of linear, foil-like, or plate-like valve metal and a cathode part composed of dielectric, solid electrolyte, graphite, and silver paste layers, which are sequentially formed to another surface of the anode body separated by insulating resin. A fillet formation part with a recessed part is provided to an end surface of anode and cathode terminals of a mounting electrode side of a first direction end surface of the electrode substrate to which the capacitor stack element is mounted. Further, the anode and cathode terminals for element connection reach the end surface of the first direction.
    Type: Application
    Filed: April 13, 2012
    Publication date: October 18, 2012
    Applicant: NEC TOKIN Corporation
    Inventors: Akihiro KAWAI, Kenji Araki
  • Publication number: 20120229956
    Abstract: A capacitor containing a solid electrolytic capacitor element that includes an anode, dielectric, and a cathode that includes a solid electrolyte is provided. An anode lead extends from the anode and is electrically connected to an anode termination. Likewise, a cathode termination is electrically connected to the cathode. The cathode termination contains an upstanding portion that is oriented generally perpendicular to the lower surface of the capacitor element, and first and second planar portions that are oriented generally parallel to the lower surface of the capacitor. The first and second planar portions are interconnected by a folded region so that the first portion is positioned vertically above the second portion. Thus, after encapsulating the capacitor element with a molding material, the second planar portion remains exposed for subsequent connection to an electrical component.
    Type: Application
    Filed: March 11, 2011
    Publication date: September 13, 2012
    Applicant: AVX CORPORATION
    Inventor: Stanislav Zednicek
  • Publication number: 20120229957
    Abstract: A capacitor containing a solid electrolytic capacitor element that includes an anode, dielectric, and a cathode that includes a solid electrolyte is provided. An anode lead extends from the anode and is electrically connected to an anode termination. Likewise, a cathode termination is electrically connected to the cathode. The cathode termination contains a planar portion that is oriented generally parallel to a lower surface of the capacitor element. An interior slot is defined by the planar portion within which is disposed a conductive adhesive that connects the cathode termination to the capacitor element. By disposing the adhesive within a slot of a planar portion of the cathode termination, the present inventors have discovered that the tendency of the adhesive to bleed toward the edges of the termination can be limited. Among other things, this improves the mechanical stability of the capacitor upon encapsulation and also improves electrical performance.
    Type: Application
    Filed: March 11, 2011
    Publication date: September 13, 2012
    Applicant: AVX CORPORATION
    Inventor: Ales Vyroubal
  • Patent number: 8254087
    Abstract: The solid electrolytic capacitor includes a capacitor element including an anode section, a dielectric film, and a cathode section, a wiring member on which the capacitor element is mounted, and an enclosure resin coating the capacitor element. The wiring member includes an insulating base, a first anode terminal portion connected to the anode section is provided on a first surface of the insulating base on which the capacitor element is mounted, the first anode terminal portion includes a connection part integrally formed therewith for electrically connecting the first anode terminal portion and the anode section to each other, a second anode terminal portion connected to the first anode terminal portion is provided on a second surface of the insulating base opposed to the first surface, and the first and second anode terminal portions are connected by an anode conduction part provided on a side surface of the insulating base.
    Type: Grant
    Filed: February 26, 2010
    Date of Patent: August 28, 2012
    Assignee: SANYO Electric Co., Ltd.
    Inventors: Yasuko Ibata, Hiroya Nishimoto, Takeshi Takamatsu
  • Patent number: 8213161
    Abstract: A solid electrolytic capacitor according to the present invention comprises an anode body, an anode lead in contact with an outer surface of the anode body, a dielectric layer formed on a surface of the anode lead, and a cathode layer formed on a surface of the dielectric layer. The anode lead is provided with a plurality of openings passing through the anode lead. Another solid electrolytic capacitor according to the present invention comprises an anode body, an anode lead in contact with an outer surface of the anode body, a dielectric layer formed on a surface of the anode lead, and a cathode layer formed on a surface of the dielectric layer. The anode lead is provided with a cutout on an outer circumference edge of the anode lead.
    Type: Grant
    Filed: October 29, 2009
    Date of Patent: July 3, 2012
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Koichi Nishimura, Koji Endo, Takashi Umemoto, Hiroshi Nonoue
  • Patent number: 8213160
    Abstract: A solid electrolytic capacitor including a solid electrolytic capacitor component comprises a porous anode body 2 composed of valve metal having a anode lead 1 protruding therefrom, a anode oxide film, a solid electrolyte layer 4, a graphite layer 5, a silver paste layer 6, a resist layer 3 separating the anode lead 1 used as a anode portion and the porous anode body 2 used as a cathode portion, and a anode lead element 7 connected to the anode lead 1, the anode oxide film, solid electrolyte layer 4, graphite layer 5, silver paste layer 6 being successively formed on the surface of the porous anode body 2, wherein the solid electrolytic capacitor component is bonded on a mounting substrate 21 having a anode terminal 21a, a cathode terminal 21b, and an insulating portion 21c therebetween with a precuring insulating adhesive 9 formed on the insulating portion 21c of the mounting substrate 21 and precuring conductive adhesives 8 formed on the anode terminal and cathode terminal, and sealed with exterior resin 10
    Type: Grant
    Filed: March 13, 2008
    Date of Patent: July 3, 2012
    Assignee: NEC Tokin Corporation
    Inventors: Takeshi Saito, Yuji Yoshida, Takeo Kasuga, Koji Sakata, Katsuhiro Yoshida, Masanori Takahashi
  • Publication number: 20120162860
    Abstract: A chip capacitor (1) includes: a capacitor body (10) from which an anode lead wire (11) and a cathode lead wire (12) are extended out; and a mount portion (20) which is fitted to the capacitor body (10), in which terminal portions (11a and 12a) of the lead wires (11 and 12) are arranged in a board mounting surface (20a) and which is placed on a circuit board. In the chip capacitor (1) in which the terminal portions (11a and 12a) are soldered to the circuit board, the mount portion (20) is formed of a resin containing an organic metal complex compound, and an assistant terminal portion (21) formed by plating a region to which a metal is exposed by applying laser light onto the board mounting surface (20a) is provided.
    Type: Application
    Filed: April 18, 2011
    Publication date: June 28, 2012
    Inventors: Yutaka Taketani, Hitoshi Yoshizawa, Kazuo Teraji, Naoya Saiki
  • Publication number: 20120154986
    Abstract: A positive electrode 21 and negative electrode 22 formed of a thin metal plate are disposed on the same plane with a space provided therebetween. An insulative resin is disposed in the space between the both electrodes. The insulative resin electrically insulates the positive and the negative electrodes, and making both electrodes integrated as a sheet to form a terminal board. Positive- and negative-electrode drawing portions are formed on the same surface of the main body of a capacitor element, and that surface serves as a joined face with the terminal board. With the terminal board being superimposed on the joined face of the capacitor element, the metal plate forming the positive and negative electrodes of the terminal board are electrically coupled to the positive- and negative-electrode drawing portions of the element, respectively.
    Type: Application
    Filed: August 21, 2009
    Publication date: June 21, 2012
    Inventors: Susumu Ando, Shigeki Shirase
  • Patent number: 8199462
    Abstract: An electrolytic capacitor that is configured to be embedded into a circuit board is provided. The electrolytic capacitor contains a capacitor element, anode and cathode terminations, and a case that encapsulates the capacitor element and leaves at least a portion of the anode and cathode terminations exposed that extend outwardly from opposite ends of the case. Each of the terminations possesses an upper surface that faces toward the capacitor element and a lower surface that faces away from the capacitor element. In contrast to conventional surface-mounted electrolytic capacitors, the upper surfaces of these exposed anode and cathode termination portions are mounted to the circuit board. In this manner, the capacitor may essentially be mounted “upside down” so that some or all of its thickness becomes embedded within the board itself, thereby minimizing the height profile of the capacitor on the board.
    Type: Grant
    Filed: September 8, 2008
    Date of Patent: June 12, 2012
    Assignee: AVX Corporation
    Inventors: Stanislav Zednicek, Ladislav Marek
  • Patent number: 8199461
    Abstract: A solid electrolytic capacitor that contains a capacitor element that includes an anode body, dielectric layer, and solid electrolyte is provided. The capacitor also contains an anode lead that is electrically connected to the anode body. Contrary to conventional capacitors in which the lead is welded or connected using a layer of seed particles, a refractory metal paste (e.g., tantalum paste) is employed in the present invention to electrically connect the anode lead to the anode body. The use of such a refractory metal paste allows the anode lead to be sinter bonded to a surface of the anode body after it is pressed. In this manner, a strong and reliable connection may be achieved without substantially decreasing the surface area of the lead that is available for connection to a termination. The paste of the present invention generally contains particles of a relatively small size.
    Type: Grant
    Filed: May 29, 2009
    Date of Patent: June 12, 2012
    Assignee: AVX Corporation
    Inventors: Stanislav Zednicek, William A. Millman
  • Patent number: 8199460
    Abstract: A capacitor containing a solid electrolytic capacitor element that includes an anode, dielectric, and solid electrolyte is provided. An anode lead extends from the anode and is electrically connected to an anode termination. The anode termination contains an upstanding portion that is bent or folded about an axis so that it possesses two or more sections. A slot (e.g., U-shaped) extends through the sections of the upstanding portion for receiving an anode lead. The resulting “folded” configuration of the anode termination increases the total thickness of the upstanding portion and its associated slot, which thereby enhances the degree of mechanical support and stability that the termination provides to the anode lead. This is particularly beneficial for thicker anode leads, such as those having a height and/or width of about 100 micrometers or more, in some embodiments about 200 micrometers or more, and in some embodiments, from about 250 to about 1000 micrometers.
    Type: Grant
    Filed: September 27, 2010
    Date of Patent: June 12, 2012
    Assignee: AVX Corporation
    Inventor: Ales Vyroubal
  • Patent number: 8184429
    Abstract: A capacitor is improved in reliability by suppressing the formation of burrs or protrusions at a joint portion between an aluminum wire round rod and an external terminal in a lead wire used for a capacitor. A metal cap having a higher melting point than aluminum is fitted to an end portion of the aluminum wire round rod and the metal cap is heated, thereby joining the aluminum wire round rod to the metal cap. Thereafter, the external terminal and the metal cap are welded to each other. The metal cap has a curved surface in which an outer periphery is decreased from an opening toward an end portion opposite to the opining. The opening is provided with a stepped portion, so that the sealing degree is increased when the lead wire is inserted into a hole of the sealing member.
    Type: Grant
    Filed: August 30, 2007
    Date of Patent: May 22, 2012
    Assignee: Panasonic Corporation
    Inventors: Junji Yamane, Hiroshi Kurimoto, Kohei Harazono, Doyuu Hachisu, Takanao Saito, Hiroyuki Saikawa
  • Patent number: 8179667
    Abstract: A solid electrolytic capacitor includes a capacitor element coated with an enclosure resin, and an insulating substrate in which an anode terminal and a cathode terminal are formed. The anode terminal includes a first anode section formed on a first surface of the insulating substrate, a second anode section formed on a second surface of the insulating substrate, and an anode conductive layer which is formed on a side edge surface of the insulating substrate to electrically connect there anode sections to each other. The cathode terminal includes a first cathode section formed on the first surface, a second cathode section formed on the second surface, and a cathode conductive layer which is formed on the side edge surface of the insulating substrate to electrically connect there cathode sections to each other. And the anode conductive layer and the cathode conductive layer are exposed from the enclosure resin.
    Type: Grant
    Filed: March 22, 2010
    Date of Patent: May 15, 2012
    Assignee: SANYO Electric Co., Ltd.
    Inventors: Yasuko Ibata, Hiroya Nishimoto, Takeshi Takamatsu
  • Patent number: 8179666
    Abstract: A multilayer electrolytic capacitor has a laminated body in which anode foils and cathode foils are alternately laminated with separators in between, and a lead member connected to corresponding electrode foils among the anode foils and cathode foils. Each of the anode foils and each of the cathode foils have their respective main electrode portions opposed to each other through the separator and their respective lead portions led from the associated main electrode portions. Each lead portion includes an end face intersecting with a direction in which the lead portions are led, and a side face intersecting with the end face and extending in a lamination direction in the laminated body. The lead member has a first portion extending in the direction in which the lead portions are led, and a second portion intersecting with the first portion and extending in the lamination direction. The second portion of the lead member is connected to the side faces of the lead portions.
    Type: Grant
    Filed: January 14, 2010
    Date of Patent: May 15, 2012
    Assignee: TDK Corporation
    Inventor: Hiroaki Hasegawa
  • Patent number: 8179665
    Abstract: A solid electrolytic capacitor includes a capacitor element surrounded with a cathode layer, an anode wire inserted into the capacitor element, a cathode terminal electrically connected to the capacitor element by being positioned at one side below the capacitor element, an anode terminal defining a space between the capacitor element and a top surface thereof and is electrically connected to the anode wire by being positioned at the other side below the capacitor element, a conductive paste coated being thicker toward an inside of the capacitor element, thereby electrically connecting the capacitor element to the cathode terminal and broadening the space, and a fixing film closely coupled to a bottom surface of the conductive paste. A molding unit wraps the capacitor element and the fixing film in a state of closely adhering the conductive paste and the cathode terminal to top and bottom surfaces of the fixing film, respectively.
    Type: Grant
    Filed: February 13, 2009
    Date of Patent: May 15, 2012
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Kwang Kim, Kwan Hyeong Kim, Chong Hoon Pak
  • Patent number: 8169774
    Abstract: A first solid electrolytic capacitor according to the present invention includes a capacitor element, an exterior resin covering the capacitor element, an anode terminal, a cathode terminal, and a metal wire. The capacitor element includes an anode body from which an anode lead is extracted, a dielectric layer formed on a surface of the anode body, and a cathode layer formed on the dielectric layer. The anode terminal and the cathode terminal are electrically connected to the anode lead and the cathode layer, respectively, and extracted to an outer surface of the exterior resin, the anode terminal including an opposing part opposed to the anode lead in the exterior resin. The metal wire includes both ends connected to the opposing part and a curving part, and is provided to the anode lead, and at least a part of the curving part is electrically connected to the anode lead.
    Type: Grant
    Filed: September 22, 2009
    Date of Patent: May 1, 2012
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Nobuhiko Hayashi, Takashi Umemoto, Hiroshi Nonoue
  • Patent number: 8154855
    Abstract: A method for manufacturing a solid electrolytic capacitor that prevents leakage current from increasing. The method includes preparing a capacitor element including an anode body, which has an anode lead, and a cathode layer; preparing a lead terminal including an anode terminal, a cathode terminal, and a first insulative member which connects the anode terminal and cathode terminal; connecting the lead terminal and the capacitor element by bonding the anode terminal and the anode lead and bonding the cathode terminal and the cathode layer; and molding a package resin around the capacitor element.
    Type: Grant
    Filed: November 21, 2008
    Date of Patent: April 10, 2012
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Masaaki Nemoto, Takashi Umemoto, Hiroshi Nonoue
  • Patent number: 8149569
    Abstract: A solid electrolytic capacitor including a capacitor element having an anode member and a cathode member, an anode terminal electrically connected with the anode member, a cathode terminal electrically connected with the cathode member, and a mold resin portion covering the capacitor element; wherein the cathode terminal has an upper step portion in face-to-face contact with the cathode member and a lower step portion exposed out of the mold resin portion and a bottom surface of the mold resin portion and an upper surface of the lower step portion of the cathode terminal are disposed in an approximately same plane.
    Type: Grant
    Filed: November 11, 2008
    Date of Patent: April 3, 2012
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Keiko Matsuoka, Shoji Umeda
  • Publication number: 20120064405
    Abstract: Disclosed are a positive active material composition for an electrochemical device, a positive electrode, and an electrochemical device including the same. The positive active material composition includes: a carbon-based additive including a hydroxyl group (—OH) and an enol group (—C?C—OH) on the surface, having a peak area ratio (OH/C?COH) of a hydroxyl group peak area and an enol group peak area of an infrared spectroscopy (FT-IR) spectrum ranging from about 0.5 to about 10, having a specific surface area of about 50 m2/g to about 3000 m2/g, and having an oxygen-containing heterogeneous element in a content of less than about 15 wt %; a positive active material; a conductive material; and a binder.
    Type: Application
    Filed: March 14, 2011
    Publication date: March 15, 2012
    Applicant: Samsung SDI Co., Ltd.
    Inventors: Kyeu-Yoon SHEEM, Mee-Young Lee, Sumihito Ishida, Eui-Hwan Song
  • Patent number: 8130507
    Abstract: A component built-in wiring board is provided. The component built-in wiring board 10 includes a core substrate 11, a first component 61, a first built-up layer 31 and a capacitor 101. The core substrate 11 has a housing hole 90 and the first component 61 is housed in the housing hole 90. A component mounting region 20 capable of mounting a second component 21 is provided in a surface 39 of the first built-up layer 31. The capacitor 101 has electrode layers 102 and 103 and a dielectric layer 104. The capacitor 101 is embedded in the first built-up layer 31 such that a first front surface 105 and a second front surface 106 in the electrode layer 102 and a first front surface 107 and a second front surface 108 in the electrode layer 103 are disposed in parallel with the surface 39 of the first built-up layer 31.
    Type: Grant
    Filed: March 23, 2009
    Date of Patent: March 6, 2012
    Assignee: NGK Spark Plug Co., Ltd.
    Inventors: Makoto Origuchi, Tsuneaki Takashima
  • Patent number: 8125769
    Abstract: A capacitor assembly containing a solid electrolytic capacitor element and an anode lead extending in a direction therefrom, first and second cathode terminations, and an anode termination is provided. The first cathode termination contains a first portion that is substantially parallel to a lower surface of the capacitor element and in electrical contact therewith, and the second cathode termination contains a second portion that is substantially parallel to an upper surface of the capacitor element and in electrical contact therewith. Through such a “sandwich” configuration, the degree of surface contact between the cathode terminations and capacitor element is increased, which can help dissipate heat and allow it to handle higher currents that would normally cause overheating. The terminations may also provide increased mechanical support.
    Type: Grant
    Filed: July 22, 2010
    Date of Patent: February 28, 2012
    Assignee: AVX Corporation
    Inventor: Lotfi Djebara
  • Patent number: 8102668
    Abstract: An integral impedence is formed on or within a lead frame pin of a semiconductor package and receives a connection from an electrode of a semiconductor die within the package to eliminate the need for adjustment and protective impedences external of the package. The impedence comprises passives such as resistors, capacitors, diodes or inductors which modify the performance of the package for new semiconductor device characteristics. The impedences may have positive or negative temperature coefficients and are in close thermal communication with the semiconductor die.
    Type: Grant
    Filed: May 6, 2008
    Date of Patent: January 24, 2012
    Assignee: International Rectifier Corporation
    Inventors: Henning M. Hauenstein, Alana Nakata
  • Patent number: 8094434
    Abstract: A capacitor assembly that includes a conductive polymer electrolytic capacitor that is enclosed and hermetically sealed within a ceramic housing in the presence of an inert gas is provided. Without intending to be limited by theory, the present inventors believe that the ceramic housing is capable of limiting the amount of oxygen and moisture supplied to the conductive polymer of the capacitor. In this manner, the conductive polymer is less likely to oxidize in high temperature environments, thus increasing the thermal stability of the capacitor assembly.
    Type: Grant
    Filed: April 1, 2008
    Date of Patent: January 10, 2012
    Assignee: AVX Corporation
    Inventors: Bharat Rawal, Gang Ning, Brady Jones, Zebbie Lynn Sebald, Stanislav Zednicek, Zdenek Sita
  • Patent number: 8081421
    Abstract: A solid electrolytic capacitor includes a capacitor element, an anode lead frame, a cathode lead frame, and a mold resin portion. The anode lead frame includes an anode terminal portion and a rising portion, and the anode terminal portion is exposed at the bottom surface of the mold resin portion. The rising portion is formed integral with the anode terminal portion, and rises to the anode portion. In the rising portion, a through hole is formed. The cathode lead frame includes a cathode terminal portion, a pair of side surface portions and a step portion. Thus, a solid electrolytic capacitor allowing highly accurate and reliable attachment of the capacitor element to the lead frame without using any additional member is provided.
    Type: Grant
    Filed: December 8, 2008
    Date of Patent: December 20, 2011
    Assignee: SANYO Electric Co., Ltd.
    Inventors: Keiko Matsuoka, Shoji Umeda, Yoshiyuki Fushimi, Koji Tezuka
  • Patent number: 8072735
    Abstract: A method for manufacturing a solid electrolytic capacitor, capable of joining a bolster member interposed between an anode lead and an anode lead frame to the anode lead frame with good adhesion property and high positional accuracy where a bolster member is obtained from a ladder-shaped frame such that a width of the bolster member in a direction perpendicular to a lead-out direction of an anode lead is larger than a width of an anode lead frame, and the bolster member is aligned with the anode lead frame while being chucked, and then is joined to the anode lead frame.
    Type: Grant
    Filed: June 22, 2007
    Date of Patent: December 6, 2011
    Assignee: SANYO Electric Co., Ltd.
    Inventors: Eizo Fujii, Hayatoshi Ihara, Yusuke Takahashi, Takeshi Kasahara, Katsumi Hiramatsu
  • Patent number: 8059390
    Abstract: To provide an electrolytic capacitor having lead wires excellent in weldability with a boss member made of aluminum, excellent in solder wettability, and less whisker. The lead wires have a nickel plating layer in a thickness of 0.3 to 5.0 ?m, a palladium plating layer in a thickness of 0.01 to 0.10 ?m, and a gold plating layer in a thickness of 0.002 to 0.030 ?m.
    Type: Grant
    Filed: June 16, 2009
    Date of Patent: November 15, 2011
    Assignees: Sanyo Electric Co., Ltd, Saga Sanyo Industries Co., Ltd, Furukawa Precision Engineering Co., Ltd
    Inventors: Daisuke Manago, Shinji Kodera, Hitoshi Ibuta, Kunio Shibata
  • Patent number: 8040662
    Abstract: A solid electrolytic capacitor includes a cathode terminal structured such that the cathode terminal's flat portion connected to a cathode portion has a divided structure made up of a first flat portion and a second flat portion spaced from each other by a predetermined distance to form a slit. Therefore, even if the cathode terminal is caused to be peeled off from the cathode portion, the peeling can be restricted to only one of the first and second flat portions, so that the peeled-off area can be prevented from increasing. Accordingly, the reliability of the state of fixture of the cathode terminal to the cathode portion is improved, so that the solid electrolytic capacitor can be provided having the structure with which the reliability of the solid electrolytic capacitor can be improved.
    Type: Grant
    Filed: December 29, 2008
    Date of Patent: October 18, 2011
    Assignee: SANYO Electric Co., Ltd.
    Inventors: Akinari Kurokawa, Yoshikazu Hirata
  • Publication number: 20110249375
    Abstract: A solid electrolytic capacitor includes a capacitor element, an anode lead frame, a cathode lead frame, and a mold resin portion. The anode lead frame includes an anode terminal portion and a rising portion, and the anode terminal portion is exposed at the bottom surface of the mold resin portion. The rising portion is formed integral with the anode terminal portion, and rises to the anode portion. In the rising portion, a through hole is formed. The cathode lead frame includes a cathode terminal portion, a pair of side surface portions and a step portion. Thus, a solid electrolytic capacitor allowing highly accurate and reliable attachment of the capacitor element to the lead frame without using any additional member is provided.
    Type: Application
    Filed: June 21, 2011
    Publication date: October 13, 2011
    Applicant: SANYO ELECTRIC CO., LTD.
    Inventors: Keiko MATSUOKA, Shoji UMEDA, Yoshiyuki FUSHIMI, Koji TEZUKA
  • Patent number: 8028653
    Abstract: A filament post used in plasma-enhanced chemical vapor deposition has an outer shell and an inner post. An electrical potential is applied only to the inner post to ensure that there is no impact on the plasma density and the carbon film properties. The inner post and the outer shell are electrically insulated by ceramic insulators, such that no electrical potential is applied to outer shell. The stress generated in the carbon film is directly related to the electrical potential of the surface to which the film is deposited. The carbon film deposited on the outer shell of the post is not highly stressed, which significantly reduces film delamination from the filament post surfaces.
    Type: Grant
    Filed: December 6, 2007
    Date of Patent: October 4, 2011
    Assignee: Hitachi Global Storage Technologies Netherlands, B.V.
    Inventors: Eric Hwang, Jinliu Wang, Richard Longstreth White
  • Publication number: 20110235242
    Abstract: Provided is a high power super capacitor including: a bobbin; an electrode assembly being wound into the bobbin to be in a jellyroll type; a conductive connection member being formed in each of one end and another end of the electrode assembly using electric energy; and a plug being inserted into each of one end and another end of the bobbin, and being bonded with the conductive connection member using electric energy to be electrically connected to the electrode assembly.
    Type: Application
    Filed: March 23, 2011
    Publication date: September 29, 2011
    Applicant: SAMHWA CAPACITOR CO., LTD.
    Inventors: Young Joo OH, Jung Rag YOON, Kyung Min LEE, Sang Won LEE
  • Publication number: 20110222210
    Abstract: A capacitor includes a positive electrode base material, a dielectric layer, a positive electrode body, a dielectric layer, a negative electrode body, and a negative electrode base material. The positive electrode body is formed on the positive electrode base material and in part is in contact with the positive electrode base material. The positive electrode body is formed by association of a large number of metal particles, and the associated metal particles form a reticular network. The positive electrode base material and the positive electrode body (core part) are formed of a NiTi alloy containing Ni having a large work function. The dielectric layers (high-permittivity insulating film) are formed of titanium oxide. It is preferable that at least one Ni atomic layer is formed at an interface between the high-permittivity insulating film and the core part. Although the Ni atomic layer is preferably formed over the entire interface, the Ni atomic layer may be partially formed at the interface.
    Type: Application
    Filed: November 17, 2009
    Publication date: September 15, 2011
    Applicant: Sanyo Electric Co., Ltd.
    Inventor: Hideaki Fujiwara
  • Patent number: 8018713
    Abstract: Anodized films are formed at both surfaces of an aluminum base and, at the center portion on each side of the aluminum base, a solid electrolyte layer of a conductive polymer, a graphite layer, and a metal layer are stacked in the order, thereby forming a rectangular cathode portion. An insulator layer is formed at the peripheries of four sides of the cathode portion and, further, an anode lead frame is provided at the peripheries of four sides of the upper insulator layer, thereby forming an anode portion. Openings are formed at four corners of the insulator layer or the anode portion, thereby establishing electrical connection between the cathode portions on both sides of the aluminum base. By setting the ratio of a total region, occupied by the openings, of the cathode portion to 25% or less, the ESL of a capacitor can be suppressed low even when the openings are provided.
    Type: Grant
    Filed: April 17, 2008
    Date of Patent: September 13, 2011
    Assignee: NEC Tokin Corporation
    Inventors: Yuji Yoshida, Katsuhiro Yoshida, Takeo Kasuga, Masanori Takahashi, Takeshi Saito, Koji Sakata
  • Patent number: 8014129
    Abstract: A stacked solid electrolytic capacitor includes a plurality of stacked solid electrolytic capacitor elements. Each solid electrolytic capacitor element includes an anode formed of a valve action metal, an anode section formed on an end of the anode, a dielectric formed on the surface of the valve action metal and including an oxide of the valve action metal, and a cathode layer formed on the dielectric. The cathode layers and the anode sections of the solid electrolytic capacitor elements are, respectively, connected to each other across the plurality of stacked solid electrolytic capacitor elements. A conductive layer extending in the stacking direction is formed on at least part of a side face of an area where the cathode layers of the solid electrolytic capacitor elements are formed.
    Type: Grant
    Filed: December 1, 2008
    Date of Patent: September 6, 2011
    Assignee: NEC Tokin Corporation
    Inventors: Takeshi Saito, Takeo Kasuga, Koji Sakata