Abstract: A surface-mount capacitor includes a multilayer capacitor structure formed by laminating plate-like capacitor elements each having anode lead portions 11 at opposite ends thereof and a cathode portion 12 at the center, an anode terminal 18 connected to each anode lead portion 11 via a strip-like plate 14, and a cathode terminal 19 connected to the cathode portion 12. The anode and the cathode terminals 18 and 19 have a flat shape and are formed on a common plane as a substrate-mounted surface. A mold resin case 20 has a bottom portion filling a gap between the anode and the cathode terminals 18 and 19 and mechanically connecting the anode and the cathode terminals 18 and 19, and side walls substantially perpendicular to the substrate-mounted surface. The anode and the cathode terminals 18 and 19 have upper surfaces exposed on an inner bottom surface of the mold resin case 20 to be connected to the anode lead portions 11 and the cathode portion 12.

Abstract: A solid electrolytic capacitor includes a capacitor element and a board mounting the capacitor element thereon. The capacitor element includes a support made of a valve metal, and an anode and a cathode provided on the support. Anode and cathode lead conductors connected to the anode and the cathode are provided on a first principal surface of the support, and anode and cathode lands are formed on a second principal surface. A conductive portion passing through the board electrically connects either the anode lead conductor to the anode land or the cathode lead conductor to the cathode land.

Abstract: The present invention provides a solid electrolytic capacitor with low leakage current. In the solid electrolytic capacitor, an anode has an anode lead made of tantalum, a surface layer made of niobium formed on the anode lead, and a rectangular block shaped base body having a porous sintered body made from niobium particles, and the anode lead is partially embedded in the base body. Onto the anode, an oxide layer made of niobium oxide, an electrically conductive polymer layer, and a cathode laminated with a first electrically conductive layer and a second electrically conductive layer are sequentially laminated. Onto the top surface of an area surrounding the cathode, a cathode terminal is formed through an electrically conductive adhesive layer. Also, an anode terminal is connected onto an edge of the anode lead.

Abstract: A solid electrolytic capacitor (1) comprises an element (2) protruding an anode lead (20), an anode lead frame (3) to which the anode lead (20) is to be attached, and a housing (5) for covering the element (2). The anode lead frame (3) has a step portion (4). The step portion (4) comprises a first horizontal portion (40) provided inside a side portion of the housing (5), a second horizontal portion (41) provided higher or lower and further inside the housing (5) than the first horizontal portion (40) and receiving an outer surface of the anode lead (20), and a linking portion (42) linking the first horizontal portion (40) and the second horizontal portion (41). The linking portion (42) is provided with an open hole (43), an edge of the open hole (43) overlapping the second horizontal portion (41), and a tip portion of the anode lead (20) being fitted into the open hole (43).

Abstract: A surface mount capacitor (10) and method for making the same. A solid slug or pellet anode body (1) is encapsulated in a case (6) of insulating material. An anode and cathode termination pair (2, 3) are formed with surface mount mounting portions on one side of the case (6). An electrical connection (4) is made from the cathode termination (2) to a cathode on pellet (1) through the case (6). An electrical connection (7) is made between an anode associated with the pellet (1) and the anode termination (3) externally of the case (6). The external connection (7) allows improved volumetric efficiency by freeing up space in the case (6) for a bigger pellet (1).

Abstract: A surface-mounted component includes an external contact, and components that are arranged in proximity to each other and that contain terminals. The external contact is connected to the terminals by spot welds. The external contact defines a contact surface on an assembly area of the surface-mounted component. The external contact also has an area that is free of spot welds.

Abstract: The invention provides a process for fabricating a solid electrolytic capacitor of the chip type which process includes the steps of plating a fabrication frame comprising an anode terminal member and a cathode terminal member projecting from a pair of side frame members respectively so as to be opposed to each other, the anode terminal member being stepped so as to provide a lower portion toward the cathode terminal member, a hole extending vertically and being formed in each of the anode terminal member and a higher portion of the cathode terminal member, joining an anode lead of a capacitor element to an upper surface of the cathode terminal member and a bottom surface of the capacitor element to an upper surface of the lower portion of the cathode terminal member, forming a packaging resin portion around the capacitor element without permitting resin to ingress into the holes, and cutting the anode and cathode terminal members along vertical planes extending through the respective holes.

Abstract: A face-down terminal solid electrolytic capacitor with the increased strength between electrode terminals and a casing resin is provided. The face-down terminal solid electrolytic capacitor has a structure where a mold structure in which a lead frame and capacitor elements fixed to the lead frame are overmolded with a casing resin is cut along cutting planes respectively passing through an anode terminal forming portion and a cathode terminal forming portion of the lead frame so that end surfaces of an anode terminal and a cathode terminal are exposed. In the lead frame, the anode terminal forming portion 21 and the cathode terminal forming portion 22 are provided so as to face each other. The anode terminal forming portion has a concave portion 21j on the board mount side and a convex portion 21t on the opposite side, which are formed by deforming part of the anode terminal forming portion in a direction perpendicular to a board mount surface. The concave portion is applied with plating.

Abstract: An electronic component includes plural elements, a pair of terminal sections provided to each one of the elements, and a packaging material covering the elements and parts of the terminal sections. A non-conductive shielding section is provided between the terminal sections led outside the packaging material. The presence of the shielding section allows the electronic component to downsize the electronic apparatus, embody a greater density in mounting, and eliminate adverse influence to the apparatus for achieving higher performance as well as improving the durability.

Abstract: A solid electrolytic capacitor including a capacitor element having an anode body partly provided with a cathode layer, an anode-side and a cathode-side lead frame attached to a lower surface of the capacitor element, and a housing covering the lead frames and the capacitor element except lower surfaces of the lead frames. Both of the lead frames are exposed on the bottom face of the housing. The anode-side lead frame extending longitudinally of the capacitor is provided in an outer end portion thereof with at least two strips which separate each other. Outer end portions of the strips are exposed on the outer end face of the housing. A concave space is formed between the strips and is filled with resin forming the housing.

Abstract: A mold member 5 packaging a capacitor element 2 is in the form of a generally rectangular parallelepiped whose length L is greater than the width W and the height H. The mold member 5 includes an opposite pair of side surfaces extending in the direction of the length L, and an anode lead terminal 3 is arranged at an anode-side one 5a of the longitudinally-extending side surfaces, whereas a cathode terminal 4 is arranged at a cathode-side one 5b of the longitudinally-extending side surfaces. The chip body 6 is in the form of a generally rectangular parallelepiped elongated in the direction of the length L of the mold member 5. The lead terminals 3 and 4 are elongated in the direction of the length L of the mold member 5. Of an opposite pair of longitudinally-extending side surfaces of the chip body 6, an anode side one 6a is provided with a plurality of anode bars 7 juxtaposed and projecting therefrom.

Abstract: In a chip type solid electrolytic capacitor including a capacitor element and a packaging resin covering the capacitor element, the packaging resin has a mount surface and a side surface adjacent to the mount surface. A terminal is electrically connected to the capacitor element and coupled to the packaging resin. The terminal extends along the mount surface and the side surface to have an outer surface exposed from the packaging resin and to have an inner surface opposite to the outer terminal surface. The inner surface has a stepwise shape formed by forging.

Abstract: A solid electrolytic capacitor which includes a capacitor element in which a dielectric coating layer and a cathode layer are sequentially formed on a surface of an anode element having an anode lead member planted on one end surface thereof, an anode terminal connected with the anode lead member, a platy cathode terminal mounting the capacitor element thereon and connected with the cathode layer, and an enclosure resin coating the capacitor element, a part of the cathode terminal and a part of the anode terminal being exposed on a same plane from the enclosure resin. The cathode terminal is provided with a cathode exposed portion exposed from the enclosure resin in at least two locations on the same plane.

Abstract: An anode with an anode body with a first side and a second side opposite to said first side. First flutes are on the first side and second flutes on the second side. The first flutes and said second flutes are offset or have different depths.

Abstract: An anode terminal or a cathode terminal is provided with an exposure portion that extends substantially perpendicularly to an arrangement direction of the two terminals and that have an end face exposed on a side face of a housing. At least the end face on the exposure portion is plated for improving the solder wettability. Furthermore, a front end portion of the exposure portion is bent upwards along a peripheral face of the housing.

Abstract: A chip solid electrolytic capacitor includes a capacitor element with an anode portion and a cathode portion, an anode lead frame, a cathode lead frame and packaging resin. The anode lead frame includes a first plane, an anode junction and an anode terminal. The anode junction is formed on one end of the first plane and connected to the anode portion. The anode terminal is formed on the other side of the first plane. The cathode lead frame has a second plane and a cathode terminal. The second plane has the cathode portion mounted thereon, is connected to the cathode portion, and is stacked on the first plane. The cathode terminal is formed on the same side of the second plane as the anode terminal. The packaging resin has a surface to be mounted and covers the capacitor element, with the anode terminal and the cathode terminal exposed on the surface to be mounted.

Abstract: A capacitor comprises a laminate constituted by a plurality of laminated capacitor elements each including an anode terminal and a cathode terminal; and an object to be connected including a terminal having the anode terminal electrically connected thereto. The respective anode terminals of one capacitor element and another capacitor element in the laminate oppose a partial region and a region different from the partial region in the terminal of the object.

Abstract: A solid electrolytic capacitor includes a cathode including a solid electrolytic layer, an anode, and a dielectric layer provided between the cathode and the anode. The anode includes an anode body, an input anode terminal and an output anode terminal. A bypass current path for causing circuit current to detour around the anode body is formed between the input anode terminal and the output anode terminal.

Abstract: A capacitor enlarging an anode electrode pattern of a substrate is provided. The capacitor comprises a capacitor device including anode and cathode parts; and a substrate including a device mounting surface formed with anode and cathode electrode patterns connected to the anode and cathode parts, respectively, and a rear face formed with anode and cathode land patterns connected to the anode and cathode electrode patterns corresponding thereto by way of anode and cathode vias extending along a thickness direction. The anode electrode pattern is integrally formed with a region including at least a part of a region corresponding to the anode land pattern and at least a part of a region corresponding to the cathode land pattern in an area of the device mounting surface of the substrate.

Abstract: A capacitor is constituted by a capacitor device including an anode part and a cathode part; and a substrate for mounting the capacitor device. The front face of a main part of the substrate is formed with first and second electrodes connected to the cathode and anode parts, respectively. The rear face of main part is provided with first and second outer electrodes electrically connected to the first and second electrodes by way of first and second conduction paths penetrating through the main part, respectively. The first and second electrodes are arranged in a row in a longitudinal direction of the substrate. The first and second outer electrodes include first and second connection areas for connecting with external wiring. The first and second connection areas extend in the longitudinal direction of the substrate, and are arranged in a row in a direction intersecting the longitudinal direction.

Abstract: A solid electrolytic capacitor includes a package for a capacitor element including an anode lead portion and a cathode portion. The package includes an insulating resin member which is arranged to cover the capacitor element and which includes hole portions formed therethrough. An anode terminal of the solid electrolytic capacitor includes a metal-plating layer which is placed in the hole portion to be electrically connected to the anode lead portion through the hole portion. A cathode terminal of the solid electrolytic capacitor includes a metal-plating layer which is placed in the hole portion to be electrically connected to the cathode conducting portion through the hole portion.

Abstract: In one aspect, a method of interconnecting two or more foils of a capacitor, the method comprising connecting together one or more anode connection members of one or more anode foils and one or more cathode connection members of one or more cathode foils and electrically isolating the one or more anode foils from the one or more cathode foils.

Abstract: A solid electrolytic capacitor includes a capacitor element provided with an anode body from which an anode lead projects, an anode-side lead frame positioned below the anode lead, and a bolster member which is provided between the anode lead and the anode-side lead frame and electrically connects the anode lead and the anode-side lead frame. At least one portion of the anode lead cuts into the bolster member.

Abstract: In a chip type solid electrolytic capacitor, an anode terminal is provided with an anode terminal lower surface exposed from a package lower surface and an anode terminal end surface adjacent to the anode terminal lower surface and exposed from a first package end surface. The cathode terminal is also provided with a cathode terminal lower surface and a cathode terminal end surface. The anode terminal end surface is provided with an anode terminal dent surface upwardly extending from the boundary with the anode terminal lower surface. The anode terminal dent surface is plated. The cathode terminal end surface is also provided with a cathode terminal dent surface which is plated.

Abstract: In a stacked solid electrolytic capacitor or a stacked transmission line element, anode portions of adjacent elements are electrically and mechanically connected to each other by the use of connecting members each in the form of a conductive adhesive or solderable metal, via metal plates connected to the anode portions so as to sandwich therebetween the anode portions, respectively, from the upper and lower surfaces thereof. On the other hand, cathode portions of the adjacent elements are electrically and mechanically connected to each other by a conductive adhesive, or are electrically and mechanically connected to each other by the use of adhesive insulating sheets each having a hollowed portion and a conductive adhesive filled in the hollowed portions, or are adhered to each other by adhesive insulating sheets, then electrically connected to each other by a conductive adhesive applied onto side surfaces of the cathode portions.

Abstract: Disclosed is a solid electrolytic capacitor, wherein a capacitor element has a front surface from which an anode lead wire is protruded. A cathode layer is formed on an outer surface of the capacitor element. A flat-shaped cathode lead frame is surface-contacted with an entire rear surface of the capacitor element. A flat-shaped anode lead frame has a concave portion formed at a central end portion thereof, in which the anode lead wire of the capacitor element is seated and electrically connected to the concave portion. A mold is formed to surround the capacitor element, to partially surround the anode lead frame, and to contact a face of the cathode lead frame which is surface-contacted with the capacitor element.

Abstract: In a solid electrolytic capacitor, an anode terminal (27 in FIG. 3) has a T-shaped section in which two plate pieces intersect at right angles. One of the two plate pieces is exposed to the mounting surface of the solid electrolytic capacitor, while the other is perpendicularly erected to an anode lead (11). The two plate pieces are made of a series of continuous members.

Abstract: A solid electrolytic capacitor includes a valve metal sheet having a porous portion on one side of the sheet, a dielectric layer formed on the porous portion, a solid electrolyte layer formed on the dielectric layer, a collector layer formed on the solid electrolyte layer, a through-hole electrode connected to the collector layer and penetrating the valve metal sheet to be exposed to the other side of the sheet, and an electrode terminal insulated from the through-hole electrode and connected to the valve metal sheet. The capacitor further includes an insulating portion penetrating the valve metal sheet and a penetration electrode penetrating the insulating portion. The solid electrolytic capacitor has a large capacitance and an excellent radio frequency response, and can be easily mounted on a semiconductor device.

Abstract: In a chip-type solid electrolytic capacitor including a capacitor element, anode terminal and cathode terminal are electrically connected to the capacitor element. A casing resin covers the capacitor element and the anode and cathode terminals. Each of the anode and cathode terminals has a bottom mount surface to be mounted on a circuit board and an exposed surface substantially perpendicular to the bottom mount surface and exposed at a side surface of the casing resin. Each of the exposed surfaces is subjected to plating to have a plated portion.

Abstract: A method for manufacturing large capacitance solid electrolytic capacitors that can be connected direct with semiconductor component, and offer a superior high frequency characteristic. An aluminum foil 3 is made porous in one of the surfaces, a dielectric layer 2 is formed on the porous portion, a through hole 4 is provided in the aluminum foil 3 at a certain specific location. An insulation layer 5 is formed to cover the other surface, viz. non-porous surface, of the aluminum foil 3 and the inner wall surface of through hole 4, a solid electrolytic layer 6 is provided on the dielectric layer 2, and a through hole electrode 7 is formed in the through hole 4, and then a collector layer 8 is formed on the solid electrolytic layer 6. The insulation layer 5 disposed on aluminum foil 3 is provided with an opening 9 at a certain specific location, and a connection terminal 10 is provided at the opening 9 of insulation layer 5 and the exposed surface of the through hole electrode 7, respectively.

Abstract: A method for manufacturing solid electrolytic capacitor that can be mounted direct on a semiconductor component and offers a superior high frequency characteristic. An aluminum foil 20 is provided on one surface with a resist film 23 and then with a through hole 24. Next, an insulation film 25 is formed to cover the other surface of aluminum foil 20 and to fill the first through hole, and then the resist film 23 is removed; and then the surface of aluminum foil 20 is roughened to be provided with a dielectric layer 27 thereon. A second through hole 36 is formed in the insulation film 25, which is filling the first through hole 24. A through hole electrode 28 is formed in the second through hole; and then, on the surface of the dielectric layer 27, a solid electrolytic layer 29 and a collector layer 30 are formed. After an opening 37 is provided, a first connection terminal 31 is formed therein, and a second connection electrode 32 on the exposed surface of the through hole electrode 28.

Abstract: A solid electrolytic capacitor is provided which includes a capacitor element having an anode and a cathode, a sheet member for mounting the capacitor element, and a protection package formed on the sheet member to enclose the capacitor element. The sheet member is provided with an anode terminal and a cathode terminal which are connected to the anode and the cathode, respectively.

Abstract: A chip-type solid electrolytic capacitor having two capacitor elements using a valve metal and laminated in a direction perpendicular to a mounting surface to be mounted on a substrate. A pair of anode lead wires are extracted on one side from anode members of the capacitor elements in parallel to the mounting surface. The anode lead wires are connected to two branches of an anode terminal portion, respectively. A cathode terminal is connected to cathode layers on dielectric oxide films of the anode members. The solid electrolytic capacitor is encapsulated in an encapsulating resin with the anode terminal and the cathode terminal partially exposed. The branches of the anode terminal portion are configured so that they overlap each other by rotation of 180° around a center line.

Abstract: A solid electrolytic capacitor includes a capacitor element having an element body and an anode wire extending therefrom, an anode lead electrically connected to the anode wire, a cathode lead electrically connected to the element body, and a resin package integrally sealing these parts. Each of the anode lead and the cathode lead is a conductive plate. The element body is connected to the upper surface of the cathode lead. The anode wire is connected to the upper surface of the anode lead via a conductive bolster.

Abstract: A method of protecting surface mount capacitors from moisture and oxygen corrosion by applying a thermally curable pre-coat resin to a portion of the terminals of a capacitor and encapsulating the element(s) with a protective resin. The pre-coat resin is substantially rigid at ambient temperatures and flexible at elevated temperatures and is preferably a lactone-containing epoxy resin. The pre-coat resin may be applied to a solder coating-free portion of the terminals by brush or wiper prior to encapsulating the capacitor element(s) with the protective resin.

Abstract: A capacitor element includes an anode chip body formed by sintering valve metal powder, an anode wire projecting from an end surface of the anode chip body, and a ring member made of a water-repellent thermoplastic synthetic resin and fitted around a root portion of the anode wire connected to the anode chip body. The ring member is fitted and attached to the anode wire. The ring member adheres closely to both of the anode chip body and the anode wire without a gap by thermally melting the ring member in its fitted state around the anode wire.

Abstract: A solid electrolytic capacitor having (A) a capacitor element including an oxide layer 1 formed on a part of an outer surface of a valve metal anode body, a solid electrolyte layer 2 formed on the oxide layer layer, and a cathode conductor layer 3 formed on the solid electrolyte layer, and an anode lead out area on a remaining part of the anode body, (B) lead terminals connected to the cathode and the anode lead out area of the capacitor element, and (C) a packaging resin encapsulating the capacitor element with parts of the lead terminals exposed outside. The solid electrolytic capacitor has a first separation strip 6 and a second separation strip 7 formed on a part of the roughened surface layer and also has insulating material 8 on the respective surfaces of the first and the second separation strips.

Abstract: A solid electrolytic capacitor is obtained by mounting a plurality of single plate capacitor elements within a chip by employing a stacking structure such as parallel stacking, opposing stacking, each layer-opposing stacking or closest stacking. As a result, a compact and high-capacitance element can be easily manufactured. The single plate capacitor element is preferably an element having an unfolded fan-like shape.

Abstract: A solid electrolytic capacitor comprising a capacitor element comprising a valve-acting metal substrate having on the surface thereof a dielectric film and a solid electrolytic layer provided on the dielectric film, the capacitor element provided with lead wires (lead frames), in which the bonding structure between the capacitor element and the lead frames is improved. The solid electrolytic capacitor has high strength at the bonded portion between the capacitor element and the lead frames and has excellent heat resistance and is highly reliable. Also, a method for manufacturing such a solid electrolytic capacitor is disclosed.

Abstract: The present invention provides an improved electrolytic capacitor device and a method of constructing the same. The capacitor includes a central support post that is inserted into an arbor hole in the center of the active element. The present invention provides a capacitor post that has a core material of metal or thermally conductive polymer that has an outer protective layer formed thereon. The outer protective layer is net shape insert molded over the core using a thermally conductive, electrically insulative polymer material that protects the support core from interfering with the electrical operation of the capacitor while increasing the capacitor's ability to transfer waste heat from the active element to the exterior of the device. The outer layer further includes an integrally formed thermal transfer pad that resides adjacent to the outer can of the capacitor when the capacitor post is installed.

Abstract: An anode lead 17 extending from a capacitor body 18 of a capacitor element 14 is mounted on a connecting portion 21 of an anode terminal 12 and the anode lead 17 and the connecting portion 21 are welded together by laser light B. The welding operation is performed by laser light B in a state where the anode lead 17 is urged to the connecting portion 21 in a region between said anode lead and said connecting portion. Alternatively, the welding operation is performed by laser light B in a state where a reflection plate having a slot and functioning to reflect reflected laser light is arranged in a region between the connecting portion and the capacitor body while the anode lead is received in said slot.

Abstract: Non-polar tantalum capacitors and non-polar tantalum capacitor arrays with compact designs are provided. The reduced volume and footprint of the capacitors and arrays in turn reduces the amount of space required in any device in which they are used. In addition, the cost of materials is reduced, and the manufacturing is simplified. Some embodiments of the present invention provide an electromechanical connector between the anode rods of each pair of polar tantalum capacitors, and insulation between the remainder of the capacitor bodies, thus providing a non-polar tantalum capacitor. These non-polar capacitors are mechanically connected to make a non-polar tantalum capacitor array. Other embodiments of the present invention provide for physically connecting the anode rods of the polar capacitors. An insulating encapsulant around the connected rods and between the polar capacitor bodies also holds the capacitors and capacitor arrays together.

Abstract: The present invention provides a solid state electrolytic capacitor having an improved anode lead terminal having first and second side edges distanced from each other in a longitudinal direction of the anode lead terminal, wherein a center position on the first side edge is retracted from opposite side positions on the top edge, and the opposite side positions are distanced in a perpendicular direction to the longitudinal direction.

Abstract: A solid state electrolytic capacitor and a structurally improved lead frame used in such a capacitor are disclosed. In the solid state electrolytic capacitor of this invention, the positive terminal parts of a lead frame assembled with each laminated capacitor unit are primarily bent upward to extend along the front surface of the positive portion of the capacitor unit and are secondarily bent rearward to come into contact with the upper surface of the positive portion, thus forming positive terminals of the capacitor unit. The contact parts of the lead frame extend outward from both sides of the capacitor unit and are brought into contact with those of lead frames assembled with the other capacitor units. The positive portion of each capacitor unit has the same width as that of the other part of the capacitor unit, thus removing stepped corners from the junction of the positive portion and the other part of the capacitor unit.

Abstract: First, an anode lead is led out of an anode member. Next, a dielectric film is formed at a surface of the anode member by anodic oxidation to form a capacitor element. Thereafter, a water-repellent agent is applied on a predetermined position of the anode lead. In succession, the capacitor element is immersed in an oxidant solution of a mixture solvent of alcohol and water, followed by drying. The capacitor element is then immersed in an alcoholic solution of a conductive polymeric monomer to polymerize a conductive polymer electrolyte on a surface of the capacitor element by chemical oxidation.

Abstract: A hoop metal lead frame (1) having, solid electrolytic capacitor elements (5) on its terminal sections (2) is provided with a crosspiece (3) bridging both sides in terms of the width direction disposed along the length direction in a region between the capacitor elements (5), one crosspiece for two capacitor elements (5). The metal lead frame (1) is placed on a molding die so that the region without having the crosspiece is locating at the sub runner (8), which has branched out from the main runner (7). The capacitor elements (5) are encapsulated with a molding resin injected through the sub runner (8). Since the molding resin is not covering the crosspiece (3), the main runner portion (7) and the sub runner portion (8) can be severed from the metal lead frame (1) without effecting unwanted stress on the solid electrolytic capacitors (10). The solid electrolytic capacitors (10) thus manufactured have a superior property in the tight hermetic sealing.

Abstract: Flat electrolytic capacitors particularly for use in implantable medical devices having stacked cathode and anode layers particular electrical connections of the capacitor anode and cathode layers with a capacitor connector assembly. Anode terminal means extend through the capacitor case side wall for electrically connecting a plurality of the anode tabs to one another and providing an anode connection terminal at the exterior of the case that is electrically insulated from the case. A cathode terminal extends through or to an encapsulation area of the capacitor case side wall via a cathode terminal passageway for electrically connecting a plurality of the cathode tabs to one another and providing a cathode connection terminal at the exterior of the case. The connector assembly is electrically attached to the anode connection terminal for making electrical connection with the anode tabs and to the cathode connection terminal for making electrical connection with the cathode tabs.

Abstract: A capacitor has a first side and an opposite second side. The capacitor also includes a first conductive member having a first planar surface and a first side edge, a first electrical connection extending from the first conductive member adjacent the first side. A second conductive member has a second planar surface. The second planar surface is spaced apart from and parallel to the first planar surface of the first conductive member. The second planar surface and the first planar surface define a space therebetween. The second conductive member also includes a third planar surface that is spaced apart from and disposed parallel to the second planar surface opposite from the first planar surface. A second electrical connection extends from the second planar surface adjacent the first side. The second conductive member also includes an electrically conductive portion, disposed adjacent the second side, electrically connecting the second planar surface and the third planar surface.

Abstract: This invention relates to solid electrolyte capacitors and is intended to decrease the contact resistance between the body of the capacitor and lead frames and the internal resistance of these components. The, invention provides a process for producing a solid electrolyte capacitor by forming a dielectric oxide film on an anode body of valve metal, forming a cathode layer of solid conductive substance on the oxide film to prepare a capacitor element, coating the cathode layer of the capacitor element with a carbon layer, coating the carbon layer with a silver paste layer to prepare a capacitor body, and bonding a lead frame to the silver paste layer of the. capacitor body with a silver adhesive. While the capacitor element coated with the carbon layer and a silver paste are being vibrated relative to each other, the capacitor element is dipped in the silver paste and withdrawn therefrom in the direction of the vibration, whereby the carbon layer is coated with the silver paste layer.

Abstract: The present invention aims to provide a chip-type solid electrolytic capacitor of large capacitance and low ESR. An element section of the capacitor is composed of an anode oxide film layer which functions as a dielectric, a solid electrolyte layer including conductive polymer and a cathode conductive body, which are stacked on a metallic electrode. A plurality of flat capacitor elements with the element section and an anode pulling-out section are stacked, and a laminated unit is produced where the cathode conductive layer and the anode pulling-out section of the flat capacitor elements are connected to a single metallic terminal member each. The solid electrolytic capacitor of the present invention has at least two laminated units placed parallel to each other, and connected to a transversely disposed comb terminal. The construction presented by the present invention achieves a solid electrolytic capacitor of a large capacitance and a low ESR without expanding its mounting surface area.