Abstract: A surface mounted device (SMD) having leads selectively solderable so that those portions of the leads extending down along the sides of the device body are not solderable. Thus, during attachment to a mother board by wave soldering, solder does not collect in the spaces between the leads and the device body, and both solder joint reliability and strength are improved.

Abstract: An electronic component in which connection elements are connected to electrode ends or electrode coatings and which is tightly surrounded by a polymer envelope is considerably reinforced with respect to bending loads on the connections and is less sensitive to the penetration of moisture when at least one of the connection elements, from the connection point, is provided with a loop which first of all extends in a direction substantially opposite to the emanating direction and towards the electronic component and then extends in the emanating direction.