Abstract: A solid electrolytic capacitor includes a capacitor element having an anode of a valve action metal, an oxide film layer formed on the surface of the anode, a solid electrolytic layer formed on the oxide film layer and a cathode electrically connected to the solid electrolytic layer, and also a packaging resin formed to cover the capacitor element. An intermediate layer to relieve stress is arranged in at least one part of the interface between the cathode and the packaging resin. The intermediate layer is deformed and/or peels to relieve stress caused by heat applied while mounting the capacitor element on a substrate.

Abstract: A capacitor includes a porous pellet formed from compressed conductive particles. The pellet has a lead receiving external surface. The conductive particles at the lead receiving surface are fused together to create a fused layer on the external surface of the pellet. A lead wire has one of its ends welded to the fused layer on the surface of the pellet. The fused layer is formed by exposing it to high temperatures, preferably by use of a laser beam.

Abstract: An energy storage device in the form of a cylindrical double layer capacitor (1) includes a plurality of integrally formed first electrode members (2) which each extend between a first end (3) and a second end (4). A plurality of integrally formed second electrode members (5) each extend between a third end (6) and a fourth end (7). As shown, members (5) are interleaved with members (2) such that ends (7) are located intermediate ends (3, 4) of the adjacent members (2). An insulator in the form of carbon layer (8) are disposed between adjacent members (2, 5) to prevent electrical contact therebetween. First contact means in the form of flanges (11) extend from respective ends (3) of each member (2) and electrically connect all the first members. Flanges (11) provide a site for the metallisation of particles thereupon. Those particles form a porous connection layer (12) for an electrical terminal (13) for members (2). Flanges (11) also form a barrier against the ingress of the particles beyond ends (3).

Abstract: A capacitor terminal is described, in particular for an electrolyte power capacitor, with which the capacitor is mechanically and electrically connected to a fastening part and/or to electric conductors. The capacitor terminal on the capacitor itself is designed as a contact stud having a relatively long, smooth contact area. The contact stud is designed in the form of a cylinder having a round or oval cross section or a rectangular tube connection. The part accommodating the contact stud is composed of a contact spring accommodating the contact stud for mechanical fixation and to establish the electric contact and which is attached to a connection strip. An extra spring can surround the contact spring in a ring to increase the contact force. Multiple capacitors may be connected to the connection strip by a simple plug-in technique, i.e.

Abstract: The tantalum chip capacitor of the present invention includes a anode terminal which is substantially flat. The tantalum wire which extends from the tantalum pellet through the insulating material terminates substantially flush with the insulating material, allowing the termination materials to be applied over a substantially flat surface. The tantalum chip capacitors of the present invention are created by methods which include the step of grinding the anode end of the capacitor so that the tantalum wire is flush with the insulating material. Conductive materials can then be applied to the anode end of the capacitor creating a substantially flat anode terminal.

Abstract: A capacitor includes a housing, a connector disposed within the housing and having an end provided with a first U-shaped terminal and another end provided with a second U-shaped terminal, the first U-shaped terminal having a first leg extending downwardly from a lower end of the first U-shaped terminal, the second U-shaped terminal having a second leg extending downwardly from a lower end of the second U-shaped terminal, an ebonite member mounted between the first and second U-shaped terminals, a grounding terminal arranged intermediate of the ebonite member, an insulating material mounted between the first leg of the first U-shaped terminal and the second leg of the second U-shaped terminal, a first voltage sensitive resistor having a leg soldered to the first U-shaped terminal and another leg soldered to a lower end of the grounding terminal, and a second voltage-sensitive resistor having a leg soldered to the second U-shaped terminal and another leg soldered to the grounding terminal.

Abstract: A water vapor discharge passage 10 formed of fine porous fluorocarbon resin having high water vapor permeability is provided in a chip type solid electrolytic capacitor having a capacitor element 1 and an anode terminal 2 and a cathode terminal 3 for external electric connection and encapsulated in a mold resin 4. The water vapor discharge passage communicates an interior of the capacitor element with atmosphere.

Abstract: A capacitor includes a porous pellet formed from compressed conductive particles. The pellet has a lead receiving external surface. The conductive particles at the lead receiving surface are fused together to create a fused layer on the external surface of the pellet. A lead wire has one of its ends welded to the fused layer on the surface of the pellet. The fused layer is formed by exposing it to high temperatures, preferably by use of a laser beam.

Abstract: A compact solid electrolytic capacitor includes a capacitor element having a positive electrode and a negative electrode which are respectively connected electrically to a first lead and a second lead and a casing of a resin material surrounding the capacitor element. A low melting-point metal layer serving as a fuse, which will quickly melt under an abnormal condition, is inserted between and electrically connects the capacitor element and the second lead and an arc-extinguishing material capable of absorbing the melted metal of the low melting-point metallic material fills a throughhole through the second lead where the latter contacts the low melting-point metal layer. The low melting-point metal layer may be in the form of a flat ribbon of thickness only about 50-100 &mgr;m.

Abstract: Doped tantalum and niobium pellets with nitrogen is described wherein the resulting pellets are substantially free of nitride precipitate on their outer surfaces. The tantalum and niobium pellets are formed by heating the pellets to a temperature of from about 600-1400° C. in a nitrogen gas atmosphere and then in a vacuum which causes nitrogen contacting a pellet to diffuse into the inner portion of the pellet instead of forming a precipitate. The resulting pellets have improved DCL stability and reliability in comparison to prior art nitrogen-doped tantalum and niobium pellets.

Abstract: Anodic valve metal foils, roughened and provided with dielectric layers, and collector metal foils (metal foils for collector) are laminated alternately to cross with cathodic electroconductive polymer layers therebetween. Anodic terminals and cathodic terminals are connected with the respective ends of the metal foils. For the anodic valve metal foils, an aluminum foil whose internal is an unroughened bulk metal layer is used. The collector metal foil is selected from the group consisting of an Al foil similar to the anodic valve metal foil, an Ni foil, a Cu foil, and an aluminum foil including carbon. As a result, a four-terminal capacitor to provide high capacitance, low impedance, high current-carrying capacity and less heat generation, as well as low ESR and low ESL, is obtained.

Abstract: An electrically conductive polymer layer of a solid electrolytic capacitor that coats a dielectric layer that coats an anode. An anode lead projects outwardly from the anode through the dielectric layer, and the electrically conductive polymer layer is separated by the dielectric layer form the anode lead. The electrically conductive polymer layer has a thicker portion than a remaining portion thereof and the thicker portion extends at least in the vicinity of the anode lead, and the thicker portion is bounded with the remaining portion so that a sloped-boundary loop between the thicker portion and the remaining portion extends to be parallel to a flat plane perpendicular to a direction along which the anode lead projects through the dielectric layer, whereby the thicker portion continuously extends close to the anode lead than the remaining portion.

Abstract: A capacitor element for a solid electrolytic capacitor includes a capacitor chip which is a compacted mass of valve metal powder, and an anode wire projecting from an end face of the capacitor chip. The capacitor chip includes a chamfer portion located adjacent to and surrounding the end face. Typically, the capacitor chip is square in cross section, and the chamfer portion includes a quadrilaterally arranged group of chamfer faces.

Abstract: An aluminum electrolytic capacitor with an aluminum housing defining a chamber, and having a feed-through aperture providing communication with the chamber from outside of the housing. A number of aluminum anode layers are positioned within the chamber, and a feed-through member formed of a first conductive material occupies the feed-through aperture. The feed-through member has an inner end extending into the chamber, an outer end extending externally from the housing, and an insulative sleeve encompassing an intermediate portion of the feed-through member and directly contacting the housing at the feed-through aperture to prevent electrical contact between the feed-through member and the housing. A connection element formed of a second different conductive material is attached to the inner end of feed-through member and spaced apart from the housing. A compressible insulative gasket may be positioned between the housing and the connection element to provide insulation and a fluid seal.

Abstract: An electrolytic capacitor device includes a capacitor which has a capacitor element and leads extending from one end of the element, and a square mounting board for use in mounting the capacitor device on a printed circuit board. The mounting board is connected to the one end of the capacitor. The leads are inserted into openings extending through the mounting board. The mounting board has parallel slits extending from the openings to one side edge of the mounting board. Each slit is wider in its open end at the one side edge of the mounting board than the diameter of the associated opening. The bottom surface of the mounting board has metal plate terminals which extend from the openings to different side edges of the mounting board. The terminals have rising portions extending upward along the inner walls of the slits and the openings. The leads have tip ends welded in their peripheries to the rising portions. The top surface of the mounting board has a U-shaped stop opening toward the one side edge.

Abstract: A dry preunit (10), includes a plurality of cells (110, 112, 114) in a true bipolar configuration, which are stacked and bonded together, to impart to the device an integral and unitary construction. Each cell (114) includes two electrically conductive electrodes (111A, 111B) that are spaced apart by a predetermined distance. The cell (114) also includes two identical dielectric gaskets (121, 123) that are interposed, in registration with each other, between the electrodes (111A, 111B), for separating and electrically insulating these electrodes. When the electrodes (111A, 111B), and the gaskets (121, 123) are bonded together, at least one fill gap (130) is formed for each cell. Each cell (114) also includes a porous and conductive coating layer (119, 120) that is formed on one surface of each electrode. The coating layer (119) includes a set of closely spaced-apart peripheral microprotrusions (125), and a set of distally spaced-apart central microprotrusions (127).

Abstract: Doped tantalum pellets with nitrogen is described wherein the resulting pellets are substantially free of nitride precipitate on their outer surfaces. The tantalum pellets are formed by heating the pellets to a temperature of from about 1000.degree.-1400.degree. C. in a nitrogen gas atmosphere and then in a vacuum which causes nitrogen contacting a tantalum pellet to diffuse into the inner portion of the pellet instead of forming a precipitate. The resulting pellets have improved DCL stability and reliability in comparison to prior art nitrogen-doped tantalum pellets.

Abstract: A gas-tight and/or oil-tight bushing is provided for attachment to a capacitor housing and for providing a connection to a capacitor. The bushings are composed of metal pins electrically insulated from the housing as well as insulators for increasing the leakage distance. The insulators have sections that extend into the inside of the housing to which a cooperating member that connects the bushing to the housing by clamping is secured. An O-ring is arranged between the insulator and the metal pin for sealing. The O-ring is preferably surrounded by a plastic sleeve that prestresses the O-ring for an improved sealing function.

Abstract: A solid electrolytic capacitor has a molded casing containing therein a capacitor element, a first lead member connected to its anode and a second lead member connected to its cathode through a fuse. The second lead member is designed such that a relatively large capacitor element can be contained inside the casing although it must also have a large enough hole to allow a portion of the casing to penetrate therethrough to fasten it to the casing.

Abstract: A capacitor has a bottomed outer casing housing a capacitor element therein, a lid closing the bottomed outer casing and having a pair of insertion holes defined therein, and a pair of electrode terminals mounted on the lid and connected to the extension leads. The capacitor element includes a plurality of current collectors with respective extension leads extending therefrom. Each of the electrode terminals has an insert inserted in one of the insertion holes with an insulator interposed between the insert and the lid, a flange contiguous to an end of the insert and held against a surface of the lid through the insulator, a joint projecting from the flange and connected to the extension lead, and a staked member contiguous to an opposite end of the insert and crimped over an opposite surface of the lid with the insulator interposed between the staked member and the lid.

Abstract: A fixing part having a room in which a metal attachment leg is inserted to attach a capacitor unit is disposed on an outside face of a case. An electrode connected to a terminal of a capacitor element is disposed in the fixing part, and a lock part to be engaged with the inserted metal attachment leg is disposed, whereby when the metal attachment leg is inserted into the fixing part, the electrode of the fixing part is electrically contacted to the metal attachment leg by elasticity.

Abstract: A chip-formed solid electrolytic capacitor having a structure wherein a projecting anode lead is not provided for an anode member. The solid electrolytic capacitor is fabricated by the following manner: First, an electrically insulating resin such as a fluororesin is impregnated into an end face of a porous electrode member to form an insulating resin impregnated portion, and an electrode lead member is bonded to the anode member at the insulating resin impregnated portion. An anodic oxidation film, a solid electrolyte layer and a cathode layer successively are formed on the anode member. Then, an electrically insulating outer package is applied so that the cathode layer on a face of the anode member opposing to the face on which the electrode lead member is mounted is exposed.

Abstract: A capacitor element for a solid electrolytic capacitor is provided which comprises a sintered chip of metal powder, the chip having a first end and a second end opposite to the first end. The chip includes a tapered body whose cross-sectional area reduces from the first end to the second end, and a cathode layer covering the chip excepting at least the first end.

Abstract: A chip type solid electrolyte capacitor is given a three-terminal structure, with cathode terminals at either end and an anode lead embedded in an anode body at the center of the device structure. This eliminates the possibility of device breakdown or short circuit when a chip-type solid electrolyte capacitor with rectifying characteristics is inadvertently mounted the wrong way on a circuit board, and assures a small device size.

Abstract: A package-type solid electrolytic capacitor is provided which comprises: a capacitor chip having a first end and a second end opposite to the first end, the chip being formed with a cathode terminal coating at least covering the second end; an anode wire partially projecting from the first end of the chip; a plate-like metal anode lead having an inner end electrically connected to the anode wire; a plate-like metal cathode lead having an inner end electrically connected to the cathode terminal coating of the chip; and a resin package enclosing the capacitor chip, the anode wire and the inner ends of the anode and cathode leads. The cathode lead has a wider portion projecting out of the resin package, and the inner end of the cathode lead is narrower and held in abutment with and electrically connected to the cathode terminal coating at the second end of the chip.

Abstract: Respective arc-shaped portions of two cathode lead terminals are arranged in opposition across a capacitor element to surround the side periphery of the capacitor element. These arc-shaped portions have straight portions at respective one open ends, which straight portion extends in axial direction of the capacitor element, namely in a direction along which an anode lead terminal provided on the end face of the capacitor element extends. The straight portions of the cathode lead terminals also arranged in opposition across the capacitor element. Accordingly, two straight portions of the cathode lead terminals are aligned across the anode lead terminal. By this, a three-terminal dip type capacitor which can achieve high reliability of connection between the cathode lead terminals and the capacitor element and reduction of production cost.

Abstract: A solid electrolytic capacitor comprises a capacitor element including a chip body and an anode wire projecting from the chip body, an anode lead electrically connected to the anode wire, a cathode lead paired with the anode lead, a first fuse wire connecting electrically between the chip body and the cathode lead, and a resin package enclosing the capacitor element, part of the anode lead, part of the cathode lead, and the first fuse wire. The capacitor further comprises an auxiliary lead separate from the anode and cathode leads, and a second fuse wire for electrically connecting the auxiliary lead to one of the chip body and the anode lead within the resin package. In an alternative embodiment, there is only a single fuse wire, the fuse wire acting both as a temperature fuse and as an overcurrent fuse.

Abstract: A solid electrolytic capacitor is provided which comprises a capacitor element including a porous sintered chip of metal particles, a solid electrolytic substance electrically insulated from the metal particles by a dielectric substance, an anode terminal layer electrically connected to the metal particles, and a cathode terminal layer electrically connected to the solid electrolytic substance. The capacitor element has a terminal portion located adjacent to the anode terminal layer and provided with barrier means for preventing the solid electrolytic substance from entering to the terminal portion.

Abstract: Provided is a solid electrolytic capacitor including a capacitor element, an internal anode lead extending from a substantially central portion of one lateral surface of the capacitor element, other surfaces of the capacitor element normal to the lateral surface being adapted to serve as cathode terminal walls, an external anode lead connected to the internal anode lead, an external cathode lead connected to one of the cathode terminal wall, and a resin mold encapsulating the capacitor element as well as connecting portions associated therewith, wherein the external anode lead connected to the internal anode lead is bent to have at least two steps at its end portion, a lower step of said at least two steps being fixed to another one of the cathode terminal walls through an insulating material, an upper step of said at least two steps being fixed to the internal anode lead.

Abstract: A capacitor element for a solid electrolytic capacitor is provided which comprises a sintered chip of metal powder, the chip having a first end and a second end opposite to the first end. The chip includes a tapered body whose cross-sectional area reduces from the first end to the second end, and a cathode layer covering the chip excepting at least the first end.

Abstract: A chip-type solid electrolytic capacitor includes a cathode conductive layer provided on a whole surface of a cathode layer formed on an outer surface of a capacitor element, which whole surface is opposite to a surface where an anode lead wire is lead out, and on a surface adjacent to the first-mentioned whole surface. With this arrangement, if the capacitor element is obliquely inserted into a mold during the formation of a resin shell, the inner walls of the mold will not come into contact with cathode layer of the capacitor element, but will instead come into contact with the cathode conductive layer to prevent the cathode layer from being exposed to the resin shell. As a result, any possible damage to the cathode layer of the capacitor element when the peripheral surface of the resin shell on a cathode side is subjected to roughening is prevented to eliminate defects in electric characteristics such as leakage of electric current and a tan.delta. value.

Abstract: A stacked type solid electrolytic capacitor has a plurality of single plate capacitors each constituted by a dielectric oxide film, a solid electrolytic film and a negative electrode layer sequentially laminated on a surface of a positive electrode member having a positive electrode section. A metal spacer which has a thickness corresponding to each of spaces between the positive electrode sections is placed in each of the spaces. The metal spacers and the positive electrode sections are mechanically and electrically interconnected by welding. The invention may be embodied in a stacked electrolytic capacitor of a lead type or that of a chip type. The invention provides capacitor in which the size is reduced and the capacity is increased, the possibility of deterioration in electrical characteristics during the fabrication process is eliminated, and the process of fabrication is made easy.

Abstract: The invention relates to a chip-type solid elelctrolytic capacitor which uses a capacitor element having an anode lead protruding from one end face of an anode body of a valve metal. The capacitor element is covered by an insulating resin cover layer except a cathode end face and the protruding part of the anode lead. A cathode terminal is formed on the cathode end face and the resin cover layer in an area near the cathode end face, and an anode terminal is formed on the resin cover layer so as to make contact with the protruding anode lead. The anode terminal is made up of a conductive layer which is formed on the resin cover layer only in a limited area so as not to make contact with the anode lead and has a microscopically rough surface, a plating layer which is formed on the conductive layer and the resin cover layer in the area over the aforementioned end face of the anode body and covers the protruding anode lead and a solder layer formed on the plating layer.

Abstract: A solid electrolytic capacitor comprises a capacitor element including a chip body and an anode wire projecting from the chip body, an anode lead electrically connected to the anode wire, a cathode lead paired with the anode lead, a first fuse wire connecting electrically between the chip body and the cathode lead, and a resin package enclosing the capacitor element, part of the anode lead, part of the cathode lead, and the first fuse wire. The capacitor further comprises an auxiliary lead separate from the anode and cathode leads, and a second fuse wire for electrically connecting the auxiliary lead to one of the chip body and the anode lead within the resin package.

Abstract: Disclosed is a method of producing a chip-type solid-electrolyte capacitor, in which the surface of a sheathing resin layer formed on an anode body is roughened by forming an irregularity thereon, and plated metal layers are formed on the surface thus roughened for an anode and cathode use. The metal layers are strongly adhered on the roughened surface. The surface-irregularity of the sheathing resin layer is produced by blasting hard particle material made of, for example, alumina or glass using a sandblast machine, or by irradiating a laser beam such as the YAG laser beam or the like.

Abstract: A DC high voltage block comprising coupled lines etched upon a substrate and covered with a bubble-free, polyurethane insulating layer. The polyurethane insulating layer prevents DC voltage breakdown through air. This DC voltage block provides a planar, noncomplex circuit that can effectively provide voltage blockage up to 4500 volts. High voltage DC blocks of this nature have applications in vacuum tubes and IMPATT devices, as well as ferro-electric or electro-optic phase shifters. They are also employed to protect bias tees and electrical devices that employ bias tees.

Abstract: According to this invention, a chip type solid electrolytic capacitor includes a capacitor element, an insulating sheathing resin layer, two anode terminals, and a cathode terminal. The capacitor element is obtained by sequentially forming an oxide film, a solid electrolytic layer, and a cathode conductive layer on an anode body consisting of a valve metal in which anode leads are extracted from two opposite end faces. The insulating sheathing resin layer is coated on an entire outer surface except for both anode lead extraction end faces and a predetermined portion of one surface. The two anode terminals are formed on both the anode lead extraction end faces and peripheral portions thereof. The cathode terminal is formed on the cathode conductive layer exposed from said insulating sheathing resin layer.

Abstract: A chip-type solid electrolytic capacitor having an anode body (1) of valve-metal with an anode lead extending from one surface thereof and a dielectric layer (3) formed thereon, a cathode layer (5) formed on the electrolytic layer, an insulating layer (6) formed on the cathode layer so as to cover the one surface of the anode body, a plated layer (7a) formed on the insulating layer over the one surface, a solder layer (8a) formed on the plated layer, and an alloy layer (9) formed on an end portion of the anode lead, the alloy layer consisting of three metals of the anode lead, the plated layer, and the solder layer.

Abstract: Solid electrolytic capacitors comprise a capacitor element having a valve metal substrate, a dielectric film formed thereon, and a conductive polymer layer formed on the dielectric film. The capacitor element is encased in a resin casing as not directly contacting the element with the resin casing. The capacitance and leakage current characteristics are improved. Alternatively, a capacitor element includes a valve metal substrate, a dielectric film, an inorganic conductive layer and a conductive polymer layer formed on the substrate in this order, wherein the conductive polymer layer is formed after anodization of the inorganic conductive layer bearing substrate. The life of the resulting capacitor is significantly prolonged. This capacitor element may be encased in a resin casing in a manner as set forth above. Methods for manufacturing the solid electrolytic capacitor are also provided.

Abstract: The components of the electrical capacitor according to the present invention consist only of unit cells, terminal plates and a molded portion, and operations such as caulking, etc. are not required so that production of the capacitor can be easily performed, by arranging and pressing electrode plates having terminals at the top and the bottom of the stacked unit cells of an electric double-layer capacitor in the stacked direction thereof, and applying molding process with resin, as it is.

Abstract: A solid electrolyte capacitor in a chip structure is composed of an anode member having an anode wire. A cathode terminal and a anode terminal are arranged as parts of a carrier band. The cathode terminal comprises an auxiliary clip bent in a U-shaped manner and comprises a further auxiliary clip arranged at 90.degree. opposite thereto, the clips at least partially embracing the chip structure. The capacitor is provided with a plastic envelope.

Abstract: A chip-type solid electrolytic capacitor comprises a capacitor element having a top surface, a bottom surface, and a side surface extending therebetween. An insulating resin layer is coated on the top and side surfaces of the element leaving the bottom surface exposed. An anode lead wire extends through the top surface from the insulating resin layer. An electroless plated layer is formed directly on the anode lead wire and the insulating resin layer at a region located on the top surface and a part of the side surface. Another electroless plated layer is also formed on the cathode layer on the bottom surface. Furthermore, solder layers are formed on the each electroless plated layers.

Abstract: For mechanically stress-free assembly of a solid electrolyte capacitor, a system carrier whose cathode terminal and anode terminal are not parted before assembly is employed. The electrode terminals are parted from one another only after the welding of the anode wire to the anode terminal and soldering of the cathode contact to the cathode terminal, preferably being cut by a laser beam.

Abstract: A solid electrolytic capacitor of this invention comprises an electrode provided with an anode lead; a dielectric oxide film, a solid electrolyte layer, a carbon layer, and a cathode layer, which are successively formed on the surface of the electrode; a positive terminal connected to the anode lead; and a negative terminal connected to the cathode layer by means of an electrically conductive adhesive; wherein at least one of the cathode layer and the electrically conductive adhesive comprises a polymer and an electrically conductive powder containing palladium. The capacitor displays little variation in the value of tan .delta. and slight changes in current leakage even when the capacitor is placed under conditions of high temperature and humidity. Moreover, electrical short-circuit failure of the capacitor rarely occurs.

Abstract: A service mountable non-polar capacitor assembly is disclosed. The assembly includes a pair of polar tantalum capacitors disposed in axial alignment the anode rods of the capacitors being mechanically and electrically connected as by welding. An insulating sleeve encompasses the body portions of the capacitors leaving projecting portions extending beyond the ends of the sleeve. The void space within the sleeve between the opposed ends of the capacitors may be filled by a polymeric insulating and rigidifying material.

Abstract: There is disclosed a chip type capacitor characterized by comprising a capacitor having lead wires derived from a terminal thereof and a sheathing frame having an accommodating space compatible with a dimension of an external shape of said capacitor, wherein a protuberance of a height substantially identical to the dimension of an external diameter of the lead wires of the capacitor is provided on the underside of the sheathing frame and the lead wires of the capacitor accommodated in the sheathing frame are bent alongside from an end of the aperture of the sheathing frame to the underside of the sheathing.

Abstract: A package and circuit arrangement having rotational symmetry wherein positive and negative terminals are connected on both opposite ends of the package and also connected to an electrical component within the package. The positive terminals are diagonally aligned with respect to an axis of symmetry for the package, and the negative terminals are also diagonally aligned with respect to this axis of symmetry. Thus, the component within the package is always properly biased when the package is inserted into a circuit board receptacle having positive and negative terminals which are matched in position and polarity with those of package regardless of planar orientation of the package on the receiving surface of the circuit board.

Abstract: The electrical component of the invention is such that, being of parallelepipedic form, each of at least two of its mutually opposite lateral faces is equipped with an element of each of the two connecting electrodes of the component.

Abstract: An aluminum foil type solid electrolytic capacitor wherein the distance between the two foils in the capacitor element to be determined by the thickness of separator being kept at a value between ten to sixty micrometers, solid electrolyte being formed between the two foils by the thermal decomposition of electrolytic solution impregnated in the capacitor element.Manufacturing methods of making an aluminum foil type solid electrolytic capacitor with a manganese dioxide electrolytic layer between the electrode foils, wherein the layer is formed by decomposing the electrolytic solution thermally under conditions of a temperature between 200 and 260.degree. C. and of a time interval between 20 and 40 minutes, wherein the layer is formed by decomposing electrolytic solution with fine powders of manganese dioxide, wherein lithium is doped in the layer or wherein electrochemical conversion processes are used for restoring an aluminum oxide film.

Abstract: Capacitor bodies are usually carried in open ended containers. The open ends are then closed with a cover or capacitor top after the capacitor body is inserted in the container. Electrical leads are then attached to terminals carried by the capacitor top. Prior art methods of forming such tops involved insert molding. The present invention starts with a preformed plastic disc with two apertures for terminals and a boss for positioning lead attachment. The terminals and a positioning lead are then applied to the disc through a combination of riveting and ultrasonic swaging.